Assembly and manufacturing friendly waveguide emitter

Abstract

Embodiments include a waveguide launcher and connector (WLC) and a method of forming a WLC. The WLC has a waveguide connector with a waveguide launcher, a taper, and a slotline signal transducer; and a balun structure on the slotline signal transducer, where the taper is on the slotline signal transducer and a termination of the waveguide connector to form a channel and a tapered slot. The WLC can have a waveguide connector disposed on a package and a waveguide coupled to the waveguide connector. The WLC can include a mounting pad and an outer wall electrically coupled to the waveguide connector of the package. The WLC can have the balun structure convert a signal to a slotline signal, and the waveguide launcher convert the slotline signal to a closed waveguide mode signal, and launch the closed signal along the channel and propagate the closed signal along the tapered slot to the waveguide coupled to the waveguide connector.

Description

Technical Field

[0001] The embodiments relate to semiconductor packages. More specifically, the embodiments relate to semiconductor packages with waveguide transmitters and connectors. Background Technology

[0002] As more devices become interconnected and users consume more data, the demands on the servers accessed by users have grown proportionally and show no signs of slowing down in the near future. Among other things, these demands include increased data transfer rates, switching architectures requiring longer interconnects, and highly cost- and power-competitive solutions.

[0003] Today, server and high-performance computing (HPC) architectures contain numerous interconnects. These interconnects include blade interconnects, rack interconnects, rack-to-rack interconnects, and rack-to-switch interconnects. In current architectures, depending on the required data rate, short interconnects (e.g., within rack interconnects and some rack-to-rack interconnects) are implemented using cables such as Ethernet cables, coaxial cables, or biaxial cables. For longer distances, optical solutions are used due to the extremely long reach and high bandwidth achievable through fiber optic solutions. However, with the emergence of new architectures, such as 100 gigabits Ethernet, traditional electrical connections are becoming increasingly expensive and power-hungry to support the required data rates. For example, extending the reach of a cable or a given bandwidth on the cable may require higher quality cables or advanced equalization, modulation, and / or data correction techniques, which increase power consumption and latency. For some of the distances and data rates required in the proposed architectures, there are currently no feasible electrical solutions. Optical transmission via fiber optics can support the required data rates and distances, but at the cost of significant power and cost penalties, especially for short to medium distances such as a few meters. Attached Figure Description

[0004] The embodiments described herein are illustrated in the accompanying drawings as examples rather than limitations, in which similar reference numerals indicate similar features. Furthermore, some general details have been omitted so as not to obscure the inventive concepts described herein.

[0005] Figure 1 It is a perspective view of a waveguide transmitter system including waveguide connectors, one or more stacked patch transmitters, and a package.

[0006] Figure 2A This is a perspective view of a waveguide transmitter system including a package with a first layer, a second layer, and a microstrip feed, according to one embodiment.

[0007] Figure 2BThis is a perspective view of a waveguide transmitter system according to one embodiment, including a package having a first layer, a second layer, and a microstrip feed, and a waveguide connector having a slotted signal converter, a balun structure, and a tapered slot transmitter.

[0008] Figure 2C This is a perspective view of a waveguide transmitter system according to one embodiment, including a package having a first layer, a second layer, and a microstrip feed, and a waveguide connector having a slotted signal converter, a balun structure, and a tapered slot transmitter.

[0009] Figure 2D This is a cross-sectional view of a waveguide transmitter system including a package with a first layer, a second layer, and one or more dielectric layers, according to one embodiment.

[0010] Figure 3 This is a detailed perspective view of a waveguide transmitter system according to one embodiment, including a package having a first layer, a second layer, and a microstrip feed, and a waveguide connector having a slotted signal converter, a balun structure, and a tapered slot transmitter.

[0011] Figure 4A This is a perspective view of a waveguide transmitter system including a waveguide connector with one or more compartments, according to one embodiment.

[0012] Figure 4B This is a perspective view of a waveguide transmitter system including a first layer and a second layer of encapsulation, according to one embodiment.

[0013] Figure 4C This is a plan and perspective view of a waveguide transmitter system according to one embodiment, including a package having a first layer and a second layer, and a waveguide connector having a slotted signal converter, a balun structure, a tapered slot transmitter, and one or more mounting pads.

[0014] Figure 5A This is a perspective view of a waveguide transmitter system including a waveguide connector with one or more compartments having one or more cones, according to one embodiment.

[0015] Figure 5B This is a perspective view of a waveguide transmitter system, according to one embodiment, including a package with a top conductive layer, a balun structure, and a microstrip feed.

[0016] Figure 5C This is a cross-sectional view of a waveguide transmitter system including a package with a first layer, a second layer, and one or more dielectric layers, according to one embodiment.

[0017] Figure 6This is a perspective view of a waveguide transmitter system according to one embodiment, including a waveguide connector having one or more compartments with one or more stepped cones.

[0018] Figure 7 This is a cross-sectional view of a waveguide transmitter system according to one embodiment, including a package having a top conductive layer, connection points, and a microstrip feed, as well as a waveguide connector having a slotted signal converter, a balun structure, and a biconical slotted transmitter.

[0019] Figure 8 This is a perspective view of a vertical waveguide transmitter system according to one embodiment, including a package with a top conductive layer and a microstrip feed, and a waveguide connector with a slotted signal converter, a balun structure, and a mirrored tapered slot transmitter.

[0020] Figure 9 This is a perspective view of a vertical waveguide transmitter system according to one embodiment, comprising a waveguide connector having one or more arranged compartments with one or more cones.

[0021] Figure 10A This is a perspective view of a vertical waveguide transmitter system with a waveguide connector, one or more cones, and one or more baluns according to one embodiment.

[0022] Figure 10B This is a plan view of a vertical waveguide transmitter system with a waveguide connector, one or more cones, and one or more baluns and unbalanced converters, according to one embodiment.

[0023] Figure 11A This is a perspective view of a vertical waveguide transmitter system with a waveguide connector, one or more cones, and one or more baluns according to one embodiment.

[0024] Figure 11B This is a plan view of a vertical waveguide transmitter system with a waveguide connector, one or more cones, and one or more baluns and unbalanced converters, according to one embodiment.

[0025] Figure 12 According to one embodiment, a schematic block diagram of a computer system packaged with a device having one or more waveguide transmitter systems is illustrated. Detailed Implementation

[0026] This document describes a system comprising a waveguide transmitter and a connector for exciting a waveguide. Specifically, as described below, the waveguide transmitter system includes a package having a microstrip feed and one or more layers, and a waveguide connector having a slot line converter, a balun structure (or dumbbell structure / aperture), and a tapered slot transmitter. Similarly, a method for forming such a system is described below, comprising: mounting the waveguide connector on the package; aligning the microstrip feed on the package with the slot line converter mounted on the waveguide connector; converting the microstrip signal of the microstrip feed to a slot line signal by means of the balun structure mounted on the slot line converter; and propagating a closed waveguide mode signal by means of the tapered slot transmitter mounted on the waveguide connector, wherein the tapered slot transmitter converts the slot line signal generated by the slot line converter into a closed waveguide mode signal (e.g., a TE10 signal for operatively coupled rectangular waveguides).

[0027] Accordingly, the waveguide transmitter system described herein can be used to propagate closed waveguide mode signals along a waveguide communicatively coupled to a slotted transmitter and a waveguide connector. In some embodiments, the waveguide connector can be a fully integrated and stand-alone surface mount technology (SMT) component disposed on a package, or a partially integrated SMT component, wherein, according to this implementation, a slotted converter with a balun structure is patterned / printed on the package, and then the partially integrated SMT component is disposed on the package. These embodiments described herein enable the fabrication of lower-cost and higher-performance millimeter-wave (mm-wave) waveguides using more standard and lower-cost dielectrics, which further enables reduced cost and power requirements for data communication between server racks in data centers and server farms.

[0028] In the following description, various aspects of the illustrative implementation will be described using terminology commonly used by those skilled in the art to convey the substance of their work to others skilled in the art. However, it will be apparent to those skilled in the art that this embodiment may be practiced using only some of the aspects described. Specific quantities, materials, and configurations are explained for illustrative purposes to provide a thorough understanding of the illustrative implementation. However, it will be apparent to those skilled in the art that this embodiment may be practiced without utilizing the specific details described. In other instances, well-known features have been omitted or simplified to avoid obscuring the illustrative implementation.

[0029] The various operations will then be described as multiple discrete operations in a manner most helpful for understanding this embodiment; however, the order of description should not be construed as implying that these operations are necessarily sequential. Specifically, these operations do not need to be performed in the order presented.

[0030] As used herein, the terms “top,” “bottom,” “upper,” “lower,” “lowest,” and “uppermost,” when used relative to one or more elements, are intended to express a relative rather than an absolute physical configuration. Thus, an element described as the “uppermost element” or “top element” in a device may, when the device is inverted, become the “lowermost element” or “bottom element” in the device. Similarly, an element described as the “lowermost element” or “bottom element” in a device may, when the device is inverted, become the “uppermost element” or “top element” in the device.

[0031] As data transfer speeds continue to increase, cost-effective and power-competitive solutions are needed for communication between rack-mounted blades and between adjacent racks. Such distances typically range from less than 1 meter to approximately 10 meters. The systems and methods disclosed herein utilize millimeter-wave (mm-wave) transceivers paired with waveguides to communicate data between blades and / or racks at transfer rates exceeding 25 gigabits per second (Gbps). The mm-wave transmitter for data transfer can be disposed (or formed) and / or positioned within, on, or around a half-body package. Aligning the mm-wave transmitter and waveguide components to maximize energy transfer from the mm-wave transmitter to the waveguide component presents considerable challenges. Further difficulties may arise as one recognizes the wide variety of available waveguide components. While metallic and metal-coated waveguide components are common, such waveguide connectors can include rectangular, circular, polygonal, elliptical, and other shapes. These waveguide components can include hollow components, components with conductive and / or non-conductive internal structures, and hollow components partially or completely filled with dielectric material.

[0032] Ideally, the waveguide is coupled to the semiconductor package at a location that maximizes energy transfer between the mm-wave transmitter, the waveguide connector, and the waveguide. However, such positioning is often complicated by the shape and / or configuration of the waveguide system itself, the relatively small size associated with the waveguide (e.g., 2 mm or less), the relatively tight tolerances required to maximize energy transfer (e.g., 100 micrometers or less), and the precise positioning of the waveguide near the mm-wave transmitter and connector, which are potentially hidden beneath the surface of the semiconductor package.

[0033] The systems and methods described herein provide new, novel, innovative, and improved systems and methods for manufacturing, positioning / assembling, and coupling waveguides and waveguide connectors to semiconductor packages, enabling improvements in energy transfer from mm-wave transmitters and waveguide connectors to waveguides, for example, through current patch and stacked patch transmitter designs. The systems and methods described herein provide new, novel, innovative, and improved systems and methods for manufacturing, positioning / assembling, and coupling waveguides and waveguide connectors to semiconductor packages, thereby enabling: (i) wider bandwidth in thinner packages; (ii) higher transmitter efficiency using traveling-wave transmitters compared to more conventional structures using resonant patch transmitters; and (iii) improved (and easier) assembly and manufacturing of transmitters and systems connected (mating) with connectors.

[0034] The systems and methods disclosed herein implement novel transmitters and waveguide connectors for exciting mm-wave signals in waveguides, wherein the waveguide connector can be a fully integrated and independent surface mount technology (SMT) component, which is then configured and coupled to a semiconductor package. As described herein, the waveguide transmitter system may have a package with a microstrip feed and one or more conductive layers, and a waveguide connector with a slotted signal converter, one or more balun structures, and one or more tapered slot transmitters. For some embodiments, the waveguide transmitter system helps to provide a power-competitive solution capable of supporting extremely high data rates, for example, over short to medium distances, which would be highly advantageous for interconnects within server and HPC architectures and / or autonomous / self-driving vehicles. Furthermore, the waveguide transmitter system includes a tapered slot transmitter and connector for exciting the waveguide, enabling the use of thin package substrates as the demand for miniaturization continues to increase.

[0035] For example, existing semiconductor packaged transmitters include patch or stacked patch structures electrically coupled to waveguide walls. Such "patch" or "stacked patch" placements are constrained by the limited bandwidth of thin semiconductor package substrates, and therefore employ relatively thick semiconductor package substrates. These thick semiconductor package substrates can cause manufacturing and assembly limitations. Furthermore, such waveguide / semiconductor package patch systems are sensitive to waveguide alignment and conductive coupling to signal generators within the semiconductor package.

