Hot and cold stamping foils and method for producing the same

Abstract

20 26 20 08 63 06 F eb 2 02 6 A B S T R A C T 2 0 2 6 2 0 0 8 6 3 0 6 F e b 2 0 2 6 210210 220220 230230 240240 200200 250250 2 / 6 FIG. 2A 210210 220220 230230 240240 250250 FIG. 2B 260260 235235 235235235 220 210 FIG. 2A 235 220 210 20 26 20 08 63 06 F eb 2 02 6 2 / 6 2 0 2 6 2 0 0 8 6 3 0 6 F e b 2 0 2 6 F I G . 2 A 2 4 0 2 3 5 2 2 0 2 1 0

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of and priority to U.S. Provisional Application No. 63 / 757,706 filed February 12, 2025 for HOT AND COLD STAMPING FOILS AND METHOD FOR PRODUCING THE SAME, the entire contents of which are incorporated by herein by reference. FIELD

[0002] The present disclosure relates generally to hot and cold stamping foils and a method of producing hot and cold stamping foils. BACKGROUND

[0003] Stamping foils may be used in stripes, patches and labels that may be applied to physical objects. The stamping foils may be utilized as, for example, anticounterfeiting features for secure documents such as banknotes, credit cards, tax stamps, and passports, or as decorative features to consumer products such as packaging, book covers, business cards, and cosmetic containers.

[0004] Stamping foils are generally produced using a dry printing method that applies a metallic or pigmented finish in a visible layer on a substrate. The visible layer may, for example, contain a colour ink, a thin-film of metal such as aluminum, an optical structure such as a lens, diffraction grating, micro-mirrors, or any other layer to provide a visual cue to the user. Typically, an adhesive layer is provided over the visible layer to bond the foil to a target surface, and a release layer, typically formed of wax or silicone, is applied between the visible layer and the substrate to facilitate the foil detaching cleanly from the substrate when the foil is applied to the target surface, leaving the release layer material on the substrate. 2026200863   06 Feb 2026

[0005] In hot stamping, the foil is applied to the target surface, which may be, for example, paper, plastic, leather, or textile, utilizing a combination of heat to activate the resin, pressure, and a die, or stamp, to transfer the foil from the substrate onto the target material. Cold stamping is similar to hot stamping except that the adhesive layer and / or the release layer are not heat activated. For example, the adhesive layer may be activated utilizing, for example, ultra-violet (UV) radiation or pressure only, and the release layer may be activated utilizing, for example, pressure only.

[0006] A problem with traditional stamping foils is that the release layer may prematurely detach from the substrate during foil production, resulting in blank areas where the visible layer should be.

[0007] Improvements to stamping foils are desired. [0007a] A reference herein to a patent document or any other matter identified as prior art, is not to be taken as an admission that the document or other matter was known or that the information it contains was part of the common general knowledge as at the priority date of any of the claims. SUMMARY

[0008] Generally, the present disclosure provides a stamping foil for hot or cold stamping and a method for producing the same. The stamping foil according to embodiments of the present disclosure typically does not include a release layer, but rather can include a first resin layer between a substrate and an embossing layer that is imprinted or embossed with physical structures. When the stamping foil is applied to a target surface utilizing, for example a hot or cold stamping process, the first resin layer detaches from the substrate, together with the embossing layer, a reflective layer, and an adhesive layer. As used herein, resin is intended to broadly include conventional resin materials (such as epoxy resin, polyester resin, polyurethane resin, UV resin, acrylic resin, and silicone resin), lacquer materials, or other substance with similar / compatible 2026200863   06 Feb 2026 properties (e.g. as described herein and / or understood by a person of skill based on the disclosure herein).

[0009] In a first aspect, the present disclosure provides a method for producing a stamping foil, the method including depositing a first resin material to a surface of a substrate to form a first resin layer on the surface of the substrate, curing the first resin material of the first resin layer, depositing a second resin material on a surface of the cured first resin layer to form an embossing layer, forming (e.g. imprinting) one or more physical structures onto a surface of the second resin material of the embossing layer, curing the second resin material of the embossing layer, depositing a reflective material on the surface of the embossing layer to form a reflective layer, and depositing an adhesive material on the reflective layer to form an adhesive layer.

[0010] In a further embodiment, the first resin layer and / or the embossing layer comprises a flood layer.

[0011] In a further embodiment, the first resin layer and / or the embossing layer comprises a discrete printed layer.

[0012] In a further embodiment, the first resin layer is not a conventional release layer and / or the stamping foil does not include a conventional release layer.

[0013] In a further embodiment, the first resin layer is configured to act as a foundation for the subsequently deposited embossing layer and is configured to release / detach (e.g. break cleanly) from the substrate when the stamping foil is applied to a target material (e.g. by hot or cold stamping).

[0014] In a further embodiment, the embossing layer is configured to adhere to the first resin layer sufficiently to substantially prevent and / or significantly reduce dropout formation. 2026200863   06 Feb 2026

[0015] In a further embodiment, the adhesive layer and the first resin layer are configured so that a heat and / or pressure and / or UV level (e.g. applied during hot or cold stamping) activates bonding of the adhesive layer to the (e.g. target) material and results in detachment / release of the first resin layer from the substrate (e.g. the same heat and / or pressure and / or UV that bonds the adhesive layer to the target material also acts to detach / release the first resin layer from the substrate during hot or cold stamping, and / or the hot or cold stamping process simultaneously causes bonding of the adhesive to the target material and detachment of the first resin layer from the substrate).

[0016] A further embodiment also comprises selecting the first resin material and the adhesive material so that the same heat and / or pressure level for effective bonding of the adhesive material of the adhesive layer to the target material also is effective to detach / release the first resin material of the first resin layer from the substrate (e.g. during hot or cold stamping).

[0017] In a further embodiment, the first resin layer covers / encapsulates / protects the embossing layer after the stamping foil is transferred to a target material by hot or cold stamping (e.g. the first resin layer is configured to detach cleanly from the substrate when the stamping foil is applied to a target material by hot or cold stamping, thereby protectively covering the embossing layer after the stamping foil is applied to the target material by hot or cold stamping).

[0018] In a further embodiment, the method further includes, prior to depositing the first resin material, performing a surface treatment to the surface of the substrate to provide a predetermined surface energy at the surface of the substrate prior to deposition.

[0019] In a further embodiment, the predetermined surface energy at the surface of the substrate is between about 30 and about 55 dynes / cm.

[0020] In a further embodiment, the surface treatment is a corona treatment, or a plasma treatment, or both a corona treatment and a plasma treatment. 2026200863   06 Feb 2026

[0021] In a further embodiment, the first resin material is the same as the second resin material.

[0022] In a further embodiment, the first resin material is different than the second resin material.

[0023] In a further embodiment, depositing a first resin material comprising maintaining an environment in which the first resin material is deposited at a temperature of between about 285 degrees Kelvin and about 298 degrees Kelvin.

[0024] In a further embodiment, the first resin layer has a thickness between about 1 um and about 20 um.

[0025] In a further embodiment, one or both of the first resin material and the second resin material are an ultra-violet (UV) curable resin, and curing the one or both of the first and second resin material comprising irradiating with UV radiation.

[0026] In a further embodiment, the ultra-violet (UV) curable resin is an acrylate base composition.

[0027] In a further embodiment, one or both of the first resin material and the second resin material are an epoxy resin (e.g. which may not be UV curable and / or which may cure / solidify due to chemical reaction).

[0028] In a further embodiment, the physical structures formed (e.g. imprinted) on the surface of the embossing layer comprise one or more of: microstructures, nanostructures, diffraction gratings, plasmonic structures, metamaterial structures, photonic crystal structures, and / or lens structures.

