A double-color packaged LED device and its preparation process

Abstract

The present invention provides a dual-gel color packaged LED device and a preparation process, belonging to the field of LED packaging technology, and solves the problem that the existing technology cannot package blue light LED chips and white light LED chips together, and the use of spraying equipment will increase the cost. The present invention includes a PCB board, an LED chip is provided on the PCB board, and the LED chip is covered with a packaging colloid. The LED chip includes a colored LED chip and a first blue light LED chip for emitting white light. The first blue light LED chip is provided with a fluorescent colloid, and the colored LED chip is provided with a transparent colloid. By encapsulating the fluorescent colloid above the first blue light LED chip, the present invention does not need to use a spraying equipment to spray fluorescent powder to excite white light, thereby saving a lot of costs. By using transparent colloid packaging and fluorescent colloid packaging respectively, LED chips emitting other colors of light and blue light LED chips can be integrated on the same device, wherein the colored LED chip can be selected according to user needs, which has diversity.

Description

Technical Field

[0001] The present invention belongs to the technical field of LED packaging, and in particular relates to a double-glue color packaged LED device and a preparation process thereof. Background Art

[0002] Currently, there are two packaging methods for dual-color or multi-color LED devices on the market. One is transparent colloid packaging (blue, green, yellow, orange, and red), and the other is fluorescent colloid packaging (because the blue light LED chip will excite the phosphor to emit a white spectrum, the conventional mode cannot be used to package blue and white LEDs together).

[0003] Existing technology uses a spraying process to spray phosphor onto a designated blue LED chip to achieve the purpose of stimulating white light. However, the investment in spraying equipment is very large, and a large number of chemicals are required. The yield and cost are both high. In addition, when it comes to two-color or three-color LED devices with multiple color combinations, more supporting molds are required, which will increase the limitations of market selection. Summary of the Invention

[0004] The purpose of the present invention is to address the above-mentioned problems existing in the prior art and to propose an LED device and a preparation process that uses a combination of transparent colloid and fluorescent colloid for packaging.

[0005] The objectives of the present invention can be achieved through the following technical solutions: a double-glue color packaged LED device, comprising a PCB board, an LED chip is provided on the PCB board, the LED chip is covered with a packaging colloid, the LED chip includes a colored LED chip and a first blue light LED chip for emitting white light, the first blue light LED chip is provided with a fluorescent colloid, and the colored LED chip is provided with a transparent colloid.

[0006] The fluorescent colloid can both encapsulate the first blue LED chip and enable the first blue LED chip to emit white light, eliminating the need to use spraying equipment to spray fluorescent powder to stimulate white light. The transparent colloid can both encapsulate the colored LED chip and ensure that the light emitted by the colored chip is not blocked.

[0007] In the above-mentioned double-color packaged LED device, the colored LED chips include one or more of a blue LED chip, a red LED chip, and a green LED chip. The colored LED chips can be selected according to user needs and are diverse.

[0008] In the aforementioned dual-color packaged LED device, the transparent colloid is integrally packaged on a PCB. A fluorescent colloid injection area is cut and formed on the first blue LED chip, and the fluorescent colloid is disposed in the area. The fluorescent colloid is packaged by thinning the transparent colloid to create the area. The fluorescent colloid is then injected into the area to achieve packaging.

[0009] In the above-mentioned double-color packaged LED device, a second blue LED chip and a red LED chip are provided on the PCB board, the first blue LED chip is located on one side of the PCB board, the second blue LED chip and the red LED chip are located on the other side of the PCB board, and the fluorescent colloid and the transparent colloid are respectively located on both sides of the PCB board.

[0010] The second blue LED chip and the red LED chip are colored LED chips. The colored LED chips and the first blue LED chip are respectively located on both sides of the PCB board. The transparent colloid is used to encapsulate the colored LED chips, and the fluorescent colloid is used to encapsulate the first blue LED chip.

[0011] In the above-mentioned double-color packaged LED device, the PCB board is provided with a second blue LED chip, a red LED chip, a green LED chip, and a first blue LED chip, and is evenly distributed on the plane of the PCB board. The first blue LED is provided with the above-mentioned fluorescent colloid, and the second blue LED chip, red LED chip, and green LED chip are provided with a transparent colloid.

