Miniaturized image sensor

Abstract

This invention provides a miniaturized image sensor. The miniaturized image sensor includes: a frame; a PCB board disposed at an opening in the frame, the PCB board including multiple spaced-apart photoelectric conversion chips arranged in an array; and a lens structure disposed within the frame, the lens structure having multiple spaced-apart lenses, the optical axes of which are perpendicular to the PCB board, with each lens corresponding to one of the multiple photoelectric conversion chips. This invention solves the problem of small imaging range in existing image sensors.

Description

Technical Field

[0001] The present invention relates to the technical field of sensor equipment, and in particular to a miniaturized image sensor. Background Art

[0002] At present, the interior of the area array camera is a photosensitive chip. If you want to capture a larger (longer length, wider width) range of images, you need to increase the distance between the object and the camera, or increase the number of cameras. If the object-phase distance is increased, the corresponding resolution will be reduced, and a stronger external light source will be required. In some specific occasions, the object-phase distance cannot be increased due to installation space limitations, and replacing it with a stronger light source is a waste and increases the corresponding cost. If the number of cameras is increased, it will be inconvenient to install, and it cannot be guaranteed that multiple cameras can take pictures at the same time, so increasing the number of cameras is basically not a solution.

[0003] That is to say, the image sensor in the prior art has the problem of small shooting range. Summary of the invention

[0004] The main purpose of the present invention is to provide a miniaturized image sensor to solve the problem of small shooting range of image sensors in the prior art.

[0005] In order to achieve the above-mentioned purpose, the present invention provides a miniaturized image sensor, comprising: a frame; a PCB board, the PCB board is arranged at an opening of the frame, the PCB board includes a plurality of photoelectric conversion chips arranged at intervals, and the plurality of photoelectric conversion chips are arranged in an array; a lens structure, the lens structure is arranged in the frame, the lens structure has a plurality of lenses arranged at intervals, and the optical axis of the lens is perpendicular to the PCB board, and the plurality of lenses are arranged in a one-to-one correspondence with the plurality of photoelectric conversion chips.

[0006] Furthermore, the plurality of photoelectric conversion chips are arranged in a rectangular array.

[0007] Furthermore, the photoelectric conversion chips in two adjacent rows of photoelectric conversion chips are staggered.

[0008] Furthermore, the intervals between two adjacent photoelectric conversion chips in one row are the same, and the intervals between two adjacent photoelectric conversion chips in different rows are different.

[0009] Furthermore, the mutual projections of the photoelectric conversion chips in two adjacent rows do not overlap.

[0010] Furthermore, the resolution A of the miniaturized image sensor, the number of columns B of light holes on a photoelectric conversion chip in the arrangement direction of the photoelectric conversion chips, and the distance C between two adjacent photoelectric conversion chips in the same row satisfy: A=25.4*B / C.

[0011] Furthermore, the plurality of lenses are located on the same plane.

[0012] Furthermore, the plurality of photoelectric conversion chips are located on the same plane.

[0013] Furthermore, the scanning areas of two adjacent photoelectric conversion chips at least partially overlap in the extension direction of the lens.

[0014] Furthermore, the multiple lenses are of the same model, and the multiple photoelectric conversion chips are of the same model.

[0015] By applying the technical solution of the present invention, a miniaturized image sensor includes a frame, a PCB board and a lens structure. The PCB board is arranged at an opening of the frame, and the PCB board includes a plurality of spaced-apart photoelectric conversion chips, which are arranged in an array. The lens structure is arranged in the frame, and the lens structure has a plurality of spaced-apart lenses, and the optical axes of the lenses are perpendicular to the PCB board, and the plurality of lenses are arranged in a one-to-one correspondence with the plurality of photoelectric conversion chips.

