A notebook computer

Abstract

The application provides a notebook computer for improving the heat dissipation effect of the notebook computer. The rotating shaft area of the keyboard shell is provided with a first opening area and a second opening area. The first fan is provided with a first air outlet and a second air outlet. The air blown out of the first air outlet flows out of the first opening area. The second air outlet faces the chip area of the mainboard. At least the base shell, the keyboard shell, the first fan and the air guide member form a semi-enclosed structure. The air blown out of the second air outlet of the first fan enters the semi-enclosed structure, flows through the chip area and flows out of the second opening area. On the one hand, the chip area of the notebook computer is cooled through the first air outlet, and on the other hand, the air blown into the chip area of the semi-enclosed structure through the second air outlet directly cools the chip of the chip area, so that the heat dissipation effect of the chip area is improved.

Description

Technical Field

[0001] This application relates to the field of computers, and more particularly to a notebook computer. Background Technology

[0002] With the rapid development of computers, heat dissipation in laptops has become a crucial design focus. Currently, laptops utilize fans, heat pipes, and heat sinks to cool the motherboard. Specifically, one end of the heat pipe makes thermal contact with the electronic components via a copper block, while the other end makes thermal contact with the heat sink fins. The heat pipe transfers heat generated by the electronic components to the heat sink fins. The heat sink fins are located in the opening area at the connection between the keyboard and screen housings of the laptop. Airflow from the fan passes through the heat sink fins and then flows out of the laptop through this opening area, thus dissipating heat from the electronic components within the laptop.

[0003] With the development of electronic technology, the transistor density of various chips (especially central processing units) is increasing daily, data processing speed is accelerating, and power consumption and heat generation are also increasing. Existing heat dissipation solutions are no longer sufficient to meet the demands. Therefore, there is an urgent need for a heat dissipation solution for laptop computers to improve their cooling performance. Summary of the Invention

[0004] This application provides a notebook computer for improving the heat dissipation effect of the notebook computer.

[0005] In a first aspect, this application provides a notebook computer, which includes a keyboard housing, a base housing, a first fan, and an air guide. The keyboard housing has a hinge area, and the keyboard housing is connected to the notebook screen via a hinge in the hinge area; the hinge area has a first opening area and a second opening area. The base housing is connected to the keyboard housing to form a cavity; the motherboard, the first fan, and the air guide are disposed within the cavity. The first fan has a first air outlet and a second air outlet; air blown from the first air outlet flows out through the first opening area, and the second air outlet faces the chip area of ​​the motherboard. At least the base housing, the keyboard housing, the first fan, and the air guide constitute a semi-enclosed structure; the chip area is located inside the semi-enclosed structure, and the opening of the semi-enclosed structure faces the second opening area; air blown from the second air outlet of the first fan enters the semi-enclosed structure, flows through the chip area, and flows out through the second opening area. Because the cooling effect on the laptop computer is improved by blowing air directly onto the chip area through the second air outlet, in addition to cooling the laptop through the first air outlet of the first fan.

[0006] In one possible implementation, the air guide is in contact with the housing of the first fan; the distance between the contact area of ​​the air guide on the first fan and the second air outlet is less than a preset distance. This semi-enclosed structure is equivalent to setting up airflow isolation in a laptop computer. Because the contact area of ​​the air guide on the first fan is close to the second air outlet, it can prevent the air blown out of the second air outlet from being drawn back into the first fan, thus avoiding backflow.

[0007] In one possible implementation, the side of the first fan with the first air outlet and the side with the second air outlet are adjacent to each other. This ensures that the second air outlet faces the chip area, making the first air outlet of the first fan more compatible with the existing laptop computer structure, and does not interfere with the layout of the input / output ports on the side of the laptop computer.

[0008] In one possible implementation, the second air outlet is located inside the semi-enclosed structure. This allows all the air blown from the second outlet to enter the semi-enclosed structure, further improving the heat dissipation efficiency of the chip area. On the other hand, it also prevents the air blown from the second outlet from wandering around the laptop computer outside the semi-enclosed structure, thus avoiding interference with other components.

[0009] In one possible implementation, the airflow from the first air outlet is greater than that from the second air outlet. Since the second air outlet blows directly onto the chip area, a smaller airflow can achieve a greater heat dissipation effect. This arrangement maintains the high heat dissipation capacity of the first air outlet while improving the heat dissipation effect of the chip area.

[0010] In one possible implementation, the base housing forms the bottom surface of the semi-enclosed structure, the keyboard housing forms the top surface of the semi-enclosed structure, and the side of the first fan with the second air outlet and the air guide form the side of the semi-enclosed structure. This layout, with the aid of the existing structure of the laptop computer, forms a semi-enclosed structure through the air guide. It can be seen that this solution adds fewer components and is more compatible with the existing laptop computer structure.

[0011] In one possible implementation, a second fan is also included, which has a third air outlet; the hinge area also has a third opening area; the air blown out by the third air outlet flows out through the third opening area. The third air outlet of the second fan further enhances the heat dissipation effect of the laptop computer.

[0012] In one possible implementation, the second fan further includes a fourth air outlet. The fourth air outlet faces the chip area of ​​the motherboard. The base housing, the keyboard housing, the first fan, the second fan, and the air guide form a semi-enclosed structure; air blown from the fourth air outlet of the second fan enters the semi-enclosed structure, flows through the chip area, and exits from the second opening area. Both the fourth and second air outlets blow air into the chip area within the semi-enclosed structure, further enhancing the heat dissipation effect of the laptop's chip area.

