Silicon wafer handling device and method for positioning a wafer cassette

Abstract

The present disclosure provides a wafer conveying device and a wafer box positioning method. The wafer conveying device comprises a conveying device, a wafer box and a loading / unloading port. The wafer conveying device is configured to convey the wafer box to above the loading / unloading port and place the wafer box on the loading / unloading port by the conveying device. The wafer conveying device further comprises a magnetic attraction mechanism. The magnetic attraction mechanism comprises a magnetic element and a metal sheet. The magnetic element is arranged at the loading / unloading port and forms a positioning magnetic field. The metal sheet is arranged at the bottom of the wafer box and corresponds to the position of the magnetic element. When the wafer box is positioned above the loading / unloading port, the metal sheet is positioned at the loading / unloading port under the action of the positioning magnetic field. The present disclosure can position the wafer box by the magnetic attraction mechanism or provide auxiliary positioning function in cooperation with other positioning structures, thereby improving the stability and precision of the wafer box positioned at the loading / unloading port.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor device manufacturing technology, and in particular to a silicon wafer handling device and a silicon wafer cassette positioning method. Background Technology

[0002] In semiconductor manufacturing, silicon wafers need to be transferred between different processes. To avoid contamination or damage to the silicon wafers, they are usually placed in wafer cassettes to carry them and facilitate the transfer.

[0003] In modern automated semiconductor manufacturing plants, silicon wafer cassettes are typically transferred between different loading / unloading ports using overhead hoist transfer (OHT) equipment. In some embodiments, the overhead hoist transfer mechanism includes an overhead hoist track, an overhead hoist, and a gripping device. The overhead hoist moves along the track, and the gripping device is connected to the overhead hoist. When the overhead hoist moves above a loading / unloading port, the gripping device lowers the silicon wafer cassette it has gripped to the loading / unloading port.

[0004] However, during the transfer of silicon wafer cassettes by the overhead crane, mechanical fatigue occurs in the ceiling, OHT tracks, and OHT trolley belts after prolonged operation, causing a deviation between the original position of the trolley lowering the wafer cassette and the current position, exacerbating the aforementioned problem. The solution is to reposition each loading / unloading port of the equipment every period of time (approximately every six months). However, repositioning each loading / unloading port requires stopping the OHT operation for about 5 to 10 minutes, which has a significant impact on production line operation and capacity.

[0005] Therefore, how to effectively improve the alignment stability and accuracy between the silicon wafer cassette and the loading / unloading port to increase semiconductor production capacity is an urgent problem to be solved in the semiconductor manufacturing field. Summary of the Invention

[0006] A primary objective of this disclosure is to overcome at least one of the deficiencies of the prior art described above, and to provide a silicon wafer handling device with better alignment stability and alignment accuracy.

[0007] Another primary objective of this disclosure is to overcome at least one of the deficiencies of the prior art described above and to provide a silicon wafer cassette positioning method.

[0008] To achieve the above objectives, the present disclosure adopts the following technical solution:

[0009] According to one aspect of this disclosure, a silicon wafer handling device is provided, including a conveying device, a silicon wafer cassette, and a loading / unloading port. The silicon wafer handling device is configured to convey the silicon wafer cassette above the loading / unloading port via the conveying device and place it on the loading / unloading port. The silicon wafer handling device further includes a magnetic attraction mechanism. The magnetic attraction mechanism includes a magnetic element and a metal sheet. The magnetic element is disposed at the loading / unloading port and forms a positioning magnetic field. The metal sheet is disposed at the bottom of the silicon wafer cassette and corresponds to the position of the magnetic element. When the silicon wafer cassette is located above the loading / unloading port, the metal sheet, under the action of the positioning magnetic field, positions the silicon wafer cassette at the loading / unloading port.

[0010] According to one embodiment of this disclosure, the magnetic component is an electromagnet, and the magnetic attraction mechanism further includes a charging device electrically connected to the electromagnet. The charging device is controlled by a controller to adjustably supply power to the electromagnet to generate a positioning magnetic field.

