Camera module

Abstract

The present invention relates to a camera module. The camera module includes a circuit board, a photosensitive chip, a package and a filter. The photosensitive chip is located on a surface of the circuit board and is electrically connected to the circuit board; the package is a hollow structure with two ends open, formed on the surface of the circuit board with the photosensitive chip, and fixes the photosensitive chip to the circuit board; the filter is located in one end of the package close to the circuit board, and is located on the surface of the photosensitive chip away from the circuit board. In the above-mentioned camera module, when the package is formed, the fixed connection between the photosensitive chip and the circuit board, and the fixed connection between the package and the circuit board are completed, which is very convenient for assembly. In addition, the filter is located in one end of the package close to the circuit board, and is located on the surface of the photosensitive chip away from the circuit board, which reduces the distance from the filter to the photosensitive chip, can effectively reduce the number of reflections of light from the filter to the photosensitive chip, and can effectively avoid the generation of light spots.

Description

Technical Field

[0001] The present invention relates to the field of camera technology, and in particular to a camera module. Background Art

[0002] In a traditional camera module, the circuit board and the photosensitive chip are usually fixedly connected by gluing, a bracket (equivalent to a package) is set on the circuit board by gluing, and finally a filter is set on the end of the bracket away from the circuit board by gluing. The assembly process is complicated. In addition, traditional camera modules are prone to light spots. Summary of the invention

[0003] Based on this, it is necessary to provide a camera module that is easy to assemble and can reduce the generation of light spots.

[0004] A camera module, comprising:

[0005] Circuit boards;

[0006] A photosensitive chip is located on a surface of the circuit board and is electrically connected to the circuit board;

[0007] The packaging body is a hollow structure with two ends opened, formed on the surface of the circuit board having the photosensitive chip, and fixes the photosensitive chip on the circuit board; and

[0008] The filter is located in one end of the packaging body close to the circuit board and is located on the surface of the photosensitive chip away from the circuit board.

[0009] In the above-mentioned camera module, when the package is formed, the fixed connection between the photosensitive chip and the circuit board and the fixed connection between the package and the circuit board are completed, which is very convenient for assembly. In addition, the filter is located in the end of the package close to the circuit board and is located on the surface of the photosensitive chip away from the circuit board, which reduces the distance from the filter to the photosensitive chip, can effectively reduce the number of reflections of light from the filter to the photosensitive chip, and can effectively avoid the generation of light spots.

[0010] In one of the embodiments, a spacer ring is further included. The spacer ring is located on the surface of the filter away from the photosensitive chip and is located on the periphery of the filter. The spacer ring is fixedly connected to the packaging body.

[0011] In one of the embodiments, it also includes a spacer ring, which is arranged on the surface of the photosensitive chip away from the circuit board and fixedly connected to the packaging body, and the filter is arranged on a side of the spacer ring away from the photosensitive chip.

[0012] In one of the embodiments, the light transmittance of the rubber spacer ring is greater than 96%.

[0013] In one embodiment, the cross-section of the rubber spacer ring is semicircular or square.

[0014] In one of the embodiments, in the direction from the circuit board to the photosensitive chip, the maximum thickness of the spacer ring is 0.05-0.20 mm.

[0015] In one embodiment, the filter is directly attached to the surface of the photosensitive chip away from the circuit board, and is fixed to the photosensitive chip by the packaging body.

[0016] In one of the embodiments, a rubber isolation layer is further included. The rubber isolation layer is located on the surface of the filter away from the photosensitive chip and is fixedly connected to the packaging body. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a structural schematic diagram of a camera module according to an embodiment;

[0018] Figure 2 is a structural schematic diagram of a camera module according to another embodiment;

[0019] Figure 3 is a structural schematic diagram of a camera module according to another embodiment;

[0020] Figure 4 A schematic structural diagram of a camera module according to another embodiment. DETAILED DESCRIPTION

[0021] The camera module is further described below in conjunction with the accompanying drawings and specific embodiments.

[0022] like Figure 1 As shown, a camera module 10 of one embodiment includes a circuit board 100 , a photosensitive chip 200 , a packaging body 300 , a filter 400 , a spacer ring 500 , a conductive wire 600 , an electronic component 700 and a lens 800 .

[0023] The photosensitive chip 200 is located on a surface of the circuit board 100 and is electrically connected to the circuit board 100. The package body 300 is a hollow structure with two ends open, and is formed on the surface of the circuit board 100 having the photosensitive chip 200. When the package body 300 is formed, the photosensitive chip 200 is fixed on the circuit board 100. The filter 400 is located in one end of the package body 300 close to the circuit board 100, and is located on the surface of the photosensitive chip 200 away from the circuit board 100.

