Wafer pick-up separation apparatus and method

Abstract

The present application relates to solar cell manufacturing equipment technical field, especially to a kind of wafer wafer separation device and method. Wherein, drive assembly is connected with separation component, separation component is fixed with adsorption plate, the side of adsorption plate is provided with reversible adsorption arm and adsorption plate can be respectively adsorbed in the lower surface of substrate and the upper surface of film, to make wafer clamping between adsorption plate and adsorption arm, and under the driving effect of drive assembly, it can move synchronously, to take out wafer from carrier;Adsorption arm is connected with motion controller, when drive assembly drives adsorption plate to contact and vacuum adsorption in the lower surface of substrate, motion controller can drive adsorption arm to make vertical movement, to make adsorption arm contact and vacuum adsorption film, also can drive adsorption arm to make lateral overturning, to make adsorption arm drive film and substrate separate, so that both can realize the quick use of wafer, also can realize the quick separation of substrate and film, greatly improve the capacity.

Description

Technical Field

[0001] This invention relates to the field of solar cell manufacturing equipment technology, and in particular to a wafer picking and separating device and method. Background Technology

[0002] Thin-film solar cells are a new type of photovoltaic device for alleviating the energy crisis. They can be manufactured using various inexpensive materials such as ceramics, graphite, and metal sheets as substrates. Therefore, compared to silicon substrate solar cells, they can significantly reduce the amount of raw materials used for the same light-receiving area. The thickness of the thin film needed to generate voltage is only a few micrometers, and they exhibit excellent conversion efficiency. Besides being planar, thin-film solar cells are also flexible enough to be fabricated into non-planar structures, expanding their application range. They can be integrated into buildings or become part of the building structure, making their applications very broad.

[0003] In the manufacturing process of thin-film solar cells, after an etching process, a square substrate with a solar thin film is bonded to the substrate (wafer) in a carrier by surface tension. To meet the requirements of subsequent production processes, the substrates need to be removed from the carrier one by one, and then separated from the thin film. In the existing technology, only one substrate can be removed at a time, and after removal, the substrate needs to be placed in another separation component for separation from the thin film. Therefore, only one set of substrates can be separated from the thin film at a time. The substrate removal and separation are two separate processes, requiring different equipment, and the separation process is time-consuming, which greatly affects production capacity. Summary of the Invention

[0004] (a) Technical problems to be solved

[0005] This invention provides a wafer picking and separation device and method, which can realize both rapid substrate picking and rapid separation of substrate and thin film, thereby improving production capacity.

[0006] (II) Technical Solution

[0007] To address the aforementioned technical problems, this invention provides a wafer picking and separating device, comprising a separating component and a driving component. The wafer includes a substrate and a thin film disposed on the substrate. The driving component is connected to the separating component. An adsorption plate is fixed on the separating component. The adsorption plate is used to adsorb and fix the substrate. A flip-up adsorption arm is provided on one side of the adsorption plate. The adsorption plate and the adsorption arm can respectively adsorb onto the lower surface of the substrate and the upper surface of the thin film, so that the wafer is clamped between the adsorption plate and the adsorption arm. Under the driving action of the driving component, the adsorption arm and the adsorption plate can move synchronously to remove the wafer from the carrier.

[0008] The adsorption arm is connected to a motion controller. When the drive assembly drives the adsorption plate to contact and vacuum adsorb the film on the lower surface of the substrate, the motion controller can drive the adsorption arm to move vertically so that the adsorption arm contacts and vacuum adsorbs the film. The motion controller can also drive the adsorption arm to rotate laterally so that the adsorption arm drives the film to separate from the substrate.

[0009] Preferably, the motion controller includes a rotation mechanism and a sliding control mechanism. The sliding control mechanism is connected to the adsorption arm through the rotation mechanism. Under the driving action of the sliding control mechanism, the rotation mechanism and the adsorption arm can slide vertically synchronously, and the rotation mechanism can drive the adsorption arm to rotate laterally.

[0010] Preferably, the rotating mechanism includes a belt drive mechanism, the driving wheel of the belt drive mechanism is connected to a servo motor via a rotary coupling, and any driven wheel of the belt drive mechanism is connected to the adsorption arm via a rotating shaft; the rotary coupling and the rotating shaft are respectively connected to the sliding control mechanism.

[0011] Preferably, the sliding control mechanism includes:

[0012] A rotating slide plate is connected to a guide rail via a slider. The slider is used to drive the rotating slide plate to slide vertically along the guide rail. The rotary coupling and the rotating shaft are respectively fixed on the rotating slide plate.

[0013] A cylinder is vertically connected to the rotating slide plate, and can drive the rotating slide plate to slide when the cylinder extends or retracts.

[0014] A limiting unit is installed on the rotating slide plate to limit the highest and lowest points of the sliding stroke of the rotating slide plate.

[0015] Preferably, the limiting unit includes a limiting fixing block and a limiting kit. The limiting fixing block is provided at the highest and lowest points of the sliding stroke of the rotating slide plate, and a limiting platform is provided on both sides of the rotating slide plate. One of the limiting platforms is opposite to the limiting fixing block provided at the highest point, and the other limiting platform is opposite to the limiting fixing block provided at the lowest point. The limiting kit is provided on any pair of limiting platforms and limiting fixing blocks.

[0016] Preferably, the limiting kit includes a matching limiting bolt and a limiting nut.

[0017] Preferably, both ends of the rotating shaft are connected to the rotating slide plate via bearing mounting seats.

[0018] Preferably, the adsorption arm includes a central shaft and a vacuum adsorption plate. The rotating mechanism and the vacuum adsorption plate are respectively connected to the two ends of the central shaft, and the central shaft and the vacuum adsorption plate are not coaxially arranged. Under the drive of the sliding control mechanism, the central shaft can drive the vacuum adsorption plate to slide vertically and drive the vacuum adsorption plate to rotate laterally around the central shaft.

[0019] Preferably, the adsorption arm further includes a stepped shaft, one end of which is connected to the central shaft, and the other end is provided with a connecting arm. The stepped shaft is connected to the vacuum adsorption sheet through the connecting arm. The connecting arm and the central shaft are not coaxially arranged. When the central shaft rotates, the connecting arm can drive the vacuum adsorption sheet to flip from one side of the central shaft to the other side under the rotation of the stepped shaft, so that the vacuum adsorption sheet can be laterally flipped around the central shaft.

[0020] Preferably, the lateral rotation angle of the vacuum adsorption sheet around the central axis ranges from 0 to 360°.

[0021] Preferably, the adsorption arm further includes a vacuum generator, which is connected to the vacuum adsorption plate.

[0022] Preferably, the separation assembly further includes a support platform, the adsorption plate is fixed on the support platform, the adsorption arm is mounted on the support platform via a motion controller, the support platform is connected to the drive assembly, and under the drive of the drive assembly, the support platform can drive the adsorption plate and the adsorption arm to move synchronously.

[0023] Preferably, the support platform includes a fixed base plate and a fixed side plate. The fixed side plate stands on the fixed base plate. The motion controller is installed on one side of the fixed side plate. A fixed arm extends outward from the end of the fixed base plate. The fixed arm is correspondingly arranged on one side of the motion controller. The extended end of the fixed arm is connected to the adsorption plate.