[0016] By arranging multiple photoelectric conversion chips in an array, the miniaturized image sensor can scan images at multiple positions, thereby increasing the scanning range of the miniaturized image sensor. At the same time, the arrangement of multiple photoelectric conversion chips in an array can increase the shooting range of the miniaturized image sensor in multiple directions without increasing the object-image distance, and will not reduce the resolution of the miniaturized image sensor, thereby ensuring the imaging clarity of the miniaturized image sensor. Multiple lenses are arranged in a one-to-one correspondence with multiple photoelectric conversion chips to ensure that each photoelectric conversion chip can form a clear image. The PCB board provides a placement position for the photoelectric conversion chip and provides the required electrical energy for the photoelectric conversion chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0018] Figure 1 A schematic structural diagram of a miniaturized image sensor according to a first embodiment of the present invention is shown; and

[0019] Figure 2 Shows Figure 1 Schematic diagram of the arrangement of the photoelectric conversion chip;

[0020] Figure 3 Shows Figure 1 Schematic diagram of the arrangement position of the middle lens;

[0021] Figure 4 Shows Figure 1 Schematic diagram of the position relationship of the photoelectric conversion chip;

[0022] Figure 5 A schematic diagram showing the arrangement position of the photoelectric conversion chip of the miniaturized image sensor according to the second embodiment of the present invention is shown;

[0023] Figure 6 A schematic diagram showing the arrangement positions of lenses of a miniaturized image sensor according to a second embodiment of the present invention is shown.

[0024] The above drawings include the following reference numerals:

[0025] 10. Frame; 20. PCB board; 21. Photoelectric conversion chip; 22. Light hole; 30. Lens; 40. Placement plane. DETAILED DESCRIPTION

[0026] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0027] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0028] In the present invention, unless otherwise specified, the directional words used, such as "up, down, top, bottom", usually refer to the directions shown in the drawings, or to the components themselves in the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directional words are not used to limit the present invention.

[0029] In order to solve the problem of small shooting range of image sensors in the prior art, the present invention provides a miniaturized image sensor.

[0030] like Figures 1 to 6 As shown, the miniaturized image sensor includes a frame 10, a PCB board 20 and a lens structure. The PCB board 20 is arranged at an opening of the frame 10. The PCB board 20 includes a plurality of spaced photoelectric conversion chips 21, and the plurality of photoelectric conversion chips 21 are arranged in an array. The lens structure is arranged in the frame 10. The lens structure has a plurality of spaced lenses 30, and the optical axis of the lens 30 is perpendicular to the PCB board 20. The plurality of lenses 30 are arranged in a one-to-one correspondence with the plurality of photoelectric conversion chips 21.

[0031] By arranging multiple photoelectric conversion chips 21 in an array, the miniaturized image sensor can scan images at multiple positions, thereby increasing the scanning range of the miniaturized image sensor. At the same time, the array arrangement of multiple photoelectric conversion chips 21 can increase the shooting range of the miniaturized image sensor in multiple directions without increasing the object-image distance, and will not reduce the resolution of the miniaturized image sensor, thereby ensuring the imaging clarity of the miniaturized image sensor. Multiple lenses 30 are arranged in a one-to-one correspondence with multiple photoelectric conversion chips 21 to ensure that each photoelectric conversion chip 21 can form a clear image. The PCB board provides a placement position for the photoelectric conversion chip 21 and provides the required electrical energy for the photoelectric conversion chip 21.

[0032] Embodiment 1

[0033] like Figures 1 to 4 As shown, a plurality of photoelectric conversion chips 21 are arranged in a rectangular array. The plurality of photoelectric conversion chips 21 are arranged in a matrix array to facilitate the arrangement of the plurality of photoelectric conversion chips 21. This arrangement enables the scanning range of the plurality of miniaturized image sensors in all directions to be larger.

[0034] It should be noted that the miniaturized image sensor in this embodiment is suitable for scanning objects with similar length and width.

