Method for manufacturing display device

Abstract

A method for manufacturing a display device is provided. The method for manufacturing a display device according to some embodiments of the present disclosure includes: preparing a display substrate, in which at least one hole region is defined when viewed in a plan view; disposing a first adhesive film on the display substrate; etching the hole region of the display substrate by irradiating first light in the form of laser; and peeling off the first adhesive film, wherein the first adhesive film transmits at least a portion of the first light.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2018-0158366, filed on Dec. 10, 2018, which is hereby incorporated by reference herein in its entirety. Technical Field

[0002] One or more aspects of example embodiments of the present disclosure relate to a method of manufacturing a display device, and more particularly, to a method of manufacturing a display device having an improved yield. Background Art

[0003] As multimedia develops, the importance of display devices is increasing. In response to this, various types of display devices such as liquid crystal display (LCD) devices and organic light emitting display (OLED) devices are being used.

[0004] The organic light emitting display device displays images using an organic light emitting element that emits light by recombining electrons and holes, and has advantages of high response speed, high brightness, and a wide viewing angle while being driven with low power consumption.

[0005] The organic light emitting display panel includes a display substrate in which an organic light emitting element is arranged and an encapsulation substrate for covering the display substrate. Summary of the invention

[0006] The present disclosure provides a display device with improved yield.

[0007] Some embodiments of the present disclosure provide a method for manufacturing a display device, the method comprising the following steps: preparing a display substrate, in which at least one hole area is defined in the display substrate when viewed in a plan view; placing a first adhesive film on the display substrate; etching the hole area of ​​the display substrate by irradiating a first light in the form of a laser; and peeling off the first adhesive film, wherein the first adhesive film transmits at least a portion of the first light.

[0008] In some embodiments, the first adhesive film may include: a base layer; and an adhesive layer disposed under the base layer, wherein the adhesive layer is disposed between the display substrate and the base layer in the step of placing the first adhesive film.

[0009] In some embodiments, in the step of etching the display substrate, a groove may be defined on an area of ​​the display substrate corresponding to the hole area due to etching the display substrate, and dust generated between the inside of the groove and the first adhesive film may adhere to the bottom surface of the first adhesive film.

[0010] In some embodiments, the method may further include irradiating second light onto an area of ​​the first adhesive film corresponding to the hole area after placing the first adhesive film on the display substrate, wherein the adhesive force of the adhesive layer increases due to the irradiation of the second light.

[0011] In some embodiments, the bonding layer may include a photoinitiator.

[0012] In some embodiments, the base layer may include polyethylene terephthalate (PET), and the wavelength of the first light may be about 310 nm or longer.

[0013] In some embodiments, the base layer may include polyimide (PI), and the wavelength of the first light may be about 475 nm or longer.

[0014] In some embodiments, the first adhesive film may have a transmittance of the first light of about 70% or more.

[0015] In some embodiments, the method may further include removing dust generated in the hole region after the step of peeling off the first adhesive film.

[0016] In some embodiments, dust may be removed by a suction unit or a blowing unit.

[0017] In some embodiments, the display substrate may include: a base substrate; a circuit layer disposed on the base substrate and having a plurality of thin film transistors; and a pixel layer disposed on the circuit layer and having a plurality of organic light emitting elements.

[0018] In some embodiments, regions of the pixel layer and the circuit layer of the display substrate corresponding to the hole region may be etched by the first photo, while the base substrate of the display substrate remains intact during the step of etching the display substrate.

[0019] In some embodiments, a region of the pixel layer of the display substrate corresponding to the hole region may be etched by the first photo, while during the step of etching the display substrate, the circuit layer and the base substrate of the display substrate remain intact.

[0020] In some embodiments, the method may further include: preparing an encapsulation substrate; combining a display substrate and an encapsulation substrate after the step of peeling off the first adhesive film; and forming a module hole in the hole region, wherein the module hole penetrates the display substrate and the encapsulation substrate.

[0021] In some embodiments, the hole area may include a central area and a peripheral area surrounding the central area, and combining the display substrate and the encapsulation substrate may include disposing a sealing member on an area of ​​the encapsulation substrate overlapping the peripheral area.

[0022] In some embodiments, the hole area may include a central area and a peripheral area surrounding the central area, and the step of forming the module hole may include etching areas of the display substrate and the encapsulation substrate corresponding to the central area by irradiating third light in the form of laser.

[0023] In some embodiments, the method may further include: before the step of forming the module hole, setting a second adhesive film on at least one of the top surface of the encapsulation substrate and the bottom surface of the display substrate; and after the step of forming the module hole, peeling off the second adhesive film, wherein the third light passes through the second adhesive film.

[0024] In some embodiments of the present disclosure, a method for manufacturing a display device includes the following steps: preparing a display substrate and a packaging substrate, at least one hole area being defined in each of the display substrate and the packaging substrate; forming a groove in the hole area of ​​the display substrate; combining the display substrate and the packaging substrate; and forming a module hole in the display substrate and the packaging substrate to penetrate the hole area, wherein the step of forming the groove in the display substrate includes: setting a first adhesive film on the display substrate to overlap with the hole area; etching the hole area of ​​the display substrate by irradiating a first light, the first light being provided in the form of a laser and at least a portion of the first light passing through the first adhesive film; and peeling off the first adhesive film. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and other aspects and features of the present disclosure will become more apparent by describing in detail example embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0026] Figure 1 is a perspective view of a display device according to some example embodiments of the present disclosure;

[0027] Figure 2 yes Figure 1 An exploded perspective view of the display device shown in ;

[0028] Figure 3 yes Figure 1 A block diagram of a display device shown in ;

[0029] Figure 4 yes Figure 2 An equivalent circuit diagram of a pixel shown in ;