[0036] The systems and methods described herein employ different types of excitation structures, tapered slot emitters, and connectors compatible with packages manufactured using conventional printed circuit board (PCB) processes and which can be mounted (assembled, placed, formed, etc.) thereon. Note that, as used herein, “tapered slot emitter and connector” (also referred to as tapered slot waveguide emitter / connector, tapered slot emitter and / or tapered slot connector, etc.) can refer to a waveguide connector having a tapered slot emitter structure disposed within one or more walls of the waveguide connector (e.g., as shown in the image). Figure 3 (As shown in the illustration). Also note that "tapered emitter and connector" can be a single fully integrated SMT component or a separate component assembled with a semiconductor package.

[0037] The conical slot launcher system described herein includes a conical slot launcher comprising a single-planar slot / component (e.g., as shown in Figures 2-6 and 9) and coplanar, spaced-apart first and second planar components (e.g., as shown in Figures 2-6 and 9) that together form the conical slot launcher. Figure 7-8 At least one of (and shown in 10-11). This horizontal and / or vertical tapered slot transmitter and connector may be incorporated into the waveguide such that, when the waveguide is conductively coupled to the semiconductor package, the tapered slot transmitter and connector have a balun structure in a slot-line signal converter aligned with and disposed thereon on the surface of the semiconductor package, wherein microstrip signals from microstrip feeds on the package may be transmitted to the balun structure in the slot-line signal converter of the transmitter / connector.

[0038] Tapered slot emitters convert slot-line signals, provided by slot-line signal converters, into closed waveguide-type signals that can propagate to other nodes via waveguides. Tapered slot emitters advantageously offer wider bandwidth and greater energy efficiency compared to patch and stacked patch emitters. As described below, such tapered slot emitters can be advantageously combined to provide space-saving two-dimensional and three-dimensional waveguide arrays—a significant advantage in the constraints of typical data center rack environments. Such tapered slot emitters described herein are also less sensitive to manufacturing tolerances. For example, the systems and methods described herein advantageously provide increased bandwidth in thinner semiconductor packages compared to patch or stacked patch emitters. Additionally, it is advantageous that the systems and methods described herein can be adapted to dielectric waveguides by using slot emitters with 180-degree opposite orientations, and also by adjusting the shape of the profile on the semiconductor package to match the waveguide geometry (e.g., as in…). Figure 9-1 As shown in Figure 1, it can be adapted to various waveguide geometries.

[0039] Figure 1This is a perspective view of a waveguide transmitter system 100 including a waveguide connector 150, one or more patch transmitters 124 and 126, and a package 130. The waveguide transmitter system 100 uses a standard package / PCB transmitter, which generally includes stacked patches 124 and 126 (or patches) electrically coupled to the walls of the waveguide connector 150. The waveguide transmitter system 100 may have a feed line 140 (e.g., from a semiconductor die) electrically coupled to a through-hole feed structure 121, which in turn is electrically coupled to the patch transmitters 124 to transmit waveguide signals.

[0040] As mentioned above, waveguide transmitter system 100 is generally limited by bandwidth when using thin package substrates. Therefore, package 130 requires the use of relatively thick substrates, which leads to various manufacturing and assembly limitations (e.g., ...). Figure 1 The patch transmitters shown are typically sensitive to waveguide alignment and electrical contact. Therefore, new transmitter and connector architectures for exciting waveguides are needed, including those that are also manufacturing and assembly-friendly, and provide power-competitive solutions capable of supporting extremely high data rates over short to medium distances.

[0041] Figure 2A-2D According to some embodiments, a waveguide transmitter system 200 is illustrated, having a package 230 and a waveguide connector 250 using a tapered slot transmitter 220 for excitation of the waveguide. Additionally, Figure 2A-2D The illustration shows a fully integrated and stand-alone SMT waveguide connector 250 disposed on package 230 and mating with rectangular waveguide 254. Waveguide transmitter system 200 includes a fully integrated SMT waveguide connector 250 with waveguide transmitter 220, a tapered element 226, and a slotted line signal converter 221. Waveguide transmitter system 200 also includes a balun structure 218 on slotted line signal converter 221, wherein the tapered element 226 is disposed on the terminals 252 of slotted line signal converter 221 and waveguide connector 250 to form a channel 221 and a tapered slot 222.

[0042] Notice, Figure 2A-2D Each highlighted element of the waveguide transmitter system 200 (e.g., Figure 2A The packaging is shown. Figure 2B The alignment of the slotted line signal converter with packaged microstrip feed and waveguide connector is shown. Figure 2C The tapered slot transmitter 120 of the waveguide connector disposed on the top surface of the package is shown, and Figure 2D One or more layers of the package are shown. Also note that, as illustrated in the figures in this document, the waveguide connector is shown as transparent to simplify the diagram and / or avoid confusion (i.e., to make the diagram more readable).

[0043] Now refer to Figure 2A A perspective view of the waveguide transmitter system 200 is shown. Figure 2A According to one embodiment, a package 230 is shown having a microstrip feed 240, a first layer 212, and a second layer 210. In one embodiment, the first layer 212 may be disposed on a portion of the second layer 210, wherein the first layer 212 may have any desired size and / or shape (e.g., based on the size and shape of the waveguide connector that may be disposed on the first layer 212). In one embodiment, the first layer 212 may be a solder mask and / or a dielectric layer (or something similar). In one embodiment, the second layer 210 is a top conductive layer (or a top metal layer), wherein the top conductive layer is a ground (GND) plane layer (also referred to as package GND). Note that in one embodiment, the first layer 212 may be optional, such that the top surface of the package 230 is the second layer 210 (which may include one or more openings formed on the second layer 210). Also note that, for clarity, the GND vias coupling one or more conductive layers of the package have been omitted as illustrated herein.

[0044] According to one embodiment, package 230 may include, but is not limited to, a semiconductor package, package / substrate, PCB, motherboard, high-density interconnect (HDI) board, ceramic substrate, or any organic semiconductor package substrate. In one embodiment, package 230 is a PCB. In one embodiment, the PCB is made of FR-4 glass epoxy resin with thin copper foil laminated on both sides (not shown). In some embodiments, multilayer PCBs (e.g., such as...) can be used. Figure 2D As illustrated in the diagram, prepreg and copper foil (not shown) are used to form additional layers. For example, a multilayer PCB may include one or more dielectric layers, wherein each dielectric layer can be a photosensitive dielectric layer (such as...). Figure 2D (As shown in the illustration). In some embodiments, holes (not shown) may be drilled in package 230. In one embodiment, package 230 may also include conductive copper traces, holes, metallic pads, and through-holes (such as...). Figure 2D As shown in the figure.

[0045] Package 230 can transmit signals received from a source (e.g., a die, sensor, etc.) via microstrip feed 240 to a balun structure 218 (e.g., a dumbbell-shaped opening) disposed on the bottom surface of waveguide connector 250. Figure 2B-2C (As shown in the diagram). Thus, in Figures 2A-2DIn the embodiments illustrated, the waveguide connector 250 can be referred to as a fully integrated SMT component, which can be mounted on the package 230 using standard PCB assembly techniques. Alternatively, for other embodiments, the package can transmit signals received from the source via a microstrip feed to a balun structure (e.g., as shown in the diagram) formed (or printed) on the top surface of the package. Figures 5B-5C As shown in the figure.

[0046] Note that, as Figure 2A The waveguide transmitter system 200 shown may include fewer or additional package components based on the desired package design.

[0047] Figure 2B This is a perspective view of a waveguide transmitter system 200, according to one embodiment, including a package 230 with a first layer 212, a second layer 210, and a microstrip feed 240, and a waveguide connector 250 with a slotted signal converter 221, a balun structure 218, and a slotted transmitter 220. Specifically, Figure 2B The connection point 219 is shown, aligning the microstrip feed line 240 of package 230 with the balun structure 218 on the slotted-line signal converter 221 of waveguide connector 250. Note that one or more well-known features may be omitted or simplified to avoid making the illustrative implementation difficult to understand.

[0048] like Figure 2B As shown, the waveguide connector 250 is a housing formed by one or more walls with an opening 154 to accommodate operative coupling of an external waveguide to the waveguide connector 250. In one embodiment, the waveguide connector 250 is a fully integrated SMR assembly, such that the bottom surface of the waveguide connector 250 has a slotted-line signal transducer 221. In some embodiments, the waveguide connector 250 may have any size, shape, physical geometry, and / or physical configuration for operatively coupling an external waveguide to the slotted transmitter 220. In some embodiments, the waveguide connector 250 may have one or more connection features disposed around all or a portion of the opening 254 of the waveguide connector 250. Such connection features may include, but are not limited to, mechanical latches, friction or resistance mating posts, aligned pins, keying structures or similar structures, flared ends, high-friction coatings or surface treatments, or combinations thereof. In some implementations, the external waveguide may be operatively coupled to the waveguide connector 250 via solder, conductive adhesive, or similar conductive adhesive.

[0049] In one embodiment, waveguide connector 250 is disposed on the top surface of package 230 to align connection point 219, which aligns with the microstrip feed line 240 of package 230 and the balun structure 218 on slot-line signal converter 221. Connection point 219 (or feed point) may be a broadband radial stub end without using any conductive vias. Alternatively, connection point 219 may include, but is not limited to, any radial stub, via, and any other shaped stub, such as a circular stub, a semi-circular stub, a semi-rectangular stub, etc.

[0050] In one embodiment, the waveguide connector 250 may utilize an opening in the first layer 212 (e.g., as shown in the image). Figure 2D The waveguide connector 250 is coupled to the package 230 via the opening 214 shown, and the first layer 212 couples the outer wall of the waveguide connector 250 to the exposed second layer 210 via the opening. In one embodiment, the outer wall of the waveguide connector 250 may be coupled to the package 230 using solder paste printing, epoxy resin dispensing, or the like.

[0051] When waveguide connector 250 is operatively coupled to the second layer 210 of package 230, slotted transmitter 220 extends at least partially into waveguide connector 250. Slotted transmitter 220 can generate a closed waveguide mode signal (described below) based on a signal transmitted by microstrip feed 240, and can then propagate the closed waveguide mode signal along waveguide connector 250 to outer waveguide 254. In some embodiments, waveguide transmitter system 200 has a waveguide transmitter that is slotted transmitter 220. In other embodiments, waveguide transmitter system 200 has a waveguide transmitter that may include, but is not limited to, patch-based transmitters, slotted transmitters, stacked patch transmitters, microstrip-to-slot transition transmitters, leaky wave transmitters, or any other mm-wave signal transmission structure.

[0052] Although Figure 2B and 2C While depicted as a rectangular waveguide connector, the waveguide connector 250 may have any lateral geometry cross-section. In some embodiments, the first layer 212 of the package 230 may be physically configured to match one or more physical aspects (e.g., peripheral geometry) of the waveguide connector 250. Thus, for example, in the case where the waveguide connector 250 has a circular or elliptical cross-section, the first layer 212 on the package 230 may have a physical configuration corresponding to the peripheral of the waveguide connector 250. In some embodiments, the waveguide connector 250 may include a hollow electrically conductive waveguide connector (e.g., a metallic waveguide connector). In other embodiments, the waveguide connector 250 may include a solid-state or hollow dielectric waveguide connector. In some embodiments, the waveguide connector 250 may be at least partially filled with one or more dielectric materials, which may also include a metallic material.

[0053] In one embodiment, the slotted signal converter 221 includes a first electrically conductive member 211b (or the bottom surface of the slotted signal converter) and a second electrically conductive member 211a (or the top surface of the slotted signal converter) communicatively coupled together. The first electrically conductive member 211b may be disposed in, on, or around at least a portion of the first layer 212 and / or the second layer 210 of the package 230. The first electrically conductive member 211b is physically coupled or otherwise adhered to the top surface of the package 230. The first electrically conductive member 211b may be communicatively coupled to one or more systems, structures, or devices disposed in, on, or around the package 130.

[0054] The slot-line signal converter 221 includes a balun structure 218 to convert a signal received from a source into a slot-line signal. In some embodiments, the balun structure 218 may include a dumbbell-shaped, double-lobed balun structure (or the like) and / or any other shape, such as circular, rectangular, wedge-shaped, hexagonal, etc. For one embodiment, the shape of the balun structure 218 may be selected based on optimizing performance with respect to available waveguide area. A first conductive member 211b includes a balun structure with a first physical configuration, and a second conductive member 211a includes a balun structure with a second physical configuration. Note, for example, Figure 2B-2C It can be shown that 211a and 211b are formed from a single metal piece with the same physical configuration, which has been processed to include a balun structure 218 and a slot line signal converter 221; however, in some instances, the components 211a and 211b may not be the same, or may have different physical configurations (e.g., if the waveguide transmitter has a cone in the balun opening, the components 211a and 211b may be different).

