Joining device

Abstract

The present application aims to provide a bonding device (3) which can reduce movement errors and mechanical errors caused by moving units as much as possible and perform efficient actions. The bonding device (3) of the present application comprises: a substrate supply unit (6) for supplying a substrate (2) to a bonding table (4); a chip supply unit (7) for supplying a chip (1) to a relay table (5); and a bonding head (8) for bonding the chip (1) to the substrate (2) on the bonding table (4). A guide member (9) is arranged in a horizontal first direction (X direction), and the substrate supply unit (6), the chip supply unit (7), and the bonding head (8) are arranged along the guide member (9). The bonding table and the relay table are moved along the guide member by a bonding table moving unit and a relay table moving unit.

Description

Technical Field

[0001] The present invention relates to bonding apparatus, and more specifically, to bonding apparatus for bonding a chip to a substrate. Background Technology

[0002] Conventionally, as a bonding apparatus for bonding a chip to a substrate, a bonding apparatus is known, which includes: a bonding stage for placing a substrate; a relay stage for placing the chip; a substrate supply unit for supplying a substrate to the bonding stage; a chip supply unit for supplying a chip to the relay stage; and a bonding head for bonding the chip to the substrate.

[0003] In the above structure, the substrate or chip is transported to the bonding head by moving the free-moving units of the bonding stage and the relay stage.

[0004] In order to properly bond the substrate and the chip, it is necessary to ensure that the movement of the substrate or chip by the aforementioned moving unit can be performed correctly. However, in reality, due to the movement error or mechanical error of the moving unit, adjustments are required.

[0005] Therefore, it is known, for example, that by integrating the aforementioned relay station and junction station into one unit and moving them as a single unit, movement errors or mechanical errors can be reduced (Patent Document 1).

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: Japanese Patent Application Publication No. 2010-238974 Summary of the Invention

[0009] The problem the invention aims to solve

[0010] However, the configuration of the aforementioned Patent Document 1, which integrates the relay station and the bonding station into one unit, makes it difficult to perform separate operations on the bonding station and the relay station, and also limits the layout of the chip supply unit or the substrate supply unit.

[0011] In view of this, the present invention aims to provide a coupling device that can minimize the movement error or mechanical error caused by the moving unit, while performing efficient operation.

[0012] Solution to the problem

[0013] That is, the bonding apparatus involved in the invention of technical solution 1 is characterized by comprising: a bonding stage for holding a substrate; a bonding stage moving unit for moving the bonding stage; a relay stage for holding a chip; a relay stage moving unit for moving the relay stage; a substrate supply unit for supplying the substrate to the bonding stage; a chip supply unit for supplying the chip to the relay stage; and a bonding head for removing the chip from the relay stage and bonding the chip to the substrate on the bonding stage.

[0014] A guide member is provided that is positioned in a horizontal first direction, and the substrate supply unit, the chip supply unit, and the connector are arranged along the guide member.

[0015] The aforementioned joint platform moving unit and relay platform moving unit cause the joint platform and relay platform to move along the aforementioned guide member.

[0016] Furthermore, the invention of technical solution 2 is characterized in that, in the bonding device of technical solution 1, the bonding head has a structure capable of performing the following bonding operations: downward bonding, holding the chip with its main surface facing downward and bonding the main surface to the substrate; and upward bonding, holding the chip with its main surface facing upward and bonding the chip to the substrate while maintaining the upward orientation of the main surface.

[0017] Along the aforementioned guide member are provided: a substrate imaging unit for imaging the substrate placed on the bonding stage from above; and a chip top surface imaging unit for imaging the main surface of the chip placed on the relay stage from above during face-up bonding.

[0018] Along the aforementioned guide member, a chip bottom surface imaging unit is also movably provided, which, during downward bonding, captures images of the main surface of the chip held at the aforementioned bonding head from below.

[0019] Furthermore, the invention of technical solution 3 is characterized in that, in the bonding device of technical solution 2, there are target marks for performing calibration operations on the aforementioned substrate imaging unit, the aforementioned chip top surface imaging unit, and the aforementioned chip bottom surface imaging unit, and these target marks are set in a manner that allows them to move along the guide member.

[0020] When calibrating the substrate imaging unit and the chip bottom imaging unit for the aforementioned downward bonding,

[0021] The target mark is positioned above the chip bottom imaging unit and below the substrate imaging unit, and the target mark is captured by the chip bottom imaging unit and the substrate imaging unit.

[0022] During the calibration of the substrate imaging unit and the chip top imaging unit for the purpose of performing the aforementioned upward bonding,

[0023] The target mark is positioned below the chip top imaging unit and the substrate imaging unit, and the target mark is captured by the chip top imaging unit and the substrate imaging unit.