[0035] It should be noted that the distance between any two adjacent photoelectric conversion chips 21 can be the same, and this arrangement facilitates the arrangement of the photoelectric conversion chips 21. Of course, the intervals between the photoelectric conversion chips 21 in one row can also be the same, and the intervals between the photoelectric conversion chips 21 in different rows can be different. This facilitates the reasonable arrangement of the positions between the photoelectric conversion chips 21, avoids the situation where the scanning range overlaps a large range, the scanning efficiency is low, and can also avoid the situation where the scanning is incomplete.

[0036] Specifically, the resolution of the miniaturized image sensor is inversely proportional to the distance between two adjacent photoelectric conversion chips 21. The greater the resolution of the miniaturized image sensor, the smaller the distance between two adjacent photoelectric conversion chips 21. The resolution of the miniaturized image sensor is controlled by controlling the distance between two adjacent photoelectric conversion chips 21, thereby ensuring the imaging clarity of the miniaturized image sensor.

[0037] Specifically, the resolution A of the miniaturized image sensor, the number of columns B of the light holes 22 on one photoelectric conversion chip 21 in the arrangement direction of the photoelectric conversion chips 21, and the distance C between two adjacent photoelectric conversion chips 21 in the same row satisfy: A=25.4*B / C. The greater the resolution of the miniaturized image sensor, the smaller the distance between two adjacent photoelectric conversion chips 21. The resolution of the miniaturized image sensor is controlled by controlling the distance between two adjacent photoelectric conversion chips 21, thereby ensuring the imaging clarity of the miniaturized image sensor.

[0038] like Figure 3 As shown, multiple lenses 30 are located on the same plane. By arranging multiple lenses 30 on the same plane, images on the same plane can be scanned and imaged, and the scanning range of the miniaturized image sensor can be increased.

[0039] like Figure 2 As shown, a plurality of photoelectric conversion chips 21 are located on the same plane. The plurality of photoelectric conversion chips 21 are arranged in one-to-one correspondence with the plurality of lenses 30 to ensure that the plurality of photoelectric conversion chips 21 can scan images on the same plane.

[0040] Specifically, the scanning areas of two adjacent photoelectric conversion chips 21 at least partially overlap in the extension direction of the lens 30. The scanning direction of the miniaturized image sensor is the same as the extension direction of the lens 30, and the areas of the photoelectric conversion chips 21 at least partially overlap in the scanning direction of the miniaturized image sensor, thereby achieving seamless scanning and reducing the occurrence of incomplete scanning of the miniaturized image sensor.

[0041] Specifically, the multiple lenses 30 are of the same model, and the multiple photoelectric conversion chips 21 are of the same model. This arrangement facilitates the installation of the lenses 30 and the photoelectric conversion chips 21, avoids mismatching between the lenses 30 and the photoelectric conversion chips 21, and also facilitates adjustment of the distance between the photoelectric conversion chips 21.

[0042] The miniaturized image sensor of the present application integrates multiple photoelectric conversion chips 21 into one product. After receiving a unified control signal, each photoelectric conversion chip 21 takes a photo in a unified manner, and then each photoelectric conversion chip 21 transmits data independently. The photoelectric conversion chips 21 are arranged in an array, which can well solve the problem of needing to take large-scale images in a small space.

[0043] The miniaturized image sensor in this application enables the capture of relatively large images in a small space.

[0044] like Figure 1 As shown, the miniaturized image sensor also includes a placement plane 40, and the object to be scanned is placed on the placement plane 40 to ensure that the distance between the lens 30 and the object to be scanned is fixed. This setting can ensure the stability of the scanning of the miniaturized image sensor to ensure the clarity of the scanned image.

[0045] When designing a miniaturized image sensor, the arrangement of the photoelectric conversion chips 21 can be designed according to the required scanning range, and the number of photoelectric conversion chips 21 in each row and the number of photoelectric conversion chip rows of the miniaturized image sensor can also be adjusted.

[0046] Embodiment 2

[0047] The difference from the first embodiment is that the arrangement of the photoelectric conversion chips 21 is different.

