TRANSACTION CARD WITH EMBEDDED ELECTRONIC COMPONENTS AND MANUFACTURING PROCESS

Abstract

A transaction card and a process for making the transaction card are described. The transaction card includes a core with first and second faces, a core thickness between them, and an opening with embedded electronic components arranged in the opening.

Description

1 / 21 “TRANSACTION CARD WITH EMBEDDED ELECTRONIC COMPONENTS AND MANUFACTURING PROCESS” CROSS-REFERENCE TO RELATED REQUESTS

[0001] This application claims priority over Provisional Application No. US 62 / 555,367, filed September 7, 2017, which is incorporated herein in its entirety by reference. BACKGROUND OF THE INVENTION

[0002] Users, manufacturers, and issuers of transaction cards may have an interest in embedded electronic components within the card as a thin printed circuit board to provide any number of functions. Functionalities provided by such embedded electronic components may include, without limitation, functions that enable the use of biometrics, a one-time password, a display (e.g., liquid crystal diode (LCD) or electronic paper) to display messages or product offers, an indicator (e.g., a light, such as an LED) that is activated when card functions are in operation (such as when the card is physically or inductively connected to a reader and being read), internet connectivity to enable the card to participate in the Internet of Things (IoT), or any other desired functionality. An illustrative example of a use for embedded electronic components in a card is to enable the use of dynamically generated security codes.

[0003] The use of dynamically generated security codes on transaction cards (e.g., smart cards, debit cards, credit cards) is of increasing interest to reduce the risk of fraud, as described in Published Patent Application No. US20140279555A1 (Guillaud), incorporated herein by reference. As described therein and known in the art, exemplary security codes may be referred to by those in the field as the Card Verification Value (“CVV” or “CVV2”), also known as the Card Security Code (“CSC”), Card Verification Data (“CVD”), Card Value Code Petition 870200039558, dated 03 / 26 / 2020, p. 25 / 45 2 / 21 Card Verification (“CVVC”), Card Verification Code (“CVC” or “CVC2”), Verification Code (“V code” or “V code”), or Card Code Verification (“CCV”).

[0004] Guillaud also discloses exemplary electronic components that can be used to implement the generation of a dynamic security code on a card 200, which includes a processor / controller 202, battery or other power source 204, memory 206, and a display 208, as illustrated in this document in Figure 2. Additional components may include, for example, one or more antennas 210, one or more other user interfaces, such as a touch-sensitive keyboard 212 or a touch-sensitive control button 214 connected to the processor / controller, and an internal clock (not shown) embedded in, or configured to provide an ingress time for, the processor / controller.

[0005] Cards with dynamically generated codes generally require that the electronic display and other embedded electronic components not only provide the necessary functionality, but also be extraordinarily thin, to fit within the thickness of a standard credit card, which is typically about 0.030 + / - 0.003 inches (i.e., 1 / 32 of an inch, 30 mils, or 0.76 millimeters + / - 10%). Guillaud, as well as the disclosures in Published Patent Application No. U.S. 20120206869A1 and U.S. Patents 8,448,872 and 9,320,186, all of which are also incorporated herein by reference, describe plastic cards with embedded electronic components and / or processes for their manufacture.There is interest in the field, however, in providing embedded electronic components, such as electronic components to facilitate the use of dynamic security codes, in cards constructed of materials other than plastic, such as metal or ceramic; such constructions present unique manufacturing challenges. SUMMARY OF THE INVENTION Petition 870200039558, dated 03 / 26 / 2020, page 26 / 45 3 / 21

[0006] One aspect of the invention comprises a transaction card having a non-plastic core, such as metal or ceramic, which has first and second faces, a pocket defined by an opening in the first face, an empty space, and a pocket bottom. The non-plastic core could also be a non-plastic polymer, for example, as plastic is a specific type of polymer. Embedded electronic components, comprising at least one printed circuit board and a power source, are arranged in the empty space, with an EMI protection layer, such as ferrite, arranged between the electronic components and the pocket bottom (for a card with a metal core). The printed circuit board can be a flexible circuit board, for example. The power source does not necessarily require a battery, and can be RF power, for example.A cured resin layer is placed in contact with the first face and the embedded electronic components, and in portions of the empty space not occupied by the embedded electronic components, one or more layers are placed over the cured resin layer. The one or more layers may comprise a clear plastic layer, a magnetic strip, and a laser-reactive layer. For each embodiment, each of the one or more layers could comprise a layer of fiber-reinforced or glass-reinforced epoxy laminate sheet material. In some embodiments, the embedded electronic components may additionally include a display and a processor configured to generate a dynamic security code on the display. A through hole in the core connecting the second face to the bottom of the pocket may be provided, with contacts arranged in the through hole configured to be read by a card reader, and an integrated circuit module connected to the contacts.The core may have a coating on the second face and distinct markings on the coating. Markings may also be formed on at least one of the one or more layers laid over the cured resin layer, such as distinctive markings, laser-formed markings, or a combination thereof.

