Inductive component with down-drawing electrode and method for processing the same

Abstract

The present application relates to a kind of processing methods of inductance component, first step, base layer preparation stage, second step, conductive main structure preparation stage, third step, electrical enhancement layer preparation stage, fourth step, end electrode preparation stage.In addition, the present application also discloses the inductance component prepared using the method, including insulating substrate one, insulating substrate two, electrical layer, first insulating layer, electrical enhancement layer, second insulating layer and end electrode, the electrical layer is filled between the insulating substrate one and the insulating substrate two, the insulating substrate one and the insulating substrate two include a through hole one and through hole two respectively, the upper and lower four sides of the insulating substrate one and the upper and lower four sides of the insulating substrate two are provided with electrical layer, the upper and lower four sides of the electrical layer and inner wall are provided with first insulating layer.Inductance component prepared using the method effectively reduces the size of inductance component, effectively solves the problem of soldering tin climbing glue when inductance component is welded.

Description

Technical Field

[0001] This invention relates to an inductor assembly with a bottom-lead electrode and a method for fabricating the same. Background Technology

[0002] With the advancement of technology, the trend towards thinner and smaller electronic products is inevitable. Therefore, components such as resistors, capacitors, and inductors mounted on the printed circuit boards of electronic products must also be miniaturized. Taking a molded miniature inductor as an example, its structure is mainly formed by first creating the internal circuitry through wire winding, then encapsulating it, and finally forming terminal electrodes on the left and right sides for external electrical connection.

[0003] However, since the terminal electrodes of existing integrally molded micro inductors are located on the left and right sides of the component, such as Chinese patent CN201921231975.6, not only can the overall size of the component not be effectively reduced, but when the inductor is soldered to the external printed circuit board through the terminal electrodes, the solder glue crawling problem is also easy to reduce the accumulation of the printed circuit board. Summary of the Invention

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide an inductor component with a bottom-lead electrode and a method for processing the same. The inductor component prepared by this method realizes the bottom-lead setting of the terminal electrode, which can effectively reduce the size of the inductor component and also effectively avoid the problem of solder glue crawling when the inductor component is soldered to the outside.

[0005] To achieve the above and other related objectives, the present invention provides a method for processing an inductor component, comprising: a first step, a substrate preparation stage, in which copper seed layers are first plated on the top and bottom surfaces of an insulating substrate; then, through-holes are formed by drilling holes in the substrate; a copper film is formed on the inner surface of the through-holes by sputtering; and finally, copper is plated on the copper seed layer and the copper film by electroplating to form an electrical layer; a second step, a conductive main structure fabrication stage, in which photoresist layers are sprayed on the top and bottom surfaces of the electrical layer; then, the photoresist layers on the sides of the through-holes are exposed and developed to expose the electrical layer; then, the exposed electrical layer is etched to the insulating substrate, and the photoresist layers are removed to form conductive lines; a third step... In the first step, the electrical enhancement layer preparation stage, the first insulating layer is printed on the top and bottom of the conductive main structure. Then, the first insulating layer and the insulating substrate between the electrical layers are cut and removed. Finally, the magnetic material is wrapped around the top, bottom, front, back, and through holes of the first insulating layer by a lamination and curing method to form the electrical enhancement layer. In the fourth step, the terminal electrode preparation stage, the product prepared in the third step is cut into multiple semi-finished products. A second insulating layer is coated on the outside of each semi-finished product. Then, the bottom two ends of the second insulating layer are cut and removed to expose the substrate. Finally, a copper layer, a nickel layer, and a tin layer are sequentially plated on the exposed substrate to form the terminal electrode. The entire inductor component is then prepared.

[0006] Meanwhile, the present invention also provides an inductor assembly with a bottom-lead electrode prepared using the above-described processing method, comprising an insulating substrate, an electrical layer, a first insulating layer, an electrical reinforcement layer, a second insulating layer, and a terminal electrode. The insulating substrate includes an insulating substrate one and an insulating substrate two, with the electrical layer filling the space between the insulating substrate one and the insulating substrate two. The insulating substrate one and the insulating substrate two each include a through-hole one and a through-hole two. The upper and lower surfaces of the insulating substrate one and the upper and lower surfaces of the insulating substrate two are provided with the electrical layer. The upper and lower surfaces and inner walls of the electrical layer are provided with the first insulating layer. The upper and lower surfaces of the first insulating layer and the through-hole one and through-hole two are provided with the electrical reinforcement layer. The second insulating layer is provided outside the electrical reinforcement layer. The terminal electrode is located below the insulating substrate one and the insulating substrate two, and passes through the second insulating layer, the electrical reinforcement layer, and the first insulating layer in sequence, and is connected to the electrical layer.

