Display device

Abstract

A display device is provided, comprising a display panel and side pads. The display panel includes: a pixel array; side terminals including a side surface exposed outside the display panel; and transmission wiring electrically connecting the side terminals and the pixel array to each other. The side pads are conductive, and electrical signals are provided through the side pads from outside the display panel to the side terminals, the side pads contacting the display panel at the side surface of the side terminals exposed outside the display panel. One end of the transmission wiring is spaced apart from the side surface of the side terminals exposed outside the display panel.

Description

Technical Field

[0001] The embodiments relate to a display device. More specifically, the embodiments relate to a display device and a method of manufacturing the display device. Background Technology

[0002] The display device includes a display panel and a driver that provides drive signals to the display panel. The driver may be included in a driver chip. The driver chip may be directly bonded to the substrate of the display panel, or it may be connected to a pad of the display panel via a flexible printed circuit board or the like. Summary of the Invention

[0003] The embodiment provides a display device with a reduced bezel and improved reliability.

[0004] An embodiment provides a method for manufacturing a display device.

[0005] According to an embodiment, the display device includes a display panel and side pads. The display panel includes: a pixel array; side terminals including a side surface exposed outside the display panel; and transmission wiring electrically connecting the side terminals and the pixel array to each other. The side pads are conductive, and electrical signals are provided through the side pads from outside the display panel to the side terminals, with the side pads contacting the display panel at the side surface of the side terminals exposed outside the display panel. One end of the transmission wiring is spaced apart from the side surface of the side terminals exposed outside the display panel.

[0006] In an embodiment, the side terminal may include at least two conductive layers.

[0007] In an embodiment, the side terminal may include a first conductive layer and a second conductive layer disposed on the first conductive layer.

[0008] In one embodiment, the first conductive layer may contact the transmission wiring, and the second conductive layer may contact the first conductive layer.

[0009] In this embodiment, both the first conductive layer and the second conductive layer can make contact with the transmission wiring.

[0010] In an embodiment, the side terminal may include a first conductive layer disposed under the transmission wiring and a second conductive layer disposed on the transmission wiring.

[0011] In an embodiment, the side terminal may include a horizontally extending portion extending in a horizontal direction and a vertically extending portion extending along the side surface of the insulating layer adjacent to the side terminal at the contact surface between the side pad and the side terminal.

[0012] In an embodiment, the side terminal may include a conformal shape at the contact surface between the side pad and the side terminal, extending along the bottom of the opening and the side surface of the insulating layer located at the opening.

[0013] In an embodiment, the display panel may further include: an array substrate including each of a pixel array, side terminals, and transmission wiring located on a substrate; a cover substrate coupled to the array substrate; a sealing member disposed between the array substrate and the cover substrate to encapsulate the pixel array; and a filling member disposed between the cover substrate and the side terminals.

[0014] In one embodiment, the filling component may include a cured resin.

[0015] In one embodiment, the display device may further include an external drive unit coupled to the side pads. The external drive unit can provide drive signals or power (e.g., electrical signals) to the transmission wiring via the side pads and side terminals.

[0016] In one embodiment, the external driving device may include a flexible printed circuit board on which a driving chip is mounted.

[0017] In one embodiment, the pixel array may include organic light-emitting diodes.

[0018] According to an embodiment, a method for manufacturing a display device includes: arranging a display panel including a pixel array, side terminals, and transmission wiring, wherein the side terminals include a side surface closest to one end of the display panel, and the transmission wiring electrically connects the pixel array and the side terminals to each other; exposing the side surface of the side terminals to the outside of the display panel; arranging conductive side pads, and providing electrical signals to the side terminals from the outside of the display panel through the side pads, the side pads contacting the side surfaces of the side terminals exposed to the outside of the display panel; and arranging an external driving device, through which the electrical signals are provided to the side pads from the outside of the display panel, the external driving device being connected to the side pads. Within the display panel, one end of the transmission wiring is spaced apart from the side surface of the side terminals exposed to the outside of the display panel.

[0019] According to an embodiment, the display panel can be coupled to an external driving device at the exposed side surface of the side terminals of the display panel, thereby reducing the size of the peripheral area or bezel of the display panel.

[0020] Furthermore, the transmission wiring within the display panel is covered at its side surface and not exposed outside the display panel, and is electrically connected to the side pads outside the display panel via side terminals that are exposed outside the display panel. Therefore, damage to the transmission wiring that would occur when handling the side surface of the display panel if the side terminals were exposed outside the display panel can be reduced or effectively prevented.

[0021] Furthermore, since the side terminals include multiple conductive layers exposed to the outside of the display panel, the contact area between the side terminals and the side pads can be increased. Attached Figure Description

[0022] The above and other advantages and features of the invention will become clearer from the following detailed description taken in conjunction with the accompanying drawings.

[0023] Figure 1 This is a top view showing an embodiment of the display device.

[0024] Figure 2 This is a perspective view showing an embodiment of the display device.

[0025] Figure 3 This is an enlarged cross-sectional view showing an embodiment of the display device.

[0026] Figure 4 , Figure 6 and Figure 7 This is an enlarged cross-sectional view showing an embodiment of the joint area of ​​the display device.

[0027] Figure 5 This is a horizontal enlarged cross-sectional view of an embodiment of the joint area of ​​the display device.

[0028] Figures 8 to 11 This is an enlarged cross-sectional view illustrating an embodiment of a method for manufacturing a display device.

[0029] Figure 12 and Figure 13 This is an enlarged cross-sectional view showing an embodiment of the joint area of ​​the display device.

[0030] Figure 14 and Figure 15 This is a horizontal enlarged cross-sectional view showing an embodiment of the joint area of ​​the display device. Detailed Implementation

[0031] The invention will now be described more fully below with reference to the accompanying drawings, in which various embodiments are illustrated. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. The same reference numerals throughout refer to the same elements.

[0032] It will be understood that when an element is referred to as being related to another element (such as "on" another element), the element may be directly on said other element, or an intermediate element may exist therein. Conversely, when an element is referred to as being directly related to another element (such as "directly on" another element), there is no intermediate element.

[0033] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or part from another. Therefore, without departing from the teaching herein, “first element,” “first component,” “first region,” “first layer,” or “first part” discussed below may be referred to as a second element, second component, second region, second layer, or second part.