[0011] According to one embodiment of this disclosure, the loading / unloading port is provided with multiple positioning posts, and the bottom of the silicon wafer cassette is provided with multiple positioning slots that are respectively inserted and engaged with the multiple positioning posts; wherein, the loading / unloading port is also provided with multiple sets of positioning sensors, and the multiple sets of positioning sensors are respectively arranged adjacent to the multiple positioning posts. When the silicon wafer cassette triggers any of the positioning sensors, the controller controls the charging device to supply power, causing the electromagnet to generate a positioning magnetic field, and the metal sheet, under the action of the positioning magnetic field, positions the silicon wafer cassette at the loading / unloading port.

[0012] According to one embodiment of this disclosure, the magnetic element is located at the geometric center of the geometry formed by the plurality of positioning posts on the loading and unloading port.

[0013] According to one embodiment of this disclosure, each group of positioning sensors includes at least one positioning sensor.

[0014] According to one embodiment of this disclosure, at least one of the multiple sets of positioning sensors includes a plurality of the positioning sensors, and the plurality of positioning sensors in the same set are arranged at intervals around the positioning post corresponding to them.

[0015] According to one embodiment of this disclosure, a sensor pad is provided at the bottom of the silicon wafer cassette, and the number and location of the sensor pad correspond to the number and location of the positioning sensor, respectively.

[0016] According to one embodiment of this disclosure, the controller is configured to control the charging device to supply power to the electromagnet to generate a positioning magnetic field when some of the positioning sensors are triggered while others are not triggered, and to not operate when all of the positioning sensors are triggered.

[0017] According to another aspect of this disclosure, a silicon wafer cassette positioning method is provided for positioning the silicon wafer cassette when it is conveyed to and placed above a loading / unloading port. The silicon wafer cassette positioning method includes the following steps:

[0018] A magnetic element is provided at the loading and unloading port to form a positioning magnetic field.

[0019] A metal sheet is disposed at the bottom of the silicon wafer cassette;

[0020] The silicon wafer cassette is transported above the loading / unloading port, and the metal sheet is magnetically attracted by the positioning magnetic field, thereby positioning the silicon wafer cassette at the loading / unloading port.

[0021] According to one embodiment of this disclosure, the magnetic component is an electromagnet, and the step of positioning the silicon wafer cassette is to energize the electromagnet after the silicon wafer cassette is transported above the loading and unloading port to generate a positioning magnetic field, and use the magnetic attraction of the positioning magnetic field to position the silicon wafer cassette at the loading and unloading port.

[0022] As can be seen from the above technical solutions, the advantages and positive effects of the silicon wafer handling device and silicon wafer cassette positioning method proposed in this disclosure are as follows:

[0023] The silicon wafer handling device disclosed herein includes a magnetic attraction mechanism. This mechanism comprises a magnetic component located at the loading / unloading port and a metal sheet located at the bottom of the silicon wafer cassette, corresponding to the position of the magnetic component. When the silicon wafer cassette is positioned above the loading / unloading port, the metal sheet, under the influence of the positioning magnetic field generated by the magnetic component, positions the silicon wafer cassette at the loading / unloading port. Through this design, the present disclosure can utilize the magnetic attraction mechanism to position the silicon wafer cassette, or, in conjunction with other positioning structures, provide auxiliary positioning functionality, thereby improving the stability and accuracy of the silicon wafer cassette's positioning at the loading / unloading port. Attached Figure Description

[0024] The various objectives, features, and advantages of this disclosure will become more apparent from the following detailed description of preferred embodiments of the disclosure taken in conjunction with the accompanying drawings. The drawings are merely illustrative illustrations of the disclosure and are not necessarily drawn to scale. In the drawings, the same reference numerals always denote the same or similar parts. Wherein:

