A DC power consumption device valve module

Abstract

This invention provides a DC energy-consuming device valve module, comprising: a rectangular frame and a series sub-module disposed on one side of the rectangular frame; the sub-module includes a series electrical module; the DC energy-consuming device valve module provided by this invention has electrical connections, and its structure is easy to assemble and maintain.

Description

Technical Field

[0001] This invention relates to the field of power electronics technology, specifically to a valve module for a DC power consumption device. Background Technology

[0002] DC transmission lines can efficiently and conveniently transmit large amounts of electrical energy from energy bases to load centers. For operational DC transmission projects, the electrical energy absorbed at the receiving end is balanced with the electrical energy generated at the sending end, and the voltage and operating frequency of the sending-end grid remain constant. When the receiving-end power system experiences disturbances or faults and cannot absorb the electrical energy sent from the sending end, the voltage and frequency of the sending-end grid will be disturbed. This disturbance can be reduced by quickly adjusting the output of generators. If the power source at the sending end is a thermal power generator or a hydropower generator, the generator output can be adjusted, but the adjustment process requires a certain time delay and cannot achieve an instantaneous response, so the voltage and frequency of the grid will still be disturbed. If the power source at the sending end is a wind turbine generator, since the natural wind force is uncontrollable, the output of the wind turbine generator cannot be adjusted according to operational needs, and the voltage and frequency of the sending-end grid will be severely disturbed. In severe cases, it may cause the generator set to break down, leading to a serious grid accident.

[0003] The development of ultra-high voltage direct current (UHVDC) transmission technology has increased the transmission capacity of DC transmission to 8,000–12,000 MW. As a result, the installed capacity of traditional thermal and hydropower generators in the sending-end power grid has also increased. Rapid adjustment of generator output has become increasingly difficult, and the bundled transmission of wind, solar, hydro, and thermal power has exacerbated this difficulty. The development of flexible DC transmission technology has led to the increasing scale of wind power grid connection. The risk of wind turbine generator failure due to power mismatch between sending and receiving ends caused by grid faults at the receiving end has also increased.

[0004] Currently, DC power consumption device topologies are mainly divided into three types: 1. Centralized resistor type; 2. Distributed resistor type; 3. Hybrid resistor type. Among these, the centralized resistor type has a larger capacitor capacity, a larger valve body footprint, and higher cost; the distributed resistor type has a larger resistor in each module, also resulting in a larger valve body footprint. The hybrid resistor type, compared to the other two topologies, has lower cost and a smaller footprint. The valve module of the DC power consumption device is designed based on the hybrid resistor topology. Its topology is as follows: Figure 17 As shown, there are many components and complex electrical connections.

[0005] The five semiconductor components in the electrical submodule require significant pressing force to meet their electrical performance requirements. Traditional component pressing uses large-component pressing, which makes the connection between components within the unit difficult, posing significant challenges to module assembly and maintenance. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides a structural design for a DC energy-consuming device valve module, which is designed with three sub-units as independent entities. Installation and maintenance are carried out on a press-fit basis, which improves the ease of assembly and maintenance of the structure.

[0007] The objective of this invention is achieved through the following technical solution:

[0008] The present invention provides a DC energy consumption device valve module, comprising: a rectangular frame (1) and a series sub-module (2) disposed on one side of the rectangular frame (1);

[0009] The submodule (2) includes: an electrical module connected in series.

[0010] Preferably, the rectangular frame (1) has insulating beams (11) on both sides and metal beams (12) at both ends and in the middle.

[0011] Preferably, the insulating beam (11) of the submodule (2) and the rectangular frame (1) is connected by the submodule mounting component (3).

[0012] Preferably, adjacent sub-modules (2) are connected by sub-module connectors (4);

[0013] The submodule (2) is connected to the metal beam (12) of the rectangular frame (1) via the metal beam connector (5).

[0014] Preferably, the electrical module consists of circuit sub-units connected in series.

[0015] Preferably, the circuit sub-unit includes: a first diode (221), a second diode (222), a third diode (223), a first IGBT (231), a second IGBT (232), a first resistor (24), a second resistor (27), and a capacitor (21);

[0016] The collector of the first IGBT (231) is connected to the positive terminal of the first diode (221);

[0017] The negative terminal of the first diode (221) is connected to the emitter of the first IGBT (231) through the capacitor (21), and is connected to the collector of the second IGBT (232) through the first resistor (24);

[0018] The second diode (222) is connected in parallel across the first resistor (24);

[0019] The second resistor (27) is connected in parallel across the capacitor (21);

[0020] The emitter of the second IGBT (232) is connected to the emitter of the first IGBT (231);

[0021] The third diode (223) is connected in reverse parallel across the first IGBT (231).