[0013] In one possible implementation, the air guide is in contact with the housing of the second fan. The distance between the contact area of ​​the second fan with the air guide and the fourth air outlet is less than a preset distance. This semi-enclosed structure is equivalent to setting up air duct isolation in a laptop computer. Because the contact area of ​​the second fan with the air guide is close to the fourth air outlet, it can prevent the air blown out of the fourth air outlet from being drawn back into the second fan, thus avoiding backflow.

[0014] In one possible implementation, the side of the second fan where the third air outlet is located and the side where the fourth air outlet is located are adjacent. This ensures that the fourth air outlet faces the chip area, making the third air outlet of the second fan more compatible with the existing laptop computer structure, and does not interfere with the layout of the input / output ports on the side of the laptop computer.

[0015] In one possible implementation, the fourth air outlet is located inside the semi-enclosed structure. This allows all the air blown from the fourth outlet to enter the semi-enclosed structure, further improving the heat dissipation efficiency of the chip area. On the other hand, it also prevents the air blown from the fourth outlet from wandering around areas of the laptop computer outside the semi-enclosed structure, thus avoiding interference with other components.

[0016] In one possible implementation, the airflow of the third air outlet is greater than that of the fourth air outlet. Since the fourth air outlet blows directly onto the chip area, a smaller airflow can achieve a greater heat dissipation effect. This arrangement maintains the high heat dissipation capacity of the third air outlet while improving the heat dissipation effect of the chip area.

[0017] In one possible implementation, the base housing forms the bottom surface of the semi-enclosed structure, the keyboard housing forms the top surface of the semi-enclosed structure, and the side of the first fan with the second air outlet, the side of the second fan with the fourth air outlet, and the air guide form the side of the semi-enclosed structure. This layout, with the aid of the existing structure of the laptop computer, forms a semi-enclosed structure through the air guide. It can be seen that this solution adds fewer components and is more compatible with the existing laptop computer structure.

[0018] In one possible implementation, the second opening area is located between the first opening area and the third opening area. In a laptop computer, the chip area is typically located in the middle of the laptop stand. By placing the second opening area in the middle, it can be closer to the chip area, thus further improving the heat dissipation effect of the chip area.

[0019] Secondly, this application provides a notebook computer, which includes a keyboard housing, a base housing, a first fan, a second fan, a first heat sink, a second heat sink, and an air guide. The keyboard housing has a hinge area, and the keyboard housing is connected to the notebook screen via a hinge in the hinge area. The hinge area has a first opening area, a second opening area, and a third opening area, with the second opening area located between the first opening area and the third opening area. The base housing is connected to the keyboard housing to form a cavity. A motherboard, a first fan, a first heat sink, a second fan, a second heat sink, and an air guide are disposed within the cavity. The first fan has a first air outlet and a second air outlet. The side of the first fan with the first air outlet and the side with the second air outlet are adjacent to each other. The first air outlet faces the first heat sink, and the airflow from the first air outlet passes through the first heat sink and exits from the first opening area. The second air outlet faces the chip area of ​​the motherboard. The second fan has a third air outlet and a fourth air outlet. The side of the second fan with the third air outlet and the side with the fourth air outlet are adjacent to each other. The third air outlet faces the second heat sink fins, and the airflow from the third air outlet flows out through the third opening area after passing through the second heat sink fins. The fourth air outlet faces the chip area of ​​the motherboard. One end of the air guide is in contact with the housing of the first fan, and the other end of the air guide is in contact with the housing of the second fan. The base housing, the keyboard housing, the first fan, the second fan, and the air guide constitute a semi-enclosed structure. The base housing forms the bottom surface of the semi-enclosed structure, the keyboard housing forms the top surface of the semi-enclosed structure, and the side of the first fan with the second air outlet, the side of the second fan with the fourth air outlet, and the air guide constitute the side of the semi-enclosed structure. Airflow from the second outlet of the first fan enters the semi-enclosed structure, flows through the chip area, and exits from the second opening area; airflow from the fourth outlet of the second fan enters the semi-enclosed structure, flows through the chip area, and exits from the second opening area. Thus, on one hand, the airflow from the first outlet cools the first heatsink fins, and the airflow from the third outlet cools the second heatsink fins, thereby achieving heat dissipation for the electronic components inside the laptop computer. On the other hand, the airflow from the second outlet of the first fan cools the chip area, and the airflow from the fourth outlet of the second fan also cools the chip area, improving the heat dissipation effect on the chip area. Attached Figure Description

