Electronic device comprising floating ground connected to case for speaker

Abstract

This electronic device comprises: a speaker; a PCB including an opening portion in which the speaker is accommodated; a capacitor disposed on the PCB; and a case surrounding the rear surface of the speaker and disposed on the PCB, wherein the PCB includes: a conductive pad disposed on the PCB along the periphery portion of the opening portion and coupled to the case; conductive patterns on a layer of the PCB on which the conductive pad is disposed, the conductive patterns being spaced apart from the conductive pad, and the capacitor may reduce a current flowing from a component on the PCB to a rechargeable battery through the case, and may connect the conductive patterns and the conductive pad so that the case operates as a ground while the electronic device transmits a signal to an external electronic device.

Description

An electronic device that includes a floating ground that connects to the case for the speaker.

[0001] The present disclosure relates to an electronic device including a floating ground connected to a case for a speaker.

[0002] For small, thin electronic devices, the thickness and size of the components placed within the device may be limited. Miniaturizing electronic devices may require reducing the size of individual electronic components and optimizing their layout. While optimizing the layout, it may also be necessary to provide a structure that reduces noise caused by electromagnetic interference between electronic components.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] An electronic device is disclosed. The electronic device may include a rechargeable battery. The electronic device may include a speaker. The electronic device may include a printed circuit board including an opening portion for accommodating the speaker. The electronic device may include a component on the printed circuit board disposed adjacent to the speaker. The electronic device may include at least one element disposed on the printed circuit board. The electronic device may include a case that surrounds the rear surface of the speaker and is disposed on the printed circuit board. The printed circuit board may include a conductive pad disposed along a periphery of the opening portion and coupled to the case. The printed circuit board may include conductive patterns spaced apart from the conductive pad and disposed on a layer of the printed circuit board on which the conductive pad is disposed. The at least one element may connect the conductive patterns and the conductive pad for the case to function as a ground.

[0005] An electronic device is disclosed. The electronic device may include a speaker. The electronic device may further include a printed circuit board (PCB). The PCB may include an opening portion for accommodating the speaker. The electronic device may further include at least one element. The at least one element may be disposed on the PCB. The electronic device may further include a case. The case may surround a rear surface of the speaker and be disposed on the PCB. The PCB may include a conductive pad disposed along the opening portion, exposed to the outside of the PCB, and coupled to the case. The PCB may include conductive patterns disposed within the PCB and spaced apart from the conductive pad. The conductive pad may be connected to the conductive patterns, which are electrically connected to a ground portion of the electronic device, through the at least one element. The at least one element may be electrically disconnected from the conductive patterns in a first frequency band and electrically connected to the conductive patterns in a second frequency band higher than the first frequency band.

[0006] FIG. 1 is a drawing showing an electronic device according to one embodiment.

[0007] Figure 2 is an exploded perspective view of an electronic device according to one embodiment.

[0008] Figure 3 is a drawing showing the interior of an exemplary electronic device.

[0009] Figure 4 is a cross-sectional view of an exemplary electronic device.

[0010] Figures 5a, 5b, and 5c are exemplary drawings showing the periphery of the opening portion where the speaker of each layer of the printed circuit board is mounted.

[0011] FIG. 5d is an exemplary drawing showing a layer from which a conductive portion of a printed circuit board has been partially removed.

[0012] FIG. 6 is a cross-sectional view of an exemplary electronic device including a capacitor connecting conductive pads and conductive patterns.

[0013] FIG. 7 is an exemplary drawing showing the periphery of an opening portion of a printed circuit board including a capacitor connecting conductive pads and conductive patterns.

[0014] FIG. 8 is a block diagram of an electronic device within a network environment according to various embodiments.

[0015] FIG. 1 is a drawing showing an electronic device according to one embodiment.

[0016] Referring to FIG. 1, an electronic device (100) according to one embodiment may include a housing (110) forming an exterior of the electronic device (100). For example, the housing (110) may include a first side (or front side) (100A), a second side (or back side) (100B), and a third side (or side surface) (100C) surrounding a space between the first side (100A) and the second side (100B). In one embodiment, the housing (110) may also refer to a structure (e.g., a frame structure (140) of FIG. 2) forming at least a portion of the first side (100A), the second side (100B), and / or the third side (100C).

[0017] An electronic device (100) according to one embodiment may include a substantially transparent front plate (102). In one embodiment, the front plate (102) may form at least a portion of the first surface (100A). In one embodiment, the front plate (102) may include, but is not limited to, a glass plate or a polymer plate including various coating layers, for example.

[0018] An electronic device (100) according to one embodiment may include a substantially opaque back plate (111). In one embodiment, the back plate (111) may form at least a portion of the second surface (100B). In one embodiment, the back plate (111) may be formed of a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0019] An electronic device (100) according to one embodiment may include a side bezel structure (or side member) (118) (e.g., a side wall (141) of a frame structure (140) of FIG. 2). In one embodiment, the side bezel structure (118) may be combined with a front plate (102) and / or a rear plate (111) to form at least a portion of a third side (100C) of the electronic device (100). For example, the side bezel structure (118) may form the entire third side (100C) of the electronic device (100), or, for another example, the side bezel structure (118) may form the third side (100C) of the electronic device (100) together with the front plate (102) and / or the rear plate (111).

[0020] Unlike the illustrated embodiment, when the third side (100C) of the electronic device (100) is partially formed by the front plate (102) and / or the rear plate (111), the front plate (102) and / or the rear plate (111) may include a region that extends seamlessly from its edge toward the rear plate (111) and / or the front plate (102). The extending region of the front plate (102) and / or the rear plate (111) may be located at both ends of a long edge of the electronic device (100), for example, but is not limited to the above-described example.

[0021] In one embodiment, the side bezel structure (118) may comprise a metal and / or a polymer. In one embodiment, the back plate (111) and the side bezel structure (118) may be formed integrally and may comprise the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (111) and the side bezel structure (118) may be formed as separate components and / or may comprise different materials.

[0022] In one embodiment, the electronic device (100) may include at least one of a display (101), an audio module (103, 104, 107), a sensor module (not shown), a camera module (105, 112, 113), a key input device (117), a light emitting element (not shown), and / or a connector hole. In one embodiment, the electronic device (100) may omit at least one of the above components (e.g., the key input device (117) or the light emitting element (not shown)) or may additionally include other components.

[0023] In one embodiment, the display (101) (e.g., the display module (860) of FIG. 8) may be visually exposed through a substantial portion of the front plate (102). For example, at least a portion of the display (101) may be visible through the front plate (102) forming the first surface (100A). In one embodiment, the display (101) may be disposed on the back surface of the front plate (102).

[0024] In one embodiment, the outer shape of the display (101) may be formed to be substantially the same as the outer shape of the front plate (102) adjacent to the display (101). In one embodiment, in order to expand the area where the display (101) is visually exposed, the gap between the outer shape of the display (101) and the outer shape of the front plate (102) may be formed to be substantially the same.

[0025] In one embodiment, the display (101) (or the first surface (100A) of the electronic device (100)) may include a screen display area (101A). In one embodiment, the display (101) may provide visual information to a user through the screen display area (101A). In the illustrated embodiment, when the first surface (100A) is viewed from the front, the screen display area (101A) is depicted as being positioned on the inside of the first surface (100A) and spaced apart from the outer edge of the first surface (100A), but is not limited thereto. In one embodiment, when the first surface (100A) is viewed from the front, at least a portion of an edge of the screen display area (101A) may substantially coincide with an edge of the first surface (100A) (or the front plate (102)).

[0026] In one embodiment, the screen display area (101A) may include a sensing area (101B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (101A) includes the sensing area (101B)" may be understood to mean that at least a portion of the sensing area (101B) may overlap the screen display area (101A). For example, the sensing area (101B) may be an area capable of displaying visual information by the display (101) like other areas of the screen display area (101A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (101B) may also be formed in the key input device (117).

[0027] In one embodiment, the display (101) may include an area where a first camera module (105) (e.g., camera module (880) of FIG. 8) is positioned. In one embodiment, an opening is formed in the area of ​​the display (101), and the first camera module (105) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (100A). In this case, the screen display area (101A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera module (105) (e.g., an under display camera (UDC)) may be positioned under the display (101) so as to overlap the area of ​​the display (101). In this case, the display (101) can provide visual information to the user through the above area, and additionally, the first camera module (105) can obtain an image corresponding to the direction toward the first surface (100A) through the above area of ​​the display (101).

