THERMOELECTRIC TEMPERATURE CONTROLLER

Description

2 However, existing systems exhibit several shortcomings. First of all, temperature sensitivity is often limited to 0.1°C, which can lead to delayed responses to temperature fluctuations, especially when the carrier gas begins to flow or the ambient temperature fluctuates. This can result in inaccurate transfer of the fluid molecules, which can affect the quality of the produced microchips. Furthermore, some existing systems have limited cooling capacity, which can lead to performance loss as the system ages. This is particularly problematic in environments where temperature can vary significantly. Finally, maintenance of these systems is often cumbersome, especially when it comes to replacing the fluid containers, which requires extra space and time. Each of these limitations, certainly in combination, emphasizes the need for improved temperature control systems that are both more accurate and more efficient, and that can be better integrated into modern production processes.SUMMARY OF THE INVENTION 20 The invention concerns an improved thermoelectric device for temperature control of liquid chemicals in a sealable container, the container comprising a bottom wall, upright side walls and a top wall, the container further provided with a temperature probe for measuring the temperature of the chemicals in the container, an inlet for receiving a carrier gas to below the level of the liquid chemicals, and an outlet for removing atmospheric gas from the container. The device comprises a thermally conductive support platform, suitable for receiving the container thereon and cooling and / or heating the container and the chemicals therein, and a cooling plate configured for dissipating excess heat.30 This device further comprises a thermoelectric element configured for the controlled transfer of heat between a first and a second side by passing a current through the thermoelectric element, whereby the thermoelectric element is thermally connected to the support platform on the first side, and thermally connected to the cooling plate on the second side. In addition, 35 one or more connection points are provided suitable for connecting to the temperature probe of the container, and a control unit configured for BE2024 / 5962 3 controlling the thermoelectric element by passing a current through the thermoelectric element, whereby the transferred heat is controlled over time by pulse width modulation of the current, where the pulse width modulation takes place at a frequency of at least 1000Hz, at preferably at least 1500Hz. The current is supplied by means of a current source.The control unit is connected to one or more connection points and is configured to read temperature data from a temperature probe coupled to one or more connection points with a readout unit. The device comprises a housing, which includes a base casing and an extension, where the base casing comprises the support platform, the cooling plate, the power source, the readout unit, the control unit, one or more connection points and the thermoelectric element. The base casing and the extension together form a cavity suitable for form-fitting and encompass substantially the full height thereof of the container. The extension comprises internal sidewalls that partially define the sidewalls of the cavity, and where the said internal sidewalls are in thermal contact with the support platform. The cooling plate is contained in a base of the housing, where the support platform rests on the The base is provided together with the side walls. The control units and the power source are distanced from each other by a distance greater than 50%, preferably 75%, from the sides of the base.The thermoelectric element is integrated into a thermally insulating separator which separates the cooling platform and the support platform. Further embodiments are described in the independent claims, as well as in the description that follows. In a second aspect, the invention concerns the use of the device for “bubbling” a precursor fluid in a “bubbler” container for the evaporation or atomization of the precursor fluid, for use in, among others, chemical vapor deposition (CVD) applications. DESCRIPTION OF THE FIGURES Figure 1 shows a rear view of an embodiment of the device. Figure 2 shows a perspective view of an embodiment of the rear side of the device. BE2024 / 5962 4 Figure 3 shows the support platform, the cooling plate and the separator according to an embodiment of the invention. Figure 4 shows a lateral view of the cross-section of the elements from Figure 3.5. Figures 5A and 5B show a design of the device, measured without the attachment.DETAILED DESCRIPTION10 The term "thermoelectric device" refers in the present invention to an apparatus designed for the precise temperature control of liquid chemicals within a closed container. This apparatus uses thermoelectric elements to enable heating and cooling, and serves for atomization, evaporation or volatilization of the liquid chemicals for further use in an ash-form state, typically in CVD applications. In the present invention, the term "container" refers to a vessel comprising a bottom wall, side walls and a top wall, which can be closed and is equipped with a temperature probe, a carrier gas inlet below the liquid level, and an outlet for the removal of atmospheric gas. The term "temperature probe" refers to a temperature sensor, such as a PT100 resistance temperature detector, which is used to measure the temperature of the chemicals inside the container.The term "thermally conductive support platform" refers to a thermally conductive support platform designed to facilitate the heating or cooling of the container.30 The term "cooling plate" refers to a cooling plate configured to efficiently dissipate excess heat. The term "thermoelectric element" refers to an element, such as a Peltier-35 element, that transfers heat between two sides when an electric current passes through it. It is thermally connected to the support platform BE2024 / 5962 5 on one side and the cooling plate on the other side. The term "connection points" refers to connection points suitable for providing interfacing with the temperature probe of the container. 