[0024] Invention Effects

[0025] According to the invention of the above-mentioned technical solution 1, a substrate supply unit, a chip supply unit, and a bonding head are provided along the guide member, and the bonding stage and the relay stage can move along the guide member in the first direction.

[0026] That is, since the junction platform and the repeater move along the shared guide member in the first direction, it is not easy for mechanical errors to occur in the junction platform and the repeater in the first direction.

[0027] On the other hand, since the junction station and the repeater station can be moved separately by the junction station moving unit and the repeater station moving unit, the operation of the junction station and the repeater station can be carried out independently, and efficient connection can be achieved.

[0028] According to the invention of the above-mentioned technical solution 2, both upward and downward joining can be performed, and through the invention of technical solution 3, calibration work can be performed on the shooting unit set in such a joining device that can perform both upward and downward joining. Attached Figure Description

[0029] Figure 1 This is a structural diagram of the joining device in this embodiment.

[0030] Figure 2 It is a top view of the joint platform and an action diagram illustrating the target markings.

[0031] Figure 3 This is an example of a captured image of a target mark.

[0032] Figure 4 This is a diagram illustrating the action of downward engagement.

[0033] Figure 5 This is a diagram illustrating the action of downward engagement.

[0034] Figure 6 This is a diagram illustrating the action of downward engagement.

[0035] Figure 7 This is a diagram illustrating the action of downward engagement.

[0036] Figure 8 This is a diagram illustrating the action of upward engagement.

[0037] Figure 9 This is a diagram illustrating the action of upward engagement.

[0038] Figure 10 This is a diagram illustrating the actions involved in performing calibration.

[0039] Figure 11 This is a diagram illustrating the actions involved in performing calibration.

[0040] Explanation of reference numerals in the attached figures

[0041] 1 chip;

[0042] 2 substrate;

[0043] 3. Connecting device;

[0044] 4. Jointing platform;

[0045] 5 repeaters;

[0046] 6 substrate supply units;

[0047] 7 chip supply units;

[0048] 8. Connector;

[0049] 9. First guiding component;

[0050] 10 jointing platform moving units;

[0051] 11 repeater mobile units;

[0052] 41 substrate imaging units;

[0053] 42-chip bottom-mounted imaging unit;

[0054] 43-chip top-mounted imaging unit;

[0055] 51 Target Marker. Detailed Implementation

[0056] The following description refers to the illustrated embodiments. Figure 1 The diagram shows a structure of a bonding device 3 for bonding chip 1 to substrate 2. On any side of chip 1, electrodes, light-emitting parts of LEDs, circuit patterns, etc. are formed. In the following description, the surface on which the electrodes are formed is referred to as the main surface of chip 1.

[0057] Furthermore, the bonding device 3 of this embodiment can perform: upward bonding, bonding the chip 1 to the substrate 2 with the main surface of the chip 1 facing upward; and downward bonding, bonding the chip 1 to the substrate 2 with the main surface of the chip 1 facing downward.

[0058] The bonding device 3 includes: a bonding stage 4 for holding the substrate 2; a relay stage 5 for holding the chip 1; a substrate supply unit 6 for supplying the substrate 2 to the bonding stage 4; a chip supply unit 7 for supplying the chip 1 to the relay stage 5; and a bonding head 8 for bonding the chip 1 to the substrate 2.

[0059] In the following description, the X direction will be referred to as the first direction of the present invention. Figure 1 The diagram shows the left and right directions, with the Y direction being used as the second direction. Figure 1 The depth direction on the paper is indicated, and the vertical direction shown in the diagram is used as the Z-direction for explanation.

[0060] In the bonding device 3 of this embodiment, a first guide member 9 is provided in the X direction, and the substrate supply unit 6 is disposed on the right side of the first guide member 9; a bonding head 8 is disposed in the center; and the chip supply unit 7 is disposed on the left side.

[0061] In addition, the aforementioned junction platform 4 and repeater platform 5 can each move along the aforementioned first guide member 9, with the junction platform moving unit 10 and repeater platform moving unit 11 respectively.

[0062] The coupling device 3, which has such a configuration, is controlled by the control unit 12 and can be switched between upward and downward coupling by pre-setting.

[0063] The aforementioned bonding platform 4 has a structure in which the substrate 2 is adsorbed and held by an adsorption mechanism (not shown) when the substrate 2 is placed on its top surface, and the substrate 2 can be heated during bonding by a heater (not shown).

[0064] Figure 2 The top view of the aforementioned joint platform 4 is shown, which is configured to span the aforementioned first guide member 9, which is composed of a pair of rails arranged parallel to each other in the X direction.

