Alignment of non-contact magnetostrictive sensors

Abstract

This invention provides systems, methods, and apparatus for positioning, orienting, and / or aligning stress sensor assemblies. A raw stress signal corresponding to stress in a target can be generated by detecting magnetic flux traveling through the target. The raw stress signal can be sensitive to the alignment of the sensor relative to the target. To minimize measurement error, the stress sensor can be properly aligned relative to the target before measuring the stress. Aligning the sensor may involve adjusting the yaw, pitch, and / or roll of the sensor, measuring the raw stress signal, attenuating the detected magnetic flux, and measuring the raw stress signal again. After the stress sensor is properly aligned, changes in the size of the gap between the sensor and the target surface can cause approximately equal changes in the raw stress signal.

Description

Background Technology

[0001] Ferromagnetic materials can possess magnetostrictive properties, which allow them to change shape in the presence of an applied magnetic field. The reverse is also true. When stress is applied to a conductive material, the material's magnetic properties, such as magnetic permeability, can change. Magnetostrictive sensors are non-contact sensors that can include a sensing element configured to sense changes in magnetic permeability. Because the change in magnetic permeability is proportional to the stress applied to the conductive material, the resulting measurement can be used to calculate the stress.

[0002] However, the change in permeability caused by applying stress to a conductive material can be very small. To facilitate the measurement of such small permeability changes, it may be necessary to account for measurement errors caused by the gap distance between the sensing element of the magnetostrictive sensor and the target when calculating the stress applied to the target. As an example, the magnetostrictive sensor can be manually aligned with the target, and this gap distance can be set using an instrument. However, this manual alignment may result in variations in the gap between the target and each sensing element, and therefore may not be properly compensated for. Summary of the Invention

[0003] This invention provides systems, apparatus, and methods for aligning a stress sensor relative to a target. In one aspect, a sensor assembly is provided, comprising a sensor and an attenuation element. The sensor may include a driving element configured to generate a first magnetic field and a corresponding first magnetic flux. The first magnetic flux may pass through a first gap distance between the driving element and a target surface, and then through the target. The sensor may further include at least one detection element configured to detect a portion of the first magnetic flux. The attenuation element may be configured to allow selective adjustment of the detected portion of the first magnetic flux without requiring axial translation of the sensor relative to the target.

[0004] The sensor assembly can be varied in several ways. For example, the position of the attenuation element can be adjusted relative to the sensor, such that changing the position of the attenuation element alters the detected portion of the first magnetic flux. As another example, the attenuation element can be a sleeve disposed around the sensor, and the sensor assembly can be configured to increase the attenuation as the attenuation element moves toward the target. As yet another example, the attenuation element can be a plate disposed between the sensor and the target.

[0005] In one embodiment, an attenuation element may be disposed around at least a portion of the sensor. The attenuation element may include at least one conductive element configured to generate a second magnetic field that can interact with a portion of the first magnetic field, thereby modulating the magnitude of the detected portion of the first magnetic flux. In some aspects, the second magnetic field may be generated by alternating current flowing through the at least one conductive element. The second magnetic field can attenuate a portion of the first magnetic field, thereby attenuating the detected portion of the first magnetic flux. In some embodiments, at least one conductive element of the attenuation element may be configured to couple to the first magnetic field. The sensor assembly may also include a resistor that may be coupled in parallel with the conductive element. The resistance of the resistor may be variable, such that adjusting the resistance of the resistor can adjust the magnitude of the second magnetic field, thereby adjusting the magnitude of the detected portion of the first magnetic flux. Furthermore, the attenuation element may be configured to attenuate the detected portion of the first magnetic flux more progressively as the resistance of the resistor decreases.

[0006] In some embodiments, at least one conductive element of the attenuation element can be configured to receive a selectively adjustable alternating current attenuation signal to generate alternating current flowing through the at least one conductive element. The attenuation element can be configured to attenuate a detected portion of the first magnetic flux when the phase of the second magnetic field is out of phase with the phase of the first magnetic field. The attenuation element can be configured to amplify a detected portion of the first magnetic flux when the phase of the second magnetic field is in phase with the phase of the first magnetic field.

[0007] In some implementations, the driving element can be configured to receive an input driving signal to generate a first magnetic flux. The attenuation element can be configured to receive the original input driving signal and use it to generate an input driving signal that can be received by the driving element. The attenuation element may include a resistor. This resistor can be configured to control the magnitude of the input driving signal, thereby controlling the magnitude of the first magnetic flux. The resistance of the resistor can be configured to be adjustable, such that increasing the resistance of the resistor decreases the magnitude of the input driving signal, thereby decreasing the magnitude of the first magnetic flux and reducing the magnitude of the detected portion of the first magnetic flux.

[0008] In other embodiments, the sensor assembly may further include at least one LED indicator configured to output a signal regarding the alignment of the sensor relative to a desired alignment. The at least one LED indicator may include a first LED indicator, a second LED indicator, and a third LED indicator, corresponding to yaw, pitch, and roll values ​​of the sensor position, respectively. As an example, the first, second, and third LED indicators may be configured to output light whose brightness changes as yaw, pitch, and roll adjust towards the desired values. As another example, the first, second, and third LED indicators may be configured to output light whose color changes as yaw, pitch, and roll adjust towards the desired values. As yet another example, the first, second, and third LED indicators may be configured to flash at varying frequencies as yaw, pitch, and roll adjust towards the desired values.

[0009] In another aspect, a method for aligning a sensor assembly is provided. The method may include activating a control and processing module to transmit an input drive signal to a drive element of a sensor in the sensor assembly, thereby generating a first magnetic field having a corresponding first magnetic flux passing through a target. At least one detection element can detect a portion of the first magnetic flux. The method may further include adjusting the detected portion of the first magnetic flux and rotating the sensor about at least one of three axes: rotating about a first axis to adjust the yaw of the sensor relative to the target; rotating about a second axis to adjust the pitch of the sensor; and rotating about a third axis to adjust the tumble of the sensor.

[0010] This method can be varied in several ways. For example, the method may include adjusting the position of the attenuation element to attenuate a detected portion of the first magnetic flux. Moving the attenuation element toward the target can adjust the attenuation of the detected portion of the magnetic flux.

[0011] In one embodiment, the method may include coupling a first magnetic field to a conductive element of an attenuating element to induce an alternating current that can flow through the conductive element, causing the conductive element to generate a second magnetic field. This second magnetic field attenuates the first magnetic field, thereby regulating the detected portion of the first magnetic flux by attenuating that portion. Adjusting the resistance of the resistor coupled to the conductive element can regulate the amount of attenuation of the detected portion of the first magnetic flux.

[0012] In another embodiment, the method may include transmitting a selectively adjustable alternating current attenuation signal to a conductive element of the attenuation element, thereby generating alternating current flowing through the conductive element, causing the conductive element to generate a second magnetic field. The amplitude, phase, and frequency of the selectively adjustable alternating current attenuation signal can define the amplitude, phase, and frequency of the second magnetic field. The method may further include adjusting the amplitude of the alternating current attenuation signal, thereby adjusting the amplitude of the second magnetic field. The detected portion of the first magnetic flux can be adjusted by attenuating a portion of the first magnetic flux when the phase of the second magnetic field is out of phase with the phase of the first magnetic field.

[0013] As another example, the method may include transmitting a raw input drive signal to an attenuation element to generate an input drive signal. The method may also include adjusting the resistance of a resistor in the attenuation element to adjust the magnitude of the input drive signal, thereby adjusting the magnitude of a first magnetic flux and the magnitude of a detected portion of the first magnetic flux.