5 The term "control unit" refers to a control unit configured to regulate the thermoelectric element by modulating the current via pulse width modulation at a frequency of at least 1000Hz, preferably 1500Hz, to regulate heat transfer over time.10 The term "housing" refers to a housing that comprises a base housing and a top section, which together form a cavity that accommodates the container over almost its entire height. The term "cavity" refers to the space formed by the base housing and the top section15, which is designed to fit and enclose the container tightly. The term "power source" refers to a power supply that provides the current required for the operation of the device, preferably operating on direct current.20 Preferably, this is supplied with energy from an external power source, and this energy is converted into a desired current. The term "reading unit" refers to a reading unit containing an analog-to-digital converter (ADC) capable of converting isomalog data from the temperature probe into a digital output with a precision of at least 0.01°C. The term "current protection element" refers to a current protection element that measures the current through the thermoelectric element and activates alarm functions based on predefined threshold values.The term "thermally insulating separator" refers to a thermally insulating separator that integrates the thermoelectric element and separates the cooling plates from the support platform.35 The term "ventilation openings" refers to ventilation openings in the housing for BE2024 / 5962 6 the discharge of warm air from the cooling plate. The term "digital display" refers to a digital display, possibly with a control panel, used for user interaction and monitoring the functions of the device.5 In a first aspect of the invention, a device is presented that significantly improves the operational efficiency and accuracy of temperature control in chemical processes. The device is distinguished by its unique design, which includes a thermally insulating separator or separation plate between the cooling platform and the support platform. This separation plate plays a crucial role in minimizing the accumulation of chemical residues on the thermoelectric elements.This design leads to significantly reduced maintenance requirements and extends the service life of the device, resulting in lower operating costs and higher reliability for the user.15 By providing a separator between the support platform, used for heating and cooling, and the cooling plate, used for heat dissipation, the system becomes more efficient, and unwanted heat is kept away from zones where it is not desired (depending on whether the support platform needs to cool or heat).20 Additionally, the thermoelectric element is thus also protected from external temperature fluctuations that can cause degradation. The device uses high-frequency modulation of the current through the thermoelectric element, which enables a rapid response to temperature fluctuations. This rapid response is essential for precise temperature control, which directly contributes to improved production results.The device's ability to quickly detect and anticipate changes in the temperature profile of a chemical process makes it an indispensable tool for efficient and reliable temperature regulation in various industrial applications. More specifically, this high-frequency current modulation allows the reliability of the system's cooling characteristics to be ensured over a long period (10-20 years, typically even longer), without significant degradation. In existing systems, the cooling strength decreases rapidly after prolonged use, meaning these systems either need to be replaced sooner or maintained more frequently, or alternatively provide unreliable cooling that is difficult to control, requires some time to provide the desired cooling using a feedback mechanism, and thus fluctuates around the desired temperature with periods in which the fluid becomes too hot and then too cold, causing the resulting vapor pressure not to be constant, as required.It goes without saying that such cooling does not achieve the desired or required quality needed in these highly sensitive processes. In certain state-of-the-art systems, there is not even a system with controllable cooling; instead, a “brute force” approach is used, in which the cooling has a fixed output, and the desired temperature is then achieved by activating an additional heating element (silicone heater) to 'correct' the cooling. It goes without saying that such a system is not only inefficient but will also operate via a feedback mechanism, thereby causing delays and resulting in periods where too much and too little heat is provided. In addition, this approach can also lead to local temperature differences across the bubble container, which is detrimental to the evaporation process. Pulse width modulation (PWM) allows the cooling power to be controlled.In standard technology, this is typically performed at a frequency between 100 and 300 Hz, which allows for the effective provision of a fairly constant heat flux, given that the rapid switching produces an apparently constant result. However, for the thermoelectric element, a typical Peltier element, this constant switching on and off of the current leads to rapid degeneration of the element. This