[0007] Another aspect of the invention comprises a process Petition 870200039558, dated 03 / 26 / 2020, p. 27 / 45 4 / 21 to make a transaction card defined by a plurality of layers defining a first portion and a second portion. The process comprises providing the first portion of the card comprising the core, forming the pocket in the core, and arranging the embedded electronic components in the empty space. A first resin component is applied to the first portion of the card in contact with the first face and the embedded electronic components are arranged in portions of the empty space not occupied by the embedded electronic components, and a second resin component is applied in contact with a second portion of the card. The first component and the second components are assembled together with the first resin component and the second resin component in contact with each other, and the resin is cured. The resin may comprise, for example, a two-part epoxy wherein the first resin component is different from the second resin component.The resin is not limited to a two-part epoxy, however, and in other embodiments may include, for example, a one-part epoxy, a heat-cured epoxy, a UV-cured epoxy, an anaerobic epoxy, and the like, without limitation. The resin curing step may comprise curing the resin at room temperature in a vacuum press. The curing step may involve UV-based curing, moisture-based curing, or temperature-based curing, for example. The second portion may have a plurality of layers; in this case, the process may include pre-laminating the plurality of layers together before applying the resin. In an embodiment where the core comprises metal, the process further comprises disposing a ferrite layer between the embedded electronic components and the bottom of the pocket.

[0008] Alternatively, in one aspect of the invention, before applying the two-part epoxy, a resin can first be delivered to the opening of the first portion of the card and in contact with the embedded electronic components. Once the resin has cured, the two-part epoxy can be applied to the first and second portions of the card, as described above. Petition 870200039558, dated 03 / 26 / 2020, page 28 / 45 5 / 21

[0009] The process may include marking a coating on the second face of the core as well as forming marks on one or more layers of the second portion, such as marking a clear plastic layer or creating laser-formed marks by exposing a laser-reactive layer to a laser. The process may additionally include forming a through hole in the first portion connecting the second face to the bottom of the pocket, arranging contacts in the through hole, and electrically connecting the contacts to an integrated circuit module. The plurality of layers of the second portion may include a carrier substrate that has an adhesive side and a non-adhesive side, a clear plastic layer, a magnetic strip, and a laser-reactive layer; in this case, pre-laminating the second portion may include contacting the adhesive side of the carrier substrate to one side of the clear plastic layer and laminating the laser-reactive layer to the clear plastic layer.

[0010] The process may involve assembling the plurality of layers that define the card as a composite comprising a plurality of sheets, each sheet defining one of the pluralities of layers and having an area greater than twice the area of ​​a single card; in this case, the process includes cutting a plurality of individual transaction cards from the composite. The individual transaction cards may be customized after cutting the card from the composite.

[0011] Another aspect of the invention comprises a transaction card comprising a non-plastic core having first and second faces, a core thickness between them, and an opening. Embedded electronic components are arranged in the opening. The embedded electronic components include indicators, which may be an LED or a display. One or more layers are arranged over the non-plastic core and the embedded electronic components. The one or more layers may be transparent or include openings so that the display is visible from the outside of the transaction card. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1A is a schematic illustration of a card. Petition 870200039558, dated 03 / 26 / 2020, page 29 / 45 6 / 21 exemplary according to an embodiment of the invention.

[0013] Figure 1B is a schematic illustration of an exemplary card according to an embodiment of the invention in which a layer of filling is confined to the pocket.

[0014] Figure 1C is a schematic illustration of an exemplary card according to an embodiment of the invention comprising a transfer tape.

[0015] Figure 1D is a schematic illustration of an exemplary card according to an embodiment of the invention implemented using a hot lamination process.

[0016] Figure 2 is a schematic diagram of embedded electronic components that may be found in a transaction card to provide dynamic security code functionality.

[0017] Figure 3 is a schematic diagram of an exemplary manufacturing process according to an embodiment of the invention.

[0018] Figure 4A and Figure 4B illustrate the front and top sides, respectively, of an exemplary card according to an embodiment of the invention.

[0019] Figure 5 is a schematic illustration of an exemplary card according to an embodiment of the invention.

[0020] Figure 6 is a block diagram representing an exemplary method for assembling the card in Figure 5.

[0021] Figure 7 represents a schematic illustration of an exemplary card according to another embodiment of the invention. DETAILED DESCRIPTION OF THE INVENTION

[0022] Referring now to Figure 1, an exemplary embodiment of the invention is shown. In this example, card 100 comprises what is sometimes referred to as a “laminated metal card”. Card 100 comprises a plurality of layers, and may include additional layers other than those described herein. Layer 110 comprises Petition 870200039558, dated 03 / 26 / 2020, pages 30 / 45 7 / 21 a metal core, comprising stainless steel, having an upper surface 111 and a rear surface 109. The metal core 110 may have a coating 113 forming the front surface 111 to support printing thereof.

[0023] Coating 113 may comprise, for example, a polyester-based coating that is receptive to UV-curable screen and inkjet inks. A resistance may be applied over this coating during any acid etching steps (such as if an etching step is used for any of the pockets as described later in this document). For example, the resistance is applied to the entire coated side 111 of the metal while the other side 109 is etched, and the etched side 109 receives the resistance except where pocket 112 (and any other pockets or surface patterns) is to be formed. After etching, the remaining resistance is removed from both sides and the part is ready for further fabrication.

[0024] Epoxy layer 108 abuts the lower surface of the metal core and may also completely or partially fill pocket 112. Layer 106 comprises an adhesive film layer, such as a clear polyester-based film having an adhesive, such as a copolymer adhesive, such as, but not limited to, an ethylene-acrylic acid (EEA) adhesive, on both sides 105 and 107. The invention is not limited to any type of adhesive or carrier substrate for such adhesive, however. Layer 104 may be a polymer or plastic layer, such as, for example, a clear amorphous copolyester film, such as Tritan™ film (available from Eastman Chemical) having a window 103 formed therein, and layer 102 may be a laser-reactive layer, such as laser-reactive PVC, in which a magnetic strip overlay may also be disposed. The window 103 104 could be cut or punched out of the layer during printing.In one exemplary embodiment, the metal core layer may have a thickness of 0.025 inches (0.635 mm), and each of the epoxy layers 108, adhesive layer 106, plastic layer 104, and laser-reactive layer 102. Petition 870200039558, dated 03 / 26 / 2020, page 31 / 45 8 / 21 can have a thickness of 0.002 inches (0.05 mm). The invention is not limited to any particular dimensions, although the resulting product is typically of a thickness that satisfies the standard thickness for transaction cards known in the art. The invention is also not limited to any particular materials of construction for the layers, or to the number of layers described in this example.