[0024] Preferably, the separation unit consists of a flippable adsorption arm and an adsorption plate. The separation unit includes a forward separation unit and a reverse separation unit. The adsorption arm of the forward separation unit is disposed on the outside of the adsorption plate, and the adsorption arm of the reverse separation unit is disposed on the inside of the adsorption plate. The forward separation unit and the reverse separation unit are arranged at intervals, and the flipping directions of two adsorption arms in adjacent forward separation units and reverse separation units are opposite.

[0025] Preferably, the driving component includes:

[0026] An X-axis driver is connected to the separation assembly to drive the adsorption plate and the adsorption arm to move horizontally synchronously.

[0027] The Y-axis driver is connected to the X-axis driver and is used to drive the X-axis driver to move vertically.

[0028] Preferably, the drive assembly further includes a connecting mechanism, the X-axis driver is fixed on the connecting mechanism, the Y-axis driver is connected to the connecting mechanism, and under the driving action of the Y-axis driver, the connecting mechanism can drive the X-axis driver to move vertically.

[0029] Preferably, the connecting mechanism includes a connecting base plate and a connecting side plate. The X-axis driver is fixed on the connecting base plate, the connecting base plate is fixed on the connecting side plate, and the connecting side plate is connected to the Y-axis driver. Under the drive of the Y-axis driver, the connecting side plate can drive the connecting base plate to move vertically.

[0030] Preferably, the X-axis driver includes an X-axis drive motor, a synchronous pulley, and a horizontal slide rail. The horizontal slide rail is laid on the connecting base plate, and a slidable horizontal slider is provided on the horizontal slide rail. The separation component is fixedly connected to the horizontal slider. The X-axis drive motor drives the horizontal slider to move horizontally along the horizontal slide rail through the synchronous pulley, so that the horizontal slider drives the separation component to move horizontally.

[0031] Preferably, the Y-axis driver includes a Y-axis drive motor and a vertical slide rail. A movable vertical slider is provided on the vertical slide rail. The vertical slider is connected to the Y-axis drive motor and can move vertically along the vertical slide rail under the drive of the Y-axis drive motor. The connecting side plate is fixedly connected to the vertical slider. Under the drive of the vertical slider, the connecting side plate drives the connecting base plate to move vertically, thereby driving the X-axis driver to move vertically.

[0032] Preferably, the vertical slide rail is a lead screw, which is connected to the Y-axis drive motor via a drive coupling. The vertical slider is mounted on the lead screw, and the Y-axis drive motor drives the lead screw to rotate via the drive coupling, thereby driving the vertical slider to move vertically along the lead screw.

[0033] The present invention also provides a wafer pick-and-place separation method, which is based on the wafer pick-and-place separation device described above, and includes the following steps:

[0034] The driving component drives the adsorption plate to contact and vacuum adsorb onto the lower surface of the substrate, and the motion controller drives the adsorption arm to flip laterally so that the adsorption arm flips to the top of the substrate, with a gap between the adsorption arm and the adsorption plate.

[0035] The motion controller drives the adsorption arm to slide vertically, so that the adsorption arm contacts and vacuum adsorbs the thin film on the substrate;

[0036] The driving assembly drives the adsorption plate and the adsorption arm to move synchronously, so as to simultaneously remove the substrate and the thin film from the carrier;

[0037] Keeping the adsorption plate fixed, the motion controller drives the adsorption arm to rotate laterally, so that the adsorption arm can separate the film from the substrate.

[0038] Preferably, the motion controller includes a rotation mechanism and a sliding control mechanism. The sliding control mechanism is connected to the adsorption arm through the rotation mechanism. Under the driving action of the sliding control mechanism, the rotation mechanism and the adsorption arm can slide vertically synchronously, and the rotation mechanism can drive the adsorption arm to rotate laterally.

[0039] Preferably, the separation unit consists of a flippable adsorption arm and an adsorption plate. The separation unit includes a forward separation unit and a reverse separation unit. The adsorption arm of the forward separation unit is disposed on the outside of the adsorption plate, and the adsorption arm of the reverse separation unit is disposed on the inside of the adsorption plate. The forward separation unit and the reverse separation unit are arranged at intervals, and the flipping directions of two adsorption arms in adjacent forward separation units and reverse separation units are opposite.

[0040] (III) Beneficial Effects

[0041] The above-described technical solution of the present invention has the following beneficial effects:

[0042] 1. In the wafer picking and separation device and method of the present invention, the substrate is vacuum-adsorbed by an adsorption plate, and the vertical self-sliding of the adsorption arm is driven by a motion controller so that the adsorption arm adsorbs the thin film on the substrate, thereby clamping the wafer between the adsorption arm and the adsorption plate. The adsorption arm and the adsorption plate are driven to move synchronously by a driving component to achieve rapid wafer picking and to effectively ensure the integrity of the substrate and the thin film of the wafer during picking, preventing the wafer quality from being affected. The device uses a motion controller to drive the adsorption arm to rotate laterally, thereby lifting the thin film on the substrate laterally by the rotation of the adsorption arm, so that the substrate and the thin film are safely separated. Therefore, the device and method can achieve both rapid wafer picking and rapid separation of the substrate and the thin film of the wafer on the same device, effectively saving process changeover time and greatly improving production capacity.

[0043] 2. In the device and method described in this invention, the wafer clamping and picking process is further decomposed into two steps by the motion controller driving the vertical self-sliding of the adsorption arm. When the adsorption plate adsorbs the substrate, there is a vertical safety gap between the film and the adsorption arm, which can prevent the film from being damaged or falling off. After the adsorption plate has finished adsorbing the lower surface of the substrate, the adsorption arm is driven to move vertically to adhere to the film, thereby using vacuum to adsorb the film and prevent displacement between the adsorption arm and the film, as well as between the film and the substrate. This ensures that the adsorption plate and the adsorption arm safely clamp the wafer, avoids damage to the film, and ensures that there is no relative displacement between the substrate and the film during the wafer picking and separation process, making the wafer picking and separation process highly accurate.

[0044] 3. In the device and method described in this invention, multiple sets of separation units are respectively arranged on the same separation component to realize the simultaneous pick-up, placement and separation of multiple wafers in one operation.

[0045] 4. In the device and method described in this invention, the forward separation unit and the reverse separation unit are arranged alternately, and the two adsorption arms in adjacent forward separation units and reverse separation units are flipped in opposite directions, thereby preventing the adsorption arms of two adjacent sets of separation units from interfering with each other when flipping, improving equipment safety, and effectively saving equipment space.

[0046] 5. In the device and method described in this invention, by setting a limiting unit, the rotating slide plate has a controllable vertical sliding stroke, thereby improving the accuracy of plate picking and separation. Attached Figure Description

[0047] Figure 1 This is a schematic diagram of the wafer picking and separating device according to Embodiment 1 of the present invention;

[0048] Figure 2 This is a top view of the detachable component according to Embodiment 1 of the present invention;

[0049] Figure 3 This is a schematic diagram of the rotating mechanism according to Embodiment 1 of the present invention;

[0050] Figure 4 This is a diagram showing the working state of the motion controller according to Embodiment 1 of the present invention;

[0051] Figure 5 This is a schematic diagram of the motion controller in Embodiment 2 of the present invention;

[0052] Figure 6 These are schematic diagrams of the vehicle structures according to embodiments one to three of the present invention;

[0053] Figure 7 This is a schematic diagram of the loading state of the wafer in Embodiments 1 to 3 of the present invention;

[0054] Figure 8 These are schematic diagrams of the sheet removal process of the separation components in embodiments one to three of the present invention;

[0055] Figure 9 This is a schematic diagram of the initial separation state of the separation components in Embodiments 1 to 3 of the present invention;

[0056] Figure 10 This is a structural schematic diagram of the separation state of the separation components in Embodiments 1 to 3 of the present invention.

