Smt high-speed vacuum suction and release control module

Abstract

This invention discloses a high-speed vacuum adsorption and release control module for SMT (Surface Mount Technology), comprising multiple vacuum adsorption components, gas source channel components, multiple flow guide components, a timing module, and an MCU module. Each pair of flow guide components is fixedly mounted on top of a vacuum adsorption component. One side of the gas source channel component is fixedly connected to one side of the vacuum adsorption component, and the top of the gas source channel component is fixedly connected to the bottom of the flow guide component. An airflow port is provided between the gas source channel component and the flow guide component. This invention relates to the field of SMT placement machine technology. This high-speed vacuum adsorption and release control module for SMT achieves multi-channel vacuum generation with only one positive pressure gas source. Even if one or more channels experience vacuum leakage, the other channels maintain their own vacuum levels, thus solving the technical problem of overall vacuum level decrease due to leakage in a certain channel, and greatly improving the pick-and-place machine's success rate.

Description

Technical Field

[0001] This invention relates to the field of SMT placement machine technology, specifically to an SMT high-speed vacuum adsorption and release control module. Background Technology

[0002] SMT pick-and-place machines and other applications involving the picking and placement of components require vacuum adsorption. As the number of placement heads in pick-and-place machines increases, the traditional method of using a vacuum pump as the negative pressure source faces growing problems. In particular, a single negative pressure source is susceptible to leakage from a particular placement head, leading to a significant drop in vacuum levels. Using multiple negative pressure sources results in substantial increases in cost, larger space requirements, higher energy consumption, and more complex gas path layouts. Therefore, a method is needed that converts positive pressure to allow each channel to operate independently with a vacuum.

[0003] Furthermore, as pick-and-place machines demand increasingly higher pick-and-place speeds, the generation and dissipation of vacuum at each placement head require extremely high response times. However, gas pressure changes inherently exhibit lag, which contradicts practical requirements. Existing technologies mostly address this lag by increasing the waiting time for adsorption and release. To improve the operational efficiency of automated equipment, a specialized structure and control system is needed to achieve high-response speed and high-frequency vacuum switching capabilities.

[0004] In addition, as the integration and precision of automated equipment become increasingly higher, especially the placement head of SMT placement machines, which is a high-speed moving part, it is necessary to consider its motion load capacity and energy saving. This makes it even more necessary to realize the miniaturization of vacuum switching devices, the integration of multiple devices, and the lightweighting of multiple devices after integration. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a high-speed vacuum adsorption and release control module for SMT, which solves the problems of vacuum leakage in a certain channel affecting the whole system, the lag in vacuum negative pressure environment conversion, and the large size and complex gas path of the equipment.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a high-speed vacuum adsorption and release control module for SMT, comprising multiple vacuum adsorption components, an air source channel component, multiple flow guide components, a timing module, and an MCU module. Each pair of flow guide components is fixedly mounted on top of a vacuum adsorption component. One side of the air source channel component is fixedly connected to one side of the vacuum adsorption component. The top of the air source channel component is fixedly connected to the bottom of the flow guide component. An airflow port is provided between the air source channel component and the flow guide component. A spray pipe is provided inside the vacuum adsorption component, and the top of the spray pipe communicates with the bottom of the flow guide component.

[0007] Preferably, a negative pressure conversion valve is fixedly installed at the connection between the spray pipe and the guide component, and a negative pressure elimination valve is fixedly installed at the bottom of the vacuum adsorption component and on the spray pipe.

[0008] Preferably, the back of the vacuum adsorption component and the air intake of the spray pipe are connected to a conduit, and the top of the conduit is connected to a suction nozzle, and a rubber ring is fixedly installed on the top of the suction nozzle.

[0009] Preferably, the output terminal of the timing module is connected to the input terminal of the MCU module, and the output terminal of the MCU module is connected to the input terminals of the negative pressure conversion valve and the negative pressure elimination force valve.

[0010] Preferably, the top of the guide member is provided with an air outlet, one side of the air source channel member is connected to an air inlet, and both sides of the surface of the air source channel member are fixedly connected with mounting parts.

[0011] Preferably, the vacuum adsorption component, the two flow guides and the suction nozzle constitute a vacuum control unit body, and each vacuum control unit body is connected to the gas source channel component to form a multi-unit combination module.

[0012] Preferably, the control method specifically includes the following steps:

[0013] S1. When it is necessary to pick up a component, high-pressure air is first introduced through the air inlet. The MCU module outputs a high level through the IO port and turns on the MOS transistor. At this time, the negative pressure conversion valve opens and high-speed compressed air is immediately injected into the guide to generate turbulence. The air in the spray pipe is instantly and continuously drawn away. Its internal pressure is lower than atmospheric pressure, so that the nozzle can pick up the component.