[0029] In further aspect, the present disclosure provides a stamping foil including a substrate, a first resin layer formed on a surface of a substrate and comprised of a first resin material, an embossing layer formed on a surface of the first resin layer, the embossing layer comprising a second resin material and having physical structures formed (e.g. imprinted) onto a surface of the embossing layer, a reflective layer formed on the surface of the embossing layer, the reflective 2026200863   06 Feb 2026 layer comprising a reflective material, and an adhesive layer formed on a surface of the reflective layer, the adhesive layer formed of an adhesive material.

[0030] In a further embodiment, the first resin layer and / or the embossing layer comprises a flood layer.

[0031] In a further embodiment, the first resin layer and / or the embossing layer comprises a discrete printed layer.

[0032] In a further embodiment, the first resin layer is not a conventional release layer and / or the stamping foil does not include a conventional release layer.

[0033] In a further embodiment, the first release layer is configured to act as a foundation for the subsequently deposited embossing layer and is configured to release / detach (e.g. break cleanly) from the substrate when the stamping foil is applied to a target material (e.g. by hot or cold stamping).

[0034] In a further embodiment, the adhesive layer and the first resin layer are configured so that hot or cold stamping of the stamping foil simultaneously causes bonding of the adhesive to a target material and detachment of the first resin layer from the substrate.

[0035] In a further embodiment, the embossing layer is configured to adhere to the first resin layer sufficiently to substantially prevent and / or significantly reduce dropout formation.

[0036] In a further embodiment, the adhesive layer and the first resin layer are configured so that a heat and / or pressure level (e.g. applied during hot or cold stamping) activates bonding of the adhesive layer to the (e.g. target) material and results in detachment / release of the first resin layer from the substrate (e.g. the same heat and / or pressure that bonds the adhesive layer to the target material also acts to detach / release the first resin layer from the substrate during hot or cold stamping). 2026200863   06 Feb 2026

[0037] In a further embodiment, the first resin layer is configured to cover, encapsulate, and / or protect the embossing layer after the stamping foil is transferred to a target material by hot or cold stamping (e.g. the first resin layer is configured to detach cleanly from the substrate when the stamping foil is applied to a target material by hot or cold stamping, thereby protectively covering the embossing layer after the stamping foil is applied to the target material by hot or cold stamping).

[0038] In a further embodiment, the first resin material is the same as the second resin material.

[0039] In a further embodiment, the first resin material is different than the second resin material.

[0040] In a further embodiment, the first resin layer has a thickness between about 1 um and about 20 um.

[0041] In a further embodiment, one or both of the first resin material and the second resin material are an ultra-violet (UV) curable resin.

[0042] In a further embodiment, one or both of the first resin material and the second resin material are an epoxy resin (e.g. which may not be UV curable and / or which may cure / solidify due to chemical reaction).

[0043] In a further embodiment, the physical structures formed (e.g. imprinted) on the surface of the embossing layer comprise one or more of: microstructures, nanostructures, diffraction gratings, plasmonic structures, metamaterial structures, photonic crystal structures, and / or lens structures.

[0044] In a further aspect, the present disclosure provides a stamping foil prepared according to the process including depositing a first resin material to a surface of a substrate to form a first resin layer on the surface of the substrate, curing the first resin material of the first resin layer, depositing a second resin material on a surface of the cured first resin layer to form an embossing layer, forming (e.g. imprinting) one or more physical structures onto a surface of the second resin 2026200863   06 Feb 2026 material of the embossing layer, curing the second resin material of the embossing layer, deposit a reflective material on the surface of the embossing layer to form a reflective layer, and depositing an adhesive material on the reflective layer to form an adhesive layer.

[0045] In a further embodiment, the first resin layer and / or the embossing layer comprises a flood layer.

[0046] In a further embodiment, the first resin layer and / or the embossing layer comprises a discrete printed layer.

[0047] In a further embodiment, the first resin layer is not a conventional release layer and / or the stamping foil does not include a conventional release layer.

[0048] In a further embodiment, the first release layer is configured to act as a foundation for the subsequently deposited embossing layer and is configured to release / detach (e.g. break cleanly) from the substrate when the stamping foil is applied to a target material (e.g. by hot or cold stamping).

[0049] In a further embodiment, hot or cold stamping of the stamping foil to a target material simultaneously causes bonding of the adhesive to the target material and detachment of the first resin layer from the substrate.

[0050] In a further embodiment, the embossing layer is configured to adhere to the first resin layer sufficiently to substantially prevent and / or significantly reduce dropout formation.

[0051] In a further embodiment, the adhesive layer and the first resin layer are configured so that a heat and / or pressure level (e.g. applied during hot or cold stamping) activates bonding of the adhesive layer to the (e.g. target) material and results in detachment / release of the first resin layer from the substrate (e.g. the same heat and / or pressure that bonds the adhesive layer to the target 2026200863   06 Feb 2026 material also acts to detach / release the first resin layer from the substrate during hot or cold stamping).

[0052] A further embodiment also comprises selecting the first resin material and the adhesive material so that the same heat and / or pressure level for effective bonding of the adhesive material of the adhesive layer to the target material also is effective to detach / release the first resin material of the first resin layer from the substrate (e.g. during hot or cold stamping).

[0053] In a further embodiment, the first resin layer covers / encapsulates / protects the embossing layer after the stamping foil is transferred to a target material by hot or cold stamping (e.g. the first resin layer is configured to detach cleanly from the substrate when the stamping foil is applied to a target material by hot or cold stamping, thereby protectively covering the embossing layer after the stamping foil is applied to the target material by hot or cold stamping).

[0054] In a further embodiment, the method further includes, prior to depositing the first resin material, performing a surface treatment to the surface of the substrate to provide a predetermined surface energy at the surface of the substrate prior to deposition.

[0055] In a further embodiment, the predetermined surface energy at the surface of the substrate is between about 30 and about 55 dynes / cm.

[0056] In a further embodiment, the surface treatment is a corona treatment, or a plasma treatment, or both a corona treatment and a plasma treatment.

[0057] In a further embodiment, the first resin material is the same as the second resin material.

[0058] In a further embodiment, the first resin material is different than the second resin material.

[0059] In a further embodiment, the first resin layer has a thickness between about 1 um and about 20 um. 2026200863   06 Feb 2026

[0060] In a further embodiment, one or both of the first resin material and the second resin material are an ultra-violet (UV) curable resin, and curing the one or both of the first and second resin material comprising irradiating with UV radiation.

[0061] In a further embodiment, the ultra-violet (UV) curable resin is an acrylate base composition.

[0062] In a further embodiment, one or both of the first resin material and the second resin material are an epoxy resin (e.g. which may not be UV curable and / or which may cure / solidify due to chemical reaction).

[0063] In a further embodiment, the physical structures formed (e.g. imprinted) on the surface of the embossing layer comprise one or more of: microstructures, nanostructures, diffraction gratings, plasmonic structures, metamaterial structures, photonic crystal structures, and / or lens structures.

[0064] In a further aspect, the present disclosure provides a use of a stamping foil (e.g. including a substrate, a first resin layer formed on a surface of a substrate and comprised of a first resin material, an embossing layer formed on a surface of the first resin layer, the embossing layer comprising a second resin material and having physical structures formed (e.g. imprinted) onto a surface of the embossing layer, a reflective layer formed on the surface of the embossing layer, the reflective layer comprising a reflective material, and an adhesive layer formed on a surface of the reflective layer, the adhesive layer formed of an adhesive material) in a cold stamping process or hot stamping process to transfer the first resin layer, the embossing layer, the reflective layer, and the adhesive layer to a (e.g. target) material.