[0025] Figure 1 This is a schematic diagram of a silicon wafer handling apparatus according to an exemplary embodiment;

[0026] Figure 2 yes Figure 1 A bottom view of the silicon wafer cassette of the silicon wafer handling device shown;

[0027] Figure 3 yes Figure 1A top view of the loading and unloading port of the silicon wafer handling device;

[0028] Figure 4 yes Figure 1 A perspective schematic diagram showing the silicon wafer cassette and loading / unloading port of the silicon wafer handling device;

[0029] Figure 5 yes Figure 1 The diagram shows the silicon wafer cassette and loading / unloading port in operation of the silicon wafer handling device.

[0030] Figure 6 yes Figure 1 The diagram shows the silicon wafer cassette and loading / unloading port in another working state of the silicon wafer handling device.

[0031] The annotations in the attached figures are explained as follows:

[0032] 100. Silicon wafer cassette;

[0033] 110. Metal sheet;

[0034] 120. Positioning groove;

[0035] 130. Sensor pad;

[0036] 200. Loading / unloading port;

[0037] 210. Magnetic components;

[0038] 220. Electromagnet;

[0039] 230. Positioning post;

[0040] 231. Region of increased friction;

[0041] 240. Positioning sensor;

[0042] 241. Sensing light;

[0043] 300. Conveying device;

[0044] H. Elevation difference. Detailed Implementation

[0045] Typical embodiments embodying the features and advantages of this disclosure will be described in detail in the following description. It should be understood that this disclosure can have various variations in different embodiments without departing from the scope of this disclosure, and the descriptions and drawings therein are illustrative in nature and not intended to limit this disclosure.

[0046] In the following description of various exemplary embodiments of this disclosure, reference is made to the accompanying drawings, which form part of this disclosure, and which illustrate by way of example different exemplary structures, systems, and steps that can implement various aspects of this disclosure. It should be understood that other specific embodiments of the components, structures, exemplary devices, systems, and steps may be used, and structural and functional modifications may be made without departing from the scope of this disclosure. Furthermore, while the terms “above,” “between,” “within,” etc., may be used in this specification to describe different exemplary features and elements of this disclosure, these terms are used herein only for convenience, such as the orientation according to the examples described in the accompanying drawings. Nothing in this specification should be construed as requiring a specific three-dimensional orientation of the structure to fall within the scope of this disclosure.

[0047] Implementation of Silicon Wafer Handling Device

[0048] See Figure 1 The illustration shows a schematic diagram of the silicon wafer handling apparatus proposed in this disclosure. In this exemplary embodiment, the silicon wafer handling apparatus proposed in this disclosure is described as an example of a handling device applied to handling silicon wafer cassettes. It will be readily understood by those skilled in the art that various modifications, additions, substitutions, deletions, or other changes may be made to the specific embodiments described below in order to apply the relevant designs of this disclosure to other types of semiconductor handling equipment or other semiconductor fabrication processes, and these changes are still within the scope of the principles of the silicon wafer handling apparatus proposed in this disclosure.

[0049] like Figure 1 As shown, in this embodiment, the silicon wafer handling device proposed in this disclosure mainly includes a conveying device 300, a silicon wafer cassette 100, a loading / unloading port 200, and a magnetic suction mechanism. The silicon wafer handling device is used to convey the silicon wafer cassette 100 to above the loading / unloading port 200 and place the silicon wafer cassette 100 on the loading / unloading port 200. (See also...) Figures 2 to 6 , Figure 2 The image shows a bottom view of a silicon wafer cassette 100, which embodies the principles of this disclosure, representing the silicon wafer handling apparatus. Figure 3 The image shows a top view of the loading / unloading port 200 of a silicon wafer handling device that embodies the principles of this disclosure. Figure 4 The image shows a perspective view of the silicon wafer cassette 100 and loading / unloading port 200 of the silicon wafer handling device that embodies the principles of this disclosure. Figure 5 The diagram shows a typical example of the silicon wafer cassette 100 and loading / unloading port 200 in operation of a silicon wafer handling device that embodies the principles of this disclosure. Figure 6The diagram illustrates, in a representative manner, the silicon wafer cassette 100 and loading / unloading port 200 engaging in another operating state of the silicon wafer handling device embodying the principles of this disclosure. The structure, connection method, and functional relationship of the main components of the silicon wafer handling device proposed in this disclosure will be described in detail below with reference to the aforementioned drawings.