[0025] In an exemplary process for making the cards, blank cards are created from a sheet that has a sufficiently large area to allow a plurality of cards to be cut from the same sheet. For example, a sheet that is approximately 0.08 meters (8”) wide by 0.2 meters (20”) long, such as sheet 300 depicted in Figure 3, can support the creation of sixteen blank cards 314 in rows and columns with two cards wide by eight cards high. It should therefore be understood that although depicted as a sheet in Figure 3 and as individual cards in Figure 1, the sheet in Figure 3 can contain all of the layers in Figure 1 before cutting the sheet into individual blank cards.

[0026] In a first operation of an exemplary manufacturing process, four registration holes 310 are created in the blade 300. Then, sixteen pockets are formed on the back side of the blade, such as by engraving, etching, milling, or by any method known in the art, including the use of a standard CNC program. As depicted in Figure 1, the pockets can penetrate only to a depth A, which is less than the thickness B of the card by a sufficient amount to prevent deformation of the card pocket. For example, in an embodiment where the thickness of the card is approximately 0.025 inches (0.635 mm) (dimension “B” as shown in Figure 1), the depth of the pocket (dimension “A” as shown in Figure 1) can be only 0.019 inches (0.48 mm). The invention is not limited to any particular dimensions, however.

[0027] The 112 pockets as shown have a region Petition 870200039558, dated 03 / 26 / 2020, pages 32 / 45 9 / 21 relatively wider 112 and a relatively narrower region 116, and may have a through hole 114. The through hole may be allowed in the pocket to align a display to be viewed from the front of the card or for insertion of a payment module, comprising an integrated circuit (not shown) and contacts 410 (pictured in Figure 4A) for use in a card configured to be read by a contact card reader. In some embodiments, the through hole for the chip and contacts 410 (other aspects of the payment module) may not coincide with the pocket for embedding the PCB. The through hole for the payment module may be separate from the pocket 112, including being immediately adjacent to the pocket 112 such that the through hole 114 and the pocket 112 share a boundary, or be spaced from the pocket 112 with a portion of the core layer between.In other embodiments, the contacts and IC module may be inserted into a pocket that does not fully penetrate the card, such pocket being opened from the front of the card, wherein this pocket may not spatially overlap with pocket 112, or may only partially overlap. Contacts 410 may be part of a contact-only system or part of a dual interface (DI) system configured to be operated by a contact card reader or by an inductive (contactless) card reader. The relatively wider region 112 may be configured to receive a display and a processor to operate the display, while the narrower region 116 may be configured to receive an integrated circuit chip module, contacts, and any antenna(s) associated with a DI system. The through hole 114 may be created in a narrower region during or immediately after the pocket recording step, or this may be done later.

[0028] The printed material can then be printed on the front (coated) side 111 of the cards, as with an inkjet printer, or using any other printing technique known in the art.

[0029] An insert of electromagnetic interference (EMI) shielding layer 120, such as a ferrite layer, is prepared having the Petition 870200039558, dated 03 / 26 / 2020, pages 33 / 45 10 / 21 same geometry as the interior of pocket 312, such as cutting the insert of a ferrite blade comprising a layer of ferrite material arranged on one side of a plastic film (such as PET). The ferrite insert 120 is then selected and placed, either manually or robotically, and the coated side of the ferrite film is affixed to the pocket with an adhesive. Alternatively, the ferrite insert 120 can be attached to an inlay or a PCB (such as PCB 426) instead of the pocket 112. Regardless, the ferrite insert 120 is generally positioned between the pocket bottom and the electronic components 420.

[0030] In one embodiment, a carrier substrate may have ferrite disposed on one face of the substrate and adhesive on the other face, along with a release layer that is removed to expose the adhesive before insertion. Electronic components 420, such as those shown in Figure 4B and described herein later, such as a PCB 426 printed on a substrate and an attached display 424 (such as an electronic paper display, which requires very low power to operate) and power source 422, are then placed on top of the ferrite insert. The electronic components may be bonded in place. The bonding, as described herein in various embodiments, may be performed with any adhesive known in the art, such as, but not limited to, a pressure-sensitive, cyanoacrylate, or epoxy adhesive.

[0031] The electronic components 420 may comprise all, less than all, or entirely different components than those schematically illustrated in Figure 2, depending on the desired functionality of the card. For example, the components may include a keyboard for data input. Notably, the arrangement of the components as shown in Figure 4 are only exemplary, and for example, instead of the display 424 facing the back of the card, the card may have a through hole, and the display may be positioned facing the front of the card. The power source 422 may comprise a display or any other power source suitable for inclusion in a card, such as a photovoltaic cell, or a circuit. Petition 870200039558, dated 03 / 26 / 2020, pages 34 / 45 11 / 21 (for example, comprising a capacitor relay) that harvests electricity from radio frequency (RF) signals, as are known in the art. Methods for making PCBs suitable for insertion into a cardboard body, including PCBs comprising flexible substrates, are well known in the art and the invention is not limited to any particular type of PCB, or to any particular type of PCB functionality (nor to any particular functionality of the other electronic components). The EMI shielding layer materials are not limited to ferrite materials, and the insert may comprise any materials suitable for providing protection of the electronic components and antenna(s) from harmful interference posed by a metal core.Furthermore, although efficiently inserted by cutting an insert from a blade of ferrite-containing material and placing it in the pocket, in other embodiments, the EMI protection layer can be provided in some other way, such as by coating the active ingredient onto the bottom of the pocket.