[0028] In one embodiment, the display (101) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0029] In one embodiment, the audio module (103, 104, 107) (e.g., audio module (870) of FIG. 8) may include a microphone hole (103, 104) and a speaker hole (107).

[0030] In one embodiment, the microphone holes (103, 104) may include a first microphone hole (103) formed in a portion of the third surface (100C) and a second microphone hole (104) formed in a portion of the second surface (100B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (103, 104). The microphone may include multiple microphones to detect the direction of the sound.

[0031] In one embodiment, a second microphone hole (104) formed in a portion of the second surface (100B) may be positioned adjacent to a camera module (105, 112, 113). For example, the second microphone hole (104) may acquire sound according to the operation of the camera module (105, 112, 113). However, the present invention is not limited thereto.

[0032] In one embodiment, the speaker hole (107) may include an external speaker hole (107) and a call receiver hole (not shown). The external speaker hole (107) may be formed on a part of the third surface (100C) of the electronic device (100). In one embodiment, the external speaker hole (107) may be implemented as a single hole with the microphone hole (103). Although not shown, the call receiver hole (not shown) may be formed on another part of the third surface (100C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (107) on the third surface (100C). For example, based on the city of FIG. 1, the external speaker hole (107) may be formed on the third surface (100C) corresponding to the lower portion of the electronic device (100), and the call receiver hole may be formed on the third surface (100C) corresponding to the upper portion of the electronic device (100). However, this is not limited thereto, and in one embodiment, the call receiver hole may be formed at a location other than the third surface (100C). For example, the call receiver hole may be formed by a spaced space between the front plate (102) (or, display (101)) and the side bezel structure (118).

[0033] In one embodiment, the electronic device (100) may include at least one speaker (not shown) configured to output sound to the outside of the housing (110) through an external speaker hole (107) and / or a call receiver hole (not shown).

[0034] In one embodiment, a sensor module (not shown) (e.g., sensor module (876) of FIG. 8) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0035] In one embodiment, a camera module (105, 112, 113) (e.g., camera module (880) of FIG. 8) may include a first camera module (105) positioned to face a first side (100A) of the electronic device (100), a second camera module (112) positioned to face a second side (100B), and a flash (113).

[0036] In one embodiment, the second camera module (112) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (112) is not necessarily limited to including multiple cameras and may include a single camera.

[0037] In one embodiment, the first camera module (105) and the second camera module (112) may include one or more lenses, image sensors, and / or image signal processors.

[0038] In one embodiment, the flash (113) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (100).

[0039] In one embodiment, a key input device (117) (e.g., input module (850) of FIG. 8) may be disposed on a third side (100C) of the electronic device (100). In one embodiment, the electronic device (100) may not include some or all of the key input devices (117), and the key input devices (117) that are not included may be implemented in another form, such as a soft key, on the display (101).

[0040] In one embodiment, a connector hole may be formed on the third surface (100C) of the electronic device (100) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (878) of FIG. 8) electrically connected to the connector of the external device may be arranged within the connector hole. The electronic device (100) according to one embodiment may include an interface module (e.g., an interface (877) of FIG. 8) for processing electrical signals transmitted and received through the connection terminal.

[0041] In one embodiment, the electronic device (100) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (100A) of the housing (110). The light-emitting element (not shown) may provide status information of the electronic device (100) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (105). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0042] Figure 2 is an exploded perspective view of an electronic device according to one embodiment.

[0043] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0044] Referring to FIG. 2, an electronic device (100) according to one embodiment may include a frame structure (140), a first printed circuit board (150), a second printed circuit board (152), a cover plate (160), and a battery (170).

[0045] In one embodiment, the frame structure (140) may include a side wall (141) forming an exterior of the electronic device (100) (e.g., the third side (100C) of FIG. 1) and a support portion (143) extending inwardly from the side wall (141). In one embodiment, the frame structure (140) may be disposed between the display (101) and the back plate (111). In one embodiment, the side wall (141) of the frame structure (140) may surround a space between the back plate (111) and the front plate (102) (and / or the display (101)), and the support portion (143) of the frame structure (140) may extend from the side wall (141) within the space. According to one embodiment, a side wall (141) forming a side surface of an electronic device (100) (e.g., a third surface (100C) of FIG. 1) may include a speaker hole (107) connecting the inside and the outside of the electronic device (100). The speaker hole (107) may penetrate the side wall (141).

[0046] In one embodiment, the frame structure (140) may support or accommodate other components included in the electronic device (100). For example, a display (101) may be disposed on one side of the frame structure (140) facing one direction (e.g., +z direction), and the display (101) may be supported by a support portion (143) of the frame structure (140). For another example, a first printed circuit board (150), a second printed circuit board (152), a battery (170), and a second camera module (112) may be disposed on the other side of the frame structure (140) facing the opposite direction (e.g., -z direction). The first printed circuit board (150), the second printed circuit board (152), the battery (170), and the second camera module (112) can each be mounted in a recess defined by a side wall (141) and / or a support portion (143) of the frame structure (140).

[0047] In one embodiment, the first printed circuit board (150), the second printed circuit board (152), and the battery (170) may be respectively coupled to the frame structure (140). For example, the first printed circuit board (150) and the second printed circuit board (152) may be fixedly disposed to the frame structure (140) via a coupling member such as a screw. For example, the battery (170) may be fixedly disposed to the frame structure (140) via an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0048] In one embodiment, the cover plate (160) may be disposed between the first printed circuit board (150) and the back plate (111). In one embodiment, the cover plate (160) may be disposed on the first printed circuit board (150). For example, the cover plate (160) may be disposed on a surface of the first printed circuit board (150) facing the -z direction.

[0049] In one embodiment, the cover plate (160) may at least partially overlap the first printed circuit board (150) with respect to the z-axis. In one embodiment, the cover plate (160) may cover at least a portion of the first printed circuit board (150). In this way, the cover plate (160) may protect the first printed circuit board (150) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (150).

[0050] In one embodiment, the cover plate (160) may be fixedly positioned on the first printed circuit board (150) via a joining member (e.g., a screw), or may be joined to the frame structure (140) together with the first printed circuit board (150) via the joining member.

[0051] In one embodiment, the display (101) may be positioned between a frame structure (140) and a front plate (102). For example, the front plate (102) may be positioned on one side (e.g., in the +z direction) of the display (101), and the frame structure (140) may be positioned on the other side (e.g., in the -z direction).

[0052] In one embodiment, the front plate (102) may be coupled with the display (101). For example, the front plate (102) and the display (101) may be bonded to each other via an optically clear adhesive (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0053] In one embodiment, the front plate (102) may be coupled with a frame structure (140). For example, the front plate (102) may include an outer portion extending outside the display (101) when viewed in the z-axis direction, and may be adhered to the frame structure (140) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (102) and the frame structure (140) (e.g., side wall (141)). However, the present invention is not limited to the above-described example.

[0054] In one embodiment, the first printed circuit board (150) and / or the second printed circuit board (152) may be equipped with a processor (e.g., processor (820) of FIG. 8), memory (e.g., memory (830) of FIG. 8), and / or an interface (e.g., interface (877) of FIG. 8). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (100) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In one embodiment, the first printed circuit board (150) and the second printed circuit board (152) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0055] In one embodiment, a battery (170) (e.g., battery (889) of FIG. 8 ) may power at least one component of the electronic device (100). For example, the battery (170) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (170) may be disposed substantially coplanar with the first printed circuit board (150) and / or the second printed circuit board (152).

[0056] An electronic device (100) according to one embodiment may include an antenna module (not shown) (e.g., antenna module (897) of FIG. 8). In one embodiment, the antenna module may be disposed between the rear plate (111) and the battery (170). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0057] In one embodiment, the housing (110) of the electronic device (100) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (100). In this respect, at least a portion of the front plate (102), the frame structure (140), and / or the rear plate (111) that form the exterior of the electronic device (100) may be referred to as the housing (110) of the electronic device (100).

[0058] Figure 3 is a drawing showing the interior of an exemplary electronic device. Figure 4 is a cross-sectional view of the exemplary electronic device.

[0059] Referring to FIGS. 3 and 4, the electronic device (100) may include a printed circuit board (150), a speaker (310), a camera (320), and a battery (170) disposed on a frame structure (140) disposed within a housing (110). The electronic device (100) may at least partially reference the electronic device (100) of FIG. 1 and the electronic device (100) of FIG. 2.