[0014] In some implementations, the yaw, pitch, and roll of the sensor can be adjusted based on the output from at least one LED indicator on the sensor assembly. This output can be the light intensity from the at least one LED indicator. This output can be the color of the light from the at least one LED indicator. This output can be the flashing frequency of the light from the at least one LED indicator. Attached Figure Description

[0015] Figure 1A This is a side view of one implementation of the sensor system;

[0016] Figure 1B yes Figure 1A A perspective view of an implementation of the sensor head of a sensor system;

[0017] Figure 2A This is a bottom perspective view of an exemplary embodiment of a sensor assembly, which includes... Figure 1B The sensor head and attenuation components;

[0018] Figure 2B yes Figure 2A A partial cross-sectional view of the side of the sensor assembly, with the attenuation element located on the nearest side;

[0019] Figure 2C yes Figure 2B A partial cross-sectional view of the side of the sensor assembly, with the attenuation element located at the farthest side;

[0020] Figure 3A This is an exemplary graph of the original stress signal as it decays before the initial alignment of the sensor;

[0021] Figure 3B This is an exemplary graph of the raw stress signal after the initial alignment of the sensor assembly;

[0022] Figure 3C This is an exemplary graph of the raw stress signal after the sensor's yaw has been aligned;

[0023] Figure 3D This is an exemplary graph of the original stress signal as it decays after the sensor has been aligned in pitch and roll.

[0024] Figure 4 This is a partial cross-sectional view of a side view of another exemplary embodiment of a sensor assembly, which includes an attenuation element in the form of a plate.

[0025] Figure 5A This is a perspective view of an exemplary embodiment of an attenuation element that can cause a variable attenuation of the detected magnetic flux;

[0026] Figure 5B yes Figure 5A Another perspective view of the attenuation element shown, with the housing of the attenuation element removed;

[0027] Figure 6 This is a partial cross-sectional view of a side view of an exemplary embodiment of a sensor assembly, which includes... Figures 5A to 5B The attenuation element shown;

[0028] Figure 7 This is a partial cross-sectional view of a side view of another exemplary embodiment of a sensor assembly, which includes an attenuation element that can be used to selectively change the input drive signal transmitted to the drive element.

[0029] Figure 8 This is a top view of an exemplary embodiment of a sensor, which includes multiple indicators for providing information about the sensor's alignment relative to a target; and

[0030] Figure 9 This is a top view of another exemplary embodiment of the sensor, which includes multiple indicators for providing information about the alignment of the sensor relative to a target. Detailed Implementation

[0031] Certain exemplary embodiments will now be described to facilitate a comprehensive understanding of the structure, function, use, and various principles of the manufacturing processes of the systems, apparatuses, and methods disclosed herein. One or more examples of these embodiments are illustrated in the accompanying drawings. Those skilled in the art will understand that the systems, apparatuses, and methods specifically described herein and illustrated in the accompanying drawings are non-limiting exemplary embodiments, and the scope of the invention is defined only by the claims. Features shown or described in conjunction with one exemplary embodiment may be combined with features of other embodiments. Such modifications and variations are intended to be included within the scope of the invention. Furthermore, in this disclosure, similarly named components of embodiments generally have similar characteristics, and therefore, within a specific embodiment, not every characteristic of each similarly named component may be described in complete detail.

[0032] This invention provides systems, methods, and apparatus for positioning, orienting, and / or aligning stress sensors relative to a structure to be monitored. It may be desirable to monitor certain components, such as the shaft of a turbine, to ensure that the component operates within its proper operating range. One method for monitoring such components is to use a stress sensor to sense stress within a material. The stress sensor can generate a magnetic flux that can pass through the component and can be detected by the detection element of the stress sensor. Magnetic flux is a measure of the total magnetic field passing through a given area. It is a useful tool to help describe the effect of a magnetic field on an object occupying a given area. For example, when stress is applied to a conductive material, the magnetic flux through that material may be affected. The magnetic flux can pass through the detection element and thus can be detected. The detection element can generate a raw stress signal corresponding to the magnitude of the detected magnetic flux. These raw stress signals can be signals generated by the detection element due to the detected magnetic flux, such as current and / or voltage. To minimize measurement error, the stress sensor can be aligned relative to the component before measuring the stress. For example, after the stress sensor is properly aligned, a change in the size of the gap between the sensor and the target surface can cause approximately equal changes in the original stress signals output from the various detection elements that the stress sensor may have, where these original stress signals correspond to stress values ​​in the target. If the size of the gap changes, the original stress signals from each of the various detection elements may change by significantly different amounts, potentially leading to inaccurate stress measurements. Therefore, the original stress signals output from these detection elements can be used to align the stress sensor.

[0033] In some cases, aligning a stress sensor may involve changing the size of the gap between the sensor and the target, and adjusting the sensor's yaw, pitch, and / or roll until the change in the size of the gap between the sensor and the target surface causes a substantially equal change in the original stress signal. A more detailed description of this alignment process can be found in U.S. Patent Application No. 15 / 378,503, filed December 14, 2016, entitled "Non-Contact Magnetostrictive Sensor Alignment Methods and Systems," which is incorporated herein by reference in its entirety. However, such alignment may require fine-tuning the size of the gap between the stress sensor and the target, which can be difficult to achieve.

[0034] Therefore, systems and methods are provided for aligning stress sensors without adjusting the size of the gap between the stress sensor and the target. In some embodiments, this is achieved by attenuating the detected magnetic flux that generates the original stress signal. Attenuating this detected magnetic flux can simulate adjusting the size of the gap between the sensor and the target. Thus, by adjusting the yaw, pitch, and / or roll of the sensor, the sensor can be aligned with the target without causing any significant axial translation of the sensor relative to the target to adjust the size of the gap between the sensor and the target.

[0035] Figure 1A An exemplary embodiment of a sensor system 100 is illustrated, which can be used to detect stresses applied to a target, such as torque, bending, and / or axial loads. Generally, the sensor system 100 may include a sensor 102, which may be received within a sensor mounting assembly or mounting bracket 150 and positioned close to surface 126 of a target 110 to be detected, such as a rotatable shaft. As an example, the target 110 may rotate about axis A1, as indicated by arrow B1. The sensor mounting assembly 150 facilitates adjustment and / or maintenance of the position of the sensor 102 relative to the target 110. Figure 1AAs shown, mounting bracket 150 can be coupled to extension arm 155, which in turn can be coupled to rigid support 159. Mounting assembly 150 facilitates proper alignment of sensor 102 relative to target 110 and maintains proper orientation and alignment of sensor 102 relative to target 110. Sensor 102 can send signals to and receive signals from control and processing module 106 for measurement. These signals can be, for example, voltage and / or current signals. Embodiments of sensor 102 are described in more detail in U.S. Patent Application No. 15 / 598,062, filed May 17, 2017, entitled “Non-Contact Magnetostrictive Sensor with Gap Compensation Field,” which is incorporated herein by reference in its entirety.

[0036] like Figure 1A As shown, sensor 102 may include a housing 103 having a proximal portion 105 and a distal portion 107. In some embodiments, the proximal portion 105 may be made of, for example, stainless steel, aluminum, or another metal, while the distal portion 107 may be made of a non-conductive material, such as ceramic, or a moldable, processable polymer. Sensor 102 may include a sensor head disposed within the housing 103. The sensor head may include a driving element and at least one detection element, wherein the detection element may be disposed within the distal portion 107 of the housing 103.

