Display device

Abstract

A display device is provided. In this display device, since the inorganic encapsulation layer of the thin film encapsulation layer does not separate from another layer, the lifespan of the display device can be increased.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefit of Korean Patent Application No. 10 - 2019 - 0046936, filed with the Korean Intellectual Property Office on April 22, 2019, the disclosure of which is incorporated herein by reference in its entirety. Technical field

[0003] One or more embodiments relate to a device, and more particularly to a display device. Background art

[0004] A display device is a device for displaying an image, and may include a liquid crystal display, an electrophoretic display, an organic light - emitting display, an inorganic light - emitting display, a field - emission display, a surface - conduction electron - emission display, a plasma display, a cathode - ray display, etc.

[0005] A display device includes a display area and a non - display area, wherein the display area displays an image, and the non - display area has wirings disposed therein for transmitting signals to the display area. Recently, in order to achieve a thin and light display device while maintaining high quality, research on a technology for encapsulating the display area and the non - display area by using an organic layer has been actively conducted. Summary of the invention

[0006] One aspect of one or more embodiments relates to a display device having a thin - film encapsulation layer that has increased adhesiveness (e.g., is not separable) while preventing or protecting against the penetration of external moisture and / or oxygen.

[0007] Those of ordinary skill in the art will appreciate that the objects and effects achievable with the present disclosure are not limited to those specifically described above, and other objects of the present disclosure will be more clearly understood from the following detailed description.

[0008] Additional aspects will be partially set forth in the detailed description below, and will be partially apparent from the description, or may be learned by practicing the embodiments.

[0009] According to one or more embodiments, a display device includes a substrate, a thin - film encapsulation layer, a barrier wall, and a cover layer, wherein the substrate includes a display area for displaying an image and a non - display area adjacent to (e.g., located outside) the display area, the thin - film encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked on the substrate, the barrier wall is located on the non - display area, and the cover layer is located between the substrate and the thin - film encapsulation layer in a first direction, and an end of the cover layer is located outside the barrier wall.

[0010] The cover layer may include an inorganic material.

[0011] The inorganic material may include at least one selected from SiNx, TiOx, ZrOx, and HfOx.

[0012] In a second direction perpendicular to the first direction, an end portion of the cover layer may be closer to the barrier wall than an end portion of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer with respect to the barrier wall.

[0013] In a second direction perpendicular to the first direction, an end portion of the cover layer may be farther from the barrier wall than an end portion of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer with respect to the barrier wall.

[0014] In a second direction perpendicular to the first direction, an end portion of the cover layer and an end portion of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer may be in the same position as each other.

[0015] In a second direction perpendicular to the first direction, at least one of an end portion of the cover layer, an end portion of the first inorganic encapsulation layer, and an end portion of the second inorganic encapsulation layer may be in the same position as an end portion of the substrate with respect to each other.

[0016] The barrier wall may include a first barrier wall located on a non-display area and a second barrier wall located on the non-display area, and the second barrier wall is spaced apart from the first barrier wall.

[0017] The cover layer, the first inorganic encapsulation layer, and the second inorganic encapsulation layer may be sequentially stacked in a first direction on a region in a second direction perpendicular to the first direction between the barrier wall and an end portion of the substrate.

[0018] The cover layer may have a refractive index of 1.8 or greater.

[0019] According to one or more embodiments, a display device includes a substrate, a thin film encapsulation layer, a barrier wall, a coating layer, and a cover layer, wherein the substrate includes a display area for displaying an image and a non-display area adjacent to the display area (e.g., located outside the display area), the thin film encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked on the substrate in a first direction, the barrier wall is located on the non-display area, the coating layer is located on the substrate, the coating layer is spaced apart from the barrier wall in a second direction perpendicular to the first direction toward an end portion of the substrate, and the cover layer is located between the substrate and the thin film encapsulation layer in the first direction, and the cover layer is at least partially located between the barrier wall and the coating layer in the second direction.

[0020] The cover layer may include an inorganic material.

[0021] The inorganic material may include at least one selected from SiNx, TiOx, ZrOx, and HfOx.

[0022] The end portion of the cover layer may be located between the barrier wall and the encapsulation layer in the second direction.

[0023] In the second direction, the end portion of the cover layer and the end portion of the substrate may be in the same position as each other.

[0024] The end portion of the cover layer may be located at a position different from the end portion of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer in the second direction, or the end portion of the cover layer may be located at the same position as the end portion of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer in the second direction.

[0025] The cover layer, the first inorganic encapsulation layer, and the second inorganic encapsulation layer may be sequentially stacked on a region in the second direction between the barrier wall and the end portion of the substrate in the first direction.

[0026] According to one or more embodiments, a display device includes a substrate, a thin film encapsulation layer, a barrier wall, and a cover layer. The substrate includes a display region for displaying an image and a non-display region adjacent to (e.g., located outside) the display region. The thin film encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked on the substrate. The barrier wall is located on the non-display region, and the cover layer is located between the substrate and the thin film encapsulation layer. The cover layer covers the front surface of the barrier wall, and the cover layer includes an inorganic material.

[0027] The density of the cover layer may be greater than the density of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer.

[0028] The cover layer may have or a smaller thickness.

[0029] Other aspects, features, and advantages of the present disclosure will be better understood through the drawings, claims, and detailed description.

[0030] Such general and specific aspects of the present disclosure may be implemented using a system, a method, a computer-readable storage medium, and / or a combination thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] These and / or other aspects will become apparent and easier to understand by the following description of the embodiments in conjunction with the drawings, in which:

[0032] Figure 1 is a plan view of a display device according to an embodiment;

[0033] Figure 2 is along Figure 1 a sectional view taken along line II-II';

[0034] Figure 3 is a view showing Figure 2Cross-sectional view of the relationship between a display device and a mask used in manufacturing the display device;

[0035] Figure 4 is a cross-sectional view of a display device according to another embodiment;

[0036] Figure 5 is a cross-sectional view of a display device according to another embodiment;

[0037] Figure 6 is a cross-sectional view of a display device according to another embodiment;

[0038] Figure 7 is a cross-sectional view of a display device according to another embodiment;

[0039] Figure 8 is a cross-sectional view of a display device according to another embodiment;

[0040] Figure 9 is a cross-sectional view of a display device according to another embodiment;

[0041] Figure 10 is a cross-sectional view of a display device according to another embodiment;

[0042] Figure 11 is a cross-sectional view of a display device according to another embodiment; and

[0043] Figure 12 is a cross-sectional view of a display device according to another embodiment. Detailed Description

[0044] Embodiments will now be described in more detail with reference thereto, where examples of the embodiments are shown in the drawings, and like reference numerals throughout the drawings always denote like elements. In this regard, the present embodiments may have different forms and should not be construed as limited to the descriptions set forth herein. Accordingly, the embodiments are described below only by referring to the drawings to explain aspects of the present specification. As used herein, the phrase "and / or" includes any and all combinations of one or more of the related listed items. Expressions such as "at least one of", "one of", "selected from", "selected from... at least one of", and "selected from... one of" after a list of elements modify the entire list of elements, rather than individual elements in the list. Further, when describing embodiments of the present disclosure, the use of "may" means "one or more embodiments of the present disclosure".

[0045] Exemplary embodiments will now be described in more detail with reference to the drawings. Irrespective of the reference numerals, the same or corresponding components are denoted by the same reference numerals, and redundant explanations are not provided.

[0046] Although terms such as "first", "second" etc. may be used to describe various components, such components should not be limited by the above terms. The above terms are only used to distinguish one component from another.

[0047] Unless clearly different in context, a statement used in the singular includes a statement in the plural.

[0048] In this specification, it should be understood that the terms "including", "having" and "comprising" are intended to indicate the presence of features, quantities, steps, actions, components, parts, or combinations thereof disclosed in this specification, and are not intended to exclude the possibility that one or more other features, quantities, steps, actions, components, parts, or combinations thereof may exist or may be added.

