Electronic device

Abstract

An electronic device is disclosed. The electronic device includes an electronic module and an electronic panel superposed with the electronic module. The electronic panel includes a base substrate divided into a hole region including a hole transmissive region superposed with the electronic module when viewed in a plan view and a light blocking region adjacent to the hole transmissive region, an active region adjacent to the hole region, and a peripheral region adjacent to the active region, a plurality of light emitting devices separated from the hole region in the active region, a light blocking pattern separated from the hole transmissive region in the light blocking region, and an encapsulation substrate on the base substrate and covering the light emitting devices, wherein the light blocking pattern includes a glass frit.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2019-0094361, filed on August 2, 2019, the entire contents of which are incorporated herein by reference. Technical Field

[0002] Some aspects of exemplary embodiments of this disclosure relate to an electronic panel and an electronic device including the electronic panel. Background Technology

[0003] Electronic devices can be activated based on electrical signals. Electronic devices may include display panels for displaying images or touch sensors for sensing external input (e.g., touch input from an external object such as a user's finger or stylus). Organic light-emitting display panels in display panels have relatively low power consumption, relatively high brightness, and relatively high response speed.

[0004] Additionally, the electronic device may include an electronic module that receives external signals (from an external source) or provides output signals to the outside. The electronic module, together with the display panel, is housed in a casing or similar enclosure to constitute the electronic device.

[0005] The information disclosed in this background section is only used to enhance the understanding of the background, and therefore the information discussed in this background section does not necessarily constitute prior art. Summary of the Invention

[0006] Some aspects of exemplary embodiments of this disclosure relate herein to an electronic panel and an electronic device including the electronic panel, for example, to an electronic panel superimposed on an electronic module and an electronic device including the electronic panel.

[0007] Some exemplary embodiments of this disclosure include electronic panels capable of improving the aesthetics of areas superimposed with electronic modules, and electronic devices including such electronic panels.

[0008] According to some exemplary embodiments of the inventive concept, an electronic panel includes: a substrate divided into an aperture region, an effective region adjacent to the aperture region, and a peripheral region adjacent to the effective region, the aperture region including a aperture transmission region superimposed on an electronic module when viewed in a plane and a light-shielding region adjacent to the aperture transmission region; a plurality of light-emitting devices separated from the aperture region and arranged in the effective region; a light-shielding pattern separated from the aperture transmission region and located in the light-shielding region; and an encapsulation substrate located on the substrate to cover the plurality of light-emitting devices, wherein the light-shielding pattern includes a glass frit.

[0009] According to some example embodiments, the glass frit may include vanadium oxide.

[0010] According to some example embodiments, the light-shielding pattern may be located on the rear surface of the packaging substrate.

[0011] According to some example embodiments, the encapsulation substrate may include glass.

[0012] According to some example embodiments, an electronic panel may include a plurality of insulating layers between and separated from a substrate and a package substrate, wherein, when viewed in a plane, the insulating layers are separated from the via transmission regions.

[0013] According to some example embodiments, the light-shielding pattern may contact either the encapsulation substrate or the insulating layer.

[0014] According to some example embodiments, the electronic panel may also include a hole conductive pattern located in the hole region and separated from the hole transmission region on any of the insulating layers. The light-shielding pattern contacts the hole conductive pattern and the package substrate.

[0015] According to some example embodiments, the electronic device may further include: a window located on a package substrate; and an anti-reflective layer located between the package substrate and the window. An opening is defined that penetrates the anti-reflective layer and overlaps with the aperture transmission region.

[0016] According to some example embodiments, when viewed in a plane, the inner surface of the opening can be superimposed on the light-shielding pattern.

[0017] According to some example embodiments, the electronic panel may also include a sensing unit located on a package substrate and comprising a plurality of sensing electrodes. When viewed in a plane, the sensing electrodes are arranged to be separated from the aperture transmission area.

[0018] According to some exemplary embodiments of the inventive concept, an electronic device includes: an electronic module; and an electronic panel configured to be superimposed on the electronic module when viewed in a plane, wherein the electronic panel includes: a substrate divided into an aperture region, an effective region adjacent to the aperture region, and a peripheral region adjacent to the effective region, the aperture region including a aperture transmission region superimposed on the electronic module when viewed in a plane and a light-shielding region adjacent to the aperture transmission region; a plurality of light-emitting devices separated from the aperture region and arranged in the effective region; a light-shielding pattern separated from the aperture transmission region and located in the light-shielding region; an encapsulation substrate located on the substrate and including a rear surface facing the light-emitting devices and a front surface opposite to the rear surface; and a sealing member configured to bond the encapsulation substrate and the substrate, wherein the light-shielding pattern is located on the rear surface of the encapsulation substrate.

[0019] According to some example embodiments, the light-shielding pattern may include glass frit.

[0020] According to some example embodiments, the light-shielding pattern may include the same material as the sealing member.

[0021] According to some example embodiments, the electronic device may further include: a window located on the front surface of the package substrate; and an anti-reflective layer located between the window and the package substrate, wherein, when viewed in a plane, the window overlaps with the aperture region, and an opening penetrating the anti-reflective layer and overlapping with the aperture region is defined.

[0022] According to some example embodiments, the inner surface of the opening can be aligned with the end of the light-shielding pattern.

[0023] According to some example embodiments, when viewed in a plane, the inner surface of the opening can be superimposed on the light-shielding pattern.

[0024] According to some example embodiments, the light transmittance of the area of ​​the window overlapping with the aperture area can be the same as the light transmittance of the area of ​​the window overlapping with the effective area.

[0025] According to some example embodiments, when viewed in a plane, the aperture transmission area can be surrounded by a light-blocking pattern.

[0026] According to some example embodiments, multiple aperture transmission regions can be configured, the multiple aperture transmission regions can be separated from each other, and a light-shielding pattern can surround each of the multiple aperture transmission regions.

[0027] According to some example embodiments, each of the aperture transmission regions and the light-shielding patterns can be configured as multiple, the multiple aperture transmission regions can be separated from each other, the multiple light-shielding patterns can be separated from each other, and the multiple light-shielding patterns can surround the multiple aperture transmission regions respectively.

[0028] According to some example embodiments, the electronic module may include at least one of a camera, a speaker, a light sensor, and a thermal sensor.

[0029] According to some example embodiments, the electronic panel may include signal wiring located in a light-shielding area and connected to a light-emitting device adjacent to an aperture area. When viewed in a flat plane, the signal wiring is covered by a light-shielding pattern.

[0030] According to some example embodiments, when viewed in a plane, the light-blocking pattern can be separated from the signal wiring.

[0031] According to some example embodiments, the electronic device may further include a via conductive pattern located in a light-shielding area and separated from signal wiring to be electrically insulated from the signal wiring. The light-shielding pattern is in contact with the via conductive pattern.

[0032] According to some example embodiments, an electronic device may include a plurality of insulating layers located between and separated from a substrate and a package substrate, wherein a light-shielding pattern contacts any one of the plurality of insulating layers. Attached Figure Description

[0033] The accompanying drawings are included to provide a further understanding of aspects of some exemplary embodiments of the inventive concept, and are incorporated in and constitute a part of this specification. The drawings illustrate aspects of some exemplary embodiments of the inventive concept and, together with the description, serve to describe the principles of some exemplary embodiments of the inventive concept. In the drawings:

[0034] Figure 1 These are perspective views of electronic devices based on some exemplary embodiments of the inventive concept;

[0035] Figure 2 yes Figure 1 An exploded perspective view of the electronic device shown in the image;

[0036] Figure 3 yes Figure 1 A block diagram of an electronic device is shown below;

[0037] Figure 4A These are plan views of electronic panels based on some exemplary embodiments of the inventive concept;

[0038] Figure 4B yes Figure 2 The plan view of region XX' shown in the figure;

[0039] Figure 5 It is along Figure 4A The cross-sectional view shown is taken along line I-I'.

[0040] Figure 6A These are cross-sectional views of electronic devices based on some exemplary embodiments of the inventive concept;

[0041] Figure 6B This is a plan view showing a portion of an electronic device according to some example embodiments of the inventive concept;

[0042] Figure 7 These are cross-sectional views of electronic devices based on some exemplary embodiments of the inventive concept;

[0043] Figure 8A These are cross-sectional views of electronic devices based on some exemplary embodiments of the inventive concept;

[0044] Figure 8B These are plan views of electronic panels based on some exemplary embodiments of the inventive concept;

[0045] Figure 9A and Figure 9B These are cross-sectional views of electronic devices based on some exemplary embodiments of the inventive concept;

[0046] Figure 10 These are assembly perspective views of electronic devices based on some exemplary embodiments of the inventive concept;

[0047] Figure 11 These are plan views of electronic panels based on some exemplary embodiments of the inventive concept;

[0048] Figure 12 These are cross-sectional views of electronic devices based on some exemplary embodiments of the inventive concept;

[0049] Figure 13 These are exploded perspective views of electronic devices according to some exemplary embodiments of the inventive concept; and

[0050] Figure 14A and Figure 14B This is a schematic plan view of a portion of an electronic panel according to some example embodiments of the inventive concept. Detailed Implementation

[0051] It will be understood that when an element or layer (or region, portion, etc.) is referred to as being "on", "connected to", or "bonded to" another element or layer, the element or layer may be directly on, directly connected to, or directly bonded to the other element or layer, or there may be intermediate elements or layers.

[0052] Throughout this specification, the same reference numerals denote the same elements. In the drawings, for the purpose of effective description of the technical content, the thickness, scale, and dimensions of the elements are exaggerated.

[0053] As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items.

[0054] It will be understood that although the terms first, second, etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or portion from another. Therefore, without departing from the teachings of the invention, the first element, component, region, layer, or portion discussed below may be named a second element, component, region, layer, or portion. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are also intended to include the plural forms.

