Imaging device and electronic equipment

Abstract

The present application discloses an imaging device and an electronic device. A frame assembly, an imaging module and a module circuit board. The imaging module is housed in the frame assembly and can move relative to the frame assembly. The imaging module includes a lens assembly and a photosensitive assembly. Light passes through the lens assembly to reach the photosensitive assembly, and the photosensitive assembly is used to convert the light signal into an electrical signal for imaging. The module circuit board includes a first connecting portion and a second connecting portion. One end of the first connecting portion is connected to the photosensitive assembly, and the other end is connected to the second connecting portion. The second connecting portion includes a first surface and a second surface opposite to each other, and the second connecting portion is provided with a through groove that passes through the first surface and the second surface. In the imaging device and electronic device of the embodiment of the present application, the module circuit board includes a first connecting portion and a second connecting portion. Among them, the second connecting portion is provided with a through groove, and the through groove can reduce the anti-torsion effect of the module circuit board on the movement of the imaging module and avoid damage to the module circuit board.

Description

Technical Field

[0001] The present application relates to the field of imaging technology, and more specifically, to an imaging device and an electronic device. Background Art

[0002] The imaging module of the electronic device can be connected to the mainboard of the electronic device through a circuit board to achieve signal transmission between the imaging module and the mainboard. However, when the imaging module moves, the circuit board will also be driven, and at this time, the circuit board will twist and generate corresponding torque. This is likely to cause damage to the circuit board. Summary of the invention

[0003] Embodiments of the present application provide an imaging device and an electronic device.

[0004] The imaging device of the embodiment of the present application includes a frame assembly, an imaging module and a module circuit board. The imaging module is housed in the frame assembly and can move relative to the frame assembly. The imaging module includes a lens assembly and a photosensitive assembly. Light passes through the lens assembly to reach the photosensitive assembly, and the photosensitive assembly is used to convert the optical signal into an electrical signal for imaging. The module circuit board includes a first connecting portion and a second connecting portion. One end of the first connecting portion is connected to the photosensitive assembly, and the other end is connected to the second connecting portion. The second connecting portion includes a first surface and a second surface opposite to each other, and the second connecting portion is provided with a through groove that passes through the first surface and the second surface.

[0005] The imaging device of the embodiment of the present application includes a frame assembly, an imaging module and a module circuit board. The imaging module is housed in the frame assembly and can move relative to the frame assembly. The imaging module includes a lens assembly and a photosensitive assembly. Light passes through the lens assembly to reach the photosensitive assembly, and the photosensitive assembly is used to convert the optical signal into an electrical signal for imaging. The module circuit board includes a first connecting part and a second connecting part. One end of the first connecting part is connected to the photosensitive assembly, and the other end is connected to the second connecting part. The second connecting part includes a plurality of first sub-connecting parts and at least one second sub-connecting part. The plurality of first sub-connecting parts are spaced apart in a direction perpendicular to the plane where the first connecting part is located. The opposite ends of the second sub-connecting part are respectively connected to two of the first sub-connecting parts.

[0006] The electronic device of the embodiment of the present application includes a housing and an imaging device. The imaging device is combined with the housing. The imaging device includes a frame assembly, an imaging module and a module circuit board. The imaging module is housed in the frame assembly and can move relative to the frame assembly. The imaging module includes a lens assembly and a photosensitive assembly. Light passes through the lens assembly to reach the photosensitive assembly, and the photosensitive assembly is used to convert the optical signal into an electrical signal for imaging. The module circuit board includes a first connecting part and a second connecting part. One end of the first connecting part is connected to the photosensitive assembly, and the other end is connected to the second connecting part. The second connecting part includes a first surface and a second surface opposite to each other, and the second connecting part is provided with a through groove that passes through the first surface and the second surface.

[0007] The electronic device of the embodiment of the present application includes a housing and an imaging device. The imaging device is combined with the housing. The imaging device includes a frame assembly, an imaging module and a module circuit board. The imaging module is housed in the frame assembly and can move relative to the frame assembly. The imaging module includes a lens assembly and a photosensitive assembly. Light passes through the lens assembly to reach the photosensitive assembly, and the photosensitive assembly is used to convert the optical signal into an electrical signal for imaging. The module circuit board includes a first connecting part and a second connecting part. One end of the first connecting part is connected to the photosensitive assembly, and the other end is connected to the second connecting part. The second connecting part includes a plurality of first sub-connecting parts and at least one second sub-connecting part. The plurality of first sub-connecting parts are spaced apart in a direction perpendicular to the plane where the first connecting part is located. The opposite ends of the second sub-connecting part are respectively connected to two of the first sub-connecting parts.