[0037] Figure 1B An embodiment of the sensor head 104 is shown. The sensor head 104 may include a support member 112 having four support rods 114a, 114b, 114c, 114d, each support rod extending outward from the support member (e.g., along axes X1, Y1). The support rods 114a, 114b, 114c, 114d may have detection arms 116a, 116b, 116c, 116d extending distally from the support rods toward the target 110 (e.g., in the direction of axis Z1). The support member 112 may also include a central arm 118 extending distally toward the target 110 along the central axis Z1.

[0038] like Figure 1BAs shown, the sensor head 104 can be positioned above the surface 126 of the target 110, and a gap G1 exists between the distal end of the central arm 118 and the surface 126 of the target 110. Similarly, each of the detection arms 116a, 116b, 116c, and 116d can have corresponding gaps G1a, G1b, G1c, and G1d between their distal ends and the surface 126 of the target 110 in a direction parallel to the axis Z1. In some embodiments, the number of support rods and / or detection arms can be four as shown, or more or fewer than four.

[0039] like Figure 1B As shown, the first pair of sensing elements 122a and 122c can extend along and define axis X1, and the second pair of sensing elements 122d and 122b can extend along and define axis Y1, wherein axis Y1 can extend orthogonally to axis X1. The pitch and roll of sensor head 104 can be independently adjusted by rotating it about axes X1 and Y1, as indicated by arrows P1 and R1. The yaw of sensor head 104 can be adjusted by rotating it about axis Z1, as indicated by Yaw1.

[0040] The sensor head 104 may further include a drive subsystem having a drive element 120 located on a central arm 118 of the support 112. The drive element 120 and the detection elements 122a, 122b, 122c, 122d may each be made of an electrical conductor (e.g., copper wire). For example, one or more segments of copper wire may be wound around the arms 118, 116a, 116b of the support 112 to form the drive element 120 and the detection elements 122a, 122b, 122c, 122d. The drive element 120 may receive an input drive signal from the control and processing module 106 to generate a magnetic flux corresponding to the magnetic field. This input drive signal may be, for example, an alternating current (AC) signal. The AC current corresponding to the input drive signal may flow through the drive element 120. The current flowing through the drive element 120 may generate a magnetic field and a corresponding magnetic flux. The magnetic flux may travel from the drive element 120 through the target 110 and may be detected by a first pair of detection elements and a second pair of detection elements. Then, detection elements 122a, 122b, 122c, and 122d can generate raw stress signals based on the detected magnetic flux. These raw stress signals can be transmitted to the control and processing module 106 and can be used to determine the stress value within the target 110. These raw stress signals can be current signals or voltage signals. The amplitude and phase of these voltage and / or current signals can be measured. Additional details regarding the drive subsystem and drive element 120 can be found in U.S. Patent Application No. 15 / 598,062.

[0041] Although the detected change in magnetic flux can correspond to a change in the stress state of target 110, the detected magnetic flux may also be sensitive to the position and orientation of sensor head 104 relative to surface 126 of target 110. As an example, the original stress signal corresponding to the detected magnetic flux can vary with the stress state of target 110 and the size of gap G1. For instance, as the size of gap G1 increases, the magnitude of the magnetic flux detected by the detected elements 122a, 122b, 122c, and 122d can decrease. Therefore, in some embodiments, a proximity sensor element can be used to determine the size of gap G1, allowing the original stress signal to be corrected based on the size of gap G1, and a corrected stress signal to be determined.

[0042] The value of the raw stress signal can also be sensitive to the alignment and positioning of sensor 102 and / or sensor head 104 relative to target 110. The raw stress signal can vary with the size of the gaps G1a, G1b, G1c, G1d between the distal ends of the detection arms 116a, 116b, 116c, 116d and the surface 126 of target 110. As an example, for a given gap G1, gaps G1a, G1b, G1c, G1d can have different sizes. In one embodiment, as the size of gap G1a increases, the value of the raw stress signal from detection element 122a can decrease. Therefore, aligning sensor 102 and / or sensor head 104 relative to target 110 may be advantageous.

[0043] During normal operation, sensor 102 and / or target 110 may be subjected to disturbances, which may cause a change in the size of gap G1. After sensor 102 is properly aligned, this change in gap G1 can cause approximately equal variations in the original stress signals output from the various sensing elements 122a, 122b, 122c, 122d. This approximately equal variation in the original stress signals allows each of the original stress signals to be corrected in the same manner to compensate for the change in gap G1 size. Therefore, proper sensor alignment can compensate for manufacturing inconsistencies that may cause differences in the magnetic flux values ​​detected by each of the sensing elements 122a, 122b, 122c, 122d, correct for variability in the user's placement of sensor 102 relative to target 110, and allow for consistent correction of the original stress signals to variations in gap G1 size. The existing technology for aligning the stress sensor 102 involves changing the size of the gap G1 and adjusting the yaw, pitch, and roll of the sensor 102 until the change in the size of the gap G1 causes approximately equal changes in the original stress signals from the detection elements 122a, 122b, 122c, and 122d.

[0044] In some cases, sensor 102 can be aligned using a mounting bracket, such as mounting bracket 150. However, using a bracket to align sensor 102 may require the bracket to precisely adjust the size of the gap G1 between sensor 102 and target 110. Accordingly, sensor 102 can be aligned without adjusting the size of the gap G1 between sensor 102 and target 110. As discussed in more detail below, instead of physically adjusting the size of gap G1 during the sensor alignment process, the magnetic flux detected by the sensed elements 122a, 122b, 122c, 122d can be attenuated to simulate the adjustment of the gap G1 size. Therefore, sensor 102 can be rotated relative to target 110 to adjust the yaw, pitch, and roll of sensor 102 without causing a significant translation of sensor 102 relative to target 110. Thus, the size of gap G1 can remain substantially constant during alignment. In some embodiments, only the yaw, pitch, and roll of sensor 102 are adjusted.

[0045] movable attenuation element

[0046] Figures 2A to 2C An embodiment of a sensor assembly 201 is shown, configured to selectively attenuate magnetic flux detected by a detected element using mechanically adjustable attenuation elements. Sensor assembly 201 can be used within a sensor system, such as sensor system 100, and may include a sensor 202 and one or more attenuation elements 260, wherein the sensor may be generally similar to sensor 102, and the attenuation elements facilitate proper alignment of sensor head 104 relative to target 110. As shown, attenuation element 260 may be in the form of a cylindrical sleeve and may include a first part 260a and a second part 260b. Each part 260a, 260b of attenuation element 260 may include a radially inwardly extending rim 262 such that the rim 262 can be positioned between a proximal stopping element 254 and a distal stopping element 256, which may be disposed around the proximal portion 205 of the housing 203 of sensor 202. The proximal stop element 254 and the distal stop element 256 can respectively restrict the movement of the attenuation element 260 on the proximal and distal sides. In some embodiments, the proximal stop element 254 and the distal stop element 256 can be disposed around the distal portion 207 of the housing 203. The attenuation element 260 can be made of a material with high magnetic permeability. Examples of such materials include, but are not limited to, ferromagnetic materials (e.g., iron, steel), silicon, nickel, cobalt, etc.

[0047] Sensor 202 may include sensor head 104. Sensor 202, and therefore sensor head 104, may be positioned above surface 126 of target 110, with a gap G1 between the distal end 128 of the central arm 118 and surface 126 of target 110. As an example, sensor assembly 201 may initially be positioned within a support (e.g., support 150) and may be mechanically aligned (e.g., using a V-block) to achieve initial alignment between sensor assembly 201 and target 110. As described above, drive element 120 may receive input drive signals from a control and processing module, such as control and processing module 106, to generate a magnetic flux 240 corresponding to a magnetic field, such as... Figures 2B to 2C As shown.

