Wafer double-bearing lifting and wobbling mechanism

Abstract

The application belongs to the field of semiconductor chip processing equipment, and particularly relates to a wafer double-bearing lifting and wobbling mechanism, which solves the defect of uneven chip corrosion of a stress corrosion removing machine in the prior art and comprises a wobbling motor, a rotating shaft, wobbling sliding mechanisms, connecting pieces and a wafer box bracket. The two wobbling sliding mechanisms are symmetrically arranged on the two sides of the wafer box bracket and connected with the wafer box bracket through the connecting pieces. The wobbling motor is connected with the rotating shaft, and the rotating shaft is connected with the wobbling sliding mechanisms. The wobbling is stable, the stress is uniform, the quality of the processed wafer is better, and the efficiency is higher.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor chip processing equipment, and specifically relates to a wafer dual-bearing lifting and throwing mechanism. Background Technology

[0002] In the manufacturing process of semiconductor integrated circuits, semiconductor wafers typically undergo multiple process steps such as thin film deposition, etching, and polishing. These process steps become important sites for contamination. To maintain the cleanliness of the wafer surface and eliminate contaminants deposited during each process step, the wafer surface must be cleaned after each step. Therefore, cleaning is the most common process step in integrated circuit manufacturing, aiming to effectively control the contamination level at each step to achieve the objectives of each process.

[0003] In wet etching and wet cleaning processes, a large amount of chemical solutions are used. These solutions utilize their corrosive properties to remove specific materials or contaminants. In single-wafer wet etching equipment, a spray arm structure is used to spray chemical solutions onto the rotating wafer surface to achieve etching or cleaning.

[0004] During etching and cleaning, wafers are typically placed directly in a non-flowing etching solution. The wafer basket is manually agitated to ensure uniform etching. This method results in inconsistent product yields and is prone to acid splashing, posing a safety risk. The large size and weight of 8-inch and 12-inch wafers, along with their bulky wafer cassettes, make it difficult for domestic cleaning equipment technology to accommodate wafers larger than 8 inches. Adding a slinging mechanism is even more challenging. Traditional single-bearing lifting and slinging mechanisms for 6-inch and smaller wafers cannot provide the uniform up-and-down slinging required for 12-inch wafers. Because 6-inch and smaller chips and their corresponding baskets are relatively lightweight, single-bearing lifting and slinging mechanisms do not cause significant edge shaking or tilting during chip slinging, resulting in satisfactory flatness and uniformity after electroplating. However, for 6-inch and larger wafers, especially 12-inch chips and their baskets, the weight of single-bearing lifting mechanisms leads to significant edge shaking and tilting (see...). Figure 5 This results in a thicker coating at the edges, which fails to meet the required flatness and uniformity.

[0005] How to produce large-diameter chips with high quality and high efficiency is a technical problem that urgently needs to be solved in the current technology. Summary of the Invention

[0006] To address the shortcomings of existing stress-relief etching machines with single-bearing lifting and throwing mechanisms, which cause significant vibration and tilting at the edges when throwing large-diameter chips, resulting in thicker coatings at the edges and failing to meet the required flatness and uniformity, leading to poor chip performance, this invention provides an automated wafer dual-bearing lifting and throwing mechanism. The technical solution adopted by this invention to solve its technical problem is as follows: A wafer dual-bearing lifting and throwing mechanism includes a throwing motor, a rotating shaft, a throwing sliding mechanism, a connecting piece, and a wafer cassette holder. Two throwing sliding mechanisms are symmetrically arranged on both sides of the wafer cassette holder and connected to the wafer cassette holder via connecting pieces. The throwing motor is connected to the rotating shaft, and the rotating shaft is connected to the throwing sliding mechanism. Each throwing sliding mechanism includes a connecting rod, a slide rail, a rotating connecting rod, a bearing fixing block, a bearing pin, a cam, and a bearing. Two sets of connecting rods and slide rails are provided. The rotating connecting rod is fastened to a slider nested on the left and right slide rails by screws. The lower parts of the two connecting rods are respectively connected to the rotating connecting rod. The rod is fixed by bolts; the bearing is passed through by the bearing pin and sandwiched between two bearing fixing blocks to form a bearing assembly. The bearing assembly is fixedly connected to the bottom end of the rotating connecting rod, and the bearing does not contact the rotating connecting rod; the bearing fixing block is held firmly on the bearing pin by a retaining ring to prevent it from loosening. The cam contacts the bearing. The cam is an eccentric wheel with its axis fixed on the rotating shaft. The edge of the cam is concave, and the bearing is located exactly in the concave area. When the cam rotates, it pushes the bearing, and the bearing drives the rotating connecting rod fixed on the bearing assembly to move up and down in the slide rail. The rotating connecting rod is fixedly connected to the connecting rod, and the connecting rod drives the connecting piece, thereby driving the disc tray bracket to move up and down.