[0065] The aforementioned jointing platform moving unit 10 includes an X slider 10a that moves along the first guide member 9 in the X direction, a pair of Y-direction guide members 10b disposed on the top surface of the X slider 10a facing the Y direction, and a Y slider 10c that moves along the Y-direction guide members 10b in the Y direction. The aforementioned jointing platform 4 is fixed on the upper part of the aforementioned Y slider 10c.

[0066] in addition, Figure 2 The substrate 2 shown is a structure in which one chip 1 is bonded, but it can also be a substrate 2 that can bond multiple chips 1.

[0067] The relay station 5 and the bonding station 4 also have a structure in which the chip 1 is held by an adsorption mechanism (not shown) when the chip 1 is placed on its top surface. When the above-facing bonding is performed, the chip 1 is held with its main surface facing upward, and when the above-facing bonding is performed, the chip 1 is held with its main surface facing downward.

[0068] The aforementioned repeater station moving unit 11 also includes an X slider 11a that moves along the first guide member 9 in the X direction, a Y guide member 11b that is disposed on the top surface of the X slider 11a facing the Y direction, and a Y slider 11c that moves along the Y guide member 10b in the Y direction. The repeater station 5 is fixed on the upper part of the Y slider 11c.

[0069] The substrate supply unit 6 includes: a substrate storage chamber 21 for storing the substrate 2 before chip 1 bonding; a product storage chamber 22 for storing the substrate 2 after chip 1 bonding and productization; a substrate holding head 23 for holding the substrate 2; and a substrate holding head moving unit 24 for moving the substrate holding head 23.

[0070] The substrate holding head 23 has a structure for adsorbing and holding the top surface of the substrate 2. The substrate holding head moving unit 24 has a second guide member 24a disposed on the upper part of the first guide member 9 in the X direction, and also has a mechanism for moving the substrate holding head 23 along the second guide member 24a in the X direction and lifting it in the Z direction.

[0071] Below the second guide member 24a, the aforementioned substrate storage 21 and product storage 22 are arranged in the X direction, and the left end of the second guide member 24a in the figure overlaps with the right end of the first guide member 9 in the figure.

[0072] In addition, at the portion where the second guide member 24a overlaps with the first guide member 9, a substrate supply position A is provided where the joining platform 4 and the substrate holding head 23 stop and transfer the substrate 2.

[0073] Alternatively, the substrate holding head 23 can be configured to move in the Y direction, and the substrate storage 21 and product storage 22 can be arranged in the Y direction. Furthermore, two substrate holding heads 23 can be provided, one of which is used to exchange substrate 2 with the bonding table 4, and the other is used to remove substrate 2 from the bonding table 4.

[0074] The chip supply unit 7 includes: a chip supply section 31 for supplying chip 1; a chip holding head 32 for holding chip 1 in the chip supply section 31; a chip holding head moving unit 33 for moving the chip holding head 32; and a chip flipping unit 34 for flipping chip 1.

[0075] Chip 1 is supplied to the chip supply unit 31 in a state where it is housed in a wafer ring or tray. Chip 1 is supplied with its main surface facing upward, whether it is being bonded upward or downward.

[0076] The chip holding head 32 is configured to hold the top surface of the chip 1 supplied to the chip supply section 31. The chip holding head moving unit 33 has a third guide member 33a provided in the upper part of the first guide member 9 in the X direction, and has a structure that allows the chip holding head 32 to move along the third guide member 33a in the X direction and to rise and fall in the Z direction.

[0077] Below the third guide member 33a, the chip supply section 31 and the chip flipping unit 34 are provided, and the right end of the third guide member 33a in the figure is arranged to overlap with the left end of the first guide member 9 in the figure.

[0078] The chip flipping unit 34 is configured such that, when performing downward bonding, it adsorbs and holds the bottom surface of the chip 1 held by the chip holding head 32, and further moves up and down along the fourth guide member 34a provided in the Z direction, and rotates 180° by a rotating mechanism not shown.

[0079] Furthermore, in the portion where the third guide member 33a overlaps with the first guide member 9, there are: a first chip supply position B1 where the chip flipping unit 34 is provided, and a second chip supply position B2 where the relay station 5 and the chip holding head 32 stop and hand over the chip 1.

[0080] In addition, as the chip flipping unit 34, the adsorption part that adsorbs the chip 1 can be set in a relative position. When the rotating mechanism is operated with one adsorption part adsorbing and holding the chip 1, the adsorption part that adsorbs the chip 1 faces downward, while the adsorption part of the other faces upward, so that a new chip 1 can be adsorbed.

[0081] The aforementioned connector 8 is disposed along the aforementioned first guide member 9 and has a mechanism for adsorbing and holding the top surface of the aforementioned chip 1 and heating the held chip 1.

[0082] Furthermore, the connector 8 has a mechanism for moving up and down in the Z direction and for rotating the held chip 1 in the horizontal plane (about the Z-axis). In other words, the connector does not have a mechanism for moving in the horizontal direction.