[0055] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” and “above” may be used herein to describe the relationship of one element or feature to another, as shown in the figure. It will be understood that the spatial relative terms are intended to cover different orientations of the device in use or operation other than those depicted in the figure.

[0056] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will also be understood that terms (such as those defined in common dictionaries) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formal sense unless so expressly defined herein.

[0057] It will also be understood that the terms “comprising” or “having” as used in this specification indicate the presence of the stated features, integrals, steps, operations, elements, components and / or groups thereof, but do not exclude the presence or addition of one or more other features, integrals, steps, elements, components and / or groups thereof.

[0058] The invention will now be described in detail with reference to the accompanying drawings.

[0059] Figure 1 These are perspective views of electronic devices based on some exemplary embodiments of the inventive concept. Figure 2 yes Figure 1 An exploded perspective view of the electronic device shown in the image. Figure 3 yes Figure 1 A block diagram of an electronic device is shown below. Referring to this in the following text... Figures 1 to 3 Further details are provided regarding some exemplary embodiments of the inventive concept.

[0060] Electronic device 1000 can be a device activated by an electrical signal. Electronic device 1000 can include various embodiments. For example, electronic device 1000 can include a tablet computer, laptop computer, personal computer, smart TV, etc. Figure 1 In this example, electronic device 1000 is shown as a smartphone as an example, but the embodiments are not limited thereto.

[0061] The transmission region TA can have a quadrilateral shape containing opposite sides parallel to each of the first direction DR1 and the second direction DR2. However, this is shown by way of example, and the transmission region TA can have various shapes and is not limited to any one embodiment. That is, according to some example embodiments, the transmission region TA can be circular, elliptical, triangular, or any other suitable shape according to the design of the electronic device 1000.

[0062] The border region BZA is adjacent to the transmission region TA. The border region BZA may surround the transmission region TA. However, this is shown by way of example, and according to some example embodiments, the border region BZA may be positioned adjacent to only one side of the transmission region TA or may be omitted. The electronic device 1000 according to some example embodiments of the inventive concept may include various shapes and sizes of the border region BZA, and is not limited to any one embodiment.

[0063] The normal direction of the front surface of the electronic device 1000 (i.e., the direction orthogonal or perpendicular to the display surface or the front surface plane) may correspond to the thickness direction DR3 of the electronic device 1000 (hereinafter referred to as the third direction DR3). In this embodiment, the front surface (or top surface) and rear surface (or bottom surface) of each component are defined with respect to the direction in which the image IM is displayed. The front surface and the rear surface are opposite to each other on the third direction DR3.

[0064] Meanwhile, the directions indicated from the first direction DR1 to the third direction DR3 are relative and can be converted to other directions. In the following text, the first direction to the third direction are respectively the directions indicated from the first direction DR1 to the third direction DR3, and are represented by the same reference numerals.

[0065] Electronic device 1000 may include window 100, electronic panel 200, anti-reflective layer POL, adhesive layer ADL, circuit board 300, electronic module 400, and housing 500. Window 100 and housing 500 are combined to define the appearance of electronic device 1000.

[0066] Window 100 is located on electronic panel 200 to cover the front surface IS of electronic panel 200. Window 100 may include an optically transparent insulating material. For example, window 100 may include glass or plastic. Window 100 may have a multilayer structure or a single-layer structure. For example, window 100 may have a laminated structure of multiple plastic films bonded by adhesive, or it may have a laminated structure of a glass substrate and a plastic film bonded by adhesive.

[0067] Window 100 includes a front surface FS exposed to the outside. The front surface FS of electronic device 1000 may be substantially defined by the front surface FS of window 100.

[0068] For example, the transmission region TA can be an optically transparent region. The transmission region TA can have a shape corresponding to the effective region AA. For example, the transmission region TA is superimposed on the effective region AA entirely or at least partially. The image IM displayed in the effective region AA of the electronic panel 200 can be viewed from the outside through the transmission region TA. The image IM can include still images and moving images.

[0069] When compared to the transmission region TA, the border region BZA can be a region with low light transmittance. The border region BZA defines the shape of the transmission region TA. The border region BZA can be adjacent to and surround the transmission region TA.

[0070] The border area BZA may have a color (e.g., a set or predetermined color). When the window 100 is set to a glass or plastic substrate, the border area BZA may be a colored layer printed or deposited on a surface of the glass or plastic substrate. Alternatively, the border area BZA may be formed by coloring a corresponding area of ​​the glass or plastic substrate.

[0071] The border area BZA can cover the peripheral area NAA of the electronic panel 200 to prevent the peripheral area NAA from being viewed from the outside. However, this is shown by way of example; according to some exemplary embodiments of the inventive concept, the border area BZA can be omitted in the window 100.

[0072] The electronic panel 200 can display an image IM. The electronic panel 200 includes a front surface IS containing an active area AA and a peripheral area NAA. The active area AA can be an area activated according to an electrical signal.

[0073] In this embodiment, the effective area AA can be the area where the image IM is displayed. The transmission area TA is superimposed on at least the effective area AA. Therefore, the user can view the image IM through the transmission area TA.

[0074] The peripheral region NAA can be the area covered by the border region BZA. The peripheral region NAA is adjacent to the active region AA. The peripheral region NAA can surround the active region AA. The driving circuitry, driving wiring, etc., used to drive the active region AA can be located in the peripheral region NAA.

[0075] Various signal lines or pads (PDs, also known as "solder pads") used to provide electrical signals to the active area AA, electronic components, etc., can be located in the peripheral area NAA. The peripheral area NAA can be covered by the border area BZA, so it is not visible from the outside.

[0076] According to some exemplary embodiments, the electronic panel 200 can be assembled in a flat state where the effective region AA and the peripheral region NAA face the window 100. However, as shown by way of example, a portion of the peripheral region NAA of the electronic panel 200 can be bent. In this case, a portion of the peripheral region NAA faces the rear surface of the electronic device 1000, such that the bezel region BZA on the front surface of the electronic device 1000 can be reduced. Alternatively, the electronic panel 200 can be assembled in a bent state where a portion of the effective region AA is bent. Alternatively, according to some exemplary embodiments of the inventive concept, the peripheral region NAA can be omitted from the electronic panel 200.

[0077] Reference Figure 2 and Figure 3 The electronic panel 200 may include a display unit DU and a sensing unit SU. The display unit DU may be a component that substantially generates an image IM. The image IM generated by the display unit DU is viewed externally by a user through a transmission area TA. The sensing unit SU senses user input applied from the outside.

[0078] An aperture region (e.g., a defined or predetermined aperture region) HA (or a first region HA) may be defined in the electronic panel 200. The aperture region HA may have a higher transmittance per square area than the effective region AA (or a second region AA). When viewed in a plane, the aperture region HA is defined at a position superimposed on the electronic module 400, which will be described later.

[0079] At least a portion of the aperture region HA may be surrounded by an effective region AA. According to some example embodiments, the aperture region HA may be separated from the peripheral region NAA (or a third region NAA). The aperture region HA is shown as being defined within the effective region AA, such that the effective region AA surrounds the entire edge of the aperture region HA. In the assembled state of the electronic device 1000 according to this embodiment, the aperture region HA may be disposed in the transmissive region TA and defined at a position separated from the border region BZA.

[0080] According to some example embodiments, the pore region HA may include the pore MH (see reference). Figure 4A ) and the shaded area BA (refer to) Figure 4A The aperture MH is located at the center of the aperture area HA to penetrate the electronic panel 200. A light-shielding area BA may surround the edge of the aperture MH. The light-shielding area BA may be an area viewed as black from the outside. A more detailed description will be given later.

[0081] The electronic panel 200 may include an aperture MH defined in an aperture region HA to penetrate the electronic panel 200. The aperture MH may penetrate at least one of the display unit DU and the sensing unit SU. The edge of the aperture region HA may be substantially separated from the edge of the aperture MH by a distance (e.g., a set or predetermined distance) to extend along the edge of the aperture MH. The edge of the aperture region HA may have a shape corresponding to the aperture MH.

[0082] An anti-reflective layer (POL) may be located between the window 100 and the electronic panel 200. The anti-reflective layer (POL) reduces the reflectivity of the electronic panel 200 to external light incident from outside the window 100. In this embodiment, the anti-reflective layer (POL) may include a polarizing film or a color filter.

[0083] According to some example embodiments, the opening OP corresponding to the aperture region HA can be defined within the antireflective layer POL. When viewed in a plane, the opening OP overlaps with the aperture region HA and penetrates the antireflective layer POL.

[0084] The adhesive layer ADL is located between the anti-reflective layer POL and the window 100. The adhesive layer ADL bonds the anti-reflective layer POL and the window 100. When the anti-reflective layer POL, according to some example embodiments of the inventive concept, is a color filter formed on the electronic panel 200, the adhesive layer ADL can substantially bond the electronic panel 200 and the window 100. The adhesive layer ADL may include an optically clear adhesive, an optically clear resin, or a pressure-sensitive adhesive, and is not limited to any one embodiment, as long as the adhesive layer ADL is optically clear.

[0085] Circuit board 300 can be connected to electronic panel 200. Circuit board 300 may include flexible board CF and main board MB. Flexible board CF may include insulating film and conductive wiring mounted on the insulating film. Conductive wiring is connected to pad PD and electrically connects circuit board 300 and electronic panel 200.

[0086] According to some example embodiments, the flexible board CF can be assembled in a bent state. Therefore, the main board MB can be located on the rear surface of the electronic panel 200 to be stably accommodated within the space provided by the housing 500. Alternatively, in this embodiment, the flexible board CF can be omitted, in which case the main board MB can be directly connected to the electronic panel 200.

[0087] The motherboard MB may include signal lines and electronic components. The electronic components may be connected to the signal lines and electrically connected to the electronic panel 200. The electronic components generate various electrical signals, such as signals for generating an image IM or signals for sensing user input, or electrical signals for processing sensing signals. Furthermore, the motherboard MB may be configured with multiple corresponding electrical signals for generation and processing by the motherboard MB, and is not limited to any single embodiment.