[0014] S2. When the component needs to be released, the MCU module outputs a low level on the IO port, which closes the negative pressure conversion valve, thereby stopping the injection and ending the turbulence pumping effect. At the same time, the IO port corresponding to the control negative pressure elimination force valve outputs a high level.

[0015] S3. The timing module is activated to set this IO low. Since this IO has a high-level pulse of a set duration, the negative pressure elimination force valve has a momentary on-off process. This process provides enough air in the vacuum passage to ensure that the negative pressure disappears instantly and that the component can be released quickly.

[0016] Beneficial effects

[0017] This invention provides a high-speed vacuum adsorption and release control module for SMT (Surface Mount Technology). Compared with existing technologies, it has the following advantages:

[0018] (1) The SMT high-speed vacuum adsorption and release control module is fixedly connected to the top of the air source channel component and the bottom of the guide component. An air flow port is opened between the air source channel component and the guide component. A spray pipe is opened inside the vacuum adsorption component. The top of the spray pipe is connected to the bottom of the guide component. A negative pressure conversion valve is fixedly installed at the connection between the spray pipe and the guide component. One vacuum adsorption component, two guide components and one nozzle form a vacuum control unit body. Each vacuum control unit body is connected to the air source channel component to form a multi-unit combination module. Only one positive pressure air source is needed to realize the generation of multiple vacuums. Even if one or several channels have vacuum leakage, the other channels still maintain their own vacuum degree, thereby solving the technical problem of the overall vacuum degree decreasing due to leakage of a certain channel, and greatly improving the pick-up success rate of the placement machine.

[0019] (2) The SMT high-speed vacuum adsorption and release control module has a negative pressure elimination force valve fixedly installed at the bottom of the vacuum adsorption component and on the spray pipe. The output end of the timing module is connected to the input end of the MCU module, and the output end of the MCU module is connected to the input end of the negative pressure conversion valve and the negative pressure elimination force valve. It has a specific spray pipe and the vacuum elimination force valve is controllable, which allows the pick-and-place machine or other automated equipment to complete the picking and placing of components instantly without waiting, greatly improving the working efficiency of the pick-and-place machine.

[0020] (3) The SMT high-speed vacuum adsorption and release control module is fixedly installed on the top of a vacuum adsorption component by two flow guides. One side of the gas source channel component is fixedly connected to one side of the vacuum adsorption component, and the top of the gas source channel component is fixedly connected to the bottom of the flow guide. An air flow port is opened between the gas source channel component and the flow guide. A spray pipe is opened inside the vacuum adsorption component, and the top of the spray pipe is connected to the bottom of the flow guide. It has a high degree of integration, saves a lot of external air paths, and the overall volume and weight are greatly reduced. It is relatively simple, has superior performance, high reliability, and low overall cost. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the multi-unit combined module structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the internal structure of the vacuum adsorption component, gas source channel component, and flow guide component of the present invention;

[0023] Figure 3 This is a structural principle block diagram of the system of the present invention;

[0024] Figure 4 This is a flowchart illustrating the operation of the present invention;

[0025] Figure 5 This is a schematic diagram of the structure of the vacuum control unit of the present invention.

[0026] In the diagram: 1. Vacuum adsorption component; 2. Air source channel component; 3. Flow guide component; 4. Timing module; 5. MCU module; 6. Air flow port; 7. Spray pipe; 8. Negative pressure conversion valve; 9. Negative pressure elimination valve; 10. Guide tube; 11. Suction nozzle; 12. Rubber ring; 13. Air outlet; 14. Air inlet; 15. Mounting component. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Please see Figure 1-5 This invention provides a technical solution: a high-speed vacuum adsorption and release control module for SMT, comprising multiple vacuum adsorption components 1, air source channel components 2, multiple flow guide components 3, a timing module 4, and an MCU module 5. Every two flow guide components 3 are fixedly installed on the top of a vacuum adsorption component 1. One side of the air source channel component 2 is fixedly connected to one side of the vacuum adsorption component 1, and the top of the air source channel component 2 is fixedly connected to the bottom of the flow guide component 3. An air flow port 6 is provided between the air source channel component 2 and the flow guide component 3. A spray pipe 7 is provided inside the vacuum adsorption component 1, and the top of the spray pipe 7 is connected to the bottom of the flow guide component 3. The spray pipe 7 is formed by CNC machining.

[0029] In this invention, a negative pressure switching valve 8 is fixedly installed at the connection between the spray pipe 7 and the guide member 3, and a negative pressure elimination force valve 9 is fixedly installed at the bottom of the vacuum adsorption member 1 and on the spray pipe 7. Both the negative pressure switching valve 8 and the negative pressure elimination force valve 9 are solenoid valves.

[0030] In this invention, the back of the vacuum adsorption component 1 and the air inlet of the spray pipe 7 are connected to a conduit 10, and the top of the conduit 10 is connected to a suction nozzle 11, and a rubber ring 12 is fixedly installed on the top of the suction nozzle 11.