[0055] In some instances, the balance-to-unbalance converter structure in the first electrical conduction member 211b may be the same as the balance-to-unbalance converter structure in the second electrical conduction member 211a. In other instances, the balance-to-unbalance converter structure in the first electrical conduction member 211b may be different from the balance-to-unbalance converter structure in the second electrical conduction member 211a.

[0056] The second electrically conductive component 211a is coupled to the conical slot transmitter 220 in a communicative manner. For example... Figure 2CAs shown, the conical slot transmitter 220 includes a cone 226 physically and / or communicatively coupled to a second electrically conductive member 211a at a first location and extending diagonally to a second location on the top inner wall of the waveguide connector 250. In some embodiments, the cones 226 are arranged at intervals to form feed channels with connection point 219 and balun structure 218 (e.g., as shown in the diagram). Figure 3 The feed channel 221 shown is illustrated. In an embodiment, the cone 226 may be physically and / or electrically coupled to the second electrically conductive member 211a at a first position relative to the balun structure 218 and a second position relative to the balun structure 218 on the top inner wall of the waveguide connector 250. In such embodiments, the first and second positions may be positioned opposite each other across the balun structure 218 (e.g., on opposite sides thereof) (i.e., the cone 226 is positioned based on the balun structure 218). Note that the tapered slot emitter 220 may include one or more coplanar tapered slots (e.g., as shown in the diagram). Figure 7 (as shown), and the cone 226 may have any size and / or shape based on the desired package design and / or application.

[0057] Microstrip feed 240 provides a signal to balun structure 218. In one embodiment, connection point 219 communicatively couples microstrip feed 240 to balun structure 218. The two lobes of balun structure 218 generate impedance-matched slotline signals. Tapered slot emitter 220 converts the slotline signals generated by balun structure 218 into closed waveguide mode signals (e.g., TE10 signals for operatively coupled rectangular waveguides), which propagate along waveguide 254 operatively coupled to tapered slot emitter 220 via waveguide connector 250. Traveling wave signals travel along slot channels (e.g., Figure 3 The traveling wave signal propagates through the slot channel 221 and is emitted by the tapered slot transmitter 220. The traveling wave signal propagates along a waveguide operatively coupled to the tapered slot transmitter 220 via a waveguide connector 250 (note that, as described above, the waveguide connector 250 has been illustrated as transparent for simplicity and clarity). As described herein, the waveguide can be at least one of a metallic waveguide, a dielectric waveguide, and a dielectric waveguide with a metallic coating (note that, unlike in data center applications, embodiments may include the use of a non-metallic coated dielectric waveguide where density and crosstalk are not issues).

[0058] In some embodiments, slot-line signal converter 210 converts the microstrip signal from microstrip feed line 240 into a slot-line signal. The microstrip signal may, in some implementations, be generated or otherwise created and supplied / transmitted to the microstrip feed line 240 and then to slot-line signal converter 221 by one or more components such as those disposed on or communicatively coupled to the mm-wave die of the semiconductor package 230. In some embodiments, the microstrip signal may include, but is not limited to, signals at microwave frequencies (e.g., from approximately 30 GHz to approximately 300 GHz). Note that other signal frequencies may be used for equivalent effects. Additionally, in some embodiments, the microstrip line may include any other line type that may be used as the feed structure, such as a grounded coplanar waveguide (GCPW) line or a coplanar waveguide (CPW) line or a stripline.

[0059] In one embodiment, the slotted signal converter 221 may have any shape, size, or configuration. As described above, in some embodiments, the slotted signal converter 221 may be formed (integrated) with a tapered slot transmitter 220 and a waveguide connector 250. In an alternative embodiment, the slotted signal converter 221 may be formed on the top surface of the package (e.g., as in...). Figure 5B As shown in the diagram), or formed as a separate component that can then be stacked with a package and waveguide connector. In some embodiments, the first electrically conductive member 211b may be formed, patterned, or otherwise disposed on the top surface of the package 230. In other embodiments, the first electrically conductive member 211b may be disposed on the top surface of the package 230 and coupled conductively and / or physically to one or more electrical contacts (e.g., vias, pads, solder pads, or similar electrically conductive structures) disposed on the top surface of the package 230. In such embodiments, the first electrically conductive member 211b may be coupled physically and conductively to one or more electrical contacts via solder, electrically conductive adhesive, or similar electrically conductive adhesive or bonding systems and methods. For other embodiments, no conductive connection is required between the first electrically conductive member 211b and the top surface of the package 230 (i.e., no conductive connection is required under the body of the SMT connector, but conductive connections may still exist around the edges of the SMT connector). Note that, as follows... Figure 2C As described herein, the waveguide transmitter system 200 may include one or more mounting pads (e.g., ) disposed on one or more outer walls of the waveguide connector 250 for electrically coupling the package 230 and the waveguide connector 250. Figure 2C Assembly pad 205).

[0060] The slot-line signal converter 221 uses a balun structure 218 to convert the received microstrip signal into a slot-line mode signal (i.e., two impedance-matched signals). The balun structure 218 may include, for example... Figure 2B and2C The illustrated dual-lobe or dumbbell-shaped balun structure 218 receives an input microstrip signal at a central location on a structure such as connection point 219. Open spaces in the balun structure 218 provide impedance-matched slotline signals that are passed to a communicatively coupled slotline signal converter 221. In some embodiments, where the slotline signal converter 221 is a single component having a first conductive member 211b and a second conductive member 211a, the balun structure 218 may be symmetrical across the thickness of the slotline signal converter 221 (i.e., the physical configuration of the balun structure 218 on the top and bottom surfaces of the slotline signal converter 221 may be identical). In some embodiments, the balun structure 218 may be asymmetrical across the thickness of the slotline signal converter 221 (i.e., the physical configuration of the balun structure 218 on the top and bottom surfaces of the slotline signal converter 221 may be different).

[0061] The balanced-to-unbalanced converter structure 218 may include a double-lobe structure with symmetrical or asymmetrical lobes of any physical configuration. Thus, the lobes forming the balanced-to-unbalanced converter structure 218 may be, but are not limited to, semicircular, circular, semi-elliptical, elliptical, semi-polygonal, polygonal, rectangular, wedge-shaped, hexagonal, etc., to optimize performance taking into account the available waveguide area. The physical dimensions and / or configuration of the lobes forming the balanced-to-unbalanced converter structure 218 may be entirely or partially based on the operating frequency and / or frequency range of the microstrip signal supplied to the slot-line signal converter 221 by the microstrip feed 240.

[0062] In one embodiment, the tapered slot transmitter 220 with tapered section 226 transforms the propagation axis (and feed path) of the slot line mode signal provided by the balun structure 218 into a different propagation axis (e.g., into an axis facing the opening of waveguide 254), and converts the signal into a closed waveguide mode signal propagating along waveguide 254. In some embodiments, the propagation axis of the closed waveguide mode signal may be parallel to the outer surface of the semiconductor package 230. In some embodiments, the propagation axis of the closed waveguide mode signal may be aligned with or parallel to the longitudinal axis of the waveguide connector 250 coupled to the traveling wave transmitter system 200.

[0063] Note that, as Figure 2B The waveguide transmitter system 200 shown may include fewer or additional package components based on the desired package design.

[0064] Figure 2CThis is a perspective view of a waveguide transmitter system 200, according to one embodiment, including a package 230 with a first layer 212, a second layer 210, and a microstrip feed 240, and a waveguide connector 250 with a slotted signal converter 221, a balun structure 218, and a slotted transmitter 220. Specifically, Figure 2C The internal structure of the waveguide connector 250 coupled to the external waveguide 254 and the tapered slot transmitter 220 is shown.

[0065] As described above, the tapered slot emitter 220 on the waveguide connector 250 achieves different excitation structures, for example, by using a tapered slot feed channel. The tapered slot feed channel (e.g., Figure 3 The feed channel 221 is fed via a microstrip feed 240 terminated by radial stubs such as connection point 219, without the use of any conductive vias. In one embodiment, the microstrip feed 240 is formed on a package layer (e.g., the second layer 210 of package 230) using a process compatible with standard PCB manufacturing. Thus, the assembly configuration of the waveguide connector 250, package 230, and slot emitter 220 inherently promotes wider bandwidth and is significantly less sensitive to manufacturing tolerances. Note that, as shown in further detail below, the slot emitter and connector can be separate STM components disposed on top of the package, or can be partially patterned on the package and partially mounted on top of the package.

[0066] In some embodiments, the balun structure 218 of the slot-line signal converter 221 is provided to provide impedance matching (i.e., the balun structure 218 is used as an inductive load for the slot-line mode signal). Using the tapered slot emitter 220, the slot-line mode signal is fed through a feed channel (e.g., Figure 3 The signal is transmitted via feed channel 221, converted in the vertical direction (i.e., orthogonal to package 230), and propagated through tapered section 226, whereby the slotted mode signal is thus converted into a closed waveguide mode signal (e.g., TE10 for a rectangular waveguide). In some embodiments, tapered section 226 can be formed by a straight line (e.g., as shown in the image). Figure 2C , 3 (As shown in 4C and 5A). In other embodiments, the cone 226 may be formed by a number of cone shapes / types (e.g., stepped cone, exponential, square, elliptical, etc.) to optimize the performance and / or manufacturability of the waveguide connector 250.

[0067] Furthermore, as described above, taking manufacturing and assembly boundary conditions into account, the slotted signal converter 221 and the balun structure 218 can be implemented as components on the top layer of the package (e.g., as shown in the image). Figure 5B (as shown), or as Figure 2CThe fully integrated and stand-alone SMT assembly shown is formed by directly mounting / assembling it on top of package 230 (e.g., forming the bottom surface of the SMT assembly). Note that in, for example, two variations, the body of the assembly must be electrically coupled to the second layer 210 of package 230 (i.e., package GND) using conductive epoxy and mounting pads 205 (e.g., as shown). Figure 4C (as shown in the image).

[0068] In other embodiments, no conductive connections are required under the body of the SMT assembly (e.g., under the lowest surface of the taper emitter 220 and waveguide connector 250), which simplifies assembly as the assembly resembles any other standard SMT assembly. Mounting pads 205 (or legs / pins) formed around the outer walls(s) of the waveguide connector 250 can be used to facilitate easier assembly of the package 230 using standard SMT assembly processes (or similar). Additionally, the mounting pads 250 can be used for self-alignment during reflow assembly. Note that a single waveguide connector (e.g., waveguide connector 250) can also be arranged to excite more than one waveguide (as shown in Figures 4-6).

[0069] Additionally, one or more components of the waveguide transmitter system 200 can be further formed by plastic injection molding and / or square molding. Using a PIM process (or square molding) can be advantageous because mating structures of the system 200, such as aligned pins, keying features, and the like, can be facilitated on the mold to achieve proper mating between the waveguide and the connector (e.g., plug-and-socket mating scheme).

[0070] Note that, as Figure 2C The waveguide transmitter system 200 shown may include fewer or additional package components based on the desired package design.

[0071] Figure 2D This is a cross-sectional view of a portion of the package 230 of the waveguide transmitter system 200. In one embodiment, the package 230 includes a first layer 212, a second layer 210, and one or more dielectric layers 207.

[0072] like Figure 2DAs shown, a first layer 212 may be disposed on a second layer 210 and patterned to form an opening 214. The opening 214 of the first layer 212 is formed to couple the second layer 210 (encapsulation GND) and the outer wall (not shown) of the waveguide connector using a solder paste printing process, a conductive epoxy resin dispensing process, or any similar process. In one embodiment, the first layer 212 may be a solder mask, a barrier layer, or any other dielectric layer. Note that the first layer 212 may be optional, such that, according to this optional implementation, the top surface of the package 230 is the second layer 210.

[0073] In one embodiment, package 230 has one or more dielectric layers 207 surrounding (set and / or adjacent to) one or more conductive layers, wherein the second layer 210 is a top conductive layer forming the GND plane of package 230. According to this embodiment, when using a fully integrated SMT waveguide connector (e.g., including a balun structure 218 on the bottom surface of connector 250)... Figure 2B-2C When the waveguide connector 250 is used, the package 230 may have a connector solder area 203 that can be used as a surface area / location in which the SMT waveguide connector can be set.