[0088] Meanwhile, in some example embodiments of the electronic device 1000 according to the inventive concept, the driving circuit for providing electrical signals to the effective area AA can be directly mounted on the electronic panel 200. In this case, the driving circuit can be mounted as a chip or can be integrated with the pixel PX (see reference 1000). Figure 4A Together, they form a single unit. In this case, the circuit board 300 may have a reduced area or may be omitted. The electronic device 1000 according to some example embodiments of the inventive concept may include various embodiments and is not limited to any one of them.

[0089] Electronic module 400 is located below window 100. When viewed in a plane, electronic module 400 can be superimposed on aperture MH and aperture region HA. Electronic module 400 can receive external input transmitted through aperture region HA or provide output through aperture region HA.

[0090] When viewed in a plane (i.e., when viewed in a plan view), the receiving portion of the electronic module 400 for receiving external input or the output portion for providing output can be superimposed on the aperture region HA. The electronic module 400 can be located on the rear surface of the electronic panel 200, or at least a portion of the electronic module 400 can be located inside the aperture MH of the electronic panel 200. According to some exemplary embodiments of the inventive concept, the electronic module 400 is arranged to be superimposed on the effective area AA, so the border area BZA can have a relatively reduced size (or footprint).

[0091] Reference Figure 3 The electronic device 1000 may include an electronic panel 200, a power module PM, a first electronic module EM1, and a second electronic module EM2. The electronic panel 200, the power module PM, the first electronic module EM1, and the second electronic module EM2 may be electrically connected to each other. Figure 3 An example of the display unit DU and sensing unit SU assembly of the electronic panel 200 is shown.

[0092] The first electronic module EM1 and the second electronic module EM2 include various functional modules for operating the electronic device 1000. The first electronic module EM1 can be directly mounted on a motherboard electrically connected to the electronic panel 200, or it can be mounted on a separate board for electrical connection to the motherboard via connectors or the like.

[0093] The first electronic module EM1 may include a control module CM, a wireless communication module TM, an image input module IIM, a voice input module AIM, a memory MM, and an external interface IF. Some of these modules may not be mounted on the motherboard, but can be electrically connected to the motherboard via a flexible circuit board.

[0094] The control module CM controls the overall operation of the electronic device 1000. The control module CM can be a microprocessor. For example, the control module CM activates or deactivates the electronic panel 200. The control module CM can control other modules such as the image input module IIM and the voice input module AIM based on touch signals received from the electronic panel 200.

[0095] The wireless communication module TM can transmit radio signals to / receive radio signals from another terminal using Bluetooth or Wi-Fi channels. The wireless communication module TM can also transmit / receive voice signals using common communication channels. The wireless communication module TM includes a transmitting unit TM1 for modulating and transmitting the signal to be transmitted, and a receiving unit TM2 for demodulating the received signal.

[0096] The image input module IIM processes image signals to convert them into image data that can be displayed on the electronic panel 200. The sound input module AIM uses a microphone to receive external sound signals in recording mode, voice recognition mode, etc., and converts the received external sound signals into electronic voice data.

[0097] The external interface (IF) serves as an interface for connecting external chargers, wired / wireless data ports, card (e.g., memory cards and SIM / UIM cards) sockets, etc.

[0098] The second electronic module EM2 may include a sound output module AOM, a light emission module LM, a light receiving module LRM, a camera module CMM, etc. These components can be directly mounted on the motherboard or mounted on a separate board for electrical connection to the electronic panel 200 or the first electronic module EM1 via connectors or the like.

[0099] The audio output module AOM converts audio data received from the wireless communication module TM or stored in the memory MM, and outputs the converted audio data to the outside.

[0100] A light-emitting module (LM) generates and outputs light. The LM can output infrared light. For example, the LM may include an LED device. A light-receiving module (LRM) can detect infrared light. The LRM can be activated when infrared light with a certain level or higher (e.g., a set or predetermined level or higher) is detected. The LRM may include a CMOS sensor. After outputting the infrared light generated by the LM, the infrared light can be reflected by an external object (e.g., a user's finger or face), and the reflected infrared light can be incident on the LRM. A camera module (CMM) captures the external image.

[0101] The electronic module 400 according to some exemplary embodiments of the inventive concept may include at least one component of a first electronic module EM1 or a second electronic module EM2. For example, the electronic module 400 may include at least one of a camera, a speaker, a light sensor, and a thermal sensor. The electronic module 400 may detect external objects through the aperture region HA or provide sound signals, such as speech, to the outside through the aperture region HA. In addition, the electronic module 400 may include multiple components of the first electronic module EM1 and the second electronic module EM2, and is not limited to any one embodiment.

[0102] The electronic module 400, arranged to overlap with the aperture region HA, allows easy viewing of external objects through the aperture region HA, or easy transmission of the resulting output signals to the outside. Meanwhile, according to some example embodiments, a transparent member located between the electronic module 400 and the electronic panel 200 may also be included in the electronic device 1000 according to some example embodiments of the inventive concept. The transparent member may be an optically transparent film, allowing viewing through the aperture MH (see reference MH) of the electronic panel 200. Figure 4A External input is transmitted to the electronic module 400 via a transparent member. The transparent member may be attached to the rear surface of the electronic panel 200, or it may be located between the electronic panel 200 and the electronic module 400 without a separate adhesive layer. The electronic device 1000 according to some exemplary embodiments of the inventive concept may have various structures and is not limited to any one embodiment.

[0103] According to some exemplary embodiments of the inventive concept, the electronic module 400 can be assembled to overlap with the transmissive region TA when viewed in a plane. Therefore, the expansion of the bezel region BZA due to the housing of the electronic module 400 can be prevented, thereby improving the aesthetics of the electronic device 1000.

[0104] Figure 4A This is a plan view of an electronic panel based on some example embodiments of the inventive concept. Figure 4B yes Figure 2 The plan view of region XX' is shown in the figure. For ease of description, Figure 4A The diagram shows a display unit DU (see...) Figure 3 Example plan view of electronic panel 200, Figure 4B A schematic plan view of an electronic panel 200 in a region adjacent to the aperture region HA is shown, although not all components need to be in the aperture region HA. Figure 4A and Figure 4B As shown in the figure. In the following text, reference will be made to... Figure 4A and Figure 4B Further details are provided regarding some exemplary embodiments of the inventive concept.

[0105] The electronic panel 200 includes a substrate BS, multiple pixels PX, multiple signal lines, a sealing component SM, and multiple display pads DPD.

[0106] The effective region AA and the peripheral region NAA can be regions provided by the substrate BS. The substrate BS can include an insulating substrate. For example, the substrate BS can be formed of a glass substrate, a plastic substrate, or a combination thereof. Optionally, the substrate BS can include a metallic substrate.

[0107] The substrate BS can be configured to be flexible so that it can be folded by the user, or it can be configured to be rigid so that there is no shape change. In this embodiment, a rigid substrate BS formed of glass material is shown by way of example. The substrate BS according to some exemplary embodiments of the inventive concept may include various embodiments, as long as components such as pixels PX and signal lines can be arranged on the substrate BS, and is not limited to any one embodiment.

[0108] Signal lines are connected to pixel PX to transmit electrical signals to pixel PX. Examples of scan lines GL, data lines DL, and power lines PL are shown among the signal lines included in the electronic panel 200. However, this is shown by way of example, and the signal lines may also include at least one of an initialization voltage line and a light emission control line, and are not limited to any one embodiment. Multiple scan lines GL, data lines DL, and power lines PL can be provided.

[0109] Pixels PX can be arranged in the effective area AA. Each of the pixels PX is shown as a quadrilateral shape and can substantially correspond to the light-emitting area emitted by the light-emitting device EE, which will be described later. Figure 4A An example of an amplified signal circuit diagram for one of a plurality of pixels PX is shown. Pixel PX may include a first thin-film transistor TR1, a capacitor CPP, a second thin-film transistor TR2, and a light-emitting device EE.

[0110] The first thin-film transistor TR1 is connected to the scan line GL and the data line DL. The capacitor CPP is connected to the first thin-film transistor TR1 and the power line PL. The second thin-film transistor TR2 is connected to the first thin-film transistor TR1, the capacitor CPP, and the light-emitting device EE. The first thin-film transistor TR1, the capacitor CPP, and the second thin-film transistor TR2 control the operation of the light-emitting device EE.

[0111] The light-emitting device (EE) can emit light at a time and intensity corresponding to the data signal transmitted via the data line (DL). For example, the EE may include an organic light-emitting layer or an inorganic light-emitting layer. For instance, the EE may include organic light-emitting devices, quantum dot light-emitting devices, nano-LEDs, micron-LEDs, electrophoretic devices, or electrowetting devices.

[0112] The light-emitting device EE is connected to the power supply terminal VSS to receive a power signal (hereinafter referred to as the second power signal) that is different from the power signal provided to the power line PL (hereinafter referred to as the first power signal). The light-emitting device EE can generate light corresponding to the difference between the electrical signal provided from the second thin-film transistor TR2 and the second power signal. Meanwhile, this is shown by way of example; each of the pixels PX may include electronics with various constructions and arrangements, and is not limited to any one embodiment.

[0113] Reference Figure 4A and Figure 4B Pixels PX are arranged around the aperture region HA. According to some example embodiments, the aperture region HA may be defined as being surrounded by an effective region AA. In this embodiment, the edges (boundaries) of the aperture region HA are dotted lines and shown in a circular shape by way of example.