[0065] In a further embodiment, the first resin layer and / or the embossing layer comprises a flood layer. 2026200863   06 Feb 2026

[0066] In a further embodiment, the first resin layer and / or the embossing layer comprises a discrete printed layer.

[0067] In a further embodiment, the first resin layer is not a conventional release layer and / or the stamping foil does not include a conventional release layer.

[0068] In a further embodiment, the first release layer is configured to act as a foundation for the subsequently deposited embossing layer and is configured to release (e.g. break cleanly) from the substrate when the stamping foil is applied to a target material (e.g. by hot or cold stamping).

[0069] In a further embodiment, hot or cold stamping of the stamping foil to a target material simultaneously causes bonding of the adhesive to the target material and detachment of the first resin layer from the substrate.

[0070] In a further embodiment, the embossing layer is configured to adhere to the first resin layer sufficiently to substantially prevent and / or significantly reduce dropout formation.

[0071] In a further embodiment, the adhesive layer and the first resin layer are configured so that a heat and / or pressure level (e.g. applied during hot or cold stamping) activates bonding of the adhesive layer to the (e.g. target) material and results in detachment / release of the first resin layer from the substrate (e.g. the same heat and / or pressure that bonds the adhesive layer to the target material also acts to detach / release the first resin layer from the substrate during hot or cold stamping).

[0072] In a further embodiment, substantially none of the first resin layer (e.g. the first resin material) is left on the substrate after transfer to the (e.g. target) material and / or substantially all of the first resin layer (e.g. first resin material) is transferred to the (e.g. target) material. 2026200863   06 Feb 2026

[0073] In a further embodiment, wherein the first resin layer covers, encapsulates, and / or protects the embossing layer after the stamping foil is transferred to a target material by hot or cold stamping.

[0074] In a further embodiment, the adhesive layer bonds the reflective layer, the embossing layer, and the first resin layer to the (e.g. target) material after transfer.

[0075] In a further embodiment, the first resin material is the same as the second resin material.

[0076] In a further embodiment, the first resin material is different than the second resin material.

[0077] In a further embodiment, the first resin layer has a thickness between about 1 um and about 20 um.

[0078] In a further embodiment, one or both of the first resin material and the second resin material are an ultra-violet (UV) curable resin.

[0079] In a further embodiment, one or both of the first resin material and the second resin material are an epoxy resin (e.g. which may not be UV curable and / or which may cure / solidify due to chemical reaction).

[0080] In a further embodiment, the physical structures formed (e.g. imprinted) on the surface of the embossing layer comprise one or more of: microstructures, nanostructures, diffraction gratings, plasmonic structures, metamaterial structures, photonic crystal structures, and / or lens structures.

[0081] The above summary provides a basic understanding of some aspects of the present disclosure. This summary is not an extensive overview of the present disclosure, nor is it intended to be used to limit the scope of the present disclosure. Other aspects and features of the present disclosure will become apparent to those of ordinary skill in the art upon review of the following description of example implementations in conjunction with the accompanying figures. 2026200863   06 Feb 2026 [0081a] In a further aspect, the present disclosure provides a method for producing a stamping foil, the method comprising: depositing a first resin material to a surface of a substrate to form a first resin layer on the surface of the substrate; curing the first resin material of the first resin layer; depositing a second resin material on a surface of the cured first resin layer to form an embossing layer; forming one or more physical structures onto a surface of the second resin material of the embossing layer; curing the second resin material of the embossing layer; depositing a reflective material on the surface of the embossing layer to form a reflective layer; and depositing an adhesive material on the reflective layer to form an adhesive layer; wherein the first resin layer is configured to act as a foundation for the subsequently deposited embossing layer and is configured to detach cleanly from the substrate when the stamping foil is applied to a target material by hot or cold stamping, thereby protectively covering the embossing layer after the stamping foil is applied to the target material by hot or cold stamping. BRIEF DESCRIPTION OF THE DRAWINGS

[0082] Reference will now be made, by way of example, to the accompanying drawings which show example implementations of the present application, and in which:

[0083] FIGs. 1A and 1B are schematic cross-sectional diagrams of a conventional stamping foil;

[0084] FIGs. 2A and 2B are schematic cross-sectional diagrams of a stamping foil in accordance with an embodiment of the present disclosure;

[0085] FIGS. 2C and 2D are schematic cross-sectional diagrams of a stamping foil in accordance with another embodiment of the present disclosure;

[0086] FIG. 2E is a schematic exploded isometric view of exemplary layers of a stamping foil in accordance with an embodiment of the present disclosure (e.g. similar to FIGS. 2A-B); and 2026200863   06 Feb 2026

[0087] FIG. 3 is a flow diagram of a method of producing a stamping foil in accordance with an embodiment of the present disclosure.

[0088] Similar reference numerals may have been used in different figures to denote similar components. Unless otherwise specifically noted, articles depicted in the drawings are not necessarily drawn to scale. DETAILED DESCRIPTION

[0089] The subject matter is described herein with reference to the accompanying drawings, in which example implementations are shown. However, many different example implementations may be used, and thus the description should not be construed as limited to the embodiments set forth herein. Rather, these example implementations are provided so that this application will be thorough and complete. Wherever possible, the same reference numbers are used in the drawings and the following description to refer to the same elements, and prime notation is used to indicate similar elements, operations or steps in alternative example implementations. Separate boxes or illustrated separation of logical elements of illustrated systems and devices does not necessarily require physical separation of such logical elements, as communication between such logical elements may occur by way of messaging, function calls, shared memory space, and so on, without any such physical separation. As such, logical elements need not be implemented in physically or logically separated platforms, although such logical elements are illustrated separately for ease of explanation herein. Different devices may have different designs, such that although some devices implement some logical elements in hardware, other devices may implement such logical elements in a programmable processor with code obtained from a machine-readable medium. Lastly, elements referred to in the singular may be plural and vice versa, except wherein indicated otherwise either explicitly or inherently by context. 2026200863   06 Feb 2026

[0090] References in the present disclosure to "one implementation," "an implementation," "an example implementation," and the like indicate that the implementation described may include a particular feature, structure, or characteristic, but it is not necessary that every implementation includes the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same implementation. Further, when a particular feature, structure, or characteristic is described in connection with an implementation, it is submitted that it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other implementations whether or not explicitly described.

[0091] Referring now to FIG. 1A, a conventional stamping foil 100 that is produced using conventional methods is shown. The stamping foil 100 includes a substrate 110, a release layer 120 formed on the substrate 110, an embossing layer 130 formed on the release layer 120, a visible layer 140 formed on the embossing layer, and an adhesive layer 150 formed on the visible layer 140.

[0092] The embossing layer 130 may be formed of a resin or lacquer material. The visible layer 140 may be formed of pigment or a reflective material, such as a deposited layer of a metallic or a dielectric material.

[0093] Conventionally, the release layer 120 may be formed of silicone-based compounds or waxbased formulations, depending on the specific application and required release characteristics. The release layer 120 is included to facilitate the functional layers, i.e., the embossing layer 130, the visible layer 140, and the adhesive layer 150, detaching smoothly from the substrate 110 when heat and / or pressure are applied during a hot or cold stamping process.