[0020] Figure 1 This application provides a schematic diagram of the structure of a notebook computer according to an embodiment of the present application. Figure 2aThis is a schematic diagram of the structure of a laptop stand provided in an embodiment of this application; Figure 2b for Figure 2a A magnified view of area A of the laptop stand shown; Figure 2c for Figure 2a An enlarged view of the first fan shown; Figure 3 for Figure 2a An exploded view of the laptop stand shown; Figure 4a for Figure 2a A plan view of the laptop stand shown; Figure 4b for Figure 4a The diagram shows the airflow effect of the first and second air outlets of the first fan in the plane of the laptop stand. Figure 5a This is a schematic diagram of another laptop stand provided in an embodiment of this application; Figure 5b for Figure 5a A magnified view of area B of the laptop stand shown; Figure 5c for Figure 5a Enlarged view of the first and second fans shown; Figure 6 for Figure 5a An exploded view of the laptop stand shown; Figure 7 for Figure 5a A plan view of the laptop stand shown; Figure 8a An exemplary schematic diagram of another laptop stand provided in an embodiment of this application is shown; Figure 8b for Figure 8a A magnified view of a portion of area C of the laptop stand shown; Figure 8c for Figure 8a Enlarged view of the first and second fans shown; Figure 9 for Figure 8a An exploded view of the laptop stand shown; Figure 10 for Figure 8a A plan view of the laptop stand shown; Figure 11 A plan view of another laptop stand provided in an embodiment of this application; Figure 12 This is a schematic diagram showing the temperature of different areas in a laptop stand in the prior art; Figure 13Applications provided in the embodiments of this application Figure 2a The illustrated embodiment is a schematic diagram of the temperature in different areas of the laptop stand.

[0021] The reference numerals in the accompanying drawings of the embodiments of this application are as follows: 10 — Laptop screen; 20 — Laptop dock; 201 — Keyboard casing; 202—Base housing; 2011 – Rotation area; 2012 – First Opening Area; 2013 – Second Opening Area; 2014 – Third Opening Zone; 203 – Motherboard; 2031 – Chip Zone; 2032 — Central Processing Unit (CPU); 2033 – Graphics Processing Unit (GPU); 2034—Other Devices; 30—First Fan; 301 – First air outlet; 302 – Second air outlet; 303 – First heatsink fin; 304 – Heat spreader; 40 – Second fan; 401 – Third air outlet; 402 – Fourth air outlet; 403 – Second heat sink fin; 50—Air guide component; 501—First Distance; 502 – Second distance. Detailed Implementation

[0022] Figure 1 An exemplary schematic diagram of a notebook computer provided in an embodiment of this application is shown. Figure 1 As shown, the laptop computer includes a laptop screen 10 and a laptop stand 20. A hinge area 2011 is provided on the side of the laptop stand 20 near the laptop screen 10, and the laptop screen 10 and the laptop stand 20 are connected by a hinge provided in the hinge area 2011.

[0023] In this embodiment, one or two fans for heat dissipation are provided on the laptop dock 20. When one fan is provided on the laptop dock 20, the fan has two air outlets and can be located on one side of the motherboard. When two fans are provided on the laptop dock 20, one fan has two air outlets and the other fan can have one or two air outlets; and the two fans can be located on both sides of the motherboard.

[0024] In the embodiments of this application Figure 2a , Figure 2b , Figure 2c , Figure 3 , Figure 4a and Figure 4b The following is an example of a laptop computer that includes a first fan 30, and the first fan 30 is provided with a first air outlet 301 and a second air outlet 302. In the embodiments of this application Figure 5a , Figure 5b , Figure 5c , Figure 6 , Figure 7 The following is an example of a laptop computer that includes a first fan 30 and a second fan 40, wherein the first fan 30 is provided with a first air outlet 301 and a second air outlet 302, and the second fan 40 is provided with a third air outlet 401. In the embodiments of this application Figure 8a , Figure 8b , Figure 8c Figure 9 , Figure 10 The following is an example of a laptop computer that includes a first fan 30 and a second fan 40, wherein the first fan 30 is provided with a first air outlet 301 and a second air outlet 302, and the second fan 40 is provided with a third air outlet 401 and a fourth air outlet 402.

[0025] The following will first address... Figure 2a , Figure 2b , Figure 2c Figure 3 , Figure 4a and Figure 4b The implementation of the laptop computer shown includes a first fan 30.

[0026] Figure 2a An example is shown Figure 1 A schematic diagram of the structure of the laptop stand 20. Figure 2b for Figure 2a A magnified view of area A of the laptop stand shown. Figure 2c for Figure 2a A schematic diagram of the structure of the first fan in the middle. Figure 3 for Figure 2a The exploded view of the laptop stand shown is as follows: Figure 2a , Figure 2b , Figure 2c and Figure 3 As shown, the laptop stand 20 includes a keyboard housing 201, a stand housing 202, a hinge area 2011, a motherboard 203, a chip area 2031, a CPU 2032, a GPU 2033, a first fan 30, a first heat dissipation fin 303, and a vapor chamber 304; the hinge area 2011 is provided with a first opening area 2012 and a second opening area 2013, and the first fan 30 is provided with a first air outlet 301 and a second air outlet 302.

[0027] like Figure 2a , Figure 2b and Figure 3 As shown, the keyboard housing 201 and the base housing 202 engage to form a cavity. A motherboard 203 is disposed between the keyboard housing 201 and the base housing 202. Various electronic components, such as CPU 2032, GPU 2033, and other chips, can be mounted on the motherboard 203. A chip area 2031 is provided on the motherboard 203, which may include one or more chips mounted on the motherboard 203, such as CPU 2032 and GPU 2033. In an optional embodiment, the chip area 2031 may also include other electronic components other than chips mounted on the motherboard 203.

[0028] The chips on the motherboard 203 can be mounted on the heat spreader 304, and other electronic components besides the chips can also be mounted on the heat spreader 304. The heat spreader 304 is connected to the first heat sink 303. The electronic components mounted on the heat spreader 304 generate heat during operation, and the heat spreader 304 can transfer the heat generated by the electronic components mounted on it to the first heat sink 303. In another optional embodiment, the heat spreader 304 can be replaced by a heat pipe. One end of the heat pipe can be thermally connected to an electronic component, and the other end can be connected to the first heat sink 303. The heat pipe can be used to transfer the heat from the connected electronic component to the first heat sink 303.