[0049] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element can be directly on the other element or there can also be an intermediate element. In contrast, when an element is referred to as being "directly" "on" another element, there is no intermediate element.

[0050] For convenience of explanation, the dimensions of components in the drawings may be enlarged. In other words, since the dimensions and thicknesses of components in the drawings are arbitrarily shown for convenience of explanation, the following embodiments are not limited thereto.

[0051] The X-axis, Y-axis, and Z-axis are not limited to the three axes of a rectangular coordinate system and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis can be perpendicular to each other or can represent different directions that are not perpendicular to each other.

[0052] When a specific embodiment can be implemented in different ways, the specific process sequence can be executed differently from the described sequence. For example, two consecutively described processes can be performed substantially simultaneously or in the reverse order of the described sequence.

[0053] Figure 1 is a plan view of a display device 1000 according to an embodiment. Figure 2 is along Figure 1 a sectional view taken along line II-II'. Figure 3 is a sectional view showing Figure 2 the relationship between the display device 1000 and a mask used in manufacturing the display device 1000.

[0054] Referring to Figures 1 to 3 , the display device 1000 includes a substrate 100. The substrate 100 includes a display area DA and a non-display area PA adjacent to the display area DA.

[0055] In the display area DA of the substrate 100, a plurality of pixels are arranged to display an image. Various display devices such as organic light-emitting devices (OLEDs), thin-film transistors, capacitors, etc. can be arranged in the display area DA, and an image is displayed by pixels formed by an electrical combination of the display devices, thin-film transistors, capacitors, etc. The driving current flowing through the display device is generated according to the gate signal, data signal, driving voltage (ELVDD), common voltage (ELVSS), etc. supplied to the pixel, and the display device can emit light having a brightness corresponding to the driving current.

[0056] The non-display area PA is adjacent to the display area DA. In the non-display area PA, a wiring portion 600 for supplying various signals and / or power sources applied to the display area DA can be arranged. The wiring portion 600 can include a driving circuit. For example, the driving circuit can include at least one selected from a scan driving circuit, a terminal portion, a driving power line, and a second line 210, and can also include a thin-film transistor T3 for controlling an electrical signal applied to the display area DA. Moreover, a barrier wall 120 or a trench can be arranged in the non-display area PA, and the barrier wall 120 or the trench can block the flow of the organic layer for manufacturing the display device 1000. In this case, at least one selected from a scan driving circuit, a terminal portion, a driving power line, a second line 210, and a thin-film transistor T3 can be arranged in the non-display area PA located at the long side (for example, the long side is parallel to the Y axis) of the display device 1000 or the non-display area PA located at the short side (for example, the short side is parallel to the X axis) of the display device 1000.

[0057] The display device 1000 includes a substrate 100 having a display area DA and a non-display area PA, and a thin-film encapsulation layer 500 for encapsulating the display area DA and the non-display area PA.

[0058] The substrate 100 can include various materials. For example, the substrate 100 can include a transparent glass material containing SiO2 as a main component. However, the substrate 100 is not limited thereto, that is, it can include a transparent plastic material. The plastic material can include an insulating organic material, that is, an organic material selected from the group consisting of polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, triacetyl cellulose, cellulose acetate propionate, etc. Moreover, the substrate 100 can have a multilayer structure, and the multilayer structure includes a layer containing a plastic material and an inorganic layer.

[0059] A buffer layer 101 is positioned on a substrate 100 to reduce or block the penetration of impurities, moisture, or external air from the lower part of the substrate 100 and to provide a flat surface on the substrate 100. The buffer layer 101 may include an inorganic material (such as an oxide material and / or a nitride material), an organic material, or an inorganic-organic composite material, and may have a single-layer or multi-layer structure including an inorganic material and / or an organic material.

[0060] The first thin-film transistor T1 includes a semiconductor layer A1, a first gate electrode G1, a source electrode S1, and a drain electrode D1, and the second thin-film transistor T2 includes a semiconductor layer A2, a second gate electrode G2, a source electrode S2, and a drain electrode D2.

[0061] Hereinafter, the thin-film transistors T1 and T2 are top-gate types. However, the embodiments are not limited thereto, and various types (such as bottom-gate types) of thin-film transistors may be employed.

[0062] Moreover, hereinafter, the case of two thin-film transistors T1 and T2 is described, but one or more embodiments are not limited thereto. In one or more embodiments, the display device 1000 may include two or more thin-film transistors in one pixel. In some embodiments, six or seven thin-film transistors may be employed in one pixel.

[0063] The semiconductor layers A1 and A2 may each include amorphous silicon or polycrystalline silicon. In another embodiment, the semiconductor layers A1 and A2 may each include an oxide of at least one selected from the group consisting of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The semiconductor layers A1 and A2 may include a channel region and a source region and a drain region having a carrier concentration higher than that of the channel region.

[0064] In the case where a first gate insulating layer 103 is interposed therebetween, the first gate electrode G1 is disposed on the semiconductor layer A1. The first gate electrode G1 may include molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may have a single-layer or multi-layer structure. As an example, the first gate electrode G1 may have a single layer including Mo.

[0065] The first gate insulating layer 103 is provided to insulate the semiconductor layer A1 from the first gate electrode G1 and may include silicon oxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), zinc oxide (ZnO2), etc.

[0066] With the first gate insulating layer 103 and the second gate insulating layer 105 interposed therebetween, the second gate electrode G2 is located on the semiconductor layer A2. The second gate electrode G2 may include a conductive material containing molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may have a single-layer or multi-layer structure. As an example, the second gate electrode G2 may have a single-layer structure including Mo or a multi-layer structure including Mo / Al / Mo.

[0067] The second gate insulating layer 105 may include an inorganic material containing an oxide and / or a nitride. For example, the second gate insulating layer 105 may include silicon oxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), and / or zinc oxide (ZnO2).

[0068] The source electrodes S1 and S2 and the drain electrodes D1 and D2 are arranged on the interlayer insulating layer 107. The source electrodes S1 and S2 and the drain electrodes D1 and D2 may each include a conductive material containing Mo, Al, Cu, Ti, etc., and may have a single-layer or multi-layer structure including the above materials. For example, the source electrodes S1 and S2 and the drain electrodes D1 and D2 may each have a multi-layer structure including Ti / Al / Ti.

[0069] The interlayer insulating layer 107 may include silicon oxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2), or zinc oxide (ZnO2), etc.

[0070] As described above, the first gate electrode G1 of the first thin film transistor T1 and the second gate electrode G2 of the second thin film transistor T2 may be located at different layers. Accordingly, the first thin film transistor T1 and the second thin film transistor T2 may have different operating ranges.

[0071] The first electrode CE1 of the storage capacitor Cst may include the same material at the same layer as the first gate electrode G1. With the second gate insulating layer 105 interposed therebetween, the second electrode CE2 of the storage capacitor Cst overlaps with the first electrode CE1. The second electrode CE2 may include the same material at the same layer as the second gate electrode G2.

[0072] In Figure 2In [the structure], the storage capacitor Cst does not overlap with the first thin film transistor T1 and the second thin film transistor T2. However, one or more embodiments are not limited thereto. For example, the storage capacitor Cst may overlap with the first thin film transistor T1. In some embodiments, the first electrode CE1 of the storage capacitor Cst may be integrally formed with the first gate electrode G1. That is, the first gate electrode G1 of the first thin film transistor T1 may also be used as (e.g., configured as) the first electrode CE1 of the storage capacitor Cst.

[0073] The planarization layer 109 is located on the source electrodes S1 and S2 and the drain electrodes D1 and D2, and the organic light emitting diode (OLED) 300 may be located on the planarization layer 109. The planarization layer 109 may include a single-layer or multi-layer structure including an organic material. The organic material may include or be at least one selected from general polymers (e.g., polymethyl methacrylate (PMMA) and / or polystyrene (PS)), polymer derivatives having a phenolic group, acrylic-based polymers, imide-based polymers, aryl ether-based polymers, amide-based polymers, fluoro-based polymers, parylene polymers, vinyl alcohol-based polymers, and blends thereof. Moreover, the planarization layer 109 may have a composite stacked structure including an inorganic insulating layer and an organic insulating layer.

