A semicircular groove rapid processing device

Abstract

The invention discloses a semicircular groove rapid processing device, comprising an operating table, on which two opposite fixed bases are arranged; on opposite sides of the two fixed bases, turntables are arranged respectively; between the two turntables, a tray is arranged; the tray is fixedly connected to the two turntables respectively; a cutting device is arranged on the tray, and the cutting device comprises a receiving portion with a flat top; a groove is provided at the top center of the receiving portion, and a cylindrical cutting knife is arranged in the groove; longitudinal through holes are arranged at both ends of the groove; the two ends of the cutting knife are embedded in the through holes, and a spring is arranged between the two ends of the cutting knife and the bottom of the through hole. The characteristic of the device is that it is not necessary to fix the parts to be processed separately during operation, which is more convenient and labor-saving.

Description

Technical Field

[0001] The invention relates to the field of mechanical processing, in particular to a semicircular groove rapid processing device. Background Art

[0002] At present, the tools used for semicircular groove processing mainly include two types: semicircular groove integral tools and semicircular groove split tools.

[0003] The width of the semicircular groove integral tool is equal to the width of the semicircular groove. During processing, only radial feeding is required to complete the processing of the semicircular groove. This type of tool has a simple structure, but the tool structure is bulky and the cost is high. During processing, the cutting resistance is large, the feed speed is slow, and the circular groove is prone to vibration, resulting in unstable groove size and unsightly surface.

[0004] The width of the semicircular groove split tool is a fraction of the width of the semicircle, and multiple repeated radial feeds are required during processing. The structure of this type of tool is also simple, but multiple radial feeds are required during processing, the circular groove is prone to multiple connection marks, and the tool is prone to breakage or chipping, and the processing efficiency is slow.

[0005] In response to the above problems, my country currently has the following patents:

[0006] Patent announcement number CN207857880U provides a semicircular groove rapid processing tool, including a tool body and a cutting blade assembly installed on the cutting end of the tool body. Among them, the cutting blade assembly is composed of multiple cutting blades connected in the form of fan blades, each cutting blade is fan-shaped, including a top face and two side faces, the top face as the main cutting edge is an inclined surface obliquely facing inward, and one of the side faces is an inclined surface with an inclination of 3 to 5 degrees, which is a secondary cutting edge. Each cutting edge of the tool is similar to each positive bias tool, which is not only very beneficial for cutting large excess parts, but also the feed speed of this tool is equal to the sum of the feeds of multiple positive bias tools, the cutting feed resistance is small, and the cutting efficiency is high, which not only improves the service life of the tool, but also greatly improves the processing efficiency, and ensures that the size of the semicircular groove is stable and the processing surface is smooth.

[0007] However, the operation of this patent still requires the parts to be processed to be fixed individually in advance, which is a time-consuming and labor-intensive process. Summary of the invention

[0008] In view of the problems existing in the prior art, the purpose of the present invention is to provide a semicircular groove rapid processing device, which is characterized in that it is not necessary to fix the parts to be processed separately during operation, which is more convenient and labor-saving.

[0009] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a semicircular groove rapid processing device, including an operating table, characterized in that: two opposite fixed bases are arranged on the operating table; turntables are respectively arranged on the opposite sides of the two fixed bases; a tray is arranged between the two turntables; the tray is fixedly connected to the two turntables respectively; a cutting device is arranged on the tray, and the cutting device includes a receiving portion with a flat top; a groove is opened in the center of the top of the receiving portion, and a cylindrical cutting knife is arranged in the groove; longitudinal through holes are arranged at both ends of the groove; both ends of the cutting knife are embedded in the through holes, and a spring is arranged between the two ends of the cutting knife and the bottom of the through hole.

[0010] Preferably, protrusions are respectively provided at both ends of the receiving portion along the length direction of the groove.

[0011] Preferably, buffer layers are respectively provided on opposite sides of the two protrusions.

[0012] Preferably, the top surface of the receiving portion is provided with an anti-slip pattern.

[0013] Preferably, a positioning hole is provided on the tray; positioning pins are respectively provided on both sides of the receiving portion; and the positioning pins are inserted into the positioning hole.

[0014] Preferably, a plurality of positioning holes are evenly arranged on the tray along the length direction of the groove of the receiving portion.

[0015] Preferably, a plurality of adjusting screws are provided at the bottom of the fixed base.

[0016] The beneficial effects of the present invention are: 1) By providing a receiving part, the part to be processed can be placed on the receiving part, at which time the cutting knife sinks and the spring is compressed; after the cutting knife starts to rotate, the pressure of the part to be processed on the cutting knife is reduced, the spring relaxes, and the semicircular groove processing work starts automatically; the turntable is provided to be able to adjust the angle of the tray so that the top surface of the receiving part is horizontal. 2) The protrusion and anti-slip pattern are provided to prevent the part to be processed from shifting during operation or even sliding off the receiving part. 3) A number of positioning holes are provided on the receiving part to adjust the position of the receiving part so that the center of gravity of the whole formed by the receiving part and the part to be processed is in the middle of the tray to prevent tipping. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of this embodiment;

[0018] Figure 2 for Figure 1 Enlarged view of point A in the middle.