[0034] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, “a,” “an,” “the,” and “at least one” do not indicate a limitation of quantity and are intended to include both the singular and the plural. For example, unless the context clearly indicates otherwise, “element” has the same meaning as “at least one element.” “At least one” will not be construed as limited to “a” or “an.” “Or” means “and (and) / or (or).” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It will also be understood that when the terms “comprising” and / or “including” and variations thereof are used in this specification, it indicates the presence of the stated features, areas, integrals, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, areas, integrals, steps, operations, elements, components, and / or groups thereof.

[0035] Furthermore, relative terms such as “below” or “bottom” and “above” or “top” may be used here to describe the relationship between one element and another as shown in the accompanying drawings. It will be understood that relative terms are intended to encompass different orientations of the device other than those depicted in the drawings. For example, if the device in one of the drawings is flipped, an element described as being “below” the other element will subsequently be positioned “above” the other element. Thus, depending on the specific orientation of the drawing, the exemplary term “below” can encompass both “below” and “above” orientations. Similarly, if the device in one of the drawings is flipped, an element described as being “below” or “under” the other element will subsequently be positioned “above” the other element. Thus, the exemplary terms “below” or “under” can encompass both “above” and “below” orientations.

[0036] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in a general dictionary) shall be interpreted as having the same meaning as they have in the relevant field and in the context of this disclosure, and shall not be interpreted in an idealized or overly formalized sense, unless expressly defined herein.

[0037] Embodiments are described herein with reference to schematic cross-sectional views as idealized examples. Thus, variations in shape illustrated due to, for example, manufacturing techniques and / or tolerances will be expected. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but will include deviations in shape caused, for example, by manufacturing processes. For example, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, acute angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the precise shapes of the regions, nor are they intended to limit the scope of the claims.

[0038] According to conventional methods used in conventional display devices, a driver chip or a flexible printed circuit board on which the driver chip is mounted is bonded to the upper surface of the substrate of the display panel of the display device. The bonding of the driver chip to the planar area of ​​the display panel undesirably increases the bezel of the display device.

[0039] The following description, with reference to the accompanying drawings, will depict a display device and a method for manufacturing the display device according to embodiments of the invention, some of which are illustrated in the drawings.

[0040] Figure 1 This is a top view showing an embodiment of the display device 10. Figure 2 This is a perspective view showing an embodiment of the display device 10.

[0041] Reference Figure 1 and Figure 2 The display device 10 includes a display area DA and a peripheral area surrounding the display area DA. Light can be generated and / or emitted in the display area DA, or the transmittance of light provided by an external light source can be adjusted to display an image. The peripheral area can be defined as the area where no image is displayed, while the display area DA is the area where an image is displayed. The peripheral area is adjacent to the display area DA.

[0042] In an embodiment, the display device 10 may be an organic light-emitting display device. In an embodiment, for example, pixels PX may be arranged in an array (e.g., an array of pixels PX or multiple pixels PX). Pixels PX including light-emitting elements may be disposed in a display area DA to generate and / or emit light in response to a driving signal (e.g., an electrical signal) applied or transmitted to the pixels PX. The display device 10 may include a display panel having a display area DA, a peripheral area, and pixels PX corresponding to the display area DA, peripheral area, and pixels PX of the display device 10. The following elements may be included within the display panel, but are not limited thereto.

[0043] Signal and power wiring can be provided in the display area DA as conductive wiring for transmitting electrical signals, so as to transmit drive signals and power as electrical signals to the pixel PX respectively. In an embodiment, for example, gate line GL, data line DL, and power line PL can be provided as conductive wiring within the display area DA. Gate line GL can extend longitudinally along a first direction D1 and can provide a gate signal as an electrical signal to the pixel PX. Data line DL can extend longitudinally along a second direction D2 that intersects the first direction D1 and can provide a data signal as another electrical signal to the pixel PX. Power line PL can extend longitudinally along the second direction D2 and can provide power (e.g., electrical power, voltage, etc.) to the pixel PX.

[0044] The thickness of the display device 10, the display panel, and / or various components among these components is defined along a third direction intersecting both the first direction D1 and the second direction D2.

[0045] Transmission cabling TL (see) Figure 4 Circuit components, etc., can be disposed in the peripheral area. Transmission wiring TL can extend into or connect to the display area DA to transmit drive signals or power signals to the display area DA. Circuit components can generate drive signals. Circuit components can be connected to the display area DA. In an embodiment, for example, a driver DR, as a circuit component that generates gate signals, can be disposed in the peripheral area. Control signal wiring DSL that transmits control signals to the driver DR, fan-out wiring FL that transmits data signals to the data line DL, power bus wiring PBL that transmits power to the power line PL, etc., can be disposed in the peripheral area as transmission wiring TL.

[0046] In one embodiment, the peripheral region includes a sealing region SA in which a sealing member SM is disposed. The sealing region SA may have a shape surrounding the display region DA in a top view.

[0047] In one embodiment, within the display panel, the transmission wiring TL can extend to the side of the peripheral area. One end of the transmission wiring TL is electrically connected to the side terminal SC of the display panel (see...). Figure 4 The side terminal SC is electrically connected to an external drive unit outside the display panel. Therefore, within the display device 10, the transmission wiring TL can be electrically connected to the external drive unit to receive drive signals, control signals, power, etc. from the external drive unit.

[0048] The mating region BA may be defined by a planar region in which a plurality of side terminals SC (e.g., multiple side terminals SC) are disposed. In an embodiment, for example, the side terminals SC may be arranged in the mating region BA along a first direction D1. A filler member FM covering the side terminals SC may be disposed in the mating region BA.

[0049] In this embodiment, an external drive unit is engaged with a side surface of the display panel. The display panel may include the engagement area BA, side terminals SC, and filler member FM described above.

[0050] In an embodiment, for example, such as Figure 2 As shown, the display device 10 may include an array substrate 100, a cover substrate 220 facing and coupled to the array substrate 100, a sealing member SM disposed between the array substrate 100 and the cover substrate 220, and a filling member FM disposed between the array substrate 100 and the cover substrate 220. The filling member FM may extend longitudinally along a first direction D1 (e.g., the direction in which the side terminals SC are arranged).