[0029] like Figure 2a , Figure 2b and Figure 3 As shown, the first fan 30 includes a first side and a second side, which are adjacent to each other. The first air outlet 301 is located on the first side, and the second air outlet 302 is located on the second side. Alternatively, it can be described as follows: the first air outlet 301 and the second air outlet 302 are located on two adjacent sides of the first fan 30, respectively.

[0030] A hinge area 2011, with a first opening area 2012 and a second opening area 2013, can be disposed on the keyboard housing 201, located on the side of the keyboard housing 201 closer to the laptop screen 10. The first air outlet 301 of the first fan 30 faces the first opening area 2012 of the hinge area 2011. A first heat dissipation fin 303 can be disposed between the first air outlet 301 and the first opening area 2012.

[0031] like Figure 2a As shown, the air guide 50 is mounted on the base housing, and the second air outlet 302 of the first fan 30 faces the chip area 2031 of the motherboard 203. The base housing 202, the keyboard housing 201, the first fan 30, and the air guide 50 form a semi-enclosed structure. Specifically, the base housing 202 is the top surface of the semi-enclosed structure, the keyboard housing 201 is the bottom surface of the semi-enclosed structure, the side of the first fan with the second air outlet 302, and the air guide 50 form the side of the semi-enclosed structure with an enclosing effect. The opening in the semi-enclosed structure faces the second opening area. This opening in the semi-enclosed structure can also be referred to as an unenclosed side of the enclosed structure, or it can be described as the location of the second opening area 2013 of the hinge area 2011. The semi-enclosed structure contains the electronic components of the chip area 2031. The second air outlet 302 faces the interior of the semi-enclosed structure.

[0032] Figure 4a for Figure 2a The diagram shown is a plan view of the laptop stand. Figure 4a The example shown in the middle Figure 2a The diagram shows the direction of airflow from the first air outlet 301 and the second air outlet 302 in the laptop computer. Figure 4aAs shown, on one hand, the heat generated by the CPU 2032 and GPU 2033 is transferred to the first heat sink 303 through the vapor chamber 304. The airflow discharged by the first fan 30 through the first air outlet 301 flows over the first heat sink 303 and is then discharged through the first opening area 2012. In this process, the airflow discharged from the first air outlet 301 is used to cool the first heat sink 303, thereby achieving heat dissipation of the electronic components inside the laptop computer. On the other hand, the air blown out from the second air outlet 302 of the first fan 30 enters the semi-enclosed structure, flows through the chip area 2031, and flows out from the second opening area 2013. It can be seen that the air from the first air outlet 301 of the first fan 30 cools the chip area 2031, and the air from the second air outlet 302 of the first fan 30 also cools the chip area 2031, improving the heat dissipation effect of the chip area 2031. Secondly, since the base housing 202, the keyboard housing 201, the first fan 30, and the air guide 50 form a semi-enclosed structure, it is equivalent to setting up an air duct isolation in the laptop keyboard. Thus, the air blown from the second air outlet 302 can flow through the chip area 2031 as much as possible before exiting from the second opening area 2013, improving the heat dissipation effect. Thirdly, the first distance 501 between the end of the air guide 50 that contacts the housing of the first fan 30 and the second air outlet 302 is within a preset distance range. This preset distance can be set to a small value; for example, the contact area can be set at the edge of the second air outlet 302, or a few millimeters away from the edge of the second air outlet 302. Because the contact point between the air guide 50 and the first fan 30 is close to the second air outlet 302, and an air duct isolation is set up in the laptop, it can prevent the air blown from the second air outlet 302 from being sucked back into the first fan 30, forming a backflow. Fourthly, the second air outlet 302 faces the chip area 2031, which is located in the middle of the laptop computer. In this case, the setting of the second air outlet 302 will not affect the input and output ports on the two sides of the laptop computer, and can better ensure compatibility with existing laptop computers.

[0033] The air guide 50 in this embodiment can be shaped to adjust the position and layout of specific components on the motherboard 203 of the laptop computer. For example... Figure 2a As shown, the air guide 50 can be an L-shaped structure. Optionally, the air guide 50 can also be other shapes, such as an inclined surface. The air guide 50 can be a flexible structure. Various materials can be used, such as foam, flexible plastic, flexible metal, etc.

[0034] In one alternative embodiment, the size of the first air outlet 301 may be larger than the size of the second air outlet 302, so that the air exhausted from the first fan 30 can be mainly exhausted through the first air outlet 301, and the second air outlet 302 can assist in exhaust, so as to meet the heat dissipation requirements of the laptop computer. Figure 4b for Figure 4a The diagram shows the airflow effect of the first and second air outlets of the first fan in the plane of the laptop stand. Figure 4b As shown, compared with the first air outlet 301, the size of the second air outlet 302 is smaller than that of the first air outlet 301, and the air volume of the second air outlet 302 is also smaller than that of the first air outlet 301.

[0035] The following is about Figure 5a , Figure 5b , Figure 6 , Figure 7 The illustrated notebook computer includes an embodiment of a first fan 30 and a second fan 40, wherein the first fan 30 includes a first air outlet 301 and a second air outlet 302, and the second fan 40 includes a third air outlet 401.