[0074] The organic light emitting diode (OLED) 300 may be located on the planarization layer 109 in the display area DA of the substrate 100. The organic light emitting diode 300 may include a pixel electrode 310, a counter electrode 330, and an intermediate layer 320 located between the pixel electrode 310 and the counter electrode 330.

[0075] The pixel electrode 310 is in contact with one of the source electrode S1 and the drain electrode D1 of the first thin film transistor T1 through an opening formed in the planarization layer 109 to be electrically connected to the first thin film transistor T1. The pixel electrode 310 may be a reflective electrode. For example, the pixel electrode 310 may include a reflective layer including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and / or a compound thereof, and a transparent or semi-transparent electrode layer located on the reflective layer. The transparent or semi-transparent electrode layer may include at least one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide, and aluminum zinc oxide (AZO).

[0076] The pixel defining layer 112 may be located on the planarization layer 109. The pixel defining layer 112 includes openings corresponding to each sub-pixel (i.e., openings that at least expose the center of the pixel electrode 310) to define pixels. Moreover, the pixel defining layer 112 increases the distance between the edge of the pixel electrode 310 and the counter electrode 330 on the pixel electrode 310 to prevent (or protect from) the generation of an arc at the edge of the pixel electrode 310. The pixel defining layer 112 may include an organic material, for example, polyimide, hexamethyldisiloxane (HMDSO), etc.

[0077] The intermediate layer 320 of the organic light emitting diode 300 may include a low molecular weight organic material or a polymer material. When the intermediate layer 320 includes a low molecular weight material, the intermediate layer 320 may include a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), and / or an electron injection layer (EIL) in a single layer or multi-layer structure, and examples of the low molecular weight material may include copper phthalocyanine (CuPc), N,N'-bis(naphthalen-1-yl)-N,N'-diphenyl-benzidine (NPB), and tris(8-hydroxyquinoline) aluminum (Alq3). The above layers may be manufactured by a vacuum deposition method.

[0078] When the intermediate layer 320 includes a polymer material, the intermediate layer 320 may include an HTL and / or an EML. Here, the HTL may include poly(3,4-ethylenedioxythiophene) PEDOT, and the EML may include a poly(phenylene vinylene) (PPV)-based polymer material and a polyfluorene-based polymer material. The intermediate layer 320 may be obtained by a screen printing method, an inkjet printing method, a laser induced thermal imaging (LITI) method, a vacuum deposition method using a mask, etc.

[0079] However, the intermediate layer 320 is not limited thereto, but may have various structures. Additionally, the intermediate layer 320 may be formed integrally across the plurality of pixel electrodes 310, or may be patterned to correspond to each of the plurality of pixel electrodes 310.

[0080] As Figure 2 shown, the counter electrode 330 is disposed above the display area DA and may cover the display area DA. That is, the counter electrode 330 may be integrally provided across the plurality of organic light emitting diodes 300 to correspond to the plurality of pixel electrodes 310. In another embodiment, the counter electrode 330 may cover the display area DA and partially cover the non-display area PA. Hereinafter, for the convenience of description, the case where the counter electrode 330 covers the display area DA and partially covers the non-display area PA will be described in more detail.

[0081] The counter electrode 330 may be a transmissive electrode. For example, the counter electrode 330 may be a transparent electrode or a semi-transparent electrode, and may be set as a metal thin film including Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, and their compounds having a small work function. Moreover, a transparent conductive oxide (TCO) (such as ITO, IZO, ZnO, and / or In2O3) may be provided above the metal thin film.

[0082] Since the pixel electrode 310 is a reflective electrode and the counter electrode 330 is a transmissive electrode, the light emitted from the intermediate layer 320 is emitted toward the counter electrode 330, that is, top emission type. However, one or more embodiments are not limited thereto, and the light emitted from the intermediate layer 320 may be emitted toward the substrate 100, that is, bottom emission type. In this case, the pixel electrode 310 may be a transparent or semi-transparent electrode, and the counter electrode 330 may be a reflective electrode. Alternatively, the display device 1000 according to this embodiment may be a dual emission type in which light is emitted to the top surface and the bottom surface of the display device 1000.

[0083] The cover layer 400 may be located on the counter electrode 330. Here, the cover layer 400 may be in direct contact with the counter electrode 330. The cover layer 400 may have a refractive index lower than that of the counter electrode 330 and higher than that of the first inorganic encapsulation layer 510. When light is emitted from the intermediate layer 320 including the organic emission layer, the cover layer 400 may improve the optical efficiency by reducing the ratio of light that may not be emitted to the outside due to total reflection.

[0084] The cover layer 400 may include or be composed of an inorganic material. For example, the inorganic material may include or be zinc oxide, titanium oxide, zirconium oxide, silicon nitride, niobium oxide, tantalum oxide, tin oxide, nickel oxide, indium nitride, and / or gallium nitride.

[0085] The cover layer 400 may have a refractive index larger than that of the first inorganic encapsulation layer 510. For example, the refractive index of the cover layer 400 may be 0.24 or more larger than that of the first inorganic encapsulation layer 510. Here, when the difference between the refractive index of the cover layer 400 and the refractive index of the first inorganic encapsulation layer 510 is less than 0.24, a large amount of total reflection occurs at the boundary between the cover layer 400 and the first inorganic encapsulation layer 510, or light corresponding to the resonance frequency of the emission layer may not be transmitted, thereby reducing the brightness. In this case, the cover layer 400 may have a refractive index of 1.8 or more. As described above, when the refractive index of the cover layer 400 is less than 1.8, the light is reflected between the first inorganic encapsulation layer 510 and the cover layer 400, and the brightness of the emission layer is reduced.

[0086] Moreover, in the above case, the cover layer 400 may have or less thickness. More specifically, inFigure 2 The thickness of the cover layer 400 can be measured based on the Z-axis direction. Here, when the thickness of the cover layer 400 is greater than then it may consume a lot of time and energy to form the cover layer 400. In addition, when the thickness of the cover layer 400 is greater than then the light emitted from the emission layer may not be transmitted through the cover layer 400 or the wavelength of the light is variable, and thus, it may be difficult to obtain a clear picture.

[0087] The cover layer 400 can be deposited on the substrate 100 by an atomic layer deposition (ALD) method. In this case, the cover layer 400 can be formed using a mask. Such a mask can have openings to expose a part of the non-display area PA and the display area DA.

[0088] The density of the cover layer 400 can be greater than the density of the first inorganic encapsulation layer 510. In this case, when the cover layer 400 is at the surface of the barrier wall 120, the bonding force between the cover layer 400 and the barrier wall 120 can be greater than the bonding force between the first inorganic encapsulation layer 510 and the barrier wall 120. In this case, the cover layer 400 and the first inorganic encapsulation layer 510 may not peel off from the barrier wall 120 at the bent portion of the barrier wall 120. Therefore, the cover layer 400 is densely formed or arranged in the material on the surface of the barrier wall 120 (formed of or including an organic material) to be bonded to the surface of the barrier wall 120, and thus, the cover layer 400 may not be separated from the barrier wall 120 due to an external impact and / or external force applied thereto and the first inorganic encapsulation layer 510 may not be separated from the cover layer 400 due to an external impact and / or external force applied thereto.

[0089] The cover layer 400 can also shield the barrier wall 120. For example, compared with the outermost part of the barrier wall 120 to the edge (or end) of the substrate 100, the end of the cover layer 400 can be closer to the edge (or end) of the substrate 100 (or the cutting line CL). In this case, the end of the cover layer 400 can be located between the barrier wall 120 and the edge of the substrate 100. In another embodiment, the end of the cover layer 400 in the X-axis direction, for example, can be in the same position as the edge of the substrate 100 (or the cutting line CL or the end of the substrate 100). Hereinafter, for the convenience of description, the case where the end of the cover layer 400 is located between the barrier wall 120 and the edge of the substrate 100 will be described below.