[0022] Preferably, the resistor of the submodule is provided with an inlet and an outlet;

[0023] The inlets and outlets of adjacent or spaced submodule resistors are connected by water pipes (28).

[0024] Preferably, the upper side of the IGBT press-fit structure of the submodule is provided with a board (26) connected to the board fiber (19).

[0025] Preferably, the IGBT press-fit structure (23) of the submodule is a press-fit structure in the following order: IGBT press plate (234), IGBT insulation plate (235), IGBT, IGBT insulation plate (235), IGBT, IGBT insulation plate (235), IGBT disc spring (233), IGBT press plate (234).

[0026] Preferably, the diode press-fit structure (22) of the submodule is press-fitted in the following order: diode pressure plate (225), diode insulating plate (226), diode, diode insulating plate (226), diode, diode insulating plate (226), diode disc spring (224), and diode pressure plate (225).

[0027] Compared with the closest prior art, the beneficial effects of the present invention are as follows:

[0028] 1. The DC energy-consuming device valve module provided by the present invention includes: a rectangular frame and a series sub-module disposed on one side of the rectangular frame; the sub-module includes a series electrical module; the DC energy-consuming device valve module provided by the present invention has electrical connections, and its structure is easy to assemble and maintain;

[0029] 2. Each submodule has as many press-fit semiconductor devices as possible, which reduces the weight of the press-fit structure. Attached Figure Description

[0030] Figure 1 Top view of the valve module of the present invention;

[0031] Figure 2 : A structural diagram of the valve module frame of the present invention;

[0032] Figure 3 : An oblique side mounting view of the valve module of the present invention;

[0033] Figure 4 : Main view of a submodule of this invention;

[0034] Figure 5 : A view of the oblique conductive plate of the submodule of the present invention;

[0035] Figure 6 Top view of a submodule of the present invention;

[0036] Figure 7 : Oblique side view of a submodule of the present invention;

[0037] Figure 8 The topology diagram used in the sub-modules of this invention;

[0038] Figure 9 : Diagram of the IGBT press-fit structure of the present invention;

[0039] Figure 10 : A diagram of the diode press-fit structure of the present invention;

[0040] Figure 11 : A side view of the diode press-fit structure of the present invention;

[0041] Figure 12 : Diagram of the anti-parallel diode press-fit structure of the present invention;

[0042] Figure 13 : A first resistor structure diagram of the present invention;

[0043] Figure 14 : A structural diagram of the water pipe of this invention;

[0044] Figure 15 : A diagram of the fiber optic structure of the board in this invention;

[0045] Figure 16 : A structural diagram of the connector of the present invention;

[0046] Figure 17 : Current topology diagram of hybrid resistor method.

[0047] Figure label:

[0048] 1-Rectangular frame, 2-Submodule, 3-Submodule mounting component, 4-Submodule connector, 5-Metal beam connector, 11-Insulating beam, 12-Metal beam, 21-Capacitor, 22-Diode press-fit structure, 23-IGBT press-fit structure, 24-First resistor, 25-Anti-parallel diode press-fit structure, 26-Board, 27-Second resistor, 28-Water pipe, 29-Board fiber optic cable, 221-First diode, 222-Second diode, 223-Third diode, 224-Diode disc spring, 225-Diode pressure plate, 226-Diode insulating plate, 231-First IGBT, 232-Second IGBT, 233-IGBT disc spring, 234-IGBT pressure plate, 235-IGBT insulating plate. Detailed Implementation

[0049] To better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0050] Example 1

[0051] DC power consumption device valve module structure as follows Figure 1 As shown, it consists of a rectangular frame 1 and a sub-module 2, as follows: Figure 2 As shown, the rectangular frame is assembled from three metal beams 12 and four insulating beams 11, as follows: Figure 3 As shown, submodule 2 is assembled with insulating beam 11 via submodule mounting component 3. Each valve module consists of 12 submodules 2.

[0052] Submodule structure as follows Figures 4 to 7 As shown, components such as capacitor 21, diode, IGBT, resistor, board 26 and multiple conductive boards are mounted on the submodule mounting component.

[0053] The structural sub-module topology is as follows: Figure 8 As shown, the following explanations will follow this topology. It consists of two levels of electrical sub-modules. Diodes 1, 2, 3, 1', 2', and 3' are all diodes. IGBT-1 and IGBT-1' control whether the main circuit is voltage-divided. IGBT-2 and IGBT-2' control the voltage across the capacitor to maintain it within a certain range. Capacitors C and C' are components that maintain a constant voltage. Resistors R1 and R2 are connected in parallel across diode 2 and capacitor C, respectively. Resistors R1' and R2' are connected in parallel across diode 2' and capacitor C', respectively.