[0036] Figure 5a An example is shown Figure 1 A schematic diagram of the structure of the laptop stand 20. Figure 5b for Figure 5a A magnified view of area B of the laptop stand shown. Figure 5c for Figure 5a Enlarged view of the first and second fans. Figure 6 for Figure 5a The exploded view of the laptop stand shown is as follows: Figure 5a , Figure 5b , Figure 5c and Figure 6 As shown, the laptop stand 20 includes a keyboard housing 201, a stand housing 202, a hinge area 2011, a motherboard 203, a chip area 2031, a CPU 2032, a GPU 2033, a first fan 30, a second fan 40, a first heat sink 303, a second heat sink 403, and a vapor chamber 304; the hinge area 2011 is provided with a first opening area 2012, a second opening area 2013, and a third opening area 2014; the first fan 30 is provided with a first air outlet 301 and a second air outlet 302; and the second fan 40 is provided with a third air outlet 401.

[0037] like Figure 5a , Figure 5b , Figure 5c and Figure 6As shown, the keyboard housing 201 and the base housing 202 engage to form a cavity. A motherboard 203 is disposed between the keyboard housing 201 and the base housing 202. For a description of the motherboard 203, the chip area 2031, and the first fan 30, please refer to the above. Figure 2a The relevant descriptions will not be repeated here.

[0038] like Figure 5a , Figure 5b , Figure 5c and Figure 6 As shown, a vapor chamber 304 connects a first heat dissipation fin 303 and a second heat dissipation fin 403. The vapor chamber 304 can transfer the heat generated by the electronic components mounted thereon to the first heat dissipation fin 303 and the second heat dissipation fin 403. In another alternative embodiment, the vapor chamber 304 can be replaced by a heat pipe, which can be sequentially connected to the first heat dissipation fin 303, the electronic components, and the second heat dissipation fin 403. The heat pipe can be used to transfer the heat from the connected electronic components to the first heat dissipation fin 303 and the second heat dissipation fin 403.

[0039] like Figure 5a , Figure 5b , Figure 5c and Figure 6 As shown, the first fan 30 and the second fan 40 are arranged on both sides of the chip area 2031, and the second opening area 2013 is located between the first opening area 2012 and the third opening area 2014. The second fan 40 includes a third side surface, and a third air outlet 401 is located on the third side surface. The third side surface is the side of the second fan 40 facing the third opening area 2014 of the pivot area 2011. The second heat dissipation fin 403 can be disposed between the third air outlet 401 and the third opening area 2014.

[0040] like Figure 5a , Figure 5b , Figure 5c and Figure 6 As shown, the air guide 50 can be positioned between the first fan 30 and the second fan 40, and the air guide 50 can contact the housings of the first fan 30 and the second fan 40. Figure 5aAs shown, the air guide 50 is disposed on the base housing, and the second air outlet 302 of the first fan 30 faces the chip area 2031 of the motherboard 203. The base housing 202, the keyboard housing 201, the first fan 30, the second fan 40, and the air guide 50 constitute a semi-enclosed structure. Specifically, the base housing 202 is the top surface of the semi-enclosed structure, the keyboard housing 201 is the bottom surface of the semi-enclosed structure, the side of the first fan with the second air outlet 302, the air guide 50, and the fourth side of the second fan form the side with an enclosing effect in the semi-enclosed structure, and the side not enclosed in the semi-enclosed structure is the position of the second opening area 2013 of the hinge area 2011. The fourth side of the second fan is the side of the second fan adjacent to the third side, and the fourth side faces the chip area 2031. The electronic components of the chip area 2031 are included inside the semi-enclosed structure. The second air outlet 302 faces the interior of the semi-enclosed structure.

[0041] Figure 7 for Figure 5a The diagram shown is a plan view of the laptop stand. Figure 7 The example shown in the middle Figure 5a The diagram shows the direction of airflow from the first air outlet 301, the second air outlet 302, and the third air outlet 401 of the second fan 40 in the laptop computer. Figure 7As shown, on one hand, the heat generated by the CPU 2032 and GPU 2033 is transferred to the first heat sink 303 and the second heat sink 403 through the vapor chamber 304. The airflow discharged by the first fan 30 through the first air outlet 301 flows over the first heat sink 303 and is then discharged through the first opening area 2012. The airflow discharged by the second fan 40 through the third air outlet 401 flows over the second heat sink 403 and is then discharged through the third opening area 2014. In this process, the airflow discharged from the first air outlet 301 is used to cool the first heat sink 303, and the airflow discharged from the third air outlet 401 is used to cool the second heat sink 403, thereby achieving heat dissipation of the electronic components inside the laptop computer. On the other hand, the air blown out from the second air outlet 302 of the first fan 30 enters the semi-enclosed structure, flows through the chip area 2031, and flows out from the second opening area 2013. As can be seen, the air from the first air outlet 301 of the first fan 30 cools the chip area 2031, and the air from the second air outlet 302 of the first fan 30 also cools the chip area 2031, improving the heat dissipation effect of the chip area 2031. Secondly, since the base housing 202, the keyboard housing 201, the first fan 30, the second fan 40, and the air guide 50 form a semi-enclosed structure, it is equivalent to setting up an air duct isolation in the keyboard of the laptop computer. In this way, the air blown out from the second air outlet 302 can flow through the chip area 2031 as much as possible and then flow out from the second opening area 2013, improving the heat dissipation effect. Secondly, the first distance 501 between the end of the air guide 50 that contacts the housing of the first fan 30 and the second air outlet 302 is within a preset distance range. This preset distance can be set to a small value; for example, the contact area can be set at the edge of the second air outlet 302, or a few millimeters away from the edge of the second air outlet 302. Because the contact point between the air guide 50 and the first fan 30 is close to the second air outlet 302, and an air duct isolation is provided in the laptop computer, it can prevent the air blown out of the second air outlet 302 from being sucked back into the first fan 30 to form a backflow. Fourthly, the second air outlet 302 faces the chip area 2031, which is located in the middle of the laptop computer. In this case, the setting of the second air outlet 302 will not affect the input / output ports on the two sides of the laptop computer, and can better accommodate existing laptop computers.