[0051] Side terminal SC or side pad (or "solder pad") connected to side terminal SC (see...) Figure 4 The side surface of the SC is exposed at the side surface of the display panel. Therefore, an external drive unit can be engaged with the side surface of the display panel for electrical connection to the transmission cabling TL. The upper surface of the side terminal SC can be protected by a protective layer 182 (see...). Figure 4 The side terminal SC and the side pad CP are covered by either the side terminal SC or the filler component FM. Therefore, the contact surface of the side terminal SC and the side pad CP can be substantially defined by the exposed side surface of the side terminal SC. That is, the contact surface of the side terminal SC and the side pad CP can be defined only by the side surface of the side terminal SC that is exposed to the outside of the display panel at its side surface. The exposed side surface can be defined by the side surface of the conductive layer exposed to the outside of the display panel (e.g., the conductive side surface).

[0052] In an embodiment, for example, the external driving device may include a flexible printed circuit board 300 and a printed circuit board 400. A driving chip 310 is mounted on or to the flexible printed circuit board 300, and the printed circuit board 400 is electrically connected to the flexible printed circuit board 300. The driving chip 310 can transmit data signals to the transmission wiring TL of the display panel via the flexible printed circuit board 300. The printed circuit board 400 can transmit control signals, power, etc., to the transmission wiring TL of the display panel via the flexible printed circuit board 300.

[0053] Figure 3 This is an enlarged cross-sectional view showing an embodiment of the display device 10. Figure 3 An enlarged cross-sectional view (such as at the display area DA) of the display panel of the display device 10 may be shown.

[0054] Reference Figure 3 The pixel PX unit disposed in the display area DA may include a driving element disposed on the substrate 110 and a light-emitting element electrically connected to the driving element. In an embodiment, the light-emitting element may be an organic light-emitting diode 210. The light-emitting element may be driven or controlled by the driving element to generate and / or emit light for displaying an image. The driving element may include at least one thin-film transistor.

[0055] The buffer layer 120 can be disposed on the substrate 110. The active pattern AP can be disposed on the buffer layer 120.

[0056] In some embodiments, the substrate 110 may include, for example, glass, quartz, sapphire, polymer materials, etc. In other embodiments, the substrate 110 may include a transparent and relatively rigid material such as glass.

[0057] The buffer layer 120 can prevent or reduce the penetration of impurities, moisture, or external gases from outside the substrate 110, and can planarize the upper surface of the substrate 110. In embodiments, for example, the buffer layer 120 may include inorganic materials such as oxides, nitrides, etc.

[0058] The gate electrode GE of the driving element can be disposed on the active pattern AP. The first insulating layer 130 can be disposed between the active pattern AP and the gate electrode GE.

[0059] The gate wiring pattern GP can be disposed on the gate electrode GE. The gate wiring pattern GP may include capacitor electrodes forming part of a capacitor, wiring for transmitting various signals, etc.

[0060] The second insulating layer 140 may be disposed between the gate electrode GE and the gate wiring pattern GP. The third insulating layer 150 may be disposed on the gate wiring pattern GP.

[0061] In some embodiments, for example, the active patterned AP may include silicon or a metal-oxide-semiconductor. In other embodiments, the active patterned AP may include polycrystalline silicon, which may be doped with n-type or p-type impurities.

[0062] In another embodiment or Figure 3 In another transistor not shown, the active pattern AP may include a metal-oxide-semiconductor (MODS). In an embodiment, for example, the active pattern AP may include a two-component compound (AB) comprising indium (In), zinc (Zn), gallium (Ga), tin (Sn), titanium (Ti), aluminum (Al), hafnium (Hf), zirconium (Zr), and magnesium (Mg). x ), ternary compounds (AB) x C y ) or four-component compound (AB) x C y D z In an embodiment, for example, the active patterned AP may include zinc oxide (ZnO). x Gallium oxide (GaO) x Titanium oxide (TiO) x ), Tin oxide (SnO) x Indium oxide (InO) x Indium gallium oxide (“IGO”), indium zinc oxide (“IZO”), indium tin oxide (“ITO”), gallium zinc oxide (“GZO”), zinc magnesium oxide (“ZMO”), zinc tin oxide (“ZTO”), zinc zirconium oxide (ZnZr) x O y Indium gallium zinc oxide (“IGZO”), indium zinc tin oxide (“IZTO”), indium gallium hafnium oxide (“IGHO”), tin aluminum zinc oxide (“TAZO”), indium gallium tin oxide (“IGTO”), etc.

[0063] The first insulating layer 130, the second insulating layer 140, and the third insulating layer 150 may comprise silicon oxide, silicon nitride, silicon carbide, or combinations thereof. Furthermore, the first insulating layer 130, the second insulating layer 140, and the third insulating layer 150 may comprise insulating metal oxides such as aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, etc. In embodiments, for example, the first insulating layer 130, the second insulating layer 140, and the third insulating layer 150 may be along the thickness direction of the substrate 110 (e.g., along...). Figure 3 The substrate 110 (in the vertical direction) has a single-layer or multi-layer structure comprising silicon nitride and / or silicon oxide, or may have structures different from each other. As used herein, the “multi-layer structure” or stacked structure is obtained along the thickness direction of the substrate 110.

[0064] The gate electrode GE and the gate wiring pattern GP can include metals, metal alloys, metal nitrides, conductive metal oxides, etc. In embodiments, for example, the gate electrode GE and the gate wiring pattern GP can include gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti), tantalum (Ta), or alloys thereof, and can have a single-layer structure or a multi-layer structure including different metal layers.

[0065] A first source metal pattern may be disposed on a third insulating layer 150. The first source metal pattern may include a source electrode SE and a drain electrode DE that electrically contact the active pattern AP. The source electrode SE and the drain electrode DE may extend through the insulating layer disposed thereunder to contact the active pattern AP. In an embodiment, the active pattern AP, the gate electrode GE, the source electrode SE, and the drain electrode DE, together with the insulating layer and the gate wiring pattern GP located therebetween, may form a transistor.