is due, among other things, to the rapid change in temperature within the element, which can lead to thermal stress, from which material fatigue and other technical defects can result. Consequently, the cooling characteristics deteriorate over time. In the case of a 'smart' system, this can potentially be compensated for by continuously increasing the delivered power to guarantee constant cooling, but this only leads to faster degeneration and can also result in complete failure of the element. By modulating with a substantially higher frequency (a factor of 10 or even higher), the applicant judge succeeds in avoiding these problems.The high frequency35 ensures that switching on and off becomes less 'perceptible' to the thermoelectric element, because the temperature extremes for the BE2024 / 5962 8 element become less pronounced, and there is a smoothing of the temperature, even very locally. Preferably, the PWM frequency is set to more than 1 kHz, preferably to more than 1.5 kHz, preferably to more than 2.0 kHz, and preferably to more than 2.5 kHz, such as 2667 Hz or more, e.g. 3.0 kHz or 3.5 kHz. This choice ensures smoother operation and improved performance over longer periods of time. By maintaining peak performance, the temperature controller optionally supports high-precision applications, where even small temperature deviations can have significant effects on the outcome. In a preferred design, the device offers precision in temperature control whereby the temperature can be controlled to within 0.01°C.This high degree of accuracy is achieved through the application15 of a high-resolution analog-to-digital converter, capable of generating extremely accurate temperature data. This results in improved monitoring and control of the temperature process, which is particularly beneficial in critical applications such as semiconductor production. In this way, it is possible to react more quickly to temperature fluctuations in the fluid, given that there is often a certain 'inertia' present. By reacting earlier, excessive deviation is avoided and a constant vapor pressure is ensured. In this way, the device also offers improved process analyses and optimizations thanks to the accurate digital output. This is particularly useful in applications where even the smallest temperature variations can have major consequences, such as in the manufacture of microchips. The ability to regulate the temperature to within 0.01°C ensures a high degree of process control and consistency.In a further preferred design form, the device can be equipped with external communication protocols and connection points, such as Ethernet, to promote seamless integration into existing process control systems. This makes it possible to operate and monitor the device remotely, which contributes to the flexibility and efficiency of the production process. The device is therefore ideally suited for applications requiring a high degree of precision and control, such as in the semiconductor industry and other advanced production systems. BE2024 / 5962 9 In a preferred design form, the device with the cavity defines a construction that ensures improved heat transfer from the support platform, whereby heat is supplied or removed not only along the underside via the support platform, but also along the side walls of the base casing and the extension, which leads to more efficient temperature regulation.This innovative construction of the device also prevents thermal bridging between the (typically aluminum) housing and the container to be cooled by separating the external housing from the support platform and the walls connected to it via an insulation layer, which results in more effective cooling.10 Preferably, low-resistance MOSFETs are placed next to the Peltier elements, whereby the device optimizes energy transfer, resulting in improved cooling efficiency and reduced heat loss. Preference is given to a configuration in which thermal insulation is maximized15 so that heat transfer to the environment is minimized, which contributes to more efficient operation of the device. The use of high-quality materials and components further contributes to the durability and reliability of the system, making it suitable for long-term use in demanding industrial environments.The design can be further optimized by the use of advanced cooling technologies, such as the use of multiple Repeltier elements working together to maintain the desired temperature, as well as guaranteeing a better distribution of the heat flux to or from the support platform. These elements can preferably be controlled by an advanced control system capable of reacting more quickly to changes in ambient temperature, thereby ensuring the stability of the process. In a more preferred configuration, the control system can be programmed to support various operating modes, depending on the specific requirements of the application. A preferred design of the device also offers the possibility to adapt the configuration to specific customer needs, allowing the device to be deployed flexibly in various applications.This can include, among other things, that the configuration of the heat sinks and the fan can be adjusted to meet specific cooling requirements, or that the software can BE2024 / 5962 10 be updated to support new functions and capabilities. Due to this versatility, the device is a valuable addition to any advanced production process in which precise temperature control is crucial. In a preferred design form, the device includes a digital display5 that is provided on the device itself and is preferably placed at an ergonomic height, thereby increasing ease of use for the user. This leads to more efficient operation and significantly reduces the chance of errors. The digital display offers a clear and direct view of the current status and settings of the device, which contributes to an intuitive user experience.10 Moreover, the optional control panel makes it possible to adjust the settings precisely, which further increases flexibility in use.Due to the construction with a semi-open cavity, space is saved at the base of the layout where a display can be provided. 