Light-emitting diode packaging structure

Abstract

The present invention discloses a light-emitting diode packaging structure, comprising an LED bracket, a driving bracket group, a shell, a plurality of LED chips, a driving chip, and a translucent packaging body. The LED bracket comprises a bearing section and two bent pins connected to the bearing section. The driving bracket group comprises two side brackets, each side bracket comprising a functional section and a bent pin. The shell is formed with a receiving groove exposing the bearing section and the two functional sections. The plurality of bent pins extend from the side of the shell and bend to the bottom surface of the shell. The plurality of LED chips are fixed and electrically connected to the bearing section. The driving chip is fixed to one of the functional sections and electrically connected to another functional section. The plurality of LED chips are electrically connected to the driving chip respectively so as to be driven by the driving chip to emit light. The translucent packaging body is filled in the receiving groove to bury the plurality of LED chips and the driving chip. Accordingly, the internal structure of the light-emitting diode packaging structure does not need to be restricted by the external driving chip and can selectively realize side emission or forward emission.

Description

Technical Field

[0001] The present invention relates to a packaging structure, in particular to a light emitting diode packaging structure. Background Art

[0002] When multiple LED chips are placed inside a conventional LED package, they must be electrically connected to an external driver chip to be controlled by the external driver chip. Therefore, the design of the conventional LED package is limited by the external driver chip.

[0003] Therefore, the inventors believed that the above defects could be improved, and they devoted themselves to research and applied scientific principles, and finally proposed the present invention which has a reasonable design and effectively improves the above defects. Summary of the Invention

[0004] An embodiment of the present invention provides a light emitting diode package structure, which can effectively improve defects that may occur in existing light emitting diode package structures.

[0005] The embodiment of the present invention discloses a light-emitting diode packaging structure, comprising: an LED bracket, comprising a bearing section and two bent pins connected to the bearing section; a driving bracket assembly, spaced apart from the LED bracket and comprising two side brackets; wherein each of the side brackets comprises a functional section, an extension section connected to the functional section, and a bent pin connected to the extension section; a shell, comprising a top surface, a bottom surface, and a plurality of side surfaces connecting the top surface and the bottom surface, wherein the shell is recessed from the top surface to form a receiving groove to expose the bearing section and the two functional sections; wherein the two bent pins of the LED bracket and the driving bracket assembly The two bent pins both pass through the shell from one of the multiple side surfaces and bend to extend to the bottom surface; multiple LED chips are located in the accommodating groove and are fixed and electrically connected to the supporting section; a driver chip is located in the accommodating groove, the driver chip is fixed to one of the two functional sections and is electrically connected to the other functional section by bonding wires; wherein, each of the multiple LED chips is electrically connected to the driver chip by bonding wires so that they can be driven by the driver chip to emit light; a light-transmitting package is filled in the accommodating groove so that the multiple LED chips and the driver chip are buried in the light-transmitting package.

[0006] Preferably, in each of the side brackets, the functional section is connected to the extension section to form an L-shaped structure, and the extension section is formed with a through hole at a position corresponding to a corner of the L-shaped structure, and the through hole is filled by the shell.

[0007] Preferably, in each of the side brackets, the edge of the functional section and the edge of the extension section are jointly recessed to form a U-shaped groove, and the U-shaped groove is filled by the shell so that part of the U-shaped groove and the part of the shell filled therein are both located at the bottom of the accommodating groove.

[0008] Preferably, in each of the side brackets, the edge of the extension section is recessed to form a plurality of notches facing different directions, and the plurality of notches are filled by the shell.

[0009] Preferably, the LED bracket is recessed to form an inner notch at the inner side of the junction between the bearing section and each of the bent legs, and each of the inner notches is filled by the housing.

[0010] Preferably, a plurality of flow-blocking grooves are formed on the surface of the LED bracket exposed in the accommodating groove, and each of the LED chips is located between two adjacent flow-blocking grooves among the plurality of flow-blocking grooves.

[0011] Preferably, the accommodating groove is in the shape of an elongated strip and defines a length direction, the shell defines a width direction and a height direction that are orthogonal to the length direction and orthogonal to each other, and the ratio of a maximum width of the light-emitting diode packaging structure in the width direction to a maximum height in the height direction is between 0.8 and 1.2.