[0057] The components include: 1. Y-axis driver; 2. X-axis driver; 3. Connecting base plate; 4. Separation assembly; 5. Connecting side plate; 6. Water spray nozzle.

[0058] 10. Fixed base plate; 20. Fixed side plate; 30. Rotating mechanism; 40. Rotating slide plate; 50. Cylinder; 60. Guide rail; 70. Adsorption arm; 80. Fixed arm; 90. Adsorption plate;

[0059] 31. Servo motor; 32. Rotary coupling; 33. Rotary connecting plate; 34. Drive wheel; 35. Belt; 36. Driven wheel; 37. Shaft; 38. Bearing mount;

[0060] 401, 406, Limiting blocks; 402, 404, Limiting bolts; 403, 405, Limiting nuts; 407, Fixing bracket;

[0061] 100, carrier; 200, substrate; 300, thin film. Detailed Implementation

[0062] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.

[0063] In the description of this invention, unless otherwise stated, "a plurality of" means two or more. The terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention.

[0064] Example 1

[0065] like Figure 1 As shown, this embodiment provides a wafer pick-and-place device for rapid pick-and-place and separation of wafers. The wafer includes a substrate 200 and a thin film 300 disposed on the substrate 200. The device includes a separation component 4 and a driving component. The driving component is connected to the separation component 4 and can drive the separation component to move as a whole. The separation component 4 is fixed with an adsorption plate 90 for vacuum adsorption of the substrate 200. One side of the adsorption plate 90 is provided with a flip-up adsorption arm 70. The adsorption arm 70 can be flipped over to be above the substrate 200 or axially flipped outward to leave the position of the substrate 200. The adsorption arm 70 is connected to a motion controller. When the drive assembly moves the separation assembly 4 as a whole, the adsorption plate 90 can contact and vacuum adsorb onto the lower surface of the substrate 200. At this time, the motion controller can drive the adsorption arm 70 to move vertically, so that the adsorption arm 70 contacts and vacuum adsorbs the upper surface of the film 300, thereby clamping the wafer between the adsorption plate 90 and the adsorption arm 70. When the wafer is clamped between the adsorption plate 90 and the adsorption arm 70, under the driving action of the drive assembly, the adsorption arm 70 and the adsorption plate 90 can move synchronously to remove the wafer from the carrier, thereby achieving rapid wafer retrieval and effectively protecting the integrity of the substrate and film of the wafer during retrieval, preventing the wafer quality from being affected. In addition, the motion controller can also drive the adsorption arm 70 to rotate laterally, so that the adsorption arm 70 can separate the film 300 from the substrate 200, thereby achieving safe separation of the substrate 200 and the film 300.

[0066] Therefore, this device can achieve both rapid wafer picking and rapid separation of the wafer substrate 200 and thin film 300 on the same device, effectively saving process changeover time and greatly improving production capacity. Simultaneously, because the motion controller can drive the vertical self-sliding of the adsorption arm 70, the wafer clamping and picking process is further decomposed into two steps. On the one hand, when the adsorption plate 90 adsorbs the substrate 200, a vertical safety gap exists between the thin film 300 and the adsorption arm 70, preventing damage or detachment of the thin film 300. On the other hand, when the adsorption plate 90 completes the adsorption of the substrate 200… After adsorption of the wafer, the adsorption arm 70 is driven to move vertically, thereby decomposing the absolute displacement of the adsorption arm 70 from at least two degrees of freedom. This allows for precise fine-tuning of the adsorption positions of the adsorption arm 70 and the thin film 300, preventing offset between the adsorption arm 70 and the thin film 300, as well as between the thin film 300 and the substrate 200. This ensures the safe clamping of the wafer by the adsorption plate 90 and the adsorption arm 70, preventing damage to the thin film 300. Furthermore, it ensures no relative displacement between the substrate 200 and the thin film 300 during wafer removal and separation, resulting in high precision in the wafer removal and separation processes.

[0067] The separation component 4 of the device can perform both wafer picking and separation.

[0068] During wafer removal, the separation assembly 4 is moved by the drive assembly, causing the adsorption plate 90 to contact and vacuum-adsorb onto the lower surface of the substrate 200. Since the adsorption arm 70 has a preset vertical sliding stroke, when the adsorption arm 70 flips above the substrate 200, a safety gap exists between the adsorption arm 70 and the thin film 200, preventing the adsorption arm 70 from touching or damaging the wafer. The motion controller then drives the adsorption arm 70 to slide vertically downwards, causing it to contact and vacuum-adsorb onto the thin film 300. The wafer is thus accurately clamped between the adsorption plate 90 and the adsorption arm 70, preventing relative displacement between the substrate 200 and the thin film 300 during wafer removal. After the wafer is clamped, the separation assembly 4 is moved as a whole by the drive assembly, thereby driving the adsorption plate 90 and the adsorption arm 70 to move synchronously, quickly removing the wafer from the carrier 100.

[0069] During separation, the separation component 4 is configured with an initial separation state and a final separation state, such as... Figure 9 and Figure 10As shown, when the separation component 4 is in the initial separation state, the adsorption arm 70 and the adsorption plate 90 are clamped and adsorbed on the upper and lower sides of the wafer, respectively. When the separation component 4 is in the final separation state, the adsorption arm 70 flips from the top of the adsorption plate 90 to the side of the adsorption plate 90. During the process of the separation component 4 from the initial separation state to the final separation state, the separation component 4 uses a motion controller to drive the adsorption arm 70 to flip laterally, thereby lifting the thin film 300 on the substrate 200 laterally through the flipping of the adsorption arm 70, so that the substrate 200 and the thin film 300 are safely separated.

[0070] Specifically, Figure 1 In the middle, with the horizontal direction as the X-axis and the vertical direction as the Y-axis, the driving mechanism includes an X-axis driver 2 and a Y-axis driver 1. The X-axis driver 2 is connected to the separation component 4 and is used to drive the entire separation component 4 to move horizontally, that is, to drive the adsorption plate 90 and the adsorption arm 70 to move horizontally synchronously. The Y-axis driver 1 is connected to the X-axis driver 2 and is used to drive the X-axis driver 2 to move vertically.

[0071] In this embodiment, the drive assembly further includes a connecting mechanism. The X-axis driver 2 is fixed on the connecting mechanism, which is connected to the Y-axis driver 1. Under the driving action of the Y-axis driver 1, the connecting mechanism can drive the X-axis driver 2 to move vertically. The connecting mechanism includes a connecting base plate 3 and a connecting side plate 5. The X-axis driver 2 is fixed on the connecting base plate 3, and the connecting base plate 3 is fixed on the connecting side plate 5. The connecting side plate 5 is connected to the Y-axis driver 1. Under the drive of the Y-axis driver 1, the connecting side plate 5 can drive the connecting base plate 3 to move vertically, thereby driving the X-axis driver 2 to move vertically.