[0090] As described above, when the end portion of the cover layer 400 is arranged to extend beyond the outside of the barrier wall 120 in, for example, the X-axis direction, channels (channels that allow external moisture and / or oxygen to be introduced into the display area DA between the cover layer 400 and the substrate 100 or between the cover layer 400 and another insulating layer) can be increased, and moisture and / or oxygen can be protected from or made more difficult to penetrate into the display area DA. In addition, since the cover layer 400 has a high density, the cover layer 400 can be firmly coupled to the substrate 100 or another layer, and thus, the cover layer 400 may not be separated from the substrate 100 or another layer. The thickness of the cover layer 400 may be less than the thickness of the first inorganic encapsulation layer 510. For example, the thickness of the cover layer 400 may be or less, and the first inorganic encapsulation layer 510 may have a thickness in the range of 1 μm to 1.5 μm. In particular, since the brightness and wavelength of the light emitted from the emission layer depend on the thickness of the cover layer 400, when the thickness of the cover layer 400 is greater than the thickness of the first inorganic encapsulation layer 510, the brightness of the light may be reduced or the wavelength of the light emitted from the emission layer may be changed according to the difference between the refractive index of the cover layer 400 and the refractive index of the first inorganic encapsulation layer 510. Therefore, the thickness of the cover layer 400 may be less than the thickness of the first inorganic encapsulation layer 510.

[0091] The thin film encapsulation layer 500 covers the display area DA and the non-display area PA to prevent (or protect from) the penetration of external moisture and / or oxygen. The thin film encapsulation layer 500 may include at least one organic encapsulation layer and at least one inorganic encapsulation layer. In Figure 2 the example, the thin film encapsulation layer 500 includes the first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 and one organic encapsulation layer 520, but the stacking order and the number of the stacked layers are not limited to the Figure 2 example.

[0092] The first inorganic encapsulation layer 510 covers the counter electrode 330 and may include silicon oxide, silicon nitride, and / or silicon oxynitride. If necessary, other layers such as the cover layer 400 may be provided between the first inorganic encapsulation layer 510 and the counter electrode 330. Since the first inorganic encapsulation layer 510 is arranged along its lower structure, as Figure 2As shown, the first inorganic encapsulation layer 510 may have an uneven upper surface. The organic encapsulation layer 520 covers the first inorganic encapsulation layer 510, and different from the first inorganic encapsulation layer 510, the organic encapsulation layer 520 may have a flat upper surface. More specifically, the organic encapsulation layer 520 may planarize the upper surface of the portion corresponding to the display area DA. The organic encapsulation layer 520 may include one or more materials selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, and hexamethyldisiloxane. The second inorganic encapsulation layer 530 covers the organic encapsulation layer 520, and may include silicon oxide, silicon nitride, and / or silicon oxynitride.

[0093] As described above, since the thin film encapsulation layer 500 includes the first inorganic encapsulation layer 510, the organic encapsulation layer 520, and the second inorganic encapsulation layer 530, even when cracks occur in the thin film encapsulation layer 500, the cracks can be disconnected between the first inorganic encapsulation layer 510 and the organic encapsulation layer 520 or between the organic encapsulation layer 520 and the second inorganic encapsulation layer 530 through the multi-layer structure. Thus, the generation of the penetration path of external moisture or oxygen to the display area DA and the non-display area PA can be prevented or reduced. The second inorganic encapsulation layer 530 contacts the first inorganic encapsulation layer 510 at its edge outside the display area DA (e.g., at the position where the organic encapsulation layer 520 ends), and the organic encapsulation layer 520 may not be exposed to the outside.

[0094] At least one of the first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 may be formed by a chemical vapor deposition method. Here, the end of at least one of the first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 may be the same as or different from the end of the cover layer 400. For example, in an embodiment, the end of at least one of the first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 may coincide with the end of the cover layer 400 (e.g., coincide in position or be the same along the X-axis direction). In another embodiment, compared to the end of the cover layer 400 with respect to the edge of the substrate 100, the end of at least one of the first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 may be closer to or farther from the edge of the substrate 100.

[0095] In particular, the ends of the first inorganic encapsulation layer 510 and the ends of the second inorganic encapsulation layer 530 may be the same as or different from each other (e.g., the same as or different from each other in position along the X-axis direction). In an embodiment, the end of the first inorganic encapsulation layer 510 may be closer to the edge of the substrate 100 than the end of the second inorganic encapsulation layer 530. In another embodiment, the end of the first inorganic encapsulation layer 510 may be the same as the end of the second inorganic encapsulation layer 530. Hereinafter, for convenience of description, the case where the end of the first inorganic encapsulation layer 510 is the same as the end of the second inorganic encapsulation layer 530 will be described in more detail.

[0096] In the above case, the first inorganic encapsulation layer 510 may be in direct contact with the covering layer 400 on the barrier wall 120. More specifically, the covering layer 400, the first inorganic encapsulation layer 510, and the second inorganic encapsulation layer 530 may be sequentially stacked on the barrier wall 120. In particular, since the barrier wall 120 has protrusions, tilting may occur, and holes (or recesses) may be formed between the planarization layer 109 and the barrier wall 120 or between a plurality of barrier walls 120. When the first inorganic encapsulation layer 510 is formed in a state where the covering layer 400 is not present in the holes, when an external force is applied to the barrier wall 120 or the region of the substrate 100 located inside (or defined by) the barrier wall 120, the first inorganic encapsulation layer 510 and the counter electrode 330 may be separated from each other, the barrier wall 120 and the first inorganic encapsulation layer 510 may be separated from each other, or the barrier wall 120 and the planarization layer 109 may be separated from each other. However, as described above, since the covering layer 400 is disposed above partial regions of the display area DA and the non-display area PA within the barrier wall 120, the first inorganic encapsulation layer 510 may not be in direct contact with the barrier wall 120, the planarization layer 109, and the counter electrode 330. In this case, due to the high density of the covering layer 400, the covering layer 400 may be firmly coupled to the barrier wall 120, the planarization layer 109, and the counter electrode 330, and thus, the covering layer 400 may not be separated from the barrier wall 120, the planarization layer 109, and the counter electrode 330. In addition, since both the first inorganic encapsulation layer 510 and the covering layer 400 include inorganic materials, the bonding force between the covering layer 400 and the first inorganic encapsulation layer 510 may be increased, and the first inorganic encapsulation layer 510 may not be separated from the covering layer 400. Therefore, as described above, when the covering layer 400 is on (or under) the lower surface of the first inorganic encapsulation layer 510, the peeling of the first inorganic encapsulation layer 510 may be reduced compared to the case where the covering layer 400 is not present on the non-display area PA located inside (or defined by) the barrier wall 120.

[0097] Moreover, as described above, since the ends of the covering layer 400, the first inorganic encapsulation layer 510, and the second inorganic encapsulation layer 530 are the same as each other in position, moisture and / or oxygen introduced into the display area DA can be effectively blocked.

[0098] The first line 116 is located at the same layer as the pixel electrode 310, and Figure 2 , may be arranged on the flat surface of the planarization layer 109 and the barrier wall 120. Here, the first line 116 may be formed simultaneously or synchronously with the pixel electrode 310 by using the same material as that included in the pixel electrode 310. In this case, the first line 116 may be connected to the opposite electrode 330, and by increasing the contact area with respect to the opposite electrode 330, the common voltage ELVSS may be stably supplied to the opposite electrode 330 through the second line 210. Then, at least a portion of the first line 116 may partially or entirely shield the second line 210. In particular, the first line 116 may cover the front surface of the second line 210 and may extend to the upper portion of some layers in the barrier wall 120.