[0024] In a conventional camera module, the circuit board and the photosensitive chip are usually first fixedly connected by gluing, then a bracket (equivalent to the package 300) is set on the circuit board by gluing, and finally a filter is set on the end of the bracket away from the circuit board by gluing. In the above-mentioned camera module 10, when the package 300 is formed, the fixed connection between the photosensitive chip 200 and the circuit board 100 and the fixed connection between the package 300 and the circuit board 100 are completed, which is very convenient for assembly. In addition, the filter 400 is located in the end of the package 300 close to the circuit board 100, and is located on the surface of the photosensitive chip 200 away from the circuit board 100, which reduces the distance from the filter 400 to the photosensitive chip 200, can effectively reduce the number of reflections of light from the filter 400 to the photosensitive chip 200, and can effectively avoid the generation of light spots.

[0025] Furthermore, in this embodiment, the filter 400 is directly attached to the surface of the photosensitive chip 200 away from the circuit board 100, and is fixed to the photosensitive chip 200 by the package 300. That is, when the package 300 is formed, the fixed connection between the filter 400 and the package 300 is completed, which is very convenient for assembly. The filter 400 is directly attached to the photosensitive chip 200, and it can be considered that the distance between the filter 400 and the photosensitive chip 200 is zero, which can minimize the number of reflections of light from the filter 400 to the photosensitive chip 200, and can effectively avoid the generation of light spots.

[0026] The package body 300 is usually formed by mold injection. In order to prevent the injection liquid from contaminating the filter 400 when the package body 300 is formed, a spacer ring 500 is provided. The spacer ring 500 is provided on the surface of the filter 400 away from the photosensitive chip 200, and the spacer ring 500 is located at the periphery of the filter 400. The spacer ring 500 is fixedly connected to the package body 300. When the package body 300 is formed by mold injection, the mold is connected to one end of the spacer ring 500 away from the filter 400, and the mold and the spacer ring 500 cooperate to effectively prevent the injection liquid from flowing onto the filter 400 and contaminating the filter 400.

[0027] Since part of the light reflected by the object passes through the lens 800, the spacer ring 500 and the filter 400 in sequence and is imaged on the photosensitive chip 200, in order to reduce the blocking of the light by the spacer ring 500, in this embodiment, the transmittance of the spacer ring 500 is greater than 96%.

[0028] In this embodiment, in order to further reduce the blocking of light by the rubber ring 500, the surface flatness of the surface of the rubber ring 500 exposed to the light area is less than 0.1 mm, thereby effectively avoiding the influence of diffuse reflection on the light. Preferably, the surface flatness of the surface of the rubber ring 500 exposed to the light area is 0.01 mm.

[0029] In this embodiment, the cross-sectional shape of the rubber spacer ring 500 is semicircular. Figure 2 As shown, in other embodiments, the cross-sectional shape of the rubber spacer ring 500 can also be a square. In the direction from the circuit board 100 to the photosensitive chip 200, the thickness of the square is equal everywhere, while the thickness of the semicircle gradually decreases. Compared with the square, the semicircle is more conducive to light propagation and can reduce the blocking of light by the rubber spacer ring 500.

[0030] Furthermore, in this embodiment, in the direction from the circuit board 100 to the photosensitive chip 200, the maximum thickness of the spacer ring 500 is 0.05-0.20 mm. This thickness can not only meet the requirements of having a good spacer effect, but also reduce the light blocking of the spacer ring 500.

[0031] like Figure 3 As shown, in other embodiments, in order to prevent the injection liquid from contaminating the filter 400 when forming the package 300, a rubber isolation layer 500a is provided. The rubber isolation layer 500a is located on the surface of the filter 400 away from the photosensitive chip 200 and is fixedly connected to the package 300.

[0032] Since the light reflected by the object passes through the lens 800, the rubber layer 500a and the filter 400 in sequence, and is imaged on the photosensitive chip 200, in order to reduce the blocking of the light by the rubber layer 500a, in this embodiment, the light transmittance of the rubber layer 500a is greater than 96%, and the surface flatness of the surface of the rubber layer 500a away from the filter 400 is less than 0.1mm. Preferably, the surface flatness of the surface of the rubber layer 500a away from the filter 400 is 0.01mm. The thickness of the rubber layer 500a is 0.10-0.20mm.

[0033] In addition, since the filter 400 is directly attached to the photosensitive chip 200, it is not conducive to quickly dissipating the heat generated by the photosensitive chip 200. In order to solve the above problem, in this embodiment, the thermal conductivity of the insulating layer 500a is greater than 80%, so that the heat generated by the photosensitive chip 200 can be quickly exchanged with the air at one end of the package body 300 away from the circuit board 100 through the insulating layer 500a, thereby avoiding the problem of excessive temperature of the photosensitive chip 200.

[0034] It should be noted that the principle of the plastic layer 500a to prevent the injection liquid from contaminating the optical filter 400 is that even if the injection liquid flows into the plastic layer 500a through the gap between the mold and the plastic layer 500a, it is relatively easy to remove the injection liquid from the plastic layer 500a without damaging the optical filter 400. However, when the injection liquid is on the optical filter 400, the optical filter 400 is easily damaged when the injection liquid is removed.