[0054] Taking Level 1 as an example, the connecting components between sub-module structures include n conductive plate 2-R1, m conductive plate 2-R1, a conductive plate 1-IGBT_1, b conductive plate C-IGBT_1, m conductive plate 1-C, and n conductive plate 2-IGBT_2.

[0055] Take the current flow direction of stage 1 as an example.

[0056] When IGBT_1 is on:

[0057] Stage 1 is short-circuited, and the current path is a→IGBT_1→b.

[0058] When IGBT_1 is turned off:

[0059] The IGBT_2 shutdown stage 1 charges the capacitor, and the current path is a→diode1→m→capacitorC→b;

[0060] When the capacitor voltage is greater than the required upper limit of the sustaining voltage, IGBT_2 turns on and the capacitor reduces the voltage through the discharge circuit. The current direction of the discharge circuit is m→R1→IGBT_2→b.

[0061] When the capacitor voltage is lower than the required sustaining voltage, the IGBT_2 turns off, and the capacitor is recharged.

[0062] The current flow direction is the same in stage 2 as in stage 1.

[0063] This invention transforms the press-fitting of large components into press-fitting of small components by replacing large disc springs with multiple small disc springs.

[0064] IGBT press-fit structure, such as Figure 9 As shown, the components of this structure are: IGBT_1, IGBT_2, IGBT_1', IGBT_2', IGBT pressure plate 1, IGBT pressure plate 2, IGBT insulation plate 1, IGBT insulation plate 2, IGBT insulation plate 3, 4 IGBT fastening screws, and 4 sets of IGBT disc springs. Taking stage 1 as an example, the external connection of the IGBT press-fit structure includes conductive plate a_IGBT1, conductive plate b_IGBT1_IGBT2, and conductive plate n_IGBT2. The E-stages of IGBT_1 and IGBT_2 are pressed together, with the two C-stages facing outwards. Conductive plate a_IGBT1 leads out the C-stage potential of IGBT1, conductive plate b_IGBT1_IGBT2 leads out the E-stage potential of IGBT1 and IGBT_2, and conductive plate n_IGBT2 leads out the C-stage potential of IGBT2. The IGBT press-fit structure applies pressure to IGBT plate 1 and IGBT plate 2, compresses the disc spring to reach the corresponding press-fit force, tightens the IGBT fastening screws, and then releases the press-fit force to complete the press-fit process.

[0065] Diode press-fit structure, such as Figure 10 As shown, it includes: diode 1, diode 2, diode 1', diode 2', diode pressure plate 1, diode pressure plate 2, diode insulating plate 1, diode insulating plate 2, diode insulating plate 3, 2 diode fastening screws, and 1 set of diode disc springs. Taking stage 1 as an example, the external connector of the diode press-fit structure... Figure 11 As shown, the assembly includes conductive plate a_diode 1, conductive plate m_diode 1_2, and conductive plate n_diode 2. Diodes 1 and 2 have their cathodes pressed together, with their anodes facing outwards. Conductive plate a_diode 1 leads to the anode potential of diode 1, conductive plate m_diode 1_2 leads to the cathode potentials of diode 1 and diode 2, and conductive plate n_diode 2 leads to the anode potential of diode 2. A pressing force is applied to diode plates 1 and 2. After compressing the disc spring to the appropriate pressing force, the diode fastening screws are tightened, and then the pressing force is released, completing the pressing process.

[0066] Anti-parallel diode press-fit structure 25 Figure 12As shown, diode 3 and diode 3' are two independent press-fit structures. Taking diode 3 in stage 1 as an example, the press-fit structure completes the press-fit of diode 3 and leads out conductive plate a_diode 3 and conductive plate b_diode 3. Conductive plate a_diode 3 leads out the cathode potential of diode 3, and conductive plate b_diode 3 leads out the anode potential of diode 3.

[0067] Resistors R2 and R2' are fixed on both sides of the capacitor terminals, as shown in the diagram. Figure 13 As shown, taking R2 in stage 1 as an example, the potentials across R2 and the potentials across the capacitor are fixed through conductive plates m_R2 and b_R2. Conductive plate m_R2 is connected to the positive terminal of capacitor C, and conductive plate b_R2 is connected to the negative terminal of capacitor C.

[0068] Taking stage 1 as an example, the busbar connection is as follows:

[0069] n conductive plate 2-R1, connect one end of R1 to n conductive plate _ diode 2;

[0070] m conductive plate 2-R1, connect one end of R1 to m conductive plate_diode 1_2;

[0071] a conductive plate 1-IGBT_1, connects a conductive plate_diode 1 and a conductive plate_IGBT1;

[0072] b conductive plate C-IGBT_1, connects the negative terminal of capacitor C to b conductive plate IGBT1_IGBT2;

[0073] m conductive plate 1-C, connects m conductive plate_diode 1_2 to the positive terminal of capacitor C;

[0074] n-conductive plate 2-IGBT_2 connects n-conductive plate_diode 2 and n-conductive plate_IGBT2.