[0007] Preferably, the device further includes a throwing mechanism sealing box, a sealing seat, and a sealing cap. The throwing mechanism sealing box is nested outside the throwing sliding mechanism. A through hole is provided at the top of the throwing mechanism sealing box at a position corresponding to the slide rail. The slide rail passes through the through hole at the top of the throwing mechanism sealing box and is sealed to the throwing mechanism sealing box through the sealing seat. Shaft holes are provided at the bottom of both sides of the throwing mechanism sealing box. The rotating shaft passes through the shaft holes, penetrates the throwing mechanism sealing box, and is sealed by the sealing cap.

[0008] It also includes a projectile motor bracket and a coupling; the projectile motor is mounted on the projectile motor bracket, and its power shaft is connected to the rotating shaft through the coupling to form a straight line.

[0009] It also includes a connecting shaft, which is located between the projectile motor and the rotating shaft and is connected to the projectile motor and the rotating shaft via a coupling.

[0010] The beneficial effects of this invention are as follows: The invention employs a dual-bearing lifting and throwing mechanism, causing the two sides of the flower basket to perform equal up-and-down throwing motions. This results in a relatively uniform up-and-down throwing motion of the chip, ensuring a consistent speed at different throwing positions and guaranteeing uniform chip plating. The throwing amplitude of this mechanical structure is 50mm, making it suitable for manufacturing large-diameter chips. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of Example 1;

[0012] Figure 2 Schematic diagram of cross-sectional structure in Example 1;

[0013] Figure 3 Example 1: Schematic diagram of the throwing and sliding mechanism

[0014] Figure 4 This is a schematic diagram illustrating the operating principle of the wafer dual-bearing lifting and throwing mechanism of the present invention;

[0015] Figure 5 Background technology structural diagram.

[0016] In the attached diagram: 1-Agitator motor, 2-Agitator motor bracket, 3-Motor coupling, 4-Sealing cover, 5-Connecting shaft, 6-Rotating shaft coupling 2, 7-Agitator mechanism sealing box, 8-Sealing seat, 9-Sealing cover 4, 10-Agitator sliding mechanism, 11-Rotating shaft; 12-Connecting piece, 13-Plate box bracket, 14-Connecting rod, 15-Slide rail, 16-Left rotation connecting rod, 17-Bearing fixing block, 18-Bearing pin, 19-Cam, 20-Bearing, 21-Motor power shaft. Detailed Implementation

[0017] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0018] Example 1:

[0019] See Figures 1-4 A schematic diagram of the wafer dual-bearing lifting and throwing mechanism in this embodiment:

[0020] A wafer dual-bearing lifting and throwing mechanism includes a throwing motor 1, a rotating shaft 11, a throwing sliding mechanism 10, a connecting piece 12, and a wafer cassette holder 13. Two throwing sliding mechanisms 10 are symmetrically arranged on both sides of the wafer cassette holder 13 and connected to the wafer cassette holder 13 via the connecting piece 12. The throwing motor 1 is connected to the rotating shaft 11, and the rotating shaft 11 is connected to the throwing sliding mechanism 10. The throwing sliding mechanism 10 includes a connecting rod 14, a slide rail 15, a rotating connecting rod 16, a bearing fixing block 17, a bearing pin 18, a cam 19, and a bearing 20. The connecting rod 14 and the slide rail 15 are two sets. The rotating connecting rod 16 is fastened to a slider nested on the left and right slide rails 15 by screws. The lower parts of the two connecting rods 14 are respectively fixed to the rotating connecting rod 16 by bolts. After the bearing 20 is passed through the bearing pin 18, it is sandwiched in the middle by two bearing fixing blocks 17 to form a bearing assembly. The bearing assembly is fixedly connected to the bottom end of the rotating connecting rod 16, and the bearing 20 does not contact the rotating connecting rod 16. The bearing fixing block 17 is held firmly on the bearing pin 18 by a retaining ring to prevent it from loosening. The cam 19 contacts the bearing 20. The cam 19 is an eccentric wheel, and its axis is fixed on the rotating shaft 11. The edge of the cam 19 is concave, and the bearing 20 is located exactly in the concave part. When the cam 19 rotates, it pushes the bearing 20. The bearing 20 drives the rotating connecting rod 16 fixed on the bearing assembly to move up and down in the slide rail 15. The rotating connecting rod 16 is fixedly connected to the connecting rod 14. The connecting rod 14 drives the connecting piece 12, thereby driving the disc tray bracket 13 to move up and down.