[0099] In addition to the above, the second line 210, the barrier wall 120, and the cladding layer CCL are arranged in the non-display area PA of the substrate 100. The second line 210 may be a wiring for supplying power to the display area DA, and may be located at the same layer as the source electrodes S1 and S2 and the drain electrodes D1 and D2, and may include the same material as the source electrodes S1 and S2 and the drain electrodes D1 and D2. In some embodiments, the second line 210 may be connected to the opposite electrode 330 of the organic light emitting diode (OLED) 300 to transmit the common voltage ELVSS. In an embodiment, the second line 210 may be directly connected to the extended opposite electrode 330. In another embodiment, as Figure 2 As shown in , the second line 210 may be connected to the opposite electrode 330 via the first line 116. In this case, the first line 116 may be formed simultaneously or synchronously with the pixel electrode 310 by using the same material as that included in the pixel electrode 310. However, one or more embodiments are not limited thereto, that is, the second line 210 may be connected to the opposite electrode 330 in various ways. Hereinafter, for the convenience of description, the case where the second line 210 is connected to the opposite electrode 330 via the first line 116 will be described in more detail.

[0100] The barrier wall 120 may at least partially cover the second line 210. In some embodiments, the barrier wall 120 may cover the edge (or end) of the second line 210 away from the display area DA (or the far end relative to the display area DA), and may not cover the edge (or end) of the second line 210 close to the display area DA (or the near end relative to the display area DA). However, one or more embodiments are not limited thereto. That is, the barrier wall 120 may be variously modified, for example, the barrier wall 120 may cover the entire second line 210.

[0101] When forming the organic encapsulation layer 520 of the thin film encapsulation layer 500 for encapsulating the display area DA and the non-display area PA, the barrier wall 120 can prevent (or protect against) the organic material from flowing to the edge of the substrate 100 and prevent (or reduce) the generation of the edge tails of the organic encapsulation layer 520.

[0102] The barrier wall 120 includes a first barrier wall 120a and a second barrier wall 120b spaced apart from each other.

[0103] The first barrier wall 120a and the second barrier wall 120b can be arranged on the second line 210 in the non-display area PA, and one of the first barrier wall 120a and the second barrier wall 120b can cover the edge of the second line 210. Additionally, at least one of the first barrier wall 120a and the second barrier wall 120b can include multiple layers. In Figure 2 it, the first barrier wall 120a includes a first layer 121a containing the same material as the material of the planarization layer 109 and a second layer 123a containing the same material as the material of the pixel defining layer 112, and the second barrier wall 120b includes a first layer 121b containing the same material as the material of the planarization layer 109, a second layer 123b containing the same material as the material of the pixel defining layer 112, and a third layer 125b containing the same material as the material of the spacer 114. The spacer 114 can include an organic material such as polyimide, HMDSO, etc. However, one or more embodiments are not limited thereto. That is, one of the first barrier wall 120a and the second barrier wall 120b can have a single-layer structure, or both can have a double-layer structure, a triple-layer structure, etc. Moreover, the barrier wall 120 can also include an additional barrier wall spaced apart from the first barrier wall 120a and the second barrier wall 120b.

[0104] Because the barrier wall 120 includes multiple barrier walls, the overflow of the organic material during the formation of the organic encapsulation layer 520 can be effectively prevented.

[0105] The first line 116 connected to the second line 210 can extend to the upper part of the first layer 121b in the second barrier wall 120b. Accordingly, the contact area between the first line 116 and the second line 210 can be increased, and the contact resistance between the second line 210 and the first line 116 can be reduced. When the first layer 121b of the second barrier wall 120b includes the same material as the material of the planarization layer 109, it can be understood that the first line 116 is connected to the second line 210 via the through hole 109h penetrating the planarization layer 109.

[0106] The coating layer CCL is located on the substrate 100 to cover the slit SL. In another embodiment, the coating layer CCL may be formed on the buffer layer 101 on the substrate 100. Hereinafter, for the convenience of description, the case of forming the coating layer CCL on the substrate 100 will be described in more detail.

[0107] In an alternative embodiment, the width of the coating layer CCL may be greater than the width of the slit SL, and the length of the coating layer CCL may be greater than the length of the slit SL. Thus, the coating layer CCL can be completely embedded in the slit SL so as not to expose the slit SL.

[0108] The coating layer CCL may include various materials. That is, the coating layer CCL may include inorganic materials and / or organic materials.

[0109] In an alternative embodiment, the coating layer CCL may include an organic material. Thus, an appropriate width and thickness of the coating layer CCL can be easily obtained, and the slit SL can be easily covered.

[0110] In an alternative embodiment, the coating layer CCL may include the same material as the insulating layer (not shown) that can be formed in the non-display area PA of the substrate 100. In addition, the coating layer CCL may be formed simultaneously or synchronously with the insulating layer (not shown) that can be formed in the display area DA of the substrate 100. For example, the coating layer CCL may include the same material as the planarization layer 109 and / or the pixel defining layer 112.

[0111] The coating layer CCL may be formed in the non-display area PA.

[0112] In an alternative embodiment, the coating layer CCL may be disposed at the edge (or end) of the substrate 100 or on the boundary (or area) between the cutting line CL and the display area DA of the substrate 100, for example, in the X-axis direction.

[0113] The coating layer CCL may be elongated. That is, the coating layer CCL may extend in a direction parallel to the cutting line CL of the substrate 100 (or the long side or short side of the substrate 100) shown in Figure 1 or be elongated. Here, the coating layer CCL may have a variable length, and the length of the coating layer CCL may be greater than or less than the length of the display area DA.

[0114] The non-display area PA of the display device 1000 may include the slit SL. Here, the slit SL may be obtained by partially removing at least one of the inorganic layer and the organic layer on the substrate 100. The slit SL blocks cracks propagating from the edge of the substrate 100. For example, the slit SL adjacent to the cutting line CL of the substrate 100 can mainly prevent or block the propagation of cracks that may occur in the substrate 100 when the mother substrate is cut and divided into individual display devices 1000.

[0115] In particular, according to some embodiments, the slit SL may be formed on the buffer layer 101. In this case, the buffer layer 101 on the substrate 100 is disposed in the non-display area PA and / or may extend to the cutting line CL to protect the upper surface of the substrate 100. Additionally, due to the pressure applied to the buffer layer 101, the slit SL may block or reduce the occurrence or propagation of cracks that may occur in the buffer layer 101.

[0116] The capping layer CCL is formed on the slit SL. The capping layer CCL may prevent or reduce the movement of impurities and / or particles that may be generated on the slit SL. In an embodiment, the capping layer CCL may cover the slit SL to block or not expose the impurities and / or particles remaining in the slit SL.

[0117] When manufacturing the display device 1000, impurities and / or particles may be generated in the slit SL. For example, during the manufacture of the display device 1000, the conductive material used to form the electrodes may remain in the slit SL. The conductive material remaining in the slit SL may cause defects in the display device 1000 during post-processing. For example, the conductive material may move to the display area DA and cause electrical defects in the display area DA, which may deteriorate the electrical characteristics and image quality of the display device 1000.

[0118] The capping layer CCL is formed on the slit SL to prevent or reduce the movement of the remaining impurities and particles, and thus, may prevent or reduce the defects that may occur in the display area DA.

[0119] Moreover, the separation of the capping layer CCL from the substrate 100 may be prevented or reduced by the slit SL.

[0120] Additionally, in the method of manufacturing the display device 1000 as described above, the respective layers are formed on the substrate 100, and then the counter electrode 330 may be disposed on the display area DA and partially on the non-display area PA.

[0121] After forming the counter electrode 330, a cover layer 400 may be formed. Here, as described above, the cover layer 400 may be formed by using an ALD apparatus. In particular, the cover layer 400 may be formed by using a first mask M1 having a first opening OP1. The first opening OP1 may have an area larger than the area of the display region DA. In this case, when viewed in a plane, the boundary of the first opening OP1 may be disposed on the non-display region PA. The first deposition material that has passed through the first opening OP1 may be deposited on the substrate 100 to form the cover layer 400. In this case, the cover layer 400 may completely shield the counter electrode 330. Additionally, the cover layer 400 may completely shield the first line 116. As described above, the cover layer 400 shields the barrier wall 120 and may extend to the outside of the barrier wall 120. Here, the cover layer 400 formed on the substrate 100 may have an area larger than the area of the first opening OP1.