[0083] Additionally, adjacent to the bonding head 8, there is a dispensing device (not shown) for supplying bonding aids (adhesives such as thermosetting resins, antioxidants such as fluxes, etc.) to the bottom surface of the chip 1 or the top surface of the substrate 2.

[0084] Furthermore, at the location where the bonding head 8 is provided, a bonding position C is set where the bonding platform 4 and the relay platform 5 stop. The bonding head 8 takes out the chip 1 from the relay platform 5 that stops at the bonding position C and bonds the chip 1 to the substrate 2 of the bonding platform 4 that stops at the bonding position C.

[0085] At this point, in order to properly bond the chip 1 to the substrate 2, it is necessary to correct the positional and tilt offsets of the chip 1 held by the bonding head 8 and the substrate 2 placed on the bonding stage 4.

[0086] Therefore, at the aforementioned bonding position C, the bonding stage moving unit 10 moves the bonding stage 4 in the X and Y directions, thereby moving the substrate 2 and correcting the position of the chip 1 and the substrate 2. On the other hand, the bonding head 8 corrects the position of the chip 1 and the substrate 2 by rotating the chip 1 in the horizontal plane.

[0087] Furthermore, the technique of using the aforementioned connector 8 to bond the substrate 2 and the chip 1 is known in the past, so its detailed description is omitted.

[0088] Secondly, as mentioned above, when the chip 1 is bonded to the substrate 2 using the bonding head 8, the positional offset and tilt offset of the chip 1 and the substrate 2 are corrected. For this purpose, it is necessary to identify the position and tilt of the chip 1 and the position and tilt of the substrate 2 in advance.

[0089] Therefore, the bonding device 3 of this embodiment includes: a substrate imaging unit 41 for imaging the substrate 2 on the bonding stage 4; a chip bottom imaging unit 42 for imaging the bottom surface of the chip 1 held on the bonding head 8 during downward bonding; and a chip top imaging unit 43 for imaging the top surface of the chip 1 placed on the relay stage 5 during upward bonding.

[0090] The control unit 12 is equipped with an image recognition unit, which performs image recognition on the images captured by the imaging units 41 to 43 and identifies the position and tilt of the chip 1 or substrate 2 captured.

[0091] The specific image recognition method is well known and therefore will not be described in detail. Alignment marks are pre-formed on the main surface of the chip 1 or the top surface of the substrate 2. Based on these alignment marks, the image processing unit can identify the center of the chip 1 or the center of the mounting position in the substrate 2, or can identify their tilt. In addition, alignment marks are not always necessary to identify the position and tilt of the chip 1. For example, the position and tilt of the chip 1 can also be identified by recognizing components or wiring patterns formed on the chip 1 in a specified shape.

[0092] The substrate imaging unit 41 is located between the bonding head 8 and the substrate supply unit 6. The bonding stage 4 stops at the substrate imaging position D set below the substrate imaging unit 41, and can photograph the substrate 2 placed on the bonding stage 4 from above.

[0093] The chip top surface imaging unit 43 is located between the connector 8 and the chip supply unit 7. The relay station 5 stops at the chip top surface imaging position E set below the chip top surface imaging unit 43, and can photograph the chip 1 placed on the relay station 5 with its main surface facing upward from above.

[0094] On the other hand, such as Figure 2 As shown, the chip bottom imaging unit 42 is disposed on the bonding stage moving unit 10 that moves the bonding stage 4, and the bonding stage 4 and the chip bottom imaging unit 42 are integrated and move together.

[0095] The chip bottom imaging unit 42 moves in the X direction by the X slider 10a of the bonding stage moving unit 10 and in the Y direction by the Y slider 10c, and stops at the bonding position C set below the bonding head 8, so as to capture the chip 1 with the main surface facing down that is adsorbed by the bonding head 8 from below.

[0096] Furthermore, if the chip bottom imaging unit 42 is arranged in the X direction relative to the bonding stage 4, then when imaging the chip 1 adsorbed by the bonding head 8, the movement of the Y slider 10c in the Y direction is unnecessary.

[0097] Thus, in the bonding device 3 of this embodiment, the above-mentioned imaging units 41 to 43 are used to identify the positional offset and tilt offset of the chip 1 and the substrate 2.

[0098] However, due to the changes over time caused by the use of the coupling device 3, mechanical errors or offsets occur in the entire device. In particular, in the above-mentioned shooting units 41 to 43, the shooting position may sometimes be offset due to the offset or deformation of the installation position.

[0099] Such positional offset of the imaging units 41 to 43 will affect the recognition results obtained by the image recognition unit and cause them to fail to engage correctly. Therefore, it is necessary to perform calibration work to correct the offset of these imaging units 41 to 43.