[0074] For example, connector solder joint 203 may be formed between ground via wall 209 and second layer 210, wherein ground via wall 209 may be formed around the outer periphery / contour of the waveguide connector and electrically coupled to at least one or more conductive layers of package 230. In another embodiment, package 230 may have a different architecture (e.g., such as...) when the SMT connector does not include a balun structure on the bottom surface (and therefore the SMT connector is partially integrated when the balun structure is formed / printed on the second layer 210 of the package). Figure 5C (As shown in the illustration). In one embodiment, one or more mounting pads 205 of the waveguide connector 250 may be provided on at least one or more openings 214 on the package 230, and then a reflow process may be used to electrically couple (and / or adhere) the outer surface walls(s) of the connector 250 to the package ground on the package 530. In another embodiment, one or more mounting pads 205 of the waveguide connector 250 may be provided on at least one or more openings 214 on the package 230, and then electrically conductive adhesive / epoxy resin may be used to electrically couple (and / or adhere) the outer surface walls(s) of the connector 250 to the package ground on the package 530.

[0075] Note that, as Figure 2D The waveguide transmitter system 200 shown may include fewer or additional package components based on the desired package design.

[0076] Figure 3This is a more detailed perspective view of a waveguide transmitter system 200, according to one embodiment, including a package 230 with a first layer 212, a second layer 210, and a microstrip feed 240, and a waveguide connector 250 with a slotted signal converter 221, a balun structure 218, and a slotted transmitter 220. Figure 3 In the diagram, a close-up view of the waveguide transmitter system 200 is shown, including a tapered slot transmitter 220 and a waveguide connector 250. Note that... Figure 3 The waveguide transmitter system 200 can be used with Figure 2A-2D The waveguide transmitter system 200 is identical. Also note that one or more well-known features may be omitted or simplified to avoid making the illustrative implementation difficult to understand.

[0077] In one embodiment, the waveguide transmitter system 200 has a fully integrated SMT assembly capable of being mounted and disposed on a package 230 using standard PCB assembly techniques. The fully integrated SMT assembly may include a slotted transmitter 220 disposed in, on, or around at least a portion of the inner housing (or surface) of the waveguide connector 250 (i.e., the slotted transmitter is integrally formed with the waveguide connector 250) and a slotted-line signal converter 221 with a balun structure 218 also disposed in, on, or around the bottom surface of the waveguide connector 250.

[0078] like Figure 3 As shown, assembling / manufacturing each of these components together as a single, fully integrated, and independent SMT assembly allows for an improved (and simplified) assembly and manufacturing process for the waveguide transmitter / connector system 200. In some embodiments, the tapered body 226 of the slot transmitter 220 and the slot line signal converter 221 are arranged at intervals to form a feed channel 221. The feed channel 221 is aligned with the center portion of the balun structure 218 of the slot line signal converter 221 and receives the microstrip signal from the microstrip feed line 240. The slot line signal converter 221 then uses the balun structure 218 to convert the microstrip signal into a slot line mode signal and transmits the slot line mode signal via the feed channel 221. Using the tapered body 226, the slot transmitter 220 transforms the propagation axis of the slot line mode signal provided by the feed channel 221 into a different axis of propagation of the opening 254 of the waveguide connector 250. The conical slot transmitter 220 has a conical slot 222 formed by a second electrically conductive member 211a of a conical body 226 and a slot line signal converter 221.

[0079] The slotted emitter 220 converts the slotted pattern signal fed by channel 221 into a closed waveguide pattern signal propagating along the waveguide (not shown). In some embodiments, the cone 226 of the slotted emitter 220 may be electrically insulated using, for example, a thin insulator, dielectric layer, or similar material. In some embodiments, the waveguide emitter system 200 may be formed using one or more different manufacturing / assembly processes, such as, but not limited to, computer numerical control (CNC) or micro-CNC with optional subsequent electroplating, metal injection molding, metal 3D printing, plastic injection molding with a metal coating, and / or 3D printing (temperature resistant) plastic with a metal coating. Note that, additionally, a square forming process may follow these manufacturing / assembly processes to enable proper mating between the waveguide and the connector. It should also be noted that the waveguide transmitter system 200 may be formed to have any size and / or shape based on the desired package design and application (e.g., the size may be based on the operating frequency (e.g., if operating at approximately 60 GHz, the size may be approximately 2.5 mm x 2.5 mm, 3.5 mm x 1.75 mm, and / or 4 mm x 2 mm, etc., and / or if operating at approximately 120 GHz, the size may be approximately 1.7 mm x 0.85 mm and / or 2 mm x 1 mm, etc.), the length of one or more components (e.g., may vary from a few mm to centimeters (cm), and / or the wall thickness (e.g., may vary from approximately less than 50 μm to several mm)).

[0080] Note that the waveguide transmitter system 300 may include fewer or additional package components depending on the desired package design.

[0081] Figures 4A-4C According to some embodiments, a waveguide transmitter system 400 is illustrated, having a package 430 and a waveguide connector 450 using a tapered slot transmitter 420 for excitation of the waveguide. Additionally, Figures 4A-4C The illustration shows a fully integrated and stand-alone SMT waveguide connector 450 disposed on package 430. The waveguide transmitter system 400 can be similar to... Figure 2A-2D The waveguide transmitter system 200, but the waveguide transmitter system 400 has fully integrated and patterned SMT waveguide connectors 450 arranged to excite more than one waveguide (not shown). Note that Figures 4A-4C Each highlighted component of the waveguide transmitter system 400 (e.g., Figure 4A Waveguide connector 450 is shown. Figure 4B Package 430 is shown, and Figure 4C A compartment of a waveguide connector 450 is shown, which is disposed on the top surface of a package 430 using a conductive layer 406 and one or more mounting pads 405.

[0082] Now refer to Figure 4A A bottom perspective view of the waveguide connector 450 of the waveguide transmitter system 400 is illustrated. The waveguide connector 450 has one or more compartments (or housings) 450a-c for exciting one or more waveguides. The waveguide connector 450 may be similar to Figure 2A-2D The waveguide connector 250, but as in Figure 4A As shown, the waveguide connector 450 has three compartments 450a-c, each of which has a single / individual waveguide transmitter. Note that the waveguide connector 450 can have any number of compartments based on the desired package design.

[0083] Waveguide connector 450 has a bottom surface 460 and a top surface 461. Waveguide connector 450 includes one or more balun structures 418 disposed on the bottom surface 460. As described above, each compartment 450a-c can be used as a separate waveguide connector, wherein each compartment 450a-c may have a tapered slot emitter and a slot signal converter (e.g., such as) with one of the balun structures 418. Figure 4C (As shown in the diagram). Each compartment 450a-c can be used to propagate closed waveguide mode signals via waveguides, which can be communicatively coupled to an opening 454 formed in each compartment 450a-c.

[0084] In some embodiments, the waveguide connector 450 may have one or more mounting pads 405 disposed on one or more outer walls of the waveguide connector 450. The one or more mounting pads 405 may be used to align and electrically couple the waveguide connector 450 and the package 430. The one or more mounting pads 405 may be disposed on the package 430, and then a reflow process (or similar) may be used to electrically couple (and / or adhere) the one or more outer surface walls of the connector 450 to the package ground on the package 430 (as in...). Figure 4C As shown in the figure.

[0085] Note that, as Figure 4A The waveguide transmitter system 400 shown may include fewer or additional package components based on the desired package design.

[0086] Figure 4B This is a top perspective view of the package 430 of the waveguide transmitter system 400. According to one embodiment, the package 430 has a first layer 412 and a second layer 210. In one embodiment, the first layer 412 may be disposed on a portion of the second layer 410, wherein the waveguide connector 450 may be disposed on the first layer 412 (as shown below). Figure 4C(As shown in the illustration). In one embodiment, the first layer 412 may be a solder mask and / or a dielectric layer. In one embodiment, the second layer 410 is a top conductive layer, wherein the top conductive layer is a GND plane layer. Note that in one embodiment, the first layer 412 may be optional, such that the top surface of the package 430 is the second layer 410.

[0087] Note that, as Figure 4B The waveguide transmitter system 400 shown may include fewer or additional package components based on the desired package design.

[0088] Figure 4C This is a top perspective view of a waveguide transmitter system 400, according to one embodiment, including a package 430 with a first layer 412 and a second layer 410, and a waveguide connector 450 with a slotted signal converter 411, a balun structure 418, and a slotted transmitter 420. Specifically, Figure 4C The internal structure of the tapered slot transmitter 420 and the waveguide connector 450 is shown. Note that one or more well-known features may be omitted or simplified to avoid making the illustrative implementation difficult to understand (e.g., the waveguide connector 450 has one or more compartments 450a-c, but for simplicity, only one compartment of the waveguide connector 450 is shown).

[0089] In one embodiment, a waveguide connector 450 is disposed on a portion of a first layer 412. The body of the waveguide connector 450 may require coupling to the package GND (e.g., a second layer 410) using a conductive layer 406 (or a conductive epoxy layer) and mounting pads 405. For example, the conductive layer 406 may be disposed on one or more outer walls of the waveguide connector 450 or below the bottom surface 460 of the waveguide connector 450. The conductive layer 406 and mounting pads 405 may be disposed on one or more openings (not shown) of the package exposed to the package GND, such that the conductive layer 406 and mounting pads 405 can be reflowed to electrically couple the connector 450 to the package GND of the package 430. The conductive layer 406 and mounting pads 405 formed around the SMT waveguide connector 450 facilitate easier assembly on the package 430 (e.g., using a standard SMT assembly process) and are used for self-alignment during reflow assembly / processing.

[0090] Package 430 may have a microstrip feed line for transmitting signals to a balun structure 418 disposed on slotted signal converter 411. Slotted transmitter 420 may have a feed channel 421 for receiving microstrip signals, terminated by a broadband radial stub (including vias or any other type of stub). The balun structure 418 disposed on slotted signal converter 411 may be used to provide impedance matching and convert the microstrip signal into a slotted mode signal. Using slotted transmitter 420, the slotted mode signal is transmitted through feed channel 421 and propagates through slotted transmitter 420, wherein the slotted mode signal is converted into a closed waveguide mode signal for transmission along the opening of connector 450 coupled to external waveguide 454.

[0091] Note that, as Figure 4C The waveguide transmitter system 400 shown may include fewer or additional package components based on the desired package design.

[0092] Figures 5A-5C According to some embodiments, a waveguide transmitter system 500 is illustrated, having a package 530 and a waveguide connector 550 using one or more tapered slot transmitters 520 for exciting one or more waveguides. Additionally, Figures 5A-5C The illustration shows a partially integrated SMT waveguide connector 550 disposed on package 530. The waveguide transmitter system 500 can be similar to... Figures 4A-4C The waveguide transmitter system 400 includes a partially integrated SMT waveguide connector 550 with one or more tapered slots 526 integrated (or patterned / formed), while other components (e.g., a balun structure 518) are disposed / printed on the top surface layer 510 of the package 530. The waveguide transmitter system 500 includes a partially integrated SMT waveguide connector 550 with a waveguide transmitter 520 and a tapered slot 526. The waveguide transmitter system 500 also includes a package 530 with a balun structure 518 on the top surface 510 of the package 530, wherein the balun structure 518 is disposed on the top surface 510 of the package 530 to form a slotted signal converter 511, and the waveguide connector 550 is disposed on the top surface 510 of the package 530. The tapered body 526 of the waveguide connector 552 can be disposed on the slotted line signal converter 511 of the package 530 and the terminal 552 of the waveguide connector 550 to form a channel 521 and a tapered slot 522.

[0093] Note that, as Figure 4C Similar assembly techniques shown (e.g., using solder, mounting pads, and / or conductive epoxy layers) can be used with Figures 5A-5C It is used in conjunction with the waveguide transmitter system 500. Also note that... Figures 5A-5CEach highlighted component of the waveguide transmitter system 500 (e.g., Figure 5A Waveguide connector 550 is shown. Figure 5B The package 530 is shown, and Figure 5C (This shows one or more layers, vias, and openings of package 530).

[0094] Now refer to Figure 5A A top perspective view of the waveguide connector 550 of the waveguide transmitter system 500 is illustrated. The waveguide connector 550 has one or more compartments 550a-c for exciting one or more waveguides. The waveguide connector 550 may be similar to... Figures 4A-4C The waveguide connector 450, but the waveguide connector 550 has a bottom surface 560 that does not integrate the balun structure and slotted line signal converter. Instead, as... Figure 5B As shown, the balun structure 518 is disposed on the top layer 510 of the package 530.

