Hochspannungsleistungsübertragung auf einer leiterplatte

AT1928902TUndetermined Publication Date: 2026-06-15INTEL CORP

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Patent Information

Application Number: AT2023216676T
Authority / Receiving Office: AT · AT
Patent Type: Patents
Current Assignee / Owner
Priority Date: 2023-06-29
Filing Date: 2023-12-14
Publication Date: 2026-06-15
Estimated Expiration: 2043-12-14

Application Information

Patent Timeline

29 Jun 2023

Priority

14 Dec 2023

Application

AT2023216676T

15 Jun 2026

Publication

AT1928902T

IPC: H05K

Inventors: AYUBKHAN, AJMEER KAJA; JANGILI GANGA, SIVA PRASAD

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Abstract

Disclosed herein is a device that provides for high power transfer. The device may include a printed circuit board and a package substrate disposed on the printed circuit board. The device may also include a plurality of high-power voltage regulators disposed on and electrically connected to the package substrate. The device may also include a plurality of low-power voltage regulators disposed on and electrically connected to the printed circuit board.

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