15 Furthermore, the device preferably comprises low-ohm MOSFET switches that operate with minimal energy loss. These switches maximize energy transfer to the Peltier elements, which results in improved overall cooling performance. The low resistance of the MOSFET switches contributes to optimal electrical efficiency, which increases the overall energy efficiency of the system. These aspects ensure that the device not only functions efficiently but also remains reliable under various operating conditions. Preferably, the resistance of these switches is a maximum of 25 milliohms, with a third preference a maximum of 10 milliohms, and with even further preference a maximum of 10 milliohms. The combination of these characteristics makes the device a versatile and high-quality device suitable for a wide range of applications where accuracy and reliability are of crucial importance.In a preferred load-bearing design, the device includes ventilation openings positioned below the digital display. This design offers efficient heat dissipation, which contributes to improved thermal management of the device. The ventilation openings are preferably designed to optimize airflow, allowing the heat generated by the internal components to be effectively dissipated. This reduces the risk of overheating and extends the service life of the device. In a preferred load-bearing design, the device includes an adjustable BE2024 / 5962 11 fan at the cooling plate, which results in quieter operation when desired and contributes to a comfortable and less disruptive working environment.In a preferred configuration, the device features compact front-loading functionality, enabling improvements in installation flexibility and easier integration into various equipment configurations without imposing excessive space requirements, where the bubble container must be placed into the cavity from above, which is often awkward and dangerous for the user, who has little grip on the container. This preferred version makes it possible to use the device in environments with limited space, which increases the versatility of the device. In a further preferred design, the facility provides for partial front loading functionality, whereby the cavity in which the container is received is partially accessible via horizontal movement,15 so that the container is already partially enclosed within the cavity, and can then be moved downwards over a limited distance, which greatly simplifies the placement and removal of a container.Users can easily tilt and remove the liquid container without requiring extra space above the device. This design is particularly advantageous in environments where space is limited, and it allows for quick maintenance or replacements, which increases operational efficiency. In a further preferred load-bearing design, ventilation openings at the rear of the device contribute to even heat dissipation. This design ensures that the internal components are less exposed to excessive heat, which benefits the reliability and performance of the device in the long term. Consequently, the device can continue to function optimally under various environmental conditions. In a preferred load-bearing design, the internal sidewalls are encased in a layer of foam insulation, which reduces heat exchange with the environment. In a further preference, a magnetic alarm can be provided in the foam insulation, enabling rapid detection of misalignment.By quickly intervening in the event of misalignment, the device can ensure that temperature control remains consistent, which is crucial for processes that depend on precise temperature control. The combination of these features in a preferred design makes the device particularly suitable for applications requiring accurate temperature control. The improved heat dissipation, simplified maintenance, and increased process integrity all contribute to the overall effectiveness and reliability of the device in various industrial environments. In a preferred design, the device can include a system for monitoring the current flowing through the thermoelectric element. This system preferably includes the ability to set alarm thresholds that can trigger warnings when abnormal current levels are detected.Such a function enables the system to react more quickly to prevent possible overheating scenarios (or substandard performance), thereby ensuring the protection of the equipment. The ability15 to monitor the internal temperature is optionally included, allowing for anticipatory adjustments that maintain stability, even amidst external environmental fluctuations. This function is particularly beneficial in environments where external temperatures vary significantly, because it enables the device to adjust its operation without compromising performance. Additionally20 this is useful for actively countering unexpected temperature changes in the environment (e.g. air conditioning failure). In a preferred design form, the device includes a second alarm function that switches off the device in the event of abnormal current deviations25 where an excessive current is detected. This function ensures increased safety and offers protection against overheating of the liquid.The alarm function is preferably configured not only to switch off the device but also to provide a warning to the user, so that immediate action can be taken. This contributes to the safe operation of the