[0012] Preferably, the housing includes a plurality of ribs, and the plurality of ribs are located on the side surface through which each bent pin passes, and each of the ribs is formed by extending from the top surface toward the bottom surface.

[0013] Preferably, the driving bracket group is provided with a conductive bracket between the LED bracket and each of the side brackets, and each of the conductive brackets includes a functional segment and a bent pin connected to the functional segment; the functional segment of each conductive bracket is exposed in the accommodating groove, and each of the bent pins of the light-emitting diode packaging structure passes through the shell from one of the multiple side surfaces and bends to extend to the bottom surface.

[0014] Preferably, the shell includes a plurality of ribs formed on its outer surface, and the bent pins of the two conductive brackets are each recessed with a relief opening at positions facing each other, and each relief opening accommodates a portion of the rib.

[0015] Preferably, the light-emitting diode package structure further comprises a Zener diode chip embedded in the light-transmitting package body, and the Zener diode chip is fixed to the functional segment of one of the two conductive supports.

[0016] Preferably, each of the bent legs includes a side view welding section and a front view welding section, the side view welding section of each bent leg is adjacent to the side surface through which it passes, and the front view welding section of each bent leg is adjacent to the bottom surface.

[0017] Preferably, the side-view welding sections of the plurality of bending legs are located on a first plane, and the front-view welding sections of the plurality of bending legs are located on a second plane perpendicular to the first plane.

[0018] Preferably, the shell is recessed on the bottom surface to form a plurality of grooves, and one end of each of the grooves is connected to the side surface through which each of the bent legs passes, and a plurality of the front-view welding sections are arranged in the plurality of the grooves.

[0019] Preferably, the bottom surface of the shell is formed into two F-shaped support ribs arranged at intervals by forming a plurality of the grooves, and the two front-view welding sections of the LED bracket are located between the two F-shaped support ribs, and the front-view welding section of each side bracket and its adjacent conductive bracket is arranged in one F-shaped support rib.

[0020] Preferably, the driving chip includes a plurality of metal pads, and the plurality of metal pads are respectively connected to the four functional segments and the plurality of LED chips via a plurality of wires.

[0021] In summary, the LED package structure disclosed in the embodiments of the present invention incorporates a driver chip capable of driving multiple LED chips, freeing the internal structure of the LED package structure from the constraints of an external driver chip. Furthermore, the bent pins of the LED package structure extend from one side surface of the housing and bend to the bottom surface of the housing, enabling the LED package structure to selectively achieve sideways or forward emission, depending on user needs.

[0022] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a three-dimensional schematic diagram of the light emitting diode packaging structure of the present invention.

[0024] Figure 2 for Figure 1 A three-dimensional diagram from another perspective.

[0025] Figure 3 for Figure 1Schematic cross-sectional view along section line III-III.

[0026] Figure 4 for Figure 1 Left side plan view.

[0027] Figure 5 for Figure 1 Schematic diagram of the top view.

[0028] Figure 6 for Figure 1 Rear plan view of .

[0029] Figure 7 It is a three-dimensional schematic diagram of the LED bracket and the driving bracket assembly of the light-emitting diode packaging structure of the present invention.

[0030] Figure 8 for Figure 7 A three-dimensional diagram from another perspective.

[0031] Figure 9 for Figure 1 Schematic diagram of the top side plan (light-transmitting packaging body omitted). DETAILED DESCRIPTION

[0032] See also Figures 1 to 9 , which is an embodiment of the present invention. It should be noted that the relevant quantities and appearances mentioned in the accompanying drawings of this embodiment are only used to specifically illustrate the implementation method of the present invention to facilitate understanding of the content of the present invention, and are not used to limit the scope of protection of the present invention.