[0095] Waveguide connector 550 has a bottom surface 560 and a top surface 561. The bottom surface 560 may include the bottom surface of a tapered body 526 and an outer / inner wall of the waveguide connector 550. As described above, each compartment 550a-c can be used as a separate waveguide connector, wherein each compartment 550a-c may have at least a tapered slot transmitter. Each compartment 550a-c can be used to propagate closed waveguide mode signals via a waveguide that can be communicatively coupled to an opening 554 formed in each compartment 550a-c. In some embodiments, waveguide connector 550 may have one or more mounting pads 505 disposed on one or more outer walls of waveguide connector 550. The one or more mounting pads 505 may be used to align and electrically couple waveguide connector 518, balun structure 518, and package 530.

[0096] Note that, as Figure 5A The waveguide transmitter system 500 shown can include fewer or additional package components based on the desired package design.

[0097] Figure 5B This is a top perspective view of the package 530 of the waveguide transmitter system 500. Package 530 has a microstrip feed 540, a balun structure 518, and a top conductive layer 510. Note that one or more known features may be present. Figure 5B The details are omitted or simplified to avoid making the illustrative implementation difficult to understand (e.g., for simplicity, the optional first layer or solder mask may not be shown). Similarly, for clarity and simplicity, Figure 5B The package 530 shown can be used to accommodate a waveguide connector and / or a compartment (e.g., compartment 550a of waveguide connector 550).

[0098] In one embodiment, the top conductive layer 510 is a GND plane layer. In one embodiment, a balun structure 518 is formed (or patterned / set) on the top conductive layer 510, which also forms a slot line converter on the package 530. Thus, the microstrip feed 540 can feed a signal to the balun structure 518 on the slot line converter. The slot line converter of the package 530 can convert (and transform) the signal into a slot line signal and transmit the slot line signal to be aligned or parallel to the z-axis. In one embodiment, the top conductive layer 510 may be disposed on or above the microstrip feed 510. In another embodiment, the bottom surface 560 of the waveguide connector 550 (e.g., Figure 5A As shown, the waveguide connector 550 can be directly disposed on the top conductive layer 510 of the package 530, wherein the waveguide connector 550 can now be closed at each end except for one opening 554.

[0099] Note that, as Figure 5B The waveguide transmitter system 500 shown can include fewer or additional package components based on the desired package design.

[0100] Figure 5C This is a cross-sectional view of a portion of the package 530 of the waveguide transmitter system 500. In one embodiment, the package 530 may include a first layer 512, a second layer 510, and one or more dielectric layers 507. The package 530 may resemble... Figure 2D Package 230, but for this embodiment, package 530 is patterned for waveguide connectors that do not include a balance-to-unbalance converter structure on the bottom surface of the connector (e.g., waveguide connector 550). (Therefore, the balance-to-unbalance converter structure is printed / patterned on the second lead 510 (or the top metal layer).

[0101] like Figure 5C As shown, a first layer 512 may be disposed on a second layer 510 and patterned to form an opening 514. The opening 514 of the first layer 512 is formed to couple the second layer 510 (encapsulation GND) and the outer wall (not shown) of the waveguide connector using a solder paste printing process, a conductive epoxy resin dispensing process, or any similar process. In one embodiment, the first layer 512 may be a solder mask, a barrier layer, or any other dielectric layer. Note that the first layer 512 may be optional, such that, according to this optional implementation, the top surface of the package 530 is the second layer 210.

[0102] In one embodiment, both the first layer 512 and the second layer 510 are patterned to form an opening 515 and a connector solder pad 503. The opening 515 can be used and patterned (e.g., through a dumbbell-shaped opening) to realize a balanced-to-unbalanced converter structure for a slotted line converter on the top surface of the package 530. In one embodiment, the package 530 has one or more dielectric layers 507 surrounding (and / adjacent to) one or more conductive layers, wherein the second layer 510 is the top conductive layer forming the GND plane of the package 530. According to this embodiment, in the use of partially integrated SMT waveguide connectors (e.g., without a balanced-to-unbalanced converter structure on the bottom surface of the connector 550), a balanced-to-unbalanced converter structure is not included. Figure 5A When the waveguide connector 550 is used, the package 530 may have a connector solder area 503 that can be used as a surface area / location in which the SMT waveguide connector can be set.

[0103] For example, connector solder pads 503 may be partially assigned on a second layer 510 between the edge of the first layer 510 and the ground via wall 509, wherein the top pad of the ground via wall 509 is coupled to the second layer 510, and at least one or more conductive layers are formed around the outer periphery / contour of the waveguide connector to be electrically coupled to the package 530. In another embodiment, the package 530 may have a different architecture (e.g., such as...) when the SMT connector does not include a balun structure on the bottom surface (and therefore the SMT connector is fully integrated when the balun structure is formed / printed on the bottom surface of the SMT connector). Figure 2D (As shown in the diagram). Additionally, one or more mounting pads 505 of the waveguide connector 550 may be provided on at least one or more openings 514 on the package 530, and a subsequent reflow process may be used to electrically couple (and / or adhere) the outer surface wall(s) of the connector 550 to the package ground on the package 530.

[0104] Note that, as Figure 5C The waveguide transmitter system 500 shown can include fewer or additional package components based on the desired package design.

[0105] Figure 6 This is a perspective view of a waveguide transmitter system 600, according to some embodiments, having a waveguide connector 650 using one or more tapered slot transmitters 520 for exciting one or more waveguides. The waveguide transmitter system 600 illustrates partially integrated SMT waveguide connectors 650 (such as... Figure 5A The SMT waveguide connector 550). The waveguide transmitter system 600 can be similar to... Figures 4A-4CThe waveguide transmitter system 400, however, only integrates one or more tapered slots 626 with the partially integrated SMT waveguide connector 650, while other components (e.g., balun structures) can be disposed on the top surface layer of the package. Similarly, the waveguide transmitter system 600 can be similar to Figures 5A-5C The waveguide transmitter system 500, but the partially integrated SMT waveguide connector 650 includes a tapered body 626 with a stepped taper for optimizing the performance and / or manufacturability of the waveguide transmitter system 600. Note, as Figure 4C Similar assembly techniques shown (e.g., using solder, assembly pads, and / or conductive epoxy layers) can be used with the waveguide transmitter system 600.

[0106] like Figure 6 A perspective view of the waveguide connector 650 of the waveguide transmitter system 600 is illustrated. The waveguide connector 650 has one or more compartments 650a-c for exciting one or more waveguides. The waveguide connector 650 has a bottom surface 660 and a top surface 661. The bottom surface 660 may include the bottom surface of a tapered body 626 and the outer / inner wall of the waveguide connector 650. As described above, each compartment 650a-c can be used as a separate waveguide connector, wherein each compartment 650a-c may have a tapered slot transmitter with a stepped tapered body 626.

[0107] The stepped cone 626 can be patterned to have one or more stepped edges on the cone, wherein, for example, the outer stepped edge is patterned between a protruding inner step. Note that the stepped cone can have multiple steps (or edges). For example, as... Figure 6 The stepped cone 626 shown has three steps, but other embodiments may include more or fewer than three steps if desired. Additionally, the waveguide connector 650 may have one or more different types of cones (e.g., straight, exponential, square, elliptical, double-finned, etc.), including patterning at least one or more of the compartments 650a-c with one or more different types of cones (i.e., compartment 650a may have a stepped cone, 650b may have a double-finned cone, and 650c may have an elliptical cone).

[0108] Each compartment 650a-c can be used to propagate a closed waveguide mode signal via a waveguide, which can be communicatively coupled to an opening 654 formed in each compartment 650a-c. In some embodiments, the waveguide connector 650 may have one or more mounting pads 605 disposed on one or more outer walls of the waveguide connector 650. The one or more mounting pads 605 can be used to align and electrically couple the waveguide connector 650 to the package 430.

[0109] Note that the waveguide transmitter system 600 may include fewer or additional package components depending on the desired package design.

[0110] Figure 7 This is a cross-sectional view of a waveguide transmitter system 700 according to one embodiment, including a package 730 with a top conductive layer 710 and a microstrip feed 740, and a waveguide connector 750 with a slotted signal converter 711, a balun structure 718, and a tapered slot transmitter 720. The waveguide transmitter system 700 may be similar to the waveguide transmitter system 200 of Figures 2-3, but the waveguide transmitter system 700 has a tapered slot transmitter 720 comprising two coplanar members (double-finned tapered slots or coplanar plates), a first member 724 being physically and / or communicatively coupled to the top surface of the slotted signal converter 711 at a first location, and a second member 726 also being physically and / or communicatively coupled to the top surface of the slotted signal converter 711 at a second location. It should also be noted that one or more well-known features may be omitted or simplified to avoid obscuring the illustrative implementation.

[0111] In some embodiments, a planar first member 724 and a planar second member 726 are coplanarly arranged at intervals to form a feed channel 721 and a tapered slot 722. In one embodiment, the first member 724 may be physically and / or electrically coupled to the top surface of the slot-line signal converter 711 at a first location relative to the balun structure 718, and the second member 726 may be physically and / or electrically coupled to the top surface of the slot-line signal converter 711 at a second location relative to the balun structure 718. In such embodiments, the first and second locations may be arranged opposite each other across the balun structure 718 (e.g., on opposite sides thereof).

[0112] The first member 724 and the second member 726 may be planar members, disposed coplanarly with each other (i.e., the first member 724 and the second member 726 may be placed or otherwise fall in the same plane) to form a dual-fin conical slot transmitter 720 within the waveguide connector 750. A first edge of the first member 724 may be disposed near the top surface of the slot-line signal converter 711. The first edge of the first member 724 may be physically and / or electrically coupled to the top surface of the slot-line signal converter 711. A second edge of the first member 724 may form at least a portion of the boundary, border, or periphery of the conical slot 722. Correspondingly, a first edge of the second member 726 may be disposed near the waveguide connector 750. The first edge of the second member 726 may be physically and / or electrically coupled to the waveguide connector 750. The second edge of the second member 726 may form at least a portion of the boundary, border, or periphery of the conical slot 722.

[0113] In such embodiments, the second edge of the first member 724 and the second edge of the second member 726 form a tapered groove 722. The second edges of the first member 724 and the second edge of the second member 726 may extend at an angle such that the second edges are positioned relatively closer to each other at the first end of the tapered groove 722 than at the opposite second end of the tapered groove 722, while the second edges are positioned relatively farther apart (i.e., the closer the second edges of the first member 724 and the second member 726 are to the feed channel 721, the smaller the taper angle of the tapered groove 722). In one embodiment, the first member 724 and the second member 726 forming the tapered groove emitter 720 are grounded to the ground plane of the package 730 via a waveguide connector 750 disposed on the top conductive layer 710 (package GND) of the package 730. In other embodiments, the first member 724 and the second member 726 forming the tapered groove emitter 720 may be directly or indirectly coupled to the ground plane of the package 730.

[0114] In some embodiments, the second edge of the first member 724 and / or the second edge of the second member 726 may include, but are not limited to, a straight edge, a stepped edge, a curved edge, an elliptical edge, or an arcuate edge. In some embodiments, the distance between the first member 724 and the second member 726 may be based wholly or partially on the frequency and / or bandwidth of the closed waveguide mode signal transmitted by the tapered slot transmitter 720.

[0115] According to some embodiments, all or a portion of the first member 724 and / or all or a portion of the second member 726 may be integrally formed with the top surface of the slotted signal converter 711. In one embodiment, the first member 724 and the second member 726 extend from the top surface of the slotted signal converter 711 at an angle of approximately 45° to approximately 90° relative to the top surface of the slotted signal converter 711. In some embodiments, the overall physical dimensions of the first member 724 and the second member 726 may be based, wholly or partially, on the frequency and / or bandwidth of the closed waveguide mode signal transmitted by the tapered slot transmitter 720.

[0116] In one embodiment, the waveguide transmitter system 700 has a fully integrated SMT waveguide connector / assembly 750 that can be mounted and disposed on a package 730 using standard PCB assembly techniques. The fully integrated SMT waveguide connector 750 may include a tapered slot transmitter 720 disposed in, on, or around at least a portion of the inner housing of the waveguide connector 750, and a slot-line signal converter 711 with a balun structure 718 also disposed in, on, or around the bottom surface of the waveguide connector 750.

