Display device and method for manufacturing a display device

Abstract

A display device and a method for manufacturing the display device are provided. The display device includes a light emitting element disposed in a display region. A connection pad is disposed in a bonding region of a non-display region. The connection pad includes a lower conductive layer, an intermediate conductive layer disposed on the lower conductive layer, and an upper conductive layer disposed on the intermediate conductive layer. A lower surface of the upper conductive layer directly contacts an upper surface of the intermediate conductive layer with no intermediate member disposed therebetween.

Description

Technical Field

[0001] Several exemplary embodiments relate to a display device. More specifically, several exemplary embodiments relate to a display device and a method for manufacturing the display device. Background Technology

[0002] Organic light-emitting displays (OLEDs) emit light without requiring a backlight or a separate light source. Therefore, compared to other display devices, OLEDs can have reduced weight and thickness. Due to these characteristics, the use of OLEDs in display devices such as flexible displays has increased.

[0003] An organic light-emitting display device includes an array of light-emitting elements and a driving unit for providing driving signals to the light-emitting elements. The driving circuitry of the driving unit can be housed in a driving chip. The driving chip (or a circuit board coupled to the driving chip) can be coupled to the substrate of the organic light-emitting display device.

[0004] The driver chip can be bonded to the substrate using hot pressing or similar methods. However, the bonding process can lead to bonding defects, which reduce the reliability of the display device. Summary of the Invention

[0005] Several exemplary embodiments provide a display device with improved reliability.

[0006] Several exemplary embodiments provide a method for manufacturing a display device.

[0007] According to an exemplary embodiment, the display device includes a light-emitting element disposed in a display area. A bonding pad is disposed in a bonding area outside the display area. The bonding pad includes a lower conductive layer, an intermediate conductive layer disposed on the lower conductive layer, and an upper conductive layer disposed on the intermediate conductive layer. The lower surface of the upper conductive layer directly contacts the upper surface of the intermediate conductive layer, and no intermediate member is disposed between the upper conductive layer and the intermediate conductive layer.

[0008] In an exemplary embodiment, the display device further includes: a driving element electrically connected to a light-emitting element; an encapsulation layer covering the light-emitting element; and a touch sensing portion disposed on the encapsulation layer, the touch sensing portion including: sensing a conductive pattern. The driving element includes: a gate metal pattern and a source metal pattern, the gate metal pattern including a gate electrode, and the source metal pattern including a drain electrode or a connection electrode electrically connected to the drain electrode of the light-emitting element.

[0009] In an exemplary embodiment, the lower conductive layer and the gate metal pattern are disposed in the same layer, the middle conductive layer and the source metal pattern are disposed in the same layer, and the upper conductive layer and the sensing conductive pattern are disposed in the same layer.

[0010] In an exemplary embodiment, the source metal pattern includes a first source metal pattern and a second source metal pattern. The first source metal pattern includes a drain electrode, and the second source metal pattern includes a connection electrode. The intermediate conductive layer includes a first intermediate conductive layer and a second intermediate conductive layer. The first intermediate conductive layer and the first source metal pattern are disposed in the same layer, and the second intermediate conductive layer and the second source metal pattern are disposed in the same layer.

[0011] In an exemplary embodiment, the display device further includes an encapsulation layer and a touch sensing unit. The encapsulation layer covers the light-emitting element, and the touch sensing unit is disposed on the encapsulation layer. The touch sensing unit includes a first sensing conductive pattern, a touch intermediate insulating layer, and a second sensing conductive pattern. The touch intermediate insulating layer covers the first sensing conductive pattern, and the second sensing conductive pattern is disposed on the touch intermediate insulating layer. The upper conductive layer and the second sensing conductive pattern are disposed in the same layer.

[0012] In an exemplary embodiment, the upper conductive layer covers the upper surface and side surface of the intermediate conductive layer.

[0013] In an exemplary embodiment, the entire lower surface of the upper conductive layer is in contact with the intermediate conductive layer.

[0014] In an exemplary embodiment, the intermediate conductive layer includes an aluminum layer and a titanium layer, with the titanium layer disposed on the aluminum layer.

[0015] In an exemplary embodiment, the first electrode of the light-emitting element comprises silver.

[0016] In an exemplary embodiment, the connection pads are electrically connected to the drive unit via conductive bonding members.