[0033] like Figures 1 to 3 As shown, this embodiment discloses a light-emitting diode package structure 100, comprising a housing 1, an LED bracket 2 and a driver bracket assembly 3 fixed to the housing 1 and spaced apart from each other, a plurality of LED chips 4 disposed on the LED bracket 2, a driver chip 5 disposed on the driver bracket assembly 3, and a light-transmitting package 6 encapsulating the plurality of LED chips 4 and the driver chip 5. Furthermore, the light-emitting diode package structure 100 may further include a Zener diode chip 7 fixed to the driver bracket assembly 3 and embedded in the light-transmitting package 6. The following describes the structure and connection relationship of each component of the light-emitting diode package structure 100 of this embodiment.

[0034] like Figures 4 to 6As shown, the housing 1 is generally rectangular and defines a length direction L, a width direction W, and a height direction H that are orthogonal to each other. The housing 1 includes a top surface 11, a bottom surface 12, and a plurality of side surfaces 13 connecting the top surface 11 and the bottom surface 12. In this embodiment, the plurality of side surfaces 13 are described as including two wide side surfaces 13a and two narrow side surfaces 13b, but the present invention is not limited thereto.

[0035] Furthermore, the housing 1 is recessed from its top surface 11 to form a receiving groove 111 (e.g. Figure 3 ), and the receiving groove 111 is long and substantially parallel to the length direction L; that is, the length direction L can also be defined by the receiving groove 111. Figure 4 As shown, the housing 1 includes a plurality of ribs 131 located on one side surface 13 (e.g., the wide side surface 13a) and spaced apart. Each rib 131 is elongated and extends from the top surface 11 toward the bottom surface 12 of the housing 1. In this embodiment, the ribs 131 are spaced apart from the bottom surface 12 of the housing 1. The width of each rib 131 in the longitudinal direction L preferably increases from the top surface 11 toward the bottom surface 12 of the housing 1.

[0036] Furthermore, if Figure 5 As shown, the shell 1 is recessed on its bottom surface 12 to form a plurality of grooves 121, and one end of each groove 121 is connected to the side surface 13 formed with the above-mentioned rib 131; that is, the plurality of grooves 121 are arranged in a row roughly along the length direction L in this embodiment, and the two grooves 121 located on the outside are further connected to the two narrow side surfaces 13b respectively.

[0037] In this embodiment, if Figure 4 and Figure 5 As shown, the bottom surface 12 of the housing 1 forms two spaced-apart F-shaped support ribs 122 by forming the plurality of grooves 121. In other words, the groove 121 located between the two F-shaped support ribs 122 is connected to the two wide side surfaces 13a of the housing 1, but the present invention is not limited to this. The adjacent portions of the two F-shaped support ribs 122 correspond to the outer two convex ribs 131 of the plurality of convex ribs 131 along the height direction H.

[0038] like Figure 7 and Figure 8As shown, the LED bracket 2 in this embodiment is an integrally formed single-piece structure and includes a supporting section 21 and two bent pins 22 connected to the supporting section 21. The supporting section 21 is elongated and parallel to the length direction L, and the two bent pins 22 are connected to the supporting section 21 at intervals so that the two bent pins 22 have the same polarity.

[0039] Further, if Figure 7 and Figure 9 As shown, the supporting section 21 is embedded in the housing 1, and at least a portion of the surface of the supporting section 21 is exposed in the receiving groove 111. The surface of the supporting section 21 of the LED bracket 2 exposed in the receiving groove 111 corresponds to the bottom of the receiving groove 111 and is recessed to form a plurality of flow-blocking grooves 211. In this embodiment, the plurality of flow-blocking grooves 211 are substantially the same length and parallel to the width direction W, but the present invention is not limited thereto.

[0040] Furthermore, the LED bracket 2 has an inner notch 212 formed on the inner side where the supporting section 21 meets each of its bent legs 22, and each inner notch 212 is filled by the housing 1. In this embodiment, the LED bracket 2 has an outer notch 213 formed on the outer side where the supporting section 21 meets each of its bent legs 22, and each outer notch 213 is filled by the housing 1. Thus, the formation of the inner notch 212 and outer notch 213 effectively enhances the bonding between the LED bracket 2 and the housing 1, and effectively reduces the intrusion of moisture into the LED package structure 100 through the housing 1.