[0050] like Figures 1 to 4 As shown, in this embodiment, the magnetic attraction mechanism mainly includes a magnetic component 210 and a metal sheet 110. Specifically, the magnetic component 210 is disposed at the loading / unloading port 200 and can form a positioning magnetic field. The metal sheet 110 is disposed at the bottom of the silicon wafer cassette 100, and the positions of the metal sheet 110 and the magnetic component 210 correspond. The corresponding positional relationship between the metal sheet 110 and the magnetic component 210 can be understood as follows: when the conveying device 300 conveys the silicon wafer cassette 100 above or below the loading / unloading port 200, the metal sheet 110, under the magnetic attraction of the positioning magnetic field, positions the silicon wafer cassette 100 at the loading / unloading port 200. Through the above design, this disclosure can utilize the magnetic attraction mechanism to position the silicon wafer cassette 100, or, in conjunction with other positioning structures, provide auxiliary positioning functions, thereby improving the stability and accuracy of the silicon wafer cassette 100's positioning at the loading / unloading port 200.

[0051] It should be noted that, in this embodiment, a metal sheet 110 is placed at the bottom of the wafer cassette 100 as a carrier for applying the positioning magnetic field formed by the magnetic component 210 to the wafer cassette 100. This design allows the wafer cassette 100 to achieve a more accurate positioning effect by utilizing the magnetic attraction between the metal sheet 110 and the magnetic component 210. Of course, in other embodiments, to achieve the purpose of positioning the wafer cassette 100 to the loading / unloading port 200 using the magnetic attraction of the positioning magnetic field, the metal sheet 110 can also adopt other designs. For example, the metal sheet 110 can be placed inside the bottom plate of the wafer cassette 100. Alternatively, the entire bottom surface of the wafer cassette 100 can be designed as a metal material, so that the entire bottom surface of the wafer cassette 100 is positioned by the magnetic attraction of the positioning magnetic field of the magnetic component 210.

[0052] like Figure 5 and Figure 6 As shown, in this embodiment, the magnetic component 210 can preferably be an electromagnet 220. Correspondingly, the magnetic attraction mechanism also includes a charging device, which is electrically connected to the electromagnet 220 and is used to supply power (voltage or current) to the electromagnet 220. The charging device can be controlled by a controller to adjust the power supply to the electromagnet 220, thereby controlling whether the positioning magnetic field is formed and the magnetic field strength.

[0053] like Figures 2 to 4As shown, in this embodiment, the loading / unloading port 200 is provided with multiple positioning posts 230, and the bottom of the silicon wafer cassette 100 is provided with multiple positioning grooves 120. The number of positioning grooves 120 and the number of positioning posts 230 are the same, and their positions correspond to each other. This is used to achieve the correction and positioning of the silicon wafer cassette 100 by the insertion and cooperation of the positioning posts 230 and the positioning grooves 120 when the silicon wafer cassette 100 is placed in the loading / unloading port 200. On this basis, the loading / unloading port 200 can preferably be provided with multiple sets of positioning sensors 240. The multiple sets of positioning sensors 240 are arranged adjacent to the multiple positioning posts 230, that is, a positioning sensor 240 is provided at the position of each positioning post 230 adjacent to the loading / unloading port 200. Accordingly, when the silicon wafer cassette 100 triggers any positioning sensor 240, the controller controls the charging device to supply power, so that the electromagnet 220 generates a positioning magnetic field. Under the action of the positioning magnetic field, the metal sheet 110 positions the silicon wafer cassette 100 in the loading / unloading port 200.