[0048] like Figure 2B As shown, magnetic flux 240 can travel from drive element 120 through target 110 and can be detected by detection elements 122a, 122b, 122c, and 122d, which can generate raw stress signals based on the detected magnetic flux. The alignment process may involve adjusting the yaw, pitch, and roll of the sensors so that changes in the size of the gap G1 between the sensors cause approximately equal changes in the raw stress signals output from detection elements 122a, 122b, 122c, and 122d.

[0049] As the attenuation element 260 moves toward the distal side ( Figure 2C The magnetic field corresponding to the magnetic flux 240 can begin to couple with the attenuation element 260. Therefore, this coupling can create a flow path or preferred flow path for a portion 241 of the magnetic flux 240, thereby reducing the amount of magnetic flux 240 detected by the detected elements 122a, 122b, 122c, and 122d, and reducing the corresponding original stress signal that can be generated. The amount of attenuation can vary depending on the position of the attenuation element 260. That is, the amount of magnetic flux 240 241 relative to the total magnetic flux 240 can vary. Therefore, the attenuation element 260 can be configured to allow selective adjustment of the detected portion of the magnetic flux 240 without axially translating the sensor 202 relative to the target 110. As an example, when the attenuation element 260 is in the closest side position, the edge 262 of the attenuation element 260 can be adjacent to the side stop element 254, such as... Figure 2B As shown, the magnetic flux 240 detected by the detected elements 122a, 122b, 122c, and 122d may attenuate by only a very small amount, or not attenuate at all. When the attenuation element 260 is in its farthest position, its edge 262 can be adjacent to the far-side stop element 256, as shown. Figure 2CAs shown, the magnetic flux detected by the detected elements 122a, 122b, 122c, and 122d can be significantly attenuated. Therefore, as the attenuation element 260 moves to the far side, the attenuation can increase due to the increased coupling between the magnetic field and the attenuation element 260, thereby simulating an increase in the size of the gap G1.

[0050] The yaw of sensor assembly 201, and thus sensor head 104, can be adjusted to reduce the difference between the original stress signals from the first pair of detection elements 122a, 122c and the original stress signals from the second pair of detection elements 122b, 122d, which varies with the amount of attenuation. As an example, the attenuation element 260 can be placed at a selected position from the nearest to the farthest side, then the yaw can be adjusted, and the original stress signal can be measured. The attenuation element 260 can then be moved further away and / or closer to adjust the attenuation, and the original stress signal can be measured again. This process can be repeated until the difference between the original stress signals from the first pair of detection elements 122a, 122c and the original stress signals from the second pair of detection elements 122b, 122d, which varies with attenuation, has been reduced by a desired amount (e.g., less than a threshold difference). In some embodiments, the yaw of sensor assembly 201 can be adjusted by rotating sensor assembly 201 within the holding element of bracket 150.

[0051] The pitch and roll of the sensor assembly 201 can be adjusted to further reduce the differences in the original stress signals from the detection elements 122a, 122b, 122c, and 122d that vary with the amount of attenuation. This can be achieved by rotating the sensor assembly 201 about axes X1 and Y1 (e.g., Figure 1B The arrows P1 and R1 shown in the diagram are used to independently adjust the pitch and roll of the sensor assembly.

[0052] The bracket 150 allows the user to adjust the pitch of the sensor assembly 201 while keeping its roll constant or substantially constant, and vice versa. Adjusting the pitch of the sensor assembly 201 changes the relative dimensions of gaps G1b and G1d. For example, by increasing the size of gap G1b, gap G1d can be decreased by a corresponding amount, while G1a and G1c remain nominally unchanged. Therefore, detection element 122b can move away from the surface 126 of target 110 in the proximal direction, and detection element 122d can move towards the surface 126 of target 110 in the distal direction. Alternatively, the size of gap G1b can be decreased, and the size of gap G1d can be increased by a corresponding amount. Therefore, detection element 122b can move towards the surface 126 of target 110 in the distal direction, and detection element 122d can move away from the surface 126 of target 110 in the proximal direction. Generally, the pitch can be adjusted, the original stress signal can be measured, and the attenuation element 260 can be moved to the far side and / or near side to adjust the attenuation amount. Then the original stress signal can be measured again. This process can be repeated until the difference between the original stress signal from the first pair of detection elements 122a, 122c and the original stress signal from the second pair of detection elements 122b, 122d, which varies with attenuation, has been reduced as much as possible, or reduced by the desired amount.

[0053] Similarly, the tumbling of the sensor assembly can be adjusted. Adjusting the tumbling of the sensor assembly changes the relative dimensions of gaps G1a and G1c. For example, by increasing the size of gap G1a, the size of gap G1c can be decreased by a corresponding amount. Therefore, detection element 122a can move away from the surface 126 of target 110 in the proximal direction, and detection element 122c can move towards the surface 126 of target 110 in the distal direction. In another case, the size of gap G1a can be decreased, and the size of gap G1c can be increased by a corresponding amount, while keeping G1b and G1d nominally unchanged. Therefore, detection element 122a can move towards the surface 126 of target 110 in the distal direction, and detection element 122c can move away from the surface 126 of target 110 in the proximal direction. Therefore, the pitch and tumbling of the stress sensor can be adjusted independently. Generally speaking, by adjusting the tumbling, the original stress signal can be measured, and the attenuation element 260 can be moved distally and / or proximally to adjust the attenuation amount, and then the original stress signal can be measured again. This process can be repeated until the difference between the original stress signals from the first pair of sensing elements 122a, 122c and the original stress signals from the second pair of sensing elements 122b, 122d, which varies with decay, has been reduced as much as possible, or reduced by the desired amount. Keeping one axis fixed while rotating about the other means that pitch and roll can be changed independently. This reduces the time required to install and align the stress sensor.

[0054] Figures 3A to 3D An exemplary graph is shown showing the raw stress signal output from the sensor assembly as the magnetic flux decays after each stage of sensor alignment. Figure 3A The original stress signals 323a, 323b, 323c, and 323d output from detection elements 122a, 122b, 122c, and 122d are shown before the initial alignment of the sensor assembly. It can be observed that each of the original stress signals 323a, 323b, 323c, and 323d is significantly different from the other signals. This result indicates that each of the detection elements 122a, 122b, 122c, and 122d is measuring a different magnitude of magnetic flux.

[0055] Figure 3B The original stress signals 323a, 323b, 323c, and 323d are shown after initial alignment of the sensor assembly using, for example, a V-block. Figure 3B As shown, the original stress signals 323b and 323d attenuate and become approximately equal. This result indicates that each of the detection elements 122b and 122d is measuring approximately the same amount of magnetic flux. Therefore, the maximum difference between the output original stress signals 323a, 323b, 323c, and 323d under a given attenuation is reduced.

[0056] Figure 3C The original stress signals 323a, 323b, 323c, and 323d are shown after the yaw of the sensor assembly has been adjusted. Figure 3C As shown, the maximum difference between the original stress signals 323a, 323b, 323c, and 323d output under a given attenuation is further reduced.

[0057] Figure 3D The original stress signals 323a, 323b, 323c, and 323d are shown after the pitch and roll of the sensor assembly have been adjusted. (See diagram.) Figure 3D As shown, adjusting the pitch and roll can further reduce the maximum difference in the original stress signals 323a, 323b, 323c, and 323d output under a given attenuation. Therefore, the sensor assembly has been aligned such that changes in magnetic flux attenuation cause approximately equal changes in the original stress signals output from detection elements 122a, 122b, 122c, and 122d. Since the change in attenuation is proportional to the change in the size of the gap between sensor 202 and target 110, the sensor has also been aligned such that changes in the size of this gap cause approximately equal changes in the original stress signals generated by detection elements 122a, 122b, 122c, and 122d.