[0122] After forming the cover layer 400, a first inorganic encapsulation layer 510, an organic encapsulation layer 520, and a second inorganic encapsulation layer 530 may be sequentially formed. Here, the first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 may be formed by using a chemical vapor deposition apparatus. In this case, masks having openings with different sizes from each other may be used to form the first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530. In another embodiment, masks having openings of the same size as each other may be used to form the first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530. Hereinafter, for convenience of description, the case of forming the first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 by using a second mask M2 having a second opening OP2 will be described in more detail. The organic encapsulation layer 520 may be formed by using a third mask M3 having a third opening OP3. Here, the third opening OP3 may be smaller (in area) than the second opening OP2, and the boundary of the third opening OP3 may be closer to the display region DA than the innermost side of the barrier wall 120 with respect to the display region DA.

[0123] When forming the first inorganic encapsulation layer 510 by using the second mask M2, the first inorganic encapsulation layer 510 may have an area equal to the area of the cover layer 400 in, for example, the X-axis direction. In this case, when viewed in a plane, the area of the second opening OP2 may be equal to the area of the first opening OP1, and the boundary of the second opening OP2 and the boundary of the first opening OP1 may be the same as each other. Here, the end of the cover layer 400 may be in the same position as the end of the first inorganic encapsulation layer 510.

[0124] Accordingly, in the display device 1000, when an external impact is applied thereto, peeling of the cover layer 400 from another layer can be prevented or reduced, and separation of the first inorganic encapsulation layer 510 from the cover layer 400 can be prevented or reduced. Moreover, in the display device 1000, the permeation path through which moisture and / or oxygen must travel can be increased, and the lifespan of the display device 1000 can be increased.

[0125] In the display device 1000, reduction in brightness can be prevented by the cover layer 400, and in addition, light of a designed wavelength or a desired wavelength can be guided to the outside of the display device 1000.

[0126] In the display device 1000, the first inorganic encapsulation layer 510 and the cover layer 400 can be firmly coupled to each other.

[0127] Figure 4 is a cross-sectional view of a display device 1000 according to another embodiment. In Figure 4 , the same reference numerals denote the same elements as those in Figure 2 and a detailed description thereof will be omitted.

[0128] Referring to Figure 4 , the cover layer 400, the first inorganic encapsulation layer 510, and the second inorganic encapsulation layer 530 can be formed or extended to the cutting line CL of the substrate 100. In this case, the ends of the cover layer 400, the ends of the first inorganic encapsulation layer 510, and the ends of the second inorganic encapsulation layer 530 can be the same in position, for example, in the X-axis direction.

[0129] In the above case, since the cover layer 400, the first inorganic encapsulation layer 510, and the second inorganic encapsulation layer 530 are formed on the surface of the substrate 100, the path required for oxygen and / or moisture to reach the display area DA from the side surface of the substrate 100 can be increased. In addition, since the first inorganic encapsulation layer 510 is on the cover layer 400 on the surface of the substrate 100, and when the cover layer 400 includes an inorganic material, the cover layer 400 has a texture similar to that of the first inorganic encapsulation layer 510, the first inorganic encapsulation layer 510 may not be separated from the cover layer 400 on the front surface of the substrate 100.

[0130] Figure 5 is a cross-sectional view of a display device 1000 according to another embodiment. In Figure 5 , the same reference numerals denote the same elements as those in Figure 2 and a detailed description thereof will be omitted.

[0131] Referring to Figure 5 , as referred to above with reference to Figure 2As described above, in the display device 1000, the ends of the cover layer 400, the first inorganic encapsulation layer 510, and the second inorganic encapsulation layer 530 may be disposed between the ends of the barrier rib 120 and the substrate 100. In this case, at least two of the ends of the cover layer 400, the ends of the first inorganic encapsulation layer 510, and the ends of the second inorganic encapsulation layer 530 may be located at different positions from each other, for example, in the X-axis direction.

[0132] For example, in an embodiment, the end of the cover layer 400 and the end of the first inorganic encapsulation layer 510 may be located at different positions from each other. In another embodiment, the end of the cover layer 400 and the end of the second inorganic encapsulation layer 530 may be located at different positions from each other. In another embodiment, the end of the cover layer 400 may be located at a different position from the end of the first inorganic encapsulation layer 510 and may also be located at a different position from the end of the second inorganic encapsulation layer 530. Hereinafter, for ease of description, the case where the end of the cover layer 400 is located at a different position from the end of the first inorganic encapsulation layer 510 will be described.

[0133] The end of the cover layer 400 may be located within the area defined by the end of the first inorganic encapsulation layer 510. In this case, the end of the cover layer 400 may be completely shielded from the outside by the first inorganic encapsulation layer 510.

[0134] In the above case, since the end of the cover layer 400 is completely blocked by the first inorganic encapsulation layer 510, separation of the end of the cover layer 400 from the first inorganic encapsulation layer 510 can be prevented or reduced.

[0135] In addition, penetration of moisture and / or oxygen through the space between the end of the cover layer 400 and the first inorganic encapsulation layer 510 can be prevented or reduced, thereby increasing the lifespan of the display area DA. In the above case, the end of the second inorganic encapsulation layer 530 may be located at the same position as the end of the first inorganic encapsulation layer 510, or may be located on the outside of the substrate 100 outside the end of the first inorganic encapsulation layer 510.

[0136] Figure 6 is a cross-sectional view of a display device 1000 according to another embodiment. In Figure 6 , the same reference numerals as Figure 2 and Figure 5 denote the same elements, and their detailed descriptions are omitted.

[0137] Referring to Figure 6 as described above with reference to Figure 5As described above, in the display device 1000, the ends of the cover layer 400, the first inorganic encapsulation layer 510, and the second inorganic encapsulation layer 530 may be disposed between the ends of the barrier rib 120 and the substrate 100. The end of the cover layer 400 may be located at a position different from the end of the first inorganic encapsulation layer 510 (i.e., the end of the cover layer 400 may be located at a position different from the position of the end of the first inorganic encapsulation layer 510). More specifically, the end of the cover layer 400 may extend more outwardly than the extension of the end of the first inorganic encapsulation layer 510 in, for example, the X-axis direction. That is, in the X-axis direction, for example, the end of the cover layer 400 may be farther from the barrier rib 120 than the end of the first inorganic encapsulation layer 510 is from the barrier rib 120.

[0138] In the above case, the end of the first inorganic encapsulation layer 510 may be located on the upper surface of the cover layer 400. In an embodiment, the end of the cover layer 400 may be located at the same position as the end of the second inorganic encapsulation layer 530 in, for example, the X-axis direction. In another embodiment, the end of the cover layer 400 may be farther from the barrier rib 120 than the end of the second inorganic encapsulation layer 530 is from the barrier rib 120. In another embodiment, the ends of the first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 may be the same in position such that the end of the second inorganic encapsulation layer 530 may be closer to the barrier rib 120 than the end of the cover layer 400 is relative to the barrier rib 120. Hereinafter, for convenience of description, the case where the ends of the first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 are located at the same position as each other will be described in more detail.

[0139] When the cover layer 400 and the first inorganic encapsulation layer 510 are arranged as described above, the first inorganic encapsulation layer 510 may be firmly coupled to the cover layer 400. In particular, the end of the first inorganic encapsulation layer 510 is firmly coupled to the cover layer 400, and thus, the penetration of moisture and / or oxygen between the cover layer 400 and the end of the first inorganic encapsulation layer 510 may be prevented or reduced.

[0140] Figure 7 is a cross-sectional view of a display device 1000 according to another embodiment. In Figure 7 in, the same reference numerals as Figure 2 denote the same elements, and their detailed descriptions are omitted.