[0054] Specifically, based on the above design, such as Figure 5 As shown, when the silicon wafer cassette 100 is conveyed to the loading / unloading port 200, the top of the positioning post 230 may develop an increased friction area 231 due to long-term insertion and use, causing the silicon wafer cassette 100 to be unable to be accurately placed on the loading / unloading port 200. This results in an inclination between the plane where the bottom of the silicon wafer cassette 100 is located and the plane where the loading / unloading port 200 is located, causing a height difference H between the bottoms of the different positioning slots 120 of the silicon wafer cassette 100. At this time, the bottom of the silicon wafer cassette 100 will trigger at least one of the multiple sets of positioning sensors 240. These positioning sensors 240 send sensing signals to the controller, which, based on the sensing signals, controls the charging device to supply power to the electromagnet 220, causing the electromagnet 220 to generate a positioning magnetic field. This positioning magnetic field acts on the metal sheet 110, that is, indirectly acts on the silicon wafer cassette 100, thereby accurately positioning the silicon wafer cassette 100 on the loading / unloading port 200 (e.g., Figure 6 (As shown).

[0055] Furthermore, such as Figure 5 and Figure 6 As shown, in this embodiment, the positioning sensor 240 can be designed to be mounted in a mounting slot. Specifically, the mounting slot is formed in the loading / unloading port 200, and the positioning sensor 240 can include a contact that is supported by an elastic member on the bottom of the mounting slot and is partially exposed in the loading / unloading port 200 under normal conditions. The wall of the mounting slot is provided with optical devices for sensing, which can emit and receive sensing light 241. Accordingly, when the contact is pressed into the mounting slot, the sensing light 241 is cut off, thereby triggering the positioning sensor 240. In other embodiments, the positioning sensor 240 can also use other related position sensing elements, displacement sensing elements, or pressure sensing elements, and is not limited to this embodiment.

[0056] Furthermore, such as Figure 3As shown, in this embodiment, the magnetic component 210 is preferably located at the geometric center of the geometric shape formed by the plurality of positioning posts 230 on the loading / unloading port 200. Correspondingly, the metal sheet 110 is positioned opposite to the magnetic component 210, that is, the metal sheet 110 is located at the geometric center of the geometric shape formed by the plurality of positioning grooves 120 on the bottom surface of the silicon wafer cassette 100. Accordingly, the magnetic attraction force of the positioning magnetic field acting on the silicon wafer cassette 100 through the metal sheet 110 can be made more balanced and stable, further improving the positioning effect.

[0057] Furthermore, such as Figure 3 As shown, in this embodiment, the number of each group of positioning sensors 240 is at least one. That is, for each positioning post 230, the positioning sensor 240 provided around the positioning post 230 at the loading / unloading port 200 can be one or more.

[0058] Furthermore, such as Figure 3 As shown, based on the design that each group of positioning sensors 240 has at least one, in this embodiment, the multiple groups of positioning sensors 240 can preferably be designed as at least one group including multiple positioning sensors 240. Furthermore, for a group of positioning sensors 240 having multiple positioning sensors 240, the multiple positioning sensors 240 in the same group can preferably be arranged at intervals around their corresponding positioning posts 230.

[0059] Furthermore, such as Figure 2 As shown, in this embodiment, a sensor pad 130 may preferably be provided at the bottom of the silicon wafer cassette 100. The number and location of the sensor pads 130 correspond to the number and location of the positioning sensors 240, respectively, and will not be described in detail here.

[0060] Furthermore, in this embodiment, the controller can preferably adopt the following control strategy: when some positioning sensors 240 are triggered while others are not, the charging device is powered to generate a positioning magnetic field in the electromagnet 220. However, when all positioning sensors 240 are triggered, it can be considered that the silicon wafer cassette 100 has been accurately positioned and placed, and the controller does not work, or the charging device is not controlled to work.