[0066] A fourth insulating layer 160 may be disposed on the first source metal pattern. A second source metal pattern may be disposed on the fourth insulating layer 160. The second source metal pattern may include a connection electrode CE electrically connecting the drain electrode DE to the organic light-emitting diode 210 disposed thereon. In an embodiment, the second source metal pattern may further include a grid-shaped network of power lines to reduce or effectively prevent voltage drop of the power applied to the organic light-emitting diode 210. The grid shape may be defined by solid portions spaced apart from each other in two directions to define the space therebetween. A fifth insulating layer 170 may be disposed on the second source metal pattern.

[0067] The first and second source metal patterns can include metals, metal alloys, metal nitrides, conductive metal oxides, etc. In embodiments, for example, the first and second source metal patterns can include gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti), tantalum (Ta), or alloys thereof, and can have a single-layer structure or a multi-layer structure including different metal layers. In embodiments, the first and second source metal patterns can have a multi-layer structure including an aluminum layer.

[0068] The fourth insulating layer 160 and the fifth insulating layer 170 may include organic materials. In embodiments, for example, the fourth insulating layer 160 and the fifth insulating layer 170 may include organic insulating materials such as phenolic resin, acrylic resin, polyimide resin, polyamide resin, silicone resin, epoxy resin, etc.

[0069] The organic light-emitting diode 210 can be disposed on the fifth insulating layer 170. The organic light-emitting diode 210 may include a first electrode 212 for contacting the electrode CE, a light-emitting layer 214 disposed on the first electrode 212, and a second electrode 216 disposed on the light-emitting layer 214. The light-emitting layer 214 of the organic light-emitting diode 210 may be disposed at least in an opening of the pixel defining layer 180, which is disposed on the fifth insulating layer 170. The first electrode 212 may be the lower electrode of the organic light-emitting diode 210, and the second electrode 216 may be the upper electrode of the organic light-emitting diode 210.

[0070] The first electrode 212 can be used as an anode. In embodiments, for example, depending on the emission type of the display device 10, the first electrode 212 can be a light-transmitting electrode or a light-reflecting electrode. When the first electrode 212 is a transmissive electrode, it can include indium tin oxide, indium zinc oxide, zinc tin oxide, indium oxide, zinc oxide, tin oxide, etc. When the first electrode 212 is a reflective electrode, it can include gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti), or combinations thereof, and can have a stacked structure that further includes materials that can be used as transmissive electrodes.

[0071] The pixel defining layer 180 defines an opening that overlaps with or corresponds to at least a portion of the first electrode 212. In an embodiment, for example, the pixel defining layer 180 may include an organic insulating material.

[0072] The light-emitting layer 214 may include at least one of a hole injection layer (“HIL”), a hole transport layer (“HTL”), an organic light-emitting layer, an electron transport layer (“ETL”), and an electron injection layer (“EIL”). In embodiments, for example, the light-emitting layer 214 may include a relatively low molecular weight organic compound or a relatively high molecular weight organic compound.

[0073] In one embodiment, the light-emitting layer 214 can emit red, green, or blue light. In another embodiment, the light-emitting layer 214 can emit white light. The white-light-emitting layer 214 can have a multilayer structure including a red emitting layer, a green emitting layer, and a blue emitting layer, or a single-layer structure including a mixture of red emitting materials, green emitting materials, and blue emitting materials.

[0074] Depending on the emission type of the display device 10, the second electrode 216 can be a light-transmitting electrode or a light-reflecting electrode. In embodiments, for example, the second electrode 216 may include a metal, a metal alloy, a metal nitride, a metal fluoride, a conductive metal oxide, or a combination thereof.

[0075] In an embodiment, for example, the second electrode 216 may be a common layer that extends continuously over a plurality of pixels PX within the display area DA to correspond to each of the pixels PX.

[0076] A cover substrate 220 is disposed on the organic light-emitting diode 210. In embodiments, the cover substrate 220 may include, for example, glass, quartz, sapphire, polymer materials, etc. In embodiments, the cover substrate 220 may include a transparent rigid material such as glass.

[0077] In an embodiment, for example, a spacer may be disposed under the cover substrate 220 to support the cover substrate 220. The spacer may be disposed between the cover substrate 220 and the organic light-emitting diode 210 or between the pixel defining layer 180 and the second electrode 216 of the organic light-emitting diode 210.

[0078] The space SP between the substrate 220 and the organic light-emitting diode 210 can be in a vacuum state, or it can be filled with gas or a sealing member SM. The sealing member SM can include an organic layer, an inorganic layer, or a combination thereof.

[0079] In another embodiment, a flexible polymer substrate can be used instead of the cover substrate 220 as a relatively rigid element, or the cover substrate 220 can be omitted. In an embodiment, for example, an encapsulation layer is provided or formed to cover the organic light-emitting diode 210, and a protective window of the display device 10 can be provided on the encapsulation layer.

[0080] In this embodiment, the transmission wiring TL does not extend to the side surface of the display panel. Therefore, the transmission wiring TL is spaced apart from the side surface of the display panel. The transmission wiring TL contacts the side terminal SC of the display panel, and the side terminal SC extends to the side surface of the display panel such that a portion of the side terminal SC is exposed outside the display panel at the side surface of the display panel.

[0081] Figure 4 , Figure 6 and Figure 7 This is an enlarged cross-sectional view showing an embodiment of the bonding area BA of the display device 10. Specifically, Figure 4 , Figure 6 and Figure 7 It shows along Figure 1 The cross section taken by line I-I'. Figure 5 This is a horizontal enlarged cross-sectional view of an embodiment of the bonding area BA of the display device 10. Figures 4 to 7The view can be a view of the peripheral area (such as at the end of the display panel, where the side surfaces of one or more layers of the display panel are exposed outside the display panel). The end of the display panel may include a bonding area BA and a peripheral area extending from the bonding area BA to the boundary between the display area DA and the peripheral area (e.g., Figure 1 The remaining part of the dashed line in the middle.

[0082] Reference Figure 3 , Figure 4 and Figure 5 The transmission cabling TL can extend from the display area DA and toward the side surface of the display panel in the bonding area BA. The side surfaces of one or more layers of the display panel can define or correspond to the side surfaces of the display panel. In an embodiment, the transmission cabling TL can be a fan-out cabling FL. However, the embodiment is not limited thereto. In an embodiment, for example, the transmission cabling TL can be a power bus cabling PBL, a control signal cabling DSL, or a bridging cabling connected thereto.