[0072] It should be noted that, in addition to the structure described above, the connecting mechanism may include other structures, as long as they can ensure that the X-axis driver 2 can be fixed on the connecting mechanism and that the connecting mechanism is connected to the Y-axis driver 1, so that when the Y-axis driver drives the connecting mechanism to move, it can drive the X-axis driver 2 to move vertically.

[0073] Preferably, the X-axis driver 2 includes an X-axis drive motor, a synchronous pulley, and a horizontal slide rail. The horizontal slide rail is laid on the connecting base plate 3, and a slidable horizontal slider is provided on the horizontal slide rail. The separation component 4 is fixedly connected to the horizontal slider. The X-axis drive motor drives the horizontal slider to move horizontally along the horizontal slide rail through the synchronous pulley, thereby causing the horizontal slider to drive the entire separation component 4 to move along the horizontal X-axis. Similarly, the Y-axis driver 1 includes a Y-axis drive motor and a vertical slide rail. The vertical slide rail is set vertically, and a vertical slider is provided on it. The vertical slider can slide along the vertical slide rail. The Y-axis drive motor is preferably installed at either end of the vertical slide rail and can drive the vertical slider to slide. The connecting side plate 5 is fixedly connected to the vertical slider, thereby causing the vertical slider to drive the connecting side plate 5 to move vertically, and thus drive the X-axis driver 2 to move vertically.

[0074] To enhance the structural reliability of the drive mechanism, the vertical slide rail of the Y-axis driver can, in addition to the aforementioned structure where the slider is movably assembled within the rail, also employ a structure where a lead screw and a nut are movably assembled. Preferably, the vertical slide rail is a lead screw, and the vertical slider is a nut. The lead screw is connected to the output shaft of the Y-axis drive motor via a drive coupling, allowing the Y-axis drive motor to drive the lead screw to rotate through the drive coupling. This, in turn, causes the vertical slider, screwed onto the lead screw, to move along the lead screw, thereby achieving the vertical movement of the vertical slider.

[0075] It should be noted that in the X-axis driver 2 and Y-axis driver 1 of this embodiment, the drive motor can be a servo motor 31 or a stepper motor; the horizontal slide rail of the X-axis driver 2 and the vertical slide rail of the Y-axis driver 1 can both be replaced by a lead screw and support assembly; the synchronous pulley of the X-axis driver 2 can be replaced by a gear assembly, that is, the X-axis drive motor is connected to the separation assembly 4 through the gear assembly to drive the separation assembly 4 to move horizontally along the horizontal slide rail; the drive coupling of the Y-axis driver 1 can be replaced by a synchronous pulley or a gear assembly, as long as it enables the Y-axis drive motor to drive the X-axis driver 2 to move along the vertical slide rail through the connecting side plate 5.

[0076] Figure 1The reference coordinate system of this device is shown, where the positive direction of the Z-axis is the outer side and the negative direction of the Z-axis is the inner side. In the device of this embodiment, a flip-up adsorption arm 70 and an adsorption plate 90 are used as separation units. The separation unit includes a forward separation unit and a reverse separation unit. The adsorption arm 70 of the forward separation unit is located on the outer side of the adsorption plate 90, and the adsorption arm 70 of the reverse separation unit is located on the inner side of the adsorption plate 90. In this embodiment, the separation assembly is provided with one or more sets of separation units. When one set of separation units is provided, the separation unit can be either a forward separation unit or a reverse separation unit. When multiple sets of separation units are provided, the forward separation units and the reverse separation units are arranged alternately. Since the adsorption arms 70 in each set of separation units can be controlled independently, and the flipping directions of the two adsorption arms 70 in adjacent forward separation units and reverse separation units are opposite, preferably, the flipping angle range of each adsorption arm 70 when it is flipped laterally is 0 to 360°, so this device can not only realize the simultaneous picking, placing and separating of multiple substrates 200 in one operation, but also prevent the two adsorption arms 70 of adjacent sets of separation units from interfering with each other when flipping, thereby improving equipment safety and effectively saving equipment space.

[0077] The following describes the structure of separation component 4 in detail, taking the example of setting two sets of separation units on a separation component 4. One of the two sets of separation units is a forward separation unit and the other is a reverse separation unit. In order to facilitate the safe flipping of the adsorption arms 70 of each set, the two adsorption plates 90 in these two sets of separation units are adjacent to each other.

[0078] like Figure 2 As shown, the separation component 4 includes a rotating mechanism 30 and a sliding control mechanism. The motion controller also includes the rotating mechanism 30 and the sliding control mechanism. The sliding control mechanism is connected to the adsorption arm 70 through the rotating mechanism 30. Under the driving action of the sliding control mechanism, the rotating mechanism 30 and the adsorption arm 70 can slide vertically synchronously. The rotating mechanism 30 can also drive the adsorption arm 70 to rotate laterally independently. Since the driving component can drive the separation component 4 to move as a whole, when the separation component 4 moves as a whole, it means that the rotating mechanism 30, the sliding control mechanism, and the adsorption plate 90 fixed on the separation component 4 move synchronously. Therefore, once the position of the adsorption plate 90 is determined, it can be used as a reference to drive the adsorption arm 70 to move and rotate through the cooperation of the rotating mechanism 30 and the sliding control mechanism.

[0079] To further achieve a reliable connection between the separation component 4 and the drive component and improve the operating accuracy of the device, the separation component 4 preferably also includes a support platform. The adsorption plate 90 is fixed on the support platform, and the adsorption arm 70 is installed on the support platform through a motion controller. The support platform is connected to the drive component, which can drive the support platform to move, thereby causing the support platform to drive the adsorption plate 90 and the adsorption arm 70 to move synchronously, thus enabling the drive component to achieve the driving effect of the overall movement of the separation component 4.

[0080] The support platform includes, but is not limited to, a fixed base plate 10 and a fixed side plate 20. The fixed side plate 20 stands on the fixed base plate 10. The rotation mechanism 30 and the sliding control mechanism of the motion controller are both installed on the same side of the fixed side plate 20. A fixed arm 80 extends outward from the end of the fixed base plate 10. The fixed arm 80 is correspondingly set on one side of the motion controller. An adsorption plate 90 is connected to the extended end of the fixed arm 80.