[0048] like Figure 5 and Figure 6 As shown, the photoelectric conversion chips 21 in two adjacent rows of photoelectric conversion chips are staggered. This arrangement can increase the scanning range of the miniaturized image sensor while making the structure of the miniaturized image sensor more compact.

[0049] exist Figure 5 In the specific embodiment shown, the distance between two adjacent photoelectric conversion chips 21 in the same row is the same, which can ensure the resolution of the miniaturized image sensor.

[0050] exist Figure 5 In the specific embodiment shown, the distance between two adjacent photoelectric conversion chips 21 in the same row is greater than the distance between two adjacent photoelectric conversion chips 21 in two adjacent rows. This arrangement is conducive to the miniaturization of the miniaturized image sensor while ensuring the resolution of the miniaturized image sensor.

[0051] Specifically, the mutual projections of the photoelectric conversion chips 21 in two adjacent rows do not overlap. This arrangement increases the scanning range and makes the structure of the miniaturized image sensor more compact.

[0052] Since the photoelectric conversion chip 21 and the lens 30 are arranged in the same manner and are arranged one-to-one with each other, it is ensured that each lens 30 can be imaged onto the photoelectric conversion chip 21 .

[0053] In this embodiment, the photoelectric conversion chips 21 are arranged in a houndstooth pattern, which is more conducive to the miniaturization of the miniaturized image sensor.

[0054] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:

[0055] 1. It can capture images in a longer range, and as the length of the object increases, it is only necessary to increase the number of area array photosensitive chips of the corresponding length.

[0056] 2. It can capture images in a wider range, and as the width of the object increases, it is only necessary to increase the number of area array photosensitive chips of the corresponding width.

[0057] 3. Miniaturized image sensors are suitable for more occasions.

[0058] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0059] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0060] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0061] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A miniaturized image sensor, characterized in that: include: Frame (10); A PCB board (20), the PCB board (20) being arranged at an opening of the frame (10), the PCB board (20) comprising a plurality of photoelectric conversion chips (21) arranged at intervals, the plurality of photoelectric conversion chips (21) being arranged in an array; A lens structure, the lens structure being arranged in the frame (10), the lens structure comprising a plurality of lenses (30) arranged at intervals, the optical axes of the lenses (30) being perpendicular to the PCB board (20), and the plurality of lenses (30) being arranged in a one-to-one correspondence with the plurality of photoelectric conversion chips (21); The resolution A of the miniaturized image sensor, the number B of columns of light holes (22) on one of the photoelectric conversion chips (21) in the arrangement direction of the photoelectric conversion chips (21), and the distance C between two adjacent photoelectric conversion chips (21) in the same row satisfy: A=25.4*B / C.

2. The miniaturized image sensor according to claim 1, characterized in that: The plurality of photoelectric conversion chips (21) are arranged in a rectangular array.

3. The miniaturized image sensor according to claim 1, characterized in that: The photoelectric conversion chips (21) in two adjacent rows of photoelectric conversion chips are arranged in a staggered manner.

4. The miniaturized image sensor according to claim 3, characterized in that: The interval between two adjacent photoelectric conversion chips (21) in one row is the same, and the interval between two adjacent photoelectric conversion chips (21) in different rows is different.

5. The miniaturized image sensor according to claim 3, characterized in that: The mutual projections of the photoelectric conversion chips (21) in two adjacent rows do not overlap.

6. The miniaturized image sensor according to claim 1, characterized in that: The plurality of lenses (30) are located on the same plane.

7. The miniaturized image sensor according to claim 1, characterized in that: The plurality of photoelectric conversion chips (21) are located on the same plane.

8. The miniaturized image sensor according to claim 1, characterized in that: The scanning areas of two adjacent photoelectric conversion chips (21) at least partially overlap in the extension direction of the lens (30).

9. The miniaturized image sensor according to claim 1, characterized in that: The multiple lenses (30) are of the same model, and the multiple photoelectric conversion chips (21) are of the same model.

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