[0083] Buffer layer 122 and first insulating layer 132 may be disposed in the bonding region BA between the transmission wiring TL and the substrate 110. Buffer layer 122 and first insulating layer 132 at the ends of the display panel may be extensions of buffer layer 120 and first insulating layer 130 of the display region DA, respectively. Buffer layer 122 and first insulating layer 132 in the peripheral region may be portions of the same material layer from which buffer layer 120 and first insulating layer 130 are provided, respectively, in the method of manufacturing the display device 10. As used herein, features provided by the same material layer or as extensions of each other may be referred to as being "in the same layer".

[0084] In an embodiment, the transmission wiring TL in the peripheral area may be located in the same layer as the gate electrode GE in the display area DA.

[0085] The side terminal SC makes electrical contact with the transmission wiring TL and extends to the side surface of the display panel. In embodiments, the side terminal SC may be disposed in a different layer from the transmission wiring TL, and may have a multi-layer structure.

[0086] In an embodiment, for example, the side terminal SC may include a first conductive layer SC1 disposed on the transmission wiring TL, a second conductive layer SC2 disposed on the first conductive layer SC1, a third conductive layer SC3 disposed on the second conductive layer SC2, and a fourth conductive layer SC4 disposed on the third conductive layer SC3. However, the embodiment is not limited thereto. In an embodiment, for example, the side terminal SC may include at least one conductive layer, such as at least two conductive layers, to increase the contact area of ​​the side terminal SC relative to components disposed outside the display panel. See also Figure 4For example, the first conductive layer SC1 of the side terminal SC forms a connection with the transmission wiring TL, and the second conductive layer SC2 of the side terminal SC forms a connection with the first conductive layer SC1.

[0087] In this embodiment, the first conductive layer SC1 may be located in the same layer as the gate wiring pattern GP of the display area DA. The second conductive layer SC2 may be located in the same layer as the first source metal pattern of the display area DA. The third conductive layer SC3 may be located in the same layer as the second source metal pattern of the display area DA. The fourth conductive layer SC4 may be located in the same layer as the first electrode 212 of the organic light-emitting diode 210 of the display area DA.

[0088] In an embodiment, for example, the second insulating layer 142 may be disposed between the first conductive layer SC1 and the transmission wiring TL, the third insulating layer 152 may be disposed between the first conductive layer SC1 and the second conductive layer SC2, the fourth insulating layer 162 may be disposed between the second conductive layer SC2 and the third conductive layer SC3, and the fifth insulating layer 172 may be disposed between the third conductive layer SC3 and the fourth conductive layer SC4.

[0089] Each of the conductive layers can be electrically connected to the transmission cable TL. In an embodiment, for example, the first conductive layer SC1 can penetrate the thickness of the second insulating layer 142 to contact the transmission cable TL, the second conductive layer SC2 can penetrate the thickness of the third insulating layer 152 to contact the first conductive layer SC1, the third conductive layer SC3 can penetrate the thickness of the fourth insulating layer 162 to contact the second conductive layer SC2, and the fourth conductive layer SC4 can penetrate the thickness of the fifth insulating layer 172 to contact the third conductive layer SC3.

[0090] The second insulating layer 142, third insulating layer 152, fourth insulating layer 162, and fifth insulating layer 172 in the peripheral region can be extensions of the second insulating layer 140, third insulating layer 150, fourth insulating layer 160, and fifth insulating layer 170 in the display area DA, respectively. The second insulating layer 142, third insulating layer 152, fourth insulating layer 162, and fifth insulating layer 172 in the peripheral region can be portions of the same material layer from which the second insulating layer 140, third insulating layer 150, fourth insulating layer 160, and fifth insulating layer 170 are respectively provided during the method of manufacturing the display device 10.

[0091] At least one of the buffer layer 122, the first insulating layer 132, the second insulating layer 142, the third insulating layer 152, the fourth insulating layer 162, and the fifth insulating layer 172 may be partially or completely removed in the region corresponding to the sealing member SM and / or the engagement region BA. In embodiments, for example, one or more insulating layers comprising organic material may be omitted under the sealing member SM.

[0092] The protective layer 182 can be disposed or formed on the fourth conductive layer SC4. The protective layer 182 in the peripheral region can be located in the same layer as the pixel defining layer 180 of the display area DA.

[0093] In this embodiment, a filler member FM is disposed between the fourth conductive layer SC4 and the cover substrate 220. The filler member FM can fill the space between the side terminal SC in the bonding region BA and the cover substrate 220 to reduce or effectively prevent damage to the sealing member SM due to grinding or polishing processes or contamination by particles generated by grinding or polishing processes.

[0094] In embodiments, for example, the filler member FM may include a cured resin such as silicone, epoxy, phenolic resin, etc. Furthermore, similar to the arrangement of the sealing member SM, the filler member FM may be disposed or formed from glass frit.

[0095] Figure 4 The illustration shows a filling member FM spaced apart from a sealing member SM along a second direction D2, creating a space between the filling member FM and the sealing member SM. However, the embodiment is not limited to this. In embodiments, for example, the filling member FM may contact or be connected to the sealing member SM, thus occupying... Figure 4 The space shown is either the whole or a part of it.

[0096] The side pad CP of the contact side terminal SC is disposed on the side surface of the display panel. In an embodiment, for example, the side pad CP may extend in a vertical direction (e.g., the thickness direction) to cover at least a portion of the side surface of the substrate 110 or the substrate 220.

[0097] The side pad CP can include a conductive material such as a metal. In embodiments, for example, a metal layer can be set or formed by depositing a metal material such as gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti), tantalum (Ta), etc. The metal layer can be patterned, for example, by laser to form the side pad CP. However, embodiments are not limited to this. In embodiments, for example, the metal pattern can be formed directly on the display panel by using a mask with openings, and the side pad CP is set with openings.

[0098] One end (e.g., end or termination) of the transmission wiring TL may be spaced apart from the side surface of the display panel. In an embodiment, for example, one end of the transmission wiring TL may be spaced apart along the second direction D2 from one end of the substrate 110 or the contact surface of the side terminal SC and the side pad CP.

