Display device

Abstract

A display device includes a substrate including a display area and a peripheral area outside the display area, wherein the peripheral area includes a curved area, and the curved area is curved around a curved axis; an inorganic material layer disposed on the substrate and having a trench corresponding to the curved area; a configuration member disposed in the trench of the inorganic material layer; a first organic material layer covering the configuration member; and a conductive layer disposed on the first organic material layer.

Description

Technical Field

[0001] One or more embodiments relate to a display device. Background Technology

[0002] The uses of display devices have recently diversified. Furthermore, as display devices become thinner and lighter, their applications are expanding. Recently, display devices in which at least a portion is bent to improve visibility at various angles or reduce the area of ​​non-display regions have become widely used. Summary of the Invention

[0003] One or more embodiments include a display device that has a long lifespan and minimizes defects such as wiring breakage during the manufacturing process, in order to address the problem of defects occurring or a shortened lifespan of the display device during the manufacture of a bent display device.

[0004] According to an embodiment, the display device includes: a substrate including a display area and a peripheral area outside the display area, wherein the peripheral area includes a curved area bent around a bending axis; an inorganic material layer disposed on the substrate and having trenches corresponding to the curved area; a structural member disposed in the trenches of the inorganic material layer; a first organic material layer covering the structural member; and a conductive layer disposed on the first organic material layer.

[0005] In one embodiment, the structural member may be insulated from the conductive layer.

[0006] In one embodiment, the structural member may have a plate shape corresponding to the grooves in the inorganic material layer.

[0007] In an embodiment, the construction member may include a plurality of patterns, each pattern having a line shape that extends in a first direction parallel to the bending axis and is spaced apart from each other in a second direction perpendicular to the first direction.

[0008] In an embodiment, the construction member may include a plurality of patterns, each pattern having a line shape that extends in a second direction perpendicular to a first direction parallel to the bending axis and spaced apart from each other in the first direction.

[0009] In an embodiment, the structural members may include a plurality of patterns spaced apart from each other in a first direction parallel to the bending axis and in a second direction perpendicular to the first direction.

[0010] In an embodiment, the structural components may include the same material as the data lines disposed in the display area, and the conductive layer may include the same material as the power supply voltage lines disposed in the display area.

[0011] In an embodiment, the display device may further include a second conductive layer and a third conductive layer disposed on an inorganic material layer in the peripheral region and spaced apart from each other by trenches in the inorganic material layer.

[0012] In an embodiment, the conductive layer may be connected to the second conductive layer and the third conductive layer.

[0013] In an embodiment, the upper surface of the first organic material layer may have an uneven shape.

[0014] In an embodiment, the upper and lower surfaces of the conductive layer may have an uneven shape.

[0015] In one embodiment, the display device may further include a second organic material layer covering the conductive layer.

[0016] According to an embodiment, the display device includes: a substrate, including a first region in which pixels are disposed, a second region in which driving units are disposed, and a curved region between the first region and the second region; an inorganic material layer disposed on the substrate in the curved region; a structural member disposed on the inorganic material layer; a first organic material layer covering the structural member; and a conductive layer disposed on the first organic material layer and extending from the first region to the second region through the curved region.

[0017] In an embodiment, the structural member may have a plate shape corresponding to the curved area.

[0018] In one embodiment, the structural member may extend in a second direction perpendicular to a first direction in which the conductive layer extends, and includes a plurality of patterns spaced apart from each other in the first direction.

[0019] In an embodiment, the structural member may extend in a first direction in which the conductive layer extends, and may include a plurality of patterns spaced apart from each other in a second direction perpendicular to the first direction.

[0020] In an embodiment, the structural members may include a plurality of patterns spaced apart from each other in a first direction in which the conductive layer extends and in a second direction perpendicular to the first direction.

[0021] In an embodiment, the upper surface of the first organic material layer may have an uneven shape.

[0022] In an embodiment, the upper and lower surfaces of the conductive layer may have an uneven shape.

[0023] In one embodiment, the display device may further include a second organic material layer covering the conductive layer. Attached Figure Description

[0024] The above and other features of the embodiments of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, wherein:

[0025] Figure 1 This is a schematic perspective view of a display device according to an embodiment;

[0026] Figure 2 It is intercepted along line I-I'. Figure 1 A schematic cross-sectional view of the display device in the diagram;

[0027] Figure 3 yes Figure 1 A schematic plan view of a portion of the display device before it is bent;

[0028] Figure 4 This is an equivalent circuit diagram of the pixels according to the embodiment;

[0029] Figures 5A to 5C According to the embodiments Figure 1 A schematic cross-sectional view of a portion of the display device;

[0030] Figure 6 yes Figure 3 A magnified view of region C in the image;

[0031] Figure 7 This is a schematic plan view of a portion of the first conductive layer according to an embodiment;

[0032] Figure 8 According to the embodiments Figure 1 A schematic cross-sectional view of a portion of the display device;

[0033] Figure 9A , Figure 10A and Figure 11A It is a plan view showing various embodiments of the construction components; and

[0034] Figure 9B , Figure 10B and Figure 11B They are respectively along Figure 9A The line IV-IV' in the middle Figure 10A The lines V-V' and Figure 11A The cross-sectional view taken from line VI-VI' in the diagram. Detailed Implementation

[0035] The invention will now be described more fully below with reference to the accompanying drawings, in which various embodiments are illustrated. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be exhaustive and comprehensive, and will fully convey the scope of the invention to those skilled in the art. Throughout the text, the same reference numerals refer to the same elements.

[0036] It will be understood that when a component is referred to as being "on" another component, the component can be directly "on" the other component, or there can be an intermediate component between the component and the other component. Conversely, when a component is referred to as being "directly" "on" another component, there is no intermediate component.

[0037] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms “a” and “the” are intended to include the plural forms including “at least one”, unless the context clearly indicates otherwise. “Or” means “and / or”. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Expressions such as “at least one of…” when following a list of elements modify the entire list of elements and not individual elements in the list.

[0038] The same reference numerals in the accompanying drawings refer to the same elements, and therefore repeated specific descriptions of the same reference numerals will be omitted or simplified.

[0039] It will be understood that while the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or part from another. Therefore, without departing from the teachings herein, “first element,” “first component,” “first region,” “first layer,” or “first part” discussed below may be referred to as a second element, second component, second region, second layer, or second part.

[0040] In this disclosure, it is to be understood that terms such as “comprising,” “having,” and “including” are intended to indicate the presence of a feature or element and are not intended to exclude the possibility that one or more other features or elements may be present or may be added.

[0041] Furthermore, related terms such as “below” or “bottom” and “above” or “top” may be used herein to describe the relationship between one element and another as illustrated in the accompanying drawings. It will be understood that, in addition to the orientations shown in the drawings, the related terms are intended to cover different orientations of the device. For example, if a device in one of the drawings is flipped, an element described as being “below” the other element will be oriented as being “above” the other element. Thus, the exemplary term “below” can cover both “below” and “above” orientations, depending on the specific orientation of the drawing. Similarly, if a device in one of the drawings is flipped, an element described as being “below” or “under” the other element will be oriented as being “above” the other element. Thus, the exemplary terms “below” and “under” can cover both “above” and “below” orientations.

[0042] Given the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), as used herein, “about” or “approximately” includes the stated values ​​and means within an acceptable range of deviation from the particular values ​​as determined by one of ordinary skill in the art.

[0043] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms such as those defined in commonly used dictionaries shall be interpreted as having the meaning consistent with their meaning in the relevant context and in this disclosure, and shall not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0044] For ease of illustration, the dimensions of the elements in the figures may be exaggerated. In other words, since the dimensions and thicknesses of the elements in the figures are arbitrarily shown for ease of illustration, the following embodiments are not limited thereto. Exemplary embodiments herein are described with reference to cross-sectional views, which are schematic illustrations of rationalized embodiments. Thus, variations in shape from the illustrations can be expected as a result of, for example, manufacturing techniques and / or tolerances. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the regions illustrated herein, but should include deviations in shape caused, for example, by manufacturing. For example, regions illustrated or described as flat may typically have rough and / or non-linear characteristics. Moreover, the illustrated sharp corners may be rounded. Therefore, the regions illustrated in the figures are purely schematic, and their shapes are not intended to illustrate the precise shapes of the regions and are not intended to limit the scope of the claims.