[0032] The adhesive layer 106 and the plastic layer 104, which may have a window 103, the window being a hole cut in the layer or a transparent or translucent portion which is, for example, left unprinted or uncolored, or has a color by which the underlying display can be read properly, may be pre-laminated together, and the printed material may be printed on the plastic side of the pre-laminated layer thus formed. The adhesive side 105 of the adhesive film may have a release layer on it to protect it from contamination due to handling prior to coupling the adhesive side to the plastic layer before the pre-lamination step. In some embodiments, the plastic layer may comprise a layer having a primer or otherwise comprise a material suitable for adhering directly to the resin layer 108.

[0033] The pre-laminated composite 104 / 105 / 106 is then laminated to the laser-reactive PVC layer. A magnetic strip (403 depicted in Figure 4B) can be provided, as arranged as an overlay on the laser-reactive layer, with the laser-reactive combined layer composite. Petition 870200039558, dated 03 / 26 / 2020, pages 35 / 45 12 / 21 laser / magnetic strip covered with a release (not shown), before combining with the pre-laminated composite. Although depicted in Figure 4B as arranged in a location that does not intercept the embedded electronic components, the magnetic strip can be arranged over portions of the electronic components.

[0034] Epoxy, as a two-component clear epoxy resin system, is then applied, as by screen printing, with one component applied to the back side 109 of the metal layer (thus encapsulating the electronic components in the pocket) and the other components applied to the non-adhesive side 107 of the 104 / 105 / 106 pre-laminated composite, and the two epoxy-coated sides are assembled in contact with each other. An absence of air gaps / voids at the epoxy interface is important to maintain good peel resistance after joining. The assembly is then laminated, as by means of a cold lamination process using a vacuum press, which can help remove air gaps / spaces. The lamination and curing cycle of the epoxy can have a significant impact on the adhesion / peel resistance of the card.Although not limited to any particular lamination conditions, it has been shown that cold lamination curing of a 20-3401 epoxy at a constant pressure of approximately 103.4 kPa (15 psi) at room temperature (e.g., 23.8 to 25.5 degrees Celsius (75 to 78 degrees F)) for a duration of about 22 to 24 hours creates a board that passes the CQM 13.2.1.22 / TM-412 Peel Resistance Test using a 90-degree Adhesion Test, an ADMET® Single Column Adhesive, and a Peel Test System.

[0035] After 48 hours of additional epoxy curing following removal from the vacuum press, the 410 contacts of the attached chip module can then be inserted into the through hole or pocket designated to house the chip module (which hole or pocket can be created prior to core assembly to the other layers, or after creating that assembly at any time prior to chip module placement). As noted previously, the Petition 870200039558, dated 03 / 26 / 2020, pp. 36 / 45 13 / 21 A through hole or pocket to receive the payment module comprising contacts 410 may be located within pocket 112, adjacent to the pocket and having a common boundary with the pocket, or it may be a separate, discreet hole distanced from the pocket. Individual blank cards 314 are then cut from the blade 300. The blank cards are then ready for cleaning, inspection, and any further processing, including personalization. The personalization step, as it is known in the art, may include the step of exposing the laser-reactive layer to a laser to form, for example, a personalized laser-formed signature for a card retainer, and programming the embedded electronic components with information assigned to the card retainer.For example, in an embodiment with an integrated circuit module and contacts readable by a card reader (or a dual interface module configured for contactless reading), the chip can be programmed with unique information for the card retainer, as is well known in the art. The processor and / or memory associated with functional components for displaying the security code can also be provided with unique information for the card retainer as part of the personalization step.

[0036] In another exemplary process of making a card 150, illustrated in Figure 1B, electronic components can be adhered (as with adhesive) to pocket 112, then pocket 112 can be filled with epoxy 108A (without coating surface 109 of layer 111), and then one or more additional sheets can be cold-laminated (i.e., at ambient pressure, as described above) to the back surface 109 of the card. Therefore, as shown in Figure 1B, the epoxy 108 may not be coextensive with the length of the card, but may be confined to pocket 112.

[0037] Another alternative process for assembling a card, such as card 170 illustrated in Figure 1C, may comprise the use of a transfer tape instead of epoxy or some other resin. The transfer tape comprises an unsupported or supported adhesive 128 with a layer of Petition 870200039558, dated 03 / 26 / 2020, pages 37 / 45 14 / 21 release 127, 129 on both sides. An exemplary process comprises the steps of printing the back blade (layer 104) as double-sided printing in a roll-to-roll printing step, then rolling onto the transfer tape, removing the release layer 127 from one side, applying the transfer tape to the film 104, and leaving the release layer 129 on the opposite side. The printed layer 104 and the transfer tape assembly can then be pre-laminated. Layer 102 can then be a laminated exposure glass to the non-release side of the printed layer 104 and the transfer tape assembly. Layer 111 with embedded electronic components (which can be adhered to pocket 112) is then prepared as previously described, without applying epoxy to fill the pocket or to cover the back of layer 111.The release layer 129 is then removed from the 102 / 104 assembly and the assembly, with the transfer tape side facing blade 111, is applied to blade 111 with the electronics in the pocket. The assembly can then optionally be further processed, such as by subjecting the assembly to gentle vacuum compression to maximize adhesive contact with all surfaces and evacuate any air bubbles. Heat can also be applied to reduce the viscosity of the adhesive to improve its flowability. Applying heat, vacuum and / or compression may also cause unsupported adhesive to flow into the pocket to partially or completely fill gaps between the electronics and the pocket boundaries.