[0117] In some embodiments, the first component 724 and the second component 726 of the slot transmitter 720, along with the slot line signal converter 711, are arranged at intervals to form a feed channel 721. The feed channel 721 is aligned with the center portion of the balun structure 718 of the slot line signal converter 711 and receives a microstrip signal from a microstrip feed line 740 terminated at connection point 719. The slot line signal converter 711 then uses the balun structure 718 to convert the microstrip signal into a slot line mode signal and transmits the slot line mode signal via the feed channel 721. The slot transmitter 720 transforms the propagation axis of the slot line mode signal provided by the feed channel 721 into a different axis of propagation toward the slot 722 of the waveguide connector 750. The slot transmitter 720 has a slot 722 formed by coplanar components 724 and 726. The tapered slot emitter 720 converts the slot line mode signal fed by channel 721 into a closed waveguide mode signal propagating along a waveguide (not shown). In some embodiments, the coplanar members 724 and 726 of the tapered slot emitter 720 may be electrically insulated from each other using, for example, a thin insulator, a dielectric layer, or a similar material.

[0118] Note that the waveguide transmitter system 700 may include fewer or additional package components depending on the desired package design.

[0119] Figure 8 This is a perspective view of a vertical waveguide transmitter system 800 according to one embodiment, including a package 830 with a top conductive layer 810 and a microstrip feed 840, and a waveguide connector 850 with a slot-line signal converter 811, a balun structure 818, and a taper slot emitter 820. The waveguide transmitter system 800 may be similar to the waveguide transmitter system 200 of Figures 2-3, but the waveguide transmitter system 800 can be used to excite an open dielectric waveguide (not shown) by monitoring the cones 824 and 826 around one of the axes of the taper slot emitter 820. In one embodiment, the vertical waveguide transmitter system 800 may be used only with a dielectric waveguide.

[0120] The vertical waveguide transmitter system 800 can also be used to excite a circular waveguide by changing the shape of the package 830 from rectangular to circular. The waveguide connector 850 can be a fully integrated SMT assembly, including a balun structure 818 disposed on the bottom surface of the connector 850, wherein the bottom surface is opposite to the opening 854 of the connector 850. The waveguide connector 850 also has a tapered slot transmitter 820, which includes two mirror-shaped cones 824 and 826, wherein the exposed edges of the mirror-shaped cones 824 and 826 form a feed channel 821 and a tapered slot 822. The cone 824 is disposed at the opposite end of the cone 826, and the bottom surfaces of the cones 824 and 826 are separated by the balun structure 818 and the feed channel 821.

[0121] Waveguide connector 850 has a slotted-line signal converter 811 including a balun structure 818. The slotted-line signal converter 811 has a top surface and a bottom surface. Tapers 824 and 826 are disposed on the top surface of the slotted-line signal converter 811, while the bottom surface of the slotted-line signal converter 811 is disposed on a top conductive layer 810 on a package 830. Package 830 includes a microstrip feed 840 to transmit signals from a source to the slotted-line signal converter 811.

[0122] Note that the waveguide transmitter system 800 may include fewer or additional package components depending on the desired package design.

[0123] Figure 9 This is a perspective view of a vertical waveguide transmitter system 900 according to one embodiment, including a package 930 with a top conductive layer 910 and one or more microstrip feed lines 940, and a waveguide connector 950 with one or more compartments 950a-f, one or more slot line signal converters 911, one or more balun structures 918, and one or more tapered slot transmitters 920. The waveguide transmitter system 900 may be similar to the waveguide transmitter system 200 of Figures 2-3, but the waveguide transmitter system 900 can be used to excite / feed one or more waveguides (not shown) by arranging the waveguide connectors 950 in a one-dimensional or two-dimensional configuration.

[0124] The vertical waveguide connector 950 includes compartments 950a-f, each compartment 950a-f having a separate tapered slot emitter 920 with an opening 954. The vertical waveguide connector 950 can be a fully integrated SMT assembly disposed on the top conductive layer 910 of a package 930. Figure 9As shown, a plurality of vias 909 (collectively referred to as "vias 909") can conductively couple the slotted-line signal converter 911 and / or the waveguide connector 950 to a ground plane (e.g., top conductive layer 910) on or within the package 930. In some embodiments, the vias 910 may communicatively couple to the top conductive layer 910 of the package 930 and extend around all or a portion of the outer periphery of the slotted-line signal converter 911 of the waveguide connector 950.

[0125] Note that the waveguide transmitter system 900 may include fewer or additional package components depending on the desired package design.

[0126] Figures 10A-10B 11A-11B have one or more waveguide transmitter systems 1000 and 1100 illustrated in one or more different ways for converting feed from a single polarization to multiple polarizations. Figure 10A This is a perspective view of the waveguide transmitter system 1000, and Figure 10B This is a plan view of waveguide transmitter system 1000. Similarly, Figure 11A This is a perspective view of the waveguide transmitter system 1100, and Figure 11B This is a plan view of waveguide transmitter system 1100. In some embodiments, waveguide transmitter systems 1000 and 1100 may require multiple polarizations. As shown in Figures 10-11, each waveguide transmitter system 1000 and 1100 may include waveguide connectors 1050 and 1150 and slotted line signal converters 1021 and 1121, respectively.

[0127] In some embodiments, Figures 10A-10B The waveguide transmitter system 1000 may have a feed structure (or a conical slot transmitter) that can be rotated 90 degrees to enable dual-polarization operation. For example, such as Figure 10B As shown, the waveguide transmitter system 1000 includes a feed point 1071 with vertical polarization and a feed point 1072 with horizontal polarization. For one embodiment, such as... Figures 10A-10B As shown, the waveguide transmitter system 1000 may have offset cones 1024a-b and 1026a-b to prevent short circuits and perforations in the cone (or fin) and to avoid a balun structure 1018. Alternatively, Figure 11A-11B The waveguide transmitter system 1100 may have cones 1124a-b and 1126a-b rotated by 45 degrees to generate a + / - 45-degree polarization. For example, as Figure 11B As shown, the waveguide transmitter system 1100 includes a feed point 1171 with -45-degree polarization and a feed point 1172 with 45-degree polarization. For one embodiment, as... Figure 11A-11BAs shown, the waveguide transmitter system 1100 may have mirrored cones 1124a-b and 1026a-b to avoid the balun structure 1118.

[0128] Note that, as Figures 10A-10B The waveguide transmitter systems 1000 and 1100 shown in 11A-11B can include fewer or additional package components based on the desired package design.

[0129] Figure 12 According to one embodiment, a schematic block diagram of a computer system 1200 utilizing a device package 1210 with one or more waveguide transmitter systems is illustrated. Figure 12 An example of a computing device 1200 is illustrated. The computing device 1200 houses a motherboard 1202. In one embodiment, the motherboard 1202 may resemble the packages of Figures 2-5 and 8-9 (e.g., packages 230, 430, 530, 830, and 930 of Figures 2-5 and 8-9). The motherboard 1202 may include multiple components, including but not limited to a processor 1204, a package 1210 (or a crimp connector package / system), and at least one communication chip 1206. The processor 1204 is physically and electrically coupled to the motherboard 1202. In some embodiments, at least one communication chip 1206 is also physically and electrically coupled to the motherboard 1202. In other embodiments, at least one communication chip 1206 is part of the processor 1204.

[0130] The computing device 1200 may include other components, which may or may not be physically and electrically coupled to the motherboard 1202, depending on its application. These other components include, but are not limited to, volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), flash memory, graphics processor, digital signal processor, encryption processor, chipset, antenna, display, touch screen display, touch screen controller, battery, audio codec, video codec, power amplifier, global positioning system (GPS) device, compass, accelerometer, gyroscope, speaker, camera, and mass storage devices (such as hard disk drives, CDs, DVDs, etc.).

[0131] At least one communication chip 1206 is capable of implementing wireless communication for transferring data to and from computing device 1200. The term "wireless" and its derivatives can be used to describe circuits, apparatus, systems, methods, techniques, communication channels, etc., that can transmit data via a non-solid medium using modulated electromagnetic radiation. This term does not imply that the associated apparatus does not contain any wires, although in some embodiments the associated apparatus may not contain any wires. At least one communication chip 1206 can implement any number of wireless standards or protocols (including but not limited to Wi-Fi (IEEE 802.11 family), WiMAX (IEEE 802.16 family), IEEE 802.20, LTE, Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, and the above derivatives, as well as any other wireless protocols designated as 3G, 4G, 5G, and above). Computing device 1200 may include multiple communication chips 1206. For example, the first communication chip 1206 can be used for short-range wireless communication (such as Wi-Fi and Bluetooth), while the second communication chip 1206 can be used for long-range wireless communication (such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO and others).

[0132] The processor 1204 of the computing device 1200 includes an integrated circuit die packaged within the processor 1204. The device package 1210 may be, but is not limited to, a package substrate, a PCB, and a motherboard. The device package 1210 has a waveguide transmitter system for the computing device 1200, comprising a package with a microstrip feed and one or more conductive layers, and a waveguide connector with a slotted signal converter, one or more balun structures, and one or more tapered slot emitters, and such—or any other components from the figures described herein. According to some embodiments, the device package 1210 includes a waveguide transmitter system with a power-competitive solution capable of supporting extremely high data rates, for example, over short to medium distances, which would be highly advantageous for interconnects within server and HPC architectures and / or autonomous / self-driving vehicles. Furthermore, the device package 1210 includes tapered slot emitters and connectors for exciting the waveguide, which facilitates improvements in the fabrication and assembly of waveguide interconnect systems. The device package 120 provides a tapered slot waveguide transmitter and connectors, which enable wider bandwidth for thin package substrates and reduced sensitivity to waveguide alignment and electrical contacts as the demand for miniaturization continues to increase.

[0133] Note that device package 1210 may be a single component / device, a subset of components, and / or an entire system, as materials, features, and components may be limited to device package 1210 and / or any other components required by the waveguide transmitter system.

[0134] In some embodiments, as described herein, the integrated circuit die may be packaged together with one or more devices on a package substrate, including a thermally stable RFIC and an antenna (for use in conjunction with wireless communication) and a device package, to reduce the z-height of the computing device. The term "processor" may refer to any device or part of a device that processes electronic data from registers and / or memory to transform that electronic data into other electronic data that can be stored in registers and / or memory.

[0135] At least one communication chip 1206 also includes an integrated circuit die packaged within the communication chip 1206. In some embodiments, as described herein, the integrated circuit die of the communication chip may be packaged together with one or more devices on a package substrate comprising one or more device packages.

[0136] This invention provides a set of technical solutions, as follows: Technical Solution 1. A waveguide transmitter and connector, comprising: Waveguide connectors with waveguide transmitters, tapered and slotted signal transducers; and In the balun structure on the slotted signal converter, the tapered body is disposed on the slotted signal converter and the terminal of the waveguide connector to form a channel and a tapered slot.

[0137] Technical Solution 2. The waveguide transmitter and connector as described in Technical Solution 1, further comprising: A package having one or more layers and lines, wherein the lines are on the layers of the package, wherein the lines include microstrip feeds, grounded coplanar waveguide (GCPW) lines, coplanar waveguide (CPW) lines, or strip lines, and wherein the lines may be terminated at radial stubs, vias, or any other shaped stubs, wherein the other shaped stubs include circular stubs, semi-circular stubs, and semi-rectangular stubs; The waveguide connector has one or more mounting pads on one or more outer walls of the waveguide connector; The waveguide connector on the top surface of the package, wherein at least one of the mounting pads and the outer wall of the waveguide connector is electrically coupled to the top surface of the package; and Waveguide coupled to the waveguide connector.

[0138] Technical Solution 3. The waveguide transmitter and connector as described in Technical Solution 1, wherein the waveguide transmitter includes a single-layer resonant patch transmitter, a stacked patch transmitter, a tapered slot transmitter, a leaky wave transmitter, or a microstrip-to-slot transition transmitter.

[0139] Technical Solution 4. The waveguide transmitter and connector as described in Technical Solution 1, wherein the balun structure includes one or more shaped openings, wherein the one or more shaped openings include dumbbell-shaped structures and double-lobed structures, and wherein the one or more shaped openings include circular openings, rectangular openings, wedge-shaped openings, hexagonal openings, semi-circular openings, semi-rectangular openings, semi-polygonal openings, and semi-hexagonal openings.

[0140] Technical Solution 5. The waveguide transmitter and connector as described in Technical Solution 1, wherein the waveguide connector has one or more inner walls, wherein the one or more inner walls include the terminal, a top surface, and a bottom surface opposite the top surface, and wherein the bottom surface of the waveguide connector forms the slotted signal transducer.

[0141] Technical Solution 6. The waveguide transmitter and connector as described in Technical Solution 1, wherein the cone includes at least one of a straight cone, a stepped cone, a double-fin cone, an exponential cone, a square cone, and an elliptical cone.