[0017] According to an exemplary embodiment, a method for manufacturing a display device includes: forming a light-emitting element disposed in a display area, a driving element electrically connected to the light-emitting element, and an encapsulation layer covering the light-emitting element. A lower conductive layer with connecting pads is formed in a bonding area outside the display area. An intermediate conductive layer is formed with the connecting pads. The intermediate conductive layer is electrically connected to the lower conductive layer. A cover layer is formed, covering a side surface of the intermediate conductive layer and exposing a top surface of the intermediate conductive layer. After forming the light-emitting element and the encapsulation layer, the cover layer is removed.

[0018] According to an exemplary embodiment, the display device includes a light-emitting element disposed in a display area. A bonding pad is disposed in a bonding area outside the display area. The bonding pad includes a lower conductive layer, a first intermediate conductive layer disposed on the lower conductive layer, a second intermediate conductive layer disposed on the first intermediate conductive layer, and an upper conductive layer disposed on the second intermediate conductive layer. The lower surface of the second intermediate conductive layer directly contacts and covers the upper surface and side surface of the first intermediate conductive layer. The lower surface of the upper conductive layer directly contacts and covers the upper surface and side surface of the second intermediate conductive layer.

[0019] According to an exemplary embodiment, a coating layer is formed in the bonding region to prevent the conductive layer, including aluminum, from being exposed. Therefore, particles resulting from the reduction of metal ions can be prevented. Furthermore, the coating layer, including an organic material, is removed during the process of forming the touch sensing portion prior to the bonding process; this organic material is sensitive to heat and moisture. Therefore, bonding failures can be prevented, and the reliability of the display device can be improved. Attached Figure Description

[0020] Various aspects of one or more exemplary embodiments of the inventive concept will become clearer from the following detailed description taken in conjunction with the accompanying drawings.

[0021] Figure 1 This is a top view illustrating an exemplary display device according to a concept of the present invention.

[0022] Figure 2 This illustrates an exemplary embodiment of the concept according to the present invention. Figure 1 An enlarged top view of area A.

[0023] Figure 3 , Figure 5 , Figure 7 , Figure 10 , Figure 12 and Figure 15 This is a cross-sectional view showing the display area of ​​a display device formed by a method for manufacturing a display device according to an exemplary embodiment of the present invention.

[0024] Figure 4 , Figure 6 , Figure 8 , Figure 11 , Figure 13 , Figure 14 , Figure 16 and Figure 17 This illustrates the method for manufacturing a display device according to an exemplary embodiment of the concept of the present invention, showing the formation along the […]. Figure 2 A cross-sectional view of the joint area of ​​the display device, taken by line I-I'.

[0025] Figure 9 This illustrates an example embodiment of the concept according to the present invention. Figure 7 An enlarged cross-sectional view of area B.

[0026] Figures 18 to 20 This illustrates the method for manufacturing a display device according to an exemplary embodiment of the concept of the present invention, showing the formation along the […]. Figure 2 A cross-sectional view of the joint area of ​​the display device, taken by line I-I'. Detailed Implementation

[0027] The following description, in conjunction with the accompanying drawings, will illustrate exemplary embodiments of a display device and a method for manufacturing the display device, some of which are shown in the drawings.

[0028] Figure 1 This is a top view showing an exemplary embodiment of a display device 1 according to the concept of the present invention. Figure 2 This illustrates an exemplary embodiment of the concept according to the present invention. Figure 1 An enlarged plan view of area A.

[0029] Reference Figure 1 The display device 1 includes a display area DA and a non-display area PA.

[0030] An array of multiple pixels PX that emit light to display an image can be set in the display area DA. For ease of explanation, Figure 1 The exemplary embodiment shown only illustrates a single specific pixel PX. However, an array of multiple pixel PXs includes multiple pixel PXs, which can be constructed in various different arrangements. In the exemplary embodiment, the display device 1 can be an organic light-emitting display device. However, the exemplary embodiments of the inventive concept are not limited thereto. Each of the multiple pixel PXs may include an organic light-emitting diode and a driving element for driving the organic light-emitting diode. The driving element may include at least one thin-film transistor. The display device 1 may also include an encapsulation layer protecting the organic light-emitting diode and a touch sensing portion disposed on the encapsulation layer.