[0038] Yet another process for embedded electronic components, as shown in Figure 1D, may comprise a hot lamination process, for embedded electronic components designed to withstand the amount of heat and pressure present in that process. In a hot lamination process, layer 111 may be provided with the embedded electronic components adhered to pocket 112 as previously described, and the rest of the card 190 is constructed with multiple layers and adhesives and laminated under heat above temperature, pressure (a compressive force F applied to the stack), and / or vacuum environments (in a maintained environment). Petition 870200039558, dated 03 / 26 / 2020, pages 38 / 45 15 / 21 at a pressure V lower than atmospheric pressure, to facilitate the removal of any air trapped between the layers under lamination). Therefore, layer 138, mustard in Figure 1 D, represents one or more layers of polymer or plastic located between layer 104 and surface 109 of the core, wherein at least one layer closest to surface 109 may have a flowable state at a predetermined lamination temperature such that, under the compressive force F and / or in a vacuum environment, it will at least partially melt into and at least partially fill pocket 112 during lamination.

[0039] Figure 5 is a schematic illustration of a card. 500 according to an exemplary embodiment of the invention. The 500 card generally comprises a plurality of layers, which are shown exploded from one another.

[0040] Starting from the front face (i.e., chip side) of card 500, layer 502 comprises coated PVC, which may be 0.001 inches (0.02 mm) thick, for example. Layer 504 mounted to the underside of layer 502 comprises a glass-reinforced epoxy laminate material (e.g., FR4), which may be 0.004 inches (0.1 mm) thick, for example. Layer 506 mounted to the underside of layer 504 comprises an adhesive, such as in the form of high-performance double-sided adhesive tape, which may be 0.002 inches (0.05 mm) thick, for example. Both sides of the double-sided adhesive tape may be covered by a release layer, both of which are removed during the assembly process. A core layer 508 mounted to the underside of layer 506 comprises a non-plastic material such as metal. The metal could be 0.018 inches (0.457 mm) thick steel (such as stainless steel), for example.Layer 508 has a through hole or opening 510, in which electronic components 420 (described above) are positioned. Layer 512, mounted to the underside of layer 508, comprises a laminating adhesive, which may be 0.002 inches (0.05 mm) thick, for example, (and which may be of the same or different material as. Petition 870200039558, dated 03 / 26 / 2020, pages 39 / 45 16 / 21 layer 506). Layer 514 mounted to the underside of layer 512 comprises a polymer, which may be 0.004 inches (0.1 mm) thick, for example. Layer 516 mounted to the underside of layer 514 optionally comprises a PVC overlay, which may be 0.002 inches (0.05 mm) thick, for example (and which may be the same material as or different from layer 502). The magnetic stripe may be mounted on or embedded in layer 516. Layer 516 represents the back side (i.e., display side) of the 500 card. The peripheral dimensions of the various layers of the 500 card are substantially equivalent. The layers shown in Figure 5 and described above comprise only one exemplary embodiment, and any one of them may be optional in other embodiments, which may have fewer than all or more layers than those described above. The thicknesses indicated above are for example only.Cards corresponding to the present invention are not limited to any particular layers, material compositions, or thickness of such layers, although certain claimed embodiments and combinations may have distinct advantages.

[0041] The arrangement of the various layers can vary. For example, layers 502, 504, and 506 of the 500 card can be replaced by a second set of layers 516, 514, and 512. Such a card is useful for 420 electronic components that can handle a hot lamination process, as discussed later. As another example, layers 502 and 516 can be swapped so that layer 502 is on the back of the 500 card and layer 516 is on the front of the 500 card.

[0042] Layers 512, 514, and 516 are (optionally) transparent so that the display 424 of the electronic components 420 is visible from the back of the card. The display 424 can be, for example, a single LED light indicator or a display capable of displaying alphanumeric characters, as described above. In another embodiment, layers 502, 504, and 506 are (optionally) transparent so that the display 424 of the electronic components 420 is visible from the front of the card. Petition 870200039558, dated 03 / 26 / 2020, pages 40 / 45 17 / 21 Alternatively, all layers 502, 504, 506, 512, 514 and 516 are (optionally) transparent so that the display 424 of the electronic components 420 is visible from both sides of the card.

[0043] Figure 6 is a block diagram depicting an exemplary method 600 for assembling card 500 of Figure 5. Method 600 is not necessarily limited to any particular step or sequence of steps.

[0044] In exemplary method 600, in step 602, layer 502 is laminated to layer 504. The lamination in step 602 may be hot lamination involving heat and pressure. In step 604, the laminated layers 502 and 504 are bonded to the top surface of the double-sided tape layer 506 (i.e., after the release sheet is removed from layer 506). In optional step 606, text and graphics may be printed on layer 502. In optional step 608, text and graphics may be printed on layer 514. Step 608 may be completed before step 602 or vice versa. In step 610, layer 514 is laminated to layer 516. The lamination in step 610 may comprise hot lamination involving heat and pressure. As an alternative to step 610, layer 514 can be laminated to layer 516 and layer 508 in a single step using layer 512 laminating adhesive. In step 612, the 510 opening is formed in layer 508.In step 614, layers 514 and 516 are laminated to the underside of layer 508 using layer 512. Lamination in step 614 may involve hot rolling with heat and pressure. In step 616, electronic components 420 are positioned within the opening 510 that is formed in layer 508.