[0019] Figure numerals: 1. operating table; 2. fixed base; 3. turntable; 4. tray; 5. receiving part; 6. groove; 7. cutting knife; 8. through hole; 9. spring; 10. protrusion; 11. positioning hole; 12. positioning pin; 13. adjusting screw. DETAILED DESCRIPTION

[0020] The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0021] The same parts are denoted by the same reference numerals. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the drawings, and the words "bottom" and "top", "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0022] This embodiment discloses a semicircular groove rapid processing device, such as Figure 1-2 As shown, a semicircular groove rapid processing device includes an operating table 1, characterized in that: two opposite fixed bases 2 are arranged on the operating table 1; turntables 3 are arranged on the opposite sides of the two fixed bases 2; a tray 4 is arranged between the two turntables 3; the tray 4 is fixedly connected to the two turntables 3 respectively; a cutting device is arranged on the tray 4, and the cutting device includes a receiving portion 5 with a flat top; a groove 6 is opened in the center of the top of the receiving portion 5, and a cylindrical cutting knife 7 is arranged in the groove 6. A longitudinal through hole 8 is arranged at both ends of the groove 6. The two ends of the cutting knife 7 are embedded in the through hole 8, and a spring 9 is arranged between the two ends of the cutting knife 7 and the bottom of the through hole 8. The receiving portion 5 is arranged, and the part to be processed can be placed on the receiving portion 5, at which time the position of the cutting knife 7 sinks and the spring 9 is compressed. After the cutting knife 7 starts to rotate, the pressure of the part to be processed on the cutting knife 7 is reduced, the spring 9 is relaxed, and the semicircular groove processing work starts automatically. The turntable 3 is arranged to be able to adjust the angle of the tray 4 so that the top surface of the receiving portion 5 is horizontal.

[0023] The receiving portion 5 is provided with protrusions 10 at both ends along the length direction of the groove 6. Buffer layers are provided on the opposite sides of the two protrusions 10. The protrusions 10 can prevent the parts to be processed from shifting and sliding off the receiving portion 5 during operation.

[0024] The top surface of the receiving portion 5 is provided with an anti-skid pattern. The anti-skid pattern can prevent the parts to be processed from shifting during operation.

[0025] The tray 4 is provided with positioning holes 11, and positioning pins 12 are respectively provided on both sides of the receiving portion 5. The positioning pins 12 are inserted into the positioning holes 11. The tray 4 is provided with a plurality of positioning holes 11 evenly along the length direction of the groove 6 of the receiving portion 5. Since the center of gravity of the part to be processed is not necessarily in the center of the part, a plurality of positioning holes 11 are provided on the receiving portion 5, so that the position of the receiving portion 5 can be adjusted so that the center of gravity of the whole formed by the receiving portion 5 and the part to be processed is in the middle of the tray 4 to prevent tipping.

[0026] A plurality of adjusting screws 13 are provided at the bottom of the fixed base 2. The adjusting screws 13 are adjusted so that the two rotating disks 3 are at the same height.

[0027] The use of this embodiment is as follows: before operation, adjust the adjustment screw 13 on the fixed base 2 and the angle of the turntable 3 so that the top surface of the receiving portion 5 is horizontal. Determine the center of gravity of the part to be processed according to the shape of the part, select a suitable positioning hole 11 to install the receiving portion 5. Then place the surface to be processed of the part to be processed on the top surface of the receiving portion 5, rotate the cutting blade 7, and start processing.

[0028] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the invention may be modified or replaced by equivalents without departing from the scope of the technical solutions of the present invention, which should all be covered by the scope of the claims of the present invention.

Claims

1. A semicircular groove rapid processing device, comprising an operating table (1), characterized in that: The operating table (1) is provided with two opposite fixed bases (2); turntables (3) are respectively provided on opposite sides of the two fixed bases (2); a tray (4) is provided between the two turntables (3); the tray (4) is respectively fixedly connected to the two turntables (3); a cutting device is provided on the tray (4), the cutting device comprising a receiving portion (5) with a flat top; a groove (6) is provided at the center of the top of the receiving portion (5), and a cylindrical cutting blade (7) is provided in the groove (6); The groove (6) is provided with longitudinal through holes (8) at both ends; the cutting blade (7) is embedded in the through hole (8), and a spring (9) is provided between the two ends of the cutting blade (7) and the bottom of the through hole (8); the receiving portion (5) is provided with protrusions (10) at both ends along the length direction of the groove (6); the tray (4) is provided with a positioning hole (11); positioning pins (12) are provided on both sides of the receiving portion (5); and the positioning pins (12) are inserted into the positioning holes (11).

2. A semicircular groove rapid processing device according to claim 1, characterized in that: Buffer layers are respectively provided on opposite sides of the two protruding portions (10).

3. A semicircular groove rapid processing device according to claim 1, characterized in that: The top surface of the receiving portion (5) is provided with an anti-slip pattern.

4. A semicircular groove rapid processing device according to claim 1, characterized in that: A plurality of positioning holes (11) are evenly arranged on the tray (4) along the length direction of the groove (6) of the receiving portion (5).

5. A semicircular groove rapid processing device according to claim 1, characterized in that: A plurality of adjustment screws (13) are provided at the bottom of the fixed base (2).

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