[0058] like Figures 3A to 3D As shown, the original stress signals 323a, 323b, 323c, and 323d can change approximately linearly with attenuation. Therefore, two or more attenuation values ​​can be used to align the sensor assembly. For example, sensor 202 can be used when the attenuation element 260 is in the closest position, such as... Figure 2B As shown, and when in the farthest position, as Figure 2C As shown, the measured original stress value is used for alignment.

[0059] In some implementations, the attenuation element can be in the form of a plate, instead of using an attenuation element in the form of a cylindrical sleeve. Figure 4 An embodiment of sensor assembly 301 is shown, which may be generally similar to sensor assembly 201, but may include an attenuation element 360 in plate form. Therefore, sensor assembly 301 may include sensor 302 and attenuation element 360. Sensor 302 may include sensor head 104 positioned within housing 303, such as... Figure 1B As shown. The attenuation element 360 can be positioned between the sensor 302 and the target 110 of the sensor assembly 301, such that the attenuation element is fixed relative to the sensor 302.

[0060] Initially, sensor 302 can be positioned within a support (e.g., support 150), and the sensor can be mechanically aligned (e.g., using a V-block) to achieve initial alignment between sensor assembly 301 and target 110. Drive element 120 can be generated from a control and processing module, such as... Figure 1A The control and processing module 106 shown receives an input drive signal to generate a magnetic flux 340 corresponding to the magnetic field. This magnetic field can be coupled to an attenuation element 360, allowing a first portion 341 of the magnetic flux 340 to travel through the attenuation element 360 and a second portion 342 to travel through the target 110. Therefore, the attenuation element 360 can provide a flow path or preferred flow path for the first portion 341 of the magnetic flux 340, thereby reducing the attenuation that would otherwise be observed if the first portion 341 of the magnetic flux traveled through the gap G1 and then through the target 110. Both portions 341 and 342 of the magnetic flux can be detected by detection elements 122a, 122b, 122c, and 122d. The attenuation element 360 can reduce the attenuation that would otherwise be observed if the first portion 341 of the magnetic flux traveled through the gap G1 and then through the target 110.

[0061] The alignment process may involve adjusting the yaw, pitch, and roll of the sensor assembly 301 so that changes in the size of the gap G1 between the sensors cause approximately equal changes in the original stress signals output from the detection elements 122a, 122b, 122c, and 122d.

[0062] The yaw of sensor assembly 201, and thus sensor head 104, can be adjusted to reduce the difference between the original stress signals from the first pair of detection elements 122a, 122c and the original stress signals from the second pair of detection elements 122b, 122d, which varies with the amount of attenuation. Generally, the yaw can be adjusted, the original stress signal can be measured, the attenuation element 360 can be removed to adjust the attenuation, and then the original stress signal can be measured again. This process can be repeated until the difference between the original stress signals from the first pair of detection elements 122a, 122c and the original stress signals from the second pair of detection elements 122b, 122d, which varies with attenuation, has been reduced as much as possible, or reduced by a desired amount. The pitch and roll of sensor assembly 301 can be adjusted in a similar manner. In some cases, instead of removing the attenuation element 360, the position of the attenuation element 360 relative to sensor 302 along the central axis Z1 of sensor head 104 can be adjusted to regulate the attenuation of the detected magnetic flux. Therefore, the attenuation element 360 can be configured to allow selective adjustment of the detected portions 341, 342 of the magnetic flux 340 without requiring axial translation of the sensor 302 relative to the target 110. For example, the magnitude of the portion 341 of the magnetic flux 340 can be adjusted according to the position of the attenuation element 360 relative to the sensor 302.

[0063] Although the attenuation element 360 is shown as a flat plate, it can have any number of geometries. For example, it can be a curved plate, an ellipsoid, an oval, a sphere, a spherical body, etc. Generally speaking, the attenuation element 360 can have any geometry that affects the magnetic flux detected by each detection element 122a, 122b, 122c, 122d approximately equally for a given magnetic flux 340 from the drive element 120.

[0064] Fixed passive attenuation element

[0065] In other implementations, instead of using an attenuation element that provides attenuation based on its position relative to the sensor to align the sensor, an attenuation element can be used that provides variable attenuation while maintaining a fixed position relative to the sensor. This configuration reduces the number of parts in the sensor assembly, such as moving parts, thereby simplifying the alignment process. (See above regarding...) Figures 2A to 2C as well as Figure 4 As shown in sensor assemblies 201 and 301, the attenuation element can be configured to allow selective adjustment of the detected portion of the magnetic flux without translating the sensor relative to the target axis.

[0066] Figures 5A to 5BAn attenuation element 460 is shown, which provides variable attenuation while remaining fixed relative to the sensor. The attenuation element 460 may include a first part 462 and a second part 464, which may be joined together using mating elements 466, 468. The first part 462 and the second part 464 may include conductive elements 470, 472, which may extend between the mating elements 466, 468 within the housings 474, 476 of the first part 462 and the second part 464. The conductive elements 470, 472 may be made of a conductive material, such as copper or any other material suitable for the purpose described. When the first part 462 and the second part 464 of the attenuation element 460 are mated, the conductive elements 470, 472 may be electrically coupled such that they form at least one conductive coil. Figure 5B As shown, the conductive coil can be coupled in parallel to the variable resistor 478. Therefore, the resistance of the circuit formed by the conductive elements 470, 472 and the variable resistor 478 can be selectively adjusted.

[0067] Figure 6 One embodiment of a sensor assembly 401 is shown, which may include an attenuation element 460 and a sensor 402. Sensor 402 may be generally similar to sensor 202 and may include a sensor head 104 positioned within a housing 403. Attenuation element 460 may be configured to selectively attenuate magnetic flux detected by sensor 402. As an example, a first part 462 and a second part 464 of attenuation element 460 may be coupled to form a conductive coil, and sensor 402 may be positioned within attenuation element 460 such that the coil wraps around sensor 402. In some embodiments, a variable resistor 478 may be coupled to a control and processing module, such as control and processing module 106. This control and processing module may transmit signals to variable resistor 478 to adjust its resistance.

[0068] Initially, sensor assembly 401 may be positioned within a support (e.g., support 150), and the sensor may be mechanically aligned (e.g., using a V-block) to achieve initial alignment between sensor assembly 401 and target 110. Drive element 120 may receive an input drive signal from a control and processing module to generate a first magnetic flux 440 corresponding to the first magnetic field. This input drive signal may be, for example, an alternating current (AC) signal. The first magnetic flux 440 may travel from drive element 120 through target 110, and at least a portion of it may be detected by detection elements 122a, 122b, 122c, 122d, which may generate an initial stress signal based on the detected magnetic flux.

[0069] The first magnetic field can be coupled to the coil formed by conductive elements 462 and 464, allowing a first portion 441 of the first magnetic flux 440 to travel through the attenuating element 460, and a second portion 462 to be detected by the detection elements 122a, 122b, 122c, and 122d. Therefore, this coupling can create a flow path or preferred flow path for the first portion 441 of the first magnetic flux 440, thereby reducing the amount of the first magnetic flux 440 detected by the detection elements 122a, 122b, 122c, and 122d, and reducing the corresponding original stress signal that can be generated. Furthermore, the coupling between the magnetic field and the coil of the attenuating element 460 can induce alternating current, which can flow through conductive elements 470 and 472 and through the variable resistor 478. The current flowing through the coil can generate a second magnetic field and a corresponding second magnetic flux. The second magnetic field can have a phase shift of approximately 180° relative to the first magnetic field. Therefore, the second magnetic field can attenuate the second part 442 of the first magnetic flux 440 detected by the detection elements 122a, 122b, 122c, and 122d.