[0142] Technical Solution 7. The waveguide transmitter and connector as described in Technical Solution 2, wherein the balun structure receives a signal from the microstrip feed line of the package and converts the signal into a slot line signal, wherein the waveguide transmitter converts the slot line signal into a closed waveguide mode signal through the tapered body, and wherein the waveguide transmitter transmits the closed waveguide mode signal along the channel and propagates the closed waveguide mode signal along the tapered slot of the waveguide transmitter to the waveguide coupled to the waveguide connector.

[0143] Technical Solution 8. The waveguide transmitter and connector as described in Technical Solution 1, wherein the waveguide connector further includes one or more compartments, and wherein each of the compartments includes a balun structure, a waveguide transmitter, a tapered body, and a slotted line signal converter.

[0144] Technical Solution 9. The waveguide transmitter and connector as described in Technical Solution 2, wherein the waveguide is at least one of a metallic waveguide and a dielectric waveguide.

[0145] Technical Solution 10. A method for forming a waveguide transmitter and a connector, comprising: The waveguide transmitter, tapered and slotted signal transducer are mounted on the waveguide connector; and A balanced-to-unbalanced converter structure is provided on the slotted signal converter, wherein the tapered body is disposed on the slotted signal converter and the terminal of the waveguide connector to form a channel and a tapered slot.

[0146] Technical Solution 11. The method as described in Technical Solution 10, further comprising: One or more layers and lines are disposed on the package, wherein the lines are on the layers of the package, wherein the lines include microstrip feed lines, GCPW lines, CPW lines, or strip lines, and wherein the lines may be terminated at radial stubs, vias, or any other shaped stubs, wherein any other shaped stubs include circular stubs, semi-circular stubs, and semi-rectangular stubs. One or more mounting pads are disposed on one or more outer walls of the waveguide connector; The waveguide connector is disposed on the top surface of the package, wherein at least one of the mounting pads and the outer wall of the waveguide connector is electrically coupled to the top surface of the package; and The waveguide is coupled to the waveguide connector.

[0147] Technical Solution 12. The method as described in Technical Solution 10, wherein the waveguide transmitter includes a single-layer resonant patch transmitter, a stacked patch transmitter, a conical slot transmitter, a leaky wave transmitter, or a microstrip-to-slot transition transmitter.

[0148] Technical Solution 13. The method of Technical Solution 10, wherein the balance-unbalance converter structure includes one or more shaped openings, wherein the one or more shaped openings include dumbbell-shaped structures and double-lobed structures, and wherein the one or more shaped openings include circular openings, rectangular openings, wedge-shaped openings, hexagonal openings, semi-circular openings, semi-rectangular openings, semi-polygonal openings, and semi-hexagonal openings.

[0149] Technical Solution 14. The method of Technical Solution 10, wherein the waveguide connector has one or more inner walls, wherein the one or more inner walls include the terminal, a top surface, and a bottom surface opposite the top surface, and wherein the bottom surface of the waveguide connector forms the slotted signal converter.

[0150] Technical Solution 15. The method of Technical Solution 10, wherein the cone includes at least one of a straight cone, a stepped cone, a double-fin cone, an exponential cone, a square cone, and an elliptical cone.

[0151] Technical Solution 16. The method as described in Technical Solution 11 further includes: The balun structure converts the signal from the microstrip feed line in the package into a slot line signal. The slotted signal is converted into a closed waveguide mode signal by the cone-shaped part of the waveguide transmitter. The closed waveguide mode signal is transmitted along the channel of the waveguide transmitter; and The closed waveguide mode signal is propagated along the tapered groove of the waveguide transmitter to the waveguide coupled to the waveguide connector.

[0152] Technical Solution 17. The method of Technical Solution 10, wherein the waveguide connector further comprises one or more compartments, and each of the compartments comprises a balun structure, a waveguide transmitter, a tapered body, and a slotted line signal converter.

[0153] Technical Solution 18. The method as described in Technical Solution 11, wherein the waveguide is at least one of a metallic waveguide and a dielectric waveguide.

[0154] Technical Solution 19. A waveguide transmitter and connector, comprising: Waveguide connector with waveguide transmitter and tapered body; and The package has a balun structure on the top surface of the package, wherein the balun structure is disposed on the top surface of the package to form a slot-line signal converter, and wherein the waveguide connector is disposed on the slot-line signal converter and the top surface of the package.

[0155] Technical Solution 20. The waveguide transmitter and connector as described in Technical Solution 19, further comprising: The tapered body of the waveguide connector is disposed on the terminal of the waveguide connector and the packaged slotted signal converter to form a channel and a tapered slot; The package having one or more layers and lines, wherein the lines are on the layers of the package, wherein the lines include microstrip feed lines, GCPW lines, CPW lines, or strip lines, and wherein the lines may be terminated at radial stubs, vias, or any other shaped stubs, wherein any other shaped stubs include circular stubs, semi-circular stubs, and semi-rectangular stubs. The waveguide connector has one or more mounting pads on one or more outer walls of the waveguide connector, wherein at least one of the mounting pads and the outer walls is electrically coupled to the top surface of the package; and A waveguide coupled to the waveguide connector, wherein the waveguide is at least one of a metallic waveguide and a dielectric waveguide.

[0156] Technical Solution 21. The waveguide transmitter and connector as described in Technical Solution 19, wherein the waveguide transmitter includes a single-layer resonant patch transmitter, a stacked patch transmitter, a tapered slot transmitter, a leaky wave transmitter, or a microstrip-to-slot transition transmitter.

[0157] Technical Solution 22. The waveguide transmitter and connector as described in Technical Solution 19, wherein the balun structure includes one or more patterned openings patterned on the top surface of the package, wherein the one or more patterned openings include dumbbell-shaped structures and double-lobed structures, and wherein the one or more patterned openings include circular openings, rectangular openings, wedge-shaped openings, hexagonal openings, semi-circular openings, semi-rectangular openings, semi-polygonal openings, and semi-hexagonal openings.

[0158] Technical Solution 23. The waveguide transmitter and connector as described in Technical Solution 19, wherein the waveguide connector has one or more inner walls, wherein the one or more inner walls include the terminal and a top surface, and wherein the top surface of the slotted line signal converter forms the bottom surface of the waveguide connector disposed on the package.

[0159] Technical Solution 24. The waveguide transmitter and connector as described in Technical Solution 19, wherein the cone includes at least one of a straight cone, a stepped cone, a double-fin cone, an exponential cone, a square cone, and an elliptical cone, wherein the waveguide connector further includes one or more compartments, and wherein each of the compartments includes at least one of the waveguide transmitter and the cone.

[0160] Technical Solution 25. The waveguide transmitter and connector as described in Technical Solution 20, wherein the balun structure receives a signal from the microstrip feed line of the package and converts the signal into a slot line signal, wherein the waveguide transmitter converts the slot line signal into a closed waveguide mode signal through the tapered body, and wherein the waveguide transmitter transmits the closed waveguide mode signal along the channel and propagates the closed waveguide mode signal along the tapered slot of the waveguide transmitter to the waveguide coupled to the waveguide connector.

[0161] In the foregoing description, embodiments have been described with reference to their specific exemplary embodiments. However, it should be understood that all such terms and similar terms will be associated with appropriate physical quantities and are merely convenient notations applied to these quantities. It will be apparent that various modifications can be made to the embodiments without departing from the broader spirit and scope. The description and drawings are therefore to be considered in an illustrative sense rather than a limiting sense.

[0162] The following examples pertain to other embodiments. Various features of different embodiments can be combined in various ways with some of the included features and others that are excluded to suit a wide variety of different applications.

[0163] The following examples relate to other embodiments: Example 1 is a waveguide transmitter and connector, including a waveguide connector with a waveguide transmitter, a tapered body, and a slotted line signal transducer; and a balun structure on the slotted line signal transducer. The tapered body is disposed on the slotted line signal transducer and termination of the waveguide connector to form a channel and a tapered slot.

[0164] In Example 2, the body as described in Example 1 may optionally include a package having one or more layers, lines, and radial stubs. The lines are on the layers of the package, the lines are microstrip feeds, and the lines are terminated at the radial stubs; the waveguide connector has one or more mounting pads on one or more outer walls of the waveguide connector; the waveguide connector is on the top surface of the package. At least one of the mounting pads and the outer walls of the waveguide connector is electrically coupled to the top surface of the package; and a waveguide is coupled to the waveguide connector.

[0165] In Example 3, the body as described in any one of Examples 1-2 may optionally include the waveguide transmitter, which may be a single-layer resonant patch transmitter, a stacked patch transmitter, a slotted tapered transmitter, a leaky wave transmitter, or a microstrip-to-slot transition transmitter.

[0166] In Example 4, the body as described in any one of Examples 1-3 may optionally include the balance-unbalance converter structure, which includes one or more shaped openings. The one or more shaped openings include dumbbell-shaped structures and double-lobed structures. The one or more shaped openings include circular openings, rectangular openings, wedge-shaped openings, hexagonal openings, semi-circular openings, semi-rectangular openings, semi-polygonal openings, and semi-hexagonal openings.

[0167] In Example 5, the body as described in any one of Examples 1-4 may optionally include the waveguide connector having one or more inner walls. The one or more inner walls include the termination, a top surface, and a bottom surface opposite the top surface. The bottom surface of the waveguide connector forms the slotted signal transducer.

[0168] In Example 6, the body as described in any one of Examples 1-5 may optionally include the cone shape, which includes at least one of a straight cone shape, a stepped cone shape, a double-fin cone shape, an exponential cone shape, a square cone shape, and an elliptical cone shape.

[0169] In Example 7, the body as described in any one of Examples 1-6 may optionally include the balun structure that receives a signal from the microstrip feed line of the package and converts the signal into a slot line signal. The waveguide transmitter converts the slot line signal into a closed waveguide mode signal via the tapered section. The waveguide transmitter transmits the closed waveguide mode signal along the channel and propagates the closed waveguide mode signal along the tapered slot of the waveguide transmitter to the waveguide coupled to the waveguide connector.

[0170] In Example 8, the body as described in any one of Examples 1-7 may optionally include the waveguide connector, which further includes one or more compartments. Each of the compartments includes a balun structure, a waveguide transmitter, a tapered body, and a slotted line signal converter.

[0171] In Example 9, the body as described in any one of Examples 1-8 may optionally include at least one of a metallic waveguide and a dielectric waveguide.

[0172] Example 10 is a method of forming a waveguide transmitter and connector, comprising: disposing a waveguide transmitter, a tapered body, and a slotted line signal transducer on a waveguide connector; and disposing a balun structure on the slotted line signal transducer. The tapered body is disposed on the slotted line signal transducer and termination of the waveguide connector to form a channel and a tapered slot.

[0173] In Example 11, the body as described in Example 10 may optionally include one or more layers, lines, and radial stubs disposed on the package. The lines are microstrip feeds on the layers of the package, and the lines are terminated at the radial stubs; one or more mounting pads are disposed on one or more outer walls of the waveguide connector; the waveguide connector is disposed on the top surface of the package. At least one of the mounting pads and the outer walls of the waveguide connector is electrically coupled to the top surface of the package; and a waveguide is coupled to the waveguide connector.

[0174] In Example 12, the body as described in any one of Examples 10-11 may optionally include the waveguide transmitter, which includes a single-layer resonant patch transmitter, a stacked patch transmitter, a slotted transmitter, a leaky wave transmitter, or a microstrip-to-slot transition transmitter.

[0175] In Example 13, the body as described in any one of Examples 10-12 may optionally include the balance-unbalance converter structure, which includes one or more shaped openings. The one or more shaped openings include dumbbell-shaped structures and double-lobed structures. The one or more shaped openings include circular openings, rectangular openings, wedge-shaped openings, hexagonal openings, semi-circular openings, semi-rectangular openings, semi-polygonal openings, and semi-hexagonal openings.

[0176] In Example 14, the body as described in any one of Examples 10-13 may optionally include the waveguide connector having one or more inner walls. The one or more inner walls include the termination, a top surface, and a bottom surface opposite the top surface. The bottom surface of the waveguide connector forms the slotted-line signal transducer.

[0177] In Example 15, the body as described in any one of Examples 10-14 may optionally include the cone shape, which includes at least one of a straight cone shape, a stepped cone shape, a double-fin cone shape, an exponential cone shape, a square cone shape, and an elliptical cone shape.

[0178] In Example 16, the body as described in any one of Examples 10-15 may optionally include: converting a signal from the microstrip feed line of the package into a slot line signal via the balun structure; converting the slot line signal into a closed waveguide mode signal via the tapered portion of the waveguide transmitter; transmitting the closed waveguide mode signal along the channel of the waveguide transmitter; and propagating the closed waveguide mode signal along the tapered slot of the waveguide transmitter to the waveguide coupled to the waveguide connector.