[0041] like Figure 1 、 Figure 4 ,and Figure 5 As shown, the two bent legs 22 of the LED bracket 2 extend from one of the side surfaces 13 (e.g., the wide side surface 13a formed with the ribs 131) through the housing 1 and bend to extend to the bottom surface 12 of the housing 1. In this embodiment, each bent leg 22 of the LED bracket 2 is generally L-shaped and includes a side welding section 221 and a front welding section 222. The side welding section 221 of each bent leg 22 of the LED bracket 2 is adjacent to the side surface 13 through which it extends, while the front welding section 222 of each bent leg 22 of the LED bracket 2 is adjacent to the bottom surface 12 of the housing 1.

[0042] More specifically, one rib 131 is disposed between the two side-view welding sections 221 of the LED bracket 2, and two other ribs 131 are disposed on the outside of each of the two side-view welding sections 221 of the LED bracket 2. Furthermore, because the groove 121 between the two F-shaped support ribs 122 connects to the side surface 13 through which the bent legs 22 of the LED bracket 2 protrude, the two front-view welding sections 222 of the LED bracket 2 are disposed within the groove 121 between the two F-shaped support ribs 122.

[0043] like Figure 7 and Figure 9 As shown, the driver bracket assembly 3 includes two side brackets 31 and two conductive brackets 32. The two side brackets 31 are located outside the LED bracket 2, and a conductive bracket 32 is located between the LED bracket 2 and each side bracket 31. Each side bracket 31 includes a functional segment 311, an extension segment 312 connected to the functional segment 311, and a bent pin 313 connected to the extension segment 312.

[0044] It should be noted that the extension section 312 and the bent pin 313 of any side bracket 31 in this embodiment are roughly mirror-symmetrical to the extension section 312 and the bent pin 313 of the other side bracket 31, and the functional sections 311 of the two side brackets 31 have slightly different structures (the functional section 311 of one side bracket 31 is longer for the driver chip 5 to be set thereon; and the functional section 311 of the other side bracket 31 is shorter for the driver chip 5 to be wired and connected).

[0045] Specifically, the extension sections 312 of the two side supports 31 are completely embedded in the housing 1 and are respectively adjacent to the two narrow side surfaces 13b of the housing 1. To ensure that the side supports 31 are tightly coupled to the housing 1 to strengthen the bonding strength and effectively reduce the intrusion of moisture into the LED package structure 100 through the housing 1, the LED package structure 100 of this embodiment preferably includes the following features in each side support 31:

[0046] The functional section 311 and the extension section 312 of the side bracket 31 are connected to form an L-shaped structure, and the extension section 312 is formed with a through hole 3121 at a position corresponding to the corner of the L-shaped structure, and the through hole 3121 is filled by the shell 1; the edge of the functional section 311 and the edge of the extension section 312 are jointly recessed to form a U-shaped groove 3122, and the U-shaped groove 3122 is filled by the above-mentioned shell 1, so that part of the U-shaped groove 3122 and the part of the shell 1 filled therein are both located at the bottom of the accommodating groove 111; the edge of the extension section 312 is recessed to form a plurality of notches 3123 facing different directions, and the plurality of notches 3123 are filled by the shell 1.

[0047] The functional segments 311 of the two side brackets 31 extend from the two extension segments 312 along the longitudinal direction L and toward each other, so that the functional segments 311 of each side bracket 31 are embedded in the housing 1, and at least a portion of the surface of the functional segments 311 of each side bracket 31 is exposed in the receiving groove 111. The surface of the functional segments 311 of each side bracket 31 exposed in the receiving groove 111 corresponds to the surface located at the bottom of the receiving groove 111. The length of the functional segments 311 for accommodating the driver chip 5 is greater than 50% of the length of the bottom of the receiving groove 111. The functional segments 311 of the two side brackets 31 extend in a direction generally parallel to the supporting segment 21 of the LED bracket 2.