device, especially in environments where temperature control is crucial. In a preferred design, the device includes high-quality temperature connectors that increase the reliability of the device by minimizing connector failure rates. These connectors are preferably designed to resist mechanical wear and provide a stable connection throughout the device's lifespan. This ensures the accuracy and consistency of the temperature measurements. In a further preferred design, the device can quickly perform software updates in the field. This capability increases the device's adaptability to new technologies or user needs.By supporting rapid updates5, the device can be easily adapted to changing process requirements or improved functionalities without the need to physically modify the device. In a preferred load-bearing design, the device uses a10 direct current source, which optionally improves the stability of the thermoelectric device by minimizing vibrations and electrical noise. This design preferably minimizes electromagnetic interference, thereby preserving high-quality signals that optionally improve the precision and reliability of the system. The device can preferably implement fast and accurate15 temperature changes, maintaining stable conditions even during process fluctuations. The use of high-quality connectors in the device further ensures guaranteed long-term reliability, reducing maintenance requirements and increasing performance consistency.20 In a further preferred design, the device can achieve an improved level of thermal stability through the application of an advanced control system that keeps the temperature at a constant value, even in the event of external disturbances such as fluctuations in ambient temperature or variations in airflow. The accuracy of the temperature control can optionally be further improved by the use of a precision temperature sensor that quickly detects and corrects changes in temperature. Furthermore, the device can optionally make use of a range of high-quality materials and components that improve the durability of the device and extend its service life. This preferably includes the use of robust housings and durable electronic components that can withstand the challenges of industrial environments.The combination of these elements can optionally result in a device that is not only accurate and reliable, but also durable35 and low-maintenance, making it a cost-effective solution for temperature control in demanding applications. BE2024 / 5962 14 In a preferred configuration, the device provides a 4-20 mA input, which allows the device to be connected to an external liquid level probe. This offers improved liquid level management, resulting in more accurate process control and a reduced risk of accidental process failure. This feature is5 particularly valuable in environments where precision and process continuity are of crucial importance. In a preferred configuration, the device is equipped with Ethernet communication, which significantly improves the integration of the device into network architectures10. This feature makes it possible to operate and monitor the device remotely, which contributes to process automation and increased operational efficiency.Ethernet communication reduces the need for analog cables, which simplifies installation and increases flexibility in system design.15 In this sentence, a preferred device design includes an Ethernet interface that simplifies integration into networks. This interface makes it possible to improve the control and communication of the device, which leads to more efficient device management. Furthermore, the Ethernet interface20 can preferably be configured to be compatible with a wide range of network protocols, thereby increasing the flexibility and deployability of the device in various industrial environments. Moreover, the device temperature controller preferably supports various25 communication protocols, thereby increasing its versatility in various industrial applications. This adaptability is preferably achieved through the integration of Ethernet communication, which can reduce the need for multiple analog cables and thus streamline the installation process.The controller's ability to operate at 24 VDC is preferably another 30 characteristic that distinguishes it from competitors, because it can place the power supply separately, which potentially improves energy efficiency and reduces heat generation in enclosed spaces. In a preferred load-bearing design, the device provides for the measurement of the 35 ambient temperature, which is used to adjust the operation of the thermoelectric element. This approach preferably ensures that a stable BE2024 / 5962 15 temperature is maintained in the chemical vapors above the wafers. By maintaining high precision and using advanced control mechanisms, the need for frequent maintenance is preferably reduced, which can lead to lower operating costs. 