[0060] The electronic device (100) may include a printed circuit board (150) (e.g., the first printed circuit board (150) of FIG. 2) and another printed circuit board (e.g., the second printed circuit board (152) of FIG. 2) spaced apart from the printed circuit board (150), and the other printed circuit board may be electrically connected to the printed circuit board (150) through a flexible printed circuit board. Each of the printed circuit board (150) and the other printed circuit board may be disposed on opposite sides of the housing (110) of the electronic device (100). For example, the printed circuit board (150) may be disposed on one side (e.g., the top) (e.g., in the +y-axis direction) of the housing (110) of the electronic device (100). The other printed circuit board may be disposed on the other side (e.g., the bottom) (e.g., in the -y-axis direction) of the housing (110) of the electronic device (100).

[0061] Electronic components (e.g., a camera, an optical sensor, a processor, or a memory) disposed on the top of the electronic device (100) may be disposed on or connected to a printed circuit board (150). For example, at least one processor controlling electronic components within the electronic device (100) may be disposed on the printed circuit board (150). The printed circuit board (150) may include an opening (352) (or receiving portion) for accommodating a speaker (310).

[0062] The opening (352) can reduce the thickness of the electronic device (100) by accommodating a portion of the speaker (310). To achieve a thin thickness of the electronic device (100), the speaker (310) may not be placed on the printed circuit board (150), but may be inserted into the opening (352) formed in the printed circuit board (150), and the speaker (310) may be supported on a frame structure (e.g., the frame structure (140) of FIG. 2). The speaker (310) may be placed on the frame structure (140) through the opening (352) of the printed circuit board (150). For example, a portion of the speaker (310) may face an end of an acoustic duct (341) of the frame structure (140). A part of the speaker (310) may protrude toward the frame structure (140) (or the acoustic duct (341)) with respect to the printed circuit board (150), and another part of the speaker (310) may protrude toward the rear plate (111) with respect to the printed circuit board (150). The speaker (310) may be inserted into an opening (352) formed at a position corresponding to an end of the acoustic duct (341) and supported by the frame structure (140). The opening (352) may be referred to as a receiving portion from the side where a part of the speaker (310) is received. One side of the speaker (310) supported by the frame structure (140) (e.g., the front side of the speaker (310)) may be a side of the speaker (310) on which a diaphragm for generating an audio signal is placed. The frame structure (140) may include an acoustic duct (341) connected to an audio hole formed on a side of the electronic device (100) to transmit audio signals to the outside. The other side of the speaker (310), opposite to one side of the speaker (310), may be the rear side of the speaker (310). The rear side of the speaker (310) may be a side where a resonance space for resonating audio signals is arranged.Since the speaker (310) penetrates the opening (352) and comes into contact with the frame structure (140), the electronic device (100) can be thinner than when it includes the speaker (310) placed on the printed circuit board (150).

[0063] The battery (170) may be disposed next to (in the -y-axis direction) the printed circuit board (150). The battery (170) may be disposed at the bottom of the electronic device (100) and spaced apart from the printed circuit board (150). The battery (170) may be disposed at the bottom of the electronic device (100) and may supply power to the printed circuit board (150) or an electronic component (e.g., a speaker (310), a camera (320), a wireless communication circuit, a power amplifier circuit, or at least one processor) (150b) disposed on the printed circuit board (150) through a power management integrated circuitry (PMIC). The battery (170) may be electrically connected to a power amplifier circuit of the wireless communication circuit through conductive patterns in the printed circuit board (150). The wireless communication circuit may require a large amount of current or power to transmit a radio frequency (RF) signal. Conductive patterns within a printed circuit board (150) can transmit a large amount of current to electronic components (150b) disposed on the printed circuit board (150). For example, the current transmitted through the printed circuit board (150) can be transmitted along a current path (P) formed from a battery (170) to an electronic component (e.g., a processor or a power amplifier circuit) (150b).

[0064] Referring to FIG. 4, the printed circuit board (150) may include a plurality of non-conductive layers (421a, 421b, 421c, 421d), a conductive pad (401), conductive patterns (411), and other conductive patterns (412a, 412b, 412c, 412d).

[0065] The plurality of non-conductive layers (421a, 421b, 421c, 421d) may be formed of a polymer material and may include an insulating material. The plurality of non-conductive layers (421a, 421b, 421c, 421d) may be combined with each other to provide a single substrate or base material. The plurality of non-conductive layers (421a, 421b, 421c, 421d) formed of an insulating material may be arranged between the plurality of conductive patterns (411, 412a, 412b, 412c, 412d). A plurality of non-conductive layers (421a, 421b, 421c, 412d) arranged between a plurality of conductive patterns (411, 412a, 412b, 412c, 412d) can separate the plurality of conductive patterns (411, 412a, 412b, 412c, 412d).

[0066] The conductive pad (401) may be exposed to the outside of the printed circuit board (150). The conductive pad (401) may be disposed on one of the outer layers among the plurality of non-conductive layers (421a, 421b, 421c, 421d). For example, the conductive pad (401) may be disposed on the first non-conductive layer (421a) forming the upper layer of the printed circuit board (150). For example, the first non-conductive layer (421a) may correspond to the non-conductive layer closest to the rear surface of the speaker (310) among the plurality of non-conductive layers (421a, 421b, 421c, 421d).

[0067] The conductive pad (401) may be coupled to a case (316) to provide a resonance space (450) of a shield can or speaker (310). For example, the case (316) may be disposed at the rear of the speaker (310) to provide a resonance space (450) for audio emitted from the speaker (310). The case (316) may include a side wall (316a) and a plate (316b) disposed on the side wall (316a). The side wall (316a) of the case (316) may be disposed on a printed circuit board (150). For example, the side wall (316a) of the case (316) may be disposed along an opening (352) of the printed circuit board (150) when the printed circuit board is viewed in the -z-axis direction. The case (316) may surround the rear of the speaker (310) and a portion of the side of the speaker (310). The case (316) may be formed of a conductive material. The case (316) may be welded or bonded to a conductive pad. The case (316) may be formed of a conductive material to shield external noise or magnetic fields, but may have difficulty blocking the influence of current flowing along the surface of the case (316). In terms of shielding external signals, the case (316) may be referred to as a shielding can, and in terms of surrounding the speaker, it may be referred to as an enclosure or housing. The case (316) may surround the rear of the speaker (310) to provide a resonance space (450) of the speaker (310). The resonance space (450) may be configured to emphasize the low-frequency range of an audio signal emitted from the speaker. The case (316) can generate a low-frequency audio signal by providing a resonance space (450). The case (316) can be coupled to a conductive pad (401). The case (316) placed on the conductive pad (401) can be sealed with a printed circuit board (150).The case (316) can reduce the transmission of audio signals generated from the speaker (310) to the outside by sealing the gap between the case (316) and the printed circuit board (150). For example, the case (316) that is sealed while surrounding the outside of the speaker (310) can reduce sound leakage to the outside of the case (316).

[0068] The printed circuit board (150) may include conductive patterns (411) disposed on a first non-conductive layer (421a) among non-conductive layers (421a, 421b, 421c, 421d) and other conductive patterns (412a, 412b, 412c, 412d) disposed between the non-conductive layers (421a, 421b, 421c, 421d). The first non-conductive layer (421a) may be a non-conductive layer that contacts the case (316). The conductive pattern (412a) may be disposed on the non-conductive layer (421b). The conductive pattern (412b) may be disposed on the non-conductive layer (421c). The conductive pattern (412c) may be arranged in the -z-axis direction of the non-conductive layer (421d). The conductive pattern (412d) may be arranged in the z-axis direction of the non-conductive layer (421d).

[0069] The conductive patterns (411) disposed on the first non-conductive layer (421a) may be spaced apart from the conductive pads (401). For example, the conductive patterns (411) and the conductive pads (401) may be electrically isolated from each other. An isolation portion (429) may be positioned between the conductive patterns (411) and the conductive pads (401). The isolation portion (429) may be filled with a non-conductive material or formed as an empty space. For example, the isolation portion (429) may be formed of the same material as the material of the non-conductive layers (421a, 421b, 421c, 421d). The isolation portion (429) may be formed integrally with the first non-conductive layer (421a). For example, the isolation portion (429) between the conductive patterns (411) and the conductive pad (401) may be a protruding portion of the first non-conductive layer (421a). Although the isolation portion (429) has been described as filling the space between the conductive patterns (411) and the conductive pad (401) from the first non-conductive layer (421a), it is not limited thereto and may be formed as an empty space.