[0042] The air guide 50 in this embodiment can be shaped to adjust the position and layout of specific components on the motherboard 203 of the laptop computer. For example... Figure 7As shown, the air guide 50 can be a straight structural component. Optionally, the air guide 50 can also be other shapes, such as an inclined surface. The air guide 50 can be a flexible structural component. Various materials can be used, such as foam, flexible plastic, flexible metal, etc.

[0043] The following is about Figure 8a , Figure 8b , Figure 8c , Figure 9 , Figure 10 The illustrated notebook computer includes an embodiment of a first fan 30 and a second fan 40, wherein the first fan 30 includes a first air outlet 301 and a second air outlet 302, and the second fan 40 includes a third air outlet 401 and a fourth air outlet 402.

[0044] Figure 8a An example is shown Figure 1 A schematic diagram of the structure of the laptop stand 20. Figure 8b for Figure 8a A magnified view of a portion of area C of the laptop stand shown. Figure 8c for Figure 8a Schematic diagram of the structure of the first and second fans in the middle. Figure 9 for Figure 8a The exploded view of the laptop stand shown is as follows: Figure 8a , Figure 8b , Figure 8c and Figure 9 As shown, the laptop stand 20 includes a keyboard housing 201, a stand housing 202, a hinge area 2011, a motherboard 203, a chip area 2031, a CPU 2032, a GPU 2033, a first fan 30, a second fan 40, a first heat sink 303, a second heat sink 403, and a vapor chamber 304; the hinge area 2011 is provided with a first opening area 2012, a second opening area 2013, and a third opening area 2014; the first fan 30 is provided with a first air outlet 301 and a second air outlet 302; and the second fan 40 is provided with a third air outlet 401 and a fourth air outlet 402.

[0045] like Figure 8a , Figure 8b , Figure 8c and Figure 9 As shown, the keyboard housing 201 and the base housing 202 engage to form a cavity. A motherboard 203 is disposed between the keyboard housing 201 and the base housing 202. For a description of the motherboard 203, the chip area 2031, and the first fan 30, please refer to the above. Figure 2aThe relevant descriptions will not be repeated here. The vapor chamber 304 connects to the first heat dissipation fin 303 and the second heat dissipation fin 403. For descriptions of the vapor chamber 304, the first heat dissipation fin 303, the second heat dissipation fin 403, the first opening area 2012, the second opening area 2013, and the third opening area 2014, please refer to the above. Figure 5a The relevant descriptions will not be repeated here.

[0046] like Figure 8a , Figure 8b , Figure 8c and Figure 9 As shown, the second fan 40 includes a third side and a fourth side. A third air outlet 401 is located on the third side, and a fourth air outlet 402 is located on the fourth side. The third side is the side of the second fan 40 facing the third opening area 2014 of the shaft area 2011. The fourth side is adjacent to the third side, and the fourth air outlet 402 faces the chip area 2031. Alternatively, it can be described that the third air outlet 401 and the fourth air outlet 402 are located on two adjacent sides of the second fan 40.

[0047] like Figure 8a , Figure 8b , Figure 8c and Figure 9 As shown, the air guide 50 can be positioned between the first fan 30 and the second fan 40, and the air guide 50 can contact the housings of the first fan 30 and the second fan 40. Figure 8a As shown, the air guide 50 is disposed on the base housing. The second air outlet 302 of the first fan 30 faces the chip area 2031 of the motherboard 203, and the second air outlet 302 of the second fan 40 also faces the chip area 2031 of the motherboard 203. The base housing 202, the keyboard housing 201, the first fan 30, the second fan 40, and the air guide 50 constitute a semi-enclosed structure. Specifically, the base housing 202 is the top surface of the semi-enclosed structure, the keyboard housing 201 is the bottom surface of the semi-enclosed structure, and the side of the first fan with the second air outlet 302, the air guide 50, and the side of the second fan with the fourth air outlet 402 form the side with an enclosing effect in the semi-enclosed structure. The side of the semi-enclosed structure that is not enclosed is the location of the second opening area 2013 of the hinge area 2011. The electronic components of the chip area 2031 are included inside the semi-enclosed structure. The second air outlet 302 and the fourth air outlet 402 face the interior of the semi-enclosed structure.