[0007] In summary, the inductor component with a bottom-lead electrode and its processing method of the present invention have the following beneficial effects: the inductor component prepared by this method realizes the bottom-lead setting of the opposite electrode, which effectively reduces the forming size of the inductor component and is conducive to the miniaturization of integrated circuits; the setting of the bottom-lead electrode effectively reduces solder paste creep of the inductor component, resulting in better soldering effect. Attached Figure Description

[0008] Figure 1 This is a cross-sectional schematic diagram of an inductor assembly with a bottom-lead electrode;

[0009] Figure 2 This is a flowchart illustrating the fabrication steps of an inductor assembly with a bottom-lead electrode, demonstrating the fabrication steps of the inductor assembly with a bottom-lead electrode according to the present invention.

[0010] Figure 3 This is a flowchart illustrating the basic preparation stage;

[0011] Figure 4 This is a flowchart illustrating the fabrication stages of the conductive main structure of the inductor component with a bottom electrode according to the present invention.

[0012] Figure 5 This is a flowchart illustrating the electrical enhancement layer fabrication stage of the inductor component with a bottom electrode according to the present invention.

[0013] Figure 6 This is a flowchart illustrating the terminal electrode fabrication stage of the inductor assembly with a bottom-lead electrode according to the present invention.

[0014] 2. Insulating substrate; 3. Conductive main structure; 4. First insulating layer; 5. Electrical reinforcement layer; 6. Terminal electrode; 20. Through hole; 21. Top surface; 22. Bottom surface; 30. Copper seed layer; 31. Electrical layer; 34. Photoresist layer; 60. Semi-finished product; 61. Copper layer; 62. Nickel layer; 63. Tin layer; 64. Second insulating layer; 34. Photoresist layer; 60. Semi-finished product; 61. Copper layer; 62. Nickel layer; 63. Tin layer; 64. Second insulating layer; 101. Substrate preparation stage; 102. Conductive main structure preparation stage; 103. Electrical reinforcement layer preparation stage; 104. Terminal electrode preparation stage; 201. Insulating substrate one; 202. Insulating substrate two; 203. Through hole one; 204. Through hole two; 301. Copper film; 302. Copper conductive layer. Detailed Implementation

[0015] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0016] Please see Figure 1 See the figures. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and are not intended to limit the scope of the invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of the invention, should still fall within the scope of the disclosed technical content. Furthermore, the terms such as "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention.

[0017] like Figure 1As shown, an inductor assembly with a bottom-lead electrode according to the present invention includes an insulating substrate 2, an electrical layer 31, a first insulating layer 4, an electrical enhancement layer 5, a second insulating layer 64, and a terminal electrode 6. The insulating substrate 2 includes an insulating substrate one 201 and an insulating substrate two 202, with the electrical layer 31 filling the space between the insulating substrate one 201 and the insulating substrate two 202. The insulating substrate one 201 and the insulating substrate two 202 each include a through hole one 203 and a through hole two 204. The electrical layer 31 is provided on the upper and lower surfaces of the insulating substrate one 201 and the upper and lower surfaces of the insulating substrate two 202. The electrical layer 31 has a first electrode 64 on its upper and lower surfaces and inner wall. An insulating layer 4 is provided. An electrical enhancement layer 5 is provided on the upper and lower surfaces of the first insulating layer 4 and in the through holes 203 and 204. A second insulating layer 64 is provided outside the electrical enhancement layer 5. The terminal electrode 6 is located below the first insulating substrate 201 and the second insulating substrate 202, and passes through the second insulating layer 64, the electrical enhancement layer 5 and the first insulating layer in sequence, and is connected to the electrical layer 31. The terminal electrode 6 includes a tin layer 63, a nickel layer 62 and a copper layer 61. The tin layer 63 is exposed on the outside and is connected to the nickel layer 62 inside. The nickel layer 62 is connected to the copper layer 61 inside. The copper layer 61 is connected to the electrical layer 31 inside.

[0018] like Figure 2 As shown, a method for fabricating an inductor assembly with a bottom-lead electrode includes the following steps: a substrate preparation stage 101, a conductive main structure preparation stage 102, an electrical enhancement layer preparation stage 103, and a terminal electrode preparation stage 104.