[0008] In the imaging device and electronic device of the embodiment of the present application, the module circuit board includes a first connection part and a second connection part. The second connection part is provided with a through groove, which can reduce the anti-torsion effect of the module circuit board on the movement of the imaging module and avoid damage to the module circuit board; or the second connection part is composed of a first sub-connection part and a second sub-connection part to form a bent circuit board structure, and the bent circuit board structure can also reduce the anti-torsion effect of the module circuit board on the movement of the imaging module and avoid damage to the module circuit board.

[0009] Additional aspects and advantages of the embodiments of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0011] Figure 1is a three-dimensional assembly schematic diagram of an imaging device according to certain embodiments of the present application;

[0012] Figure 2 yes Figure 1 A three-dimensional exploded schematic diagram of the imaging device;

[0013] Figure 3 yes Figure 1 A schematic diagram of the planar structure of the imaging device;

[0014] Figure 4 yes Figure 1 A partial cross-sectional schematic diagram of the imaging device along line IV-IV;

[0015] Figure 5 yes Figure 1 A partial cross-sectional schematic diagram of the imaging device along line VV;

[0016] Figure 6 yes Figure 1 A schematic diagram of the structure of the cover and hinge of the imaging device;

[0017] Figure 7 yes Figure 1 A schematic structural diagram of the cover and hinge of the imaging device from another perspective;

[0018] Figure 8 yes Figure 1 A partially exploded perspective diagram of an imaging device;

[0019] Fig. 9 is a schematic diagram of the planar structure of an imaging device according to some embodiments of the present application;

[0020] Fig.10 is a schematic diagram of the positional relationship between the first driving member and the magnetic induction device in the imaging device of certain embodiments of the present application;

[0021] Fig.11 is a schematic diagram of the positional relationship between the first driving member and the magnetic induction device in the imaging device of certain embodiments of the present application;

[0022] Fig.12 It is a three-dimensional assembly diagram of a module circuit board and a limiting member in an imaging device according to certain embodiments of the present application;

[0023] Fig.13 yes Fig.12 Schematic diagram of the planar structure of the middle module circuit board and the limiter;

[0024] Fig.14 yes Fig.12 A three-dimensional exploded diagram of the middle module circuit board and the stopper;

[0025] Fig.15is a schematic diagram of the planar structure of a module circuit board in an imaging device according to certain embodiments of the present application;

[0026] Fig.16 It is a schematic diagram of the planar structure of an electronic device according to certain embodiments of the present application. DETAILED DESCRIPTION

[0027] The following further describes the embodiments of the present application in conjunction with the accompanying drawings. The same or similar reference numerals in the accompanying drawings represent the same or similar elements or elements with the same or similar functions.

[0028] In addition, the embodiments of the present application described below in conjunction with the drawings are exemplary and are only used to explain the embodiments of the present application and should not be construed as limiting the present application.

[0029] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0030] See also Figure 1 , Figure 2 and Figure 4 The present application provides an imaging device 100. The imaging device 100 includes a frame assembly, an imaging module 30 and a module circuit board 90. The imaging module 30 is housed in the frame assembly and can move relative to the frame assembly. The imaging module 30 includes a lens assembly 31 and a photosensitive assembly 32. Light passes through the lens assembly 31 to reach the photosensitive assembly 32. The photosensitive assembly 32 is used to convert the optical signal into an electrical signal for imaging. The module circuit board 90 includes a first connecting portion 91 and a second connecting portion 92, one end of the first connecting portion 91 is connected to the photosensitive assembly 32, and the other end is connected to the second connecting portion 92. The second connecting portion 92 includes a first surface 9201 and a second surface 9202 that are opposite to each other. The second connecting portion 92 is provided with a through groove 94 that penetrates the first surface 9201 and the second surface 9202.

[0031] In the imaging device 100 of the embodiment of the present application, the module circuit board 90 connected to the imaging module 30 includes a first connection portion 91 and a second connection portion 92. The second connection portion 92 is provided with a through slot 94. The through slot 94 can reduce the anti-torsion effect of the module circuit board 90 on the movement of the imaging module 30, which can ensure that the imaging module 30 can perform accurate jitter compensation on the one hand, and can reduce the influence of the movement of the imaging module 30 on the module circuit board 90 on the other hand, and avoid damage to the module circuit board 90.