[0048] like Figure 1 、 Figure 4 ,and Figure 5 As shown, the bent legs 313 of the two side brackets 31 extend from one of the side surfaces 13 (e.g., the wide side surface 13a formed with the ribs 131) through the housing 1 and bend to extend to the bottom surface 12 of the housing 1. In this embodiment, the extension section 312 and the bent legs 313 of each side bracket 31 are generally U-shaped; that is, the bent legs 313 of each side bracket 31 are generally L-shaped and include a side-view welded section 3131 and a front-view welded section 3132. The side-view welded section 3131 of each side bracket 31 is adjacent to the side surface 13 through which it extends, while the front-view welded section 3132 of each side bracket 31 is adjacent to the bottom surface 12 of the housing 1.

[0049] In more detail, since the two grooves 121 surrounded by the two F-shaped support ribs 122 and separated from each other are both connected to the side surface 13 through which the bent legs 313 of the side bracket 31 pass, the front-view welding sections 3132 of the two side brackets 31 are respectively disposed in the two grooves 121 surrounded by the two F-shaped support ribs 122 and separated from each other (e.g., Figure 5 The two outermost grooves 121).

[0050] like Figure 7 and Figure 9 As shown, each conductive bracket 32 includes a functional segment 321 and a bent pin 322 connected to the functional segment 321. The functional segment 321 of each conductive bracket 32 is embedded in the shell 1, and at least part of the surface of the functional segment 321 of each conductive bracket 32 is exposed in the accommodating groove 111. The surface of the functional segment 321 of each conductive bracket 32 exposed in the accommodating groove 111 is equivalent to being set at the bottom of the accommodating groove 111, and the functional segment 321 of one of the conductive brackets 32 is recessed to form a flow blocking groove 3211. In other words, the functional segment 321 of the conductive bracket 32 is preferably divided into a wire bonding area 3212 and a solid crystal area 3213 by its flow blocking groove 3211, but the present invention is not limited thereto.

[0051] Furthermore, the functional segments 321 of the two conductive brackets 32 are arranged in a row along the length direction L with the supporting segment 21 of the LED bracket 2, and the functional segments 321 of the two conductive brackets 32 are respectively located on opposite sides of the supporting segment 21, while the functional segments 311 of the two side brackets 31 are arranged in another row.

[0052] like Figure 1 、 Figure 4 ,and Figure 5 As shown, the bent leg 322 of each conductive bracket 32 extends through one of the side surfaces 13 (e.g., the wide side surface 13a formed with the ribs 131) of the housing 1 and bends to extend to the bottom surface 12 of the housing 1. In this embodiment, each conductive bracket 32 is generally U-shaped; that is, the bent leg 322 of each conductive bracket 32 is generally L-shaped and includes a side view welding section 3221 and a front view welding section 3222. The side view welding section 3221 of each conductive bracket 32 is adjacent to the side surface 13 through which it extends, while the front view welding section 3222 of each conductive bracket 32 is adjacent to the bottom surface 12 of the housing 1.

[0053] More specifically, a bent leg 322 of the conductive bracket 32 is disposed between any bent leg 22 of the LED bracket 2 and the adjacent bent leg 313 of the side bracket 31. Furthermore, a rib 131 is disposed between the side-view welding section 3221 of each conductive bracket 32 and the adjacent bent leg 22 of the LED bracket 2. The bent legs 322 of the two conductive brackets 32 each have a recessed opening 3223 at the mutually facing locations (e.g., the inner edges of the side-view welding sections 3221), and each recess 3223 accommodates a portion of the rib 131.

[0054] Furthermore, since the two grooves 121 surrounded by the two F-shaped support ribs 122 and adjacent to each other are both connected to the side 13 through which the bent pin 322 of the conductive bracket 32 passes, the front-view welding sections 3222 of the two conductive brackets 32 are respectively arranged in the two grooves 121 surrounded by the two F-shaped support ribs 122 and adjacent to each other.

[0055] In addition, such as Figure 8 As shown, the LED bracket 2, two side brackets 31, and two conductive brackets 32 are recessed with a plurality of isolation grooves G on a surface embedded in the housing 1 and facing the bottom surface 12 thereof. In this embodiment, each isolation groove G is parallel to the longitudinal direction L and is arranged in multiple sections on the LED bracket 2, two side brackets 31, and two conductive brackets 32. The isolation grooves G are completely filled by the housing 1. Thus, the formation of the isolation grooves G strengthens the bonding strength between the LED bracket 2 and the driver bracket assembly 3 and the housing 1, effectively reducing the intrusion of moisture into the LED package structure 100 through the housing 1.