[0081] When the separation assembly 4 is provided with two sets of separation units, it is preferable that a fixed side plate 20 is erected at each end of the fixed base plate 10. Two rotating mechanisms 30 are respectively connected to the two adsorption arms 70 in the two sets of separation units. The two rotating mechanisms 30 are respectively installed on the inner side of the two fixed side plates 20 through a sliding control mechanism. Two fixed arms 80 extend outward side by side at the same end of the fixed base plate 10. An adsorption plate 90 is fixed at the extended end of each fixed arm 80. The adsorption plate 90 includes an adsorption end. The adsorption end is inserted into the carrier 100 and adsorbed on the lower surface of the substrate 200 by vacuum adsorption. A preset distance is reserved between the two fixed arms 80 to avoid collisions between the substrates 200 and the thin film 300 of the two wafers during wafer picking or separation. This is because: if the two rotating mechanisms 30 rotate in the same direction, the preset distance between the two fixed arms 80 should be large enough, thus requiring a sufficiently large space between the two thin films 300 to ensure no interference occurs during separation. However, on the one hand, when the distance between the two thin films 300 is large enough, the size of the mechanism will increase. The two adsorption arms 70 of this device adopt a left-right reverse flipping method to simultaneously separate the substrates 200 and thin films 300 of the two wafers, thereby effectively reducing the space occupied by the mechanism. On the other hand, the space between the thin films 300 of the two wafers can be achieved by increasing the size of the carrier 100, or the two adsorption arms 70 can be set to a movable state without changing the size of the carrier 100, so that the distance between the two adsorption arms 70 can be adjusted. This device uses two adsorption arms 70 with opposite flipping directions to achieve simultaneous separation of the thin film 300 and substrate 200 of the two wafers. This ensures that the process of simultaneous separation of multiple wafers can be safely achieved without changing the original size of the carrier 100. Furthermore, it does not require adjusting the spacing of the adsorption arms 70 and will not cause interference between the two thin films 300. Therefore, it is the most preferred structure with the highest safety and reliability.

[0082] To achieve the lateral flipping of the adsorption arm 70, the adsorption arm 70 preferably includes a central shaft and a vacuum adsorption plate. The rotating mechanism and the vacuum adsorption plate are respectively connected to the two ends of the central shaft, and the central shaft and the vacuum adsorption plate are not coaxially arranged. Therefore, the rotating mechanism moves vertically under the drive of the sliding control mechanism, while the central shaft can drive the vacuum adsorption plate to slide vertically. Through the rotation of the central shaft itself, the vacuum adsorption plate is driven to flip laterally around the central shaft.

[0083] To ensure sufficient flipping accuracy during vacuum adsorption sheet flipping, the adsorption arm 70 preferably includes a stepped shaft. One end of the stepped shaft is connected to the central shaft, and the other end is provided with a connecting arm. The stepped shaft is connected to the vacuum adsorption sheet through the connecting arm. When the central shaft rotates, the connecting arm, under the rotation of the stepped shaft, can drive the vacuum adsorption sheet to flip from one side of the central shaft to the other side, so that the vacuum adsorption sheet can be laterally flipped around the central shaft. Moreover, the connecting arm and the central shaft are not coaxially arranged, and the flipping radius of the lateral flipping of the connecting arm can be reasonably controlled. Thus, under the drive of the rotation mechanism, after the vacuum adsorption sheet flips to above the thin film 300, it moves vertically downward under the drive of the motion controller to clamp the wafer from the upper surface of the thin film 300, while vacuum adsorbing it onto the thin film 300. Then, the flipping of the vacuum adsorption sheet drives the thin film 300 to be lifted off the substrate 200. The number of stepped levels of the stepped shaft can be determined according to the flipping radius of the vacuum adsorption sheet and the structural strength coefficient. The rotation angle of the central axis can be adjusted by the rotating mechanism 30, thereby controlling the flipping position and flipping speed of the vacuum adsorption sheet. The vacuum adsorption sheet is also connected to a vacuum generator, thereby creating a vacuum negative pressure environment between the vacuum adsorption sheet and the film 200, so that the vacuum adsorption sheet can vacuum adsorb the film 200. Similarly, a vacuum generator is also connected to the adsorption plate 90.

[0084] Specifically, such as Figure 3 As shown, the rotating mechanism 30 in this embodiment includes a belt drive mechanism. The driving wheel 34 of the belt drive mechanism is connected to a servo motor 31 through a rotary coupling 32. The belt drive mechanism may have one or more driven wheels 36. Any driven wheel 36 of the belt drive mechanism is connected to the adsorption arm 70 through a rotating shaft 37. The rotation of the driving shaft of the servo motor 31 can drive the rotating shaft 37 to rotate, thereby driving the adsorption arm 70 to perform a lateral flip. The rotary coupling 32 and the rotating shaft 37 are respectively connected to a sliding control mechanism. The sliding control mechanism can simultaneously drive the rotary coupling 32 and the rotating shaft 37 to move synchronously, thereby realizing the vertical reciprocating self-sliding of the rotating mechanism 30.

[0085] It should be noted that the belt drive mechanism of the rotating mechanism 30 can also be a gear drive mechanism. Correspondingly, the driving gear in the gear drive mechanism is connected to the rotating coupling 32, and any driven gear is connected to the rotating shaft 37, thereby realizing the reliable transmission of power and torque of the servo motor 31. The power unit of the rotating mechanism 30 can be either the servo motor 31 or a stepper motor.

[0086] like Figure 4 As shown, in order to reliably control the vertical reciprocating self-sliding of the rotating mechanism 30, the sliding control mechanism of this embodiment includes a rotating slide plate 40, a cylinder 50, and a limiting unit.

[0087] Specifically, the guide rail 60 is preferably laid on the fixed side plate 20 of the support platform, so that when the drive mechanism drives the support platform to move, the guide rail 60 can move with the support platform, thereby pushing the rotating mechanism 30 to move with the entire separation component 4; the rotating slide plate 40 is connected to the guide rail 60 through a slider, and the slider drives the rotating slide plate 40 to slide vertically along the guide rail 60, thereby using the guide rail 60 to limit the movement direction of the rotating slide plate 40; the rotating coupling 32 and the rotating shaft 37 are respectively fixed on the rotating slide plate 40 and can move with the sliding of the rotating slide plate 40. Preferably, both ends of the rotating shaft 37 are connected to the rotating slide plate 40 through bearing fixing seats 38, and the rotating coupling 32 is preferably fixed on the rotating slide plate 40 through a rotating connecting plate 33, thereby ensuring high rotational accuracy of the rotating shaft 37 and the rotating coupling 32 respectively.

[0088] In addition to using the guide rail 60 to limit the movement direction of the rotating slide plate 40, a lead screw assembly can also be used to limit the movement direction of the rotating slide plate 40. That is, a lead screw nut is set on the rotating slide plate 40 and the lead screw is fixed on the fixed side plate 20. The vertical sliding of the rotating slide plate 40 is achieved by using the vertical sliding of the lead screw nut on the lead screw.

[0089] The cylinder 50 is vertically connected to the rotating slide plate 40, and can drive the rotating slide plate 40 to slide when the cylinder 50 extends or retracts. In this embodiment, preferably, the cylinder barrel of the cylinder 50 is fixed to the fixed side plate 20 by the fixing bracket 407, one end of the piston rod of the cylinder 50 is fixed to the fixed base plate 10, and the other end reciprocates along the axial direction of the cylinder barrel. Since the fixed base plate 10 is fixed relative to the separation assembly 4 as a whole, when the cylinder 50 is in the extended state, one end of the piston rod abuts against the fixed base plate 10, and the other end pushes the slider to move upward along the guide rail 60; the rotating slide plate 40 is fixed on the slider, the rotating mechanism 30 is fixed on the rotating slide plate 40, and the suction arm 70 is fixed on the rotating mechanism 30. Therefore, when the piston rod of cylinder 50 extends, the slider of guide rail 60 moves upward, thereby causing the rotating slide plate 40, rotating mechanism 30 and suction arm 70 to move upward as well; when the piston rod of cylinder 50 retracts, the piston rod pulls the slider to move downward along guide rail 60, and the rotating slide plate 40, rotating mechanism 30 and suction arm 70 also move downward as well, thereby realizing the vertical sliding of rotating mechanism 30.