[0019] like Figure 2 and Figure 3 As shown, in the substrate preparation stage 101, a copper seed layer 30 is first formed on the top surface 21 and bottom surface 22 of the insulating substrate 2. Then, multiple through holes 20 are formed by drilling holes in the insulating substrate 2, and a copper film 301 is plated on the inner side of the through holes 20 by sputtering. Finally, a copper conductive layer 302 is plated on the copper seed layer 30 and the copper film 301 by electroplating to complete the substrate preparation stage 101.

[0020] like Figure 2 and Figure 4 As shown, after step 101, the conductive main structure preparation stage 102 is carried out. Photoresist layers 34 are sprayed on the upper and lower sides of the copper conductive layer 302, and the photoresist layer 34 on the side of the via 20 is exposed and developed to expose the electrical layer 31. Then, the exposed electrical layer 31 is etched to the insulating substrate 2, and the photoresist layer 34 is removed to form the conductive main structure 3.

[0021] like Figure 2 and Figure 5As shown, in the electrical enhancement layer preparation stage 103, the first insulating layer 4 is printed on the top and bottom of the conductive main structure 3. Then, the first insulating layer 4 and the insulating substrate 2 between the electrical layers 31 are cut and removed. Finally, the magnetic material is wrapped around the top, bottom, front and back sides of the first insulating layer 4 and inside the through hole 20 by the pressure film curing method to form the electrical enhancement layer 5.

[0022] like Figure 2 and 6 As shown, in the terminal electrode preparation stage 104, the product prepared in the third step is cut into multiple semi-finished products 60. A second insulating layer 64 is coated on the outside of each semi-finished product 60. Then, the bottom ends of the second insulating layer 64 are cut off to expose the insulating substrate 2. Finally, a copper layer 61, a nickel layer 62 and a tin layer 63 are sequentially plated on the exposed insulating substrate 2 to form the terminal electrode 6. The entire inductor assembly is then prepared.

[0023] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A method for processing an inductor component, characterized in that, include: The first step, the substrate preparation stage, involves first plating a copper seed layer on the top and bottom surfaces of the insulating substrate, then drilling holes in the substrate to form through holes, and forming a copper film on the inner surface of the through holes by sputtering, and finally plating copper on the copper seed layer and copper film by electroplating to form an electrical layer. The second step, the conductive main structure fabrication stage, involves spraying photoresist layers onto the top and bottom surfaces of the electrical layer, then exposing and developing the photoresist layer on the side of the via to expose the electrical layer, then etching the exposed electrical layer onto the insulating substrate, and finally removing the photoresist layer to form the conductive main structure. The third step, the electrical reinforcement layer preparation stage, involves printing the first insulating layer on the top and bottom of the conductive main structure, then cutting and removing the first insulating layer and the insulating substrate between the electrical layers, and finally using a lamination and curing method to encapsulate the magnetic material on the top, bottom, front, back, and through holes of the first insulating layer to form the electrical reinforcement layer. The fourth step is the terminal electrode preparation stage. The product prepared in the third step is cut into multiple semi-finished products. A second insulating layer is coated on the outside of each semi-finished product. Then, the bottom two ends of the second insulating layer are cut off to expose the insulating substrate. Finally, a copper layer, a nickel layer and a tin layer are sequentially plated on the exposed insulating substrate to form the terminal electrode. The entire inductor component is then prepared. An inductor component with a bottom-lead electrode, fabricated according to the above-described inductor component processing method, has the following structure: an insulating substrate, an electrical layer, a first insulating layer, an electrical reinforcement layer, a second insulating layer, and a terminal electrode. The insulating substrate includes an insulating substrate one and an insulating substrate two, with the electrical layer filling the space between the insulating substrate one and the insulating substrate two. The insulating substrate one and the insulating substrate two each include a through-hole one and a through-hole two. The upper and lower surfaces of the insulating substrate one and the upper and lower surfaces of the insulating substrate two are provided with the electrical layer. The upper and lower surfaces and inner walls of the electrical layer are provided with the first insulating layer. The upper and lower surfaces of the first insulating layer and the through-hole one and through-hole two are provided with the electrical reinforcement layer. The second insulating layer is provided outside the electrical reinforcement layer. The terminal electrode is located below the insulating substrate one and the insulating substrate two, and passes through the second insulating layer, the electrical reinforcement layer, and the first insulating layer in sequence, and is connected to the electrical layer.

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