[0070] The conductive patterns (411) and other conductive patterns (412a, 412b, 412c, 412d) may include conductive lines that transmit signals or power and / or ground lines that are connected to a ground portion of the electronic device (100) (e.g., a conductive portion of the frame structure (140)). The conductive patterns (411) may be disposed on the same layer as the conductive pad (401) (e.g., a first non-conductive layer (421a)). The conductive patterns (411) may be spaced apart from and electrically isolated from other conductive pads (401). Other conductive patterns (412a, 412b, 412c, 412d) can be electrically isolated from the conductive pad (401) by being disposed on other layers (421b, 421c, 421d) on which the conductive pad (401) is disposed. The conductive patterns (411) and other conductive patterns (412a, 412b, 412c, 412d) can be electrically connected to each other. For example, the conductive patterns (411) and other conductive patterns (412a, 412b, 412c, 412d) can be connected to each other through a conductive via (413).

[0071] The conductive pad (401) may be electrically isolated from the ground line and / or the ground portion by being electrically separated from the conductive patterns (411) and other conductive patterns (412a, 412b, 412c, 412d). The case (316) may be connected to the conductive pad (401) that is electrically isolated from the ground line or the ground portion. As the case (316) is separated from the conductive patterns (411) and other conductive patterns (412a, 412b, 412c, 412d), the flow of current into the case (316) may be restricted. As the current flowing into the case (316) is eliminated or reduced, the influence of the current on the speaker (310) disposed below the case (316) may be reduced.

[0072] Referring back to FIG. 3, the current flowing along the case (316) can generate a magnetic field. The generated magnetic field can induce a current in the coil within the speaker (310). The audio signal of the speaker (310) may include noise due to the induced current. As the case (316) and the conductive pad (401) are separated from the conductive patterns (411) and other conductive patterns (412), the magnetic field around the speaker (310) can be reduced by blocking or limiting the current transmitted to the case (316). By reducing the magnetic field, the noise transmitted to the speaker (310) can be reduced. The magnetic field transmitted to the speaker (310) can be proportional to the strength or size of the current and inversely proportional to the square of the distance between the speaker (310) and the current path. By inducing current through conductive patterns on the outside of the case (316) instead of the case (316), the distance between the speaker (310) and the current path can be increased. By providing the current path as the first electrical path (R1) instead of the second electrical path (R2), the magnetic field around the speaker (310) can be reduced. The printed circuit board (150) can allow current to flow through some of the conductive patterns that act as ground lines. For example, when a case including a conductive material (e.g., the case (316) of FIG. 4) is electrically connected to a ground line or a ground portion, the current can flow along the second electrical path (R2) among the electrical paths (R1, R2) along the surface of the case. The currents can form a magnetic field that affects electronic components. The magnetic field caused by the currents can induce current in the coil of an electronic component including a coil therein, such as a camera or a speaker. The speaker can generate an audio signal having noise due to the induced current.In order to reduce or eliminate the above noise, the printed circuit board (150) and the case (316) for the speaker (310) may be configured to limit the current flowing around the speaker (310) from flowing through the case (316). When the case (316) is electrically isolated from the ground line or ground portion, the current flowing from the electronic component (150b) arranged around the speaker (310) to the battery (170) or power management circuit (150a) may be limited (or reduced) from flowing to the surface of the case (316). For example, the conductive pad (401) connected to the case (316) may be electrically isolated from the conductive patterns (411, 412a, 412b, 412c, 412d) that act as ground lines. A ground line electrically disconnected from the case (316) can be configured to limit current flow along a second electrical path (R2) formed along the surface of the case (316) and to allow current to flow along a first electrical path (R1).

[0073] By electrically isolating the case (316) from the conductive patterns connected to the ground portion, noise transmitted to the speaker (310) can be reduced. However, the present invention is not limited thereto, and according to one embodiment, the conductive pad (401) can be selectively connected to the conductive pattern (411) through a switch.

[0074] Although the conductive pad (401) has been described as being electrically isolated from other conductive patterns (412a, 412b, 412c, 412d) laminated on layers other than the first non-conductive layer (421a), it is not limited thereto. For example, the conductive pad (401) may be connected to a conductive pattern or conductive portion disposed on other non-conductive layers (421a, 421b, 421c, 421d) through a conductive via. In order to secure the rigidity of the conductive pad (401) and the rigidity of the case (316) coupled to the conductive pad (401), the conductive pad (401) may be coupled to a conductive portion disposed on other non-conductive layers (421a, 421b, 421c, 421d). To reinforce rigidity, some portions of the conductive pad (401) may be plated. For example, the side surfaces of the conductive pad (401) may be plated.

[0075] The structure of the conductive portion within the printed circuit board (150) to secure the rigidity of the conductive pad (401) is explained through FIGS. 5a, 5b, and 5c.

[0076] Figures 5a, 5b, and 5c are exemplary drawings showing the area around the openings where the speakers of each layer of the printed circuit board are mounted.

[0077] Referring to FIG. 5a, a conductive pad (401) and conductive patterns (411) may be disposed on a first non-conductive layer (421a). The conductive pad (401) may be disposed along an edge of an opening (352) of a printed circuit board (150). The conductive patterns (411) may be conductive patterns disposed next to the conductive pad (401) disposed on the first non-conductive layer (421a).

[0078] The conductive pad (401) and the conductive patterns (411) may be spaced apart from each other. In order for the conductive pad (401) and the conductive patterns (411) to be electrically isolated from each other, the first non-conductive layer (421a) of the printed circuit board (150) may include a first insulating portion (501) and a second insulating portion (502).

[0079] The conductive pads (401) are expressed as forming a closed curve, but are not limited thereto, and the conductive pads (401) may be configured to be separated from each other so as to be arranged at portions that are coupled with a connecting portion (e.g., a leg) of a case (e.g., a case (316) of FIG. 4). The conductive patterns (411) may be electrically connected to a ground portion of the electronic device. The conductive patterns (411) may be electrically separated from the conductive pads (401) through the first insulating portion (501). The case (316) electrically connected to the conductive pads (401) separated from the conductive patterns (411) may be electrically separated from the ground. The case (316) separated from the conductive patterns (411) may prevent current transmitted through the conductive patterns (411) from flowing into the case (316).

[0080] In one embodiment, the first insulating portion (501) and the second insulating portion (502) may be part of the first non-conductive layer (421a). The first insulating portion (501) may be part of the first non-conductive layer (421a) disposed between the conductive pad (401) and the conductive patterns (411). The second insulating portion (502) may be part of the first non-conductive layer (421a) disposed between the conductive portion around the opening portion (352) surrounded by the conductive pad (401) and the conductive pad (401).

[0081] According to one embodiment, the conductive pad (401) may be connected to conductive patterns (411) connected to the ground through a capacitor. Direct current transmitted through the conductive patterns (411) may not be transmitted to the conductive pad (401) by the capacitor. If necessary, an alternating current having a frequency may be transmitted to the conductive pad through the conductive patterns (411) in a certain frequency band.

[0082] Referring to FIG. 5b, the first reinforcing pattern (511) and the first other conductive patterns (412a) among the other conductive patterns may be disposed on the second non-conductive layer (421b). The first reinforcing pattern (511) may be disposed along a portion of an edge of the opening (352) of the printed circuit board (150). The first other conductive patterns (412a) may be conductive patterns disposed next to the first reinforcing pattern (511) disposed on the second non-conductive layer (421b).

[0083] The first reinforcing pattern (511) and the first other conductive patterns (412a) may be spaced apart from each other. The first reinforcing pattern (511) may be electrically connected to a conductive pad (e.g., the conductive pad (401) of FIG. 5a). For example, the first reinforcing pattern (511) may be connected through a conductive via (512) that is connected to the conductive pad (401). The conductive pad (401) may be coupled to the first reinforcing pattern (511) through the conductive via (512) to secure rigidity. The conductive pad (401) coupled to the conductive via (512) and the first reinforcing pattern (511) may secure rigidity for maintaining coupling with a case (e.g., the case (316) of FIG. 4) based on the increased rigidity. The first reinforcing pattern (511) may be referred to as a conductive pattern or a conductive portion in terms of including a conductive material.