[0048] Figure 10 for Figure 8a The diagram shown is a plan view of the laptop stand. Figure 10 The example shown in the middle Figure 8aThe diagram shows the direction of airflow from the first air outlet 301, the second air outlet 302, the third air outlet 401, and the fourth air outlet 402 of the second fan 40 in the laptop computer. Figure 10As shown, on one hand, the heat generated by the CPU 2032 and GPU 2033 is transferred to the first heat sink 303 and the second heat sink 403 through the vapor chamber 304. The airflow discharged by the first fan 30 through the first air outlet 301 flows over the first heat sink 303 and is then discharged through the first opening area 2012. The airflow discharged by the second fan 40 through the third air outlet 401 flows over the second heat sink 403 and is then discharged through the third opening area 2014. In this process, the airflow discharged from the first air outlet 301 is used to cool the first heat sink 303, and the airflow discharged from the third air outlet 401 is used to cool the second heat sink 403, thereby achieving heat dissipation of the electronic components inside the laptop computer. On the other hand, the air blown out from the second air outlet 302 of the first fan 30 enters the semi-enclosed structure, flows through the chip area 2031, and flows out from the second opening area 2013. As can be seen, the airflow from the first outlet 301 of the first fan 30 cools the chip area 2031, and the airflow from the second outlet 302 of the first fan 30 also cools the chip area 2031, improving the heat dissipation effect of the chip area 2031. Furthermore, the airflow from the fourth outlet 402 of the second fan 40 enters the semi-enclosed structure, flows through the chip area 2031, and exits from the second opening area 2013. As can be seen, the airflow from the third outlet 401 of the second fan 40 cools the chip area 2031, and the airflow from the fourth outlet 402 of the second fan 40 also cools the chip area 2031, improving the heat dissipation effect of the chip area 2031. Secondly, since the base housing 202, the keyboard housing 201, the first fan 30, the second fan 40, and the air guide 50 form a semi-enclosed structure, it is equivalent to setting up an air duct isolation inside the laptop keyboard. Thus, the air blown from the second air outlet 302 can flow through the chip area 2031 as much as possible before exiting from the second opening area 2013, and the air blown from the fourth air outlet 402 can also flow through the chip area 2031 as much as possible before exiting from the second opening area 2013, improving the heat dissipation effect. Thirdly, the first distance 501 between the end of the air guide 50 that contacts the housing of the first fan 30 and the second air outlet 302 is within a preset distance range. This preset distance can be set to a small value; for example, the contact area can be set at the edge of the second air outlet 302, or it can be set a few millimeters away from the edge of the second air outlet 302.Furthermore, the second distance 502 between the end of the air guide 50 that contacts the housing of the second fan 40 and the fourth air outlet 402 is within a preset distance range. This preset distance can be set to a small value. For example, the contact area can be set at the edge of the fourth air outlet 402, or it can be set a few millimeters away from the edge of the fourth air outlet 402. Because the position where the air guide 50 contacts the first fan 30 is close to the second air outlet 302, and the position where the air guide 50 contacts the second fan 40 is close to the fourth air outlet 402, the air duct isolation is set in the laptop computer. Therefore, it can prevent the air blown out of the second air outlet 302 from being sucked back into the first fan 30 to form a backflow, and it can also prevent the air blown out of the fourth air outlet 402 from being sucked back into the second fan 40 to form a backflow. Fourthly, the second air outlet 302 faces the chip area 2031, which is located in the middle of the laptop computer, and the fourth air outlet 402 faces the chip area 2031, which is also located in the middle of the laptop computer. In this case, the arrangement of the second air outlet 302 and the fourth air outlet 402 will not affect the input and output ports on the two sides of the laptop computer, and can better ensure compatibility with existing laptop computers.

[0049] In one alternative embodiment, the size of the third air outlet 401 may be larger than the size of the fourth air outlet 402, so that the air exhausted from the second fan 40 can be mainly exhausted through the third air outlet 401, and the fourth air outlet 402 can assist in exhaust, so as to meet the heat dissipation requirements of the laptop computer.

[0050] The air guide 50 in this embodiment can be shaped to adjust the position and layout of specific components on the motherboard 203 of the laptop computer. For example... Figure 10 As shown, the air guide 50 can be a straight structural component, or alternatively, the air guide 50 can be other shapes.

[0051] Figure 11 A plan view of another laptop stand provided in an embodiment of this application, as shown below. Figure 11 As shown, Figure 11 An example is shown in Figure 10 A schematic diagram of another possible air guide component 50, such as... Figure 11 As shown, in Figure 11 The semi-enclosed structure shown may also include other components 2034. The air guide is a flexible component, and its shape can be adjusted according to the actual distribution of the components included in the semi-enclosed structure; for example, the air guide can be bent into... Figure 11 The structure shown.

[0052] Regarding the heat dissipation requirements of laptops, several other approaches exist. One approach involves placing two fans on either side of the laptop's chipset area, but each fan has only one exhaust vent, and both exhaust vents face the heatsink fins. This implementation offers better heat dissipation compared to the methods described above. Figures 2a to 11 The proposed solution has poor heat dissipation performance.

[0053] Another approach involves placing two fans on either side of the laptop's chipset area, each with only one exhaust vent facing the heatsink fins. A third fan is then added to the laptop's base, also with one exhaust vent facing the chipset area. This additional fan increases the laptop's weight and noise, and the airflow from this fan tends to circulate erratically within the base and keyboard casings, potentially causing backflow.

[0054] Another scenario involves placing two fans on either side of the laptop's chipset area. Each fan has two exhaust vents: the primary vents face the heatsink fins, while the secondary vents face the opposite direction, towards the sides of the laptop. However, laptops typically have input / output ports on their sides. If the exhaust vents are on the sides, this becomes unsuitable for these ports, significantly impacting the overall layout of the internal components. Furthermore, the airflow from the secondary vents of these fans exits directly from the sides of the laptop, bypassing the chipset area. Therefore, this design offers limited cooling for the chipset area.