[0030] Figure 5 is a flow chart of a method for manufacturing a display device according to some embodiments of the present disclosure;

[0031] Figure 6 shows a display substrate and a packaging substrate before a module hole is formed;

[0032] Figures 7 to 14 The process of the method for manufacturing a display device according to some embodiments of the present disclosure is shown;

[0033] Fig.15 shows the steps of providing an adhesive film according to some embodiments of the present disclosure; and

[0034] Figures 16 to 18 A process of forming module holes according to some embodiments of the present disclosure is shown. DETAILED DESCRIPTION

[0035] Hereinafter, example embodiments will now be described in more detail with reference to the accompanying drawings, in which the same reference numerals always indicate the same elements. However, the present disclosure may be implemented in a variety of different forms and should not be construed as being limited to the embodiments shown only herein. On the contrary, these embodiments are provided as examples so that the present disclosure will be thorough and complete, and will fully convey the aspects and features of the present invention to those skilled in the art. Therefore, processes, elements and techniques that are not necessary for a complete understanding of the aspects and features of the present invention to those with ordinary skill in the art may not be described. Unless otherwise stated, the same reference numerals always represent the same elements in the drawings and written descriptions, and therefore, their descriptions will not be repeated. In the drawings, the relative sizes of elements, layers and regions may be exaggerated for clarity.

[0036] In the following description, for the purpose of explanation, many specific details are set forth to provide a thorough understanding of the various embodiments. However, it is apparent that the various embodiments can be practiced without these specific details or with one or more equivalent arrangements. In other cases, in order to avoid unnecessarily obscuring the various embodiments, known structures and devices are shown in block diagram form.

[0037] In the drawings, the thicknesses of various layers and regions may be shown in an exaggerated manner for clarity and convenience of description thereof.

[0038] It will also be understood that when the terms "comprises," "includes," and variations thereof are used in this specification, it indicates the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0039] It will be understood that when a region or element is referred to as being “on,” “connected to,” or “coupled to” another region or element, it can be directly on, directly connected to, or directly coupled to the other region or element, or there can be intervening regions or elements in between. Conversely, when a region or element is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another region or element, there can be no intervening regions or elements in between. Furthermore, it will be understood that when a region or element is referred to as being “between” two regions or elements, it can be the only region or element between the two regions or elements, or there can also be one or more intervening regions or elements.

[0040] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. It will also be understood that, unless explicitly defined in this specification, terms (such as those defined in general dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formalized meaning.

[0041] Furthermore, when describing embodiments of the present invention, the use of "may" indicates "one or more embodiments of the present invention." As used herein, the term "using" and variations thereof may be considered synonymous with "utilizing" and variations thereof. Additionally, the term "exemplary" is intended to indicate an example or illustration.

[0042] It will be understood that, although the terms "first", "second", "third", etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, the first element, component, region, layer or part described below can be named as the second element, component, region, layer or part, without departing from the spirit and scope of the present invention.

[0043] When a certain embodiment can be implemented differently, a specific process order can be performed differently from the described order. For example, two consecutively described processes can be performed substantially simultaneously or in the reverse order of the described order.

[0044] Various embodiments are described herein with reference to cross-sectional views as schematic diagrams of embodiments and / or intermediate structures. As such, variations in the shapes of the illustrations, for example, caused by manufacturing techniques and / or tolerances, will be expected. Therefore, the embodiments disclosed herein should not be interpreted as being limited to the shapes of the specifically shown regions, but will include deviations in shape caused by, for example, manufacturing. For example, an implanted region shown as a rectangle will typically have rounded or curved features and / or a gradient of implant concentration at its edges, rather than a binary change from an implanted region to a non-implanted region. Similarly, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation occurs. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of the region of the device, and are not intended to be restrictive.

[0045] When an expression such as "at least one of..." follows a list of elements, it modifies the entire list of elements rather than just the individual elements of the list. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as any combination of only X, only Y, only Z, or two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ as examples. The same reference numerals always indicate the same element. As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0046] For ease of description, spatially relative terms such as "under", "below", "below", "above", "on", etc. may be used herein to describe the relationship of one element or feature to another (other) element or feature as shown in the drawings. It will be understood that, in addition to the orientation described in the drawings, the spatially relative terms are intended to include different orientations of the device in use or operation. For example, if the device in the drawings is turned over, the element described as "below" or "below" or "below" other elements or features will subsequently be positioned "above" the other elements or features. Therefore, the exemplary terms "below" and "below" can include both above and below orientations. The device can be positioned otherwise (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0047] In the following examples, the x-axis, y-axis, and z-axis are not limited to the three axes of the rectangular coordinate system, but can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0048] As used herein, the terms "substantially," "approximately," "substantially," and similar terms are used as terms of approximation and not as terms of degree, and are intended to account for the inherent deviations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. In addition, these terms as used herein include the stated value and mean within an acceptable range of deviations of the particular value as determined by one of ordinary skill in the art, taking into account the measurements being discussed and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "approximately" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0049] Figure 1 is a perspective view of a display device according to some example embodiments of the present disclosure, Figure 2 yes Figure 1 An exploded perspective view of the display device shown in FIG.

[0050] Reference Figure 1 and Figure 2 According to some embodiments of the present disclosure, the display device DD may be a device activated according to an electrical signal. The display device DD may include a tablet computer, a laptop computer, a general-purpose computer, a smart TV, etc.

[0051] exist Figure 1 and Figure 2 In the embodiment, the display device DD provides a display surface that displays an image IM in parallel with each of the first and second directions DR1 and DR2 crossing each other and toward a third direction DR3. The display surface on which the image IM is displayed may correspond to a front surface of the display device DD.