[0084] The first reinforcing pattern (511) is separated from other conductive patterns (e.g., first other conductive patterns (412a)), so that even if the case (316) is connected to the first reinforcing pattern (511) through the conductive via (512) and the conductive pad (401), it can maintain separation from the ground.

[0085] Referring to FIG. 5c, the second reinforcing pattern (521) and the remaining conductive patterns (412b, 412c, 412d) excluding the first other conductive pattern (412a) among the other conductive patterns may be arranged on the remaining non-conductive layers (421c, 421d). The second reinforcing pattern (521) may be spaced apart from the remaining conductive patterns (421b, 421c, 421d). The second reinforcing pattern (521) may be electrically connected to the first reinforcing pattern (511) and the conductive pad (401) through a conductive via (522), similar to the first reinforcing pattern (511) of FIG. 5b. The conductive via (522) may be formed at a position corresponding to the position of the conductive via (512) of FIG. 5b. The second reinforcement pattern (521) may be placed below the first reinforcement pattern (511) and may be formed narrower than the first reinforcement pattern (511).

[0086] The first reinforcing pattern (511) and the second reinforcing pattern (521) can be placed in a weakly rigid portion around the opening (352) of the printed circuit board (150). Through the reinforcing patterns (511, 521) that reinforce the rigidity of the printed circuit board (150), the case (316) can be stably coupled to the conductive pad (401).

[0087] The second reinforcing pattern (521) is separated from other conductive patterns, so that even when the case (316) is connected to the second reinforcing pattern (521) through the conductive via (512), the conductive pad (401), the first reinforcing pattern (511), and the conductive via (522), the separation from the ground can be maintained. The reinforcing patterns (511, 521) can be arranged in each of the multiple layers constituting the printed circuit board (150).

[0088] In order to prevent the case (316) from being detached from the conductive pad (401), conductive patterns (412a, 412b, 412c, 412d) disposed on a non-conductive layer (421b, 421c, 421d) different from the non-conductive layer (421a) on which the conductive pad (401) is disposed can reinforce the rigidity of the conductive pad (401) through a conductive via (512). Conductive patterns (412a, 412b, 412c, 412d) disposed on a non-conductive layer (421b, 421c, 421d) different from the non-conductive layer (421a) on which the conductive pad (401) is disposed can be extended to be wider than the width of the conductive pad (401), thereby reinforcing the rigidity of the conductive pad (401).

[0089] The reinforcement patterns (511, 521) of FIGS. 5b and 5c may be omitted. The reinforcement patterns of FIGS. 5b and 5c are excluded, and the portion where the reinforcement patterns are arranged may be filled with non-conductive layers (421a, 421b, 421c, 421d). The portion filled with the non-conductive layers (421a, 421b, 421c, 421d) may be a fill-cut portion formed entirely of non-conductive layers (421a, 421b, 421c, 421d) except for a portion of the conductive pad (e.g., the conductive pad (401) of FIG. 5a). By including the fill-cut portion, the conductive pad (401) may be electrically isolated from the conductive patterns. By eliminating the return current flow of the conductive pad (401), the current affecting the speaker (310) can be reduced.

[0090] The above-mentioned fillet portion may be a thin section of a printed circuit board (150) between the speaker (310) and the camera (320).

[0091] FIG. 5d is an exemplary drawing showing a layer from which a conductive portion of a printed circuit board has been partially removed.

[0092] Referring to FIGS. 4 and 5d, conductive patterns (412a, 412b, 412c, 412d) disposed on non-conductive layers (421b, 421c, 421d) of a printed circuit board (150) other than the first non-conductive layer (421a) in contact with the case (316) may be removed in a portion (530). For example, the portion (530) may be referred to as a fill-cut portion or a fill-cut area when considering the portion where the conductive patterns (412a, 412b, 412c, 412d) are removed. Some areas (530) may be referred to as a lateral edge, which is a relatively thin portion of the printed circuit board (150) or the non-conductive layer (421a).

[0093] The partial area (530), which is a fill-cut portion or fill-cut area, may be a narrow portion around the opening (352) for the speaker. For example, one side of the partial area (530) may be formed to face the speaker and the other side may be formed to face another electronic component. Conductive patterns (412a, 412b, 412c, 412d) within the partial area (530) may be at least partially removed. For example, conductive patterns (412a) (e.g., ground lines or signal rounds) may be removed in a partial area (530) of a second layer (421b) disposed below a first layer (421a) of a printed circuit board (150). Among the layers (421a, 421b, 421c, 421d) of the printed circuit board (150), conductive patterns (412b, 412c, 412d) may be removed in some areas (530) of the non-conductive layers (421b, 421c, 421d) except for the first non-conductive layer (421a) that contacts the case (316). The some areas (530) may not include a conductive portion except for the first non-conductive layer (421a) where the conductive pad (501) is exposed.

[0094] Referring to FIGS. 5a, 5b, 5c, and 5d, the conductive patterns (412a, 412b, 412c, 412d) can be electrically isolated from the conductive pad (501). On the first non-conductive layer (421a), the conductive pad (501) is electrically isolated from the conductive pad (411), and the conductive patterns (412a, 412b, 412c, 412d) arranged except for a portion (530) of the second non-conductive layer (421b), the third non-conductive layer (421c), and the fourth non-conductive layer (421d) can be electrically isolated from the conductive pad (501). The conductive patterns (412a, 412b, 412c, 412d) may be electrically disconnected from each other in some areas (530). As the conductive patterns (412a, 412b, 412c, 412d) are removed in the some areas (530), the current flowing in the printed circuit board (150) may flow by avoiding the some areas (530), thereby reducing the influence of the current on the speaker (310).

[0095] Point below the reference magnetic field strength on a printed circuit board where the mode pad and the conductive pattern are connected Point below the reference magnetic field on a printed circuit board where the mode pad and the conductive pattern are separated LTE B41221391NR n78286476WIFI 2.4G 11b131348

[0096] Referring to Table 1, the number of points where the strength of the magnetic field generated by the current flow of the printed circuit board on which the speaker is mounted is less than or equal to the reference strength (e.g., -38 dB A / m) while the electronic device is operating according to each communication mode (or communication protocol).

[0097] On a printed circuit board where the conductive pads and conductive patterns are separated, there may be more points below the critical magnetic field strength than points below the critical magnetic field strength on a printed circuit board where the conductive pads and conductive patterns are connected. As the conductive pads are separated from the conductive patterns, current flow to the case through the conductive pads is restricted, and the number of points where the magnetic field strength due to the current is below the reference strength may increase. As the magnetic field around the speaker is weakened, the speaker noise may be improved.

[0098] FIG. 6 is a cross-sectional view of an exemplary electronic device including a capacitor connecting conductive pads and conductive patterns. FIG. 7 is an exemplary drawing showing the periphery of an opening portion of a printed circuit board including a capacitor connecting conductive pads and conductive patterns.

[0099] Referring to FIGS. 6 and 7, the electronic device (100) may include a printed circuit board (150), a speaker (310), a camera (320), and a battery (170) disposed on a frame structure (140) disposed within a housing (110). The electronic device (100) may at least partially reference the electronic device (100) of FIG. 1, the electronic device (100) of FIG. 2, the electronic device (100) of FIG. 3, and the electronic device (100) of FIG. 4. The printed circuit board (150) may include a plurality of non-conductive layers (421a, 421b, 421c, 421d), a conductive pad (401), conductive patterns (411), and other conductive patterns (412a, 412b, 412c, 412d). The printed circuit board (150) may refer to at least a portion of the printed circuit board (150) of FIG. 4, FIG. 5a, FIG. 5b, FIG. 5c, and FIG. 5d.

[0100] A housing (110), a printed circuit board (150) disposed on a frame structure (140) disposed within the housing (110), a speaker (310), a camera (320), a battery (170), a plurality of non-conductive layers (421a, 421b, 421c, 421d), a conductive pad (401), conductive patterns (411) and other conductive patterns (412a, 412b, 412c, 412d) are provided in the housing (110), a printed circuit board (150), a speaker (310), a camera (320), a battery (170), a plurality of non-conductive layers (421a, 421b, 421c, 421d), a conductive pad (401), conductive patterns (411) and other conductive patterns (412a, 412b, 412c, 412d) of FIGS. 1, 2, 3, 4, 5a, 5b, 5c and 5d. The patterns (411) and other challenging patterns (412a, 412b, 412c, 412d) may be substantially identical or similar. Description of overlapping portions is omitted.

