An embedded packaging structure of integrated antenna and RF front end based on metal substrate

Abstract

The present invention discloses an embedded packaging structure of an integrated antenna and a radio frequency front end based on a metal substrate, comprising: a metal substrate, the metal substrate having a chip cavity, a via cavity and an antenna cavity located on the upper surface; a chip, the chip being embedded in the chip cavity with its active surface facing outward; a dielectric layer, the dielectric layer filling the via cavity and the gap between the chip and the chip cavity, and covering the lower surface of the metal substrate and the active surface of the chip; a conductive through hole, the conductive through hole penetrating the dielectric layer and being electrically connected to the chip; a wiring layer, the wiring layer being arranged below the dielectric layer and being electrically connected to the conductive through hole; a second substrate, the second substrate being arranged above the metal substrate; and an antenna, the antenna being fixedly arranged on the lower surface of the second substrate above the antenna cavity.

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