[0141] Referring to Figure 7, the barrier wall 120 may at least partially cover the second line 210. In some embodiments, the barrier wall 120 may cover an edge (or end) of the second line 210 that is away from the display area DA (or the distal end relative to the display area DA), and may not cover an edge (or end) of the second line 210 that is close to the display area DA (or the proximal end relative to the display area DA). However, one or more embodiments are not limited thereto. That is, various modifications may be made to the barrier wall 120. For example, the barrier wall 120 may cover the entire second line 210.

[0142] When forming the organic encapsulation layer 520 of the thin film encapsulation layer 500 for encapsulating the display area DA and the non-display area PA, the barrier wall 120 may prevent or reduce the flow of the organic material to the edge of the substrate 100 and prevent or block the generation of the edge tails of the organic encapsulation layer 520.

[0143] The barrier wall 120 includes multiple layers. Among the multiple layers, the first layer 121 includes the same material as the planarization layer 109, and the second layer 123 on the first layer 121 may include the same material as the pixel defining layer 112. As described above, the planarization layer 109 and the pixel defining layer 112 may include an organic material, and this organic material has a more excellent (or better) adhesion to metal compared to the adhesion of the inorganic material included in the interlayer insulating layer 107 to metal.

[0144] Therefore, since the barrier wall 120 is formed to overlap with the edge of the second line 210 including a metal material, the barrier wall 120 can be stably formed with excellent adhesion. In Figure 7 , the barrier wall 120 includes multiple layers, but the barrier wall 120 may have a single-layer structure. In this case, the barrier wall 120 may include the same material as the planarization layer 109 or the pixel defining layer 112.

[0145] Figure 8 is a cross-sectional view of a display device 1000 according to another embodiment. In Figure 8 In, the same reference numerals as Figure 2 denote the same elements, and their detailed descriptions are omitted.

[0146] Referring to Figure 8 , the first line 116 connected to the second line 210 may extend to the upper part of the first layer 121 in the barrier wall 120. Accordingly, the contact area between the first line 116 and the second line 210 can be increased, and the contact resistance between the second line 210 and the first line 116 can be reduced. When the first layer 121 of the barrier wall 120 includes the same material as the material of the planarization layer 109, it can be understood that the first line 116 is connected to the second line 210 via a through hole 109h that penetrates the planarization layer 109.

[0147] As the first line 116 extends to the upper part of the first layer 121 in the barrier wall 120, the barrier wall 120 may have a structure in which the first layer 121, the first line 116, and the second layer 123 are stacked in sequence.

[0148] The cover layer 400 may be located on the substrate 100 to shield the counter electrode 330. Here, similar to that shown in Figure 4 , in Figure 8 , the cover layer 400 may extend to the cutting line CL of the substrate 100. Here, the first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 may be sequentially formed on the upper surface of the cover layer 400 in the same area or region as the area or region (e.g., in the X-axis direction) where the cover layer 400 is formed.

[0149] However, the positions of the cover layer 400, the first inorganic encapsulation layer 510, and the second inorganic encapsulation layer 530 are not limited thereto, that is, the cover layer 400, the first inorganic encapsulation layer 510, and the second inorganic encapsulation layer 530 may be arranged as shown in the examples shown in Figure 2 , Figure 5 and Figure 6 .

[0150] Figure 9 is a cross-sectional view of a display device 1000 according to another embodiment. In Figure 9 , the same reference numerals as in Figure 2 represent the same elements, and their detailed descriptions are omitted.

[0151] Referring to Figure 9 , the display device 1000 may further include a spacer 114 located on the pixel defining layer 112. The barrier wall 120 includes a first barrier wall 120a and a second barrier wall 120b spaced apart from each other. Moreover, in the non-display area PA, the spacer 114 may be further arranged on the pixel defining layer 112. The spacer 114 protrudes from the pixel defining layer 112 toward the thin film encapsulation layer 500 and prevents or blocks defects caused by mask indentation or the like during the manufacturing process. The spacer 114 may include an organic material such as polyimide, HMDSO, etc.

[0152] The first barrier wall 120a and the second barrier wall 120b may be arranged on the second line 210 in the non-display area PA, and one of the first barrier wall 120a and the second barrier wall 120b may cover the edge of the second line 210. Additionally, at least one of the first barrier wall 120a and the second barrier wall 120b may include multiple layers. In Figure 9In [the figure], the first barrier wall 120a includes a first layer 121a containing a material identical to that of the planarization layer 109 and a second layer 123a containing a material identical to that of the pixel definition layer 112, and the second barrier wall 120b includes a first layer 121b containing a material identical to that of the planarization layer 109, a second layer 123b containing a material identical to that of the pixel definition layer 112, and a third layer 125b containing a material identical to that of the spacer 114. However, one or more embodiments are not limited thereto. That is, one of the first barrier wall 120a and the second barrier wall 120b may have a single-layer structure, or both may have a double-layer structure, a triple-layer structure, etc. Moreover, the barrier wall 120 may further include an additional barrier wall spaced apart from the first barrier wall 120a and the second barrier wall 120b.

[0153] Since the barrier wall 120 includes a plurality of barrier walls, the overflow of the organic material during the formation of the organic encapsulation layer 520 can be effectively prevented.

[0154] The barrier wall 120 is not limited to the above examples. That is, as Figure 7 and Figure 8 shown, a single barrier wall may be formed.

[0155] The first line 116 may at least partially contact the second line 210. Here, the first line 116 may not completely shield the second line 210.

[0156] The cover layer 400 may shield the spacer 114 and the barrier wall 120. Here, similar to the example of Figure 2 , the end of the cover layer 400 may be located between the outermost part of the barrier wall 120 and the cutting line CL of the substrate 100. Moreover, the first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 may be disposed in the same region as the cover layer 400.

[0157] However, the positions of the cover layer 400, the first inorganic encapsulation layer 510, and the second inorganic encapsulation layer 530 are not limited thereto. That is, the cover layer 400, the first inorganic encapsulation layer 510, and the second inorganic encapsulation layer 530 may be arranged as Figure 4 , Figure 5 and Figure 6 shown in the example.

[0158] Figure 10 is a cross-sectional view of a display device 1000 according to another embodiment. In Figure 10 in, the same reference numerals as in Figure 2 denote the same elements, and their detailed descriptions are omitted.

[0159] Referring to Figure 10, the first line 116 connected to the second line 210 can extend to the upper part of the first layer 121b in the second barrier wall 120b. Accordingly, the contact area between the first line 116 and the second line 210 can be increased, and the contact resistance between the second line 210 and the first line 116 can be reduced. When the first layer 121b of the second barrier wall 120b includes the same material as that of the planarization layer 109, it can be understood that the first line 116 is connected to the second line 210 via the through hole 109h penetrating the planarization layer 109.

[0160] As the first line 116 extends to the upper part of the first layer 121b in the second barrier wall 120b, the second barrier wall 120b can have a structure in which the first layer 121b, the first line 116, the second layer 123b, and the third layer 125b are stacked in sequence.

[0161] In Figure 10 , the first barrier wall 120a can be located on the first line 116 in the through hole 109h of the planarization layer 109. In this case, the first layer 121a of the first barrier wall 120a can include the same material as the planarization layer 109 and can be formed synchronously with the planarization layer 109, and the second layer 123a can include the same material as the pixel defining layer 112 and can be formed simultaneously or synchronously with the pixel defining layer 112.

[0162] In the above structure, the contact resistance between the first line 116 and the second line 210 can be reduced, and at the same time, a plurality of barrier walls can be formed. Since there are a plurality of barrier walls, when the organic encapsulation layer 520 is formed, the overflow of the organic material can be effectively prevented.

[0163] The cover layer 400 can shield the spacer 114 and the barrier wall 120. Here, similar to the example of Figure 4 , the end of the cover layer 400 can extend to the cutting line CL of the substrate 100. The first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 can be disposed in the same region as the cover layer 400.