[0101] According to one embodiment, the conductive pad (401) can be isolated from the conductive patterns (411, 412a, 412b, 412c, 412d) that act as grounds of the printed circuit board (150). The conductive pad (401) isolated from the conductive patterns (411, 412a, 412b, 412c, 412d) can reduce the influence of the magnetic field on the speaker (310) caused by the return current flowing along the conductive patterns (411, 412a, 412b, 412c, 412d) of the printed circuit board (150). By reducing the influence of the magnetic field, unnecessary current flowing in the coil of the speaker (310) can be reduced, and noise of the speaker (310) can be reduced. Return current may represent current supplied from a power source (e.g., a battery (170) or a power management circuit (150a)) to a load (e.g., hardware elements such as electronic components (150b)) that is transmitted through the ground portion.

[0102] According to one embodiment, a conductive pad (401) disposed on a printed circuit board (150) may be connected to one of the conductive patterns (411, 412a, 412b, 412c, 412d) (e.g., a conductive pattern (411) disposed on a first non-conductive layer (421a)) through at least one element (610).

[0103] Referring to FIG. 7, at least one element (610) may be arranged to contact a conductive pad (401) arranged along an opening portion (352). The at least one element (610) may be arranged along a conductive pad (401) formed as a closed curve. The conductive pad (401) may be electrically isolated from a conductive pattern (411) on a first non-conductive layer (421a) via a first insulating portion (501) and a second insulating portion (502). The at least one element (610) may be arranged across the first insulating portion (501) or the second insulating portion (502) to connect the conductive pad (401) and the conductive pattern (411).

[0104] In one embodiment, at least one element (610) may include a capacitor. One end of the elements (610) may be connected to a conductive pad (401), and the other end of the at least one element (610) may be connected to a conductive pattern (411). The at least one element (610) that is a capacitor may limit (or reduce) a return current from flowing through the conductive pad (401) to the case (316). For example, the elements (610) that are capacitors may limit (or reduce) a current flowing from an electronic component (e.g., an electronic component (150b) of FIG. 4) on a PCB (e.g., a PCB (150) of FIG. 4) to a rechargeable battery (170) (or a power management circuit (150a)) through the case (316). At least one element (610) which is a capacitor can operate as if the conductive pad (401) and the conductive patterns (411, 412a, 412b, 412c, 412d) are open for low frequency or direct current. For example, the conductive pad can operate as if it is electrically isolated from the conductive patterns (411, 412a, 412b, 412c, 412d) in a first frequency band by the at least one element (610), and as if it is electrically connected to the conductive patterns (411, 412a, 412b, 412c, 412d) in a second frequency band which is higher than the first frequency band. At least one element (610) which is a capacitor can improve the performance of an antenna placed around a speaker (310) by electrically connecting conductive pads (401) and cases (316) and conductive patterns (411, 412a, 412b, 412c, 412d) which act as grounds for a high-frequency RF (radio frequency) signal.For example, at least one element (610), which is a capacitor, may be configured to ground the case (316) together with the conductive pad (401) and the conductive patterns (411, 412a, 412b, 412c, 412d) while the electronic device (100) transmits a signal to an external electronic device (e.g., the electronic device (804) of FIG. 8). For example, the electronic device (100) may further include a wireless communication circuit and an antenna. The wireless communication circuit may be disposed on a printed circuit board (150) and may receive current from a battery (e.g., the battery (170) of FIG. 4) through the printed circuit board (150), a power management circuit, or a power amplification circuit disposed on the printed circuit board (150). For example, the wireless communication circuit and the power amplifier circuit may be electrically connected to the battery through conductive patterns (411, 412a, 412b, 412c, 412d) within the printed circuit board (150). The antenna may be electrically connected to the wireless communication circuit and may be positioned between the printed circuit board (150) and a side wall of the housing (110). The antenna may face the side wall of the housing (110).

[0105] At least one element (610) can reduce noise of the speaker (310) by limiting the return current from flowing around the speaker (310) or to the case (316) surrounding the speaker (310), thereby reducing the generation of induced current in the coil of the speaker (310), and at the same time, for high-frequency signals, can improve the performance of the antenna by making the conductive parts (e.g., the conductive pad (401) and the case (316)) have the same potential as the ground.

[0106] According to the embodiment described above, the magnetic field according to the current flow of the printed circuit board (150) separated from the conductive pad (401) and the conductive patterns acting as ground can be reduced.

[0107] According to the above-described embodiments, the electronic device can improve noise generated in a speaker or receiver. By reducing the current flowing around the speaker or receiver, the size of the magnetic field around the speaker or receiver can be reduced or eliminated. By reducing the noise generated by the magnetic field, the sound quality of the speaker or receiver can be improved.

[0108] The technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those with ordinary knowledge in the technical field to which this document pertains.

[0109] According to the above-described embodiment, an electronic device (e.g., electronic device (100) of FIG. 4) may include a rechargeable battery (170) (e.g., battery (170) of FIG. 3) and a housing (110). The electronic device may include a speaker (e.g., speaker (310) of FIG. 4) within the housing. The electronic device (100) may include a PCB (e.g., printed circuit board (150) of FIG. 4) including an opening portion (e.g., opening portion (352) of FIG. 4) in which the speaker (310) is accommodated. The electronic device (100) may include a case (e.g., case (316) of FIG. 4) that surrounds the rear surface of the speaker and is disposed on the PCB. The PCB (150) may include a conductive pad (e.g., a conductive pad (401) of FIG. 4) disposed along the periphery of the opening portion and coupled to the case, and conductive patterns (e.g., conductive patterns (411) of FIG. 4) spaced apart from the conductive pad and on a layer of the PCB on which the conductive pad is disposed. The electronic device may include a capacitor (e.g., at least one element (610) of FIG. 6) disposed on the PCB (150). The capacitor may be configured to reduce a current flowing from the component on the PCB to the rechargeable battery through the case, and to ground the case while the electronic device transmits a signal to an external electronic device. The capacitor may connect the conductive patterns and the conductive pad.

[0110] The conductive pad may be connected to the conductive patterns (411) that are electrically connected to the ground portion of the electronic device (100) through the capacitor (e.g., at least one element (610) of FIG. 6). By the at least one element, the conductive pad may be electrically disconnected from the conductive patterns (411) in a first frequency band and electrically connected to the conductive patterns (411) in a second frequency band higher than the first frequency band.

[0111] According to the above-described embodiment, the conductive patterns can be separated from the conductive pads, thereby limiting the return current flowing through the conductive patterns from being transmitted to the shield can through the conductive pads. By limiting the current flowing in the shield can, the current flowing around the speaker can be reduced. As the current flowing around the speaker is reduced, the magnitude of the magnetic field formed around the speaker can be reduced or the magnetic field can be eliminated. As the noise caused by the magnetic field is reduced, the quality of the audio signal of the speaker can be improved.

[0112] In one embodiment, the speaker may be configured to provide an audio signal to the exterior of the electronic device through an acoustic duct positioned at the front of the speaker. The case may provide a resonant space (e.g., resonant space (450) of FIG. 4) for the audio signal.

[0113] According to the above-described embodiment, the electronic device can improve the quality of the low-frequency audio signal of the speaker by including a resonant space. The case can prevent noise leakage of the audio signal emitted from the speaker by sealing the space between the printed circuit boards. By preventing noise leakage, the size of the audio signal can be maintained and the quality of the audio signal can be improved.

[0114] According to one embodiment, the printed circuit board (PCB) may include a plurality of non-conductive layers forming the substrate (e.g., non-conductive layers (421a, 421b, 421c, 421d)) and other conductive patterns (e.g., other conductive patterns (412a, 412b, 412c, 412d) of FIG. 4) disposed on each of the plurality of non-conductive layers.

[0115] According to the above-described embodiment, the PCB can provide a ground or grounding portion of an electronic device and provide lines for transmitting power or signals by including different conductive patterns. For example, the conductive patterns can interconnect electronic components mounted on the printed circuit board and transmit power from a battery to the electronic components.

[0116] According to one embodiment, the conductive pad may be disposed on a non-conductive layer among the plurality of non-conductive layers that is closer to the rear of the speaker.