[0094] FIG. 1B shows the stamping foil of FIG. 1A after application to a target material 160. When heat and / or pressure are applied during the hot or cold stamping process, the release layer 120 2026200863   06 Feb 2026 softens, allowing the functional layers, i.e., the embossing layer 130, the visible layer 140, and the adhesive layer 150 to detach from the substrate 110 (and the release layer 120), while the adhesive layer 150 adheres to the surface of the target material 160, bonding the functional layers to the target material 160. Once the foil has transferred onto the target material 160, the release layer 120, ideally, completely remains on the discarded substrate 110, inhibiting unwanted adhesion of any material from the release layer 120 or the substrate 110 on the functional layers that are transferred onto the target material 160.

[0095] The release layer 120 in hot and cold stamping foils has traditionally been considered a crucial component that is required for the functional layers to cleanly separate from the substrate 110 and transfer onto the target material 160 during stamping.

[0096] A problem with traditional stamping foils, such as the stamping foil 100 shown in FIG. 1A and described previously, is that the release layer 120, which is first deposited on the substrate, may premature detach during production of the subsequent layers, such as the embossing layer 130, which may lead to blank areas where the embossing layer is missing, which may be referred to as “dropouts”.

[0097] The problem of dropouts caused by the release layer may be particularly problematic with stamping foils that are holographic or optically variable device (OVD) foils in which physical structures are imprinted or embossed on the embossing layer after it is deposited, then reflective layer is deposited over the physical structures that reflect and / or diffract light to create a three dimensional (3D) and / or rainbow effect when the foil is viewed from different angles.

[0098] The physical structures may be any structures that alters the behavior and properties of the light that is reflected, transmitted, absorbed, or scattered from the surface on which the physical structures are provided, and may include, for example, microstructures, nanostructures, diffraction 2026200863   06 Feb 2026 gratings, plasmonic structures, metamaterial structures, photonic crystal structures, lens structures, or any combination thereof.

[0099] Physical structures are typically formed by imprinting or embossing the physical structures onto a surface of the embossing layer 130 using a mold, a stamp, or a shim that includes the physical structures.

[00100] However, due to wettability between the release layer 120 and the substrate 110 and the tendency of the release layer 120 to premature release from the substrate 110, dropouts may be commonly formed during the imprinting or embossing process of forming an OVD stamping foil.

[00101] Referring now to FIG. 2A, a schematic diagram of an OVD stamping foil 200 is shown that does not include a release layer, but rather includes a first resin layer (e.g. a break layer configured to cleanly break away from the substrate during hot or cold stamping) of a resin material between an embossing layer and the substrate that acts as a foundation layer for the subsequently deposited embossing layer and releases from the substrate when the foil is applied to a target material (e.g. with the first resin layer remaining attached to the embossing layer after the stamping foil 200 is attached to the target material / layer by the hot or cold stamping process), forming a protective layer for the applied foil.

[00102] Typically, the first resin layer is configured so that it cleanly releases from the substrate during the hot or cold stamping process, for example with substantially all of the first resin layer (e.g. substantially all of the first resin material) remaining attached (e.g. bonded) to the embossing layer and / or with substantially none of the first resin layer (e.g. substantially none of the first resin material) remaining attached to the substrate after hot or cold stamping.

[00103] In FIG. 2A, the stamping foil 200 includes a substrate 210. The substrate may be formed of any suitable material. In an example, the substrate is polyethylene terephthalate (PET). Other 2026200863   06 Feb 2026 example materials for the substrate 110 include polycarbonate, nylon, polyethylene naphthalate (PEN), biaxially-oriented polypropylene (BOPP), and biaxially oriented polyethylene terephthalate (BOPET).

[00104] A first resin layer 220 of a first resin material is deposited on a surface of the substrate. The first resin layer 220 may be formed of any suitable resin material, and may, for example, be formed of an ultra-violet (UV) curable resin material such as, for example a polymer composed of an acrylate base. In embodiments, the first release layer 220 can be configured to act as a foundation for the subsequently deposited embossing layer 230 and is configured to release (e.g. break cleanly) from the substrate 210 when the stamping foil 200 is applied to a target material (e.g. by hot or cold stamping).

[00105] In some embodiments, as shown in FIG. 2A-2B, the first resin layer 220 may comprise a flood layer (e.g. a flood coated layer), for example covering substantially the entire coated surface of the substrate 210 (e.g. as a continuous film and / or unpatterned layer over substantially the entire surface of the substrate) and / or extending substantially edge-to-edge on the coated surface of the substrate and / or extending across both feature and non-feature regions of the coated surface of the substrate and / or configured to release from the substrate as a whole. For example, a thickness of the first resin layer 220 can be chosen to be thick enough to fully wet the surface of the substrate 210 to facilitate forming a uniform layer (e.g. a flood layer) over the surface of the substrate 210, but thin enough that the first resin layer 220 breaks cleanly from the substrate 210 when the stamping foil 200 is applied to a target material. In some embodiments, the flood coat / layer can be deposited onto the substrate 210 using a roller (e.g. which may have a substantially uniform roller surface) configured to evenly and / or uniformly cover / coat the entire surface of the substrate 210 (e.g. with the first resin material). In other embodiments, the first resin layer 220 may not be 2026200863   06 Feb 2026 a flood layer, but for example can be a discrete printed layer (e.g. as will be discussed below in more detail).

[00106] The temperature at which the first resin layer 220 is deposited may be within a predetermined temperature or temperature range. The predetermined temperature or temperature range may depend on the materials that are utilized for the substrate 210 and the first resin layer 220 and may be determined to facilitate a suitable bonding between the first resin layer and the substrate. In some implementations, the temperature of the environment in which the first resin layer is deposited may be maintained at a temperature between about 285 degrees Kelvin and about 298 degrees Kelvin. The thickness of the first resin layer 220 may be dependent on the resin material utilized for forming the first layer 220. In some implementations, a thickness of the first resin layer 220 is in a range of about 1 um to about 20 um thick.

[00107] An embossing layer 230 (e.g. a second resin layer, which can serve as a structure formation layer or casting layer) is formed on the first resin layer 220 in FIG. 2A. Typically, the embossing layer 230 is configured to adhere to the first resin layer 220 sufficiently to substantially prevent and / or significantly reduce dropout formation. The embossing layer 230 includes physical structures 235 that may be formed in a surface of the embossing layer 230, for example during an embossing process. The physical structures 235 may be formed utilizing, for example, a mold, a stamp, or a shim to form the physical structures prior to curing the resin of the embossing layer 230. In alternate embodiments, the physical structures 235 can be formed using printing techniques. As described previously, the physical structures 235 may be any structures that alters the behavior and properties of the light, which may include UV, visible, or infrared light, that is reflected, transmitted, absorbed, or scattered from the surface on which the physical structures are provided, and may include, for example, microstructures, nanostructures, diffraction gratings, 2026200863   06 Feb 2026 plasmonic structures, metamaterial structures, photonic crystal structures, lens structures, or any combination thereof.

[00108] The embossing layer 230 may be formed of any suitable resin material, and may, for example, be formed of an ultra-violet (UV) curable resin material such as, for example, co-polymer acrylate. In some implementations, the embossing material 230 may be formed of the same resin material as the first resin layer 220, which may result in the first resin layer and the embossing layer being indistinguishable in the finished stamping foil 200. In other implementations, the embossing layer 230 may be formed of a different (e.g. second) resin material than the resin material of the first resin layer 220 provided that the resin material of the embossing layer 230 adheres to the resin material of the first resin layer 220 during the embossing process to form the physical structures 235 in order to inhibit dropouts forming in the embossing layer 230.