[0052] The display device DD according to some embodiments of the present disclosure has a substantially rectangular shape having long sides in a first direction DR1 and short sides in a second direction DR2 perpendicular to the first direction DR1. For convenience of description, the shape of the display device DD is specified as an example, but is not limited to a specific shape.

[0053] like Figure 1 and Figure 2 As shown in FIG, the display device DD includes a window WD, a display panel DP, a housing HS, and an electronic module EM. The display device DD may further include various components such as a power module, an optical member, a protective member, and a heat dissipation member.

[0054] The window WD provides the front surface of the display device DD and protects the display panel DP. By way of example, the window WD may include a glass substrate, a sapphire substrate, or a plastic film. The window WD may have a multilayer structure or a single-layer structure. By way of example, the window WD may have a laminated structure of a plurality of plastic films bonded by an adhesive, or may also have a laminated structure of a glass substrate and a plastic film bonded by an adhesive.

[0055] The front surface of the window WD may be divided into a light-transmitting area TA and a light-shielding area CA. The light-transmitting area TA is defined as an area through which an image IM is transmitted. A user views the image IM through the light-transmitting area TA.

[0056] The light-shielding area CA is adjacent to the light-transmitting area TA. The light-shielding area CA may surround (e.g., partially or completely surround) the light-transmitting area TA. The light-shielding area CA may have a predetermined color. However, the light-shielding area CA is shown only by way of example, and the light-shielding area CA may be adjacent to only one side or more sides of the light-transmitting area TA, or may be omitted.

[0057] The normal (e.g., vertical) direction of the front surface of the display device DD corresponds to the thickness direction of the display device DD. For the convenience of description, the normal direction of the front surface of the display device DD, that is, the direction along which the image IM is provided from the display device DD is defined as the upward direction, and the direction opposite to the upward direction is defined as the downward direction. In some embodiments, the upward direction and the downward direction are parallel to the third direction DR3, and the third direction DR3 is defined as a direction perpendicular to the first direction DR1 and the second direction DR2. The third direction DR3 can be a reference direction along which the front surface of the component to be described in more detail is distinguished from the rear surface of the component. However, the upward direction and the downward direction are relative concepts and can be converted to another direction.

[0058] The display panel DP is disposed below the window WD (see Figure 2 ). The display panel DP displays the image IM.

[0059] The display panel DP according to some embodiments of the present disclosure may be an organic electroluminescent display panel. In particular, the display panel DP according to some embodiments of the present disclosure may include a plurality of organic light emitting elements OLED (see Figures 7 to 14 ). However, the present disclosure is not limited to a specific type of display panel DP. For example, the display panel DP may be a liquid crystal display panel, an electrowetting display panel, a nanocrystal display panel, or a quantum dot light-emitting display panel. For the purpose of description herein, the display panel DP is described as a case of an organic electroluminescent display panel.

[0060] When viewed in a plane, the display panel DP may have a display area DA, a non-display area NDA, and a hole area HA defined in the display panel DP.

[0061] The display area DA is an area in which the image IM is displayed. In some embodiments, the display area DA may be defined at the center of the display panel DP. By way of example, when viewed in a plane or in plan view, the display area DA may overlap with the light-transmitting area TA.

[0062] The display panel DP may include a plurality of pixels PX arranged in the display area DA and emitting light to generate an image. The pixels PX may be arranged in a matrix form in the display area DA. The pixels PX display light according to an electrical signal.

[0063] The non-display area NDA is an area in which the image IM is not displayed, and may have a frame shape surrounding the display area DA. By way of example, the non-display area NDA may overlap the light shielding area CA when viewed in a plane or in a plan view.

[0064] According to some embodiments, at least one module hole MH penetrating the display panel DP in the third direction DR3 may be defined in the display panel DP. The module hole MH may be a through hole extending from the front surface to the rear surface of the display panel DP. A component disposed in the rear surface of the display panel DP and overlapping the module hole MH may be viewed from the front surface of the display panel DP through the module hole MH. Figure 2 2 and 3. Although illustrated as having a cylindrical shape having a height in the third direction DR3, the module hole MH may be provided in various shapes such as a polygonal column, an elliptical column, and a truncated cone without being limited to any one shape.

[0065] When viewed in a plane or in a plan view, the module hole MH overlaps the electronic module EM. The electronic module EM may be inserted in the module hole MH. The electronic module EM may receive an external input through the module hole MH. The electronic module EM receives a signal input through the module hole MH and provides the signal to the display panel DP. The electronic module EM may have a size that can be accommodated in the module hole MH.

[0066] The hole area HA may be defined to surround the module hole MH. When viewed in a plane or in a plan view, the hole area HA may be separated from the non-display area NDA, and the display area DA is located between the hole area HA and the non-display area NDA. By way of example, the hole area HA may be surrounded by the display area DA.

[0067] The display panel DP includes a display substrate DS and an encapsulation substrate ES. In some embodiments, each of the display substrate DS and the encapsulation substrate ES includes a glass material. The display substrate DS may be provided in the form of being bonded to the encapsulation substrate ES.

[0068] The housing HS is disposed in the rear surface of the display panel DP. The housing HS may be combined with the window WD to provide the rear surface of the display device DD. The housing HS may be combined with the window WD to define an internal space, and the display panel DP, the electronic module EM and various other electronic components or optical components are accommodated in the internal space. The housing HS may include a material having a relatively high rigidity. By way of example, the housing HS may include a plurality of frames and / or flat plates made of glass, plastic, metal, etc. The housing HS may safely protect the components of the display device DD accommodated in the internal space from external impacts.