[0070] The attenuation of the detected portion of the first magnetic flux 440 can be adjusted by changing the resistance of the variable resistor 478. The amount of current flowing through the conductive elements 470 and 472 and through the variable resistor 478 can be changed inversely proportional to the change in the resistance of the variable resistor 478. Therefore, decreasing the resistance of the variable resistor 478 increases the amount of current flowing through the conductive elements 470 and 472 and through the variable resistor 478, thereby increasing the strength of the second magnetic field. Therefore, the second magnetic field can have a greater attenuation effect on the detected portion of the first magnetic flux 440. Conversely, increasing the resistance of the variable resistor 478 decreases the amount of current flowing through the conductive elements 470 and 472 and through the variable resistor 478, thereby decreasing the strength of the second magnetic field. Therefore, the second magnetic field can have a smaller attenuation effect on the detected portion of the first magnetic flux 440.

[0071] Sensor assembly 401 can be aligned relative to target 110 in a manner similar to that described above with respect to sensor assemblies 201 and 301. For example, the yaw of sensor assembly 401 can be adjusted, the original stress signal can be measured, the resistance of variable resistor 478 can be adjusted to adjust the attenuation, and then the original stress signal can be measured again. This process can be repeated until the difference between the original stress signal from the first pair of detection elements 122a, 122c and the original stress signal from the second pair of detection elements 122b, 122d, which varies with attenuation, has been reduced as much as possible, or reduced by a desired amount. The pitch and roll of sensor assembly 301 can be adjusted in a similar manner.

[0072] Fixed active attenuation element

[0073] In some implementations, the current flowing through conductive elements 470, 472 can be actively controlled. For example, a coil formed by conductive elements 470, 472 can be coupled to a control and processing module, such as control and processing module 106, so that it can receive an input attenuation signal capable of controlling the current flowing through conductive elements 470, 472, thereby generating a second magnetic field. This input attenuation signal can be, for example, an AC signal having a given frequency, amplitude, and phase. By adjusting the frequency, amplitude, and / or phase of the input attenuation signal, the attenuation of the detected portion of the first magnetic flux 440 can be actively controlled. For example, the frequency and phase of the input attenuation signal can be configured such that the second magnetic field attenuates the first magnetic field, thereby attenuating the detected portion of the first magnetic flux 440. The amplitude of the input attenuation signal can then be adjusted to change the strength of the second magnetic field, thereby changing the amount of attenuation of the detected portion of the first magnetic flux 440. For example, increasing the amplitude of the attenuation signal can increase the strength of the second magnetic field, thereby increasing the attenuation of the second portion 442 of the first magnetic flux 440 that can be detected by 122a, 122b, 122c, and 122d. In another embodiment, the amplitude of the input attenuation signal can be decreased, thereby reducing the strength of the second magnetic field and decreasing the attenuation of the second portion 442 of the first magnetic flux 440.

[0074] The active control attenuation element 460 can also allow the detected portion of the first magnetic flux 440 to be amplified. For example, the phase of the input attenuation signal can be configured such that the phase of the resulting second magnetic field can match the phase of the first magnetic field generated by the driving element 120. Therefore, the second magnetic field can amplify the first magnetic field, thereby amplifying the detected portion of the first magnetic flux 440.

[0075] In another implementation, the detected portion of the magnetic flux can be attenuated by directly changing the intensity of the magnetic flux. Figure 7 An exemplary embodiment of sensor assembly 501 is shown, which includes an attenuation element 560 that can be used to selectively modify an input drive signal that can change the strength of a resulting magnetic field. Sensor assembly 401 may include attenuation element 560 and sensor 502, which may be generally similar to sensor 202. Sensor 402 may include sensor head 104 positioned within housing 503.

[0076] The attenuation element 560 may include a variable resistor 578, which may be substantially similar to the variable resistor 478. In some embodiments, the variable resistor 578 may be coupled to a control and processing module, such as control and processing module 106. The control and processing module may transmit signals to the variable resistor 578 to adjust its resistance.

[0077] Initially, sensor 502 may be positioned within a support (e.g., support 150), and the sensor may be mechanically aligned (e.g., using a V-block) to achieve initial alignment between sensor assembly 501 and target 110.

[0078] The driving element 120 can receive an input driving signal from the control and processing module to generate a first magnetic flux 540 corresponding to the first magnetic field. The control and processing module can transmit the original input driving signal to the variable resistor 578 of the attenuation element 560, which then transmits the input driving signal back to the driving element 120. This input driving signal can be, for example, an alternating current (AC) signal. The first magnetic flux 540 can travel from the driving element 120 through the target 110, and at least a portion of it can be detected by detection elements 122a, 122b, 122c, and 122d, which can generate an original stress signal based on the detected magnetic flux. The variable resistor 578 of the attenuation element 560 can attenuate the original input driving signal, thereby attenuating the magnetic flux 540 and the corresponding detected portion of the magnetic flux 540.

[0079] Sensor assembly 501 can be aligned relative to target 110 in a manner similar to that described above with respect to sensor assemblies 201 and 301. For example, the yaw of sensor 502 can be adjusted, the original stress signal can be measured, the resistance of variable resistor 578 can be adjusted to adjust the attenuation, and then the original stress signal can be measured again. This process can be repeated until the difference between the original stress signal from the first pair of detection elements 122a, 122c and the original stress signal from the second pair of detection elements 122b, 122d, which varies with attenuation, has been reduced as much as possible, or reduced by a desired amount. The pitch and roll of sensor 502 can be adjusted in a similar manner.

[0080] As described above, alignment sensors can compensate for manufacturing inconsistencies that may lead to differences in the magnetic flux values ​​detected by the sensor's sensing elements, and can also correct for variability in how the user places the sensor relative to the target. An example of manufacturing inconsistency can be minute variations in the placement of sensing elements 122a, 122b, 122c, and 122d on sensing arms 116a, 116b, 116c, and 116d. These variations in placement of sensing elements 122a, 122b, 122c, and 122d can lead to differences in the detected magnetic flux values. In cases where manufacturing inconsistencies have been mitigated, alignment sensors primarily correct for variability in how the user places the sensor relative to the target. Therefore, the correct position of the sensor relative to the target can be known before alignment. Thus, the sensor can simply provide the user with detailed information on how to adjust the sensor relative to the target to achieve proper alignment.

[0081] Figure 8A top view of sensor 602, similar to sensor 202, is shown. This sensor may also include a yaw indicator 604, a pitch indicator 606, and a roll indicator 608. The yaw, pitch, and roll indicators 604, 606, and 608 can be configured to provide information about the placement of sensor 602 relative to target 110. As an example, in a manner similar to that described above with respect to sensor assemblies 201, 301, 401, and 501, the driving element of sensor 602 can receive an input driving signal from a control and processing module, and can then generate a magnetic flux that can travel through target 110 and be detected by a detection element. The detection element can generate raw stress signals corresponding to the detected magnetic flux, which can then be transmitted to the control and processing module. The control and processing module can use these raw stress signals to determine the current orientation of sensor 602 relative to the correct alignment orientation of sensor 602, and can then transmit yaw, pitch, and roll signals to indicators 604, 606, and 608. In some embodiments, these indicators may be LED indicators that emit light with varying brightness to inform the user how to adjust sensor 602. For example, as yaw, pitch, and / or roll are adjusted closer to the desired value, the light emitted by indicators 604, 606, and 608 may each increase in intensity. Conversely, if yaw, pitch, and / or roll are adjusted away from the desired value, indicators 604, 606, and 608 may dim. In some embodiments, LED indicators 604, 606, and 608 may flash to inform the user how to adjust sensor 602. For example, indicators 604, 606, and 608 may flash at a gradually increasing frequency as yaw, pitch, and / or roll are adjusted closer to the desired value. Alternatively, indicators 604, 606, and 608 may flash at a gradually decreasing frequency as yaw, pitch, and / or roll are adjusted closer to the desired value.