[0090] It should be noted that, in addition to using the extension and retraction of the cylinder 50 to drive the rotating slide plate 40 to slide, a screw and nut assembly structure can also be used to drive the rotating slide plate 40 to slide. That is, the screw is placed on the fixed base plate 10, the screw nut is fitted on the outside of the screw and moves along the screw axis, and the screw nut is fixed on the rotating slide plate 40. Thus, the relative movement between the screw nut and the screw drives the rotating slide plate 40 to slide vertically.

[0091] Preferably, the limiting unit is installed on the rotating slide plate 40 to limit the highest and lowest points of the sliding stroke of the rotating slide plate 40, thereby using the combination of the guide rail 60 and the limiting unit to achieve dual limiting of the sliding direction and sliding stroke of the rotating slide plate 40, thereby achieving fine adjustment of the displacement of the adsorption arm 70 and ensuring that the adsorption arm 70 safely adsorbs the film 300.

[0092] Specifically, the limiting unit includes limiting fixing blocks 401 and 406 and a limiting kit. Limiting fixing blocks 401 and 406 are provided at the highest and lowest points of the sliding stroke of the rotating slide plate 40, and limiting platforms are provided on both sides of the rotating slide plate 40. One limiting platform is opposite to the limiting fixing block 401 at the highest point, and the other limiting platform is opposite to the limiting fixing block 406 at the lowest point. The limiting kit is provided on any pair of limiting platforms and limiting fixing blocks 401 and 406. Preferably, the limiting kit includes matching limiting bolts 402 and 404 and limiting nuts 403 and 405.

[0093] In this embodiment, the rotating slide plate 40 has a lower limiting platform on the top left and a higher limiting platform extending outward on the right, thus forming a stepped structure at the top of the rotating slide plate 40. On one hand, a highest point limiting fixing block 401 is provided above the left limiting platform, with a limiting bolt 402 on the limiting fixing block 401 and a limiting nut 403 at the corresponding position on the limiting platform, so that the limiting bolt 402 and the limiting nut 403 are positioned opposite each other, thus forming a limiting kit at the highest point. Similarly, a lowest point limiting fixing block 406 is provided below the right limiting platform, with a limiting bolt 404 on the extending limiting platform and a limiting nut 405 correspondingly provided on the limiting fixing block 406, so that the limiting bolt 404 and the limiting nut 405 are positioned opposite each other, thus forming a limiting kit at the lowest point. When the piston rod of cylinder 50 extends, the limiting bolt 402 and the limiting nut 403 at the highest point contact each other, and this position is the highest point of the sliding stroke. When the piston rod of cylinder 50 retracts, the limiting bolt 404 and the limiting nut 405 at the lowest point contact each other, and this position is the lowest point of the sliding stroke. The rotating slide plate 40 will stop sliding at both the highest and lowest points due to the collision between the limiting bolts 402 and 404 and the limiting nuts 403 and 405, thus achieving upper and lower limits on the sliding stroke of the rotating slide plate 40.

[0094] Example 2

[0095] The structure of the wafer picking and separating device described in Embodiment 2 is basically the same as that of the device described in Embodiment 1. The similarities will not be repeated here. The differences are as follows: Figure 5As shown, in the device described in this embodiment 2, the rotating mechanism 30 is connected to the rotating shaft 37 via the swing cylinder 50. The swing cylinder 50 drives the rotating shaft 37 to rotate, thereby driving the adsorption handle to rotate laterally. The swing cylinder 50 and the rotating shaft 37 are respectively connected to the rotating slide plate 40 and connected to the sliding control mechanism. The sliding control mechanism can simultaneously drive the swing cylinder 50 and the rotating shaft 37 to move synchronously, thereby realizing the vertical reciprocating self-sliding of the rotating mechanism 30.

[0096] Example 3

[0097] Based on Embodiment 1 or Embodiment 2, Embodiment 3 provides a wafer pick-and-place method, including the following steps:

[0098] S1. The driving component drives the adsorption plate to contact and vacuum adsorb onto the lower surface of the substrate, and drives the adsorption arm to flip laterally through the motion controller so that the adsorption arm flips to the top of the substrate, with a gap between the adsorption arm and the adsorption plate.

[0099] S2. The motion controller drives the adsorption arm to slide vertically so that the adsorption arm contacts and vacuum adsorbs the thin film on the substrate.

[0100] S3. The adsorption plate and adsorption arm are moved synchronously by the driving component to simultaneously remove the substrate and thin film from the carrier.

[0101] S4. Keep the adsorption plate fixed, and use the motion controller to drive the adsorption arm to flip laterally so that the adsorption arm can separate the film from the substrate.

[0102] Steps S1 to S4 are the wafer retrieval steps, and step S5 is the separation step.

[0103] Furthermore, the film retrieval process can be broken down into the following steps:

[0104] S201: Drive the X-axis driver 2 to move horizontally and drive the Y-axis driver 1 to move upward so that the adsorption plate 90 and the lower surface of the substrate 200 come into contact and are adsorbed onto the substrate 200 by vacuum adsorption; drive the adsorption arm 70 to flip laterally by the rotation mechanism 30 of the motion controller so that the adsorption arm 70 flips above the substrate 200 and a gap is left between the adsorption arm 70 and the adsorption plate 90.

[0105] like Figure 6 and Figure 7As shown, multiple square carriers 100 are arranged side by side. Each carrier 100 has a groove for loading a square substrate 200 for wafers. When the substrate 200 is loaded in the groove, the edge of the thin film 300 on the substrate 200 is mounted on the upper surface of the carrier 100. One end of the carrier 100 is provided with a channel that matches the adsorption plate 90, and the number of channels is the same as the number of adsorption ends on the adsorption plate 90. In this third embodiment, the adsorption plate 90 has two adsorption ends, so the carrier 100 has two channels accordingly.

[0106] like Figure 8 As shown, when the separation component 4 picks up the wafer, it can first vacuum adsorb the adsorption plate 90 onto the lower surface of the substrate 100, and then flip the adsorption arm 70 above the adsorption plate 90 so that the wafer is located between the adsorption plate 90 and the adsorption arm 70; or it can first flip the adsorption arm 70 above the adsorption plate 90, and then drive the adsorption plate 90 to move and adsorb onto the lower surface of the substrate 100 through the drive component, that is, insert the wafer between the adsorption plate 90 and the adsorption arm 70.

[0107] Since the cylinder 50 remains in the extended state, there is a certain safety gap between the adsorption arm 70 and the adsorption plate 90. Therefore, when the adsorption plate 90 is located in the channel of the carrier 100 and adsorbed below the substrate 200, the adsorption arm 70 is located above the film 300 and does not contact the film 300.

[0108] S201: Drive cylinder 50 retracts to drive rotating mechanism 30 and adsorption arm 70 to move synchronously downward along the Y-axis, so that adsorption arm 70 and the upper surface of film 300 come into contact, and adsorption arm 70 is adsorbed onto film 300 by vacuum.