[0069] The display panel DP may further include an input sensing unit (not shown). That is, the display panel DP may sense an external input. The input signal may include various types of input provided from the outside of the display device DD. For example, the input signal may include various types of external inputs such as a part of the user's body, light, heat, and pressure. In some embodiments, the input signal may be a touch signal.

[0070] In some embodiments where the input signal is a touch signal, the display panel DP may sense the input signal applied to the display area DA, and may not sense the input signal applied to the non-display area NDA. Alternatively, in other embodiments of the present disclosure, the display panel DP may sense the input signal applied to the non-display area NDA, and may not sense the input signal applied to the display area DA. Alternatively, the display panel DP may also sense all input signals applied to the front surface of the display panel DP including the display area DA and the non-display area NDA. The display panel DP according to some embodiments of the present disclosure may sense input signals applied to various areas depending on the internal structural design, and is not limited to any one embodiment.

[0071] The display device DD may further include an anti-reflection member (not shown) disposed between the display panel DP and the window WD. The anti-reflection member may prevent external light incident from the outside of the display device DD from being reflected by the display panel DP and viewed by the user. By way of example, the anti-reflection member may include a polarizing layer and a phase delay layer.

[0072] According to some embodiments, the module hole MH described above may be defined in the anti-reflection member described above. Therefore, the electronic module EM may penetrate both the display panel DP and the anti-reflection member.

[0073] Figure 3 yes Figure 1 A block diagram of a display device is shown in FIG.

[0074] Reference Figure 3 , the display device DD may include a power module PM, a display panel DP, a first electronic module EM1 and a second electronic module EM2. The power module PM may supply power required for all operations of the display device DD. The power module PM may include a battery module. The display panel DP may include a display unit DPU and an input sensing unit ISU.

[0075] The first electronic module EM1 and the second electronic module EM2 may include various functional modules for operating the display device DD. The first electronic module EM1 may be directly mounted on a printed circuit board (not shown) or a flexible circuit board (not shown) electrically connected to the display panel DP.

[0076] The first electronic module EM1 may include a control module CM, a wireless communication module TM, an image input module IIM, a sound input module AIM, a memory MM, and an external interface IF.

[0077] The control module CM may control all operations of the display device DD. The control module CM may be a microprocessor. By way of example, the control module CM may activate or deactivate the display panel DP. For example, based on a touch signal received from the display panel DP, the control module CM may control other modules such as the image input module IIM and the sound input module AIM.

[0078] The wireless communication module TM can use, for example, a Bluetooth or Wi-Fi channel to send / receive a radio signal to / from another terminal. The wireless communication module TM can use a general communication channel to send / receive a voice signal. The wireless communication module TM may include a transmitting unit TM1 for modulating and sending a signal to be sent and a receiving unit TM2 for demodulating a received signal.

[0079] The image input module IIM may process the image signal to convert the processed image signal into image data that may be displayed on the display panel DP. The sound input module AIM may receive an external sound signal using, for example, a microphone in a recording mode, a voice recognition mode, etc. to convert the received external sound signal into electrical voice data.

[0080] The external interface IF serves as an interface to which an external charger, a wired / wireless data port, a card slot (eg, a card slot for a memory card and a SIM / USIM card), etc. are connected.

[0081] The second electronic module EM2 may include an acoustic output module AOM, a light transmitting module LM, a light receiving module LRM, a camera module CMM, etc. The above-described components may be mounted on a printed circuit board, a flexible circuit board, etc. to be electrically connected to the display panel DP or the first electronic module EM1.

[0082] The sound output module AOM may convert sound data received from the wireless communication module TM or sound data stored in the memory MM to output the converted sound data to the outside.

[0083] The light emitting module LM can generate and output light. By way of example, the light emitting module LM can output infrared rays. The light emitting module LM may include an LED element. The light receiving module LRM can sense infrared rays. When infrared rays having a predetermined level or higher are sensed, the light receiving module LRM may be activated. The light receiving module LRM may include a CMOS sensor. After the infrared rays generated by the light emitting module LM are output, the infrared rays may be reflected by an external object (e.g., a user's finger or face), and the reflected infrared rays may be incident on the light receiving module LRM. The camera module CMM may capture external images.

[0084] Figure 2 The electronic module EM shown in the figure can receive an external input transmitted through the module hole MH, or can provide an output through the module hole MH. The electronic module EM can be any one of the modules constituting the first electronic module EM1 and the second electronic module EM2. By way of example, the electronic module EM can be a camera, a speaker, or a sensor of light or heat, etc. The electronic module EM can sense an external object received through the module hole MH, or can provide a sound signal such as voice to the outside through the module hole MH. The remaining components of the first electronic module EM1 and the second electronic module EM2 can be arranged at other locations and are not shown. The electronic module EM can also be included in some modules that are arranged in plurality among the modules constituting the first electronic module EM1 and the second electronic module EM2, without being limited to any one embodiment.

[0085] Meanwhile, the display device DD according to some embodiments of the present disclosure may further include a transparent member (not shown) disposed between the electronic module EM and the display panel DP. The transparent member may be an optically transparent film so that the external input transmitted through the module hole MH is transmitted to the electronic module EM through the transparent member. The transparent member may be attached to the rear surface of the display panel DP, or be disposed between the display panel DP and the electronic module EM without a separate adhesive layer.

[0086] According to some embodiments of the present disclosure, a separate space for the electronic module EM provided on the outer side of the non-display area NDA can be omitted by forming a module hole MH in the display panel DP. In addition, by defining the module hole MH inside the hole area HA surrounded by the display area DA, the electronic module EM can be arranged to overlap with the light-transmitting area TA without overlapping with the light-shielding area CA. Therefore, the area of ​​the light-shielding area CA can be reduced, so that a display device DD with a narrow frame can be realized. In addition, in the case where the electronic module EM is accommodated in the module hole MH, a thin display device DD can be realized.