[0114] Figure 4B Signal traces SL11, SL12, SL21, SL22, and SSL are shown positioned adjacent to the aperture region HA. Signal traces SL11, SL12, SL21, SL22, and SSL may include main signal traces SL11, SL12, SL21, and SL22, and sub-signal traces SSL. Main signal traces SL11, SL12, SL21, and SL22 are located within the active region AA and connected to corresponding pixels in pixel PX. Main signal traces SL11, SL12, SL21, and SL22 may include first to fourth main signal traces SL11, SL12, SL21, and SL22.

[0115] The first main signal routing SL11 can be a data line that provides data signals to the first pixel PX-A1 in pixel PX, and the second main signal routing SL12 can be a data line that provides data signals to the second pixel PX-A2 in pixel PX. The third main signal routing SL21 can be a scan line that provides scan signals to the third pixel PX-B1 in pixel PX, and the fourth main signal routing SL22 can be a scan line that provides scan signals to the fourth pixel PX-B2 in pixel PX.

[0116] According to some example embodiments, the first pixel PX-A1 and the second pixel PX-A2 can be pixels that are separated from each other with the aperture region HA located between them and in the same column. The third pixel PX-B1 and the fourth pixel PX-B2 can be pixels that are separated from each other with the aperture region HA located between them and in the same row.

[0117] According to some example embodiments, the light emission control line for transmitting the light emission control signal to the pixel PX or the initialization voltage line for providing the initialization voltage to the pixel PX may also be included in the main signal wiring SL11, SL12, SL21, and SL22. The main signal wiring may include various embodiments, as long as the main signal wiring is respectively connected to the corresponding pixel PX arranged in the effective area AA to provide electrical signals for controlling the corresponding pixel PX, and is not limited to any one embodiment.

[0118] The aperture region HA may include an aperture transmission region HTA and a light-shielding region BA. The aperture transmission region HTA may be defined as the region in which the aperture MH is formed. The aperture transmission region HTA may be an optically transparent region with a transmittance of approximately 90% or greater. Provided to electronic module 400 (see...) Figure 2 External light or light output from the electronic module 400 is transmitted through the aperture transmission area HTA.

[0119] The light-shielding region BA is adjacent to the aperture transmission region HTA. The light-shielding region BA may be defined along the edge of the aperture transmission region HTA. In this embodiment, the light-shielding region BA may be configured as an annular shape surrounding the aperture transmission region HTA.

[0120] The light-blocking area BA can be optically opaque. For example, the light-blocking area BA can be an area with a transmittance of about 5% or less. The light-blocking area BA can be viewed in a color with low brightness, such as black, gray, brown, etc.

[0121] The sub-signal wiring SSL is located within the aperture region HA. For example, the sub-signal wiring SSL is located within the light-shielding region BA. When viewed in a plane, the sub-signal wiring SSL can be separated from the aperture transmission region HTA and can extend along the edge of the aperture transmission region HTA.

[0122] Sub-signal wiring SSLs can be arranged to be separated from each other in the via region HA. Sub-signal wiring SSLs can transmit signals independently of each other. Sub-signal wiring SSLs may include at least one of, for example, wiring for transmitting scan signals, wiring for transmitting data signals, wiring for transmitting initialization voltage, wiring for transmitting light control signals, and wiring for transmitting power supply voltage.

[0123] Sub-signal wiring SSL may include n wirings arranged sequentially, separated from vias MH. For ease of description, Figure 4B An example is shown of the first sub-signal routing SSL1 located closest to the hole MH, the second sub-signal routing SSL2 surrounding the first sub-signal routing SSL1, and the nth sub-signal routing SSLn located furthest from the hole MH.

[0124] Sub-signal wiring SSL can be electrically connected to main signal wirings SL11, SL12, SL21, and SL22, which are connected to pixels PX located adjacent to the aperture region HA. The first sub-signal wiring SSL1 connects the first main signal wiring SL11 and the second main signal wiring SL12, such that the same electrical signal is transmitted to both main signal wiring SL11 and SL12. The second sub-signal wiring SSL2 connects the third main signal wiring SL21 and the fourth main signal wiring SL22, such that the same electrical signal is transmitted to both main signal wiring SL21 and SL22.

[0125] In this embodiment, each of the sub-signal wiring SSLs is shown as having a closed circular shape. However, this is shown as an example, and each of the sub-signal wiring SSLs may have an open, curved shape, and is not limited to any one embodiment, as long as each of the sub-signal wiring SSLs can be connected to the corresponding main signal wiring in the main signal wirings SL11, SL12, SL21, and SL22.

[0126] Additionally, the sub-signal wiring SSL can be formed in an integral shape on the same layer as the main signal wiring SL11, SL12, SL21 and SL22, or it can be located on different layers to be connected to the main signal wiring SL11, SL12, SL21 and SL22 through contact holes (e.g., set or predetermined contact holes), and is not limited to any one embodiment.

[0127] According to some exemplary embodiments of the inventive concept, the first main signal wiring SL11 and the second main signal wiring SL12 are connected to each other via the first sub-signal wiring SSL1, so that a common electrical signal can be provided to the first pixel PX-A1 and the second pixel PX-A2, which are separated from each other with aperture regions HA located between them and forming the same column. Similarly, the third main signal wiring SL21 and the fourth main signal wiring SL22 are connected via the second sub-signal wiring SSL2, so that a common electrical signal can be provided to the third pixel PX-B1 and the fourth pixel PX-B2, which are separated from each other with aperture regions HA located between them and forming the same row. Therefore, without disconnecting the signal lines, an electrical signal can be stably provided to multiple pixels PX that are separated from each other with aperture regions HA located between them.

[0128] Backward reference Figure 4AThe display pad DPD may include a first pad P1 and a second pad P2. Multiple first pads P1 may be configured, and each of the multiple first pads P1 may be connected to a data line DL. The second pad P2 may be electrically connected to a power line PL. The electronic panel 200 may provide electrical signals supplied from the outside via the display pad DPD to the pixel PX. Simultaneously, the display pad DPD may also include pads other than the first pads P1 and the second pads P2 for receiving other electrical signals, and is not limited to any particular embodiment.

[0129] The sealing member SM is separated from the pixel PX and located within the peripheral region NAA. When viewed in a plane, the sealing member SM may have a closed curved shape surrounding the edge of the effective region AA. The sealing member SM seals the pixel PX and protects it from external contaminants or moisture. The sealing member SM may have light-shielding properties. A detailed description will be given later.

[0130] An electronic panel 200 according to some example embodiments of the inventive concept provides a light-shielding region BA in the aperture region HA. The light-shielding region BA can be superimposed with the sub-signal wiring SSL located around the aperture transmission region HTA, thereby preventing the sub-signal wiring SSL from being viewed from the outside. Therefore, the aesthetics of the electronic panel 200 can be improved.

[0131] Figure 5 It is along Figure 4A The cross-sectional view shown is taken along line I-I'. Figure 6A These are cross-sectional views of electronic devices based on some exemplary embodiments of the inventive concept. Figure 6B This is a plan view showing a portion of an electronic device according to some example embodiments of the inventive concept.

[0132] Figure 5 A cross-section of the window 100, electronic panel 200, anti-reflective layer POL, and adhesive layer ADL in the components of electronic device 1000 is shown. For ease of description, Figure 6A A schematic cross-sectional view of the electronic device 1000 in the aperture region HA is shown. Figure 6B A schematic plan view of some components in the aperture region HA is shown. Referring below... Figures 5 to 6B Further details of some exemplary embodiments of the inventive concept are described below. Meanwhile, with reference to... Figures 1 to 4B The same components are represented by the same reference numerals, and some of their repeated descriptions may be omitted.

[0133] Electronic panel 200 may include a substrate BS, pixel PX, sealing member SM, and encapsulation substrate ECG. For ease of description, Figure 5 The image shows a thin-film transistor TR and a light-emitting device EE within a pixel PX. The thin-film transistor TR can be connected to... Figure 4A The second thin-film transistor TR2 shown in the figure (see Figure 4A )correspond.

[0134] Multiple insulating layers 10, 20, 30, 40, and 50 are located on a substrate BS. Insulating layers 10, 20, 30, 40, and 50 may comprise first to fifth insulating layers 10, 20, 30, 40, and 50 sequentially laminated. Each of the first to fifth insulating layers 10, 20, 30, 40, and 50 may comprise organic and / or inorganic materials and may have a single-layer or laminated structure.

[0135] A first insulating layer 10 is located on the substrate BS to cover the front surface of the substrate BS. The first insulating layer 10 prevents oxygen or moisture flowing in through the substrate BS from penetrating into the pixel PX, or provides the pixel PX with a top surface having a surface energy lower than that of the substrate BS, so that the pixel PX can be stably formed.

[0136] The thin-film transistor TR is located on the first insulating layer 10. The thin-film transistor TR includes a semiconductor pattern SP, a control electrode CE, an input electrode IE, and an output electrode OE. The semiconductor pattern SP is located on the first insulating layer 10. The semiconductor pattern SP may include semiconductor material.

[0137] The control electrode CE is separated from the semiconductor pattern SP, and the second insulating layer 20 is located between the control electrode CE and the semiconductor pattern SP. The control electrode CE can be connected to one electrode of the first thin-film transistor TR1 described above (see...). Figure 4A ) and one electrode of capacitor CPP (see Figure 4A When viewed in a plane, the input electrode IE and the output electrode OE are located on the third insulating layer 30 and separated from each other. The input electrode IE and the output electrode OE pass through the second insulating layer 20 and the third insulating layer 30 to connect to one side and the other side of the semiconductor pattern SP, respectively.

[0138] On the other hand, as illustrated by way of example, in some exemplary embodiments of the thin-film transistor TR according to the inventive concept, the input electrode IE and the output electrode OE can be formed from portions of the semiconductor pattern SP. For example, the region of the semiconductor pattern SP superimposed with the control electrode CE can be defined as a channel region, the portion extending from one side of the channel region can be defined as the input electrode IE, and the portion extending from the other side of the channel region can be defined as the output electrode OE. Optionally, the input electrode IE and the output electrode OE can be located directly on the top surface of the semiconductor pattern SP, or they can be located below the semiconductor pattern SP. The thin-film transistor TR according to some exemplary embodiments of the inventive concept can be formed in various structures and is not limited to any one embodiment.

