INSTALLATION COMPONENT MADE OF A LEAD-FREE COPPER ALLOY
AT1933072TUndetermined Publication Date: 2026-07-15DIEHL BRASS SOLUTIONS STIFTUNG & CO KG
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Patent Information
- Application Number
- AT2021201428T
- Authority / Receiving Office
- AT · AT
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2020-10-16
- Filing Date
- 2021-10-07
- Publication Date
- 2026-07-15
- Estimated Expiration
- 2041-10-07
Abstract
The invention relates to a lead-free copper alloy comprising: 70.0 to 83.0 wt.% of Cu, 2.0 to 2.9 wt.% of Si, 0.05 to 0.10 wt.% of P, 0.01 to less than 0.30 wt.% of Sn, remainder: Zn and unavoidable impurities.
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