[0179] In Example 17, the body as described in any one of Examples 10-16 may optionally include the waveguide connector further comprising one or more compartments. Each of the compartments includes a balun structure, a waveguide transmitter, a tapered and slotted line signal converter.

[0180] In Example 18, the body as described in any one of Examples 10-17 may optionally include at least one of a metallic waveguide and a dielectric waveguide.

[0181] Example 19 is a waveguide transmitter and connector, comprising: a waveguide connector with a waveguide transmitter and a tapered shape; and the package having a balun structure on the top surface of the package. The balun structure is disposed on the top surface of the package to form a slot-line signal converter. The waveguide connector is disposed on the top surface of the slot-line signal converter and the package.

[0182] In Example 20, the body as described in Example 19 may optionally include: the tapered portion of the waveguide connector disposed on the terminals of the waveguide connector and the slotted signal transducer of the package to form a channel and a tapered slot; the package having one or more layers, lines, and radial stubs. The lines are on the layers of the package, the lines are microstrip feed lines, and the lines are terminated at the radial stubs; the waveguide connector has one or more mounting pads on one or more outer walls of the waveguide connector. At least one of the mounting pads and the outer walls of the waveguide connector is electrically coupled to the top surface of the package; and a waveguide coupled to the waveguide connector. The waveguide is at least one of a metallic waveguide and a dielectric waveguide.

[0183] In Example 21, the body as described in any one of Examples 19-20 may optionally include the waveguide transmitter, which may be a single-layer resonant patch transmitter, a stacked patch transmitter, a slotted transmitter, a leaky wave transmitter, or a microstrip-to-slot transition transmitter.

[0184] In Example 22, the body as described in any one of Examples 19-21 may optionally include the balance-to-unbalance converter structure, which includes one or more shaped openings patterned on the top surface of the package. The one or more shaped openings include dumbbell-shaped structures and double-lobed structures. The one or more shaped openings include circular openings, rectangular openings, wedge-shaped openings, hexagonal openings, semi-circular openings, semi-rectangular openings, semi-polygonal openings, and semi-hexagonal openings.

[0185] In Example 23, the body as described in any one of Examples 19-22 may optionally include the waveguide connector having one or more inner walls. The one or more inner walls include the termination and a top surface. The top surface of the slotted line signal converter forms the bottom surface of the waveguide connector disposed on the package.

[0186] In Example 24, the body as described in any one of Examples 19-23 may optionally include at least one of a straight cone, a stepped cone, a double-fin cone, an exponential cone, a square cone, and an elliptical cone. The waveguide connector further includes one or more compartments. Each compartment includes at least one of a waveguide transmitter and a cone.

[0187] In Example 25, the body as described in any one of Examples 19-24 may optionally include the balun structure receiving a signal from the microstrip feed line of the package and converting the signal into a slot line signal. The waveguide transmitter converts the slot line signal into a closed waveguide mode signal via the tapered section. The waveguide transmitter transmits the closed waveguide mode signal along the channel and propagates the closed waveguide mode signal along the tapered slot of the waveguide transmitter to the waveguide coupled to the waveguide connector.

[0188] In the foregoing description, the methods and apparatus have been described with reference to specific exemplary embodiments thereof. It will be understood that various modifications may be made thereto without departing from the broader spirit and scope. Accordingly, the description and drawings are to be considered illustrative rather than restrictive.

Claims

1. A waveguide transmitter system, comprising: A waveguide connector with a housing compartment, wherein the waveguide connector includes a top wall, a bottom wall, and multiple side walls, and wherein the waveguide connector includes a waveguide transmitter, a tapered body, and a slotted line signal transducer located within the housing compartment; and A balun structure on the slotted signal converter, wherein the bottom wall of the housing compartment of the waveguide connector includes the balun structure and the slotted signal converter, wherein a tapered body is disposed on the slotted signal converter and the terminal of the waveguide connector to form a channel and a tapered slot, and wherein the waveguide transmitter, the tapered body, the slotted signal converter, the balun structure, the channel and the tapered slot are coupled to the housing compartment of the waveguide connector as a fully integrated and independent surface mount technology (SMT) component.

2. The waveguide transmitter system of claim 1, further comprising: A package having one or more layers, lines and radial stubs, wherein the lines are on the layers of the package, the lines are microstrip feed lines, and the lines are terminated at the radial stubs; The waveguide connector has one or more mounting pads on one or more outer walls of the waveguide connector; The waveguide connector on the top surface of the package, wherein at least one of the mounting pads and the outer wall of the waveguide connector is electrically coupled to the top surface of the package; as well as Waveguide coupled to the waveguide connector.

3. The waveguide transmitter system of any one of claims 1-2, wherein the waveguide transmitter comprises at least one of the following: a single-layer resonant patch transmitter, a stacked patch transmitter, a leaky wave transmitter, or a microstrip-to-slot transition transmitter.

4. The waveguide transmitter system of any one of claims 1-2, wherein the balun structure includes one or more shaped openings, wherein the one or more shaped openings include dumbbell-shaped structures and double-lobed structures, and wherein the one or more shaped openings include circular openings, rectangular openings, wedge-shaped openings, hexagonal openings, semi-circular openings, semi-rectangular openings, semi-polygonal openings, and semi-hexagonal openings.

5. The waveguide transmitter system of any one of claims 1-2, wherein the waveguide connector has one or more inner walls, wherein the one or more inner walls include the terminal, a top surface, and a bottom surface opposite the top surface, and wherein the bottom surface of the waveguide connector forms the slotted signal transducer.

6. The waveguide transmitter system according to any one of claims 1-2, wherein the cone comprises at least one of a straight cone, a stepped cone, a double-fin cone, an exponential cone, a square cone, and an elliptical cone.

7. The waveguide transmitter system of claim 2, wherein the balun structure receives a signal from the microstrip feed line of the package and converts the signal into a slot line signal, wherein the waveguide transmitter converts the slot line signal into a closed waveguide mode signal through the tapered slot, and wherein the waveguide transmitter transmits the closed waveguide mode signal along the channel and propagates the closed waveguide mode signal along the tapered slot of the waveguide transmitter to the waveguide coupled to the waveguide connector.

8. The waveguide transmitter system of any one of claims 1-2, wherein the waveguide connector further comprises one or more compartments, and each of the compartments comprises a balun structure, a waveguide transmitter, a tapered body, and a slotted line signal converter.

9. The waveguide transmitter system according to any one of claims 1-2, wherein the waveguide is at least one of a metallic waveguide and a dielectric waveguide.

10. A method for forming a waveguide transmitter system, comprising: A waveguide connector with a housing compartment is provided, wherein the waveguide connector includes a top wall, a bottom wall, and multiple side walls, and wherein the waveguide connector includes a waveguide transmitter, a tapered body, and a slotted line signal transducer located within the housing compartment; and A balun structure is provided on the slotted signal converter, wherein the bottom wall of the housing compartment of the waveguide connector includes the balun structure and the slotted signal converter, wherein a cone is disposed on the slotted signal converter and the terminal of the waveguide connector to form a channel and a tapered slot, and wherein the waveguide transmitter, the cone, the slotted signal converter, the balun structure, the channel and the tapered slot are coupled to the housing compartment of the waveguide connector as a fully integrated and independent surface mount technology (SMT) component.

11. The method of claim 10, further comprising: One or more layers, lines, and radial stubs are disposed on the package, wherein the lines are on the layers of the package, the lines are microstrip feed lines, and the lines are terminated at the radial stubs; One or more mounting pads are disposed on one or more outer walls of the waveguide connector; The waveguide connector is disposed on the top surface of the package, wherein at least one of the mounting pads and the outer wall of the waveguide connector is electrically coupled to the top surface of the package. as well as The waveguide is coupled to the waveguide connector.

12. The method of any one of claims 10-11, wherein the waveguide transmitter comprises at least one of the following: a single-layer resonant patch transmitter, a stacked patch transmitter, a leaky wave transmitter, or a microstrip-to-slot transition transmitter.

13. The method of any one of claims 10-11, wherein the balance-unbalance converter structure includes one or more shaped openings, wherein the one or more shaped openings include dumbbell-shaped structures and double-lobed structures, and wherein the one or more shaped openings include circular openings, rectangular openings, wedge-shaped openings, hexagonal openings, semi-circular openings, semi-rectangular openings, semi-polygonal openings, and semi-hexagonal openings.

14. The method of any one of claims 10-11, wherein the waveguide connector has one or more inner walls, wherein the one or more inner walls include the terminal, a top surface, and a bottom surface opposite the top surface, and wherein the bottom surface of the waveguide connector forms the slotted signal transducer.

15. The method of any one of claims 10-11, wherein the cone comprises at least one of a straight cone, a stepped cone, a double-fin cone, an exponential cone, a square cone, and an elliptical cone.

16. The method of claim 11, further comprising: The balun structure converts the signal from the microstrip feed line in the package into a slot line signal. The slotted signal is converted into a closed waveguide mode signal by the cone-shaped part of the waveguide transmitter. The closed waveguide mode signal is transmitted along the channel of the waveguide transmitter; as well as The closed waveguide mode signal is propagated along the tapered slot of the waveguide transmitter to the waveguide coupled to the waveguide connector.

17. The method of any one of claims 10-11, wherein the waveguide connector further comprises one or more compartments, and each of the compartments comprises a balun structure, a waveguide transmitter, a tapered body, and a slotted line signal converter.

18. The method of any one of claims 10-11, wherein the waveguide is at least one of a metallic waveguide and a dielectric waveguide.

19. A waveguide transmitter system, comprising: A waveguide connector with a housing compartment, wherein the waveguide connector includes a top wall and multiple side walls, and wherein the waveguide connector includes a waveguide transmitter and a cone located within the housing compartment; as well as The package has a balun structure on its top surface, wherein the balun structure is disposed on the top surface of the package to form a slot-line signal converter, wherein the top surface of the package includes the balun structure and the slot-line signal converter, wherein the waveguide transmitter and the cone are coupled to the housing compartment of the waveguide connector as a fully integrated and independent surface mount technology (SMT) component, and wherein the housing compartment of the waveguide connector is disposed above the balun structure and the slot-line signal converter on the top surface of the package.

20. The waveguide transmitter system of claim 19, further comprising: The tapered body of the waveguide connector is disposed on the terminal of the waveguide connector and the packaged slotted signal converter to form a channel and a tapered slot; The package has one or more layers, lines and radial stubs, wherein the lines are on the layers of the package, the lines are microstrip feed lines, and the lines are terminated at the radial stubs; The waveguide connector has one or more mounting pads on one or more outer walls of the waveguide connector, wherein at least one of the mounting pads and the outer walls of the waveguide connector is electrically coupled to the top surface of the package. as well as A waveguide coupled to the waveguide connector, wherein the waveguide is at least one of a metallic waveguide and a dielectric waveguide.

21. The waveguide transmitter system of any one of claims 19-20, wherein the waveguide transmitter comprises at least one of the following: a single-layer resonant patch transmitter, a stacked patch transmitter, a leaky wave transmitter, or a microstrip-to-slot transition transmitter.

22. The waveguide transmitter system of any one of claims 19-20, wherein the balun structure includes one or more shaped openings patterned on the top surface of the package, wherein the one or more shaped openings include dumbbell-shaped structures and double-lobed structures, and wherein the one or more shaped openings include circular openings, rectangular openings, wedge-shaped openings, hexagonal openings, semi-circular openings, semi-rectangular openings, semi-polygonal openings, and semi-hexagonal openings.

23. The waveguide transmitter system of claim 20, wherein the waveguide connector has one or more inner walls, wherein the one or more inner walls include the terminal and the top surface, and wherein the top surface of the slotted signal transducer forms the bottom surface of the waveguide connector disposed on the package.

24. The waveguide transmitter system of any one of claims 19-20, wherein the cone comprises at least one of a straight cone, a stepped cone, a double-fin cone, an exponential cone, a square cone, and an elliptical cone, wherein the waveguide connector further comprises one or more compartments, and wherein each of the compartments comprises at least one of a waveguide transmitter and a cone.

25. The waveguide transmitter system of claim 20, wherein the balun structure receives a signal from the microstrip feed line of the package and converts the signal into a slot line signal, wherein the waveguide transmitter converts the slot line signal into a closed waveguide mode signal through the tapered slot, and wherein the waveguide transmitter transmits the closed waveguide mode signal along the channel and propagates the closed waveguide mode signal along the tapered slot of the waveguide transmitter to the waveguide coupled to the waveguide connector.

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