[0082] In some implementations, indicators 604, 606, and 608 can change color to inform the user how to adjust sensor 602. For example, as yaw, pitch, and / or roll are adjusted toward a desired value, indicators 604, 606, and 608 can each gradually change from red to green. Conversely, if yaw, pitch, and / or roll are adjusted away from the desired value, these indicators can each gradually change from green to red.

[0083] Figure 9 A top view of another embodiment of sensor 702 is shown, which can provide information about the placement of sensor 702 relative to a target. Sensor 702 can be generally similar to Figure 8The sensor 602 shown may include indicators 704, 706, 708, and 710, which may correspond to detection elements, such as... Figure 1B The detection elements 122a, 122b, 122c, and 122d are shown. Similar to the manner described above with respect to sensor assemblies 201, 301, 401, and 501, the driving element of sensor 702 receives an input driving signal from the control and processing module, and can then generate a magnetic flux that can travel through the target and be detected by the detection elements. The detection elements can generate raw stress signals corresponding to the detected magnetic flux, and these raw stress signals can then be transmitted to the control and processing module. The control and processing module uses these raw stress signals to determine the current orientation of the sensor relative to the correct alignment orientation of the sensor, and can then transmit signals corresponding to each detection element to indicators 704, 706, 708, and 710. In some embodiments, these indicators may be LED indicators that can emit light with varying brightness to inform the user how to adjust sensor 704. For example, as the detection element is adjusted closer to the desired position, the light emitted by indicators 704, 706, 708, and 710 can each increase in intensity. Conversely, if the detection element is adjusted to be away from the desired position, the indicators 704, 706, 708, and 710 can dim.

[0084] The exemplary technical effects of the methods, systems, and apparatus described herein, by way of non-limiting example, include the ability to align the stress sensor relative to the target while maintaining a constant gap size between the stress sensor and the target. This improvement in aligning the stress sensor without changing the size of the gap between the sensor and the target can significantly reduce the time required to install the sensor and substantially improve the sensor's accuracy due to reduced sensor movement during alignment.

[0085] Other implementation schemes fall within the scope and substance of the disclosed subject matter.

[0086] In the foregoing description and claims, phrases such as “at least one of…” or “one or more of…” may be followed by a list of multiple elements or features connected together. The term “and / or” may also appear in a list of two or more elements or features. Unless such a phrase implicitly or explicitly contradicts the context in which it is used, it is intended to mean any of the individually listed elements or features, or any of the listed elements or features in combination with any of the other listed elements or features. For example, the phrases “at least one of A and B,” “one or more of A and B,” and “A and / or B” are each intended to mean “only A, only B, or both A and B.” A similar interpretation applies to lists comprising three or more items. For example, the phrases “at least one of A, B, and C,” “one or more of A, B, and C,” and “A, B, and / or C” are each intended to mean “only A, only B, only C, both A and B, both A and C, both B and C, or both A, B, and C.” Furthermore, the use of the term "based on" in the foregoing and claims is intended to mean "at least partially based on," thereby allowing for the presence of features or elements not listed.

[0087] The subject matter described herein can be implemented in digital electronic circuits or in computer software, firmware, or hardware, including structural components disclosed herein and their structural equivalents, or combinations thereof. The subject matter described herein can be implemented as one or more computer program products, for example, tangibly implemented in an information carrier (e.g., a machine-readable storage device), or implemented in a propagating signal for execution by or control of a data processing device (e.g., a programmable processor, a computer, or multiple computers). A computer program (also referred to as a program, software, software application, or code) can be written in any form of programming language, including compiled or interpreted languages, and can be deployed in any form, including as a standalone program or as a module, component, subroutine, or other unit suitable for use in a computing environment. A computer program does not necessarily correspond to a file. A program can be stored as a portion of a file containing other programs or data, a single file dedicated to a related program, or multiple coordinating files (e.g., a file storing portions of one or more modules, subroutines, or code). A computer program can be deployed to execute on one computer or multiple computers at one location, or distributed across multiple locations and interconnected via a communication network.

[0088] The processes and logic flows described in this specification, including the method steps of the subject matter described herein, can be executed by one or more programmable processors that execute one or more computer programs to perform the functions of the subject matter described herein by manipulating input data and producing output. The processes and logic flows can also be executed by special-purpose logic circuitry, such as FPGAs (Field-Programmable Gate Arrays) or ASICs (Application-Specific Integrated Circuits), and the devices of the subject matter described herein can be implemented as said special-purpose logic circuitry.

[0089] Processors suitable for executing computer programs include, for example, both general-purpose and special-purpose microprocessors, and any one or more processors of any kind of digital computer. Generally, a processor receives instructions and data from read-only memory or random access memory, or both. The basic components of a computer are a processor for executing instructions and one or more memory devices for storing instructions and data. Generally, a computer will also include one or more mass storage devices for storing data, such as magnetic disks, magneto-optical disks, or optical disks, or operatively connected to receive data from or transfer data to said one or more mass storage devices, or perform both operations. Information carriers suitable for implementing computer program instructions and data include all forms of non-volatile memory, including, for example: semiconductor memory devices (e.g., EPROM, EEPROM, and flash memory devices); magnetic disks (e.g., internal hard disks or removable magnetic disks); magneto-optical disks; and optical disks (e.g., CDs and DVDs). The processor and memory may be supplemented by or incorporated into special-purpose logic circuitry.

[0090] To provide interaction with a user, the subject matter described herein can be implemented on a computer having a display device for displaying information to the user, such as a CRT (cathode ray tube) or LCD (liquid crystal display) monitor, and a keyboard and pointing device (e.g., a mouse or trackball) that the user can use to provide input to the computer. Other types of devices can also be used to provide interaction with the user. For example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback), and input from the user can be received in any form, including sound waves, speech, or tactile input.

[0091] The techniques described herein can be implemented using one or more modules. As used in this specification, the term "module" refers to computing software, firmware, hardware, and / or various combinations thereof. However, a module should not be construed as software not implemented on hardware, firmware, or recorded on a non-transitory processor-readable and recordable storage medium (i.e., a module is not the software itself). In practice, a "module" should be construed as always including at least some physical non-transitory hardware, such as a processor or part of a computer. Two different modules may share the same physical hardware (e.g., two different modules may use the same processor and network interface). The modules described herein can be combined, integrated, separated, and / or replicated to support different applications. Furthermore, functions described herein as performing at a particular module may replace or complement functions performing at a particular module performed at one or more other modules and / or performed by one or more other devices. Additionally, modules can be implemented in multiple devices and / or other components local to each other or other components remote from each other. Furthermore, modules can be moved from one device and added to another device, and / or may be included in two devices.

[0092] The subject matter described herein can be implemented in a computing system that includes backend components (e.g., a data server), middleware components (e.g., an application server), or frontend components (e.g., a client computer with a graphical user interface or web browser for interacting with an implementation of the subject matter described herein), or any combination of such backend, middleware, and frontend components. The components of the system can be interconnected via digital data communication (e.g., a communication network) of any form or medium. Examples of communication networks include local area networks (“LANs”) and wide area networks (“WANs”), such as the Internet.