[0035] Preferably, the spacer ring 500 is combined with the spacer layer 500a, that is, after the spacer layer 500a is arranged on the surface of the filter 400 away from the photosensitive chip 200, the spacer ring 500 is arranged, so as to effectively prevent the filter 400 from being contaminated.

[0036] Furthermore, in this embodiment, the portion of the package body 300 between the filter 400 and the end surface of the package body 300 away from the circuit board 100 is the light entrance section, and the inner diameter of the light entrance section gradually increases in the direction from the circuit board 100 to the photosensitive chip 200. This can effectively increase the light flux, facilitate demoulding (a mold is required to form the package body 300, and demoulding is required after the package body 300 is formed), and facilitate centrifugal throwing of the cleaning liquid (after the package body 300 is formed, the cleaning liquid is required to clean the package body 300).

[0037] Furthermore, in this embodiment, the angle between the line between the two ends of the light-entering section and the Z axis (the direction from the circuit board 100 to the photosensitive chip 200) is 15 to 45 degrees, preferably 15 to 30 degrees, and more preferably 30 degrees. This can effectively increase the light flux, facilitate demoulding, and facilitate the centrifugal ejection of the cleaning liquid.

[0038] like Figure 4 As shown, in other embodiments, the rubber spacer ring 500 is disposed on the surface of the photosensitive chip 200 away from the circuit board 100, and is fixedly connected to the package body 300. The filter 400 is disposed on the side of the rubber spacer ring 500 away from the photosensitive chip 200. Thus, there is an air layer between the filter 400 and the photosensitive chip 200, which is convenient for dissipating the heat generated by the photosensitive chip 200 and preventing the photosensitive chip 200 from being overheated. The transmittance, shape, height and other characteristics of the rubber spacer ring 500 are the same as those described above and will not be repeated here.

[0039] The two ends of the conductive wire 600 are respectively connected to the circuit board 100 and the photosensitive chip 200, that is, in this embodiment, the circuit board 100 and the photosensitive chip 200 are electrically connected through the conductive wire 600. It can be understood that in other embodiments, the circuit board 100 and the photosensitive chip 200 can also be electrically connected by direct contact between electrical connection points. The conductive wire 600 is enclosed in the package body 300, that is, when the package body 300 is formed, the conductive wire 600 can be fixed, thereby effectively preventing the conductive wire 600 from loosening, that is, the circuit board 100 and the photosensitive chip 200 will not be disconnected. Specifically, the conductive wire 600 is a gold wire.

[0040] The electronic component 700 is located on the circuit board 100 and is electrically connected to the circuit board 100. The electronic component 700 is enclosed in the package body 300. That is, when the package body 300 is formed, the electronic component 700 can be fixed, which can effectively prevent the electronic component 700 from being loosened. Moreover, the electronic component 700 is enclosed in the package body 300, which can also prevent pollutants from contaminating the electronic component 700. The conductive wire 600 is located between the electronic component 700 and the photosensitive chip 200. The electronic component 700 is a device such as a resistor and a capacitor.

[0041] The lens 800 is disposed on an end surface of the package body 300 away from the circuit board 100 .

[0042] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0043] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A camera module, characterized in that: include: Circuit boards; A photosensitive chip is located on a surface of the circuit board and is electrically connected to the circuit board; The packaging body is a hollow structure with two ends opened, formed on the surface of the circuit board having the photosensitive chip, and fixes the photosensitive chip on the circuit board; as well as A filter, located in one end of the package body close to the circuit board, and located on the surface of the photosensitive chip away from the circuit board; The rubber isolation layer is located on the surface of the filter away from the photosensitive chip and is fixedly connected to the packaging body. The inner contour of the orthographic projection of the opening of the packaging body on the circuit board is located within the orthographic projection of the rubber isolation layer on the circuit board.

2. The camera module according to claim 1, characterized in that: It also includes a spacer ring, which is located on the surface of the filter away from the photosensitive chip and on the outer periphery of the filter, and is fixedly connected to the packaging body.

3. The camera module according to claim 1, characterized in that: It also includes a spacer ring, which is arranged on the surface of the photosensitive chip away from the circuit board and fixedly connected to the packaging body. The filter is arranged on a side of the spacer ring away from the photosensitive chip.

4. The camera module according to claim 2 or 3, characterized in that: The light transmittance of the rubber spacer ring is greater than 96%.

5. The camera module according to claim 2 or 3, characterized in that: The cross-sectional shape of the rubber spacer ring is semicircular or square.

6. The camera module according to claim 2 or 3, characterized in that: In the direction from the circuit board to the photosensitive chip, the maximum thickness of the adhesive ring is 0.05-0.20 mm.

7. The camera module according to claim 1, characterized in that: The filter is directly attached to the surface of the photosensitive chip away from the circuit board, and is fixed on the photosensitive chip by the packaging body.

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