[0045] In the following disclosure, it will be understood that when a wiring is referred to as “extending in a first direction or a second direction”, the wiring may extend not only in a linear shape, but also in a zigzag or curved shape in the first or second direction.

[0046] In the following disclosures, a "plan view" indicates that a portion of the target object is seen from above, and a "section view" indicates that a portion of the target object is cut vertically and viewed from the side. In the following disclosures, the term "overlap" includes overlap in both plan and section views.

[0047] In the following, embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

[0048] Figure 1 This is a schematic perspective view of a display device according to an embodiment. Figure 2 It is intercepted along line I-I'. Figure 1 A schematic cross-sectional view of the display device in the image. Figure 3 yes Figure 1 A schematic plan view of a portion of the display device before it was bent.

[0049] Embodiments of the display device may include electronic devices such as smartphones, mobile phones, navigation devices, gaming devices, televisions (“TVs”), head units for automobiles, laptop computers, tablet computers, personal multimedia players (“PMPs”), personal digital assistants (“PDAs”), etc. In such embodiments, the electronic device may include a flexible device.

[0050] In embodiments of the display device, such as Figure 1 and Figure 2 As shown, a portion of the substrate 100, which is part of the display device, is bent, such that the portion of the display device can have the same bent shape as the substrate 100. However, for ease of description, such as Figure 3 Some of the accompanying drawings illustrate that the display device is not bent. For ease of illustration and description, the display device is shown as not bent in cross-sectional and plan views of one or more embodiments described below.

[0051] refer to Figures 1 to 3 Embodiments of the display device may include a substrate 100 having a first region A1, a second region A2, and a curved region BA between the first region A1 and the second region A2. The display device may include a display component 200, a sensing component 300, and a polarizing component 400 located in the first region A1 of the substrate 100, and a driving unit 500 located in the second region A2 of the substrate 100. Although in Figures 1 to 3 Not shown in the diagram, but the window can be attached to the upper part of the polarizing member 400. The window can extend not only to the display area DA, but also to the peripheral area PA, including the curved area BA. Therefore, the window can protect the curved area BA from external impacts.

[0052] The first region A1 may include the display region DA and the peripheral region PA, which is a non-display region surrounding the display region DA. The second region A2 may also include the peripheral region PA.

[0053] The substrate 100 may have a curved region BA extending in a first direction D1. The curved region BA may be included in the peripheral region PA. The curved region BA may be located between the first region A1 and the second region A2 in a second direction D2 intersecting the first direction D1. Here, the third direction D3 is a direction perpendicular to the first direction D1 and the second direction D2, or the thickness direction of the substrate 100. In an embodiment, as... Figure 1 As shown, the substrate 100 is bent about a bending axis BAX extending in the first direction D1. The trench TR of the inorganic insulating layer IL (see...) Figures 5A to 5C It can be provided or defined in the outer region PA along the first direction D1 of the curved region BA.

[0054] The substrate 100 may comprise at least one of a variety of materials having flexible or bendable properties. In embodiments, for example, the substrate 100 may comprise polymeric resins such as polyethersulfone (“PES”), polyacrylate, polyetherimide (“PEI”), polyethylene naphthalate (“PEN”), polyethylene terephthalate (“PET”), polyphenylene sulfide (“PPS”), polyarylate (“PAR”), polyimide (“PI”), polycarbonate (“PC”), and cellulose acetate propionate (“CAP”).

[0055] The display component 200 for displaying images can be located in the display area DA of the first area A1. The display component 200 may include a plurality of pixels PX, and each pixel PX may include a display element and pixel circuitry including thin-film transistors for controlling the light emission of the display element. Figure 3 As shown, each pixel PX in the pixel PX can be connected to a scan line SL and a data line DL. The display element may include, for example, an organic light-emitting element and / or a liquid crystal element. The display component 200 may include a display panel containing an encapsulation component. In an embodiment, the encapsulation component may include an encapsulation substrate and a sealant for coupling the substrate 100 to the encapsulation substrate. In an alternative embodiment, the encapsulation component may include an encapsulation layer. The encapsulation layer may include an inorganic encapsulation layer and an organic encapsulation layer. The encapsulation layer can supplement the characteristics of display elements that may be susceptible to oxygen and moisture damage by blocking and encapsulating the organic light-emitting element from the outside.

[0056] The sensing component 300 may be provided or disposed on the display component 200. The sensing component 300 can obtain the coordinate information of an input point by sensing external touch information, and output an input signal corresponding to the input point. The sensing component 300 may include sensing electrodes (or touch electrodes) and traces connected to the sensing electrodes. The sensing component 300 can sense external input using mutual capacitance and / or self-capacitance methods.

[0057] The sensing element 300 can be provided directly or formed on the display element 200 to be embedded, or it can be disposed or mounted on the display element 200 as a separate unit. In embodiments, for example, the sensing element 300 can be formed continuously after the process of forming the display element 200. In such embodiments, the sensing element 300 can be part of the display element 200, and the adhesive layer may not be between the sensing element 300 and the display element 200. Alternatively, the sensing element 300 can be coupled to the display element 200 via an adhesive layer. Although Figure 1 The illustration shows an embodiment in which the sensing element 300 is positioned between the display element 200 and the polarizing element 400, but is not limited thereto. Alternatively, the sensing element 300 may be positioned above the polarizing element 400.

[0058] The polarization member 400 can be located on the sensing member 300. Although in Figure 1 and Figure 2 Not illustrated, but an adhesive layer may be present between the polarizing member 400 and the sensing member 300. In an embodiment, the adhesive layer may be present between the sensing member 300 and the display member 200. The adhesive layer may include a transparent adhesive layer. In one embodiment, for example, the adhesive layer may include an optically clear adhesive (“OCA”). However, the embodiments are not limited thereto. Alternatively, the adhesive layer may include an optically clear resin (“OCR”). In another alternative embodiment, the adhesive layer may include a pressure-sensitive adhesive (“PSA”). The PSA may comprise a polymer-cured product. The PSA may be a film shape comprising the adhesive and may perform its adhesive function in response to pressure supplied from an external source. The PSA may comprise an acrylic or rubber adhesive, or an acrylic or rubber adhesive containing fine particles such as zirconium.

[0059] The polarizing member 400 may include an anti-reflective layer. The anti-reflective layer reduces the reflectivity of light incident on the display member 200 from the outside (external light) through a window coupled above the polarizing member 400. The anti-reflective layer may include a retarder and a polarizer. The retarder may be film-type or liquid crystal coated type, and may include a λ / 2 retarder and / or a λ / 4 retarder. The polarizer may also be film-type or liquid crystal coated type. A film-type polarizer may include a stretched synthetic resin film, and a liquid crystal coated type polarizer may include a liquid crystal with a predetermined configuration. The retarder and polarizer may further include a protective film. The protective film of the retarder and polarizer may be defined as the base layer of the anti-reflective layer.

[0060] In alternative embodiments, the antireflective layer may include a black matrix and color filters. The color filters may be arranged to correspond to the color of light to be emitted from each pixel PX of the display element 200. Each color filter may include a red pigment or dye, a green pigment or dye, or a blue pigment or dye. Alternatively, in addition to the pigments or dyes described above, each color filter may further include quantum dots. Alternatively, some color filters may not include the pigments or dyes described above and may include scattering particles such as titanium dioxide.

[0061] In another alternative embodiment, the antireflective layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer disposed in different layers from each other. First reflected light and second reflected light reflected from the first reflective layer and the second reflective layer, respectively, can destructively interfere, and thus can reduce the reflectivity of external light.

[0062] The polarizing member 400 may include a lens layer. The lens layer can improve the light output efficiency of light emitted from the display member 200 or reduce color deviation. The lens layer may include a layer having a concave lens shape or a convex lens shape, and / or may include multiple layers having different refractive indices. The polarizing member 400 may include both an anti-reflective layer and a lens layer, or may include one of an anti-reflective layer and a lens layer.