[0012] The second blue LED chip, the red LED chip and the green LED chip are colored LED chips. The colored LED chips and the first blue LED chip are respectively located on both sides of the PCB board. The transparent colloid is used to encapsulate the colored LED chips, and the fluorescent colloid is used to encapsulate the first blue LED chip.

[0013] In the above-mentioned double-color packaged LED device, fluorescent colloid flow channels are provided on both sides of the transparent colloid, and the fluorescent colloid is embedded in the fluorescent colloid flow channels during injection. The fluorescent colloid flow channels make the fluorescent colloid and the transparent colloid fit more tightly and are not easy to separate.

[0014] In the above-mentioned double-color packaged LED device, the transparent colloid is made of epoxy resin, which is easy to cure, has strong adhesion and is dimensional stable.

[0015] In the above-mentioned double-color packaged LED device, the fluorescent colloid is made of epoxy resin and fluorescent powder, which can be excited by the blue LED chip to produce white light.

[0016] The above-mentioned process for preparing a double-color packaged LED device includes the following steps:

[0017] S1. Die bonding: After pre-processing the PCB board, select the colored LED chip and the first blue light chip and bond them in fixed positions using die bonding adhesive;

[0018] S2, baking: fix each LED chip in the set position by baking;

[0019] S3, wire bonding: solder the electrodes of the colored LED chip and the first blue LED chip to the PCB board using gold wires;

[0020] S4, transparent colloid encapsulation: using a mold to press-mold the transparent colloid onto the surface of the colored LED chip and the first blue LED chip;

[0021] S5, cutting and thinning: cutting and thinning the transparent colloid on the first blue LED chip into a fluorescent glue injection molding area;

[0022] S6. Fluorescent colloid encapsulation: Plastic molding is performed in the fluorescent glue injection area through a mold, and fluorescent colloid is used for encapsulation;

[0023] S7, curing: curing the encapsulated transparent colloid and fluorescent colloid by baking;

[0024] S8. Cutting: Cut into specific sizes according to product design requirements.

[0025] After step S4, the transparent colloid needs to be baked and solidified.

[0026] Compared with the existing technology, the present invention encapsulates fluorescent colloid above the first blue light LED chip, eliminating the need to use spraying equipment to spray fluorescent powder to excite white light, thus saving a lot of costs. By using transparent colloid packaging and fluorescent colloid packaging respectively, LED chips emitting other colors of light and the blue light LED chip can be integrated on the same device, among which colored LED chips can be selected according to user needs, which is diverse. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a top view of the transparent colloid before cutting and thinning in Example 1 of the present invention;

[0028] Figure 2 This is a front cross-sectional view of the transparent colloid before cutting and thinning in Example 1 of the present invention;

[0029] Figure 3 is a top view of the transparent colloid after cutting and thinning in Example 1 of the present invention;

[0030] Figure 4is a front cross-sectional view of the transparent colloid after cutting and thinning in Example 1 of the present invention;

[0031] Figure 5 This is a top view of the transparent colloid after cutting and thinning in Example 2 of the present invention.

[0032] In the figure, 1. PCB board; 2. First blue LED chip; 3. Fluorescent colloid; 4. Second blue LED chip; 5. Red LED chip; 6. Transparent colloid; 7. Fluorescent glue injection molding area; 8. Fluorescent colloid flow channel; 9. Green LED chip. DETAILED DESCRIPTION

[0033] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solutions of the present invention, but the present invention is not limited to these embodiments.

[0034] Example 1

[0035] like Figure 1-4 As shown, the dual-color LED device includes a PCB board 1, an LED chip is provided on the PCB board 1, the LED chip is covered with a packaging colloid, the LED chip includes a colored LED chip and a first blue light LED chip 2 for emitting white light, a fluorescent colloid 3 is provided on the first blue light LED chip 2, and a transparent colloid 6 is provided on the colored LED chip.

[0036] Fluorescent colloid 3 both encapsulates the first blue LED chip 2 and enables it to emit white light, eliminating the need for spraying phosphor to stimulate white light. Transparent colloid 6 both encapsulates the colored LED chip and prevents light from the colored chip from being blocked. Transparent colloid 6 is integrally encapsulated on PCB 1. Fluorescent colloid injection area 7 is cut and defined on the first blue LED chip 2. Fluorescent colloid 3 is incorporated into this area. Fluorescent colloid injection area 7 is thinned and formed into transparent colloid 6, and encapsulation is achieved by injecting fluorescent colloid 3 into this area.