[0100] In this embodiment, the following calibration operations can be performed: calibration of the substrate imaging unit 41 and the chip bottom imaging unit 42 used for downward bonding; and calibration of the substrate imaging unit 41 and the chip top imaging unit 43 used for upward bonding.

[0101] To perform the above calibration operation, the coupling device in this embodiment is as follows: Figure 2 The target mark 51 is shown as being disposed adjacent to the aforementioned joint platform 4.

[0102] The aforementioned target mark 51 is a plate-shaped member on a body made of transparent material, which has a cross-shaped mark that can be photographed from the front and back respectively, and can be moved integrally with the aforementioned bonding stage 4 and the aforementioned chip bottom surface imaging unit 42 by the aforementioned bonding stage moving unit 10.

[0103] The target mark 51 is configured to be able to move forward and backward by the moving mechanism 52 of the Y slider 10c provided on the above-mentioned joint stage moving unit 10, and can be moved to a retreat position (a) that is outside the shooting range of the chip bottom shooting unit 42, and a protruding position (b) that is protruding into the upper shooting range.

[0104] Thus, target mark 51 is in the retracted position during engagement and in the protruding position during calibration.

[0105] Using this structure, by placing the target mark 51 in a protruding position, the target mark 51 can be photographed by the chip bottom imaging unit 42. Furthermore, by moving the bonding stage 10, the target mark 51 is stopped at the substrate imaging position D and the chip top imaging position E, thereby the target mark 51 can be photographed by the substrate imaging unit 41 and the chip top imaging unit 43.

[0106] in addition, Figure 3 A schematic diagram is shown showing the result of capturing the target mark 51 by the substrate imaging unit 41, the chip bottom imaging unit 42, and the chip top imaging unit 43.

[0107] Specifically, the image recognition unit identifies the position and tilt of the target mark 51 relative to the imaging center 41c for the substrate imaging unit 41, and uses this identification as the offset 41g of the substrate imaging unit 41.

[0108] Similarly, the image recognition unit can also recognize the offset 42g of the shooting center 42c for the chip bottom shooting unit 42, and can also recognize the offset 43g of the shooting center 43c for the chip top shooting unit 43.

[0109] If the offsets 41g to 43g of each imaging unit 41 to 43 are identified, the calibration operation can be performed as follows.

[0110] First, the sequence of the first calibration operation will be explained. Initially, the calibration amount of the substrate imaging unit 41 and the chip bottom imaging unit 42 used for downward bonding can be calculated by adding the identified offset 41g of the substrate imaging unit 41 and the offset 42g of the chip bottom imaging unit 42.

[0111] Next, the calibration amount of the substrate imaging unit 41 and the chip top imaging unit 43 used for upward bonding can be calculated by adding the identified offset 41g of the substrate imaging unit 41 and the offset 43g of the chip top imaging unit 43.

[0112] In contrast, the second calibration operation should be performed using the following method.

[0113] First, the calibration amount of the substrate imaging unit 41 and the chip bottom imaging unit 42 used for downward bonding is the same as in the first method described above, by adding the offset amount 41g of the substrate imaging unit 41 and the offset amount 42g of the chip bottom imaging unit 42.

[0114] Next, in order to perform the calibration operation of the substrate imaging unit 41 and the chip top imaging unit 43 used for upward bonding, the offset 43g of the chip top imaging unit 43 and the offset 42g of the chip bottom imaging unit 42 are first added together.

[0115] Then, the values ​​of the added offset 43g and offset 42g are obtained, and the difference between the offset 41g and offset 42g calculated earlier is the calibration amount for downward engagement. This difference becomes the calibration amount for upward engagement.

[0116] The following uses Figures 4-8 The operation of the coupling device 3 having the above-described configuration is explained. Among them, Figures 4-7 This indicates an action involving downward engagement; Figure 8 , Figure 9 This indicates an action involving upward engagement.

[0117] Figure 4 The diagram illustrates the operation of supplying substrate 2 to the aforementioned bonding station 4 and supplying chip 1 with its main surface facing downwards to the aforementioned relay station 5.

[0118] First, the bonding table 4 is moved in the X direction by the bonding table moving unit 10 along the first guide member 9 and stops at the substrate supply position A.

[0119] Subsequently, in the substrate supply unit 6, the substrate holding head 23 moves up and down at the position of the substrate storage 21 and holds the substrate in the storage 21, and then descends at the substrate supply position A to place the substrate 2 on the bonding stage 4.

[0120] On the other hand, the repeater station 5 is moved in the X direction by the repeater station moving unit 11 along the first guide member 9 and stops at the first chip supply position B1.