[0063] In one embodiment, the polarizing member 400 may be formed sequentially after the process of forming the display member 200 and / or the sensing member 300. In such an embodiment, the adhesive layer may not be located between the polarizing member 400, the display member 200, and / or the sensing member 300.

[0064] Despite Figure 3Although not shown, display member 200, sensing member 300, or polarizing member 400 may include openings in the display area DA. In an embodiment, each of display member 200, sensing member 300, and polarizing member 400 may include an opening, and the openings may overlap each other. In an alternative embodiment, one or more of display member 200, sensing member 300, and polarizing member 400 may not include openings. The opening may be a hole through the element or a transmissive region without a hole. In an embodiment, the opening of each of display member 200, sensing member 300, and polarizing member 400 may be a transmissive region with a hole. In an alternative embodiment, the opening of each of display member 200, sensing member 300, and polarizing member 400 may be a transmissive region without a hole. Components to be added to the display device for various functions may be located in the openings of display member 200, sensing member 300, and polarizing member 400. Components may be located in the openings of display member 200, sensing member 300, and polarizing member 400 or below display member 200.

[0065] The component may include electronic elements. In embodiments, for example, the component may include electronic elements that use light or sound. In embodiments, for example, the electronic elements may include sensors (such as infrared sensors) for outputting and / or receiving light, a camera for capturing images by receiving light, a sensor for outputting and sensing light or sound to measure distance or identify fingerprints, a small lamp for outputting light, a speaker for outputting sound, etc. The electronic elements may use light of various wavelengths, such as visible light, infrared light, ultraviolet light, etc. In embodiments, the opening may be a transmissive area through which light and / or sound output from the electronic element to the outside or from the outside toward the electronic element can pass.

[0066] In alternative embodiments, where the display device is a smartwatch or a dashboard for a vehicle, the component may be a hand such as a clock or a needle used to indicate specific information (e.g., vehicle speed). In such embodiments, where the display device includes a clock hand or a dashboard for a vehicle, the component may be exposed to the outside through a window, and the window may include an opening.

[0067] The components may include those associated with the functions of the display device as described above, or may include accessories such as those that enhance the aesthetics of the display device.

[0068] The driving unit 500 may be located in the second region A2. The driving unit 500 may be connected to the pad units of the substrate 100 and may supply scan signals and data signals to the scan line SL and the data line DL. In one embodiment, for example, the driving unit 500 may include a driving integrated circuit chip and may be mounted above the pad units of the substrate 100. In such an embodiment, the pad units of the substrate 100 may be directly electrically connected to the driving integrated circuit chip.

[0069] In an alternative embodiment, a flexible printed circuit board (“FPCB”) 800 may be mounted above the pad units of the substrate 100, and a driver integrated circuit chip may be mounted above the FPCB 800. A chip-on-film (COF) or flexible printed circuit (FPC) may be applied to the FPCB 800, and a driver integrated circuit chip for supplying signals for illuminating a plurality of pixels PX of the display member 200 may be mounted above the FPCB 800.

[0070] The bending protective layer 600 can be located above the peripheral region PA of the substrate 100. The bending protective layer 600 can be positioned from one end of the display member 200 through the bending region BA to the vicinity of one end of the driving unit 500. However, the formation location of the bending protective layer 600 is not limited to this, and can include various deformable structures capable of covering the bending region BA.

[0071] The bending protective layer 600 can be adjusted to the position of the neutral plane where the strain becomes essentially zero during bending, so that the deformation force applied to the substrate 100 can be compressive stress rather than tensile stress. Therefore, the bending protective layer 600 can cover the bending region BA of the substrate 100 to minimize damage to the bending region BA of the substrate 100.

[0072] The elastic modulus of the bending protective layer 600 can be from approximately 500 MPa to approximately 100 GPa. However, the bending protective layer 600 is not limited to this, and the elastic modulus of the bending protective layer 600 can be modified in various ways depending on design conditions such as the thickness of the substrate 100.

[0073] In an embodiment, the bendable protective layer 600 may comprise an acrylic or silicone-based resin, and fine particles may be included within the resin. The fine particles may include polymer-based nanoparticles or microparticles, such as rubber, epoxy resin, or epoxy resin mixtures including silica. In an embodiment, the bendable protective layer 600 may comprise various film types including PET.

[0074] although Figure 2The illustration shows an embodiment in which the ends of the display member 200, sensing member 300, and polarizing member 400 are aligned with each other, but embodiments of the invention are not limited thereto. In an embodiment, as stated above, the display member 200 may include a light-emitting element, a thin-film transistor, and an encapsulation layer covering the light-emitting element and the thin-film transistor. In such an embodiment, one end of the encapsulation layer may extend further from the sensing member 300 and the polarizing member 400. In an embodiment, the polarizing member 400 may be positioned to contact and adjacent to the bending protection layer 600. The polarizing member 400 may extend to the bending region BA and serve as a bending protection layer.

[0075] In an embodiment, the substrate 100 may have one surface and another surface located on the opposite side of the one surface, and the display member 200 may be located on one surface of the substrate 100. The protective film 700 may be located on the other surface of the substrate 100 opposite to the one surface of the substrate 100 where the display member 200 is located.

[0076] The protective film 700 can be attached to another surface of the substrate 100 to protect the display device. Although in Figure 2 Although not shown, the protective film 700 can be attached to another surface of the substrate 100 via an adhesive layer. The protective film 700 may include a first protective film 701 and a second protective film 703 spaced apart from each other. The first protective film 701 may be attached to a position corresponding to a first region A1 of the substrate 100. The second protective film 703 may be attached to a position corresponding to a second region A2 of the substrate 100. In such an embodiment, the protective film 700 may not be attached to a position corresponding to the bending region BA. Therefore, the stress applied to the substrate 100 and the protective film 700 during bending of the substrate 100 can be minimized to prevent damage to the substrate 100 in the bending region BA during bending. Although the protective film 700 is not attached to the bending region BA of the substrate 100, this disclosure is not limited thereto. In an alternative embodiment, for example, the protective film 700 may be located on another surface of the substrate 100 (i.e., the entire surface of the substrate 100) and may be located in the first region A1, the second region A2, and the bending region BA. Alternatively, the groove may be defined in a position corresponding to the curved region BA of the substrate 100 or formed in the protective film 700.

[0077] Figure 4 This is an equivalent circuit diagram of pixel PX according to an embodiment.

[0078] refer to Figure 4In one embodiment, each pixel PX may include signal lines SL1, SL2, EL, and DL, an initialization voltage line VIL, and a power supply voltage line PL. In an alternative embodiment, at least one of the signal lines SL1, SL2, EL, and DL, the initialization voltage line VIL, and / or the power supply voltage line PL may be shared or jointly connected to adjacent pixels PX.

[0079] The signal lines include a first scan line SL1 for transmitting a first scan signal GW, a second scan line SL2 for transmitting a second scan signal GI, a light emission control line EL for transmitting a light emission control signal EM, and a data line DL intersecting the first scan line SL1 for transmitting a data signal DATA. The second scan line SL2 can be connected to the first scan line SL1 in the next or previous row, and the second scan signal GI can be the first scan signal GW in the next or previous row.

[0080] The power supply voltage line PL can transmit the first power supply voltage ELVDD to the first transistor T1, and the initialization voltage line VIL can transmit the initialization voltage VINT used to initialize the first transistor T1 and the pixel electrode to the pixel PX.

[0081] The first scan line SL1, the second scan line SL2, the light emission control line EL, and the initialization voltage line VIL can extend in the first direction D1 and can be spaced apart from each other in each row. The data line DL and the power supply voltage line PL can extend in the second direction D2 and can be spaced apart from each other in each column.

[0082] The pixel circuit PC of pixel PX may include multiple transistors (e.g., first transistor T1 to seventh transistor T7) and capacitor Cst. First transistor T1 to seventh transistor T7 may include thin-film transistors.