[0109] S301: Ensure that the wafer is clamped between the adsorption arm 70 and the adsorption plate 90, drive the Y-axis driver 1 to move upward a certain distance so that the adsorption plate 90 and the adsorption arm 70 of the separation component 4 can simultaneously drive the wafer substrate 200 and thin film 300 away from the carrier 100, and ensure that the separation component 4 does not contact the carrier 100.

[0110] S302: The separation assembly 4 is moved to the preset separation position by the X-axis driver 2, so that the adsorption plate 90 and the adsorption arm 70 can simultaneously remove the film 300 and the substrate 200 from the carrier 100, and the wafer removal step is completed.

[0111] In the above wafer removal step, since the separation component 4 of this device is equipped with two sets of separators, two substrates 200 can be removed simultaneously each time, effectively improving the production capacity.

[0112] Furthermore, the separation step can be broken down into the following steps:

[0113] S401: Drive the X-axis driver 2 and the Y-axis driver 1 to a preset separation position, which is equipped with a water spray nozzle 6.

[0114] S402: The positions of the thin film 300 and the substrate 200 are synchronously adjusted by the movement of the X-axis driver 2 and the Y-axis driver 1, so that each wafer has a water spray nozzle 6 between the thin film 300 and the substrate 200.

[0115] S403: Drive the rotating mechanism 30 to rotate, thereby causing the adsorption arm 70 to flip laterally, thereby lifting the film 300 off the substrate 200. The rotating mechanism 30 lifts the film 300 off the substrate 200 by rotating at a certain angle, thereby achieving the separation of the film 300 and the substrate 200.

[0116] The separation component 4 between steps 402 and 403 went through the process from the initial separation state to the end separation state. During this process, the water spray nozzle 6 continuously sprayed water onto the bonding surface of the substrate 200 and the thin film 300 to improve the lubrication between the thin film 300 and the substrate 200, and to ensure the safety of separation and the integrity of the workpiece.

[0117] Since this device has two sets of separation units, the two rotating mechanisms 30 equipped in each of the two sets of separation units can simultaneously and slowly rotate in opposite directions at a certain angle, that is... Figure 8 The left adsorption arm 70 rotates counterclockwise, while the right adsorption arm 70 rotates clockwise. After the two rotating mechanisms 30 rotate by a certain angle, the two substrates 200 and the thin film 300 are separated.

[0118] S504: After the substrate 200 is separated from the thin film 300, the drive rotation mechanism 30 is rotated rapidly to drive the adsorption arm 70 to flip to the outer position so that the substrate 200 and the thin film 300 are completely separated, thus completing the separation step of the substrate 200 and the thin film 300.

[0119] Similarly, in the two sets of separation units of this device, the two rotating mechanisms 30 rotate rapidly to the following positions: Figure 10 The outer position shown is used to completely separate the thin film 300 and the substrate 200, at which point the separation component 4 is in a separated state.

[0120] As can be seen from the above, when two sets of separation units are installed on the separation component 4, one set of separation units is a forward separation unit and the other is a reverse separation unit. In order to facilitate the safe flipping of the adsorption arms 70 of each set, the two adsorption plates 90 in these two sets of separation units are adjacent, and the flipping directions of the two adsorption arms 70 in these two sets of separation units are opposite. Therefore, by using this method to separate the substrate 200 and the thin film 300, it is possible to complete the picking, placing and separating of multiple substrates 200 in one operation, and effectively prevent the two adjacent sets of separators from interfering with each other when flipping the adsorption arms 70, thereby improving equipment safety and effectively saving equipment space.

[0121] In summary, in the wafer picking and separation apparatus and method described in the above embodiments, the substrate 200 is vacuum-adsorbed by the adsorption plate 90, and the vertical self-sliding of the adsorption arm 70 is driven by the motion controller so that the adsorption arm 70 adsorbs the thin film 300 on the substrate 200, thereby clamping the wafer between the adsorption arm 70 and the adsorption plate 90. The adsorption arm 70 and the adsorption plate 90 are driven to move synchronously by the driving component to achieve rapid wafer picking and effectively ensure the integrity of the substrate 200 and the thin film 300 during picking, preventing the wafer quality from being affected. The apparatus uses the motion controller to drive the adsorption arm 70 to laterally flip, thereby lifting the thin film 300 on the substrate 200 laterally to safely separate the substrate 200 and the thin film 300. Therefore, this apparatus and method can achieve both rapid wafer picking and rapid separation of the substrate 200 and the thin film 300 on the same device, effectively saving process changeover time and greatly improving production capacity.

[0122] In this apparatus and method, the vertical self-sliding of the adsorption arm 70 driven by the motion controller further decomposes the wafer clamping and picking process into two steps. When the adsorption plate 90 adsorbs the substrate 200, there is a vertical safety gap between the film 300 and the adsorption arm 70, which can prevent the film 300 from being damaged or falling off. After the adsorption plate 90 completes the adsorption of the lower surface of the substrate 200, the adsorption arm 70 is driven to move vertically to adhere to the film 300, thereby using vacuum to adsorb the film 300 and preventing displacement between the adsorption arm 70 and the film 300, as well as between the film 300 and the substrate 200. This ensures the safe clamping of the wafer by the adsorption plate 90 and the adsorption arm 70, avoids damage to the film 300, and ensures that there is no relative displacement between the substrate 200 and the film 300 during the wafer picking and separation process, making the wafer picking and separation process highly accurate.

[0123] In this apparatus and method, multiple sets of separation units are set on the same separation component to enable the simultaneous pick-up, placement, and separation of multiple wafers in a single operation.

[0124] In this device and method, forward separation units and reverse separation units are arranged alternately, and the two adsorption arms 70 in adjacent forward separation units and reverse separation units are flipped in opposite directions, thereby preventing the adsorption arms 70 of adjacent two sets of separation units from interfering with each other when flipping, improving equipment safety, and effectively saving equipment space.

[0125] In this device and method, by setting a limiting unit, the rotating slide plate 40 has a controllable vertical sliding stroke, thereby improving the accuracy of plate picking and separation.

[0126] The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and to design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A wafer picking and separating device, characterized in that, The device includes a separation component and a driving component. The wafer includes a substrate and a thin film disposed on the substrate. The driving component is connected to the separation component. An adsorption plate is fixed on the separation component. The adsorption plate is used to adsorb and fix the substrate. A flip-up adsorption arm is provided on one side of the adsorption plate. The adsorption plate and the adsorption arm can respectively adsorb the lower surface of the substrate and the upper surface of the thin film, so that the wafer is clamped between the adsorption plate and the adsorption arm. Under the driving action of the driving component, the adsorption arm and the adsorption plate can move synchronously to remove the wafer from the carrier. The adsorption arm is connected to a motion controller. When the drive assembly drives the adsorption plate to contact and vacuum adsorb the film on the lower surface of the substrate, the motion controller can drive the adsorption arm to move vertically so that the adsorption arm contacts and vacuum adsorbs the film. The motion controller can also drive the adsorption arm to flip laterally so that the adsorption arm drives the film to separate from the substrate. The motion controller includes a rotation mechanism and a sliding control mechanism. The sliding control mechanism is connected to the adsorption arm through the rotation mechanism. Under the driving action of the sliding control mechanism, the rotation mechanism and the adsorption arm can slide vertically synchronously, and the rotation mechanism can drive the adsorption arm to rotate laterally. The rotating mechanism includes a belt drive mechanism, the driving wheel of which is connected to a servo motor via a rotary coupling, and any driven wheel of which is connected to the adsorption arm via a rotating shaft; the rotary coupling and the rotating shaft are respectively connected to the sliding control mechanism. The adsorption arm includes a central shaft and a vacuum adsorption plate. The rotating mechanism and the vacuum adsorption plate are respectively connected to the two ends of the central shaft, and the central shaft and the vacuum adsorption plate are not coaxially arranged. Under the drive of the sliding control mechanism, the central shaft can drive the vacuum adsorption plate to slide vertically and drive the vacuum adsorption plate to rotate laterally around the central shaft.