5 In a preferred load-bearing design, the temperature measurement sensitivity of 0.01°C is achieved by using a Pt100 (resistance of 100 ohms at 0°C) resistance-sensitive temperature probe, which can be calibrated to provide high accuracy over extended periods.This sensitivity ensures faster detection of temperature fluctuations, which can be quickly compensated for by the cooling or heating functions of the controller. The use of a pulse width modulation technique with a frequency above 1 kHz to control the Peltier elements is another preferred feature that extends the cooling capacity and service life of the device. In a preferred design, the device can also include a half-front loading design, which preferably allows for the simple installation of the liquid container with minimal overhead space. This compact design, together with the unique construction of the one-piece aluminum housing, preferably ensures efficient cooling and minimizes the risk of liquid leakage, thereby improving operator safety. Overall, the combination of precision, reliability, and versatility of the device-temperature controller positions it as a preferred superior choice in temperature control applications.25 In a preferred application, the invention comprises improved heat transfer that ensures accurate temperature control through powerful thermal conduction of the internal sidewalls of the base housing and the attachment. The device is preferably equipped with a high resolution of 0.01°C, which offers maximum improvement in the precision of the temperature control. This is advantageous for 30 applications where accurate temperature monitoring is essential, such as in processes that generate consistent causes. The device's ability to detect small temperature changes contributes to the overall precision of the temperature control, which is crucial for the reliability and efficiency of the process. 35 In a further preferred application, the device may be equipped with an advanced feedback mechanism that further refines the temperature control by creating real-time composition based on the measured temperature changes.This can preferably be expanded from an increasing algorithm to optimize the temperature mechanism control and improve the responsiveness of the system.5 In a preferred load-bearing design, the temperature controller includes side walls manufactured in one piece with the base casing, which ensures improved structural integrity and durability of the device. This design optionally allows for a more robust frame, thereby minimizing the risk of deformation or damage during operation. Preferably, this construction facilitates the efficient installation of the temperature controller in environments with limited overhead space, enabling its integration into compact production setups. Furthermore, the unique design of the unit ensures easy access and maintenance, which ensures minimal downtime15 and increased productivity. The design of the insulation plate or separator is preferably configured to guarantee the thermal insulation of the thermoelectric elements and the cooling plate.This ensures improved energy efficiency of the temperature controllers and increased reliability. By reducing the thermal conductivity between the support platform (and the side walls of the cavity) and the cooling plate, the separator protects sensitive components from excessive heat exposure, thereby extending their operational lifespan. Furthermore, the thermal insulation contributes to maintaining consistent temperature control, which is crucial for processes requiring high precision and reliability. In a preferred load-bearing design, the device features a cylindrical cavity design that contributes to improved heat efficiency. Here, all side walls of the cavity are thermally connected to the support platform, through which heat transfer occurs. This design ensures an even distribution of heat across the liquid container, resulting in energy savings and stable temperature control.Optionally, the cylindrical cavity can be configured to further optimize heat transfer, whereby the internal structure of the cavity is designed to maximize the thermal conductivity of the materials used. BE2024 / 5962 17 In a preferred load-bearing design, the device has an open top of the cavity, which contributes to a more compact installation. This preferably ensures that less vertical space is required, allowing the device to be easily integrated into limited or existing spaces. This design choice makes it possible to use the device in a wide range of applications where space saving is a crucial factor. The open top is then closed once the bubbler container has been placed, by means of an attachment that may already form part of the bubbler10 container, and is provided with connections for the supply of carrier gases and for the discharge of the produced vapors. In a preferred load-bearing configuration, the device includes the implementation of an advanced PID control system.This system preferably enables the rapid and accurate control of temperature changes. The PID control system is designed to respond efficiently to changes in ambient temperature or other disturbances, allowing the desired temperature to be restored quickly. This precise control over temperature management is of great importance in applications where even small temperature deviations can affect the quality of the final product. The combination of a compact design, improved electrical efficiency, reliable temperature connections, and an advanced control system makes the device a preferred versatile and reliable choice for a wide range of industrial applications. These features preferably contribute to improved process stability and product quality, which ultimately leads to higher operational efficiencies and lower costs. In a preferred design form, the invention concerns a device in which the connection points, control units, and power source are separated by a distance of at least 10 cm from each other.This separation optionally minimizes electromagnetic interference and prevents excessive heat accumulation within the housing. By physically separating these components, heat transfer between them is reduced, which optionally leads to less thermal stress and a longer service life of sensitive electronic parts. BE2024 / 5962 18 Preferably, the control unit is positioned at a distance of at least 10 cm from the power source, allowing electromagnetic interference to be further reduced. This results in more reliable communication and more accurate temperature regulation. The physical separation of the connection points optionally offers easy access to the connectors, which facilitates maintenance and minimizes the risk of connection problems. Preferably, the invention involves a construction where the distance between the components can vary, but ideally lies within a range of 10 cm to 20 cm.This range can be further extended to a distance of 5cm to 25cm, even further to 3cm to 30cm, and even to 2cm to 35cm, depending on the specific applications and the available space within the housing. In a more preferred design, the device can optionally make use of components specially designed to reduce electromagnetic interference, such as shielded cables or housings with electromagnetic shielding. These measures contribute to the overall reliability and accuracy of the system. 