[00109] In FIG. 2A, a reflective layer 240 is deposited over the physical structures 235 of the embossing layer 230. The reflective layer 240 may be formed of any suitable material. In some implementations, the reflective layer 240 may be a thin film of a material having a high refractive index, such as, for example, TiO2 or Nb2O5 and having a thickness in the range of, for example, approximately 50 nm to approximately 400 nm thick. In another example, the reflective layer may be a thin film of a metal, such as for example Al, Ag, Au, Cu, Ni, Cr, having a thickness, for example, in the range approximately 15 nm to approximately 100 nm thick.

[00110] While not shown here, in some embodiments, a tie-in layer can be disposed between the reflective layer 240 and the embossing layer 230, and may be configured to aid in adhesion of the reflective layer 240 to the embossing layer 230. For example, the tie-in layer can include an adhesive or adhesive layer (e.g. similar to adhesive layer 250, discussed in more detail below), a deposited layer of thin transparent film (e.g. SiO2), or another material coated / deposited on the 2026200863   06 Feb 2026 surface of the embossing layer 230 which promotes the adhesion of the reflective layer 240 to the embossing layer 230.

[00111] In FIG. 2A, an adhesive layer 250 formed of an adhesive material is deposited over the reflective layer 240. The adhesive material forming the adhesive layer 250 may be any suitable adhesive (e.g. for effective hot or cold stamping). The adhesive material may be, for example, a heat activated adhesive if the stamping foil 200 is to be used in a hot stamping process, or a UV and / or pressure activated adhesive if the stamping 200 is to be used in a cold stamping process. In embodiments, hot or cold stamping of the stamping foil to a target material simultaneously causes bonding of the adhesive to the target material and detachment of the first resin layer from the substrate. In embodiments, the adhesive layer 250 and the first resin layer 220 can be configured so that a heat and / or pressure level (e.g. applied during hot or cold stamping) activates bonding of the adhesive layer 250 to the (e.g. target) material / surface and results in detachment / release of the first resin layer 220 from the substrate 210. For example, the same heat and / or pressure that bonds the adhesive layer 250 to the target material can also act to detach / release the first resin layer 220 from the substrate 210 during hot or cold stamping).

[00112] The substrate 210 may be formed of a material that chosen to have a desired surface energy, or the substrate 210 material may be treated with a surface energy treatment, such as, for example, a corona or plasma surface treatment, prior to depositing the first resin layer 220 such that a surface of the substrate 210 has the desired surface energy when the first resin layer 220 is deposited. The desired surface energy may be chosen to be high enough to facilitate sufficient adhesion between the first resin layer 220 to the substrate 210 to inhibit the formation of dropouts during the embossing of physical structures onto the embossing layer, while being low enough to facilitate a clean release of the first resin layer 220 from the substrate 210 when the stamping foil 2026200863   06 Feb 2026 200 is applied to a target material. The desired surface energy may depend on the particular materials utilized for the substrate 210 and / or the first resin layer 220. In an example, the desired surface energy for a PET substrate 210 may be between about 30 dynes / cm and about 55 dynes / cm.

[00113] FIG. 2B shows the stamping foil 200 of FIG. 2A after application to a target material 260. When heat and / or pressure are applied during the hot or cold stamping process, the adhesive layer 250 activates, bonding to the surface of the target material 260, and the first resin layer 220 detaches from the substrate 210, such that the functional layers, i.e., the first resin layer 220, the embossing layer 230, the reflective layer 240, and the adhesive layer 250 adhere to the surface of the target material 260 and / or are separate from the substrate 210. When the stamping foil 200 is transferred onto the target material 260, the first resin layer 220 can form a protective layer for the stamping foil 200 (which can be an OVD foil).

[00114] While FIGS. 2A-2B illustrate an exemplary embodiment in which the first resin layer 220 and / or the embossing layer 230 are flood layers, in some embodiments the first resin layer 220 and / or the embossing layer 230 can be discrete printed layers. Discrete printed layers can comprise any layers that are selectively applied to only portions (e.g. predetermined regions) of the coated surface of the substrate 210 (e.g. depositing coating material in a targeted, non-continuous, or pattern-specific manner, for example to the substrate) and / or that comprise spatially separated layer portions, with intervening regions of the substrate substantially uncoated / uncovered, and / or configured so that only specific portions / areas of the stamping foil release from the substrate (e.g. during hot or cold stamping). In some embodiments, discrete printing can be accomplished using an engraved drum or roller configured to pick up resin onto and deposit resin from only portions of its roller / drum surface (e.g. the drum surface may be non-continuous and / or may have a pattern). FIGS. 2C and 2D illustrate another embodiment of a stamping foil 200 illustrating discrete printed 2026200863   06 Feb 2026 layers (e.g. with both the first resin layer 220a and the embossing layer 230a being discrete printed layers). In other aspects, the embodiment of FIGS. 2C-2D can be similar to other disclosed embodiments (such as those illustrated and discussed with respect to FIGS. 2A-2B).

[00115] In FIG. 2C, the first resin layer 220a comprises a discrete printed layer, which is disposed / deposited on the substrate 210. The first resin layer 220a can be formed of first resin material similar to that described in other embodiments. The embossing layer 230a in FIG. 2C can also be a discrete printed layer, for example printed atop the first resin layer 220a. The embossing layer 220a can be formed a second resin material similar to that described in other embodiments. The physical structures 235 can be formed (e.g. embossed, printed, or casted) in the surface of the embossing layer 230a (e.g. the surface opposite the first resin layer 220a), and the reflective layer 240 can be disposed atop the embossing layer 230a. The physical structures 235 and / or the reflective layer 240 can be similar to those disclosed herein.

[00116] While the reflective layer 240 can be discretely printed onto the embossing layer 230a, in FIG. 2C, the reflective layer 240 is disposed atop the entire surface of the stamping foil 200 (e.g. covering both the embossing layer 230a and the substrate 210). For example, the reflective layer 240 can be a flood layer. The adhesive layer 250 can be disposed atop the reflective layer 240. While the adhesive layer 250 can be discretely printed atop the embossing layer 230a (e.g. with the reflective layer disposed therebetween), in FIG. 2C the adhesive layer 250 is disposed atop the entire surface of the stamping foil 200 (e.g. covering both the embossing layer 230a (although with the reflective layer therebetween) and the substrate 210). In embodiments, the adhesive layer 250 can be similar to those disclosed herein. For example, the adhesive layer 250 can be a flood layer.

[00117] FIG. 2D illustrates the stamping foil 200 of FIG. 2C after application to a target material 260. When heat and / or pressure and / or UV are applied during the hot or cold stamping process, 2026200863   06 Feb 2026 the adhesive layer 250 activates, bonding to the surface of the target material 260, and the first resin layer 220a detaches from the substrate 210, such that the functional layers, i.e., the first resin layer 220a, the embossing layer 230a, the reflective layer 240 (e.g. the portion disposed on the embossing layer), and the adhesive layer 250 (e.g. the portion atop the embossing layer) adhere to the surface of the target material 260 and / or are separate from the substrate 210. In the embodiment illustrated in FIG. 2D, only the portion of the adhesive layer 250 and the reflective layer 240 disposed on the discretely printed embossing layer 230a and the discretely printed first resin layer 220a release from the substrate 210 during hot or cold stamping, while other portions may remain fixed to the substrate 210. When the stamping foil 200 is transferred onto the target material 260, the first resin layer 220a can form a protective layer for the stamping foil 200.

[00118] FIG. 2E illustrates another exemplary embodiment of a stamping foil, for example having a substrate 210 which can be formed of PET film, a first resin layer 220 which is a flood coat layer, an embossing layer 230 (which can be a flood layer) which can comprise casting structures (e.g. physical structures 235), a reflective layer 240 which can comprise metal (e.g. deposited on the embossing layer), and an adhesive layer 250. The embodiment illustrated in FIG. 2E can be similar in one or more aspects to FIG. 2A.