2. The wafer picking and separating device according to claim 1, characterized in that, The sliding control mechanism includes: A rotating slide plate is connected to a guide rail via a slider. The slider is used to drive the rotating slide plate to slide vertically along the guide rail. The rotary coupling and the rotating shaft are respectively fixed on the rotating slide plate. A cylinder is vertically connected to the rotating slide plate, and can drive the rotating slide plate to slide when the cylinder extends or retracts. A limiting unit is installed on the rotating slide plate to limit the highest and lowest points of the sliding stroke of the rotating slide plate.

3. The wafer picking and separating device according to claim 2, characterized in that, The limiting unit includes a limiting fixing block and a limiting kit. The limiting fixing block is provided at the highest and lowest points of the sliding stroke of the rotating slide plate. Limiting platforms are provided on both sides of the rotating slide plate. One of the limiting platforms is opposite to the limiting fixing block provided at the highest point, and the other limiting platform is opposite to the limiting fixing block provided at the lowest point. The limiting kit is provided on any pair of limiting platforms and limiting fixing blocks.

4. The wafer picking and separating device according to claim 3, characterized in that, The limiting kit includes a matching limiting bolt and a limiting nut.

5. The wafer picking and separating device according to claim 2, characterized in that, Both ends of the rotating shaft are connected to the rotating slide plate via bearing mounting seats.

6. The wafer picking and separating device according to claim 1, characterized in that, The adsorption arm also includes a stepped shaft, one end of which is connected to the central shaft, and the other end is provided with a connecting arm. The stepped shaft is connected to the vacuum adsorption sheet through the connecting arm. The connecting arm and the central shaft are not coaxially arranged. When the central shaft rotates, the connecting arm can drive the vacuum adsorption sheet to flip from one side of the central shaft to the other side under the rotation of the stepped shaft, so that the vacuum adsorption sheet can be laterally flipped around the central shaft.

7. The wafer picking and separating device according to claim 1, characterized in that, The vacuum adsorption sheet rotates laterally around the central axis at an angle ranging from 0 to 360°.

8. The wafer picking and separating device according to claim 1, characterized in that, The adsorption arm also includes a vacuum generator, which is connected to the vacuum adsorption plate.

9. The wafer picking and separating device according to claim 1, characterized in that, The separation assembly also includes a support platform, the adsorption plate is fixed on the support platform, the adsorption arm is mounted on the support platform via a motion controller, the support platform is connected to the drive assembly, and under the drive of the drive assembly, the support platform can drive the adsorption plate and the adsorption arm to move synchronously.

10. The wafer picking and separating device according to claim 9, characterized in that, The support platform includes a fixed base plate and a fixed side plate. The fixed side plate stands on the fixed base plate. The motion controller is installed on one side of the fixed side plate. A fixed arm extends outward from the end of the fixed base plate. The fixed arm is correspondingly arranged on one side of the motion controller. The extended end of the fixed arm is connected to the adsorption plate.

11. The wafer picking and separating apparatus according to any one of claims 1-10, characterized in that, A separation unit is formed by a flip-up adsorption arm and an adsorption plate. The separation unit includes a forward separation unit and a reverse separation unit. The adsorption arm of the forward separation unit is located on the outside of the adsorption plate, and the adsorption arm of the reverse separation unit is located on the inside of the adsorption plate. The forward separation unit and the reverse separation unit are arranged at intervals, and the flipping directions of two adsorption arms in adjacent forward separation units and reverse separation units are opposite.

12. The wafer picking and separating apparatus according to any one of claims 1-10, characterized in that, The driving component includes: An X-axis driver is connected to the separation assembly to drive the adsorption plate and the adsorption arm to move horizontally synchronously. The Y-axis driver is connected to the X-axis driver and is used to drive the X-axis driver to move vertically.

13. The wafer picking and separating apparatus according to claim 12, characterized in that, The drive assembly also includes a connecting mechanism. The X-axis driver is fixed on the connecting mechanism, and the Y-axis driver is connected to the connecting mechanism. Under the driving action of the Y-axis driver, the connecting mechanism can drive the X-axis driver to move vertically.

14. The wafer picking and separating apparatus according to claim 13, characterized in that, The connecting mechanism includes a connecting base plate and a connecting side plate. The X-axis driver is fixed on the connecting base plate, and the connecting base plate is fixed on the connecting side plate. The connecting side plate is connected to the Y-axis driver. Under the drive of the Y-axis driver, the connecting side plate can drive the connecting base plate to move vertically.

15. The wafer picking and separating apparatus according to claim 14, characterized in that, The X-axis driver includes an X-axis drive motor, a synchronous pulley, and a horizontal slide rail. The horizontal slide rail is laid on the connecting base plate, and a slidable horizontal slider is provided on the horizontal slide rail. The separation component is fixedly connected to the horizontal slider. The X-axis drive motor drives the horizontal slider to move horizontally along the horizontal slide rail through the synchronous pulley, so that the horizontal slider drives the separation component to move horizontally.

16. The wafer picking and separating apparatus according to claim 14, characterized in that, The Y-axis driver includes a Y-axis drive motor and a vertical slide rail. A movable vertical slider is provided on the vertical slide rail. The vertical slider is connected to the Y-axis drive motor and can move vertically along the vertical slide rail under the drive of the Y-axis drive motor. The connecting side plate is fixedly connected to the vertical slider. Under the drive of the vertical slider, the connecting side plate drives the connecting base plate to move vertically, thereby driving the X-axis driver to move vertically.

17. The wafer picking and separating apparatus according to claim 16, characterized in that, The vertical slide rail is a lead screw, which is connected to the Y-axis drive motor via a drive coupling. The vertical slider is mounted on the lead screw, and the Y-axis drive motor drives the lead screw to rotate via the drive coupling, thereby driving the vertical slider to move vertically along the lead screw.

18. A wafer picking and separation method, characterized in that, This method is based on the wafer pick-and-place separation apparatus as described in any one of claims 1-17, and includes the following steps: The driving component drives the adsorption plate to contact and vacuum adsorb onto the lower surface of the substrate, and the motion controller drives the adsorption arm to flip laterally so that the adsorption arm flips to the top of the substrate, with a gap between the adsorption arm and the adsorption plate. The motion controller drives the adsorption arm to slide vertically, so that the adsorption arm contacts and vacuum adsorbs the thin film on the substrate; The driving assembly drives the adsorption plate and the adsorption arm to move synchronously, so as to simultaneously remove the substrate and the thin film from the carrier; Keeping the adsorption plate fixed, the motion controller drives the adsorption arm to rotate laterally, so that the adsorption arm can separate the film from the substrate.

Images