[0083] The first transistor T1 is connected to the power supply voltage line PL via the fifth transistor T5, and is electrically connected to the pixel electrode of the organic light-emitting diode (OLED) via the sixth transistor T6. The first transistor T1 acts as a driving transistor and receives the data signal DATA according to the switching operation of the second transistor T2 to supply the driving current Ioled to the OLED.

[0084] The second transistor T2 is connected to the first scan line SL1 and the data line DL, and is turned on in response to the first scan signal GW received through the first scan line SL1 to perform a switching operation for transmitting the data signal DATA transmitted by the data line DL to node N.

[0085] The third transistor T3 is connected to the pixel electrode of the organic light-emitting diode (OLED) via the sixth transistor T6. The third transistor T3 is turned on in response to the first scan signal GW received through the first scan line SL1, and is connected to the first transistor T1 as a diode.

[0086] The fourth transistor T4 is turned on in response to the second scan signal GI received through the second scan line SL2, and transmits the initialization voltage VINT from the initialization voltage line VIL to the gate electrode of the first transistor T1 to initialize the gate voltage of the first transistor T1.

[0087] The fifth transistor T5 and the sixth transistor T6 are simultaneously turned on in response to the light emission control signal EM received through the light emission control line EL, forming a current path so that the drive current Ioled can flow from the power supply voltage line PL to the direction of the organic light emission diode OLED.

[0088] The seventh transistor T7 is turned on in response to the second scan signal GI received via the second scan line SL2, and transmits the initialization voltage VINT from the initialization voltage line VIL to the pixel electrode of the OLED to initialize the pixel electrode of the OLED. Alternatively, the seventh transistor T7 can be omitted.

[0089] although Figure 4 The illustration shows an embodiment in which the fourth transistor T4 and the seventh transistor T7 are connected to the second scan line SL2, but the embodiments of the invention are not limited thereto. In an alternative embodiment, the fourth transistor T4 may be connected to the second scan line SL2, and the seventh transistor T7 may be connected to a separate wiring and can be driven in response to a signal transmitted to that wiring.

[0090] The capacitor Cst can maintain the voltage applied to the gate electrode of the first transistor T1 by connecting it to the power supply voltage line PL and the gate electrode of the first transistor T1 and storing and maintaining a voltage corresponding to the difference between the voltages across the power supply voltage line PL and the gate electrode of the first transistor T1.

[0091] An organic light-emitting diode (OLED) may include a pixel electrode, a common electrode facing the pixel electrode, and an emitter layer between the pixel electrode and the common electrode. The common electrode may receive a second power supply voltage, ELVSS. An OLED can display an image by receiving a drive current Ioled from a first transistor T1 and emitting light.

[0092] Figures 5A to 5C According to the embodiments Figure 1 A schematic cross-sectional view of a portion of the display device. Figures 5A to 5C It is along Figure 3The cross-sectional view taken from lines II-II' and III-III' in the diagram.

[0093] refer to Figure 5A In one embodiment, the display element DE, along with the thin-film transistor 130 and capacitor 150 electrically connected to the display element DE, may be located in the display area DA of the substrate 100. In such an embodiment, the first electrode 310 of the display element DE may be electrically connected to the thin-film transistor 130. In another embodiment, as... Figure 4 As shown, the display element DE can be an organic light-emitting diode (OLED). In such an embodiment, the thin-film transistor 130 can be one of the first transistors T1 to the seventh transistor T7 included in the pixel circuit PC, and the capacitor 150 can be the capacitor Cst included in the pixel circuit PC.

[0094] The substrate 100 may include a glass material or a polymer resin. The substrate 100 may have a multilayer structure. In one embodiment, for example, the substrate 100 may include a first base layer 101, a first barrier layer 103, a second base layer 105, and a second barrier layer 107.

[0095] In such an embodiment, each of the first substrate layer 101 and the second substrate layer 105 may include a polymer resin. In one embodiment, for example, the first substrate layer 101 and the second substrate layer 105 may include a polymer resin such as PES, PAR, PEI, PEN, PET, PPS, PI, PC, cellulose triacetate (“TAC”), CAP, etc. Each of the first substrate layer 101 and the second substrate layer 105 may include a transparent polymer resin.

[0096] The first barrier layer 103 and the second barrier layer 107 are barrier layers used to prevent the penetration of external foreign matter. The first barrier layer 103 and the second barrier layer 107 may have a single-layer structure or a multi-layer structure comprising inorganic materials such as silicon nitride or silicon oxide.

[0097] The buffer layer 110 may be disposed on or above the substrate 100. The buffer layer 110 may comprise an inorganic insulating material such as silicon nitride or silicon oxide, and may have a single-layer structure or a multi-layer structure.

[0098] The thin-film transistor 130 may include a semiconductor layer 131, a gate electrode 132, a source electrode 133, and a drain electrode 134. The semiconductor layer 131 may include amorphous silicon, polycrystalline silicon, or an organic semiconductor material. In embodiments, the material of the gate electrode 132 may be determined based on adhesion to adjacent layers, surface smoothness, and the machinability of the layers to be stacked. In one embodiment, for example, the gate electrode 132 may include at least one material selected from aluminum (“Al”), platinum (“Pt”), palladium (“Pd”), silver (“Ag”), magnesium (“Mg”), gold (“Au”), nickel (“Ni”), neodymium (“Nd”), iridium (“Ir”), chromium (“Cr”), lithium (“Li”), calcium (“Ca”), molybdenum (“Mo”), titanium (“Ti”), tungsten (“W”), and copper (“Cu”), and may have a single-layer or multi-layer structure.

[0099] In this embodiment, a first insulating layer 111 comprising an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride may be present between the semiconductor layer 131 and the gate electrode 132 to ensure insulation between the semiconductor layer 131 and the gate electrode 132. A second insulating layer 112 and a third insulating layer 113, both comprising inorganic materials such as silicon oxide, silicon nitride, and / or silicon oxynitride, may be present between the gate electrode 132, the source electrode 133, and the drain electrode 134. Each of the source electrode 133 and the drain electrode 134 may be electrically connected to the semiconductor layer 131 through contact holes defined or formed in the first insulating layer 111, the second insulating layer 112, and the third insulating layer 113.

[0100] In an embodiment, the source electrode 133 and the drain electrode 134 may comprise at least one material selected from Al, Pt, Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, W and Cu based on their predetermined conductivity, and may have a single-layer structure or a multi-layer structure.

[0101] The capacitor 150 includes a lower electrode 151 and an upper electrode 153 that overlap each other, with a second insulating layer 112 between the lower electrode 151 and the upper electrode 153. The capacitor 150 may overlap with the thin-film transistor 130. In an embodiment, as... Figure 5A As shown, the gate electrode 132 of the thin-film transistor 130 is the lower electrode 151 of the capacitor 150. In an alternative embodiment, the capacitor 150 may not overlap with the thin-film transistor 130. The capacitor 150 may be covered by a third insulating layer 113.

[0102] The pixel circuitry, including the thin-film transistor 130 and the capacitor 150, may be covered by a fourth insulating layer 114 and a fifth insulating layer 115. The fourth insulating layer 114 and the fifth insulating layer 115 may be planarization insulating layers and organic insulating layers. The fourth insulating layer 114 and the fifth insulating layer 115 may include commercially available polymers such as poly(methyl methacrylate) (“PMMA”) or polystyrene (“PS”), polymer derivatives having a phenolic group, and organic insulating materials such as acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluoropolymers, p-xylene polymers, vinyl alcohol polymers, and mixtures thereof. In an embodiment, the fourth insulating layer 114 and the fifth insulating layer 115 may include PI.

[0103] In an embodiment, the data line DL may be located between the third insulating layer 113 and the fourth insulating layer 114. The power supply voltage line PL may include a first power supply voltage line 172 located in the same layer as the data line DL and a second power supply voltage line 174 located between the fourth insulating layer 114 and the fifth insulating layer 115. The second power supply voltage line 174 may overlap with the first power supply voltage line 172 and may be electrically connected to the first power supply voltage line 172 through contact holes defined or formed in the fourth insulating layer 114. The data line DL and the first power supply voltage line 172 may include Mo, Al, Cu, Ti, etc., and may have a single-layer structure or a multi-layer structure. In an embodiment, the data line DL and the first power supply voltage line 172 may include a Ti / Al / Ti multi-layer structure. The second power supply voltage line 174 may include Mo, Al, Cu, Ti, etc., and may have a single-layer structure or a multi-layer structure. In an embodiment, the second power supply voltage line 174 may include a Ti / Al / Ti multi-layer structure.