[0093] As used herein and throughout the specification and claims, approximate language may be applied to modify any quantitative expression that may be varied in manner without altering its associated essential function. Therefore, values ​​modified by terms such as “about” and “substantially” are not limited to the specified precise values. In at least some cases, approximate language may correspond to the precision of the instrument used to measure the value. Scope limitations may be combined and / or interchanged herein and throughout the specification and claims; unless otherwise indicated by the content or language, such scopes are identified and include all subscopes included herein.

[0094] Furthermore, those skilled in the art will understand additional features and advantages of the invention based on the embodiments described above. Therefore, the invention is not limited to what has been specifically shown and described, but only by the appended claims. All patent publications and references cited herein are expressly and entirely incorporated herein by reference.

Claims

1. A sensor assembly, comprising: Sensor, the sensor includes A driving element configured to generate a first magnetic field and a corresponding first magnetic flux, the first magnetic flux traveling through a first gap distance between the driving element and the target surface and through the target, and At least one detection element, the detection element being configured to detect a portion of the first magnetic flux; as well as An attenuation element is configured to allow selective adjustment of the detected portion of the first magnetic flux to align the sensor and the target without translating the sensor axially relative to the target.

2. The sensor assembly of claim 1, wherein the position of the attenuation element is adjustable relative to the sensor such that changing the position of the attenuation element changes the detected portion of the first magnetic flux.

3. The sensor assembly of claim 1, wherein the attenuation element includes a sleeve disposed around the sensor, the attenuation element being configured to increase attenuation as it moves toward the target.

4. The sensor assembly of claim 1, wherein the attenuation element is disposed around at least a portion of the sensor, the attenuation element comprising at least one conductive element configured to generate a second magnetic field that interacts with a portion of the first magnetic field to modulate the magnitude of the detected portion of the first magnetic flux, the second magnetic field being generated by alternating current flowing through the at least one conductive element and configured to attenuate a portion of the first magnetic field, thereby attenuating the detected portion of the first magnetic flux.

5. The sensor assembly of claim 4, wherein the at least one conductive element of the attenuation element is configured to be coupled to the first magnetic field.

6. The sensor assembly of claim 5 further includes a resistor coupled in parallel with the conductive element, wherein the resistance of the resistor is variable, such that adjusting the resistance of the resistor adjusts the magnitude of the second magnetic field, thereby adjusting the magnitude of the detected portion of the first magnetic flux.

7. The sensor assembly of claim 6, wherein the attenuation element is configured to attenuate the detected portion of the first magnetic flux more and more as the resistance of the resistor decreases.

8. The sensor assembly of claim 4, wherein the at least one conductive element of the attenuation element is configured to receive a selectively adjustable alternating current attenuation signal to generate the alternating current flowing through the at least one conductive element.

9. The sensor assembly of claim 8, wherein the attenuation element is configured to attenuate a detected portion of the first magnetic flux when the phase of the second magnetic field is out of phase with the phase of the first magnetic field.

10. The sensor assembly of claim 8, wherein the attenuation element is configured to amplify the detected portion of the first magnetic flux when the phase of the second magnetic field is in phase with the phase of the first magnetic field.

11. The sensor assembly of claim 1, wherein the attenuation element is configured to receive a raw input drive signal and use the raw input drive signal to generate an input drive signal, the input drive signal being received by the drive element to generate the first magnetic flux.

12. The sensor assembly of claim 11, wherein the attenuation element comprises a resistor configured to control the magnitude of the input drive signal, thereby controlling the magnitude of the first magnetic flux, wherein the resistance of the resistor is configured to be adjustable such that increasing the resistance of the resistor decreases the magnitude of the input drive signal, thereby decreasing the magnitude of the first magnetic flux and decreasing the magnitude of the detected portion of the first magnetic flux.

13. The sensor assembly of claim 1, further comprising at least one LED indicator configured to output a signal relating to the desired alignment of the sensor with respect to the sensor.

14. The sensor assembly of claim 13, wherein the at least one LED indicator comprises a first LED indicator, a second LED indicator, and a third LED indicator, the indicators corresponding to the yaw, pitch, and roll values ​​of the sensor's position.

15. The sensor assembly of claim 14, wherein the first LED indicator, the second LED indicator, and the third LED indicator are configured to output light whose brightness varies with yaw, pitch, and roll toward a desired value.

16. The sensor assembly of claim 14, wherein the first LED indicator, the second LED indicator, and the third LED indicator are configured to output light whose color changes with yaw, pitch, and roll adjustment toward a desired value.

17. The sensor assembly of claim 14, wherein the first LED indicator, the second LED indicator, and the third LED indicator are configured to flash at a varying frequency as yaw, pitch, and roll adjust toward a desired value.

18. A method for aligning a sensor assembly with a target, comprising: The control and processing module is activated to transmit an input drive signal to the drive element of the sensor in the sensor assembly, thereby generating a first magnetic field having a corresponding first magnetic flux traveling through the target, wherein at least one detection element detects a portion of the first magnetic flux. The detected portion of the first magnetic flux is selectively adjusted by an attenuation element without translating the sensor relative to the target axis. as well as The sensor is rotated about at least one of the following three axes: about a first axis to adjust the yaw of the sensor relative to the target, about a second axis to adjust the pitch of the sensor, and about a third axis to adjust the roll of the sensor.

19. The method of claim 18, further comprising adjusting the position of an attenuation element to attenuate a detected portion of the first magnetic flux, wherein moving the attenuation element toward the target increases the attenuation of the detected portion of the magnetic flux.

20. The method of claim 18, further comprising coupling the first magnetic field to a conductive element of the attenuation element to induce alternating current flowing through the conductive element, causing the conductive element to generate a second magnetic field, wherein the second magnetic field attenuates the first magnetic field, thereby adjusting the detected portion of the first magnetic flux by attenuating the detected portion of the first magnetic flux.

21. The method of claim 20, further comprising adjusting the resistance of a resistor coupled to the conductive element to adjust the attenuation of the detected portion of the first magnetic flux.

22. The method of claim 18, further comprising transmitting a selectively adjustable alternating current attenuation signal to a conductive element of the attenuation element, thereby generating alternating current flowing through the conductive element, causing the conductive element to generate a second magnetic field. The amplitude, phase, and frequency of the selectively adjustable alternating current attenuation signal define the amplitude, phase, and frequency of the second magnetic field.

23. The method according to claim 22 further includes adjusting the amplitude of the alternating current attenuation signal to adjust the amplitude of the second magnetic field.

24. The method of claim 22, wherein the detected portion of the first magnetic flux is adjusted by attenuating the detected portion of the first magnetic flux when the phase of the second magnetic field is out of phase with the phase of the first magnetic field.

25. The method of claim 18, further comprising transmitting the original input drive signal to an attenuation element to generate the input drive signal, and adjusting the resistance of a resistor in the attenuation element to adjust the magnitude of the input drive signal, thereby adjusting the magnitude of the first magnetic flux and the magnitude of the detected portion of the first magnetic flux.

26. The method of claim 18, wherein the yaw, pitch, and roll of the sensor are adjusted based on the output from at least one LED indicator on the sensor assembly.

27. The method of claim 26, wherein the output is the light intensity from the at least one LED indicator.

28. The method of claim 26, wherein the output is the color of light from the at least one LED indicator.

29. The method of claim 26, wherein the output is the flashing frequency of light from the at least one LED indicator.

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