[0121] Subsequently, in the chip supply unit 7, the chip holding head 32 moves up and down at the position of the chip supply section 31 and holds the chip 1 with its main surface facing upward. Then, it moves above the chip flipping unit 34 located at the first chip supply position B1, and then descends to hand over the chip 1 to the adsorption section of the chip flipping unit 34.

[0122] Next, the chip flipping unit 34 rotates the adsorption part 180° by the rotation mechanism so that the main surface of the chip 1 faces downward. In this state, the adsorption part descends and places the chip 1 on the repeater station 5.

[0123] Next, Figure 5 The diagram illustrates the operation of identifying the position of the substrate 2 on the bonding station 4 and transferring the chip 1 of the relay station 5 to the bonding head 8.

[0124] First, the bonding stage 4 is moved in the X direction by the bonding stage moving unit 10 along the first guide member 9 and stops at the substrate shooting position D.

[0125] Subsequently, the substrate imaging unit 41 images the substrate 2 on the bonding stage 4, while the image recognition unit identifies the position and tilt of the substrate 2 in the bonding stage 4.

[0126] On the other hand, the repeater 5 is moved in the X direction by the repeater moving unit 11 along the first guide member 9 and stops at the aforementioned engagement position C.

[0127] Then, the connector 8 moves up and down in the Z direction, while adsorbing and holding the chip 1 on the repeater 5.

[0128] Next, Figure 6 The diagram illustrates the operation of identifying the position of chip 1 held at the connector 8 and moving the repeater 5 toward the chip supply unit 7.

[0129] First, the chip bottom imaging unit 42, which is integrally set with the bonding stage 4, is moved in the X direction along the first guide member 9 by the bonding stage moving unit 10 and stops at the bonding position C.

[0130] Subsequently, the chip bottom imaging unit 42 takes an image from below the chip 1 attached to the connector 8, and the image recognition unit identifies the position and tilt of the chip 1 attached to the connector 8.

[0131] On the other hand, the repeater station 5 is moved in the X direction by the repeater station moving unit 11 along the first guide member 9 and stops at the first chip supply position B1.

[0132] In the chip supply unit 7, the chip holding head 32 holds the chip 1 with its main surface facing upward in the chip supply section 31 and moves the chip 1 above the chip flipping unit 34 located at the first chip supply position B1.

[0133] in addition, Figure 7 The diagram illustrates the operation in which the connector 8 bonds the chip 1 to the substrate 2 and the chip supply unit 7 supplies the chip 1 to the repeater station 5.

[0134] First, the aforementioned jointing platform 4 is moved in the X direction by the jointing platform moving unit 10 along the first guide member 9 and stops at the aforementioned jointing position C.

[0135] On the other hand, the image recognition unit calculates the positional offset and tilt offset between the substrate 2 placed on the bonding stage 4 and the chip 1 held in the bonding head 8 based on the position and tilt of the substrate 2 captured by the substrate imaging unit 41 and the position and tilt of the chip 1 captured by the chip bottom imaging unit 42.

[0136] Subsequently, the control unit 12 controls the bonding stage moving unit 10 to move the bonding stage 4 in the X and Y directions to eliminate the positional misalignment between the substrate 2 and the chip 1. At this time, since the above-mentioned calibration operation has already been performed, a calibration amount is also added and the stage is moved.

[0137] Furthermore, the control unit 12 controls the rotation mechanism of the aforementioned connector 8, causing the connector 8 to rotate in the horizontal plane, thereby eliminating the tilt misalignment between the substrate 2 and the chip 1. At this time, if the aforementioned calibration operation has already been performed, a calibration amount can also be added and the connector rotated.

[0138] In this state, the aforementioned bonding head 8 descends in the Z direction. When the chip 1 with its main surface facing downwards comes into contact with the top surface of the substrate 2, the heated chip 1 is bonded to the substrate 2 through the bonding head 8 and the bonding stage 4.

[0139] On the other hand, in the chip supply unit 7, the chip holding head 32 descends to hand over the chip 1 to the upward-facing adsorption part in the chip flipping unit 34.

[0140] Subsequently, when the joined head 8, which has been joined, retracts above the joining table 4, the joining table 4 is moved by the joining table moving unit 10 to the substrate supply position A.

[0141] Afterwards, the substrate holding head 23 of the substrate supply unit 6 holds the substrate 2 with the chip 1 already bonded from the bonding table 4 and then stores the substrate 2 in the product storage cassette 22.

[0142] Subsequently, the substrate supply unit 6 takes out the new substrate 2 from the substrate storage 21 through the substrate holding head 23 and supplies the new substrate 2 to the bonding stage 4.

[0143] Next, use Figure 8 , Figure 9 This describes the actions involved in upward-facing engagement. Furthermore, descriptions of operations common to downward-facing engagement are omitted.