[0139] The light-emitting device EE is located on the fourth insulating layer 40. The light-emitting device EE includes a first electrode E1, a light-emitting layer EL, and a second electrode E2.

[0140] The first electrode E1 can be connected to the thin-film transistor TR through the fourth insulating layer 40. According to some example embodiments, a separate connection electrode located between the first electrode E1 and the thin-film transistor TR can also be included in the electronic panel 200, in which case the first electrode E1 can be electrically connected to the thin-film transistor TR through the connection electrode.

[0141] A fifth insulating layer 50 is located on the fourth insulating layer 40. The fifth insulating layer 50 may include organic and / or inorganic materials and may have a monolayer or laminated structure. An opening may be defined in the fifth insulating layer 50. The opening exposes at least a portion of the first electrode E1. The fifth insulating layer 50 may be a pixel-defining film.

[0142] The light-emitting layer EL is located between the first electrode E1 and the second electrode E2. The light-emitting layer EL includes a light-emitting material. For example, the light-emitting layer EL can be formed of at least one of materials that emit red, green, and blue light, and can include fluorescent or phosphorescent materials. The light-emitting layer EL can include organic or inorganic light-emitting materials. The light-emitting layer EL can emit light in response to the potential difference between the first electrode E1 and the second electrode E2.

[0143] According to some example embodiments, a charge control layer located between the light-emitting layer EL and the first electrode E1, or between the light-emitting layer EL and the second electrode E2, may also be included in the light-emitting device EE. The charge control layer may include at least one of hole transport materials, hole injection materials, electron transport materials, and electron injection materials.

[0144] The second electrode E2 is located on the light-emitting layer EL. The second electrode E2 may face the first electrode E1. The second electrode E2 may have an overall shape extending from the effective region AA to the peripheral region NAA. The second electrode E2 may be shared with multiple pixels PX. The light-emitting device EE in each of the pixels PX receives a common power supply voltage (hereinafter referred to as the second power supply voltage) through the second electrode E2.

[0145] The second electrode E2 may comprise a transmissive conductive material or a transmissive-reflective conductive material. Therefore, light generated in the light-emitting layer EL can be readily emitted onto the third-direction DR3 via the second electrode E2. However, this is shown by way of example, and the light-emitting device EE according to some exemplary embodiments of the inventive concept may be driven by a bottom emission method in which the first electrode E1 comprises a transmissive or transmissive-reflective material, or a bi-directional emission method in which light is emitted toward both the front and rear surfaces, and is not limited to any one embodiment.

[0146] The encapsulation substrate ECG is located on the substrate BS to cover the pixels PX and insulating layers 10, 20, 30, 40, and 50. When viewed in cross-section, the encapsulation substrate ECG can be positioned separately from the pixels PX and insulating layers 10, 20, 30, 40, and 50. The encapsulation substrate ECG can be an insulating and optically transparent substrate. For example, the encapsulation substrate ECG can include a glass substrate or a plastic substrate.

[0147] The sealing member SM is located between the package substrate ECG and the base substrate BS. The sealing member SM allows the package substrate ECG and the base substrate BS to be joined together, and the space (e.g., a defined or predetermined space) GP is located between the package substrate ECG and the base substrate BS. The space GP between the package substrate ECG and the base substrate BS (hereinafter referred to as the gap GP) may be filled with air or an inert gas.

[0148] The sealing component SM may include a glass frit. The sealing component SM can be formed by sintering the glass frit. The sealing component SM may be optically opaque. The sealing component SM may include vanadium oxide (V₂O₄, V₂O₅). The sealing component SM may have a color with low brightness, therefore the sealing component SM can be viewed, for example, in colors such as black, brown, and gray.

[0149] However, this is described by way of example, and the sealing member SM may be optically transparent or may be viewed in a color with high brightness, and is not limited to any one embodiment.

[0150] An anti-reflective layer POL is located on the electronic panel 200. The anti-reflective layer POL can be in direct contact with the top surface of the electronic panel 200, or it can be bonded to the electronic panel 200 via an adhesive layer. The anti-reflective layer POL may include an optical film, and may include, for example, a polarizing film.

[0151] The adhesive layer ADL bonds the window 100 and the anti-reflective layer POL. The window 100 may include a transmissive portion TL and a frame portion BZ. The transmissive portion TL may be optically transparent and may include a transparent insulating material.

[0152] As described above, the border portion BZ can be a colored layer printed or deposited on the rear surface of the transmissive portion TL. Alternatively, the border portion BZ can be formed by coloring a corresponding area of ​​the transmissive portion TL, in which case the step between the border portion BZ and the transmissive portion TL can be removed. The window 100 according to some exemplary embodiments of the inventive concept can be provided in various embodiments, and is not limited to any one embodiment.

[0153] In some example embodiments of the electronic device 1000 according to the inventive concept, the sealing member SM can be covered by the frame portion BZ, and therefore cannot be viewed from the outside. The frame portion BZ can prevent the peripheral area NAA from being viewed from the outside. Alternatively, in some example embodiments of the electronic device 1000 according to the inventive concept, the frame portion BZ can be omitted. In this case, the sealing member SM can be optically opaque, and the peripheral area NAA and the effective area AA can be divided by the sealing member SM. The electronic device 1000 according to some example embodiments of the inventive concept can include various embodiments and is not limited to any one embodiment.

[0154] Figure 6A A cross-sectional view of the electronic device 1000 in the aperture region HA is shown. The aperture region HA includes an aperture transmission region HTA and a light-shielding region BA. The light-shielding region BA may include a wiring region LA and a margin region MA.

[0155] The wiring region LA can be the area within which signal wirings SSLa and SSLb are located in the via region HA. Signal wirings SSLa and SSLb can be connected to the aforementioned sub-signal wirings SSL (see...). Figure 4B Corresponding to this embodiment. In this embodiment, signal routing SSLa and SSLb are shown as including a first signal routing SSLa and a second signal routing SSLb located on different layers. However, this is shown by way of example, and signal routing SSLa and SSLb may be positioned separately from each other on the same layer, and are not limited to any one embodiment.

[0156] The margin region MA can be defined between the aperture transmission region HTA and the wiring region LA. In this embodiment, the aperture transmission region HTA can be defined as the area superimposed on the electronic module 400 when viewed in a plane, specifically, the area superimposed on the light input / output portion of the electronic module 400 (e.g., the lens or barrel of a camera).

[0157] When viewed in a plane, the components of the electronic panel 200, excluding the substrate BS and the encapsulation substrate ECG, may not overlap with the aperture transmission region HTA. For example, the ends of insulating layers 10, 20, 30, 40, and 50 closer to the aperture transmission region HTA are formed to be separated from the aperture transmission region HTA. According to some exemplary embodiments of the inventive concept, insulating layers 10, 20, 30, 40, and 50, or signal wirings SSLa and SSLb with relatively low transmittance, may be positioned to be separated from the aperture transmission region HTA, thereby improving the transmittance of the aperture transmission region HTA.

[0158] The opening OP of the antireflective layer POL is defined by the area that penetrates the antireflective layer POL and overlaps with the aperture transmission region HTA. When viewed in a plane, the inner surface of the opening OP can be formed at a location separated from the aperture transmission region HTA.

[0159] According to some exemplary embodiments of the inventive concept, for example, optically transparent components such as the substrate BS, encapsulation substrate ECG, adhesive layer ADL, and window 100 can be arranged to overlap with the aperture transmission region HTA. Insulating layers 10, 20, 30, 40, and 50, or signal wiring SSLa and SSLb with relatively low transmittance, can be removed from the aperture transmission region HTA, thereby improving the transmittance of the aperture transmission region HTA and the sensitivity of the electronic module 400.

[0160] The allowance region MA can be an area created by tolerances when forming the opening OP of the antireflective layer POL, or an area created by manufacturing tolerances of the insulating layers 10, 20, 30, 40, and 50. The allowance region MA can be the area between the inner surface of the opening OP of the antireflective layer POL and the aperture transmission region HTA, or the area between the end of the insulating layers 10, 20, 30, 40, and 50 and the aperture transmission region HTA.

[0161] As the tolerances increase when forming insulating layers 10, 20, 30, 40, and 50 or anti-reflective layer POL, the size of the margin region MA can be increased. When the tolerances are zero when forming insulating layers 10, 20, 30, 40, and 50 or anti-reflective layer POL, the margin region MA can be omitted.

[0162] The electronic panel 200 according to some exemplary embodiments of the inventive concept may also include a light-shielding pattern LSP. The light-shielding pattern LSP may be located on the rear surface of the package substrate ECG. The light-shielding pattern LSP may be in direct contact with the rear surface of the package substrate ECG. The light-shielding pattern LSP may be formed by printing or depositing a light-shielding material on the rear surface of the package substrate ECG.

[0163] The light-blocking pattern LSP makes the light-blocking area BA optically opaque. The light-blocking pattern LSP can have colors containing low brightness, such as black, gray, and brown.

[0164] In this embodiment, the light-shielding pattern LSP may include a glass frit. The light-shielding pattern LSP can be formed by printing it onto the back surface of the encapsulation substrate ECG with a glass frit (e.g., vanadium-based glass frit) having an optically opaque color.