[00119] Referring now to FIG. 3, a flowchart illustrating an exemplary method for producing a stamping foil, such as the example stamping foil 200 described previously with reference to FIG. 2A or FIG. 2C, is shown.

[00120] Optionally at 302, a surface treatment is performed to a surface of a substrate to provide a predetermined surface energy at the surface of the substate. As described previously, the predetermined surface energy that results from the surface treatment may be chosen to be high enough to facilitate sufficient adhesion between a deposited first resin layer that is subsequently 2026200863   06 Feb 2026 deposited onto the surface of the substrate to inhibit the formation of dropouts during the embossing of physical structures onto an embossing layer, while being low enough to facilitate a clean release of the first resin layer from the substrate when the stamping foil 200 is applied to a target material. The predetermined surface energy may be determined based on the materials utilized for the substrate and for a subsequently deposited first resin layer. In an example, the predetermined surface energy is between about 30 dynes / cm and about 55 dynes / cm. Any suitable surface treatment may be utilized to provide the predetermined surface energy at the surface of the substrate including, for example, one or both of a corona treatment and a plasma treatment.

[00121] In other implementations, the material for the substrate may inherently have a suitable surface energy, in which implementations a surface treatment at 302 may be skipped. For example, the materials for the substrate and / or the first resin layer may be chosen such the surface energy is within a desired range of surface energies for the substrate and the first resin layer materials, or the material forming the substrate and / or the first resin layer may be engineered such the surface energy is within a desired range of surface energies for the substrate and the first resin layer materials.

[00122] At 304, a first resin material is deposited on a surface of the substrate to form a first resin layer. The first resin material may be any suitable material. In some implementations, the first resin material is a UV-curable resin material. In some embodiments, the first resin layer can be a flood layer, for example covering substantially the entire coated surface of the substrate (e.g. as a continuous film and / or unpatterned layer over substantially the entire surface of the substrate) and / or extending substantially edge-to-edge on the coated surface of the substrate and / or extending across both feature and non-feature regions of the coated surface of the substrate and / or configured to release from the substrate as a whole. For example, depositing the first resin material on the 2026200863   06 Feb 2026 substrate to form the first resin layer can comprise depositing the first resin material onto the substrate using a roller (e.g. which may have a substantially uniform roller surface) configured to evenly and / or uniformly cover / coat the entire surface of the substrate with the first resin material.

[00123] In other embodiments, the first resin layer can be a discrete printed layer, for example a layer that is selectively applied to only portions (e.g. predetermined regions) of the coated surface of the substrate (e.g. depositing coating material in a targeted, non-continuous, or pattern-specific manner, for example to the substrate) and / or that comprise spatially separated layer portions, with intervening regions of the substrate substantially uncoated / uncovered, and / or configured so that only specific portions / areas of the stamping foil release from the substrate (e.g. during hot or cold stamping). For example, depositing the first resin material on the substrate to form the first resin layer can comprise discretely printing the first resin material onto the surface using an engraved drum or roller configured to pick up the resin onto and deposit the resin from only portions of its roller / drum surface (e.g. the drum surface may be non-continuous and / or may have a pattern). Alternatively, the discretely printed layer can be formed by printing (e.g. depositing the first resin material in a manner similar to an inkjet printer) the first resin onto the surface.

[00124] In some embodiments, the first resin material may be deposited such that the surface of the substrate is fully wetted to facilitate forming a uniform layer of the first resin material over the surface of the substrate, but that the thickness of the of the first resin layer is not so great that that the first resin layer is inhibited from breaking cleanly from the substrate when the stamping foil is applied to a target material. The thickness of the first resin layer that is formed by the deposition of the first resin material may depend on the resin material utilized for forming the first resin layer. In some implementations, the first resin material is deposited to form a first resin layer having a thickness in a range of about 1 um to about 20 um thick. 2026200863   06 Feb 2026

[00125] At 306, the first resin material of the first resin layer is cured to harden the first resin material. The curing that is performed at 306 may depend on the first resin material that forms the first resin layer. For example, if the first resin material is a UV-curable resin, then the curing that is performed at 306 may comprise irradiating the first resin material of the first resin layer with UV radiation. The cured first resin layer forms a foundation for the subsequently deposited embossing layer.

[00126] The temperature at which the first resin material is deposited at 304 and / or at which the first resin material is cured at 306 may be within a predetermined temperature or temperature range. The predetermined temperature or temperature range may depend on the materials that are utilized for the substrate and the first resin material and may be determined to facilitate a suitable bonding between the first resin layer and the substrate. In some implementations, the temperature of the environment in which the first resin material is deposited at 304 and / or cured at 306 may be maintained at a temperature between about 285 degrees Kelvin and about 298 degrees Kelvin.

[00127] At 308, a second resin material is deposited into the surface of the cured first resin layer to form an embossing layer. The second resin material may be any suitable material. The second resin layer may be, for example, a UV-curable resin. In some implementations, the second resin material is the same material as the first resin layer. Utilizing the same resin material for the first resin layer and the embossing layer provides predictable outcomes for the finished stamping foil because of matching material properties, and results in the first resin layer and the embossing layer being essentially indistinguishable in the finished stamped foil. In other implementations, the second resin material may be different than the first resin material provided that the second resin material adheres well to the first resin material to avoid dropouts forming in the embossing layer during the process of imprinting or embossing the physical structures on the surface of the 2026200863   06 Feb 2026 embossing layer, and to inhibit delamination of the embossing layer and the first resin layer in the finished stamping foil.

[00128] In some embodiments, the embossing layer can be a flood layer, for example covering substantially the entire coated surface of the substrate and / or first resin layer (e.g. as a continuous film and / or unpatterned layer over substantially the entire surface) and / or extending substantially edge-to-edge on the surface and / or extending across both feature and non-feature regions of the surface and / or configured to release as a whole. For example, depositing the second resin material on the cured first resin layer to form the embossing layer can comprise depositing the second resin material onto the first resin layer using a roller (e.g. which may have a substantially uniform roller surface) configured to evenly and / or uniformly cover / coat the entire surface of the first resin layer on the substrate.

[00129] In other embodiments, the embossing layer can be a discrete printed layer, for example a layer that is selectively applied to only portions (e.g. predetermined regions) of the surface of the first resin layer and / or the substrate (e.g. depositing coating material in a targeted, non-continuous, or pattern-specific manner, for example to the first resin layer and / or the substrate) and / or that comprise spatially separated layer portions, with intervening regions substantially uncoated / uncovered, and / or configured so that only specific portions / areas of the stamping foil release from the substrate (e.g. during hot or cold stamping) and / or are embossed with physical structures. For example, depositing the second resin material on the cured first resin layer to form the embossing layer can comprise discretely printing the second resin material onto the surface using an engraved drum or roller configured to pick up the resin onto and deposit the resin from only portions of its roller / drum surface (e.g. the drum surface may be non-continuous and / or may have a pattern). Alternatively, the discretely printed layer can be formed by printing (e.g. 2026200863   06 Feb 2026 depositing the second resin material in a manner similar to an inkjet printer) the second resin material.

[00130] In some embodiments, both the first resin layer and the embossing layer can be flood layers, for example extending substantially to cover one entire surface of the substrate. In some embodiments, both the first resin layer and the embossing layer can be discrete printed layers, for example with the first resin layer covering only one or more portions of one surface of the substrate, while the embossing layer covers (e.g. is co-extensive with) the first resin layer one or more portions (e.g. only extends over portions of the substrate that are also covered by the first resin layer, with the first resin layer serving as the foundation for the embossing layer).