[0032] See also Figure 1 , Figure 2 , Figure 4 and 5 The present application provides an imaging device 100. The imaging device 100 includes a frame assembly, an imaging module 30 and a module circuit board 90. The imaging module 30 is housed in the frame assembly and can move relative to the frame assembly. The imaging module 30 includes a lens assembly 31 and a photosensitive assembly 32. Light passes through the lens assembly 31 to reach the photosensitive assembly 32. The photosensitive assembly 32 is used to convert the optical signal into an electrical signal for imaging. The module circuit board 90 includes a first connecting portion 91 and a second connecting portion 92, one end of the first connecting portion 91 is connected to the photosensitive assembly 32, and the other end is connected to the second connecting portion 92. The second connecting portion 92 includes a plurality of first sub-connecting portions 921 and at least one second sub-connecting portion 922. The plurality of first sub-connecting portions 921 are spaced apart in a direction perpendicular to the plane where the first connecting portion 91 is located, and the opposite ends of the second sub-connecting portion 922 are respectively connected to the two first sub-connecting portions 921.

[0033] In the imaging device 100 of the embodiment of the present application, the module circuit board 90 connected to the imaging module 30 includes a first connection part 91 and a second connection part 92. Among them, the second connection part 92 includes a first sub-connection part 921 and a second sub-connection part 922, and the alternating arrangement of the first sub-connection part 921 and the second sub-connection part 922 makes the second connection part 92 a bent structure. The second connection part 92 of the bent structure can reduce the anti-torsion effect of the module circuit board 90 on the movement of the imaging module 30. On the one hand, it can ensure that the imaging module 30 can perform accurate jitter compensation, and on the other hand, it can reduce the influence of the movement of the imaging module 30 on the module circuit board 90, avoiding damage to the module circuit board 90.

[0034] See also Figure 2 , Figure 4 , Figure 5 , Figure 6 and Figure 8The imaging device 100 of the embodiment of the present application includes a frame assembly, an imaging module 30, a cover 40, a first hinge 51, a second hinge 52, a driving circuit board 60, a driving assembly 70, a magnetic induction device 80 and a module circuit board 90. The frame assembly includes a first frame 10 and a second frame 20.

[0035] See also Figure 2 The first frame 10 includes a first sub-frame 13 and a second sub-frame 14 connected to each other. The first sub-frame 13 is provided with a first receiving space 12 for receiving the second frame 20. The first sub-frame 13 includes a first inner side wall 101 and a first outer side wall 102 opposite to each other. The first inner side wall 101 is closer to the second frame 20 than the first outer side wall 102. The first inner side wall 101 is recessed toward the first outer side wall 102 to form two first receiving cavities 11. The second sub-frame 14 extends from the first outer side wall 10 in a direction away from the first receiving space 12. The second sub-frame 14 is provided with a module circuit board 90 ( Figure 5 As shown) in the accommodating cavity 141.

[0036] Please continue reading Figure 2 , the second frame 20 is received in the first frame 10, specifically, the second frame 20 is received in the first receiving space 12 of the first sub-frame 13. The second frame 20 includes a second inner wall 201 and a second outer wall 202, the second inner wall 201 and the second outer wall 202 are opposite to each other, and the second inner wall 201 is closer to the imaging module 30 than the second outer wall 202. The second inner wall 201 of the second frame 20 is surrounded by a second receiving space 22. The second inner wall 201 is recessed toward the second outer wall 202 to form two second receiving cavities 21. The second outer wall 202 is recessed toward the second inner wall 201 to form a mounting groove 23 ( Figure 8 shown).

[0037] Please also read Figure 2 and Figure 4 The imaging module 30 is received in the second frame 20, specifically, the imaging module 30 is received in the second receiving space 22 of the second frame 20. The imaging module 30 includes a lens assembly 31, a photosensitive assembly 32, and a module bracket 33. The module bracket 33 is formed with a third receiving space 331, and the lens assembly 31 is received in the third receiving space 331. Light passes through the lens assembly 31 to reach the photosensitive assembly 32, and the photosensitive assembly 32 is used to convert the optical signal into an electrical signal to form an image.