[0031] exist Figure 1 In the exemplary embodiment shown, the display area DA is shown to have a rectangular shape, with a relatively long side extending in a first direction D1 and a relatively short side extending in a second direction D2. However, in other exemplary embodiments, the display area DA may have various different shapes. The non-display area PA may include a peripheral area PA1 and a junction area PA2, wherein the peripheral area PA1 is adjacent to or surrounds the display area DA. Figure 1 In the exemplary embodiment shown, the peripheral region PA1 may surround the four sides of the display region DA (e.g., in the first direction D1 and the second direction D2). However, in other exemplary embodiments, the peripheral region PA1 may surround three or fewer sides of the display region DA. Figure 1 In an exemplary embodiment, the engagement region PA2 may be disposed below the peripheral region PA1 (e.g., in the first direction D1).

[0032] The driving unit DC can provide a driving signal, such as a data signal, to an array of multiple pixels PX in the display area DA. In an exemplary embodiment, the driving unit DC may include a driving chip, which includes an integrated circuit. The driving signal generated by the driving unit DC can be provided to the array of multiple pixels PX in the display area DA via a transmission line TL extending from the driving unit DC to the display area DA. For example, the transmission line TL may extend along a first direction D1. However, exemplary embodiments of the inventive concept are not limited thereto.

[0033] In an exemplary embodiment, the display device 1 may have a folded shape or a bent shape. For example, as Figure 1 In an exemplary embodiment, the display device 1 may include a bent region PA3 (e.g., in a first direction D1) between a peripheral region PA1 and a joining region PA2. The bent region PA3 may be bent to have a curvature that allows the joining region PA2 to be positioned below the display region DA.

[0034] Connection pads electrically connected to the drive unit DC are provided in the bonding area PA2. For example, in an exemplary embodiment, multiple connection pads may be arranged in a zigzag pattern along a second direction D2 intersecting the first direction D1. For example, as... Figure 2 In the exemplary embodiment shown, a plurality of first connection pads CP1 electrically connected to a plurality of first transmission lines TL1 may be spaced apart in a first row in a second direction D2, and a plurality of second connection pads CP2 electrically connected to a plurality of second transmission lines TL2 may be spaced apart in a second row in a second direction D2. The second row is spaced apart from the first row in a first direction D1.

[0035] In an exemplary embodiment, the first connection pad CP1 and the second connection pad CP2 may each have a multilayer structure including multiple conductive layers. For example, the first connection pad CP1 and the second connection pad CP2 may include a combination of multiple conductive layers, wherein the multiple conductive layers are formed of at least two identical layers among the gate metal pattern of the driving element, the source metal pattern of the driving element, and the sensing conductive pattern of the touch sensing portion.

[0036] Figures 3 to 17 This is a cross-sectional view showing the structure formed by a method for manufacturing a display device 1 according to an exemplary embodiment of the present invention. Figure 3 , Figure 5 , Figure 7 , Figure 10 , Figure 12 and Figure 15 The display area DA can be shown, and Figure 4 , Figure 6 , Figure 8 , Figure 11 , Figure 13 , Figure 14 , Figure 16 and Figure 17 It can be shown along Figure 2 The joint area PA2 is intercepted by line I-I'. Figure 9 It can be shown Figure 8 The magnified area "B".

[0037] Reference Figure 3 A buffer layer 120 is formed on the substrate 110 in the display area DA. For example, as... Figure 3 In an exemplary embodiment, the bottom surface of the buffer layer 120 can be directly disposed on the top surface of the substrate 110.

[0038] In an exemplary embodiment, substrate 110 may include glass, quartz, silicon, polymer materials, etc. However, exemplary embodiments of the present invention are not limited thereto. For example, substrate 110 may be a flexible substrate comprising a polymer material. In an exemplary embodiment, the polymer material may include polyethylene terephthalate, polyethylene naphthalate, polyetherketone, polycarbonate, polyarylate, polyethersulfone, polyimide, or combinations thereof.

[0039] The buffer layer 120 can prevent or reduce the penetration of impurities, moisture, or external gases from the lower surface of the substrate 110, and can planarize the upper surface of the substrate 110. For example, the buffer layer 120 may include inorganic materials such as silicon oxide, silicon nitride, or the like, or combinations thereof.

[0040] An active pattern AP is formed on the buffer layer 120. For example, such as... Figure 3 In an exemplary embodiment, the bottom surface of the active pattern AP can be formed directly on the top surface of the buffer layer 120.