[0087] Figure 4 yes Figure 2 The equivalent circuit diagram of a pixel is shown in FIG.

[0088] For the convenience of description, Figure 4 It is shown in Figure 2 The equivalent circuit diagram of one pixel PX among the plurality of pixels PX shown in FIG. Each of the plurality of pixels PX according to some embodiments of the present disclosure may have Figure 4 The structure of the pixel PX shown in FIG. 1 corresponds to the structure of the pixel PX shown in FIG. 1 . Figure 4 The structure shown in and can be modified and implemented.

[0089] Reference Figure 4 , the pixel PX may include a first transistor TR1, a capacitor CAP, a second transistor TR2, and an organic light emitting element OLED. The first transistor TR1 may include a control electrode connected to the first signal line GL, an input electrode connected to the second signal line DL, and an output electrode.

[0090] The first transistor TR1 may be a switching element for controlling the pixel PX to be turned on and off. The first transistor TR1 may transmit or block a data signal transmitted through the second signal line DL in response to a scan signal transmitted through the first signal line GL.

[0091] The capacitor CAP may include a first capacitor electrode connected to the first transistor TR1 and a second capacitor electrode receiving the first power supply voltage VDD. The capacitor CAP is charged with an amount of charge corresponding to a difference between a voltage corresponding to a data signal received from the first transistor TR1 and the first power supply voltage VDD.

[0092] The second transistor TR2 may include a control electrode connected to the output electrode of the first transistor TR1 and the first capacitor electrode of the capacitor CAP, an input electrode receiving the first power supply voltage VDD, and an output electrode. The output electrode of the second transistor TR2 may be connected to the first electrode of the organic light emitting element OLED. The second electrode of the organic light emitting element OLED may be connected to the second power supply voltage VSS. The second transistor TR2 may be a driving thin film transistor for controlling the organic light emitting element OLED.

[0093] The second transistor TR2 can control the driving current flowing in the organic light emitting element OLED in response to the amount of charge stored in the capacitor CAP. The turn-on time of the second transistor TR2 can be determined according to the amount of charge charged in the capacitor CAP. Basically, the output electrode of the second transistor TR2 can supply a voltage lower than the first power supply voltage VDD to the organic light emitting element OLED.

[0094] The organic light emitting element OLED includes a light emitting material. The organic light emitting element OLED may generate light having a color corresponding to the light emitting material. The color of the light generated by the organic light emitting element OLED may be one of red, green, blue, and white.

[0095] Figure 5 is a flowchart of a method for manufacturing a display device according to some embodiments of the present disclosure, and

[0096] Figure 6 The display substrate and the packaging substrate are shown before the module hole is formed.

[0097] Figures 7 to 14 The process of a method of manufacturing a display device according to some embodiments of the present disclosure is shown. Figures 7 to 14 Along with Figure 6 The cross-sectional view shown in FIG. 1 corresponds to the cross-sectional view taken along the line II′.

[0098] In the following, reference will be made to Figure 5 as well as Figures 6 to 14 A method of manufacturing a display device according to some embodiments of the present disclosure is described together in more detail.

[0099] First, refer to Figures 5 to 7 In step S1, a display substrate DS and an encapsulation substrate ES are prepared (see Figure 5 ). Figure 6 The module hole MH (see Figure 2) is formed before the display substrate DS and the encapsulation substrate ES are formed. The display area DA_ES and the non-display area NDA_ES may be defined in the encapsulation substrate ES, and the display area DA_DS and the non-display area NDA_DS may be defined in the display substrate DS. The display area DA_ES of the encapsulation substrate ES and the display area DA_DS of the display substrate DS may correspond to the display area DA of the display panel DP, and the non-display area NDA_ES of the encapsulation substrate ES and the non-display area NDA_DS of the display substrate DS may correspond to the non-display area NDA of the display panel DP.

[0100] The display substrate DS may include a base substrate BS, a circuit layer CRL, and a pixel layer PXL. The circuit layer CRL and the pixel layer PXL may include components of the pixel PX.

[0101] The pixel PX may be provided in the display area DA and the hole area HA. ​​The pixel PX may generate light to realize the image IM. The pixel PX may be provided in plurality to be arranged in the display area DA.

[0102] The base substrate BS may define the rear surface of the display panel DP. The base substrate BS may be an insulating substrate. By way of example, the base substrate BS may be composed of various materials such as glass and plastic.

[0103] A circuit layer CRL may be disposed on the base substrate BS. The circuit layer CRL may include a plurality of thin film transistors TR1 and TR2 (see FIG. 1 ) for driving a plurality of organic light emitting elements OLED. Figure 4 ) and multiple signal lines DL and GL (see Figure 4 ).

[0104] The display panel DP according to some embodiments of the present disclosure may further include a functional layer (not shown) disposed between the base substrate BS and the circuit layer CRL. The functional layer may be directly formed on the base substrate BS to cover the front surface of the base substrate BS.

[0105] The functional layer may include an inorganic material. The functional layer may include a barrier layer and / or a buffer layer. The functional layer may prevent oxygen or moisture from penetrating the circuit layer CRL or the pixel layer PXL through the base substrate BS, and allow the circuit layer CRL to be stably formed on the base substrate BS. The type of material of the functional layer is not specifically limited in the embodiments of the present disclosure. In some embodiments of the present disclosure, the functional layer may be omitted.

[0106] A pixel layer PXL may be disposed on the circuit layer CRL. The pixel layer PXL may include a plurality of organic light emitting elements OLED and a pixel defining layer PDL that divides the organic light emitting elements OLED. One organic light emitting element OLED of the pixel layer PXL and at least one thin film transistor of the circuit layer CRL connected to one organic light emitting element OLED may define a pixel PX.