[0038] Please continue reading Figure 2The cover 40 is fixedly connected to the imaging module 30 and is movably connected to both the first frame 10 and the second frame 20. The driving force applied to the second frame 20 can drive the imaging module 30 to move relative to the first frame 10 through the cover 40 to compensate for the shaking of the imaging module 30. Figure 3 The cover body 40 and the first frame 10 are movably connected to form two first connection points 901, and the line connecting the two first connection points 901 is defined as the first axis D1. The cover body 40 and the second frame 20 are movably connected to form two second connection points 902, and the line connecting the two second connection points 902 is defined as the second axis D2. In one example, the first axis D1 can be perpendicular to the second axis D2. Of course, the angle between the first axis D1 and the second axis D2 can also be other angles, which is not limited here. Figure 3 The cover body 40, the first frame 10 and the second frame 20 shown are all square structures. In this case, the extension direction of the first axis D1 and the extension direction of the second axis D2 can be two diagonal directions of the square structure. Of course, in other embodiments, the cover body 40, the first frame 10 and the second frame 20 can also be circular structures. In this case, the extension direction of the first axis D1 and the extension direction of the second axis D2 can be two radial directions of the circular structure, which is not limited here. The driving force can drive the imaging module 30 to rotate around the first axis D1 relative to the first frame 10 through the cover body 40 to compensate for the jitter of the imaging module 30; or, the driving force can drive the imaging module 30 to rotate around the second axis D2 relative to the first frame 10 and the second frame 20 through the cover body 40 to compensate for the jitter of the imaging module 30; or, the driving force can drive the imaging module 30 to rotate around the first axis D1 relative to the first frame 10 through the cover body 40, and can drive the imaging module 30 to rotate around the first axis D1 and around the second axis D2 relative to the first frame 10 and the second frame 20 through the cover body 40 (the rotation around the first axis D1 and the rotation around the second axis D2 can be performed in different times) to compensate for the jitter of the imaging module 30.

[0039] See also Figure 1 , Figure 2 , Figure 4 and Figure 6 The cover body 40 is disposed on the top of the imaging module 30, and the cover body 40 includes a first surface 401, a second surface 402, a cover body 41, a first hinge arm 42, and a second hinge arm 43. The first surface 401 is opposite to the second surface 402. The second surface 402 is closer to the imaging module 30 than the first surface 401. The cover body 41 is provided with a light hole 411, and one end of the lens assembly 31 away from the photosensitive assembly 32 extends out from the light hole 411.

[0040] See also Figure 3 and Figure 6There are two first hinged arms 42, and the extension direction of the two first hinged arms 42 coincides with the first axis D1. One end of each first hinged arm 42 is connected to the cover body 41, and the other end is hinged to the first frame 10. At one end of each first hinged arm 42 away from the cover body 41, the first surface 401 is recessed toward the second surface 402 to form a first receiving groove 421.

[0041] See also Figure 3 and Figure 7 There are two second hinged arms 43, and the extension direction of the two second hinged arms 43 coincides with the second axis D2. One end of each second hinged arm 43 is connected to the cover body 41, and the other end is hinged to the second frame 20. At one end of each second hinged arm 43 away from the cover body 41, the first surface 401 is recessed toward the second surface 402 to form a second receiving groove 431.

[0042] See also Figure 2 , Figure 3 and Figure 6 , the number of the first hinges 51 is two. The two first hinges 51 correspond to the two first receiving cavities 11. Each first hinge 51 is arranged on the first frame 10 and received in the corresponding first receiving cavity 11. The end of the first hinge arm 42 away from the cover body 41 is connected to the first hinge 51. Each first hinge 51 includes a first hinge body 511 and a first sphere 512. The first hinge body 511 is provided with a first through hole 5111. The first sphere 512 is partially received in the first through hole 5111. The portion of the first sphere 512 not received in the first through hole 5111 is at least partially received in the first receiving groove 421. In this way, through the movable connection between the first hinge 51 and the first hinge arm 42, the cover body 40 can drive the imaging module 30 to rotate around the first axis D1 relative to the first frame 10 to compensate for the jitter of the imaging module 30.

[0043] See also Figure 2 , Figure 3 and Figure 7, the number of the second hinges 52 is two. The two second hinges 52 correspond to the two second receiving cavities 21. Each second hinge 52 is arranged on the second frame 20 and is received in the corresponding second receiving cavity 21. The end of the second hinge arm 43 away from the cover body 41 is connected to the second hinge 52. Each second hinge 52 includes a second hinge body 521 and a second sphere 522. The second hinge body 521 is provided with a second through hole 5211. The second sphere 522 is partially received in the second through hole 5211. The portion of the second sphere 522 not received in the second through hole 5211 is at least partially received in the second receiving groove 431. In this way, through the movable connection between the second hinge 52 and the second hinge arm 43, the cover body 40 can drive the imaging module 30 to rotate around the second axis D2 relative to the first frame 10 and the second frame 20 to compensate for the jitter of the imaging module 30.

[0044] See also Figure 2 , Figure 4 and Figure 8 The driving circuit board 60 is mounted on the first inner side wall 101 of the first frame 10 and passes through the first frame 10 so that the connector end extends toward a side away from the first receiving space 12. The driving circuit board 60 includes a first side surface 601 and a second side surface 602, and the first side surface 601 is opposite to the second side surface 602. The first side surface 601 is closer to the second frame 20 than the second side surface 602.