20 In another preferred design, the separation of the components can also contribute to more efficient heat dissipation, enabling the facility to operate within a wider temperature range. This temperature range can preferably lie between -10°C and 60°C, more preferably between -5°C and 55°C, even more preferably between 0°C and 50°C, and most preferably between 5°C and 45°C.These improvements in heat management and electromagnetic interference make the device particularly suitable for use in demanding environments where precise temperature control is of crucial importance. 30 In a preferred design, the frequency of the high-frequency modulation can preferably vary from 1 kHz to 5 kHz, more preferably from 1.5 kHz to 4.5 kHz, even more preferably from 2 kHz to 4 kHz, even more preferably from 2.5 kHz to 3.5 kHz, and most preferably around 2.667 kHz. This frequency optimization contributes to extending the service life of the Peltier-35 elements and ensures that cooling efficiency is maintained, even after prolonged use. BE2024 / 5962 19 Overall, the combination of these preferred functions in the device temperature controller offers a comprehensive solution for maintaining accurate temperature control in various industrial applications. The improved durability, energy efficiencies, and service life of the components5 collectively contribute to a reliable and effective temperature management system.These features are particularly advantageous in semiconductor production and other high-tech industries where precision and reliability are of the greatest importance. EXAMPLES10 Figure 1 shows a rear view of the device (with a back panel removed), in which a number of the most important electronic components are visible. At the bottom of the counter is a communication circuit(11) suitable for being connected to external systems. At the top of the counter there is a connection point(13) to which15 a temperature probe can be connected, with below it, in the base casing(2), a readout unit(12) for reading temperature data from the temperature probe. At the bottom left there is a connection(10) for external power supply, with a power source(14) above it that converts the external power supply into a suitable current20 and voltage, for the thermoelectric element(7), among other things. Finally, there are two Ethernet connections(8) at the top.Figure 2 shows a perspective view of the rear side of the unit (with a rear wall removed), in which the base casing (1,2) is visible. This 25 comprises a base (1) and an upright section (2) that stands on the base and at the rear of the unit. Together with the attachment (15), the base (1) and the upright section (2) define the cavity in which the liquid container (bubbler) can be fitted. In Figure 2, the connection point (13) for the temperature probe and the readout unit (12) are again visible, as well as the connection (10) for external power supply, the power source (14), the two Ethernet connections (8), and the communication circuit (11). Figure 3 shows the internal sidewalls (5) of the upright section (2) of the 35 base casing, and the support platform (4) with which the internal sidewalls are thermally connected. The internal sidewalls at the rear (5a) extend over the full height of the cavity to be formed, and the internal sidewalls at the front (5b) only over part of the height.An extension piece is later added that 'fills in' the shorter front sidewalls (5b) to the full length, and thereby also makes a thermal connection with the internal sidewalls of the extension piece and those of the upright section (5).5 The support platform (4) is fixed on a thermally insulating separator (6), in which one or more (invisible in this figure) thermoelectric elements (7) are provided. At the bottom of the separator (6) it is fixed on a cooling plate (3) with cooling fins (9). 10 Figure 4 shows a side view of the cross-section of the elements from Figure 3. It shows how a thermoelectric element (7) is built into the separator (6) and makes thermal contact with both the support platform (4) and the cooling plate (3), and in this way can create a heat flux in both directions, depending on how the thermoelectric element is controlled.Both the support platform (4) and the cooling plate (3) are mounted securely to the separator (6) with a number of bolts, however no thermal bridge is formed between the support platform and the cooling plate, except for the thermoelectric element, which is verifiable, and the separator, which in fact does not act as a thermal bridge. 20 Figure 5 A shows a device according to the invention, where the attachment (18) is placed on the base casing (1,2), and thus defines the cavity (15). At the front underside there is also a digital display (16) with control buttons, which allows a user to perform actions directly on the device, such as adjusting a temperature setpoint. 25 Below the display a grill with ventilation openings (17) is visible, which allows an airflow to pass the cooling plate (3) and cooling fins (9). This airflow is generated by an internal fan in the base casing.