[0165] In this case, when the sealing member SM (refer to) Figure 5When the material is optically opaque, the light-shielding pattern LSP can be formed from the same material as the sealing member SM. After printing with glass frit, a single process is performed on the rear surface of the encapsulation substrate ECG, along with the via area HA and the peripheral area NAA (see reference). Figure 5 In the corresponding region, the sealing member SM can be formed by irradiating the region corresponding to the peripheral region NAA with a laser, and the light-shielding pattern LSP can be formed by omitting laser irradiation in the region corresponding to the hole region HA. Therefore, by forming the light-shielding pattern LSP during the process of forming the sealing member SM and by using the same material as the sealing member SM to form the light-shielding pattern LSP, the current process can be used without change, thus simplifying the process and reducing the process cost for the light-shielding pattern LSP.

[0166] Reference Figure 5 , Figure 6A and Figure 6B The light-shielding pattern LSP is located inside the aperture region HA and has an annular shape surrounding the aperture transmission region HTA. The opening OP of the antireflective layer POL is shown in a circular shape surrounding the aperture transmission region HTA. As described above, depending on the tolerance when forming the opening OP, the opening OP can be formed to be the same as the aperture transmission region HTA, or it can be formed to be larger than the aperture transmission region HTA as the inner surface of the opening OP moves further away from the aperture transmission region HTA.

[0167] Furthermore, even when the size of the opening OP varies according to the tolerance level, the inner surface of the opening OP is defined within the light-blocking area BA, which is viewed opaquely due to the light-blocking pattern LSP. The light-blocking area BA can essentially serve as a border within the aperture area HA.

[0168] According to some exemplary embodiments of the inventive concept, defects in the inner surface of the opening OP, which are viewed according to tolerance levels, can be prevented. The electronic device 1000 can provide uniform color in the light-shielding area BA, regardless of the tolerance level of the anti-reflective layer POL. Therefore, design freedom for the anti-reflective layer POL can be ensured, and the aesthetics of the electronic device 1000 can be improved.

[0169] Furthermore, according to some exemplary embodiments of the inventive concept, only the transmissive portion TL is provided in the region of window 100 that overlaps with the aperture region HA and the region that overlaps with the effective region AA, and the frame portion BZ is not provided. That is, for window 100, the light transmittance of the region overlapping with the aperture region HA can be substantially the same as the light transmittance of the region overlapping with the effective region AA. In electronic device 1000, the light-shielding properties in the aperture region HA can be provided by the light-shielding pattern LSP located in electronic panel 200 instead of window 100. Therefore, the possibility of misalignment between the aperture transmissive region HTA and the light-shielding region BA or between the aperture transmissive region HTA and the light-shielding pattern LSP can be reduced, thereby simplifying the corresponding process and reducing the corresponding process cost.

[0170] Figure 7 These are cross-sectional views of electronic devices according to some exemplary embodiments of the inventive concept. For ease of description, Figure 7 It shows the relationship with Figure 6A The region corresponding to that region. In the following text, reference will be made to... Figure 7 Further details of some exemplary embodiments of the inventive concept are described below. Meanwhile, with reference to... Figures 1 to 6B The same components are represented by the same reference numerals, and some of their repeated descriptions may be omitted.

[0171] like Figure 7 As shown, in electronic device 1000-A, the light-shielding pattern LSP-A can be configured to correspond to the shape of the wiring area LA. The light-shielding pattern LSP-A can cover only the area of ​​the aperture area HA where the anti-reflective layer POL, insulating layers 10, 20, 30, 40, and 50, and signal wirings SSLa and SSLb are located, and can be independent of the margin area MA. The light-shielding pattern LSP-A can be aligned with the inner surface of the opening OP.

[0172] In this embodiment, the allowance region MA can have a transmittance substantially corresponding to the transmittance of the aperture transmission region HTA. Because the light-shielding pattern LSP-A exposes the aperture transmission region HTA and the region having a transmittance corresponding to the transmittance of the aperture transmission region HTA, and selectively covers only the areas where components such as signal wirings SSLa and SSLb, which can be viewed from the outside, are located, an effect can occur where the area of ​​the transparently viewable region in the aperture region HA increases and the area of ​​the opaquely viewable region decreases. Therefore, an effect of reducing the area of ​​the border in the aperture region HA can also occur.

[0173] Figure 8A These are cross-sectional views of electronic devices based on some exemplary embodiments of the inventive concept. Figure 8B These are plan views of electronic panels based on some exemplary embodiments of the inventive concept. For ease of description, Figure 8AIt shows the relationship with Figure 6A The region corresponding to the region, Figure 8B It shows the relationship with Figure 4B The region corresponding to that region. In the following text, reference will be made to... Figure 8A and Figure 8B Further details of some exemplary embodiments of the inventive concept are described below. Meanwhile, with reference to... Figures 1 to 7 The same components are represented by the same reference numerals, and some of their repeated descriptions may be omitted.

[0174] like Figure 8A and Figure 8B As shown, in the electronic device 1000-B, the light-shielding pattern LSP-B can have a shape that overlaps only with the regions where the signal wirings SSLa and SSLb are located. That is, the light-shielding pattern LSP-B can be formed such that the light-shielding pattern LSP-B exposes the aperture transmission region HTA and the allowance region MA of the aperture region HA, and overlaps only with the regions where the signal wirings SSLa and SSLb of the wiring region LA are located.

[0175] According to some exemplary embodiments of the inventive concept, the light-shielding pattern LSP-B can cover only a portion of the light-shielding area BA. Therefore, the substantial area of ​​the bezel in the aperture area HA can be reduced, and the aesthetics of the electronic device 1000-B can be improved.

[0176] Figure 9A and Figure 9B These are cross-sectional views of electronic devices according to some exemplary embodiments of the inventive concept. For ease of description, Figure 9A and Figure 9B It shows the relationship with Figure 6A The region corresponding to that region. In the following text, reference will be made to... Figure 9A and Figure 9B Further details of some exemplary embodiments of the inventive concept are described below. Meanwhile, with reference to... Figures 1 to 8B The same components are represented by the same reference numerals, and some of their repeated descriptions may be omitted.

[0177] like Figure 9A As shown, in electronic device 1000-C, the light-shielding pattern LSP-C can be used as a support in the gap GP. For example, the light-shielding pattern LSP-C can be formed with a height (e.g., a set or predetermined height) HH to serve as a support in the gap GP between the package substrate ECG and the substrate BS. In this embodiment, the light-shielding pattern LSP-C can be located on the third insulating layer 30 to serve as a support in the space of the gap GP between the third insulating layer 30 and the package substrate ECG.

[0178] In this embodiment, portions of the fourth insulating layer 40 and the fifth insulating layer 50 can be removed from the area where the light-shielding pattern LSP-C of the wiring region LA is located. Therefore, when viewed in a plane, the fourth insulating layer 40 and the fifth insulating layer 50 can be separated from the light-shielding pattern LSP-C.

[0179] A portion of the package substrate ECG within the wiring area LA can be supported by a light-shielding pattern LSP-C, while another portion of the package substrate ECG within the wiring area LA can be supported by spacers SPC located on the fifth insulating layer 50. The spacers SPC can serve as supports for the gap GP in the area overlapping with signal wirings SSLa and SSLb, and the light-shielding pattern LSP-C can serve as supports for the gap GP in the area separated from signal wirings SSLa and SSLb.

[0180] Furthermore, the electronic device 1000-C according to this embodiment may also include a hole conductive pattern SD. When viewed in a plane, the hole conductive pattern SD may be located in the wiring region LA and may be separated from the signal wirings SSLa and SSLb. The hole conductive pattern SD may be one of the signal lines that provides electrical signals to the pixel PX, or it may be the periphery of the electrically shielded hole transmission region HTA or a conductive pattern electrically floating with the pixel PX. Optionally, according to some example embodiments, the hole conductive pattern SD may be one of the signal lines that provides electrical signals to the sensing unit.

[0181] The via conductive pattern SD may be located on the third insulating layer 30 and exposed from the fourth insulating layer 40. The light-shielding pattern LSP-C may be located on the via conductive pattern SD. Therefore, the light-shielding pattern LSP-C may have a height obtained by subtracting the thickness of the via conductive pattern SD from the height of the region of the gap GP between the third insulating layer 30 and the package substrate ECG. Furthermore, according to some example embodiments, the via conductive pattern SD may be located on any of the insulating layers 10 to 50.

[0182] Optionally, such as Figure 9B As shown, the light-shielding pattern LSP-D may be located on the fourth insulating layer 40 in the electronic device 1000-D. A portion of the fifth insulating layer 50 can be removed from the area in which the light-shielding pattern LSP-D is located in the wiring area LA. Therefore, when viewed in a plane, the fifth insulating layer 50 may be separated from the light-shielding pattern LSP-D. Furthermore, according to some example embodiments, the light-shielding pattern LSP-D may be located on any of the insulating layers 10 to 50 to contact any of the insulating layers 10 to 50.

[0183] The light-shielding pattern LSP-D can be used as a support for the gap GP defined in the space between the fourth insulating layer 40 and the package substrate ECG. When viewed in a plane, the light-shielding pattern LSP-D can be superimposed on the signal wirings SSLa and SSLb. The height HH of the light-shielding pattern LSP-D can correspond to the distance between the fourth insulating layer 40 and the package substrate ECG, and the width of the light-shielding pattern LSP-D can have various dimensions, as long as the light-shielding pattern LSP-D can support a portion of the package substrate ECG in the wiring area LA, and is not limited to any one embodiment.

[0184] like Figure 9A and Figure 9B As shown, the light-shielding patterns LSP-C and LSP-D can be used as supports in the gap GP. The light-shielding patterns LSP-C and LSP-D contact the package substrate ECG and the components separated from the package substrate ECG to define the gap GP (e.g., the via conductive pattern SD or the fourth insulating layer 40), respectively.

[0185] According to this embodiment, the light-shielding patterns LSP-C and LSP-D not only optically shield the wiring area LA, but also support a portion of the package substrate ECG within the wiring area LA. The light-shielding patterns LSP-C and LSP-D prevent the package substrate ECG from sagging in the via area HA. ​​Therefore, defective optical viewing in the via area HA, such as viewing Newton's rings, can be prevented.