[0107] The organic light emitting element OLED may include a first electrode EL1, a second electrode EL2 and a light emitting layer OEL. The first electrode EL1 may be a pixel electrode or an anode. The second electrode EL2 may be a common electrode or a cathode.

[0108] A pixel defining layer PDL may be disposed on the first electrode EL1. Specifically, the pixel defining layer PDL may cover a portion of the first electrode EL1 and may expose the remaining portion of the first electrode EL1. The light emitting area PXA may be defined by the pixel defining layer PDL.

[0109] The light emitting layer OEL may be disposed between the first electrode EL1 and the second electrode EL2 . Specifically, the light emitting layer OEL may be disposed in the light emitting area PXA defined by the pixel defining layer PDL.

[0110] A plurality of common layers other than the light-emitting layer OEL may be further provided between the first electrode EL1 and the second electrode EL2. In particular, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer may be sequentially stacked between the first electrode EL1 and the second electrode EL2. In addition, at least one of a hole blocking layer, a hole buffer layer, and an electron blocking layer may be further provided between the first electrode EL1 and the second electrode EL2.

[0111] Afterwards, if Figure 8 As shown in FIG. 1 , in step S2, a first adhesive film ADF1 (see FIG. 1 ) is disposed on the display substrate DS. Figure 5 ). The first adhesive film ADF1 covers the area of ​​the top surface of the display substrate DS corresponding to the hole area HA. ​​The first adhesive film ADF1 is Figure 8 In the figure, it is shown as being disposed on the entire top surface of the display substrate DS (e.g., covering the entire top surface), however, the present disclosure is not limited thereto or thereby. When viewed in a plane or in a plan view, when the area occupied by the first adhesive film ADF1 is more than the area covering the hole area HA, whether the first adhesive film ADF1 covers the display area DA and the non-display area NDA is not specifically limited in various embodiments.

[0112] The first adhesive film ADF1 may have optical transparency. In particular, the first adhesive film ADF1 may transmit at least a portion of light having a predetermined wavelength. According to some embodiments, the transmittance of the first adhesive film ADF1 to the light having the predetermined wavelength may be about 70% or more.

[0113] According to some embodiments, the first adhesive film ADF1 includes a base layer BL and an adhesive layer ADL.

[0114] The base layer BL constitutes the main body of the first adhesive film ADF1.

[0115] By way of example, the first adhesive film ADF1 may include polyethylene terephthalate (PET) or polyimide (PI), however, the material of the base layer BL is not particularly limited.

[0116] An adhesive layer ADL is disposed under the base layer BL. The adhesive layer ADL may be disposed in the form of being coated on the bottom surface of the base layer BL. When the first adhesive film ADF1 is disposed on the display substrate DS, the adhesive layer ADL may be disposed between the base layer BL and the top surface of the display substrate DS to combine the base layer BL and the display substrate DS.

[0117] Afterwards, if Fig. 9 As shown in FIG. 1 , in step S3, the first light L1 is irradiated onto the first adhesive film ADF1 and the display substrate DS to etch the hole area HA of the display substrate DS (see FIG. 1 ). Figure 5 ). The first light L1 may be irradiated onto the hole area HA. ​​The first light L1 may be provided to the first adhesive film ADF1 and the display substrate DS in the form of laser. By way of example, the first light L1 may be UV laser, femtosecond laser, picosecond laser, visible light laser, etc.

[0118] The first light L1 may pass through the first adhesive film ADF1. Therefore, the first adhesive film ADF1 is not etched by the first light L1. In some embodiments, the transmittance of the first adhesive film ADF1 to the first light L1 may be about 70% or more.

[0119] According to some embodiments, the transmittance of the first adhesive film ADF1 to the first light L1 may be different depending on the material of the first adhesive film ADF1. Therefore, the wavelength of the first light L1 may be set so that the transmittance of the first adhesive film ADF1 to the first light L1 is a predetermined value or more. By way of example, in the case where the first adhesive film ADF1 includes polyethylene terephthalate (PET), the wavelength of the first light L1 may be about 310 nm or longer, and in the case where the first adhesive film ADF1 includes polyimide (PI), the wavelength of the first light L1 may be about 475 nm or longer.

[0120] The first light L1 having passed through the first adhesive film ADF1 etches the hole area HA of the display substrate DS. A groove SPC may be formed in the etched hole area HA. ​​The groove SPC has a shape that is recessed downward from the top surface of the display substrate DS. According to some embodiments, the etching depth of the display substrate DS, that is, the depth of the groove SPC, may be set by adjusting the irradiation time of the first light L1. By way of example, in Fig. 10A In the embodiment, the pixel layer PXL and the circuit layer CRL are etched by the first light L1 in the region corresponding to the hole region HA, while the base substrate BS is not etched by the first light L1. However, the embodiments of the present disclosure are not limited thereto. In some embodiments, only the region of the pixel layer PXL corresponding to the hole region HA may be etched by the first light L1, and the circuit layer CRL and the base substrate BS may be retained.

[0121] like Fig. 10A As shown in FIG, due to the first light L1 (see Fig. 9 ) Etching the pixel layer PXL and the circuit layer CRL may generate dust PTC inside the groove SPC. The dust PTC inside the groove SPC may be attached to the bottom surface of the first adhesive film ADF1 through the adhesive layer ADL of the first adhesive film ADF1. Therefore, the first adhesive film ADF1 may perform a dust collection function.

[0122] According to some embodiments of the present disclosure, an electric field may be applied to the inside of the groove SPC so that the dust PTC dispersed inside the groove SPC may effectively move toward the first adhesive film ADF1.