[0056] As described above, the connection relationship between the LED bracket 2 and the driver bracket assembly 3 relative to the housing 1 in this embodiment can be summarized as follows, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the LED bracket 2, the two side brackets 31, and the two conductive brackets 32 can also be partial components to implement the technical features described in this embodiment.

[0057] Specifically, if Figure 4 、 Figure 5 ,and Figure 9 As shown, the housing 1's receiving groove 111 exposes the supporting section 21 of the LED bracket 2 and each functional section 311, 321 of the driver bracket assembly 3. Each bent pin 22, 313, 322 extends from the housing 1 (approximately at the center height) of one of the multiple side surfaces 13 and bends to extend to the bottom surface 12 of the housing 1, thereby enabling the LED package structure 100 to selectively achieve sideways or forward light emission depending on user needs. The housing 1's multiple ribs 131 are located on the side surfaces 13 where each bent pin 22, 313, 322 extends.

[0058] The side-view welding section 221, 3131, 3221 of each bent leg 22, 313, 322 is adjacent to the side surface 13 through which it passes, while the front-view welding section 222, 3132, 3222 of each bent leg 22, 313, 322 is adjacent to the bottom surface 12. Furthermore, the side-view welding sections 221, 3131, 3221 of the bent legs 22, 313, 322 are located on a first plane P1 and protrude from or are flush with the rib 131; while the front-view welding sections 222, 3132, 3222 of the bent legs 22, 313, 322 are located on a second plane P2 perpendicular to the first plane P1 and protrude from or are flush with the bottom surface of the housing 1. Therefore, the LED package structure 100 is convenient for welding when viewing the welding sections 221 , 3131 , and 3221 from the side, or when viewing the welding sections 222 , 3132 , and 3222 from the front.

[0059] Furthermore, one end of each groove 121 is connected to the side surface 13 through which each bent leg 22, 313, 322 passes, and the plurality of front-view welding sections 222, 3132, 3222 are respectively disposed within the grooves 121. The two front-view welding sections 222 of the LED bracket 2 are located between two F-shaped support ribs 122, and the front-view welding sections 3132, 3222 of each side bracket 31 and its adjacent conductive bracket 32 are disposed within one of the F-shaped support ribs 122.

[0060] It should be noted that in this embodiment, the length of the side-view welded section 221, 3131, 3221 of each bent leg 22, 313, 322 is preferably equal to the length of the front-view welded section 222, 3132, 3222, but the present invention is not limited thereto. For example, in other embodiments not shown, the length of the side-view welded section 221, 3131, 3221 of each bent leg 22, 313, 322 may be 90% to 110% of the length of the front-view welded section 222, 3132, 3222.

[0061] like Figure 3 and Figure 9 As shown, the plurality of LED chips 4 are located in the receiving groove 111 of the housing 1 and are fixed and electrically connected to the supporting section 21 of the LED bracket 2. In this embodiment, each LED chip 4 is located between two adjacent blocking grooves 211 among the plurality of blocking grooves 211 (that is, any two adjacent LED chips 4 are separated by one blocking groove 211), and each LED chip 4 is electrically connected to the supporting section 21 via a wire Wa.

[0062] It should be noted that the multiple LED chips 4 of this embodiment are preferably capable of emitting the red light with a wavelength between 620nm and 630nm, the green light with a wavelength between 520nm and 535nm, and the blue light with a wavelength between 447nm and 472nm, but the present invention is not limited thereto.

[0063] like Figure 3 and Figure 9 As shown, the driver chip 5 is located within the housing 1's receiving groove 111 and secured to the functional segment 311 of one of the side brackets 31. It is also electrically connected to the functional segment 311 of the other side bracket 31 and the functional segments 321 of the two conductive brackets 32 via bonding wires. It should be noted that in this embodiment, the driver chip 5 is also electrically connected to the functional segment 311 to which it is secured via bonding wires, but the present invention is not limited to this. Furthermore, each of the multiple LED chips 4 is electrically connected to the driver chip 5 via bonding wires, enabling them to be driven by the driver chip 5 to emit light.