[0186] Figure 10 This is an assembly perspective view of an electronic device based on some example embodiments of the inventive concept. Figure 11 This is a plan view of an electronic panel based on some example embodiments of the inventive concept. Figure 12 These are cross-sectional views of electronic devices according to some exemplary embodiments of the inventive concept. For ease of description, Figure 11 It shows the relationship with Figure 4A The region corresponding to the region, in Figure 11 and Figure 12 Some components have been omitted. They will be referred to below. Figures 10 to 12 Further details of some exemplary embodiments of the inventive concept are described below. Meanwhile, with reference to... Figures 1 to 9B The same components are represented by the same reference numerals, and some of their repeated descriptions may be omitted.

[0187] like Figure 10As shown, electronic device 1000-1 can display an image IM and sense user input TC applied from the outside. User input TC includes various types of external input such as a part of the user's body, light, heat, and pressure. In addition, electronic device 1000-1 can sense input that is near or adjacent to electronic device 1000-1 and input that touches electronic device 1000-1.

[0188] In this embodiment, the user input TC is shown as a user's hand applied to the front surface of the electronic device 1000-1. However, this is shown as an example, and the user input TC can be provided in various types as described above. Additionally, the electronic device 1000-1 can sense user input TC applied to the side or rear surface of the electronic device 1000-1 depending on its structure, and the exemplary embodiments of the inventive concept are not limited to any one embodiment.

[0189] like Figure 10 , Figure 11 and Figure 12 As shown, the electronic panel 200-1 constituting the electronic device 1000-1 may include a display unit DU and a sensing unit SU. The display unit DU is located below the sensing unit SU. Figure 11 The components of the sensing unit SU are shown as viewed from the top surface of the electronic panel 200-1.

[0190] The sensing unit SU can sense the user's input TC to obtain the position or intensity information of the user's input TC. The sensing unit SU includes multiple first sensing electrodes TE1, multiple second sensing electrodes TE2, multiple sensing lines TL1, TL2 and TL3, and multiple sensing pads T1, T2 and T3.

[0191] The first sensing electrode TE1 and the second sensing electrode TE2 are arranged in the effective area AA. The sensing unit SU can obtain information about the user's input TC by the change in capacitance between the first sensing electrode TE1 and the second sensing electrode TE2.

[0192] First sensing electrodes TE1 are arranged along a first direction DR1, and each of the first sensing electrodes TE1 extends along a second direction DR2. Each of the first sensing electrodes TE1 may include a first main pattern SP1, a first adjacent pattern SP1H, and a first connecting pattern CP1. Multiple first main patterns SP1, first adjacent patterns SP1H, and first connecting patterns CP1 may be provided.

[0193] The first main pattern SP1 is located in the effective area AA. The first main pattern SP1 is arranged to be separated from the hole area HA. ​​The first main pattern SP1 has a shape (e.g., a defined or predetermined shape) and a first area. In this embodiment, the first main pattern SP1 may have a rhomboid shape. However, this is shown by way of example, and the first main pattern SP1 may have various shapes and is not limited to any one embodiment.

[0194] The first adjacent pattern SP1H is positioned adjacent to the aperture region HA. According to this embodiment, the aperture MH passes through the sensing unit SU. The first adjacent pattern SP1H has a second area smaller than the first area of ​​the first main pattern SP1. The first adjacent pattern SP1H may have a shape that is a rhombus shape identical to the first main pattern SP1, except for the area overlapping with the aperture region HA.

[0195] In this embodiment, the first connecting pattern CP1 extends along the second direction DR2. The first connecting pattern CP1 is connected to the first main pattern SP1. The first connecting pattern CP1 may be located between two of the first main patterns SP1 to connect the two of the first main patterns SP1. In addition, the first connecting pattern CP1 is located between the first main pattern SP1 and the first adjacent pattern SP1H to connect the first main pattern SP1 and the first adjacent pattern SP1H.

[0196] The second sensing electrodes TE2 are arranged along the second direction DR2, and each of the second sensing electrodes TE2 extends along the first direction DR1. Each of the second sensing electrodes TE2 may include a second main pattern SP2, a second adjacent pattern SP2H, and a second connecting pattern CP2. Multiple second main patterns SP2, second adjacent patterns SP2H, and second connecting patterns CP2 may be provided.

[0197] The second main pattern SP2 is positioned separately from the hole region HA. The second main pattern SP2 can be separated from the first main pattern SP1. In this embodiment, the interval between the first main pattern SP1 and the second main pattern SP2 can be the interval viewed in cross-section. The first main pattern SP1 and the second main pattern SP2 do not need to contact each other, so independent electrical signals can be sent and received.

[0198] In this embodiment, the second main pattern SP2 may have the same shape as the first main pattern SP1. For example, the second main pattern SP2 may have a rhombus shape. However, this is shown by way of example, and the second main pattern SP2 may have various shapes and is not limited to any one embodiment.

[0199] The second adjacent pattern SP2H is positioned adjacent to the hole region HA. The second adjacent pattern SP2H has an area smaller than that of the second main pattern SP2. The second adjacent pattern SP2H may have a shape that is a rhombus shape identical to that of the second main pattern SP2, except for the area overlapping with the hole region HA.

[0200] In this embodiment, the second connecting pattern CP2 extends along the first direction DR1. The second connecting pattern CP2 is connected to the second main pattern SP2. The second connecting pattern CP2 can be located between two of the second main patterns SP2 to connect the two of the second main patterns SP2. In addition, the second connecting pattern CP2 is located between the second main pattern SP2 and the second adjacent pattern SP2H to connect the second main pattern SP2 and the second adjacent pattern SP2H.

[0201] In this embodiment, the first main pattern SP1, the second main pattern SP2, and the second connecting pattern CP2 can be located on the same layer, while the first connecting pattern CP1 can be located on a different layer. The first adjacent pattern SP1H is located on the same layer as the first main pattern SP1, and the second adjacent pattern SP2H is located on the same layer as the second main pattern SP2.

[0202] The sensing unit SU may include a plurality of sensing insulating layers 61, 62, and 63 sequentially laminated on a package substrate ECG. Each of the sensing insulating layers 61, 62, and 63 may include an organic film and / or an inorganic film. A first main pattern SP1, a second main pattern SP2, and a second connecting pattern CP2 are located between the second sensing insulating layer 62 and the third sensing insulating layer 63 within the sensing insulating layers 61, 62, and 63. A first connecting pattern CP1 is located between the first sensing insulating layer 61 and the second sensing insulating layer 62. The first main pattern SP1 and a first adjacent pattern SP1H may pass through the second sensing insulating layer 62 and be connected to the first connecting pattern CP1.

[0203] Sensing lines TL1, TL2, and TL3 are arranged in the peripheral region NAA. Sensing lines TL1, TL2, and TL3 may include a first sensing line TL1, a second sensing line TL2, and a third sensing line TL3.

[0204] The first sensing line TL1 is connected to the first sensing electrode TE1. In this embodiment, the first sensing line TL1 is connected to the lower end of the opposite end of the first sensing electrode TE1.

[0205] The second sensing line TL2 is connected to one end of the second sensing electrode TE2. In this embodiment, the second sensing line TL2 is connected to the left end of the opposite end of the second sensing electrode TE2.

[0206] The third sensing line TL3 is connected to the upper end of the opposite end of the first sensing electrode TE1. According to some exemplary embodiments of the inventive concept, the first sensing electrode TE1 can be connected to both the first sensing line TL1 and the third sensing line TL3. Therefore, for the first sensing electrode TE1, which has a length longer than the second sensing electrode TE2, the sensitivity based on position can be maintained uniformly. On the other hand, as shown by way of example, according to some exemplary embodiments of the inventive concept, the third sensing line TL3 can be omitted in the sensing unit SU, and this is not limited to any particular embodiment.

[0207] Sensing pads T1, T2, and T3 are located in the peripheral area NAA. When viewed in a plane, sensing pads T1, T2, and T3 can be located in an area that does not overlap with the display pad DPD.

[0208] Sensing pads T1, T2, and T3 may include a first sensing pad T1, a second sensing pad T2, and a third sensing pad T3. The second sensing pad T2 is connected to the second sensing line TL2 to provide external signals to the second sensing electrode TE2. The first sensing pad T1 is connected to the first sensing line TL1, and the third sensing pad T3 is connected to the third sensing line TL3, such that the first sensing pad T1 and the third sensing pad T3 are electrically connected to the first sensing electrode TE1.

[0209] The sensing unit SU may further include a first connecting line BL1 and a second connecting line BL2 located in the aperture region HA. The first connecting line BL1 and the second connecting line BL2 electrically connect two adjacent patterns that are separated from each other and in which the aperture region HA is located. For example, the first connecting line BL1 connects two of the first adjacent patterns SP1H, each of which constitutes one of the first sensing electrodes TE1 and is separated from each other with the aperture region HA located therebetween. The second connecting line BL2 connects two of the second adjacent patterns SP2H, each of which constitutes one of the second sensing electrodes TE2 and is separated from each other with the aperture region HA located therebetween.

[0210] Each of the first connecting line BL1 and the second connecting line BL2 may have a shape that extends to at least a portion of the edge of the aperture transmission region HTA. In this embodiment, the first connecting line BL1 and the second connecting line BL2 are shown as being located on the same layer. However, this is shown by way of example, and the first connecting line BL1 and the second connecting line BL2 may be located on different layers, and are not limited to any one embodiment.

[0211] In this embodiment, when viewed in a plane, the first connecting line BL1 and the second connecting line BL2 are located in the light-shielding area BA and overlap with the light-shielding pattern LSP. The light-shielding area BA is viewed by the user in an opaque color because the light-shielding pattern LSP. Therefore, the first connecting line BL1 and the second connecting line BL2 are difficult to see.