[0075] The diode 3 on the a conductive plate is directly connected to the IGBT 1 on the a conductive plate.

[0076] Diode 3 on the b-conductive plate is directly connected to IGBT1 and IGBT2 on the b-conductive plate.

[0077] Valve module water circuit structure as follows Figure 14 As shown, the sub-modules are numbered AL sequentially. The resistors in the module require water cooling, and the cooling method adopts a large series scheme. The water flow path is A inlet → A outlet → C inlet → C outlet → E inlet → E outlet → G inlet → G outlet → I inlet → I outlet → K inlet → K outlet → L inlet → L outlet → J inlet → J outlet → H inlet → H outlet → F inlet → F outlet → D inlet → D outlet → B inlet → B outlet.

[0078] Valve module fiber optic structure such as Figure 15As shown, the optical fiber enters from the inlet of the module optical fiber slot. The module optical fiber slot has a notch at the optical fiber inlet of each module board. The optical fiber of the board is led out from the notch and inserted into the board.

[0079] like Figure 16 As shown, the inter-module connection row connects the potentials a and d of two structural sub-modules together, the module-to-edge beam connection row 1 connects the potential a of the first structural sub-module to the potential of the module metal beam together, and the module-to-edge beam connection row 2 connects the potential d of the last structural sub-module to the potential of the module metal beam together.

[0080] The DC power consumption device provided by this invention has simple and few electrical connection lines; the sub-module scheme ingeniously integrates multiple components into one, making it easy to install and maintain; each sub-module press-fit structure presses up as many semiconductor devices as possible, reducing the weight of the press-fit structure.

[0081] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0082] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0083] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0084] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0085] The above are merely embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention are included within the scope of the claims of the present invention pending approval.

Claims

1. A DC power consumption device valve module, characterized in that, The DC power consumption device valve module includes: a rectangular frame (1) and a series sub-module (2) located on one side of the rectangular frame (1). The submodule (2) includes: an electrical module connected in series; The electrical module consists of circuit sub-units connected in series; The circuit subunit includes: a first diode (221), a second diode (222), a third diode (223), a first IGBT (231), a second IGBT (232), a first resistor (24), a second resistor (27), and a capacitor (21). The collector of the first IGBT (231) is connected to the positive terminal of the first diode (221); The negative terminal of the first diode (221) is connected to the emitter of the first IGBT (231) through the capacitor (21), and is connected to the collector of the second IGBT (232) through the first resistor (24); The second diode (222) is connected in parallel across the first resistor (24); The second resistor (27) is connected in parallel across the capacitor (21); The emitter of the second IGBT (232) is connected to the emitter of the first IGBT (231); The third diode (223) is connected in reverse parallel across the first IGBT (231).

2. The DC energy-consuming device valve module as described in claim 1, characterized in that, The rectangular frame (1) has insulating beams (11) on both sides and metal beams (12) at both ends and in the middle.

3. The DC energy-consuming device valve module as described in claim 2, characterized in that, The insulating beam (11) of the submodule (2) and the rectangular frame (1) is connected by the submodule mounting component (3).

4. A DC power consumption device valve module as described in claim 3, characterized in that, The adjacent sub-modules (2) are connected by sub-module connectors (4); The submodule (2) is connected to the metal beam (12) of the rectangular frame (1) via a metal beam connector (5).

5. A DC power consumption device valve module as described in claim 1, characterized in that, The resistor in the submodule is equipped with an inlet and an outlet. The inlets of adjacent or spaced submodule resistors are connected to the outlets of the submodule resistors via water pipes (28).

6. The DC power consumption device valve module as described in claim 1, characterized in that, The upper side of the IGBT press-fit structure of the submodule is provided with a board (26) that is connected to the optical fiber (19) of the board.

7. A DC energy-consuming device valve module as described in claim 1, characterized in that, The IGBT press-fit structure (23) of the submodule is a press-fit structure in the following order: IGBT press plate (234), IGBT insulation plate (235), IGBT, IGBT insulation plate (235), IGBT, IGBT insulation plate (235), IGBT disc spring (233), IGBT press plate (234).

8. A DC power consumption device valve module as described in claim 1, characterized in that, The diode press-fit structure (22) of the submodule is press-fitted in the following order: diode pressure plate (225), diode insulating plate (226), diode, diode insulating plate (226), diode, diode insulating plate (226), diode disc spring (224), and diode pressure plate (225).

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