[0061] It should be noted that the silicon wafer handling apparatus shown in the accompanying drawings and described in this specification are merely a few examples among many silicon wafer handling apparatuses capable of employing the principles of this disclosure. It should be clearly understood that the principles of this disclosure are by no means limited to any details or components of the silicon wafer handling apparatus shown in the accompanying drawings or described in this specification.

[0062] For example, in other embodiments, the magnetic element 210 may also be designed as a permanent magnet.

[0063] Implementation of Silicon Wafer Cassette Positioning Method

[0064] Based on the foregoing exemplary description of the silicon wafer handling apparatus proposed in this disclosure, an exemplary embodiment of the silicon wafer cassette positioning method proposed in this disclosure will be described below. In this exemplary embodiment, the silicon wafer cassette positioning method proposed in this disclosure is described as an example of the handling and placement process of silicon wafer cassettes in the semiconductor device manufacturing process. It will be readily understood by those skilled in the art that various modifications, additions, substitutions, deletions, or other changes may be made to the specific embodiments described below in order to apply the relevant designs of this disclosure to other types of semiconductor fabrication processes, and these changes are still within the scope of the principles of the silicon wafer cassette positioning method proposed in this disclosure.

[0065] In this embodiment, the silicon wafer cassette positioning method proposed in this disclosure can be used to position the silicon wafer cassette when it is transported to and placed above the loading / unloading port. Specifically, the silicon wafer cassette positioning method proposed in this disclosure includes the following steps:

[0066] Magnetic components are installed at the loading and unloading ports to form a positioning magnetic field.

[0067] A metal sheet is placed at the bottom of the silicon wafer cassette.

[0068] The silicon wafer cassette is transported to the top of the loading / unloading port, and the metal sheet is magnetically attracted by the positioning magnetic field to position the silicon wafer cassette at the loading / unloading port.

[0069] The magnetic component is an electromagnet. The step of positioning the silicon wafer box is to energize the electromagnet after the silicon wafer box is transported to the loading and unloading port, thereby generating a positioning magnetic field. The metal sheet is attracted by the positioning magnetic field, which positions the silicon wafer box at the loading and unloading port.

[0070] It should be noted that the silicon wafer handling apparatus shown in the accompanying drawings and described in this specification are merely a few examples among many silicon wafer handling apparatuses capable of employing the principles of this disclosure. It should be clearly understood that the principles of this disclosure are by no means limited to any details or steps of the silicon wafer handling apparatus shown in the accompanying drawings or described in this specification.

[0071] In summary, the silicon wafer handling device disclosed herein includes a magnetic attraction mechanism. This mechanism comprises a magnetic component located at the loading / unloading port and a metal sheet located at the bottom of the silicon wafer cassette, corresponding to the position of the magnetic component. When the silicon wafer cassette is positioned above the loading / unloading port, the metal sheet, under the influence of the positioning magnetic field generated by the magnetic component, positions the silicon wafer cassette at the loading / unloading port. Through this design, this disclosure enables the use of a magnetic attraction mechanism to position the silicon wafer cassette, or, in conjunction with other positioning structures, to provide auxiliary positioning functionality, thereby improving the stability and accuracy of the silicon wafer cassette's positioning at the loading / unloading port.

[0072] The foregoing has described and / or illustrated exemplary embodiments of the silicon wafer handling apparatus and silicon wafer cassette positioning method disclosed herein. However, the embodiments of this disclosure are not limited to the specific embodiments described herein; rather, components and / or steps of each embodiment may be used independently and separately from other components and / or steps described herein. Each component and / or step of one embodiment may also be used in combination with other components and / or steps of other embodiments. In describing the elements / components / etc. described and / or illustrated herein, the terms “a,” “an,” and “the above” are used to indicate the presence of one or more elements / components / etc. The terms “comprising,” “including,” and “having” are used to indicate an open-ended inclusion and mean that additional elements / components / etc. may exist in addition to those listed.