[0117] According to the above-described embodiment, the conductive pad may be positioned so as to be exposed to the outer surface of the printed circuit board for bonding with a case for providing a shield can or resonant space.

[0118] According to one embodiment, the other conductive patterns may be arranged on each of the non-conductive layers, excluding the non-conductive layer closer to the rear of the speaker, among the plurality of non-conductive layers.

[0119] According to the above-described embodiment, the conductive patterns can be arranged on different layers and electrically isolated from each other. The conductive patterns and the conductive pads are separated from each other, thereby blocking current flow into the case and reducing the generation of a magnetic field around the speaker by blocking the current. The speaker can reduce noise by reducing the induced current in the coil caused by the magnetic field.

[0120] In one embodiment, the other conductive patterns may be connected through conductive vias penetrating the plurality of non-conductive layers and electrically isolated from the conductive pads.

[0121] In one embodiment, the conductive patterns may be connected to each other via conductive vias. A plurality of grounds connected to the conductive patterns via conductive vias may provide a wide ground.

[0122] According to one embodiment, the electronic device may further include a camera connected to the PCB. The speaker (310) is a receiver that transmits an audio signal received through communication with an external electronic device (100), and may be positioned adjacent to the camera.

[0123] In one embodiment, a portion of the side surface of the conductive pad may be wrapped with a conductive thin film.

[0124] According to one embodiment, the PCB may include reinforcement patterns (e.g., the first reinforcement pattern (511) of FIG. 5b and the second reinforcement pattern (512) of FIG. 5c) arranged within the PCB and connected to the conductive pads through conductive vias.

[0125] In one embodiment, each of the conductive portions may be spaced apart from the conductive patterns.

[0126] According to the above-described embodiment, the pad can secure rigidity by being connected to the conductive portions. The conductive pad with secured rigidity can maintain bonding force with the case. The conductive pad that maintains bonding with the case can prevent return current from being transmitted to the case through the conductive pad by being separated from the conductive patterns. The limited or reduced current can reduce the size of the magnetic field around the speaker. Through the reduced magnetic field, the amount of induced current within the speaker can be reduced, and the audio quality of the speaker can be improved by the reduced induced current.

[0127] According to one embodiment, the electronic device may further include at least one processor disposed on the PCB (150) and operatively connected to the speaker (310).

[0128] According to one embodiment, the speaker may be positioned on a support portion within the housing that includes an acoustic duct connected to an audio hole formed in the housing.

[0129] According to the above-described embodiment, an audio signal can be transmitted to the outside of the electronic device through an acoustic duct connected to the audio hole.

[0130] In one embodiment, the case may be electrically isolated from the conductive patterns to limit the generation of a magnetic field by current flowing along the case.

[0131] According to one embodiment, the electronic device may further include a switch configured to selectively connect the conductive pad and some of the conductive patterns.

[0132] In one embodiment, the electronic device may further include a wireless communication circuit. The electronic device may further include a battery (e.g., battery (170) of FIG. 4). The battery may be disposed within the housing.

[0133] The battery may be electrically connected through the conductive patterns within the PCB (150). The battery may be electrically connected to a power amplifier circuit of the wireless communication circuit.

[0134] The above battery can be electrically connected to a power amplifier circuit of the wireless communication circuit through the conductive pattern in the PCB.

[0135] According to the above-described embodiment, the printed circuit board may be connected to a wireless communication circuit and may have a power amplifier circuit arranged thereon. Because the current transmitted to or through the power amplifier circuit is large, noise may be transmitted to the speaker. A conductive pad separated from the ground can limit the current flowing to the shielding can or case, thereby reducing noise around the speaker.

[0136] According to one embodiment, the antenna connected to the wireless communication circuit may be positioned toward a side wall of the electronic device (100).

[0137] According to one embodiment, an electronic device (100) is disclosed. The electronic device may include a speaker (e.g., speaker (310) of FIG. 4). The electronic device may further include a printed circuit board (PCB) (150). The PCB may include an opening portion in which the speaker (310) is accommodated.

[0138] The electronic device may further include a case (e.g., case (316) of FIG. 3) that surrounds the rear of the speaker and is placed on the PCB.

[0139] The PCB (150) may further include a conductive pad (e.g., conductive pad (401) of FIG. 4) that is positioned along the opening portion (e.g., opening portion (352) of FIG. 4) and exposed to the outside of the PCB and is coupled to the case (e.g., case (316) of FIG. 4).

[0140] The electronic device may further include conductive patterns disposed within the PCB and electrically disconnected from the conductive pad.

[0141] The conductive pad may be electrically disconnected from a ground portion of the electronic device that is electrically connected to the conductive patterns.

[0142] According to the above-described embodiment, the conductive patterns can be separated from the conductive pads, thereby limiting the return current flowing through the conductive patterns from being transmitted to the shield can through the conductive pads. By limiting the current flowing in the shield can, the current flowing around the speaker can be reduced. As the current flowing around the speaker is reduced, the magnitude of the magnetic field formed around the speaker can be reduced or the magnetic field can be eliminated. As the noise caused by the magnetic field is reduced, the quality of the audio signal of the speaker can be improved.

[0143] In one embodiment, the PCB may further include a plurality of non-conductive layers forming the substrate (e.g., non-conductive layers 421a, 421b, 421c, 421d of FIG. 4). The PCB may include other conductive patterns (e.g., other conductive patterns 412a, 412b, 412c, 412d of FIG. 4) disposed on each of the plurality of non-conductive layers. The other conductive patterns may be electrically disconnected from the conductive pad.

[0144] According to the above-described embodiment, the other conductive patterns can be separated from the conductive pad, thereby limiting the return current flowing through the other conductive patterns from being transmitted to the shield can through the conductive pad. By limiting the current flowing to the shield can on the speaker, the influence of the magnetic field transmitted to the speaker placed under the shield can can be reduced.

[0145] According to one embodiment, the other conductive patterns may be arranged on each of the non-conductive layers, excluding the non-conductive layer closer to the rear of the speaker, among the plurality of non-conductive layers.

[0146] According to the above-described embodiment, the conductive patterns can be arranged on different layers and electrically isolated from each other. The conductive patterns and the conductive pads are separated from each other, thereby blocking current flow into the case and reducing the generation of a magnetic field around the speaker by blocking the current. The speaker can reduce noise by reducing the induced current in the coil caused by the magnetic field.

[0147] In one embodiment, the other conductive patterns may be connected to the conductive patterns through conductive vias penetrating the plurality of non-conductive layers.

[0148] The at least one element can connect the conductive pads to the conductive patterns connected to the other conductive patterns to reduce current flowing from the component on the PCB to the rechargeable battery through the case and to ground the case while the electronic device transmits a signal to an external electronic device.

[0149] According to the above-described embodiment, the pad can secure rigidity by being connected to the conductive portions. The conductive pad with secured rigidity can maintain bonding force with the case. The conductive pad that maintains bonding with the case can prevent return current from being transmitted to the case through the conductive pad by being separated from the conductive patterns. The limited or reduced current can reduce the size of the magnetic field around the speaker. Through the reduced magnetic field, the amount of induced current within the speaker can be reduced, and the audio quality of the speaker can be improved by the reduced induced current.

[0150] In one embodiment, the speaker may be configured to provide an audio signal to the exterior of the electronic device through an acoustic duct positioned at the front of the speaker. The case may provide a resonant space (450) for the audio signal.

[0151] According to the above-described embodiment, the electronic device can improve the quality of the low-frequency audio signal of the speaker by including a resonant space. The case can prevent noise leakage of the audio signal emitted from the speaker by sealing the space between the printed circuit boards. By preventing noise leakage, the size of the audio signal can be maintained and the quality of the audio signal can be improved.

[0152] FIG. 8 is a block diagram of an electronic device (801) within a network environment (800) according to various embodiments. Referring to FIG. 8, in the network environment (800), the electronic device (801) may communicate with the electronic device (802) via a first network (898) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (804) or the server (808) via a second network (899) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (801) may communicate with the electronic device (804) via the server (808). According to one embodiment, the electronic device (801) may include a processor (820), a memory (830), an input module (850), an audio output module (855), a display module (860), an audio module (870), a sensor module (876), an interface (877), a connection terminal (878), a haptic module (879), a camera module (880), a power management module (888), a battery (889), a communication module (890), a subscriber identification module (896), or an antenna module (897). In some embodiments, the electronic device (801) may omit at least one of these components (e.g., the connection terminal (878)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (876), the camera module (880), or the antenna module (897)) may be integrated into one component (e.g., the display module (860)).