[0123] like Fig. 10B As shown in , according to some embodiments of the present disclosure, the adhesive layer ADL-1 of the first adhesive film ADF1-1 may have a material different from the material in some embodiments described above. The adhesive layer ADL-1 may include a photoinitiator. Therefore, according to some embodiments, the adhesive force of the adhesive layer ADL-1 may increase due to the irradiation of light onto the adhesive layer ADL-1. That is, compared with the adhesive layer ADL described above, the adhesive layer ADL-1 (arranged immediately after the base layer BL) is disposed on the display substrate DS and may not have an adhesive force, or may have a weaker adhesive force.

[0124] In particular, after the first adhesive film ADF1-1 is disposed on the display substrate DS, the second light L2 is irradiated onto the first adhesive film ADF1-1. The kind or type of the second light L2 according to various embodiments of the present disclosure is not particularly limited. By way of example, Fig. 10BAs shown in , the second light L2 may be provided in the form of a light source unit LS including at least one diode. Alternatively, in other embodiments of the present disclosure, the second light L2 may also be provided in the form of laser and irradiated onto the first adhesive film ADF1-1 through a laser oscillator.

[0125] When the second light L2 is irradiated onto the adhesive layer ADL-1 of the first adhesive film ADF1-1, the bonding between the molecules included in the adhesive layer ADL-1 can become stronger. Since the adhesive force of the adhesive layer ADL-1 becomes stronger, the dust PTC generated inside the groove SPC during the etching process can be attached to the bottom surface of the adhesive layer ADL-1.

[0126] like Fig.11 As shown in FIG. 1 , after the etching process is finished, in step S4, the first adhesive film ADF1 (see FIG. 1 ) to which the dust PTC is attached is peeled off from the display substrate DS. Figure 5 ). Therefore, the first adhesive film ADF1 may be a release film.

[0127] Generally, in the etching process of the display substrate DS, dust PTC is generated in the area corresponding to the periphery of the etched hole area HA on the top surface of the display substrate DS or in the interior of the groove SPC. Figure 2 ) process, the dust PTC may fail. According to some embodiments of the present disclosure, however, because the first adhesive film ADF1 that is not etched by the first light L1 collects the dust PTC generated in the display substrate DS during the etching process and the first adhesive film ADF1 is peeled off after the etching process is finished, the dust PTC generated in the etching process can be effectively removed. Therefore, according to some embodiments of the present disclosure, the display panel DP (see Figure 2 )’s yield.

[0128] Afterwards, if Fig.12 As shown in FIG. 1 , in step S5, the encapsulation substrate ES is bonded to the display substrate DS (see FIG. 1 ). Figure 5 According to some embodiments, the combining of the encapsulation substrate ES and the display substrate DS in step S5 may include the steps of disposing a sealing member SM between the encapsulation substrate ES and the display substrate DS, disposing the encapsulation substrate ES on the display substrate DS, and hardening the sealing member SM by using heat or light.

[0129] The non-display areas NDA_ES and NDA_DS (see FIG. 1 ) defined in the encapsulation substrate ES and the display substrate DS, respectively. Figure 6) and in the edge region of the hole region HA and is provided with a sealing member SM. The sealing member SM may combine the display substrate DS with the encapsulation substrate ES. By way of example, the sealing member SM may be a glass frit including glass powder.

[0130] The hole area HA defined in each of the encapsulation substrate ES and the display substrate DS may include a central area HCA and a peripheral area HSA. The central area HCA may be defined at the center of the hole area HA. ​​The central area HCA may be where the module hole MH is substantially formed (see Figure 2 The peripheral area HSA may be defined as surrounding the central area HCA. The sealing member SM described above may overlap the peripheral area HSA of the hole area HA.

[0131] The display panel DP described above may be in the form of an encapsulation substrate ES and a display substrate DS combined together. The display panel DP may further include a filling layer ASL defined by a space between the encapsulation substrate ES and the display substrate DS (the encapsulation substrate ES and the display substrate DS may be separated). The filling layer ASL may include an inert gas. The filling layer ASL may prevent diffusion of foreign matter present between the display substrate DS and the encapsulation substrate ES.

[0132] Afterwards, if Fig.13 As shown in FIG. 1 , in step S6, the third light L3 is irradiated to etch the display substrate DS and the encapsulation substrate ES, thereby forming a module hole MH in the display panel DP (see FIG. 1 ). Figure 5 ). The third light L3 may be irradiated onto the central area HCA of the hole area HA. ​​Thus, the central area HCA may be etched by the third light L3. The third light L3 may be provided to the display substrate DS, the encapsulation substrate ES, and the filling layer ASL in the form of a laser. By way of example, the third light L3 may be a laser having substantially the same wavelength as the first light L1.

[0133] like Fig.14 As shown in FIG. 1 , a module hole MH may be formed in the region etched by the third light L3. The module hole MH may penetrate the display substrate DS and the encapsulation substrate ES. The module hole MH may be connected to the electronic module EM described above (see FIG. 1 ). Figure 2 ) overlap.

[0134] Despite Fig.13 and Fig.14 , a method of forming the module hole MH using a laser is illustrated in FIG. 1 , but the embodiments of the present disclosure are not particularly limited to the method of forming the module hole MH, and the module hole MH may be formed by various methods.

[0135] Fig.15 The steps of providing an adhesive film according to some embodiments of the present disclosure are shown.

[0136] For the convenience of description, we will mainly describe Fig.15 The embodiment in FIG. 1 is different from the previous embodiment. In addition, the components described above are denoted by the same reference numerals, and a repeated description of the components described above will not be given.

