Image Sensor Package

CN111883547BActive Publication Date: 2025-07-08SAMSUNG ELECTRO MECHANICS CO LTD
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Patent Information

Application Number
CN202010046361.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2019-05-02
Filing Date
2020-01-16
Publication Date
2025-07-08
Estimated Expiration
2040-01-16

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Abstract

An image sensor package, comprising: a substrate; an image sensor mounted on the substrate; bonding wires connecting the image sensor to the substrate; a reflector disposed on the image sensor; a sealing member sealing a part of the image sensor and the bonding wires and covering at least a part of the reflector, the sealing member including a hole exposing an effective imaging surface of the image sensor; and a filter attached to the sealing member.
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Citation Information

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