[0045] In step 618, the bonded layers 502, 504, and 506 are bonded to the upper side of layer 508 using the lower surface of the double-sided tape layer 506 (i.e., after the lower release sheet is removed from layer 506). Step 618 may preferably be a cold lamination step in which no significant heat or pressure is required; however, vacuum may be used. Method 600 preferably uses a cold lamination process in step 618 to avoid exposing the electronic components 420 to heat. Petition 870200039558, dated 03 / 26 / 2020, pages 41 / 45 18 / 21 and / or pressure.

[0046] For electronic components that can tolerate the hot lamination process, layers 502, 504, and 506 of the 500 card can be replaced by layers 516, 514, and 512, as noted above. To assemble such a card, the 420 electronic components are first placed in the opening 510; a first set of layers 516, 514, and 512 is hot laminated to one side of layer 508; and a second set of layers 516, 514, and 512 is then hot laminated to the other side of layer 508.

[0047] Figure 7 depicts an exploded view of a 700 card according to another exemplary embodiment. The 700 Card comprises a plurality of layers, and may include additional layers different from those depicted in this document. The layers have approximately the same maximum external dimensions along the A and B axes. Layer 702 comprises a metal core, such that it comprises stainless steel, which has a front surface 704 and a back surface 706. The thickness of layer 702 may be 0.018 inches (0.45 mm), for example. Layer 702 may have a coating on the front surface 704 to support printing on them.

[0048] Layer 702 has three cross openings 708a, 708b and 708c, each of which extends from the front surface 704 to the back surface 706. Opening 708c is positioned in the approximate center of the card and is substantially aligned along the geometric axis in the length direction “A” and geometric axis in the width direction “B”. Openings 708a and 708b flank each side of opening 708c. Each opening 708a, 708b, and 708c has a substantially rectangular or square shape with rounded inner corners. Opening 708c is larger than openings 708a and 708b. The size and shape of the openings may vary from what is shown and described. The openings may be provided in the form of pockets or blind holes, if desired.

[0049] Layer 703 is positioned below layer 702. A Petition 870200039558, dated 03 / 26 / 2020, pages 42 / 45 19 / 21 layer 703 is a printed circuit board (PCB) composed of FR4 material having a thickness of 0.004 inches (0.1 mm), for example. Layer 703 can be composed of, generally, glass-reinforced epoxy laminate material. Although not shown, layer 703 includes a plurality of traces, which may be composed of copper, for example, that are capable of transmitting electrical signals and current.

[0050] A payment module, in the form of chip 710, is mounted on the upper side of layer 703 and extends upwards. Chip 710 may form part of a dual interface (DI) system, as described above. In a card mounting form 700, chip 710 is positioned to be contained within opening 708a.

[0051] A fingerprint pad 712 is also mounted to the upper side 707 of layer 703 and extends upwards. The fingerprint pad 712 connects to the chip 710 via vias and / or traces (not shown) on layer 703. In one form of card mounting 700, the fingerprint pad 712 is positioned to be contained within the opening 708b.

[0052] A capacitive RF antenna 714 is mounted on the upper side 707 of layer 703 or embedded in layer 703. The antenna 714 is positioned in the approximate center of card 700 in an effort to conform to one or more compliance standards. The antenna 714 connects to chip 710 via vias and / or traces (not shown) in layer 703. In one form of card mounting 700, the antenna 714 is positioned along axes A and B to be aligned with aperture 708c. The antenna 714 may or may not project above the surface of layer 703. The antenna 714 consumes a large area in layer 703 in an effort to improve wireless performance.

[0053] An insert 705 is positioned within aperture 708c of layer 702 and resides above antenna 714 in layer 703. The insert 705 may be made of plastic having a thickness of 0.018 inches (0.45 mm), for example. The thickness of the insert 705 may be equal to the thickness of layer 704. The front surface 718 of the insert 705 may have a coating. Petition 870200039558, dated 03 / 26 / 2020, pages 43 / 45 20 / 21 to support printing on the same along with the front surface of layer 702. Alternatively, one or more plastic layers (not shown) can be applied over insert 705 and layer 702, and printing can be applied to the outermost layer. Plastic insert 705 is configured to allow RF flow emitted by antenna 714.

[0054] Although not shown, a small integrated circuit (IC) may also be mounted on the upper side of layer 703 (or on layer 703) to process signals transmitted between the fingerprint pad 712 and the chip 710. More specifically, the IC may verify fingerprints applied to pad 712. The IC may be connected to other components mounted to layer 703, and traces and / or vias may connect the IC chip to the other components of card 700. The components mounted to layer 703 may vary from what is shown and described. Components may include an IC, a Bluetooth module, a display, and so on.