[0037] The colored LED chips include a blue LED chip and a red LED chip 5. Specifically, a second blue LED chip 4 and a red LED chip 5 are provided on a PCB board 1. The first blue LED chip 2 is located on one side of the PCB board 1, while the second blue LED chip 4 and the red LED chip 5 are located on the other side. The fluorescent colloid 3 and the transparent colloid 6 are located on either side of the PCB board 1. The second blue LED chip 4 and the red LED chip 5 are colored LED chips. The colored LED chips and the first blue LED chip 2 are located on either side of the PCB board 1. The transparent colloid 6 is used to encapsulate the colored LED chips, while the fluorescent colloid 3 is used to encapsulate the first blue LED chip 2.

[0038] Fluorescent colloid 3 flow channels are located on both sides of transparent colloid 6. Fluorescent colloid 3 is embedded within these channels during injection. These channels ensure a tighter fit between fluorescent colloid 3 and transparent colloid 6, preventing separation. Transparent colloid 6 is made of epoxy resin. Epoxy resin is easy to cure, exhibits strong adhesion, and offers dimensional stability. Fluorescent colloid 3 is made of epoxy resin supplemented with phosphor. The phosphor is excited by a blue LED chip to produce white light.

[0039] The preparation process of the dual-color LED device includes the following steps:

[0040] S1. Die bonding: After pre-processing the PCB board, select the colored LED chip and the first blue light chip and bond them in fixed positions using die bonding adhesive;

[0041] S2, baking: fix each LED chip in the set position by baking;

[0042] S3, wire bonding: welding the colored LED chip, the electrodes of the first blue LED chip (2) and the PCB board (1) together using gold wires;

[0043] S4, transparent colloid encapsulation: using a mold to press-form the transparent colloid (6) onto the surface of the colored LED chip and the first blue LED chip (2);

[0044] S5, cutting and thinning: cutting and thinning the transparent colloid (6) on the first blue LED chip (2) into a fluorescent glue injection molding area (7);

[0045] S6, fluorescent colloid encapsulation: plastic molding is performed in the fluorescent glue injection molding area (7) through a mold, and fluorescent colloid (3) is used for encapsulation;

[0046] S7, curing: curing the encapsulated transparent colloid (6) and fluorescent colloid (3) by baking;

[0047] S8. Cutting: Cut into specific sizes according to product design requirements.

[0048] 10. The process for preparing a double-color colloid packaged LED device according to claim 9, wherein after step S4, the transparent colloid needs to be baked and solidified.

[0049] Working process of Example 1 of the present invention: The second blue LED chip 4 and the red LED chip 5 are fixed to one side of the PCB board 1 by baking with a fixing glue, and the first blue LED chip 2 is fixed to the other side of the PCB board 1 by baking with a fixing glue. The electrodes of the second blue LED chip 4, the red LED chip 5 and the first blue LED chip 2 are soldered to the PCB board 1 by gold wire. The second blue LED chip 4, the red LED chip 5 and the first blue LED chip 2 are encapsulated with a transparent colloid 6 through a mold. The transparent colloid 6 that has been encapsulated for the first time is placed above the first blue LED chip 2. The PCB is cut and thinned, and a fluorescent glue injection molding area 7 is provided after the cutting and thinning. Fluorescent colloid 3 is injected into the fluorescent glue injection molding area 7, and then encapsulated again through a mold. The fluorescent colloid 3 is solidified by baking, and then cut into a suitable size. The PCB board 1 is powered on to emit light normally. The second blue light LED chip 4 and the red light LED chip 5 have transparent glue layers on their surfaces, which emit normal blue light and red light respectively. The first blue light LED chip 2 has fluorescent colloid 3 on its surface, which contains fluorescent powder. The first blue light LED chip 2 excites the fluorescent powder to emit white light. The present invention can achieve the simultaneous emission of blue light, red light and white light.

[0050] The present invention encapsulates the fluorescent colloid 3 above the first blue LED chip 2, eliminating the need to use spraying equipment to spray fluorescent powder to excite white light, thereby saving a lot of costs. By using the transparent colloid 6 and the fluorescent colloid 3 for packaging respectively, LEDs emitting light of other colors can be integrated with the first blue LED chip 2 on the same device, wherein the colored LED chips can be selected according to user needs, thus providing diversity.