[0045] The driving assembly 70 includes a first driving member 71 and a second driving member 72. The first driving member 71 is mounted on a side of the driving circuit board 60 close to the second frame 20, that is, the first driving member 71 is mounted on the first side 601 of the driving circuit board 60. The second driving member 72 is mounted on a side of the second frame 20 close to the first frame 10, that is, the second driving member 72 is mounted on the second outer side wall 202 of the second frame 20. The first driving member 71 interacts with the second driving member 72 to generate a driving force. For example, as Figure 4 As shown, the first driving member 71 is a coil, the second driving member 72 is a magnet, and the driving circuit board 60 provides current to the coil so that the coil and the magnet interact to generate a driving force. Figure 8 As shown, the second driving member 72 is installed in the installation slot 23 of the second frame 20 , which is beneficial to reducing the lateral size of the imaging device 100 .

[0046] The number of the drive components 70 can be one, two, three, four, etc., which is not limited here. Figure 2 and Figure 8As shown, there are two drive assemblies 70, and the two drive assemblies 70 are respectively located on two adjacent sides of the second frame 20. Of course, in other embodiments, the two drive assemblies 70 may also be located on two opposite sides of the second frame 20, which is not limited here. Providing two drive assemblies 70 to apply a driving force to the second frame 20 can reduce the number of components required for the imaging device 100 and reduce the weight of the imaging device 100 while ensuring that sufficient driving force can be applied to achieve an anti-shake effect. Figure 2 and Fig. 9 As shown, there are four driving assemblies 70, and the four driving assemblies 70 are respectively located on the four second outer side walls 202 of the second frame 20. The four driving assemblies 70 can ensure that sufficient driving force can be applied to the second frame 20, so that the cover body 40 can better drive the imaging module 30 to move to achieve anti-shake.

[0047] See also Figure 4 The driving assembly 70 may further include a third driving member 73. The third driving member 73 is mounted on the side wall of the lens assembly 31. The third driving member 73 interacts with the second driving member 72 to generate a driving force, which can cause the lens assembly 31 to move along the optical axis of the lens assembly 31, thereby achieving zooming or focusing of the imaging module 30. In one example, the second driving member 72 is a magnet, and the third driving member 73 is a coil.

[0048] Figure 4 In the illustrated embodiment, the first driving member 71 can interact with the second driving member 72 to provide driving force for the shake compensation movement of the imaging module 30, and the second driving member 72 can interact with the third driving member 73 to provide driving force for the focusing movement of the lens assembly 31. This sharing of driving members can reduce the number of components required for the imaging device 100 and is beneficial to reducing the lateral size and weight of the imaging module 30.

[0049] See also Figure 8 , Fig.10 and Fig.11 The magnetic induction device 80 is disposed on a side of the driving circuit board 60 close to the second frame 20 (ie, the first side 601). Fig.10 As shown, when the magnetic induction device 80 is arranged on the side of the driving circuit board 60 close to the second frame 20, it can also be arranged in the space formed by the first driving member 71 (ie, the coil); or Fig.11As shown, when the magnetic induction device 80 is arranged on a side of the driving circuit board 60 close to the second frame 20, it can also be arranged outside the space formed by the first driving member 71 (i.e., the coil). The magnetic induction device 80 can detect the moving position of the imaging module 30, and the detected moving position can be used to determine whether the imaging module 30 has moved to the target position, and further correct the moving position of the imaging module 30 when the imaging module 30 has not moved to the target position. In this way, the data detected by 80 during the magnetic induction period forms feedback information, and the moving position of the imaging module 30 is further adjusted based on the feedback information, so that the jitter compensation of the imaging module 30 is more accurate.