[0099] The contact surface of the side terminal SC may include, but is not limited to, the collection of side surfaces of layers (such as conductive layers therein) within the side terminal SC. See reference. Figure 5 For example, the sum of the planar areas of the side surfaces of the conductive layers of the side terminals SC can define the total contact area of ​​the side terminals SC and / or the total contact area of ​​the side pads CP. The planar area of ​​the side pads CP ( Figure 5 The dashed line in the diagram can be equal to or greater than the total contact area of ​​the side terminal SC, but is not limited to this.

[0100] The side pad CP can be bonded to the flexible printed circuit board 300 via the conductive connection member CM.

[0101] The conductive connection member CM can be disposed or formed by various methods. In one embodiment, for example, the conductive connection member CM can be an anisotropic conductive film (“ACF”) having conductive particles dispersed therein. In another embodiment, the conductive connection member CM can be a conductive bump bonded to the side pad CP, for example, by ultrasonic welding. However, the embodiments are not limited thereto, and various conventional bonding methods can be used to bond the side pad CP to the flexible printed circuit board 300 and to dispose of or form the conductive connection member CM.

[0102] According to an embodiment, the side surface of the display panel is exposed outside the display panel and is engaged with an external driving device, thereby reducing the size of the peripheral area or bezel of the display panel and / or display device 10.

[0103] Furthermore, the transmission wiring TL in the display panel is not exposed outside the display panel at its side surface and is electrically connected to the side pad CP via the side terminal SC. Therefore, damage to the transmission wiring TL that may occur when handling the side surface of the display panel can be reduced or effectively prevented.

[0104] Furthermore, since the side terminal SC includes multiple conductive layers, the contact area between the side terminal SC and the side pad CP at that location can be increased.

[0105] The construction of the side terminal SC can be varied depending on the construction of the transmission cabling TL. In an embodiment, for example, refer to... Figure 6 The transmission wiring TL can be set in the same layer as the gate wiring pattern GP.

[0106] When the transmission wiring TL and the gate wiring pattern GP are disposed in the same layer, the side terminal SC may include a first conductive layer SC1 disposed on the transmission wiring TL, a second conductive layer SC2 disposed on the first conductive layer SC1, and a third conductive layer SC3 disposed on the second conductive layer SC2.

[0107] The first conductive layer SC1 can be located in the same layer as the first source metal pattern of the display area DA. The second conductive layer SC2 can be located in the same layer as the second source metal pattern of the display area DA. The third conductive layer SC3 can be located in the same layer as the first electrode 212 of the organic light-emitting diode 210 of the display area DA.

[0108] Reference Figure 7 When the transmission wiring TL and the gate wiring pattern GP are disposed in the same layer, the side terminal SC may include a first conductive layer SC1 disposed under the transmission wiring TL, a second conductive layer SC2 disposed on the transmission wiring TL, a third conductive layer SC3 disposed on the second conductive layer SC2, and a fourth conductive layer SC4 disposed on the third conductive layer SC3.

[0109] The first conductive layer SC1 can be located in the same layer as the gate electrode GE of the display area DA. The second conductive layer SC2 can be located in the same layer as the first source metal pattern of the display area DA. The third conductive layer SC3 can be located in the same layer as the second source metal pattern of the display area DA. The fourth conductive layer SC4 can be located in the same layer as the first electrode 212 of the organic light-emitting diode 210 of the display area DA.

[0110] The first conductive layer SC1 and the second conductive layer SC2 can contact the transmission wiring TL.

[0111] Figures 8 to 11 This is an enlarged cross-sectional view illustrating an embodiment of a method for manufacturing a display device 10. Figures 8 to 11 A cross-section of the junction region BA can be shown.

[0112] Reference Figure 8 A buffer layer 122 is disposed or formed on a substrate 110. A first insulating layer 132 is disposed or formed on the buffer layer 122. A transmission wiring TL is disposed or formed on the first insulating layer 132. A second insulating layer 142 is disposed or formed on the transmission wiring TL. A first conductive layer SC1 that contacts the transmission wiring TL is disposed or formed on the second insulating layer 142. A third insulating layer 152 is disposed or formed on the first conductive layer SC1. A second conductive layer SC2 that contacts the first conductive layer SC1 is disposed or formed on the third insulating layer 152. A fourth insulating layer 162 is disposed or formed on the second conductive layer SC2. A third conductive layer SC3 that contacts the second conductive layer SC2 is disposed or formed on the fourth insulating layer 162. A fifth insulating layer 172 is disposed or formed on the third conductive layer SC3. A fourth conductive layer SC4 that contacts the third conductive layer SC3 is disposed or formed on the fifth insulating layer 172. A protective layer 182 is disposed or formed on the fourth conductive layer SC4.

[0113] Each element in the conductive layer can also be referred to as a conductive pattern. Such patterns can be independent patterns. See also... Figure 4 , Figure 5 and Figure 8 For example, each of the conductive patterns has independent dimensions in a first direction D1, a second direction D2, and a thickness direction (e.g., the vertical direction). Figure 8 In this process, the insulating layer and the protective layer 182 each extend further than the plurality of ends of the conductive pattern on one side corresponding to the side surface of the display panel (e.g., at end I'). Figure 8 The structure in the middle can form a preliminary structure for the display panel. The display panel of the display device 10 can be defined by the preliminary structure processed as described below.

[0114] The insulating layer, conductive layer, and protective layer 182 in the peripheral area can be set or formed during the process of forming the driving element and organic light-emitting diode 210 in the display area DA, or by means of the process of forming the driving element and organic light-emitting diode 210 in the display area DA. At least one of the insulating layers can be omitted.

[0115] A structure including a substrate 110, a pixel array (e.g., an array of pixels PX) disposed or formed in a display area DA of the substrate 110, and a bonding structure disposed or formed in a peripheral area including a bonding area BA can be referred to as an array substrate 100.

[0116] Reference Figure 9 A cover substrate 220 is disposed on the array substrate 100. A sealing member SM may be disposed or formed between the cover substrate 220 and the array substrate 100 to combine the cover substrate 220 with the array substrate 100 and encapsulate the pixel array in the display area DA. Figure 9 The structure in the middle can form the preliminary structure of the display panel. The display panel of the display device 10 can be defined by the preliminary structure that is further processed as described below.