[0144] Figure 8 The diagram shows the representation and Figure 4 The operation described corresponds to the operation of supplying substrate 2 to the bonding station 4 and chip 1 to the relay station 5.

[0145] For the operation of supplying substrate 2 to the bonding stage 4, the substrate 2 is placed on the bonding stage 4 by the substrate supply unit 6, just as when performing downward bonding.

[0146] On the other hand, during the operation of supplying chip 1 to repeater station 5, the repeater station moving unit 11 causes repeater station 5 to stop at the second chip supply position B2.

[0147] Next, in the chip supply unit 7, the chip holding head 32 directly places the chip 1 taken from the chip supply unit 31 onto the repeater station 5, thereby placing the chip 1 onto the repeater station 5 with its main surface facing upward.

[0148] Figure 9 The diagram shows the representation and Figure 5 The operation described corresponds to the operation of identifying the position of the substrate 2 on the bonding stage 4 and the position of the chip 1 on the relay stage 5.

[0149] The operation of identifying the position of the substrate 2 on the bonding stage 4 is the same as when performing downward bonding. The bonding stage 4 is moved to the substrate imaging position D, and the substrate imaging unit 41 is used to image the substrate 2 on the bonding stage 4.

[0150] On the other hand, in the operation of identifying the position of chip 1 on repeater station 5, firstly, the repeater station moving unit 11 moves repeater station 5 to the chip top surface imaging position E.

[0151] Subsequently, the chip top imaging unit 43 photographs the chip 1 on the repeater station 5.

[0152] Subsequent operations, in addition to using the chip bottom imaging unit 42 for imaging, also involve the same process as when the chip is facing downwards. Figure 5 The operation shown involves positioning the repeater station 5 at the connection position C and attaching the chip 1 via the connector 8, and as shown... Figure 7The operation shown is to bond the chip 1 to the substrate 2 while correcting the positional and tilt offsets of the substrate 2 and the chip 1.

[0153] This allows the chip 1, with its main surface facing upwards, to be bonded to the substrate 2.

[0154] Thus, according to the bonding device 3 of this embodiment, the bonding stage 4 on which the substrate 2 is placed and the relay stage 5 on which the chip 1 is placed can move in the X direction along the first guiding member 9.

[0155] Based on this, a substrate supply unit 6 for supplying substrate 2, a chip supply unit 7 for supplying chip 1, and a connector 8 are provided in an arrangement along the first guide member 9 in the X direction.

[0156] That is, since the connecting platform 4 and the relay platform 5 move relative to each other in the X direction along a first guide member 9, the movement in the relative Y direction is reduced, and compared with the case where the connecting platform 4 and the relay platform 5 move along different guide members, it is a structure that is less likely to produce mechanical errors in the Y direction.

[0157] Thus, the joining device 3 of this embodiment can be said to have a structure that can minimize the movement error or mechanical error caused by the moving unit.

[0158] In addition, in this embodiment, the joining platform 4 and the relay platform 5 can be moved by the joining platform moving unit 10 and the relay platform moving unit 11 respectively, so that the joining platform 4 and the relay platform 5 can be operated respectively during the joining operation.

[0159] In contrast, if the bonding stage and the relay stage are integrated as in Patent Document 1, and the substrate supply unit 6 and the chip supply unit 7 are separated as in this embodiment, the integrated bonding stage and the relay stage need to be moved frequently, which will make the bonding operation inefficient.

[0160] Thus, the joining device 3 of this embodiment can be said to have a structure that can perform efficient operation. In particular, the joining device 3 of this embodiment can be said to have a more efficient structure because it can be used for both downward joining and upward joining.

[0161] Secondly, use Figure 10 , Figure 11 This explains the operation of the substrate imaging unit 41, the chip bottom imaging unit 42, and the chip top imaging unit 43 during the calibration process.

[0162] Figure 10 This diagram illustrates the calibration process for the substrate imaging unit 41 and the chip bottom imaging unit 42 used for downward bonding.

[0163] Here, in order to perform calibration work, such as Figure 2As shown, the target mark 51 moves from the retreated state to the protruding state, and the target mark 51 is located above the chip bottom imaging unit 42.

[0164] In this state, the bonding stage moving unit 10, together with the bonding stage 4 and the chip bottom surface imaging unit 42, moves the target mark 51 toward the substrate imaging position D.

[0165] Subsequently, the substrate imaging unit 41 captures the target mark 51 from above, and the chip bottom imaging unit 42 captures the target mark 51 from below.

[0166] The image recognition unit calculates and stores the positional offset or tilt offset between the substrate imaging unit 41 and the chip bottom imaging unit 42 based on the image of the target mark 51 captured by the substrate imaging unit 41 and the image of the target mark 51 captured by the chip bottom imaging unit 42 as described above.