[0050] See also Figure 2 , Figure 4 and Figure 5 The module circuit board 90 can be used to power the photosensitive component 32 in the imaging module 30, and can also provide current for the third driving member 73. Of course, the third driving member 73 can also be electrically connected to the driving circuit board 60. At this time, the current of the third driving member 73 can be provided by the driving circuit board 60. The module circuit board 90 is partially accommodated in the first frame 10. Specifically, the module circuit board 90 is partially accommodated in the accommodating cavity 141 of the second sub-frame 14. The module circuit board 90 includes a first connecting portion 91, a second connecting portion 92 and a third connecting portion 93 connected in sequence. The first connecting portion 91 is accommodated in the first accommodating space 12 of the first sub-frame 13, and the photosensitive component 32 is arranged on the first connecting portion 91 and is electrically connected to the first connecting portion 91. One end of the first connecting portion 91 away from the photosensitive component 32 is connected to the second connecting portion 92. The second connecting portion 92 is accommodated in the accommodating cavity 141, and the second sub-frame 14 can protect the second connecting portion 92. The second connection part 92 includes a plurality of first sub-connection parts 921, at least one second sub-connection part 922 and a cushion block 923. The plurality of first sub-connection parts 921 are arranged at intervals in a direction perpendicular to the plane where the first connection part 91 is located. The opposite ends of a second sub-connection part 922 are respectively connected to two first sub-connection parts 921. Each first sub-connection part 921 includes a first surface 9201 and a second surface 9202 that are opposite to each other, and at least one first sub-connection part 921 is provided with a through groove 94 that passes through the first surface 9201 and the second surface 9202. The extension direction of the through groove 94 is parallel to the extension direction of the first sub-connection part 921. The cushion block 923 is arranged between two adjacent first sub-connection parts 921. The cushion block 923 includes two opposite surfaces, one of which is in contact with one of the first sub-connection parts 921, and the other surface is in contact with the other first sub-connection part 921. As Figure 5As shown, the second connection part 92 includes five first sub-connection parts 921, four second sub-connection parts 922 and four pads 923. The five first sub-connection parts 921 are stacked and spaced in a direction perpendicular to the plane where the first connection part 91 is located. The end of any two adjacent first sub-connection parts 921 connected to the second sub-connection part 922 is provided with a pad 923, and the height of the pad 923 is substantially equal to the distance between the two adjacent first sub-connection parts 921. The pad 923 can make the connection between the first sub-connection part 921 and the second sub-connection part 922 more secure. In one example, the pad 923 can include two sub-pads, and the two sub-pads are stacked. Each sub-pad is integrally formed with the first sub-connection part 921 in contact with it. The design of the sub-pad and the first sub-connection part 921 being integrally formed can simplify the manufacturing process of the second connection part 92. Of course, the pad 923 can also be not divided into a plurality of sub-pads, but present a complete structure, which is not limited here. One end of the second connection part 92 away from the first connection part 91 extends from the through hole that penetrates the first inner wall 101 and the first outer wall 102 of the second sub-frame 14, and is connected to the third connection part 93. One end of the third connection part 93 away from the second connection part 92 is a connector end, which is used to connect to other external circuit boards, such as a main board. It can be understood that since the module circuit board 90 is used to power the imaging module 30, and in order to prevent shaking, the driving force can drive the imaging module 30 to move as a whole relative to the first frame 10 through the cover body 40. During the overall movement of the imaging module 30, the module circuit board 90 will also be driven. At this time, the existence of the module circuit board 90 will produce a torsion resistance effect on the movement of the imaging module 30, affecting the jitter compensation of the imaging module 30. Moreover, the overall movement of the imaging module 30 drives the module circuit board 90 to move, which may also cause damage to the module circuit board 90. Therefore, by setting the first connecting part 91, the second connecting part 92 and the third connecting part 93 in the module circuit board 90, wherein the second connecting part 92 includes the first sub-connecting part 921 and the second sub-connecting part 922 that are alternately arranged, the second connecting part 92 formed by the alternately arranged first sub-connecting part 921 and the second sub-connecting part 922 has a multi-bending structure. The second connecting part 92 with the multi-bending structure can reduce the torsional resistance of the module circuit board 90 on the movement of the imaging module 30, thereby ensuring that the imaging module 30 can perform accurate jitter compensation. At the same time, it can also reduce the influence of the movement of the imaging module 30 on the module circuit board 90, thereby avoiding damage to the module circuit board 90. In addition, a through slot 94 is also provided in the first sub-connecting portion 921. The provision of the through slot 94 allows the first sub-connecting portion 921 to be divided into two parts. When the imaging module 30 moves and causes the module circuit board 90 to deform, the two parts of the first sub-connecting portion 921 divided by the through slot 94 are subjected to force separately. This can reduce the torsional force of the module circuit board 90 on the movement of the imaging module 30.

[0051] In summary, in the imaging device 100 of the embodiment of the present application, the imaging module 30 is fixedly connected to the cover 40, and the cover 40 is movably connected to the first frame 10 and the second frame 20, so that the cover 40 can drive the imaging module 30 to move relative to the first frame 10 to compensate for the shaking amount of the imaging module 30. In this way, during the entire anti-shake process, the imaging module 30 moves as a whole, the lens assembly 31 will not translate relative to the photosensitive assembly 32, and the imaging module 30 can obtain an image with better quality.

[0052] In addition, the driving assembly 70 includes a first driving member 71, a second driving member 72 and a third driving member 73, wherein the first driving member 71 can interact with the second driving member 72 to provide a driving force for the shake compensation movement of the imaging module 30; the second driving member 72 can interact with the third driving member 73 to provide a driving force for the focus or zoom of the lens assembly 31. This shared driving member method can reduce the number of components required for the imaging device 100, and is conducive to reducing the lateral size and weight of the imaging module 30.

