Substrate using core with cavity embeding reduced height electrical device(s) and related integrated circuit (IC) packages and methods of fabrication
BR112025022427A2Pending Publication Date: 2026-09-15
0 Cites 0 Cited by
Patent Information
- Application Number
- BR112025022427
- Authority / Receiving Office
- BR · BR
- Patent Type
- Applications
- Publication Date
- 2026-09-15
Need to check novelty before this filing date? Find Prior Art
No text content released.