[0073] Although the silicon wafer handling apparatus and silicon wafer cassette positioning method disclosed herein have been described according to different specific embodiments, those skilled in the art will recognize that modifications may be made to the implementation of this disclosure within the spirit and scope of the claims.

Claims

1. A silicon wafer handling device, comprising a conveying device, a silicon wafer cassette, and a loading / unloading port, wherein the silicon wafer handling device is configured to convey the silicon wafer cassette above the loading / unloading port via the conveying device and place it on the loading / unloading port, characterized in that, The silicon wafer handling device further includes: Magnetic attraction mechanism, including: A magnetic component, which is an electromagnet, is disposed at the loading / unloading port and forms a positioning magnetic field. A metal sheet is disposed at the bottom of the silicon wafer box and corresponds to the position of the magnetic component; A charging device is electrically connected to the electromagnet, and the charging device is controlled by a controller to adjustably supply power to the electromagnet to generate the positioning magnetic field; When the silicon wafer cassette is located above the loading / unloading port, the metal sheet positions the silicon wafer cassette at the loading / unloading port under the action of the positioning magnetic field. The loading / unloading port is provided with multiple positioning posts, and the bottom of the silicon wafer cassette is provided with multiple positioning slots that are respectively inserted and cooperate with the multiple positioning posts. The loading / unloading port is also provided with multiple sets of positioning sensors, which are arranged adjacent to the multiple positioning posts. When the silicon wafer cassette triggers any of the positioning sensors, the controller controls the charging device to supply power so that the electromagnet generates the positioning magnetic field, and the metal sheet positions the silicon wafer cassette at the loading / unloading port under the action of the positioning magnetic field. The magnetic component is located at the geometric center of the geometric shape formed by the multiple positioning posts on the loading / unloading port.

2. The silicon wafer handling device according to claim 1, characterized in that, Each group of positioning sensors includes at least one positioning sensor.

3. The silicon wafer handling device according to claim 2, characterized in that, At least one of the multiple sets of positioning sensors includes multiple positioning sensors, and the multiple positioning sensors in the same set are arranged at intervals around the positioning post corresponding to them.

4. The silicon wafer handling device according to claim 1, characterized in that, The bottom of the silicon wafer box is provided with sensor pads, and the number and location of the sensor pads correspond to the number and location of the positioning sensors, respectively.

5. The silicon wafer handling device according to claim 3, characterized in that, The controller is configured to control the charging device to supply power to the electromagnet to generate a positioning magnetic field when some of the positioning sensors are triggered while others are not, and to not operate when all of the positioning sensors are triggered.

6. A method for positioning a silicon wafer cassette, used to position the silicon wafer cassette when it is conveyed to and placed above the loading / unloading port, characterized in that, The silicon wafer cassette positioning method includes the following steps: An electromagnet is installed at the loading and unloading port, and a charging device electrically connected to the electromagnet is provided. The charging device is controlled by a controller to adjustably supply power to the electromagnet to generate a positioning magnetic field. A metal sheet is disposed at the bottom of the silicon wafer cassette; Multiple positioning posts are provided at the loading and unloading port, and multiple positioning slots are provided at the bottom of the silicon wafer box, which are respectively inserted and cooperate with the multiple positioning posts; Multiple sets of positioning sensors are installed at the loading and unloading port, and the multiple sets of positioning sensors are arranged adjacent to multiple positioning posts respectively. The electromagnet is positioned at the geometric center of the geometric shape formed by the plurality of positioning posts on the loading and unloading port; The silicon wafer cassette is transported above the loading / unloading port. When the silicon wafer cassette triggers any of the positioning sensors, the controller controls the charging device to supply power so that the electromagnet generates the positioning magnetic field. The metal sheet is attracted by the positioning magnetic field, thereby positioning the silicon wafer cassette at the loading / unloading port.

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