[0055] Figure 12 This is a schematic diagram showing the temperature of different areas in a laptop stand in the prior art. Figure 13 Applications provided in the embodiments of this application Figure 2a The illustrated embodiment shows a schematic diagram of the temperature in different areas of the laptop stand. It can be seen that when applying existing heat dissipation solutions, such as... Figure 12 As shown, the temperatures at several locations on the keyboard casing of the laptop computer are 43.5 degrees Celsius (degC), 51.2 degC, 52.3 degC, and 44.9 degC, respectively. This is in accordance with the embodiments of this application. Figure 2a In the provided embodiment, the temperatures at several corresponding locations on the keyboard casing of the laptop computer are 40.5 degC, 44 degC, 46.3 degC, and 42.5 degC, respectively. And it can be seen from... Figure 12 and Figure 13 Overall, Figure 12The keyboard casing shown has a darker gray tone; the darker the gray tone, the higher the temperature. Figure 13 The keyboard casing shown has a lighter gray tone; the lighter the gray tone, the lower the temperature. Based on Figure 12 and Figure 13 It can be seen that the solution provided in this application embodiment has a good heat dissipation effect on laptop computers.

Claims

1. A notebook computer, characterized in that, include: A keyboard housing, wherein the keyboard housing is provided with a hinge area, and the keyboard housing is connected to the laptop screen through a hinge in the hinge area; the hinge area is provided with a first opening area and a second opening area; A base housing is connected to the keyboard housing to form a cavity; a motherboard, a first fan, and an air guide are disposed inside the cavity. The first fan is provided with a first air outlet and a second air outlet. The first air outlet and the second air outlet of the first fan face different directions. The first air outlet and the second air outlet are respectively provided on adjacent different sides of the first fan. The first air outlet faces the first opening area of ​​the hinge area. The air blown out by the first air outlet flows out of the first opening area to the outside of the laptop computer. The second air outlet faces the chip area of ​​the motherboard. The second fan has a third air outlet and a fourth air outlet. The hinge area also has a third opening area. The third air outlet and the fourth air outlet of the second fan face different directions. The third air outlet and the fourth air outlet are respectively located on adjacent different sides of the second fan. The third air outlet faces the third opening area of ​​the hinge area. The air blown out by the third air outlet flows out of the laptop computer from the third opening area. The fourth air outlet faces the chip area of ​​the motherboard. The base housing, keyboard housing, first fan, second fan, and air guide form a semi-enclosed structure. The base housing constitutes the bottom surface of the semi-enclosed structure, the keyboard housing constitutes the top surface of the semi-enclosed structure, the side of the first fan with the second air outlet, the side of the second fan with the fourth air outlet, and the air guide form the side of the semi-enclosed structure. The chip area is located inside the semi-enclosed structure, the second air outlet and the fourth air outlet face the interior of the semi-enclosed structure, and the opening of the semi-enclosed structure faces the second opening area. Air blown from the second air outlet of the first fan enters the semi-enclosed structure, flows through the chip area, and exits from the second opening area to the outside of the laptop computer. Air blown from the fourth air outlet of the second fan enters the semi-enclosed structure, flows through the chip area, and exits from the second opening area to the outside of the laptop computer. The air guide is arranged in the direction from the first fan to the second fan, and the air guide is a continuous structure.

2. The notebook computer according to claim 1, characterized in that, The side of the semi-enclosed structure that is not enclosed corresponds to the second opening area of ​​the pivot area.

3. The notebook computer as described in claim 1 or 2, characterized in that, The side of the first fan where the first air outlet is located is adjacent to the side where the second air outlet is located.

4. The notebook computer according to claim 1 or 2, characterized in that, The laptop computer also includes a vapor chamber and a first heat dissipation fin. The first heat dissipation fin is disposed between the first air outlet and the first opening area. The vapor chamber is disposed corresponding to the chip area of ​​the motherboard. The vapor chamber is connected to the first heat dissipation fin. The airflow blown out of the first air outlet flows out of the laptop computer through the first heat dissipation fin and then flows out of the first opening area.

5. The notebook computer as described in claim 1 or 2, characterized in that, The air guide component is in contact with the housing of the first fan; The distance between the contact area of ​​the first fan and the air guide and the second air outlet is less than a preset distance.

6. The notebook computer as described in claim 1 or 2, characterized in that, The second air outlet is located inside the semi-enclosed structure.

7. The notebook computer according to claim 1 or 2, characterized in that, The size of the first air outlet of the first fan is larger than the size of the second air outlet of the first fan.

8. The notebook computer as described in claim 1 or 2, characterized in that, The air volume of the first air outlet is greater than that of the second air outlet.

9. The notebook computer as described in claim 1 or 2, characterized in that, The air guide component is in contact with the housing of the second fan; The distance between the contact area of ​​the second fan and the air guide and the fourth air outlet is less than a preset distance.

10. The notebook computer as described in claim 1 or 2, characterized in that, The side of the second fan where the third air outlet is located is adjacent to the side where the fourth air outlet is located.

11. The notebook computer as described in claim 1 or 2, characterized in that, The fourth air outlet is located inside the semi-enclosed structure.

12. The notebook computer as described in claim 1 or 2, characterized in that, The air volume of the third air outlet is greater than that of the fourth air outlet.

13. The notebook computer as described in claim 1 or 2, characterized in that, The second opening area is located between the first opening area and the third opening area.

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