[0117] In an embodiment, for example, the sealing member SM can be formed or disposed of using a curable polymer resin or a glass frit. In an embodiment, the glass frit can be coated onto the sealing region SA, a cover substrate 220 can be disposed on the glass frit, and the glass frit can be cured by heat, ultraviolet (“UV”) light, laser, etc., to form the sealing member SM in the sealing region SA.

[0118] A filler member FM can be provided between the side terminal SC and the cover substrate 220.

[0119] In an embodiment, the filler member FM may be set or formed after the array substrate 100 and the cover substrate 220 are bonded together by injecting a polymer resin between the array substrate 100 and the cover substrate 220 and allowing it to cure.

[0120] In another embodiment, a curable polymer resin may be coated on the bonding region BA of the array substrate 100 before or after the glass frit is applied to the sealing region SA of the array substrate 100. Subsequently, a cover substrate 220 is applied to the glass frit and the curable polymer resin, and the glass frit and the curable polymer resin are cured to form the sealing member SM and the filling member FM.

[0121] In another embodiment, the filling member FM may be set or formed from glass frit together with the formation of the sealing member SM.

[0122] Reference Figure 10 In the initial structure of the display panel, the display panel, which includes an array substrate 100 and a cover substrate 220 bonded together, is further processed to expose the side surfaces of the side terminals SC to the outside of the display panel.

[0123] In an embodiment, to expose the side surface of the display panel, processing the side surface of the display panel may include scribing the display panel, grinding a layer of preliminary structure disposed on the side surface of the display panel, polishing the side surface of the display panel, or a combination thereof.

[0124] Processing components 500 used to process the side surfaces of a display panel and expose the side surfaces to the outside of the display panel may include scribing machines, grinding machines, polishing machines, etc.

[0125] exist Figure 10 In this process, when the side surface of the display panel is exposed to the outside, portions of each of the insulating layer, the filler member FM, and the protective layer 182 that previously extended further than the multiple ends of the conductive pattern at the side surface of the display panel are removed. In an embodiment, processing the side surface of the preliminary structure may involve setting the end surfaces of each of the insulating layer, the filler member FM, and the protective layer 182 to be coplanar with each other, but is not limited thereto.

[0126] Reference Figure 11 By processing the side surfaces of the preliminary structure, the end surfaces of the insulating layer, the filling member FM, and the protective layer 182 are all exposed to the outside of the display panel. That is, the side terminals SC are exposed to the outside of the display panel. Side pads CP are provided or formed on the side surfaces of the display panel where the side terminals SC are exposed. The side surfaces of the display panel may include, but are not limited to, the combination of the end surfaces of the insulating layer, the filling member FM, and the protective layer 182.

[0127] In one embodiment, for example, a metal material layer is disposed or formed on the side surface of the display panel by a deposition process such as sputtering. The metal material layer is then patterned to form side pads (CP).

[0128] After that, as Figure 4As shown, the side pad CP is combined with the external drive unit through anisotropic conductive film, ultrasonic welding, etc. As a result, the external drive unit can be electrically connected to the transmission cable TL through the side terminal SC exposed outside the display panel and the side pad CP connected to the side terminal SC.

[0129] Figure 12 and Figure 13 This is an enlarged cross-sectional view showing an embodiment of the bonding area BA of the display device 10.

[0130] Reference Figure 12 The side terminal SC is located in the mating area BA. The transmission wiring TL is electrically connected to the side terminal SC.

[0131] In an embodiment, for example, the side terminal SC includes a first conductive layer SC1 disposed on the transmission wiring TL, a second conductive layer SC2 disposed on the first conductive layer SC1, a third conductive layer SC3 disposed on the second conductive layer SC2, and a fourth conductive layer SC4 disposed on the third conductive layer SC3.

[0132] In one embodiment, at least two of the conductive layers may contact the transmission wiring TL to define more than one contact area between the side terminal SC and the transmission wiring TL. In another embodiment, for example, each of the first to fourth conductive layers SC1, SC2, SC3, and SC4 may contact the transmission wiring TL to define four contact areas between the side terminal SC and the transmission wiring TL.

[0133] The above configuration can reduce the electrical contact resistance between the side terminal SC and the transmission wiring TL.

[0134] In addition, such as Figure 13 As shown, the insulating layer between the conductive layers can be removed or omitted. In an embodiment, for example, one or more conductive layers can contact each other to form a connection therebetween (e.g., a contact area). Conductive layers with omitted insulating layers can be connected to the transmission cable TL at a single contact area of ​​the side terminal SC relative to the transmission cable TL, and are not limited thereto.

[0135] Figure 14 and Figure 15 This is a horizontal enlarged cross-sectional view showing an embodiment of the bonding area BA of the display device 10. Figure 14 and Figure 15 A view can be shown of the exposed side surface of the side terminal SC, which is the contact surface between the side terminal SC and the side pad CP.

[0136] Reference Figure 14On the side surface of the display panel, the side pad CP contacts the side terminal SC. The side terminal SC may include a first conductive layer SC1, a second conductive layer SC2 disposed on the first conductive layer SC1, a third conductive layer SC3 disposed on the second conductive layer SC2, and a fourth conductive layer SC4 disposed on the third conductive layer SC3.

[0137] The end surface of the conductive layer defines the side surface of the side terminal SC, and includes, respectively, a horizontally extending portion extending along the substrate 110 in a plane defined by a first direction D1 and a second direction D2 (e.g., a planar direction). (Refer to...) Figure 14 At least one of the conductive layers may include a vertically extending portion extending in a vertical direction (e.g., the thickness direction). In an embodiment, for example, the vertically extending portion may extend along a side surface of an insulating layer adjacent to a side terminal.