[0053] In addition, the module circuit board 90 includes a first connecting portion 91, a second connecting portion 92 including a first sub-connecting portion 921 and a second sub-connecting portion 922 and having a slotted design, and a third connecting portion 93. This design method can reduce the torque resistance of the module circuit board 90 on the movement of the imaging module 30, ensuring that the imaging module 30 can perform accurate jitter compensation. At the same time, it can also reduce the impact of the movement of the imaging module 30 on the module circuit board 90, avoiding damage to the module circuit board 90.

[0054] See also Figure 12 to Figure 14 In some embodiments, the imaging device 100 further includes a limit member 96. The limit member 96 can limit the structure of the second connection portion 92, so that the second connection portion 92 is a multi-bend structure including a first sub-connection portion 921 and a second sub-connection portion 922. The number of limit members 96 can be one or more, which is not limited here. The limit member 96 includes a limit member body 961, two first limit members 962 and a third limit member 963. The limit member body 961 is at least partially accommodated in the space formed by two adjacent first sub-connections 921. The two first limit members 962 are both arranged on the limit member body 961, and the two first limit members 962 are respectively located at opposite ends of the limit member body 961, and the two first limit members 962 are located outside the space formed by two adjacent first sub-connections 921. As Figure 12 to Figure 14As shown, the two first limiting portions 962 are both circular rings sleeved on the limiting member body 961. The diameter of the circular ring should be greater than the maximum distance between the two adjacent first sub-connecting portions 921 to prevent the limiting member 96 from falling off from the space formed by the two adjacent first sub-connecting portions 921. The third limiting portion 963 is arranged on the limiting member body 961 and is located between the two first limiting portions 962. The third limiting portion 961 is accommodated in the space formed by the two adjacent first sub-connecting portions 921 and contacts with the two adjacent first sub-connecting portions 921. When the third limiting portion 961 is accommodated in the space formed by the two adjacent first sub-connecting portions 921, the third limiting portion 963 is located close to the second sub-connecting portion 922 connecting the two adjacent first sub-connecting portions 921. At this time, the third limiting portion 963 can play the role of propping up the two adjacent first sub-connecting portions 921, thereby avoiding the problem that the distance between the two adjacent first sub-connecting portions 921 is too close, causing the second sub-connecting portion 922 connecting the two adjacent first sub-connecting portions 921 to be damaged due to excessive bending. Figure 12 to Figure 14 In the module circuit board 90 shown, the first sub-connection part 921 and the second sub-connection part 922 are both provided with a through slot 94. In other embodiments, the first sub-connection part 921 may be provided with a through slot 94; or the second sub-connection part 922 may be provided with a through slot 94; or neither the first sub-connection part 921 nor the second sub-connection part 922 may be provided with a through slot 94, which is not limited here. Figure 12 to Figure 14 The module circuit board 90 shown is provided with a second connecting portion 92 with a multi-bending structure and a through groove 94 is opened on the second connecting portion 92 to reduce the anti-torsion effect of the module circuit board 90 on the movement of the imaging module 30, thereby ensuring that the imaging module 30 can perform accurate jitter compensation and reducing the impact of the movement of the imaging module 30 on the module circuit board 90, thereby avoiding damage to the module circuit board 90.

[0055] See also Fig.15 In some embodiments, the second connection portion 92 in the module circuit board 90 may not include the first sub-connection portion 921 and the second sub-connection portion 922. In this case, the second connection portion 92 extends along a plane. For example, the second connection portion 92 extends along a plane parallel to the plane where the first connection portion 91 is located. A through slot 94 is provided on the second connection portion 92. In this way, the anti-torsion effect of the module circuit board 90 on the movement of the imaging module 30 is reduced only by providing the through slot 94, so as to ensure that the imaging module 30 can perform accurate jitter compensation, reduce the influence of the movement of the imaging module 30 on the module circuit board 90, and avoid damage to the module circuit board 90.

[0056] See also Figure 2 , Fig.12 and Fig.16The present application also provides an electronic device 300. The electronic device 300 includes a housing 200 and an imaging device 100 described in any one of the above embodiments. The imaging device 100 is combined with the housing 200. For example, the imaging device 100 is installed in the housing 200. The electronic device 300 can be a mobile phone, a laptop computer, a tablet computer, a smart wearable device (such as a smart watch, a smart bracelet, a smart helmet, smart glasses, etc.), a virtual reality device, etc., which is not limited here.