[00131] In still other embodiments, the first resin layer can be a flood layer, while the embossing layer can be a discrete printed layer. For example, the first resin layer may substantially cover (e.g. extend over) one surface of the substrate, while the embossing layer atop the first resin layer may not be entirely co-extensive with the first resin layer (e.g. may only cover and / or be disposed atop portions of the first resin layer). Most often, if discrete printing is used, both the first resin layer and the embossing layer may be discrete printed (e.g. to be coextensive, for example with the embossing layer entirely covering the first resin layer and / or not extending beyond the first resin layer); if flooding is used, both the first resin layer and the embossing layer can be flood layers (e.g. both substantially coextensive with the substrate); but persons of skill will appreciate that either or both of the first resin layer and the embossing layer could be flood layers or discrete printed layers, for example depending on the specific structure and / or characteristics desired.

[00132] At 310, physical structures are imprinted, cast, embossed, printed, or otherwise formed onto the surface of the embossing layer. For example, the physical structures may be imprinted or embossed onto the surface of the embossing layer utilizing any suitable process such as, for 2026200863   06 Feb 2026 example, utilizing a mold, a stamp, or a shim to form the physical structures. The mold, or stamp, or shim may include the physical structures such that when the mold, or stamp, or shim is pressed into the surface of the embossing layer, the surface is deformed into the shape of the mold, or stamp, or shim creating the physical structures. In other embodiments, the physical structures can be discrete printed as part of the embossing layer. As described previously, the physical structures may be any structures that alters the behavior and properties of the light, which may be UV, visible, or infrared light, that is reflected, transmitted, absorbed, or scattered from the surface on which the physical structures are provided, and may include, for example, microstructures, nanostructures, diffraction gratings, plasmonic structures, metamaterial structures, photonic crystal structures, lens structures, or any combination thereof. During imprinting or embossing, the cured first resin layer acts as a foundation that inhibits the formation of dropouts in the embossing layer which could more readily form if the embossing layer were deposited directly onto the substate, or onto a release layer comprised of wax or silicone of a conventional stamping foil, as described previously.

[00133] At 312, the embossing layer is cured to harden the second resin material. The curing that is performed at 312 may depend on the second resin material that forms the embossing layer. For example, if the second resin material is a UV-curable resin, then the curing that is performed at 312 may comprise irradiating the imprinted second resin material of the embossing layer with UV radiation. The curing may be performed at 312 simultaneously while the mold, stamp, or shim is being pressed into the embossing layer at 310, then when the second resin material is cured, the mold, stamp, or shim may be detached, leaving the surface of the embossing layer with the physical structures.

[00134] At 314, a reflective material is deposited on the (e.g. imprinted) surface of the embossing layer (e.g. the surface with the physical structures and / or opposite the first resin layer) to form a 2026200863   06 Feb 2026 reflective layer. The reflective layer may be formed of any suitable reflective material. In some implementations, the reflective material may be a material having a high refractive index, such as, for example, TiO2 or Nb2O5 and may be deposited to form a reflective layer having a thickness in the range of, for example, approximately 50 nm to approximately 400 nm. In another example, the reflective material may be a metal, such as for example Al, Ag, Au, Cu, Cr, Ni, and may be deposited to form a reflective layer having a thickness in the range of, for example, approximately 15 nm to approximately 100 nm thick. In some embodiments, the reflected layer is deposited with sufficient thickness (e.g. depending on the material and its properties) to have a visible light transmission value less than 100%, for example 50-99%, 75-100%, 85-100%, 90-100%, 95-100%, 97-100%, 75-99%, 85-99%, 90-99%, 95-99%, 97-99%, 75-95%, 75-90%, 75-85%, 85-90%, 8597%, 85-95%, 85-90%, 90-97%, 90-95%, or 95-97%. The reflective material may be deposited in any suitable manner including, for example, vapor deposition. In some embodiments, the reflective layer may be deposited over the entire surface of the substrate, over the entire surface of the embossing layer, over the physical structures of the embossing layer, and / or over only a portion of the substrate.

[00135] At 316, an adhesive material is deposited on the reflective layer to form an adhesive layer. The adhesive material may be any adhesive material that is suitable for adhering stamping foils to a target material. The adhesive material may be chosen depending on whether the stamping foil will be utilized in a hot stamping process, in which case the adhesive material may be a heat activated adhesive material, or a cold stamping process, in which case the adhesive may be non-thermally activated adhesive such as a UV-activated and / or a pressure activated adhesive material. The adhesive material utilized may depend on the target material onto which the stamping foil is to be adhered to. In some embodiments, the adhesive layer may be deposited by a roller or drum. 2026200863   06 Feb 2026 In some embodiments, the adhesive layer may be deposited over the entire surface of the substrate, over the entire surface of the reflective layer, over the entire surface of the embossing layer, and / or over only a portion of the substrate. In some embodiments, the adhesive layer can be a flood layer (e.g. flood coated), while in other embodiments the adhesive layer can be a discrete printed layer (e.g. discretely printed).

[00136] Once formed, the stamping foil produced utilizing the above-described method may be utilized in a hot stamping or a cold stamping process to transfer the functional layers of the stamping foil (i.e., the first resin layer, the embossing layer, the reflective layer, and the adhesive layer) to a target material. For example, in hot stamping, the foil can be applied to the target surface using a combination of heat (e.g. to activate the resin of the first resin layer and / or the adhesive layer) and / or pressure to transfer the stamping foil to the target material / surface. For example, the adhesive layer and the first resin layer can be configured so that a heat and / or pressure level activates bonding of the adhesive layer to the target material / surface and results in detachment / release of the first resin layer from the substrate (e.g. the same heat and / or pressure that bonds the adhesive layer to the target material also acts to detach / release the first resin layer from the substrate during hot or cold stamping). During such transfer, the first resin layer remains attached to the embossing layer on the target surface (e.g. the adhesive layer, embossing layer, and first resin layer are jointly attached as a unified stamping foil to the target material).

[00137] In cold stamping, heat may not be used. For example, the adhesive layer may be activated by UV radiation and / or pressure, and the first resin layer may be activated by UV radiation and / or pressure. In embodiments, the adhesive layer and the first resin layer can be configured so that a UV radiation level and / or pressure level activates bonding of the adhesive layer to the target material / surface and results in detachment / release of the first resin layer from the substrate. In 2026200863   06 Feb 2026 other words, the conditions of the cold stamping process are sufficient to cause the first resin layer to detach (e.g. cleanly release) from the substrate and the adhesive layer to bond to the target material / surface. In some embodiments, hot or cold stamping of the stamping foil to a target material simultaneously causes bonding of the adhesive to the target material and detachment of the first resin layer from the substrate. In some embodiments, the adhesive layer bonds the reflective layer, the embossing layer, and the first resin layer to the target material after transfer (e.g. the first resin layer is released from the substrate and is attached to the target material / surface by the hot or cold stamping). For example, after hot or cold stamping, the stamping foil (e.g. having the adhesive, the reflective layer, the embossing layer (e.g. with physical structures), and the first resin layer) is bonded to the target material / surface.