[0041] In an exemplary embodiment, the active patterned AP may include a semiconductor material, such as amorphous silicon, polycrystalline silicon, metal oxide, etc. In embodiments where the active patterned AP may include polycrystalline silicon, at least a portion of the active patterned AP may be doped with impurities such as n-type or p-type impurities.

[0042] In another exemplary embodiment, the active patterned AP may include a metal-oxide-semiconductor (MODS). For example, the active patterned AP may include a binary compound (AB). x ), ternary compounds (AB) x C y ) or four-component compound (AB) x C y D z ), while binary compounds (AB) x ), ternary compounds (AB) x C y ) or four-component compound (AB)x C y D z This includes compounds selected from indium (In), zinc (Zn), gallium (Ga), tin (Sn), titanium (Ti), aluminum (Al), hafnium (Hf), zirconium (Zr), and magnesium (Mg). For example, an active patterned AP may include zinc oxide (ZnO). x Gallium oxide (GaO) x Titanium oxide (TiO) x ), Tin oxide (SnO) x Indium oxide (InO) x Indium gallium oxide (IGO), indium zinc oxide (IZO), indium tin oxide (ITO), zinc gallium oxide (GZO), zinc magnesium oxide (ZMO), zinc tin oxide (ZTO), zinc zirconium oxide (ZnZr) x O y Indium gallium zinc oxide (IGZO), indium zinc tin oxide (IZTO), indium gallium hafnium oxide (IGHO), tin aluminum zinc oxide (TAZO), indium gallium tin oxide (IGTO), etc.

[0043] A first insulating layer 130 is formed on the active pattern AP. For example, as shown... Figure 3 In the exemplary embodiment shown, the first insulating layer 130 can be directly disposed on the top and side surfaces of the active pattern AP. A first gate metal pattern including a gate electrode GE is formed on the first insulating layer 130. The bottom surface of the gate electrode GE can be directly formed on the top surface of the first insulating layer 130. The gate electrode GE overlaps with the active pattern AP (e.g., in the thickness direction of the substrate 110). A second insulating layer 140 is formed to cover the first gate metal pattern. For example, as... Figure 3 In the exemplary embodiment shown, the second insulating layer 140 can be directly disposed on the top and side surfaces of the gate electrode GE and on the top surface of the first insulating layer 130. A second gate metal pattern including the gate wiring pattern GP is formed on the second insulating layer 140. For example, as Figure 3 In the exemplary embodiment, the bottom surface of the gate wiring pattern GP can be directly formed on the top surface of the second insulating layer 140. In the exemplary embodiment, the gate wiring pattern GP may include capacitor electrodes and signal lines for transmitting drive signals, etc.

[0044] In an exemplary embodiment, the first insulating layer 130 and the second insulating layer 140 may each comprise at least one compound selected from silicon oxide, silicon nitride, and silicon carbide, or a combination thereof. Furthermore, the first insulating layer 130 and the second insulating layer 140 may comprise insulating metal oxides, such as aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, etc. For example, the first insulating layer 130 and the second insulating layer 140 may each have a single-layer structure or a multi-layer structure, and the single-layer structure or multi-layer structure may be formed of silicon nitride and / or silicon oxide.

[0045] For example, the first gate metal pattern and the second gate metal pattern may each include at least one of gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti) and tantalum (Ta) or alloys thereof, and may have a single-layer structure or a multi-layer structure including different metal layers.

[0046] Reference Figure 4 The diagram shows the lower conductive layer of the connection pads in the bonding region PA2.

[0047] In an exemplary embodiment, the lower conductive layer CP1a of the first connection pad CP1 can be formed of the same layer as the gate electrode GE, and the lower conductive layer CP2a of the second connection pad CP2 can be formed of the same layer as the gate wiring pattern GP. For example, as Figure 4 In the exemplary embodiment shown, the bottom surface of the lower conductive layer CP1a of the first connecting pad CP1 can be directly disposed on the top surface of the first insulating layer 130. The second insulating layer 140 can be directly disposed on the top and side surfaces of the lower conductive layer CP1a of the first connecting pad CP1 and on the top surface of the first insulating layer 130. The lower conductive layer CP1a of the first connecting pad CP1 is disposed between the first insulating layer 130 and the second insulating layer 140. The lower conductive layer CP2a of the second connecting pad CP2 can be disposed on the second insulating layer 140. For example, as Figure 4 In an exemplary embodiment, the bottom surface of the lower conductive layer CP2a of the second connection pad CP2 can be directly formed on the top surface of the second insulating layer 140.