[0104] In an embodiment, such as Figure 5A As shown, the power supply voltage line PL has a double-layer structure of a first power supply voltage line 172 and a second power supply voltage line 174, but the embodiment is not limited thereto. In an alternative embodiment, the power supply voltage line PL may have a single-layer structure located in the same layer as the data line DL, or similar to the second power supply voltage line 174, it may have a single-layer structure between the fourth insulating layer 114 and the fifth insulating layer 115.

[0105] The display element DE can be located above the fifth insulating layer 115. The display element DE may include a first electrode 310 as a pixel electrode, an intermediate layer 320, and a second electrode 330 as a counter electrode.

[0106] The first electrode 310 of the display element DE can be located on the fifth insulating layer 115 and can be connected to the thin film transistor 130 through the connection electrode 179 on the fourth insulating layer 114.

[0107] In one embodiment, the first electrode 310 may include a conductive oxide such as indium tin oxide (“ITO”), indium zinc oxide (“IZO”), zinc oxide (“ZnO”), indium oxide (“In2O3”), indium gallium oxide (“IGO”), or zinc aluminum oxide (“AZO”). In an alternative embodiment, the first electrode 310 may include a reflective film, and the reflective film may include Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or combinations thereof (e.g., compounds). In another alternative embodiment, the first electrode 310 may further include a film comprising ITO, IZO, ZnO, or In2O3 above / below the aforementioned reflective film.

[0108] A sixth insulating layer 116 may be located on the fifth insulating layer 115. The sixth insulating layer 116 may serve as a pixel defining layer by having an opening corresponding to each pixel (i.e., an opening OP exposing a portion of the first electrode 310). In an embodiment, the sixth insulating layer 116 may increase the distance between the edge of the first electrode 310 and the second electrode 330 above the first electrode 310 to prevent the formation of electric arcs or the like at the edge of the first electrode 310. The sixth insulating layer 116 may comprise an organic material such as PI or hexamethyldisiloxane (“HMDDSO”).

[0109] The intermediate layer 320 includes an emitting layer. The emitting layer may include a polymer or a low molecular weight organic material that emits light of a specific color. In embodiments, the intermediate layer 320 may include a first functional layer below the emitting layer and / or a second functional layer above the emitting layer. The first functional layer and / or the second functional layer may include an integrated (or common) layer on a plurality of first electrodes 310, or may include a patterned layer corresponding to each of the plurality of first electrodes 310.

[0110] The first functional layer may have a monolayer or multilayer structure. In one embodiment, for example, when the first functional layer comprises a polymer material, the first functional layer may include a hole transport layer (“HTL”) having a monolayer structure and may include poly(3,4)-ethylene-dihydroxythiophene (“PEDOT”) or polyaniline (“PANI”). In an embodiment, when the first functional layer comprises a low molecular weight material, the first functional layer may include a hole injection layer (“HIL”) and an HTL.

[0111] Alternatively, the second functional layer can be omitted. In one embodiment, for example, where the first functional layer and the emitter layer comprise polymer materials, the second functional layer is preferably formed to improve the characteristics of the organic light-emitting diode (OLED). The second functional layer can have a single-layer structure or a multi-layer structure. The second functional layer may include an electron transport layer (“ETL”) and / or an electron injection layer (“EIL”).

[0112] The second electrode 330 may be positioned facing the first electrode 310, with the intermediate layer 320 between the second electrode 330 and the first electrode 310. The second electrode 330 may include a conductive material having a low work function. In one embodiment, for example, the second electrode 330 may include a (semi-)transparent layer, and the (semi-)transparent layer may include Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, combinations thereof (e.g., alloys), etc. Alternatively, the second electrode 330 may further include a layer such as ITO, IZO, ZnO, or In2O3 above the (semi-)transparent layer comprising the materials described above. The second electrode 330 may be located on the intermediate layer 320 and the sixth insulating layer 116. The second electrode 330 may be integrally formed as a single unit relative to a plurality of display elements DE in the display area DA, facing a plurality of first electrodes 310.

[0113] The encapsulation layer 450 can be located above the second electrode 330, thereby protecting the display device from external foreign objects, moisture, etc. The encapsulation layer 450 can cover the display area DA and extend beyond the display area DA. The encapsulation layer 450 can include organic encapsulation layers and inorganic encapsulation layers. In an embodiment, such as... Figure 5A As shown, encapsulation layer 450 includes a first inorganic encapsulation layer 410, a second inorganic encapsulation layer 430, and an organic encapsulation layer 420 between the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430. In alternative embodiments, the number of organic encapsulation layers, the number of inorganic encapsulation layers, and their lamination order can be modified in various ways.

[0114] The first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430 may each comprise one or more inorganic materials (such as alumina, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, silicon oxynitride) and may be formed by chemical vapor deposition. The organic encapsulation layer 420 may comprise PET, PEN, PC, PI, polyethylene sulfonate, polyoxymethylene (“POM”), PAR, HMDSO, acrylic resins (e.g., PMMA and poly(acrylic acid)) or combinations thereof. Although in Figure 5A Not shown, but other layers such as a capping layer may be present between the first inorganic encapsulation layer 410 and the second electrode 330 as needed. Since the first inorganic encapsulation layer 410 is formed along the underlying structure, its upper surface may not be flat. Unlike the first inorganic encapsulation layer 410, the upper surface of the organic encapsulation layer 420 may be formed substantially flat. The second inorganic encapsulation layer 430 may contact the first inorganic encapsulation layer 410 in the peripheral region PA to prevent the organic encapsulation layer 420 from being exposed to the outside.

[0115] Despite Figure 5A Not shown, but the polarizing plate can be bonded to the encapsulation layer 450 using a light-transmitting adhesive. The polarizing plate can have a structure that reduces external light reflection, and a layer including a black matrix and color filters can be used instead of the polarizing plate.

[0116] The buffer layer 110, the first insulating layer 111, the second insulating layer 112 and the third insulating layer 113 can be collectively referred to as the inorganic insulating layer IL, and the buffer layer 110, the first insulating layer 111, the second insulating layer 112 and the third insulating layer 113 include inorganic materials. Figure 5A The illustration shows an embodiment in which an inorganic insulating layer IL in a peripheral region PA, including a curved region BA, comprises a buffer layer 110, a first insulating layer 111, a second insulating layer 112, and a third insulating layer 113. In an alternative embodiment, the inorganic insulating layer IL may include at least one of the buffer layer 110, the first insulating layer 111, the second insulating layer 112, and the third insulating layer 113.

[0117] In an embodiment, such as Figure 5A As shown, the inorganic insulating layer IL may have a trench TR corresponding to the bending region BA. The trench TR may pass through the first insulating layer 111, the second insulating layer 112, and the third insulating layer 113, and the bottom surface of the trench TR may be the upper surface of the buffer layer 110. The trench TR may be defined by the opening 111a of the first insulating layer 111, the opening 112a of the second insulating layer 112, and the opening 113a of the third insulating layer 113, as well as the first insulating layer 111, the second insulating layer 112, and the third insulating layer 113 corresponding to the bending region BA. Figure 5A The illustration shows an embodiment in which the inner surfaces of the opening 111a of the first insulating layer 111, the opening 112a of the second insulating layer 112, and the opening 113a of the third insulating layer 113 overlap with each other. In an alternative embodiment, the inner surfaces of the openings 111a, 112a, and 113a may not overlap with each other, and the sizes of the openings 111a, 112a, and 113a may be different from each other.