[0153] The processor (820) may, for example, execute software (e.g., a program (840)) to control at least one other component (e.g., a hardware or software component) of the electronic device (801) connected to the processor (820) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (820) may store commands or data received from other components (e.g., a sensor module (876) or a communication module (890)) in a volatile memory (832), process the commands or data stored in the volatile memory (832), and store result data in a non-volatile memory (834). According to one embodiment, the processor (820) may include a main processor (821) (e.g., a central processing unit or an application processor) or an auxiliary processor (823) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (821). For example, when the electronic device (801) includes the main processor (821) and the auxiliary processor (823), the auxiliary processor (823) may be configured to use less power than the main processor (821) or to be specialized for a given function. The auxiliary processor (823) may be implemented separately from the main processor (821) or as a part thereof.

[0154] The auxiliary processor (823) may control at least a portion of functions or states associated with at least one component (e.g., a display module (860), a sensor module (876), or a communication module (890)) of the electronic device (801), for example, on behalf of the main processor (821) while the main processor (821) is in an inactive (e.g., sleep) state, or together with the main processor (821) while the main processor (821) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (823) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (880) or a communication module (890)). In one embodiment, the auxiliary processor (823) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (801) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (808)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0155] The memory (830) can store various data used by at least one component (e.g., the processor (820) or the sensor module (876)) of the electronic device (801). The data can include, for example, software (e.g., the program (840)) and input data or output data for commands related thereto. The memory (830) can include volatile memory (832) or non-volatile memory (834).

[0156] The program (840) may be stored as software in the memory (830) and may include, for example, an operating system (842), middleware (844), or an application (846).

[0157] The input module (850) can receive commands or data to be used in a component of the electronic device (801) (e.g., a processor (820)) from an external source (e.g., a user) of the electronic device (801). The input module (850) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0158] The audio output module (855) can output audio signals to the outside of the electronic device (801). The audio output module (855) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0159] The display module (860) can visually provide information to an external party (e.g., a user) of the electronic device (801). The display module (860) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (860) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0160] The audio module (870) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (870) can acquire sound through the input module (850), output sound through the sound output module (855), or an external electronic device (e.g., electronic device (802)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (801).

[0161] The sensor module (876) can detect the operating status (e.g., power or temperature) of the electronic device (801) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (876) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0162] The interface (877) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (801) with an external electronic device (e.g., the electronic device (802)). In one embodiment, the interface (877) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0163] The connection terminal (878) may include a connector through which the electronic device (801) may be physically connected to an external electronic device (e.g., the electronic device (802)). In one embodiment, the connection terminal (878) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0164] The haptic module (879) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (879) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0165] The camera module (880) can capture still images and videos. According to one embodiment, the camera module (880) may include one or more lenses, image sensors, image signal processors, or flashes.

[0166] The power management module (888) can manage the power supplied to the electronic device (801). According to one embodiment, the power management module (888) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0167] A battery (889) may power at least one component of the electronic device (801). In one embodiment, the battery (889) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0168] The communication module (890) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (801) and an external electronic device (e.g., electronic device (802), electronic device (804), or server (808)), and the performance of communication through the established communication channel. The communication module (890) may operate independently from the processor (820) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (890) may include a wireless communication module (892) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (894) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (804) via a first network (898) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (899) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (892) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (896) to verify or authenticate the electronic device (801) within a communication network such as the first network (898) or the second network (899).

[0169] The wireless communication module (892) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (892) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (892) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (892) may support various requirements specified in the electronic device (801), an external electronic device (e.g., the electronic device (804)), or a network system (e.g., the second network (899)). According to one embodiment, the wireless communication module (892) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0170] The antenna module (897) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (897) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (897) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (898) or the second network (899), may be selected from the plurality of antennas by, for example, the communication module (890). A signal or power may be transmitted or received between the communication module (890) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (897).

[0171] According to various embodiments, the antenna module (897) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0172] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0173] According to one embodiment, commands or data may be transmitted or received between the electronic device (801) and an external electronic device (804) via a server (808) connected to a second network (899). Each of the external electronic devices (802 or 804) may be the same or a different type of device as the electronic device (801). According to one embodiment, all or part of the operations executed in the electronic device (801) may be executed in one or more of the external electronic devices (802, 804, or 808). For example, when the electronic device (801) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (801) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (801). The electronic device (801) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (801) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (804) may include an Internet of Things (IoT) device. The server (808) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (804) or the server (808) may be included in the second network (899).The electronic device (801) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0174] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0175] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0176] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0177] Various embodiments of the present document may be implemented as software (e.g., a program (840)) including one or more instructions stored in a storage medium (e.g., an internal memory (836) or an external memory (838)) readable by a machine (e.g., an electronic device (801)). For example, a processor (e.g., a processor (820)) of the machine (e.g., an electronic device (801)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0178] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0179] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, speaker; A printed circuit board comprising an opening portion for accommodating the speaker; Electronic components on the printed circuit board, positioned adjacent to the speaker; At least one element disposed on the printed circuit board; and A case comprising a case that surrounds the rear of the speaker and is placed on the printed circuit board, The above printed circuit board, A conductive pad arranged along the periphery of the opening portion of the printed circuit board and coupled to the case, and Containing conductive patterns spaced apart from the conductive pad of the printed circuit board and arranged on a layer of the printed circuit board on which the conductive pad is arranged, At least one of the above elements, For the above case to function as a ground, connecting the above conductive patterns and the above conductive pad, Electronic devices.

2. In paragraph 1, The above speaker, It is configured to provide an audio signal to the outside of the electronic device through an acoustic duct located at the front of the speaker, The above case is, Providing a resonant space for the above audio signal, Electronic devices.

3. In paragraph 1 or 2, The above printed circuit board, a substrate comprising a plurality of non-conductive layers, and comprising different conductive patterns arranged on each of the plurality of non-conductive layers; Electronic devices.

4. In paragraph 3, The above conductive pad is, Among the plurality of non-conductive layers, the non-conductive layer closest to the rear of the speaker is disposed on the Electronic devices.

5. In paragraph 3 or 4, The other above challenging patterns are: Among the above plurality of non-conductive layers, each of the remaining non-conductive layers except the non-conductive layer closest to the rear of the speaker is disposed, Electronic devices.

6. In any one of paragraphs 3 to 5, The other above challenging patterns are: Connected to each other through conductive vias penetrating the above-described plurality of non-conductive layers and spaced apart from the conductive pad, Electronic devices.

7. In any one of paragraphs 1 to 6, Further comprising a camera connected to the printed circuit board, The above speaker, A receiver that transmits audio signals received through communication with an external electronic device, and is placed adjacent to the camera. Electronic devices.

8. In any one of paragraphs 1 to 7, A portion of the side of the above-mentioned conductive pad, Wrapped with a conductive thin film, Electronic devices.

9. In any one of paragraphs 1 to 8, The above printed circuit board, comprising reinforcing patterns connected to the conductive pad through a conductive via and arranged within the printed circuit board; Each of the above reinforcement patterns, Away from the above challenging patterns, Electronic devices.

10. In any one of paragraphs 1 to 9, further comprising at least one processor disposed on the printed circuit board and operatively connected to the speaker; Electronic devices.

11. In any one of paragraphs 1 to 10, Including more housing, The above housing, A support portion including an acoustic duct disposed within the housing and connected to an audio hole defined by a side surface of the housing, The above speaker, Placed on the support portion within the above housing Electronic devices.

12. In any one of paragraphs 1 to 11, The above case is, configured to reduce the current transmitted from the conductive patterns so as to limit the generation of a magnetic field by the current flowing along the case. Electronic devices.

13. In any one of paragraphs 1 to 12, The above printed circuit board, A portion disposed next to the opening portion and including a portion from which the conductive patterns are excluded, Electronic devices.

14. In paragraph 13, The above challenging patterns are: In the above part of the above printed circuit board, which are disconnected from each other, Electronic devices.

15. In any one of paragraphs 1 to 14, wireless communication circuit; An antenna electrically connected to the wireless communication circuit; and Including more batteries, The above battery, Through the conductive patterns of the printed circuit board, it is electrically connected to the power amplifier circuit of the wireless communication circuit, The above antenna, Positioned so as to face the side wall of the electronic device, Electronic devices.

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