[00138] In some embodiments, substantially none of the first resin layer (e.g. the first resin material) is left on the substrate after transfer to the target material and / or substantially all of the first resin layer (e.g. first resin material) is transferred to the target material (e.g. along with the embossing layer, the reflective layer, and the adhesive layer). In some embodiments (e.g. in which the first resin layer is a flood layer), the substrate may be substantially bald after hot or cold stamping (e.g. without substantially any other material attached thereto - see for example FIG. 2B). In some embodiments, (e.g. in which the first resin layer and the embossing layer are discrete printed layers), after hot or cold stamping, the stamping foil (e.g. having the adhesive, the reflective layer, the embossing layer (e.g. with physical structures), and the first resin layer) is bonded to the target material / surface, and some portion of the reflective layer and / or the adhesive layer (e.g. portions not disposed atop the adhesive material and / or embossing layer) may remain on the substrate (e.g. see FIG. 2D). Such usage can apply to one or more of the disclosed stamping foil embodiments. 2026200863   06 Feb 2026

[00139] The present disclosure provides a stamping foil, and a method of producing the same, that includes a first resin layer that acts as a foundation layer for a subsequently deposited embossing (e.g. second) resin layer. The deposition and curing of the first resin layer may inhibit the formation of dropouts in the embossing layer during a process of imprinting or embossing physical structures onto the surface of the embossing layer. The first resin layer also detaches from the substrate during application of the functional layers of the stamping foil to a target material, providing a protective coating to the foil. The first resin layer between the embossing layer and the substrate can replace a release layer comprised of wax-based or silicone-based materials used in conventional stamping foils, which release layer may prematurely detach from the substrate during production of the stamping foil, particular when imprinting physical structures in OVD stamping foils, forming dropouts. Thus, disclosed embodiments may not include a conventional release layer, and may provide improved functionality. The process for producing stamping foils may include performing a surface treatment to provide a desired surface energy at the substrate, or may include providing substrate material that includes the desired surface energy, that facilitates wettability and adhesion of the resin material of the first resin layer to the substrate to inhibit detachment during an imprinting process of a subsequently deposited embossing layer, but also facilitates a clean detachment of the first resin layer from the substrate during application of the stamping foil to a target material.

[00140] In the preceding description, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the embodiments. However, it will be apparent to one skilled in the art that these specific details are not required.

[00141] Embodiments of the disclosure may be represented as a computer program product stored in a machine-readable medium (also referred to as a computer-readable medium, a processor- 2026200863   06 Feb 2026 readable medium, or a computer usable medium having a computer-readable program code embodied therein). The machine-readable medium can be any suitable tangible, non-transitory medium, including magnetic, optical, or electrical storage medium including a diskette, compact disk read only memory (CD-ROM), memory device (volatile or non-volatile), or similar storage mechanism. The machine-readable medium can contain various sets of instructions, code sequences, configuration information, or other data, which, when executed, cause a processor to perform steps in a method according to an embodiment of the disclosure. Those of ordinary skill in the art will appreciate that other instructions and operations necessary to implement the described implementations can also be stored on the machine-readable medium. The instructions stored on the machine-readable medium can be executed by a processor or other suitable processing device, and can interface with circuitry to perform the described tasks.

[00142] The above-described embodiments are intended to be examples only. Alterations, modifications and variations can be effected to the particular embodiments by those of skill in the art. The scope of the claims should not be limited by the particular embodiments set forth herein, but should be construed in a manner consistent with the specification as a whole.

[00143] Unless the context requires otherwise, where the terms “comprise”, “comprises”, “comprised” or “comprising” are used in this specification (including the claims) they are to be interpreted as specifying the presence of the stated features, integers, steps or components, but not precluding the presence of one or more other features, integers, steps or components, or group thereof.

Claims

1. A method for producing a stamping foil, the method comprising:depositing a first resin material to a surface of a substrate to form a first resin layer on the surface of the substrate;curing the first resin material of the first resin layer;depositing a second resin material on a surface of the cured first resin layer to form an embossing layer;forming one or more physical structures onto a surface of the second resin material of the embossing layer;curing the second resin material of the embossing layer;depositing a reflective material on the surface of the embossing layer to form a reflective layer; anddepositing an adhesive material on the reflective layer to form an adhesive layer;wherein the first resin layer is configured to act as a foundation for the subsequently deposited embossing layer and is configured to detach cleanly from the substrate when the stamping foil is applied to a target material by hot or cold stamping, thereby protectively covering the embossing layer after the stamping foil is applied to the target material by hot or cold stamping.

2. The method according to claim 1, further comprising, prior to depositing the first resin material, performing a surface treatment to the surface of the substrate to provide a predetermined surface energy at the surface of the substrate prior to deposition.2026200863   06 Feb 20263. The method according to claim 2, wherein the predetermined surface energy at the surface of the substrate is between about 30 and about 55 dynes / cm.

4. The method according to claim 2 or claim 3, wherein the surface treatment is a corona treatment, or a plasma treatment, or both a corona treatment and a plasma treatment.

5. The method according to any one of claims 1 to 4, wherein the first resin material is the same as the second resin material.

6. The method according to any one of claims 1 to 4, wherein the first resin material is different than the second resin material.

7. The method according to any one of claims 1 to 6, wherein depositing a first resin material comprising maintaining an environment in which the first resin material is deposited at a temperature of between about 285 degrees Kelvin and about 298 degrees Kelvin.

8. The method according to any one of claims 1 to 7, wherein the first resin layer has a thickness between about 1 um and about 20 um.

9. The method according to any one of claims 1 to 8, wherein one or both of the first resin material and the second resin material are an ultra-violet (UV) curable resin, and curing the one or both of the first and second resin material comprising irradiating with UV radiation.2026200863   06 Feb 202610. The method according to claim 9, wherein the ultra-violet (UV) curable resin is an acrylate base composition.

11. The method according to any one of claims 1 to 10, wherein the physical structures imprinted on the surface of the embossing layer comprise one or more of the following: microstructures, nanostructures, diffraction gratings, plasmonic structures, metamaterial structures, photonic crystal structures, lens structures, or combinations thereof.

12. A stamping foil comprising:a substrate;a first resin layer formed on a surface of a substrate and comprised of a first resin material;an embossing layer formed on a surface of the first resin layer, the embossing layer comprising a second resin material and having physical structures imprinted onto a surface of the embossing layer;a reflective layer formed on the surface of the embossing layer, the reflective layer comprising a reflective material; andan adhesive layer formed on a surface of the reflective layer, the adhesive layer formed of an adhesive material.

13. The stamping foil according to claim 12, wherein the first resin material is the same as the second resin material.2026200863   06 Feb 202614. The stamping foil according to claim 12, wherein the first resin material is different than the second resin material.

15. The stamping foil according to any one of claims 12 to 14, wherein the first resin layer has a thickness between about 1 um and about 20 um.

16. The stamping foil according to any one of claims 12 to 15, wherein one or both of the first resin material and the second resin material are an ultra-violet (UV) curable resin.

17. The stamping foil according to any one of claims 12 to 16, wherein the physical structures imprinted on the surface of the embossing layer comprise one or more of: microstructures, nanostructures, diffraction gratings, or plasmonic structures.

18. The stamping foil according to any one of claims 12 to 17, wherein the adhesive layer and the first resin layer are configured so that hot or cold stamping simultaneously activates bonding of the adhesive layer to a target material and results in detachment of the first resin layer from the substrate.

19. A stamping foil prepared according to the process of any one of claims 1 to 11.

20. A use of the stamping foil according to any one of claims 12 to 18 in a cold stampingprocess or hot stamping process to transfer the first resin layer, the embossing layer, the reflective layer, and the adhesive layer to a material, wherein the first resin layer is configured to detach2026200863   06 Feb 2026cleanly from the substrate when the stamping foil is applied to a target material by hot or cold stamping, thereby protectively covering the stamping foil after application to the target material by hot or cold stamping.

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