[0118] The groove TR corresponding to the curved region BA can be defined in such a way that the groove TR overlaps with the curved region BA. The area of ​​the groove TR can be larger than the area of ​​the curved region BA. In an embodiment, as shown... Figure 5A As shown, the width OW of the groove TR is greater than the width of the curved region BA. In this document, the area of ​​the groove TR can be the area of ​​the bottom surface of the groove TR that has the smallest area when viewed from above. In an embodiment, as... Figure 5A As shown, the area of ​​the trench TR is defined by the opening area of ​​the first insulating layer 111 among the openings 111a of the first insulating layer 111, the opening 112a of the second insulating layer 112, and the opening 113a of the third insulating layer 113.

[0119] Embodiments of the display device may have a first conductive layer 230 extending in a first direction D1. The first conductive layer 230 extends from a first region A1 through a curved region BA to a second region A2 and is located on a fourth insulating layer 114, which is an organic insulating layer. In an embodiment, if the fourth insulating layer 114 is omitted, the first conductive layer 230 may be located on an inorganic insulating layer IL, such as a third insulating layer 113. The first conductive layer 230 may be formed simultaneously using the same material as the material of the second power supply voltage line 174 during the process of forming the second power supply voltage line 174. In an embodiment, for example, the first conductive layer 230 may include Mo, Al, Cu, Ti, etc., and may have a single-layer structure or a multi-layer structure. In an embodiment, the first conductive layer 230 may include a Ti / Al / Ti multi-layer structure.

[0120] During the bending process of the substrate 100, tensile stress can be applied to the inorganic material layer located in the bending region BA. Since the inorganic material layer typically has a higher hardness than the organic material layer, cracks may easily form in the inorganic material layer due to the bending of the substrate 100. These cracks in the inorganic material layer may also cause cracks in the first conductive layer 230 on the inorganic material layer, potentially leading to defects such as disconnections in the display device. According to an embodiment, since the first insulating layer 111, the second insulating layer 112, and the third insulating layer 113, which are inorganic insulating layers of the inorganic material layer, include trenches TR, cracks caused by stress can be effectively prevented, or the likelihood of cracks occurring can be reduced. In such an embodiment, the width OW of the trench TR can be equal to or greater than the width of the bending region BA, thereby reducing defects caused by cracks.

[0121] To minimize the possibility of crack formation, after forming trenches TR in the first insulating layer 111, the second insulating layer 112, and the third insulating layer 113 in the curved region BA, the trenches TR can be extended to the buffer layer 110 and the second barrier layer 107, which are inorganic material layers, by an additional etching process. However, using an additional masking process for the additional etching may increase manufacturing costs.

[0122] According to an embodiment, a structural member 210 can be formed in the bending region BA simultaneously with the formation of the conductive layer of the display region DA, without using additional etching processes for removing the inorganic material layer (such as the buffer layer 110 and the second barrier layer 107) beneath the first insulating layer 111 in the bending region BA. The structural member 210 can serve as a crack-blocking layer to prevent cracks from propagating from the remaining inorganic material layer (i.e., the second barrier layer 107 and / or the buffer layer 110 (or a portion of the buffer layer 110)) in the bending region BA to the first conductive layer 230 and to reduce tensile stress. Therefore, without using additional etching processes, defects that may occur in the first conductive layer 230 during bending can be effectively prevented or substantially minimized.

[0123] In one embodiment, the structural member 210 may be provided in a groove TR of the curved region BA. In another embodiment, the structural member 210 may be provided in a groove TR of the inorganic insulating layer IL. In yet another embodiment, the structural member 210 may be provided in a groove TR formed by removing portions of the first insulating layer 111, the second insulating layer 112, and the third insulating layer 113 of the inorganic insulating layer IL corresponding to the curved region BA. The structural member 210 may contact the upper surface of the buffer layer 110 of the curved region BA.

[0124] The second conductive layer 213a and the third conductive layer 213b may be directly located on the inorganic insulating layer IL (e.g., the third insulating layer 113). The second conductive layer 213a and the third conductive layer 213b are spaced apart from each other, and the trench TR of the inorganic insulating layer IL is between the second conductive layer 213a and the third conductive layer 213b. The second conductive layer 213a may be located in a first region A1, and the third conductive layer 213b may be located in a second region A2. The second conductive layer 213a and the third conductive layer 213b may contact and be electrically connected to the first conductive layer 230 in the contact portion CNT. The second conductive layer 213a and the third conductive layer 213b may be located in the same layer as the data line DL and the first power supply voltage line 172, and may include the same material as the data line DL and the first power supply voltage line 172. In embodiments, for example, the second conductive layer 213a and the third conductive layer 213b may include Mo, Al, Cu, Ti, etc., and may have a single-layer structure or a multi-layer structure. In the embodiments, the second conductive layer 213a and the third conductive layer 213b may include a multilayer structure of Ti / Al / Ti.

[0125] The second conductive layer 213a located in the first region A1 can be electrically connected to the pixel PX in the display region DA. Therefore, the first conductive layer 230 and the third conductive layer 213b can be electrically connected to the pixel PX in the display region DA through the second conductive layer 213a. The second conductive layer 213a can be electrically connected to components located in the display region DA while also being located in the peripheral region PA, and can be located in the peripheral region PA and extend into the display region DA, such that at least a portion of the second conductive layer 213a can be located in the display region DA. In an embodiment, when the third conductive layer 213b is located in the second region A2, at least a portion of the upper part of the third conductive layer 213b can be exposed to the outside for electrical connection to various types of electronic components, printed circuit boards, etc.

[0126] The structural member 210 may include the same material as the data line DL and the first power supply voltage line 172. In embodiments, for example, the structural member 210 may include Mo, Al, Cu, Ti, etc., and may have a single-layer structure or a multi-layer structure. In an embodiment, the structural member 210 may include a Ti / Al / Ti multi-layer structure.

[0127] The structural member 210 can cover the bottom surface of the trench TR of the inorganic insulating layer IL (i.e., the upper surface of the buffer layer 110 exposed by the trench TR) and the inner surface of the trench TR. The structural member 210 can be positioned to further cover the upper surface of the inorganic insulating layer IL surrounding the trench TR, i.e., the upper surface of the third insulating layer 113. The structural member 210 can be completely covered by the fourth insulating layer 114 of the peripheral region PA. Therefore, the structural member 210 can be insulated from the first conductive layer 230, the second conductive layer 213a, and the third conductive layer 213b.

[0128] A portion of the fourth insulating layer 114 may fill at least a portion of the trench TR of the inorganic insulating layer IL. A portion of the fourth insulating layer 114 may be located within the trench TR of the inorganic insulating layer IL. The first conductive layer 230 may be located on the fourth insulating layer 114 of the peripheral region PA. The fifth insulating layer 115 and the sixth insulating layer 116 may be located above the first conductive layer 230. The opposite ends of the first conductive layer 230 may be exposed and not covered by the fifth insulating layer 115 and the sixth insulating layer 116. The bending protection layer 600 may be located on the sixth insulating layer 116 of the peripheral region PA. By adjusting the thickness, modulus, etc., of the bending protection layer 600 when positioning it above the first conductive layer 230, the position of the stress neutral plane relative to all the laminates including the substrate 100, the structural member 210, the first conductive layer 230, and the bending protection layer 600 can be adjusted to minimize tensile stress.