[0057] In the electronic device 300 of the embodiment of the present application, the module circuit board 90 includes a first connection part 91 and a second connection part 92. The second connection part 91 is provided with a through slot 94, which can reduce the anti-torsion effect of the module circuit board 90 on the movement of the imaging module 30, thereby avoiding damage to the module circuit board 90; or the second connection part 92 is composed of a first sub-connection part 921 and a second sub-connection part 922 to form a bent circuit board structure, and the bent circuit board structure can also reduce the anti-torsion effect of the module circuit board 90 on the movement of the imaging module 30, thereby avoiding damage to the module circuit board 90.

[0058] In the description of this specification, the description with reference to the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0059] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, unless otherwise clearly and specifically defined.

[0060] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. An imaging device, characterized in that: include: Frame components; An imaging module, which is housed in the frame assembly and can move relative to the frame assembly, and includes a lens assembly and a photosensitive assembly. Light passes through the lens assembly to reach the photosensitive assembly, and the photosensitive assembly is used to convert light signals into electrical signals to form an image; and A module circuit board, the module circuit board includes a first connecting part and a second connecting part, one end of the first connecting part is connected to the photosensitive component, and the other end is connected to the second connecting part, the second connecting part includes a first surface and a second surface opposite to each other, and the second connecting part is provided with a through groove penetrating the first surface and the second surface.

2. The imaging device according to claim 1, characterized in that The second connecting portion extends along a plane.

3. The imaging device according to claim 1, characterized in that The second connecting part includes a plurality of first sub-connecting parts and at least one second sub-connecting part. The plurality of first sub-connecting parts are arranged at intervals in a direction perpendicular to the plane where the first connecting part is located. At least one of the first sub-connecting parts is provided with the through groove. The opposite ends of the second sub-connecting part are respectively connected to two of the first sub-connecting parts.

4. An imaging device, characterized in that: include: Frame components; An imaging module, which is housed in the frame assembly and can move relative to the frame assembly, and includes a lens assembly and a photosensitive assembly. Light passes through the lens assembly to reach the photosensitive assembly, and the photosensitive assembly is used to convert light signals into electrical signals to form an image; and A module circuit board, the module circuit board includes a first connecting part and a second connecting part, one end of the first connecting part is connected to the photosensitive component, and the other end is connected to the second connecting part, the second connecting part includes a plurality of first sub-connecting parts and at least one second sub-connecting part, the plurality of first sub-connecting parts are arranged at intervals in a direction perpendicular to the plane where the first connecting part is located, and the opposite ends of the second sub-connecting part are respectively connected to two of the first sub-connecting parts.

5. The imaging device according to claim 3 or 4, characterized in that: The second connection part further includes a cushion block, which is disposed between two adjacent first sub-connection parts. The cushion block includes two opposite surfaces, one of which is in contact with one of the first sub-connection parts, and the other is in contact with the other first sub-connection part.

6. The imaging device according to claim 3 or 4, characterized in that: The imaging device also includes a limiter, which includes a limiter body and two first limiter portions. The two first limiter portions are both arranged on the limiter body and are respectively located at opposite ends of the limiter body. The limiter body is at least partially accommodated in a space formed by two adjacent first sub-connecting portions, and the two first limiter portions are located outside the space formed by two adjacent first sub-connecting portions.

7. The imaging device according to claim 6, characterized in that The limiting member further includes a third limiting portion, which is arranged on the limiting member body and located between the two first limiting portions. The third limiting portion is accommodated in a space formed by two adjacent first sub-connecting portions and contacts both of the two adjacent first sub-connecting portions.

8. The imaging device according to claim 3 or 4, characterized in that: The module circuit board also includes a third connecting part, and the frame assembly includes a first frame, the first frame includes a first sub-frame and a second sub-frame connected to each other, the first sub-frame is provided with a first receiving space for accommodating the imaging module, the second sub-frame is provided with a receiving cavity for accommodating the second connecting part, the side wall of the second sub-frame is provided with a through hole, and an end of the second connecting part away from the first connecting part extends from the through hole to be connected to the third connecting part.

9. The imaging device according to claim 1 or 4, characterized in that: The frame assembly includes a first frame and a second frame, the second frame is received in a first receiving space opened in the first frame, and the imaging module is received in a second receiving space opened in the second frame; The imaging device also includes a cover body, which is fixedly connected to the imaging module and movably connected to the first frame and the second frame. The driving force applied to the second frame can drive the imaging module to move relative to the first frame through the cover body to compensate for the jitter of the imaging module.

10. An electronic device, characterized in that: include: case; and The imaging device according to any one of claims 1 to 9, wherein the imaging device is combined with the housing.

Images