[0055] Although an exemplary embodiment is described herein as having a metal core, it should be understood that similar constructions and manufacturing processes may be relevant to the creation of cards with a non-metal, non-plastic core, such as a ceramic core. A card with a ceramic core has the advantage of not requiring an EMI shielding layer, such as the ferrite layer described herein, or any of the process steps related to the placement or creation of the EMI shielding layer. The ceramic core can be made with any number of pockets and holes as required to house the electronic components by means of molding, machining, etching, or any method known in the art for creating such features in ceramic bodies. Methods for making a ceramic core are described in US Serial Application No. 15 / 521.519, entitled “CERAMIC-CONTAINING AND CERAMIC COMPOSITE TRANSACTION CARDS”, assigned to ordinary depositors of that application, and incorporated herein by reference. Although described with certain layers in this document, any portion of it. Petition 870200039558, dated 03 / 26 / 2020, pp. 44 / 45 21 / 21 cards may have fewer, more, or different layers than those described in this document, and each of the layers may have different materials of construction than those discussed in this document. The invention is not limited to any particular order of the layers or sequence of their assembly. Certain layers as described in this document may comprise composites of more than one material or layer of material. Additional layers may be arranged between any of the layers as disclosed in this document, either as part of the finished card, or as temporary layers (e.g., release layers) that are removed during the assembly process. The layers disclosed in this document as discrete films may instead be provided as coatings, and vice versa.

[0056] Although the invention is illustrated and described in this document with reference to specific embodiments, the invention should not be limited to the details shown. Instead, various modifications can be made to the details within the scope and reach of equivalents of the claims and without departing from the invention. Petition 870200039558, dated 03 / 26 / 2020, p. 45 / 45

Claims

1 / 8 CLAIMS 1. Transaction card (100, 500, 700) comprising: a non-plastic core (110, 508, 702) having a first (109, 704) and a second face (111, 706) and a core thickness between them, an opening in the first face and a pocket (112, 510) extending from the opening and having a bottom with a depth less than the core thickness; embedded electronics (420) disposed in the opening, the embedded electronics (420) comprising at least one printed circuit board and an active or passive power supply; a filler layer (108, 108A) in contact with the embedded electronics, disposed in the portions of the opening not occupied by the embedded electronics;one or more layers (102, 104, 106, 120, 512, 514, 516) arranged on the fill layer (108, 108A), the transaction card is characterized in that the core (110, 508, 702) further comprises a through hole (114, 510, 708a, 708b, 708c) connecting the second face (111) to the bottom of the pocket, contacts (410) arranged in the through hole (114, 510, 708a, 708b, 708c) configured to be read by a card reader and an integrated circuit module connected to the contacts (410).

2. Transaction card, according to claim 1, characterized in that one or more layers (102, 104, 106, 120, 512, 514, 516) comprise a polymer layer, a magnetic stripe and a laser-reactive layer.

3. Transaction card, according to claim 1, characterized in that the embedded electronic components further comprise a display (424) or an indicator and a processor configured to generate a dynamic security code on the display (424) or indicator. Petition 870250110230, dated 12 / 01 / 2025, page 10 / 43 2 / 8 4. Transaction card, according to claim 1, characterized in that the core (110, 508, 702) has a coating (113) on the second face (111) and printed indications on the coating (113).

5. Transaction card, according to claim 1, characterized in that it further comprises indications formed in at least one of the one or more layers (102, 104, 106, 120, 512, 514, 516) arranged on the fill layer (108, 108A).

6. Transaction card, according to claim 1, characterized in that the indications comprise printed indications, laser-formed indications or a combination thereof.

7. Transaction card, according to claim 1, characterized in that the non-plastic core (110) comprises metal, and the card further comprises a shielding layer against electromagnetic interference (EMI) (120) disposed in the empty space between the embedded electronic components and the bottom of the compartment.

8. Transaction card according to claim 7, characterized in that the EMI shielding layer (120) comprises ferrite.

9. Transaction card, according to claim 1, characterized in that the non-plastic core (110) comprises ceramic.

10. Transaction card according to claim 9, characterized in that the filler layer (108, 108A) comprises a cured resin.

11. Transaction card, according to claim 1, characterized in that the padding layer (108, 108A) is confined to the opening.

12. Transaction card according to claim 1, characterized in that the filling layer (108, 108A) extends over the first face of the non-plastic core (110). Petition 870250110230, dated 12 / 01 / 2025, page 11 / 43 3 / 8 13. Transaction card, according to claim 1, characterized in that the filler layer (108, 108A) comprises a transfer tape adhesive.

14. Transaction card, according to claim 1, characterized in that the filler layer (108, 108A) comprises a polymer that is in a fluid state at a predetermined lamination temperature.

15. Process for manufacturing a transaction card (100, 500, 700) of any of claims 1 to 14, characterized in that the process comprises the steps of: providing a first portion (110, 508, 702) of the card; forming an opening in the core (110, 508, 702); arranging embedded electronic components (420) in the opening; providing a second portion of the card, the second portion comprising a plurality of layers (102, 104, 106, 120, 512, 514, 516); filling (108, 108A) and fixing the first portion (110, 508, 702) of the card to the second portion of the card, further comprising the formation of a through hole (114, 510, 708a, 708b, 708c) in the core (110, 508, 702), the arrangement of contacts (410) in the through hole (114, 510, 708a, 708b, 708c) and the electrical connection of the contacts (410) to an integrated circuit module.

16. Process according to claim 15, characterized in that the steps of filling (108, 108A) and fixing the first portion (110, 508, 702) of the card to the second portion of the card comprise the substeps of: applying a first resin component to the first portion of the card in contact with the first face and the embedded electronic components; applying a second resin component in contact with the second portion of the card; Petition 870250110230, dated 12 / 01 / 2025, page 12 / 43 4 / 8 assembling the first and second components together, with the first and second resin components in contact with each other; curing the resin.

17. Process according to claim 15, characterized in that the resin comprises a two-component epoxy, wherein the first component of the resin is different from the second component of the resin.

18. Process according to claim 15, characterized in that the resin curing step comprises curing the resin by ultraviolet light, humidity or heating.