[0129] Figure 5AThe illustration shows an embodiment in which a trench TR is formed where the buffer layer 110 of the inorganic insulating layer IL is not removed from the bending region BA and passes through the first insulating layer 111, the second insulating layer 112, and the third insulating layer 113. Embodiments of the invention are not limited thereto, and the trench TR may be formed to pass through at least one of the buffer layer 110, the first insulating layer 111, the second insulating layer 112, and the third insulating layer 113 of the inorganic insulating layer IL in the bending region BA, or defined by at least one of the buffer layer 110, the first insulating layer 111, the second insulating layer 112, and the third insulating layer 113 of the inorganic insulating layer IL in the bending region BA. In an alternative embodiment, the trench TR may be formed by the first insulating layer 111, the second insulating layer 112, and the third insulating layer 113 in the bending region BA and by a portion of the buffer layer 110 in the bending region BA that has been partially removed. In such an embodiment, the trench TR may include an opening 111a of the first insulating layer 111, an opening 112a of the second insulating layer 112, and an opening 113a of the third insulating layer 113, and the bottom surface of the trench TR may be the upper surface of the partially removed portion of the buffer layer 110. In another alternative embodiment, such as Figure 5B As shown, a trench TR defined by the second insulating layer 112 and the third insulating layer 113 in the bending region BA and by a portion of the first insulating layer 111 in the bending region BA that has been partially removed can be formed. In such an embodiment, a portion of the first insulating layer 111 of the inorganic insulating layer 111 and the buffer layer 110 can be retained. The trench TR may include an opening 112a of the second insulating layer 112 and an opening 113a of the third insulating layer 113, and the bottom surface of the trench TR may be the upper surface of the portion of the first insulating layer 111 that has been partially removed. In another alternative embodiment, a trench TR defined by the buffer layer 110, the first insulating layer 111, the second insulating layer 112, and the third insulating layer 113 in the bending region BA can be formed. In such an embodiment, the trench TR may include an opening 110a of the buffer layer 110, an opening 111a of the first insulating layer 111, an opening 112a of the second insulating layer 112, and an opening 113a of the third insulating layer 113. In another alternative embodiment, as Figure 5C As shown, according to the bending region BA, the trench TR may further include an opening 107a of the second barrier layer 107. The opening 107a of the second barrier layer 107 may correspond to the openings 110a, 111a, 112a, and 113a of the inorganic insulating layer IL. In such an embodiment, the bottom surface of the trench TR may be the upper surface of the second base layer 105. In this disclosure, the term "corresponding" may mean "overlapping".

[0130] Figure 6 yes Figure 3 A magnified view of region C in the image. Figure 7 This is a schematic plan view of a portion of the first conductive layer 230 according to an embodiment. Figure 6 In the diagram, the outline of the bottom surface of the trench TR is indicated by a dashed line.

[0131] like Figure 6 As shown, the structural member 210, as a single entity within the curved region BA, can have a substantially rectangular plate shape. The structural member 210 can be a plate-like member corresponding to the curved region BA. The structural member 210 can be insulated from the first conductive layer 230, the second conductive layer 213a, and the third conductive layer 213b, and can be in a floating state. The structural member 210 can extend along the curved region BA in a first direction D1 and overlap with the trench TR. In an embodiment, as... Figures 5A to 5C As shown, the structural member 210 may be covered by a fourth insulating layer 114, and a plurality of first conductive layers 230 may be located on the fourth insulating layer 114. The plurality of first conductive layers 230 may extend in the second direction D2, electrically connected to a second conductive layer 213a in the contact portion CNT in the first region A1, and electrically connected to a third conductive layer 213b in the contact portion CNT in the second region A2. The plurality of first conductive layers 230 may overlap with the structural member 210. The linewidth may increase as the distance between the first conductive layer 230 and the second conductive layer 213a decreases.

[0132] In an embodiment, such as Figure 7 As shown, a plurality of through-holes 230' are defined or formed by the first conductive layer 230. The plurality of through-holes 230' can be arranged in a row on a second direction D2, which is the extending direction of the first conductive layer 230. Although Figure 7 The illustration shows an embodiment in which the through-hole 230' has a basic rectangular shape in a plan view, but embodiments of the invention are not limited thereto. In one embodiment, for example, the shape of the through-hole 230' can be modified in various ways to have another shape in the plan view, such as a circular shape, a rhombus shape, a chamfered rectangular shape, a chamfered rhombus shape, an elliptical shape, a broken circular shape, etc. In an embodiment, the display device may further have a protective film covering at least a portion of the inner surfaces of the plurality of through-holes 230'. The protective film can prevent or minimize corrosion on the inner surfaces of the plurality of through-holes 230'. The protective film may include inorganic materials such as silicon oxide, silicon nitride, silicon oxynitride, etc.

[0133] Figure 8 According to the embodiments Figure 1 A schematic cross-sectional view of a portion of the display device. Figure 8 According to alternative embodiments along Figure 3 The cross-sectional view taken from lines II-II' and III-III' in the diagram.

[0134] In an embodiment, such as Figure 8 As shown, at least a portion of the upper surface of the fourth insulating layer 114 may be an uneven surface or a surface 114a with irregularities. Therefore, the surface area of ​​the upper surface of the fourth insulating layer 114 in the region corresponding to the trench TR, as well as the surface areas of the upper and bottom surfaces of the first conductive layer 230, can be increased. Because the upper surface of the fourth insulating layer 114 and the upper and bottom surfaces of the first conductive layer 230 have large surface areas, the tensile stress in the upper and bottom surfaces of the first conductive layer 230 and the fourth insulating layer 114 caused by bending of the substrate 100, etc., is reduced.

[0135] The first conductive layer 230, which contacts the uneven surface 114a of the fourth insulating layer 114, may also have an uneven shape. The bottom surface of the first conductive layer 230 may have a shape corresponding to the uneven surface 114a of the fourth insulating layer 114. In an embodiment, the upper surface of the first conductive layer 230 may have a shape corresponding to the uneven surface 114a of the fourth insulating layer 114.

[0136] In an alternative embodiment, the upper surface of the first conductive layer 230 may be an artificially formed uneven surface having a predetermined shape that does not correspond to the uneven surface 114a of the fourth insulating layer 114. In an embodiment, for example, after forming a conductive material layer over the fourth insulating layer 114, the uneven surface may be artificially formed on the upper surface of the first conductive layer 230 by coating photoresist on the conductive material layer and varying the exposure according to the area of ​​the photoresist, and by etching (removing) the conductive material layer using a slit mask, halftone mask, etc. In other embodiments described below, the uneven surface may be artificially formed on the upper surface of the first conductive layer 230, as described above. Even during the process of artificially forming the uneven surface on the upper surface of the first conductive layer 230, the uneven surface of the first conductive layer 230 may correspond to the uneven surface 114a of the fourth insulating layer 114.

[0137] The uneven surface 114a of the fourth insulating layer 114 can be formed by various methods. In one embodiment, for example, the uneven surface 114a of the fourth insulating layer 114 can be formed by etching (removing) the fourth insulating layer forming material by varying the exposure using a slit mask, a halftone mask, etc. Hereinafter, the portion that is etched more may be the recessed portion of the uneven surface 114a. However, the embodiments are not limited thereto. The uneven surface 114a of the fourth insulating layer 114 can be formed by using various methods (such as removing only specific portions of the fourth insulating layer forming material by methods such as dry etching).

[0138] In another alternative embodiment, the uneven surface 114a can be formed on the fourth insulating layer 114 by means of a structural member 210 located below the fourth insulating layer 114. In one embodiment, for example, the structural member 210 may not have such a structure. Figure 6 The monolithic structure shown in the bending region BA may include multiple patterns spaced apart from each other in and around the groove TR. The multiple patterns may be positioned to be spaced apart from each other in a first direction D1 and / or a second direction D2. The fourth insulating layer 114 covering the multiple patterns may have a surface 114a with irregularities corresponding to the arrangement of the patterns. The portion corresponding to the gap between the multiple patterns may be a recessed portion of the surface 114a. Even when the surface 114a is formed on the fourth insulating layer 114 in contact with the structural member 210 due to the deformation structure of the structural member 210, the process of artificially forming the surface 114a on the upper surface of the fourth insulating layer 114 may be further included.

[0139] Figure 8 The uneven surfaces of the fourth insulating layer 114 and the first conductive layer 230 shown can be applied to the above reference. Figure 5B and Figure 5C The described embodiments.

[0140] Figure 9A , Figure 10A and Figure 11A This is a plan view showing various embodiments of the structure of the structural member 210; and Figure 9B , Figure 10B and Figure 11B They are respectively along Figure 9A The line IV-IV' in the middle Figure 10A The lines V-V' and Figure 11A The cross-sectional view taken from line VI-VI' in the diagram.

[0141] In an embodiment, such as Figure 9A and Figure 9B As shown, the structural member 210 may include a plurality of patterns 210', which are linear floating patterns extending in the second direction D2 and having a predetermined width and length. The plurality of patterns 210' may be arranged parallel to each other at predetermined intervals in the first direction D1.