[0021] Preferably, the device further includes a throwing mechanism sealing box 7, a sealing seat 8, and a sealing cap 9. The throwing mechanism sealing box 7 is nested outside the throwing sliding mechanism 10. A through hole is provided at the top of the throwing mechanism sealing box 7 at a position corresponding to the slide rail 15. The slide rail 15 passes through the through hole at the top of the throwing mechanism sealing box 7 and is sealed to the throwing mechanism sealing box 7 through the sealing seat 8. Shaft holes are provided at the bottom of both sides of the throwing mechanism sealing box 7. The rotating shaft 11 passes through the shaft holes, penetrates the throwing mechanism sealing box 7, and is sealed by the sealing cap 9.

[0022] It also includes a projectile motor bracket 2 and a coupling; the projectile motor 1 is mounted on the projectile motor bracket 2, so that its power shaft 21 is connected to the rotating shaft 11 in a straight line through the coupling.

[0023] It also includes a connecting shaft 5, which is located between the projectile motor 1 and the rotating shaft 11. It is connected to the projectile motor 1 through the motor coupling 3 and to the rotating shaft 11 through the rotating shaft coupling 6.

[0024] Of course, the above description is the preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A wafer dual-bearing lifting and throwing mechanism for processing chips, characterized in that: The system includes a projectile motor, a rotating shaft, a projectile sliding mechanism, a connecting piece, and a film cassette holder. Two projectile sliding mechanisms are symmetrically arranged on both sides of the film cassette holder and connected to it via the connecting piece. The projectile motor is connected to the rotating shaft, which in turn is connected to the projectile sliding mechanism. Each projectile sliding mechanism includes a connecting rod, a slide rail, a rotating connecting rod, a bearing fixing block, a bearing pin, a cam, and a bearing. Two sets of connecting rods and slide rails are provided. The rotating connecting rod is fastened to a slider nested on the left and right slide rails by screws. The lower parts of the two connecting rods are respectively fixed to the rotating connecting rod by bolts. The bearing is secured by the bearing pin. After passing through, it is sandwiched in the middle by two bearing fixing blocks to form a bearing assembly. The bearing assembly is fixedly connected to the bottom end of the rotating connecting rod, but the bearing does not contact the rotating connecting rod. The bearing fixing block is held firmly on the bearing pin by a retaining ring to prevent it from loosening. The cam contacts the bearing. The cam is an eccentric wheel with its axis fixed on the rotating shaft. The edge of the cam is concave, and the bearing is located exactly in the concave area. When the cam rotates, it pushes the bearing, and the bearing drives the rotating connecting rod fixed on the bearing assembly to move up and down in the slide rail. The rotating connecting rod is fixedly connected to the connecting rod, and the connecting rod drives the connecting piece, thereby driving the disc tray bracket to move up and down.

2. The wafer dual-bearing lifting and throwing mechanism according to claim 1, characterized in that: It also includes a throwing mechanism sealing box, a sealing seat, and a sealing cover. The throwing mechanism sealing box is nested outside the throwing sliding mechanism. A through hole is provided at the top of the throwing mechanism sealing box at a position corresponding to the slide rail. The slide rail passes through the through hole at the top of the throwing mechanism sealing box and is sealed to the throwing mechanism sealing box through the sealing seat. Shaft holes are provided at the bottom of both sides of the throwing mechanism sealing box. The rotating shaft passes through the shaft holes, penetrates the throwing mechanism sealing box, and is sealed by the sealing cover.

3. The wafer dual-bearing lifting and throwing mechanism according to claim 1, characterized in that: It also includes a projectile motor bracket and a coupling; the projectile motor is mounted on the projectile motor bracket, and its power shaft is connected to the rotating shaft through the coupling to form a straight line.

4. The wafer dual-bearing lifting and throwing mechanism according to claim 1, characterized in that: It also includes a connecting shaft, which is located between the projectile motor and the rotating shaft and is connected to the projectile motor and the rotating shaft via a coupling.

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