[0212] Furthermore, according to some exemplary embodiments of the inventive concept, the first connecting line BL1 and the second connecting line BL2 are covered by an anti-reflective layer POL. Therefore, the problem of the first connecting line BL1 and the second connecting line BL2 being visible due to reflection of external light can be easily prevented. According to some exemplary embodiments of the inventive concept, a light-shielding area BA with a uniform color can also be provided in the aperture area HA of the electronic device 1000-1 including the sensing unit SU, and the aesthetics of the electronic device 1000-1 can be improved.

[0213] Figure 13 This is an assembly perspective view of an electronic device based on some example embodiments of the inventive concept. Figure 14A and Figure 14B This is a schematic plan view illustrating portions of an electronic panel according to some example embodiments of the inventive concept. For ease of description, Figure 13 Shown as with Figure 2 correspond, Figure 14A and Figure 14B It shows the relationship with Figure 6B The region corresponding to that region. In the following text, reference will be made to... Figures 13 to 14B Further details of some exemplary embodiments of the inventive concept are described below. Meanwhile, with reference to... Figures 1 to 12 The same components are represented by the same reference numerals, and some of their repeated descriptions may be omitted.

[0214] like Figure 13 As shown, the electronic device 1000-2 may include a window 100, an electronic panel 200-2, an anti-reflective layer POL, an adhesive layer ADL, a circuit board 300, multiple electronic modules 410 and 420, and a housing 500. Because the window 100, circuit board 300, and housing 500 are... Figure 1 The components shown correspond to those in the diagram, so some of their redundant descriptions need not be given.

[0215] Electronic modules 410 and 420 can each constitute Figure 3 Any of the modules in the first electronic module EM1 and the second electronic module EM2 shown. For example, each of the electronic modules 410 and 420 can be a camera, a speaker, or a sensor such as a light sensor and a heat sensor.

[0216] Multiple hole regions HA1 and HA2 can be defined in the electronic panel 200-2. Hole regions HA1 and HA2 can correspond to electronic modules 410 and 420, respectively. Electronic modules 410 and 420 can include a first module 410 superimposed with the first hole region HA1 and a second module 420 superimposed with the second hole region HA2. The first module 410 and the second module 420 can be the same as or different from each other.

[0217] Multiple openings OP1 and OP2 can be defined within the anti-reflective layer POL. Openings OP1 and OP2 can be superimposed on aperture regions HA1 and HA2, respectively, and can correspond to electronic modules 410 and 420, respectively. According to some exemplary embodiments of the inventive concept, the anti-reflective layer POL can increase the light transmittance in aperture regions HA1 and HA2 and improve the sensitivity of electronic modules 410 and 420 by providing openings OP1 and OP2 corresponding to electronic modules 410 and 420, respectively.

[0218] Reference Figure 14A The light-shielding pattern can be set to multiple patterns, and the multiple light-shielding patterns LSP1 and LSP2 can be positioned to correspond to the aperture regions HA1 and HA2, respectively. For example, the electronic device 1000-2 may include a first light-shielding pattern LSP1 and a second light-shielding pattern LSP2.

[0219] When viewed in a plane defined by a first direction DR1 and a second direction DR2, the first light-shielding pattern LSP1 and the second light-shielding pattern LSP2 are positioned separately from each other. The first light-shielding pattern LSP1 may be located in a first aperture region HA1 and may be configured as an annular shape surrounding the first aperture transmission region HTA1. The second light-shielding pattern LSP2 may be located in a second aperture region HA2 and may be configured as an annular shape surrounding the second aperture transmission region HTA2.

[0220] Optionally, refer to Figure 13 and Figure 14B The light-shielding pattern can be set as a whole. For example, electronic device 1000-2 may include a single light-shielding pattern LSP-S.

[0221] The light-shielding pattern LSP-S can surround each of the first aperture transmission region HTA1 and the second aperture transmission region HTA2. The light-shielding pattern LSP-S can be located within a single aperture region HA-S surrounding the first aperture transmission region HTA1 and the second aperture transmission region HTA2, and can be configured to have openings formed therein corresponding to the first aperture transmission region HTA1 and the second aperture transmission region HTA2, respectively. Therefore, a single light-shielding region can be provided around the edges of the aperture transmission regions HTA1 and HTA2.

[0222] According to some exemplary embodiments of the inventive concept, multiple aperture transmission regions HTA1 and HTA2 corresponding to multiple electronic modules 410 and 420 respectively can be set, and various shapes of light-shielding regions can be set by using light-shielding patterns of various shapes. Therefore, the design freedom and aesthetics of the electronic device 1000-2 can be improved.

[0223] Furthermore, according to some exemplary embodiments of the inventive concept, the light-shielding pattern can be arranged to correspond to the plurality of aperture transmission regions HTA1 and HTA2, thereby preventing sagging of the package substrate ECG in each of the aperture transmission regions HTA1 and HTA2. Therefore, the problem of optical defects in each of the aperture transmission regions HTA1 and HTA2 being visible can be easily prevented.

[0224] According to some exemplary embodiments of the inventive concept, by providing a light-shielding area in the hole area stacked with the electronic module, the aesthetics of the electronic panel in the area adjacent to the electronic module can be improved.

[0225] Furthermore, according to some exemplary embodiments of the inventive concept, the light-shielding area can be formed using current processes, thus simplifying the process and reducing process costs. Additionally, according to some exemplary embodiments of the inventive concept, misalignment between other components, such as anti-reflective members, and the light-shielding area can be easily prevented.

[0226] Although exemplary embodiments of the inventive concept have been described herein, it should be understood that various changes and modifications can be made by those skilled in the art within the spirit and scope of the inventive concept as defined by the claims and their equivalents.

[0227] Therefore, the exemplary embodiments described herein are not intended to limit the technical spirit and scope of the invention, and all technical spirit within the scope of the claims or their equivalents shall be interpreted as being included within the scope of the invention.

Claims

1. An electronic device, the electronic device comprising: Electronic module; as well as The electronic panel, when viewed in a plan view, is superimposed on the electronic module. The electronic panel includes: The substrate is divided into a hole region, an effective region adjacent to the hole region, and a peripheral region adjacent to the effective region. The hole region includes a hole transmission region that is superimposed on the electronic module when viewed in the plan view, and a light-shielding region adjacent to the hole transmission region. Multiple light-emitting devices are separated from the aperture region in the effective region; A light-shielding pattern is separated from the aperture transmission area and the effective area in the light-shielding area; An encapsulation substrate, located on the substrate and including a rear surface facing the plurality of light-emitting devices and a front surface opposite the rear surface; and A sealing member that bonds the encapsulation substrate and the base substrate in the peripheral region. The light-shielding pattern is located on the rear surface of the encapsulation substrate. The light-shielding pattern comprises the same material as the sealing member, and The light-shielding pattern includes glass material.

2. The electronic device according to claim 1, further comprising: A window is located on the front surface of the encapsulation substrate; as well as An anti-reflective layer is located between the window and the encapsulation substrate. When viewed in the plan view, the window overlaps with the hole area, and The opening penetrates the anti-reflective layer and overlaps with the hole area.

3. The electronic device according to claim 2, wherein, The inner surface of the opening is aligned with the end of the light-shielding pattern.

4. The electronic device according to claim 2, wherein, When viewed in the plan view, the inner surface of the opening overlaps with the light-blocking pattern.

5. The electronic device according to claim 2, wherein, The light transmittance of the area of ​​the window that overlaps with the aperture area is equal to the light transmittance of the area of ​​the window that overlaps with the effective area.

6. The electronic device according to claim 1, wherein, When viewed in the plan view, the aperture transmission area is surrounded by the light-blocking pattern.

7. The electronic device according to claim 6, wherein, The aperture transmission region comprises multiple aperture transmission regions that are separated from each other, and The light-shielding pattern surrounds each of the plurality of aperture transmission regions.

8. The electronic device according to claim 6, wherein, Each of the aperture transmission region and the light-shielding pattern is configured as a plurality, the plurality of aperture transmission regions being separated from each other, and the plurality of light-shielding patterns being separated from each other. The plurality of light-shielding patterns surround the plurality of aperture transmission areas respectively.

9. The electronic device according to claim 1, wherein, The electronic module includes at least one of a camera, a speaker, a light sensor, and a thermal sensor.

10. The electronic device according to any one of claims 1 to 9, wherein, The electronic panel further includes signal wiring located in the light-shielding area and connected to a light-emitting device among the plurality of light-emitting devices that is adjacent to the aperture area. When viewed in the plan view, the signal wiring is partially or completely covered by the light-shielding pattern.

11. The electronic device according to claim 10, wherein, When viewed in the plan view, the light-shielding pattern is separated from the signal wiring.

12. The electronic device of claim 10, further comprising a via conductive pattern located in the light-shielding region and separated from the signal wiring to be electrically insulated from the signal wiring. in, The light-shielding pattern is in contact with the hole conductive pattern.

13. An electronic device, the electronic device comprising: Electronic module; as well as The electronic panel, when viewed in a plan view, is superimposed on the electronic module. The electronic panel includes: The substrate is divided into a hole region, an effective region adjacent to the hole region, and a peripheral region adjacent to the effective region. The hole region includes a hole transmission region that is superimposed on the electronic module when viewed in the plan view, and a light-shielding region adjacent to the hole transmission region. Multiple light-emitting devices are separated from the aperture region in the effective region; A light-shielding pattern is separated from the aperture transmission area in the light-shielding area; An encapsulation substrate is located on the substrate and includes a rear surface facing the plurality of light-emitting devices and a front surface opposite to the rear surface; A sealing member that bonds the encapsulation substrate and the base substrate; and Multiple insulating layers are located between and separated from the substrate and the encapsulation substrate. Wherein, the light-shielding pattern is located on the rear surface of the packaging substrate, and The light-shielding pattern is in contact with any one of the plurality of insulating layers.

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