[0064] Specifically, the driver chip 5 includes a plurality of metal pads 51, each of which is connected to the four functional segments 311 and 321 of the driver bracket assembly 3 and the plurality of LED chips 4 via wires Wa. The four metal pads 51 corresponding to the four functional segments 311 and 321 of the driver bracket assembly 3 are preferably located at the four corners of the driver chip 5, while the remaining metal pads 51 corresponding to the plurality of LED chips 4 are located adjacent to the support segment 21 of the driver chip 5. This simplifies the wire bonding process of the light-emitting diode package structure 100 of this embodiment and effectively avoids reliability issues caused by interlaced or excessively long wires Wa.

[0065] like Figure 3 and Figure 9 As shown, the Zener diode chip 7 is fixed to the functional segment 321 of one of the two conductive brackets 32. Specifically, within the functional segment 321 formed with the flow-blocking groove 3211, the Zener diode chip 7 is fixed to the die-bonding area 3213 of the functional segment 321, while the bonding area 3212 is used for bonding the driver chip 5. Furthermore, in this embodiment, the Zener diode chip 7 is electrically connected to the supporting segment 21 of the LED bracket 2 via bonding.

[0066] like Figure 3 As shown, the light-transmitting package 6 is filled in the receiving groove 111 of the housing 1, so that the plurality of LED chips 4, the driver chip 5, and the Zener diode chip 7 are embedded in the light-transmitting package 6. In this embodiment, the receiving groove 111 of the housing 1 is filled with the light-transmitting package 6, but the present invention is not limited thereto.

[0067] In addition, such as Figure 6 As shown, the ratio of the maximum width W100 of the LED package structure 100 in the width direction W divided by the maximum height H100 in the height direction H is preferably between 0.8 and 1.2. Furthermore, the maximum length of the LED package structure 100 in the length direction L is at least twice the maximum width W100 (or maximum height H100). Accordingly, the LED package structure 100 of this embodiment can be welded and fixed with its multiple side-view welding sections 221, 3131, and 3221 to achieve sideways illumination, or welded and fixed with its multiple front-view welding sections 222, 3132, and 3222 to achieve forward illumination, depending on user needs.

[0068] [Technical Effects of the Embodiments of the Invention]

[0069] In summary, the LED package structure 100 disclosed in the embodiments of the present invention is internally configured with a driver chip 5 capable of driving multiple LED chips 4, eliminating the need for external driver chip constraints within the LED package structure 100. Furthermore, the bent pins 22, 313, and 322 of the LED package structure 100 extend from one of the side surfaces 13 of the housing 1 and bend to extend to the bottom surface 12 of the housing 1, thereby enabling the LED package structure 100 to selectively achieve sideways or forward emission, depending on user needs.

[0070] The above description is only a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. All equivalent changes and modifications made within the scope of the patent of the present invention should fall within the scope of protection of the claims of the present invention.

Claims

1. A light emitting diode packaging structure, characterized in that: The light emitting diode packaging structure comprises: An LED bracket comprising a supporting section and two bent pins connected to the supporting section; a driving bracket assembly spaced apart from the LED bracket and comprising two side brackets; wherein each side bracket comprises a functional section, an extension section connected to the functional section, and a bent pin connected to the extension section; A housing comprising a top surface, a bottom surface, and a plurality of side surfaces connecting the top surface and the bottom surface, wherein the housing is recessed from the top surface to form a receiving groove to expose the supporting section and the two functional sections; wherein the two bent pins of the LED bracket and the two bent pins of the driving bracket assembly pass through the housing from one of the plurality of side surfaces and bend to extend to the bottom surface; A plurality of LED chips are located in the receiving groove and are fixed and electrically connected to the supporting section; a driver chip located in the receiving groove, the driver chip being fixed to one of the two functional segments and electrically connected to the other functional segment by wire bonding; wherein each of the plurality of LED chips is electrically connected to the driver chip by wire bonding so as to be driven by the driver chip to emit light; and A light-transmitting package is filled in the receiving groove so that the plurality of LED chips and the driving chip are embedded in the light-transmitting package.