[0142] Multiple patterns 210' can be covered by a fourth insulating layer 114, and multiple first conductive layers 230 can be formed on the fourth insulating layer 114. The multiple first conductive layers 230 can extend in the second direction D2, electrically connected to a second conductive layer 213a in the contact portion CNT in the first region A1, and electrically connected to a third conductive layer 213b in the contact portion CNT in the second region A2. The first conductive layers 230 can overlap with the multiple patterns 210'. The width W1 of the first conductive layer 230 can be equal to or less than the width W2 of the pattern 210'.

[0143] Patterns 210' and the first conductive layer 230 may correspond one-to-one and overlap each other. Only a plurality of patterns 210' may be provided in the curved regions BA in which the first conductive layer 230 is not present. Patterns 210' may further be provided in the regions between the first conductive layers 230.

[0144] In alternative embodiments, such as Figure 10A and Figure 10B As shown, the structural member 210 may include a plurality of patterns 210', which are linear floating patterns extending in a first direction D1 and having a predetermined width and length. The plurality of patterns 210' may be arranged parallel to each other at predetermined intervals in a second direction D2.

[0145] Multiple patterns 210' can be covered by a fourth insulating layer 114, and multiple first conductive layers 230 can be formed on the fourth insulating layer 114. The multiple first conductive layers 230 can extend in the second direction D2, electrically connected to a second conductive layer 213a in the contact portion CNT in the first region A1, and electrically connected to a third conductive layer 213b in the contact portion CNT in the second region A2. The first conductive layers 230 can overlap with the multiple patterns 210'.

[0146] In another alternative embodiment, such as Figure 11A and Figure 11B As shown, the structural member 210 may include a plurality of patterns 210' as an island-like floating pattern. The plurality of patterns 210' may be arranged in a matrix form, spaced apart by predetermined intervals in a first direction D1 and a second direction D2. Although Figure 11A The illustration shows an embodiment in which multiple patterns 210' have a basic rectangular shape, but the embodiment is not limited thereto. The shape of the multiple patterns 210' can be changed or modified in various ways to have another shape such as a circular shape, an elliptical shape, a polygonal shape, a star shape, a rhombus shape, etc.

[0147] Multiple patterns 210' can be covered by a fourth insulating layer 114, and multiple first conductive layers 230 can be formed on the fourth insulating layer 114. The multiple first conductive layers 230 can extend in the second direction D2, electrically connected to a second conductive layer 213a in the contact portion CNT in the first region A1, and electrically connected to a third conductive layer 213b in the contact portion CNT in the second region A2. The first conductive layers 230 can overlap with the multiple patterns 210'.

[0148] Only a plurality of patterns 210' can be arranged in a matrix spaced apart from each other in the curved region BA where the first conductive layer 230 is not present. In another alternative embodiment, the plurality of patterns 210' can be further arranged between the first conductive layer 230.

[0149] exist Figure 9A , Figure 10A and Figure 11A In the illustrated embodiment, the linewidth increases as the distance between the first conductive layer 230 and the second conductive layer 213a decreases. Therefore, the area in which the portion of the first conductive layer 230 near the second conductive layer 213a overlaps with the pattern 210' is greater than the area in which the portion of the first conductive layer 230 near the third conductive layer 213b overlaps with the pattern 210'.

[0150] like Figure 9A , Figure 10A and Figure 11A As shown, the fourth insulating layer 114 covering multiple patterns 210' may have an uneven surface 114a on at least a portion of its upper surface to correspond to the arrangement of the multiple patterns 210'. The first conductive layer 230 in contact with the uneven surface 114a of the fourth insulating layer 114 may also have an uneven shape. The bottom surface of the first conductive layer 230 may have a shape corresponding to the uneven surface 114a of the fourth insulating layer 114. In an embodiment, the upper surface of the first conductive layer 230 may have a shape corresponding to the uneven surface 114a of the fourth insulating layer 114. In an alternative embodiment, by performing a process to form an artificially uneven surface, the upper surface of the first conductive layer 230 may have an uneven surface of a predetermined shape that does not correspond to the uneven surface 114a of the fourth insulating layer 114.

[0151] According to one or more embodiments, the display device can have a long service life while having minimal defects (such as disconnection) during the manufacturing process. However, the scope of this disclosure is not limited to the above effects.

[0152] It should be understood that the embodiments described herein are to be considered descriptive and not limiting. The description of features or aspects in each embodiment should typically be considered as other similar features or aspects that may be used in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various modifications in form and detail may be made to one or more embodiments without departing from the spirit and scope as defined by the appended claims.

Claims

1. A display device, comprising: A substrate includes a display area and a peripheral area outside the display area, wherein the peripheral area includes a curved area that is bent about a bending axis; An inorganic material layer is disposed on the substrate and has grooves corresponding to the bending region; A structural component is disposed in the groove of the inorganic material layer; A first organic material layer covers the structural components; as well as A conductive layer is disposed on the first organic material layer. The structural member comprises a conductive material, and at least a portion of the structural member is in contact with the inner surface of the trench in the inorganic material layer.

2. The display device according to claim 1, wherein, The structural component is insulated from the conductive layer.

3. The display device according to claim 1, wherein, The structural member has a plate shape corresponding to the grooves in the inorganic material layer.

4. The display device according to claim 1, wherein, The structural member includes a plurality of patterns, each pattern having a line shape that extends in a first direction parallel to the bending axis and is spaced apart from each other in a second direction perpendicular to the first direction.

5. The display device according to claim 1, wherein, The structural member includes a plurality of patterns, each pattern having a line shape extending in a second direction perpendicular to a first direction parallel to the bending axis and spaced apart from each other in the first direction.

6. The display device according to claim 1, wherein, The structural members comprise a plurality of patterns spaced apart from each other in a first direction parallel to the bending axis and in a second direction perpendicular to the first direction.

7. The display device according to claim 1, wherein, The structural components comprise the same material as the data lines disposed in the display area, and The conductive layer comprises the same material as the power supply voltage lines disposed in the display area.

8. The display device according to claim 1, further comprising: The second and third conductive layers are disposed on the inorganic material layer in the peripheral region and spaced apart from each other by the trenches in the inorganic material layer.

9. The display device according to claim 8, wherein, The conductive layer is connected to the second conductive layer and the third conductive layer.

10. The display device according to claim 1, wherein, The upper surface of the first organic material layer has an uneven shape.

11. The display device according to claim 1, wherein, The upper and lower surfaces of the conductive layer have an uneven shape.

12. The display device according to claim 1, further comprising: A second organic material layer covers the conductive layer.

13. A display device, comprising: The substrate includes a first region in which pixels are disposed, a second region in which driving units are disposed, and a curved region between the first region and the second region. An inorganic material layer is disposed in the curved region on the substrate; Structural components are disposed on the inorganic material layer; A first organic material layer covers the structural components; as well as A conductive layer is disposed on the first organic material layer and extends from the first region to the second region through the curved region. The grooves corresponding to the curved regions are formed in the inorganic material layer, and The structural member includes a conductive material, and at least a portion of the structural member is in contact with the inner surface of the trench in the inorganic material layer.

14. The display device according to claim 13, wherein, The structural member has a plate shape corresponding to the curved region.

15. The display device according to claim 13, wherein, The structural member extends in a second direction perpendicular to a first direction in which the conductive layer extends, and includes a plurality of patterns spaced apart from each other in the first direction.

16. The display device according to claim 13, wherein, The structural member extends in a first direction in which the conductive layer extends, and includes a plurality of patterns spaced apart from each other in a second direction perpendicular to the first direction.

17. The display device according to claim 13, wherein, The structural members include a plurality of patterns spaced apart from each other in a first direction in which the conductive layer extends and in a second direction perpendicular to the first direction.

18. The display device according to claim 13, wherein, The upper surface of the first organic material layer has an uneven shape.

19. The display device according to claim 13, wherein, The upper and lower surfaces of the conductive layer have an uneven shape.

20. The display device according to claim 13, further comprising: A second organic material layer covers the conductive layer.

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