[0167] In addition, for the chip bottom imaging unit 42, it is not necessary to capture the target mark 51 at the substrate imaging position D; it is also possible to capture the target mark at any position.

[0168] Secondly Figure 11 This diagram illustrates the calibration process for the substrate imaging unit 41 and the chip top imaging unit 43, which are bonded upwards as described above.

[0169] First, such as Figure 10 As shown, the bonding stage moving unit 10, together with the bonding stage 4, moves the target mark 51 toward the substrate shooting position D, and the substrate shooting unit 41 shoots the target mark 51 from above.

[0170] Subsequently, as Figure 11 As shown, the bonding stage moving unit 10 moves the target mark 51 toward the chip top surface shooting position E, and the chip top surface shooting unit 43 shoots the target mark 51 from above.

[0171] The image recognition unit calculates and stores the positional offset or tilt offset between the substrate imaging unit 41 and the chip top imaging unit 43 based on the image of the target mark 51 captured by the substrate imaging unit 41 and the image of the target mark 51 captured by the chip top imaging unit 43 as described above.

[0172] Thus, according to this embodiment, in the bonding device 3 that can be used for both downward bonding and upward bonding, calibration operations can be performed on the imaging units 41 to 43 for them.

[0173] Furthermore, in this case, since the aforementioned jointing platform 4 moves along the first guide member 9 in the X direction, mechanical errors in the Y direction can be suppressed as much as possible.

[0174] Furthermore, in the above embodiment, the structure allows the chip bottom imaging unit 42 and the target mark 51 to move integrally with the bonding stage 4. However, it could also be a structure where the repeater moving unit 11 allows them to move integrally with the repeater stage 5. Alternatively, it could be a structure where the chip bottom imaging unit 42 and the target mark 51 can each move along the first guide member 9.

[0175] Furthermore, the substrate supply unit 6 and chip supply unit 7 in the above embodiments, in Figure 1 In this arrangement, the substrate holding head 23 and the chip holding head 32 are moved in the X direction in the same way as the first guide member 9 to supply the substrate 2 and the chip 1. However, these holding heads 23 and 32 can also be moved in the Y direction. These arrangements can be modified in various ways.

Claims

1. A coupling device, characterized in that, include: The bonding table holds the substrate; The jointing table moving unit moves the jointing table. Repeater station, housing chips; The repeater station moving unit moves the repeater station. A substrate supply unit supplies the substrate to the bonding stage; A chip supply unit supplies the chip to the repeater station; and The bonding head removes the chip from the relay station and bonds the chip to the substrate on the bonding station; The bonding device is provided with a guide member consisting of a pair of rails arranged in a horizontal first direction, and the substrate supply unit, the chip supply unit and the bonding head are arranged along the guide member; The joint platform moving unit and the relay platform moving unit each have a sliding member that is movably engaged with the guide member. The joint platform moving unit has a joint platform on the sliding member, and the relay platform moving unit has a relay platform on the sliding member, so that the joint platform and the relay platform can move along the guide member respectively.

2. The coupling device as claimed in claim 1, characterized in that, The bonding head has a structure capable of performing the following bonding: downward bonding, holding the chip with the main surface of the chip facing downward, and bonding the main surface to the substrate; With the main surface of the chip facing upwards, the chip is held in this position and bonded to the substrate while maintaining this upward-facing orientation. Along the guide member are provided: a substrate imaging unit for imaging the substrate placed on the bonding stage from above; and a chip top surface imaging unit for imaging the main surface of the chip placed on the relay stage from above during face-up bonding. Along the guide member, a chip bottom surface imaging unit is also movably provided, which, during downward bonding, captures images of the main surface of the chip held at the bonding head from below.

3. The joining device as claimed in claim 2, characterized in that, It also includes target markings for performing calibration operations on the substrate imaging unit, the chip top imaging unit, and the chip bottom imaging unit, the target markings being set in a manner that allows them to move along the guide member; When calibrating the substrate imaging unit and the chip bottom imaging unit for the purpose of performing the downward bonding, The target mark is positioned above the chip bottom imaging unit and below the substrate imaging unit, and the target mark is captured by the chip bottom imaging unit and the substrate imaging unit. When calibrating the substrate imaging unit and the chip top imaging unit for the purpose of performing the upward bonding, The target mark is positioned below the chip top imaging unit and the substrate imaging unit, and the target mark is captured by the chip top imaging unit and the substrate imaging unit.

4. The coupling device as claimed in claim 3, characterized in that, The chip bottom imaging unit and the target mark are configured to be movable integrally with the bonding stage by the bonding stage moving unit. The target mark also includes a moving mechanism that moves the target mark to a protruding position within the shooting range of the bottom imaging unit of the chip and to a retracted position away from the shooting range.

Images