2. The light emitting diode package structure according to claim 1, wherein: In each of the side brackets, the functional section is connected to the extension section to form an L-shaped structure, and the extension section is formed with a through hole at a position corresponding to a corner of the L-shaped structure, and the through hole is filled by the shell.

3. The light emitting diode package structure according to claim 1, wherein: In each of the side brackets, the edge of the functional section and the edge of the extension section are jointly recessed to form a U-shaped groove, and the U-shaped groove is filled by the shell so that part of the U-shaped groove and the part of the shell filled therein are both located at the bottom of the accommodating groove.

4. The light emitting diode package structure according to claim 1, wherein: In each of the side brackets, the edge of the extension section is recessed to form a plurality of notches facing different directions, and the plurality of notches are filled by the shell.

5. The light emitting diode package structure according to claim 1, wherein: The LED bracket is recessed to form an inner notch at the inner side of the connection between the bearing section and each of the bent legs, and each of the inner notches is filled by the shell.

6. The light emitting diode package structure according to claim 1, wherein: A plurality of flow-blocking grooves are formed on the surface of the LED bracket exposed in the accommodating groove, and each of the LED chips is located between two adjacent flow-blocking grooves among the plurality of flow-blocking grooves.

7. The light emitting diode package structure according to claim 1, wherein: The accommodating groove is in the shape of an elongated strip and defines a length direction. The shell defines a width direction and a height direction that are orthogonal to the length direction and are orthogonal to each other. The ratio of a maximum width of the light-emitting diode package structure in the width direction divided by a maximum height in the height direction is between 0.8 and 1.

2.

8. The light emitting diode package structure according to claim 1, wherein: The shell includes a plurality of ribs, and the plurality of ribs are located on the side surface through which each bent pin passes, and each rib is formed by extending from the top surface toward the bottom surface.

9. The light emitting diode package structure according to claim 1, wherein: The driving bracket group is provided with a conductive bracket between the LED bracket and each of the side brackets, and each of the conductive brackets includes a functional segment and a bent pin connected to the functional segment; the functional segment of each conductive bracket is exposed in the accommodating groove, and each of the bent pins of the light-emitting diode packaging structure passes through the shell from one of the multiple side surfaces and bends to extend to the bottom surface.

10. The light emitting diode package structure according to claim 9, wherein: The shell includes a plurality of ribs formed on its outer surface. The bent pins of the two conductive brackets are each recessed with a relief opening at positions facing each other, and each relief opening accommodates a portion of the rib.

11. The light emitting diode package structure according to claim 9, wherein: The light emitting diode package structure further includes a Zener diode chip embedded in the light-transmitting package body, and the Zener diode chip is fixed to the functional segment of one of the two conductive supports.

12. The light emitting diode package structure according to claim 9, wherein: Each of the bending legs includes a side view welding section and a front view welding section. The side view welding section of each bending leg is adjacent to the side surface from which it passes, and the front view welding section of each bending leg is adjacent to the bottom surface.

13. The light emitting diode package structure according to claim 12, wherein: The side-view welding sections of the plurality of bending legs are located on a first plane, and the front-view welding sections of the plurality of bending legs are located on a second plane perpendicular to the first plane.

14. The light emitting diode package structure according to claim 12, wherein: The shell is recessed on the bottom surface to form a plurality of grooves, and one end of each of the grooves is connected to the side surface through which each of the bent legs passes, and a plurality of front-view welding sections are disposed in the plurality of grooves.

15. The light emitting diode package structure according to claim 14, wherein: The bottom surface of the shell is formed with a plurality of grooves to form two F-shaped support ribs spaced apart, and the two front-view welding sections of the LED bracket are located between the two F-shaped support ribs, and the front-view welding section of each side bracket and its adjacent conductive bracket is arranged in one F-shaped support rib.

16. The light emitting diode package structure according to claim 9, wherein: The driving chip includes a plurality of metal pads, and the plurality of metal pads are respectively connected to the four functional segments and the plurality of LED chips through a plurality of wires.

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