[0138] Reference Figure 14 For example, the first conductive layer SC1 may include a horizontally extending portion SC1a extending in a horizontal direction and a vertically extending portion SC1b passing through the second insulating layer 142, the first insulating layer 132, and the buffer layer 122 disposed under the horizontally extending portion SC1a. The second conductive layer SC2 may include a horizontally extending portion SC2a extending in a horizontal direction and a vertically extending portion SC2b passing through the third insulating layer 152 disposed under the horizontally extending portion SC2a. The third conductive layer SC3 may include a horizontally extending portion SC3a extending in a horizontal direction and a vertically extending portion SC3b passing through the fourth insulating layer 162 disposed under the horizontally extending portion SC3a. The fourth conductive layer SC4 may include a horizontally extending portion SC4a extending in a horizontal direction and a vertically extending portion SC4b passing through the fifth insulating layer 172 disposed under the horizontally extending portion SC4a.

[0139] like Figure 14 As shown, the conductive layers may form multiple contact areas with each other along the first direction D1, but are not limited thereto. At the side surface of the display panel, the contact area or contact surface between the side pad CP and the side terminal SC is defined by one or more of the aforementioned horizontal and vertical extension portions. That is, the contact surface between the side pad CP and the side terminal SC is defined by the planar area of ​​the side terminal SC exposed to the outside of the display panel.

[0140] In addition, such as Figure 15As shown, openings can be provided or formed through the buffer layer 122, the first insulating layer 132, and the second insulating layer 142. The opening can be a single opening common to each of the aforementioned layers. The first conductive layer SC1 can have a conformal shape extending along the bottom surface of the opening defined by the substrate 110 and the side surface of the opening jointly defined by the sidewalls of the buffer layer 122, the first insulating layer 132, and the second insulating layer 142. Furthermore, the second conductive layer SC2, the third conductive layer SC3, and the fourth conductive layer SC4 disposed on the first conductive layer SC1 can have conformal shapes extending along the upper surface and side surface of the first conductive layer SC1. At the side surface of the display panel, the contact area or contact surface between the side pad CP and the side terminal SC is defined by a conformal shape or contour that extends along the bottom of the opening and the side surface of the insulating layer at the opening. That is, the contact surface between the side pad CP and the side terminal SC is defined by the planar area of ​​the side terminal SC exposed to the outside of the display panel. In an embodiment, the side surface of the side terminal SC exposed to the outside of the display panel includes a conformal conductive portion extending along the bottom of the opening and along the sidewall of the insulating layer at the opening.

[0141] like Figure 14 and Figure 15 As shown, the side terminal SC may have or define portions extending in both the horizontal and vertical directions. Therefore, the contact area between the conductive layers can be increased, thereby reducing the contact resistance within the side terminal SC and increasing its connection reliability. Within the conductive layers, one of the horizontal and vertical portions can be considered an extension of the other.

[0142] The above embodiments provide an organic light-emitting display device. However, the embodiments are not limited thereto. In another embodiment, for example, the embodiments can be applied to the bonding structure of display devices such as liquid crystal display devices, electroluminescent display devices, micro light-emitting diode (“LED”) display devices, etc.

[0143] The embodiments can be applied to various display devices. For example, the embodiments can be applied to vehicle display devices, ship display devices, aircraft display devices, portable communication devices, display devices for display or for information transmission, medical display devices, etc.

[0144] The foregoing is illustrative of the embodiments and should not be construed as limiting them. Although embodiments have been described, those skilled in the art will readily understand that many modifications can be made to the embodiments without substantially departing from the novel teachings of the invention. Therefore, all such modifications are intended to be included within the scope of the invention. It should be understood that the foregoing is illustrative of various embodiments and should not be construed as limiting to the specific embodiments disclosed, and modifications to the disclosed embodiments and other embodiments are included within the scope of the invention as set forth in the claims and their equivalents.

Claims

1. A display device, the display device comprising: A display panel includes: a pixel array; side terminals, including a side surface exposed outside the display panel; transmission wiring electrically connecting the side terminals and the pixel array to each other; and an insulating layer adjacent to the side terminals; and The side pads are conductive, and electrical signals are provided from the outside of the display panel to the side terminals through the side pads. The side pads contact the display panel at the side surface of the side terminals exposed to the outside of the display panel. Wherein, one end of the transmission wiring is spaced apart from the side surface of the side terminal exposed outside the display panel, and The side terminal is electrically connected to the transmission wiring through the insulating layer.

2. The display device according to claim 1, wherein, The side terminal includes at least two conductive layers.

3. The display device according to claim 2, wherein, The side terminal includes a first conductive layer and a second conductive layer arranged along the thickness direction of the display device.

4. The display device according to claim 3, wherein, The first conductive layer of the side terminal is connected to the transmission wiring, and The second conductive layer of the side terminal is connected to the first conductive layer.

5. The display device according to claim 3, wherein, Each of the first conductive layer and the second conductive layer forms a connection with the transmission wiring.

6. The display device according to claim 2, wherein, The side terminal includes a first conductive layer and a second conductive layer arranged along the thickness direction of the display device, and Along the thickness direction of the display device, the transmission wiring is located between the first conductive layer and the second conductive layer.

7. The display device according to claim 2, in, Each of the at least two conductive layers has an end surface exposed outside the display panel to define the side surface of the side terminal, the end surface comprising: The horizontal extension extends along a plane defined by a first direction and a second direction that intersect each other, and A vertical extension extends along the thickness direction of the display device, the thickness direction being defined by a third direction intersecting each of the first and second directions, the vertical extension extending from the horizontal extension and through the insulating layer.

8. The display device according to claim 2, wherein, An opening is defined in the insulating layer. Wherein, at the opening, the end surface of each of the at least two conductive layers is exposed outside the display panel to define the side surface of the side terminal, the end surface including a conformal shape extending along the bottom of the opening and along the side surface of the insulating layer defining the opening.

9. The display device according to claim 1, wherein, The display panel also includes: An array substrate includes each of the pixel array, the side terminals, and the transmission wiring located on a substrate. Covering substrate, facing the array substrate; A sealing member that bonds the array substrate and the cover substrate together and encapsulates the pixel array; and A filling member is disposed between the cover substrate and the side terminal.

10. The display device according to claim 9, wherein, The filling component comprises a cured resin.

11. The display device according to claim 1, further comprising an external driving device connected to the side pad and the electrical signal being provided from outside the display panel to the side pad via the external driving device.

12. The display device according to claim 11, wherein, The external driving device includes a flexible printed circuit board on which a driving chip is mounted.

13. The display device according to claim 11, wherein, The pixel array includes organic light-emitting diodes.

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