[0137] Reference Fig.15 , used in the method for manufacturing a display device according to some embodiments of the present disclosure

[0138] The first adhesive film ADF1-2 may not have adhesive force. Therefore, when the first adhesive film ADF1-2 is disposed on the display substrate DS, the dust PTC may not be attached to the first adhesive film ADF1-2. However, even if the first adhesive film ADF1-2 does not have adhesive force, the dust PTC generated in the etching process may be

[0139] The first adhesive film ADF1 - 2 does not move from the inside to the outside of the groove SPC.

[0140] In some embodiments, removing the dust PTC may be additionally performed after peeling off the first adhesive film ADF1-2. By way of example, the dust PTC may be removed by a suction unit, or may be moved out of the display substrate DS by an air blowing unit.

[0141] Figures 16 to 18 A process of forming module holes according to some embodiments of the present disclosure is shown.

[0142] For the convenience of description, we will mainly describe Figures 16 to 18 Differences between the embodiment of and the previous embodiment. In addition, the components described above are denoted by the same reference numerals, and repeated description of the components described above will not be given.

[0143] Reference Fig.16 , the method of manufacturing a display device according to some embodiments of the present disclosure may further include disposing a second adhesive film ADF2 on the encapsulation substrate ES before forming the module hole MH. The second adhesive film ADF2 contacts the top surface of the encapsulation substrate ES. However, the present disclosure is not limited thereto, and the second adhesive film ADF2 may be disposed on at least one of the top surface of the encapsulation substrate ES and the bottom surface of the display substrate DS.

[0144] The second adhesive film ADF2 may be constructed in the same manner as the first adhesive film ADF1 described above (see Figure 8 However, in some embodiments of the present disclosure, the material or transmission wavelength of the second adhesive film ADF2 may be different from that of the first adhesive film ADF1.

[0145] After the second adhesive film ADF2 is disposed on the encapsulation substrate ES, the third light L3 is irradiated onto the second adhesive film ADF2 and the display panel DS, the encapsulation substrate ES, and the filling layer ASL. The third light L3 may pass through the second adhesive film ADF2. Therefore, the second adhesive film ADF2 is not etched by the third light L3. In some embodiments, the transmittance of the second adhesive film ADF2 to the third light L3 may be about 70% or more.

[0146] like Fig.17 As shown in FIG. , after passing through the third light L3 (see Fig.16 ) In the process of forming the module hole MH, dust PTC may be generated inside the module hole MH. The dust PTC may be attached to the bottom surface of the second adhesive film ADF2.

[0147] After the etching process is completed, Fig.18 As shown in FIG. 1 , the second adhesive film ADF2 is peeled off from the encapsulation substrate ES (the dust PTC is attached to the second adhesive film ADF2 ). Therefore, the second adhesive film ADF2 may be a release film.

[0148] According to some embodiments of the present disclosure, the yield of a display device can be improved.

[0149] Although example embodiments of the present disclosure have been described, it is understood that the present disclosure is not limited to these example embodiments, but various changes and modifications may be made by one of ordinary skill in the art within the spirit and scope of the present disclosure as claimed.

[0150] Therefore, the disclosed subject matter is not limited to any single embodiment described herein, and the embodiments described above are to be considered illustrative rather than restrictive. Accordingly, the scope of the inventive concept should be determined only in accordance with the appended claims and their equivalents.

Claims

1. A method for manufacturing a display device, the method comprising the following steps: preparing a display substrate in which at least one hole region is defined when viewed in plan view; placing a first adhesive film on the display substrate; irradiating first light in the form of laser light onto the first adhesive film and the display substrate so that the first light passing through the first adhesive film etches the hole region of the display substrate; as well as peeling off the first adhesive film, The first adhesive film transmits at least a portion of the first light.

2. The method according to claim 1, wherein: The first adhesive film comprises: a substrate layer; and an adhesive layer, located below the base layer, Wherein, the adhesive layer is placed between the display substrate and the base layer in the step of placing the first adhesive film.

3. The method according to claim 2, wherein: In the step of etching the display substrate, As the display substrate is etched, a groove is defined on a region of the display substrate corresponding to the hole region, and Dust generated between the inside of the groove and the first adhesive film adheres to the bottom surface of the first adhesive film.

4. The method according to claim 1, wherein: The first adhesive film has a transmittance of the first light of 70% or more.

5. The method according to claim 1, wherein: The display substrate comprises: base substrate; a circuit layer, located on the base substrate and comprising a plurality of thin film transistors; and The pixel layer is located on the circuit layer and includes a plurality of organic light emitting elements.

6. The method according to claim 5, wherein: Regions of the pixel layer and the circuit layer of the display substrate corresponding to the hole region are etched by the first light, while the base substrate of the display substrate remains intact during the step of etching the display substrate.

7. The method according to claim 5, wherein: A region of the pixel layer of the display substrate corresponding to the hole region is etched by the first light, while the circuit layer and the base substrate of the display substrate remain intact during the step of etching the display substrate.

8. The method according to claim 1, further comprising: preparing a packaging substrate; After the step of peeling off the first adhesive film, combining the display substrate and the encapsulation substrate; as well as forming a module hole in the hole region, Wherein, the module hole penetrates the display substrate and the packaging substrate.

9. The method according to claim 8, wherein: The hole region includes a central region and a peripheral region surrounding the central region, and The forming of the module hole includes etching areas of the display substrate and the encapsulation substrate corresponding to the central area by irradiating third light in the form of laser.

10. The method according to claim 9, further comprising: Before the step of forming the module hole, placing a second adhesive film on at least one of the top surface of the package substrate and the bottom surface of the display substrate; as well as peeling off the second adhesive film after the step of forming the module hole, Wherein, the third light passes through the second adhesive film.

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