[0048] also, Figure 2The first transmission line TL1 and the second transmission line TL2 shown can be formed from the same layers as the gate electrode GE and the gate wiring pattern GP, ​​respectively, and can be continuously connected to the corresponding lower conductive layers CP1a and CP2a. However, in an exemplary embodiment, at least a portion of the first transmission line TL1 and the second transmission line TL2 can be formed from layers different from the gate electrode GE and the gate wiring pattern GP. For example, the first transmission line TL1 and the second transmission line TL2 may include a bridge formed from a layer with the same layer as the source metal pattern.

[0049] Reference Figure 5 A third insulating layer 150 is formed in the display area DA to cover the second gate metal pattern, such as the gate wiring pattern GP. Figure 5 In the exemplary embodiment shown, the bottom surface of the third insulating layer 150 can directly contact the top and side surfaces of the gate wiring pattern GP and the top surface of the second insulating layer 140. Thereafter, a first source metal pattern is formed on the third insulating layer 150. Figure 5 In an exemplary embodiment, the first source metal pattern may include a source electrode SE and a drain electrode DE, which are electrically connected to the active pattern AP, respectively. For example, the source electrode SE and the drain electrode DE may be formed directly on the top surface of the third insulating layer 150. The source electrode SE and the drain electrode DE may pass through the third insulating layer 150, the second insulating layer 140, and the first insulating layer 130, respectively, to contact the active pattern AP for which they are electrically connected.

[0050] Reference Figure 6 A first intermediate conductive layer CP1b of the first connecting pad CP1 and a first intermediate conductive layer CP2b of the second connecting pad CP2 are formed in the bonding region PA2.

[0051] In an exemplary embodiment, the first intermediate conductive layer CP1b of the first connection pad CP1 and the first intermediate conductive layer CP2b of the second connection pad CP2 can be formed of the same layer as the source electrode SE and the drain electrode DE. Therefore, the first intermediate conductive layer CP1b of the first connection pad CP1 and the first intermediate conductive layer CP2b of the second connection pad CP2 can be disposed on the third insulating layer 150. For example, the first intermediate conductive layer CP1b of the first connection pad CP1 and the first intermediate conductive layer CP2b of the second connection pad CP2 can be directly disposed on the top surface of the third insulating layer 150. The first intermediate conductive layer CP1b of the first connection pad CP1 can penetrate the third insulating layer 150 and the second insulating layer 140 to contact the lower conductive layer CP1a for electrical connection thereto. The first intermediate conductive layer CP2b of the second connection pad CP2 can penetrate the third insulating layer 150 to contact the lower conductive layer CP2a for electrical connection thereto.

[0052] Reference Figure 7 A fourth insulating layer 160 is formed to cover the first source metal pattern. In an exemplary embodiment, the fourth insulating layer 160 may include an inorganic layer 162 and an organic layer 164, wherein the inorganic layer 162 is in direct contact with the first source metal pattern and the organic layer 164 is disposed on the inorganic layer 162.

[0053] A second source metal pattern is formed on the fourth insulating layer 160. The second source metal pattern may include a connection electrode CE electrically connected to the drain electrode DE. For example, as... Figure 7 In the exemplary embodiment, the connection electrode CE can be formed directly on the top surface of the organic layer 164 of the fourth insulating layer 160. The connection electrode CE can extend through the fourth insulating layer 160 to contact the drain electrode DE for electrical connection thereto. The second source metal pattern may also include a mesh power line to compensate for the voltage drop of the current applied to the organic light-emitting diode.

[0054] A fifth insulating layer 170 is formed to cover the second source metal pattern. For example, as... Figure 7 In the exemplary embodiment shown, the fifth insulating layer 170 may be formed directly on the top and side surfaces of the connection electrode CE and on the top surface of the fourth insulating layer 160 (e.g., the top surface of the organic layer 164). The fifth insulating layer 170 may include openings that expose at least a portion of the upper surface of the connection electrode CE.

[0055] In an exemplary embodiment, the first source metal pattern and the second source metal pattern may include at least one selected from gold (Au), silver (Ag), aluminum (Ag), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti), and tantalum (Ta), or alloys thereof, and may have a single-layer structure or a multi-layer structure including different metal layers. In an exemplary embodiment, the first source metal pattern and the second source metal pattern may include at least one layer, which includes aluminum or an aluminum alloy. For example, the first source metal pattern and the second source metal pattern may each have a titanium / aluminum bilayer structure or a titanium / aluminum / titanium trilayer structure.