[0164] However, the positions of the cover layer 400, the first inorganic encapsulation layer 510, and the second inorganic encapsulation layer 530 are not limited thereto, that is, the cover layer 400, the first inorganic encapsulation layer 510, and the second inorganic encapsulation layer 530 can be arranged as in the examples shown in Figure 2 , Figure 5 and Figure 6 .

[0165] Figure 11 is a cross-sectional view of the display device 1000 according to another embodiment. In Figure 11 , the same reference numerals as those in Figure 2 represent the same elements, and their detailed descriptions are omitted.

[0166] Reference Figure 11 , the display device 1000 may not include a cover layer CCL and a slit SL. In this case, the cover layer 400 may be formed as shown in Figure 2 , and the end of the cover layer 400 may be closer to the display area DA than the cutting line CL of the substrate 100.

[0167] The first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 may be disposed in the same region as the cover layer 400.

[0168] However, the positions of the cover layer 400, the first inorganic encapsulation layer 510, and the second inorganic encapsulation layer 530 are not limited thereto, that is, the cover layer 400, the first inorganic encapsulation layer 510, and the second inorganic encapsulation layer 530 may be arranged as Figure 2 , Figure 5 and Figure 6 shown in the examples.

[0169] In addition to the above cases, as shown in Figure 9 and Figure 10 , spacers 114 may be disposed on the pixel defining layer 112. In this case, similar to the examples of Figure 9 and Figure 10 , the barrier rib 120 may include a third layer 125b containing the same material as the spacers 114.

[0170] Here, the barrier rib 120 of this embodiment is not limited to the example shown in the figure, but the barrier rib 120 may be the same as or similar to the Figures 2 to 10 barrier rib 120.

[0171] Figure 12 is a cross-sectional view of a display device 1000 according to another embodiment. In Figure 12 , the same reference numerals as in Figure 2 denote the same elements, and their detailed descriptions are omitted.

[0172] Reference Figure 12 , the display device 1000 may not include a cover layer CCL and a slit SL. Here, as shown in Figure 4 , the cover layer 400 may extend to the cutting line CL of the substrate 100. The end of the cover layer 400 may be the same as the cutting line CL of the substrate 100. Moreover, the first inorganic encapsulation layer 510 and the second inorganic encapsulation layer 530 may be disposed in the same region as the cover layer 400.

[0173] However, the positions of the cover layer 400, the first inorganic encapsulation layer 510, and the second inorganic encapsulation layer 530 are not limited thereto, that is, the cover layer 400, the first inorganic encapsulation layer 510, and the second inorganic encapsulation layer 530 may be arranged as Figure 2 , Figure 5 andFigure 6 the example shown in

[0174] In addition to the above cases, as Figure 9 and Figure 10 in the example shown in, spacers 114 may be arranged on the pixel defining layer 112. In this case, similar to the example of Figure 9 and Figure 10 the barrier wall 120 may include a third layer 125b containing the same material as the spacers 114.

[0175] Here, the barrier wall 120 of this embodiment is not limited to the example shown in the figure, but the barrier wall 120 may be the same as or similar to the barrier wall 120 of Figures 2 to 11

[0176] According to one or more embodiments, the display device 1000 can reduce the non-display area PA and can reduce the penetration of moisture and oxygen.

[0177] In the display device 1000 according to one or more embodiments, separation of the thin film encapsulation layer 500 from the barrier wall 120 can be prevented or reduced at the portion where the barrier wall 120 is arranged.

[0178] According to one or more embodiments, a clear image displayed by the display device 1000 can be achieved.

[0179] It should be understood that the embodiments described herein should be considered only in a descriptive sense and not for purposes of limitation. The description of features or aspects within each embodiment should generally be considered available for other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, those of ordinary skill in the art will understand that various changes may be made in form and detail without departing from the scope and spirit defined in the appended claims and their equivalents.

Claims

1. A display device, comprising: a substrate including a display area for displaying an image and a non-display area adjacent to the display area; a thin film encapsulation layer including a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer disposed on the substrate; a barrier wall disposed on the non-display area; and a cover layer disposed between the substrate and the thin film encapsulation layer in a first direction, wherein the cover layer, the first inorganic encapsulation layer, and the second inorganic encapsulation layer are sequentially stacked outside the barrier wall and in a region away from the barrier wall in a second direction perpendicular to the first direction.

2. The display device according to claim 1, wherein the cover layer includes an inorganic material.

3. The display device according to claim 2, wherein The inorganic material includes at least one selected from SiN x , TiO x , ZrO x , and HfO x .

4. The display device according to claim 1, wherein in a second direction perpendicular to the first direction, an end of the cover layer is closer to the barrier wall than an end of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer with respect to the barrier wall.

5. The display device according to claim 1, wherein in a second direction perpendicular to the first direction, an end of the cover layer is farther from the barrier wall than an end of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer with respect to the barrier wall.

6. The display device according to claim 1, wherein in a second direction perpendicular to the first direction, an end of the cover layer is in the same position as an end of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer.

7. The display device according to claim 1, wherein in a second direction perpendicular to the first direction, at least one of an end of the cover layer, an end of the first inorganic encapsulation layer, and an end of the second inorganic encapsulation layer is in the same position as an end of the substrate.

8. The display device according to claim 1, wherein the barrier wall includes: a first barrier wall disposed on the non-display area; and a second barrier wall disposed on the non-display area, the second barrier wall being spaced apart from the first barrier wall.

9. The display device according to claim 1, wherein the cover layer has a refractive index of 1.8 or greater.

10. The display device according to claim 2, wherein the density of the cover layer is greater than the density of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer.

11. The display device according to claim 2, wherein The covering layer has a thickness of or less.

12. A display device, comprising: a substrate including a display area for displaying an image and a non-display area adjacent to the display area; a thin film encapsulation layer including a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked on the substrate in a first direction; a barrier wall disposed on the non-display area; A coating layer, the coating layer being located on the substrate, and an end portion of the coating layer facing the substrate in a second direction perpendicular to the first direction being spaced apart from the barrier wall; and A cover layer, the cover layer being located between the substrate and the thin film encapsulation layer in the first direction, the cover layer being at least partially located between the barrier wall and the coating layer in the second direction, wherein the coating layer covers end portions of a gate insulating layer and an interlayer insulating layer.

13. The display device according to claim 12, wherein, the cover layer includes an inorganic material.

14. The display device according to claim 13, wherein, The inorganic material includes at least one selected from SiN x , TiO x , ZrO x , and HfO x .

15. The display device according to claim 12, wherein, an end portion of the cover layer is located between the barrier wall and the coating layer in the second direction.

16. The display device according to claim 12, wherein, in the second direction, an end portion of the cover layer and an end portion of the substrate are in the same position as each other.

17. The display device according to claim 12, wherein, the end portion of the cover layer is located at a position different from an end portion of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer in the second direction, or the end portion of the cover layer is located at the same position as an end portion of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer in the second direction.

18. The display device according to claim 12, wherein, the cover layer, the first inorganic encapsulation layer, and the second inorganic encapsulation layer are sequentially stacked on a region in the second direction between the barrier wall and an end portion of the substrate in the first direction.

19. The display device according to claim 13, wherein, a density of the cover layer is greater than a density of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer.

20. The display device according to claim 13, wherein, The covering layer has a thickness of or less.

21. A display device, comprising: A substrate, the substrate including a display region for displaying an image and a non-display region adjacent to the display region; A thin film encapsulation layer, the thin film encapsulation layer including a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked on the substrate; A barrier wall, the barrier wall being located on the non-display region; and A cover layer, the cover layer being located between the substrate and the thin film encapsulation layer, the cover layer covering an entire surface of the barrier wall, wherein the cover layer includes an inorganic material, and the cover layer is in direct contact with an entire surface of the first inorganic encapsulation layer.

22. The display device according to claim 21, wherein, a density of the cover layer is greater than a density of at least one of the first inorganic encapsulation layer and the second inorganic encapsulation layer.

23. The display device according to claim 21, wherein, The covering layer has a thickness of or less.

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