[0031] In this invention, the output terminal of the timing module 4 is connected to the input terminal of the MCU module 5, and the output terminal of the MCU module 5 is connected to the input terminals of the negative pressure conversion valve 8 and the negative pressure elimination force valve 9.

[0032] In this invention, the top of the guide member 3 is provided with an air outlet 13, one side of the air source channel member 2 is connected to an air inlet 14, and both sides of the surface of the air source channel member 2 are fixedly connected with mounting members 15.

[0033] In this invention, a vacuum adsorption component 1, two flow guides 3 and a suction nozzle 11 constitute a vacuum control unit body, and each vacuum control unit body is connected to the gas source channel component 2 to form a multi-unit combination module. Multiple negative pressure control units are connected together to form a multi-path module. All units share one gas source, but the negative pressure path of each unit does not interfere with each other, providing vacuum control for multiple adhesive heads individually.

[0034] The control method of this invention specifically includes the following steps:

[0035] S1. When it is necessary to pick up the component, high-pressure air is first introduced through the air inlet 14. The MCU module 5 outputs a high level through the IO port and turns on the MOS transistor. At this time, the negative pressure conversion valve 8 is opened, and high-speed compressed air is immediately injected into the guide 3 to generate turbulence. The air in the spray pipe 7 is instantly and continuously drawn away. Its internal pressure is lower than atmospheric pressure, so that the suction nozzle 11 can adsorb the component.

[0036] S2. When the component needs to be released, the MCU module 5 outputs a low level on the IO port, which closes the negative pressure conversion valve 8, thereby stopping the injection and ending the turbulence pumping effect. At the same time, the IO port corresponding to the control negative pressure elimination force valve 9 outputs a high level.

[0037] S3. The timing module 4 is activated to set the IO low. Since the IO has a high-level pulse of a set duration, the negative pressure elimination force valve 9 has a momentary on-off process. This process provides enough air in the vacuum passage to ensure that the negative pressure disappears instantly and that the component can be released quickly.

[0038] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0040] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-speed vacuum adsorption and release control module for SMT, comprising multiple vacuum adsorption components (1) and a gas source channel component (2). The plurality of flow guides (3), timing module (4) and MCU module (5), characterized in that: Two guide components (3) are fixedly installed on the top of a vacuum adsorption component (1). One side of the gas source channel component (2) is fixedly connected to one side of the vacuum adsorption component (1). The top of the gas source channel component (2) is fixedly connected to the bottom of the guide component (3). An air passage (6) is provided between the gas source channel component (2) and the guide component (3). A spray pipe (7) is provided inside the vacuum adsorption component (1). The top of the spray pipe (7) is connected to the bottom of the guide component (3). A negative pressure conversion valve (8) is fixedly installed at the connection between the spray pipe (7) and the guide (3), and a negative pressure elimination force valve (9) is fixedly installed at the bottom of the vacuum adsorption component (1) on the spray pipe (7). The output of the timing module (4) is connected to the input of the MCU module (5), and the output of the MCU module (5) is connected to the input of the negative pressure conversion valve (8) and the negative pressure elimination force valve (9). The vacuum adsorption component (1), two flow guides (3) and a suction nozzle (11) constitute a vacuum control unit body, and each vacuum control unit body is connected to the gas source channel component (2) to form a multi-unit combination module.

2. The SMT high-speed vacuum suction and release control module according to claim 1, characterized in that: The vacuum adsorption component (1) is connected to a conduit (10) at the air intake of the spray pipe (7) on its back side, and a suction nozzle (11) is connected to the top of the conduit (10). A rubber ring (12) is fixedly installed on the top of the suction nozzle (11).

3. The SMT high-speed vacuum adsorption and release control module according to claim 2, characterized in that: The top of the guide (3) is provided with an air outlet (13), one side of the air source channel (2) is connected to an air inlet (14), and both sides of the surface of the air source channel (2) are fixedly connected with mounting parts (15).

4. The SMT high-speed vacuum adsorption and release control module according to claim 3, characterized in that: It is controlled through the following steps: S1. When it is necessary to pick up the component, high-pressure air is first introduced through the air inlet (14). The MCU module (5) outputs a high level through the IO port. At this time, the negative pressure conversion valve (8) is opened. High-speed compressed air is injected into the guide (3) to generate turbulence and continuously draw away the air in the spray pipe (7). The pressure inside the guide (3) is lower than atmospheric pressure, so that the suction nozzle (11) adsorbs the component. S2. When the component needs to be released, the MCU module (5) outputs a low level on the IO port, which closes the negative pressure conversion valve (8), thereby stopping the injection and ending the turbulence pumping effect. At the same time, the IO port corresponding to the control negative pressure elimination force valve (9) outputs a high level. S3. Start the timing module (4) to set the IO low for timing. Since the IO has a high-level pulse of a set duration, the negative pressure elimination force valve (9) is switched on and off to ensure that the component is released.

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