19. Process according to claim 15, characterized in that the resin curing step comprises curing the resin in a vacuum press.

20. Process according to claim 15, characterized in that the steps of providing the filler (108, 108A) and attaching the first portion to the second portion of the card comprise the substeps of: providing a transfer tape comprising unsupported adhesive disposed between a first release layer and a second release layer; removing the first release layer and attaching the adhesive to one of the following options: (i) the second portion of the card and (ii) the first face and embedded electronic components; and removing the second release layer and attaching the adhesive to the other of the following options: (i) the second portion of the card and (ii) the first face and embedded electronic components.

21. Process, according to claim 15, characterized in that the steps of supplying the filler material (108, 108A) and fixing the first portion to the second portion of the card comprise the substeps of: laminating the first portion to the second portion in a lamination process at a temperature above ambient temperature, wherein the filler material (108, 108A) comprises a portion of a fluid polymer layer disposed in the second portion, wherein the fluid polymer layer is fluid at the lamination temperature.

22. Process according to claim 15, characterized in that the steps of supplying the filler material (108, 108A) and fixing the first portion to the second portion of the card comprise the substeps of: applying a resin to at least one portion of the opening, wherein the resin does not extend beyond the opening; and curing the resin.

23. Process according to claim 22, characterized in that it further comprises laminating at least one sheet over the resin and the first portion of the cardboard.

24. Process, according to claim 15, characterized in that it further comprises fixing the electronic components in the opening before disposing of the filling material (108, 108A) in the opening.

25. Process according to claim 15, characterized in that the plurality of layers of the second portion comprises a transparent polymer layer, comprising the printing of indications on the transparent polymer layer.

26. Process according to claim 15, characterized in that the step of providing the second portion comprises the pre-lamination of the plurality of layers together before the application of the resin.

27. Process, according to claim 26, characterized in that the plurality of layers of the second portion comprises a support substrate with an adhesive side and a non-adhesive side, a transparent polymer layer, a magnetic strip and a laser-reactive layer, the pre-lamination step of the second portion comprising the contact of the adhesive side of the support substrate with one side of the transparent polymer layer and the lamination of the laser-reactive layer to the transparent polymer layer. Petition 870250110230, dated 01 / 12 / 2025, page 14 / 43 6 / 8 28. Process, according to claim 15, characterized in that it further comprises the arrangement of a coating (113) on a core surface (110, 508, 702) that allows printing on the coated surface.

29. Process according to claim 15, characterized in that the through-hole forming process (114, 510, 708a, 708b, 708c) is carried out before the assembly step of the first component and the second component.

30. Process according to claim 15, characterized in that the steps of filling (108, 108A) and fixing the first portion to the second portion of the card comprise the substeps of: applying a first resin to the opening of the card and over the embedded electronic components (420); curing the first resin; applying a first component of a second resin to the first portion of the card in contact with the first face and the embedded electronic components (420); applying a second component of the second resin in contact with the second portion of the card; assembling the first component and the second component together, with the first component of the second resin and the second component of the second resin in contact with each other; and curing the second resin.

31. Transaction card, according to any one of claims 1 to 14, characterized in that it further comprises a dual interface (DI) chip mounted or embedded in the non-plastic core (110, 508, 702).

32. Transaction card, according to claim 1, characterized in that one or more layers comprise a Petition 870250110230, dated 12 / 01 / 2025, page 15 / 43 7 / 8 layer of glass fiber reinforced epoxy laminate material.

33. Transaction card, according to claim 1, characterized in that it further comprises adhesive mounted between the central layer and one or more layers (102, 104, 106, 120, 512, 514, 516).

34. Transaction card, according to claim 1, characterized in that it further comprises adhesive mounted between the central layer and one or more layers (102, 104, 106, 120, 512, 514, 516).

35. Transaction card, according to claim 3, characterized in that one or more layers (102, 104, 106, 120, 512, 514, 516) are transparent, so that the display or indicator is visible from the outside of the transaction card.

36. Process, according to claim 15, characterized in that it further comprises a hot lamination step of one or more layers (102, 104, 106, 120, 512, 514, 516) to the first face of the card using heat, pressure or both.

37. Process according to claim 36, characterized in that the step of arranging electronic components embedded in the opening of the non-plastic core layer (110) is carried out after the lamination step.

38. Process, according to claim 37, characterized in that it further comprises a cold lamination step of one or more layers (102, 104, 106, 120, 512, 514, 516) to the second face of the card, wherein the cold lamination step is performed after the step of arranging the electronic components embedded in the opening of the non-plastic core layer (110) and wherein the cold lamination step comprises vacuum, adhesive or both vacuum and adhesive.

39. Transaction card, according to any one of claims 1 to 14, characterized in that it further comprises an antenna (714) which is substantially aligned with the opening in the non-plastic core (110); and Petition 870250110230, dated 12 / 01 / 2025, page 16 / 43 8 / 8 an insert disposed in the opening and positioned over the antenna (714).

40. Transaction card, according to claim 39, characterized in that the insert is made of plastic.

41. Transaction card, according to claim 39, characterized in that the non-plastic core (110) is composed of a polymer or a metal.

42. Transaction card, according to claim 39, characterized in that it further comprises additional components on the printed circuit board and additional openings in the non-plastic core (110), wherein the additional components are respectively positioned in the additional openings or aligned with them.

43. Transaction card, according to claim 39, characterized in that the maximum external dimensions in the longitudinal and transverse directions of the non-plastic core (110) and the printed circuit board are substantially equal. Petition 870250110230, dated 12 / 01 / 2025, page 17 / 43

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