Embedded circuit board and fabrication method thereof, and electronic device

Abstract

This application discloses an embedded circuit board and a fabrication method thereof, and an electronic device. The embedded circuit board includes a main board, and the main board is provided with a blind cavity. A daughter board is provided in the blind cavity. A build-up board is provided on surfaces of the main board and the daughter board. The build-up board is provided with an interconnection region covering a surface of the daughter board. A third trace and a fourth trace perpendicular to the surface of the daughter board are provided in the interconnection region. A fifth trace is provided in the daughter board. The third trace, the fifth trace, and the fourth trace are electrically connected in sequence to form the interconnection trace. The interconnection trace is configured to connect a first component and a second component that are disposed on a surface of the build-up board.