[0051] Example 2

[0052] like Figure 5 As shown, the structure and principle of this embodiment are basically the same as those of Example 1. The difference is that a second blue LED chip 4, a red LED chip 5, a green LED chip 9 and a first blue LED chip 2 are provided on the PCB board 1. The second blue LED chip 4, the red LED chip 5, the green LED chip 9 and the first blue LED chip 2 are respectively evenly distributed in four quadrants with the center of the PCB board 1 as the starting point of the coordinate axis. The first blue LED chip 2 is thinned by cutting and a fluorescent colloid 3 is added to achieve white light. The RGB three colors and the white light excited by the fluorescent colloid 3 are used to form an RGBW four-color LED component.

[0053] The specific embodiments described herein are merely illustrative of the spirit of the present invention. Persons skilled in the art may make various modifications, additions, or substitutions to the described specific embodiments without departing from the spirit of the present invention or exceeding the scope of the appended claims.

Claims

1. A double-color packaged LED device, comprising a PCB board (1), on which an LED chip is arranged, characterized in that: The LED chip is covered with a packaging colloid, the LED chip comprises a colored LED chip and a first blue LED chip (2) for emitting white light, the first blue LED chip (2) is provided with a fluorescent colloid (3), and the colored LED chip is provided with a transparent colloid (6); The transparent colloid (6) is integrally packaged on the PCB board (1); the transparent colloid (6) is located on the first blue LED chip (2) and is cut to form a fluorescent glue injection molding area (7); the fluorescent glue injection molding area (7) is provided with a fluorescent colloid (3); Fluorescent colloid (3) flow channels are provided on both sides of the transparent colloid (6), and the fluorescent colloid (3) is embedded in the fluorescent colloid (3) flow channels when the colloid is injected; The transparent colloid (6) is made of epoxy resin.

2. The double-color packaged LED device according to claim 1, characterized in that: The colored LED chips include one or more of a blue LED chip, a red LED chip (5), and a green LED chip (9).

3. A double-color packaged LED device according to claim 1 or 2, characterized in that: The PCB board (1) is provided with a second blue LED chip (4) and a red LED chip (5); the first blue LED chip (2) is located on one side of the PCB board (1); the second blue LED chip (4) and the red LED chip (5) are located on the other side of the PCB board (1); and the fluorescent colloid (3) and the transparent colloid (6) are respectively located on both sides of the PCB board (1).

4. A double-color packaged LED device according to claim 1 or 2, characterized in that: The PCB board (1) is provided with a second blue LED chip (4), a red LED chip (5), a green LED chip (9), and a first blue LED chip (2), which are evenly distributed on the plane of the PCB board (1); the first blue LED chip (2) is provided with the above-mentioned fluorescent colloid (3); and the second blue LED chip (4), the red LED chip (5), and the green LED chip (9) are provided with a transparent colloid (6).

5. A double-color packaged LED device according to claim 1 or 2, characterized in that: The fluorescent colloid (3) is made of epoxy resin and fluorescent powder.

6. A process for preparing a double-color packaged LED device according to claim 1, characterized in that: The following steps are involved: S1. Die bonding: After pre-processing the PCB board, select the colored LED chip and the first blue light chip and bond them in fixed positions using die bonding adhesive; S2, baking: fix each LED chip in the set position by baking; S3, wire bonding: solder the electrodes of the colored LED chip and the first blue LED chip to the PCB board using gold wires; S4, transparent colloid encapsulation: using a mold to press-mold the transparent colloid onto the surface of the colored LED chip and the first blue LED chip; S5, cutting and thinning: cutting and thinning the transparent colloid on the first blue LED chip into a fluorescent glue injection molding area; S6, fluorescent colloid encapsulation: plastic molding is performed in the fluorescent glue injection area through a mold, and fluorescent colloid is used for encapsulation; S7, curing: curing the encapsulated transparent colloid and fluorescent colloid by baking; S8. Cutting: Cut into specific sizes according to product design requirements.

7. The process for preparing a double-color packaged LED device according to claim 6, characterized in that: After step S4, the transparent colloid needs to be baked and solidified.

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