[0056] For example, the inorganic layers 162 of the third insulating layer 150 and the fourth insulating layer 160 may each comprise at least one compound selected from silicon oxide, silicon nitride, and silicon carbide, or combinations thereof. Furthermore, the inorganic layers 162 of the third insulating layer 150 and the fourth insulating layer 160 may comprise insulating metal oxides, such as aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, etc. For example, the inorganic layers 162 of the third insulating layer 150 and the fourth insulating layer 160 may each have a single-layer structure or a multi-layer structure, and the single-layer structure or multi-layer structure may be formed of silicon nitride and / or silicon oxide.

[0057] In an exemplary embodiment, the organic layer 164 of the fifth insulating layer 170 and the fourth insulating layer 160 may include organic insulating materials, such as phenolic resin, acrylaldehyde resin, polyimide resin, polyamide resin, epoxy resin, benzocyclobutene, etc.

[0058] Reference Figure 8 A second intermediate conductive layer CP1c of the first connecting pad CP1 and a second intermediate conductive layer CP2c of the second connecting pad CP2 are formed in the bonding region PA2.

[0059] In an exemplary embodiment, the fourth insulating layer 160 formed on the first intermediate conductive layer CP1b of the first connection pad CP1 and the first intermediate conductive layer CP2b of the second connection pad CP2 may include an inorganic layer 162 but does not have an organic layer 164. For example, in an exemplary embodiment, the organic layer 164 of the fourth insulating layer 160 may be initially formed in the bonding region PA2 and may be completely removed during the process of patterning the organic layer 164 in the display region DA.

[0060] The second intermediate conductive layer CP1c of the first connection pad CP1 and the second intermediate conductive layer CP2c of the second connection pad CP2 can be formed on the inorganic layer 162 and can pass through the inorganic layer 162 to electrically contact the first intermediate conductive layer CP1b and the first intermediate conductive layer CP2b, respectively. In an exemplary embodiment, the second intermediate conductive layer CP1c of the first connection pad CP1 and the second intermediate conductive layer CP2c of the second connection pad CP2 can be formed from the same layer as the connection electrode CE.

[0061] A cover layer 172 is formed in the bonding region PA2 to cover at least a portion of the second intermediate conductive layer CP1c of the first connecting pad CP1 and the second intermediate conductive layer CP2c of the second connecting pad CP2. In an exemplary embodiment, the cover layer 172 may be formed of the same layer as the fifth insulating layer 170 formed in the display region DA.

[0062] Reference Figure 9 The second intermediate conductive layer CP1c of the first connecting pad CP1 and the second intermediate conductive layer CP2c of the second connecting pad CP2 can each include an upper UL layer, an intermediate ML layer, and a lower LL layer. For example... Figure 9 In the exemplary embodiments shown, the bottom surface of the intermediate layer ML can be directly disposed on the top surface of the lower layer LL. The bottom surface of the upper layer UL can be directly disposed on the top surface of the intermediate layer ML. In the exemplary embodiments, the upper layer UL and the lower layer LL may include metals with relatively low ionization tendency, such as titanium. In the exemplary embodiments, the intermediate layer ML may include metals with relatively high ionization tendency, such as aluminum. However, the exemplary embodiments of the inventive concept are not limited thereto.

[0063] The overlay layer 172 at least covers the side surface of the second intermediate conductive layer CP1c of the first connecting pad CP1 and the side surface of the second intermediate conductive layer CP2c of the second connecting pad CP2. For example, as Figure 9 In the exemplary embodiment, the overlay layer 172 covers the lateral side surfaces of the upper UL, the middle ML, and the lower LL, as well as a portion of the upper surface of the upper UL. Therefore, at least a portion of the upper surface of the upper UL is exposed and not covered by the overlay layer 172. However, the middle ML is covered by the overlay layer 172, the upper UL, and the lower LL, and is not exposed. The lower LL is covered by the overlay layer 172 and the middle ML, and is not exposed. In other exemplary embodiments, the overlay layer 172 may not cover the upper surface of the upper UL.

[0064] In an exemplary embodiment, the thickness T2 of the covering layer 172 can be less than the thickness T1 of the fifth insulating layer 170. Therefore, the relatively thin covering layer 172 can be removed in a relatively short time by a process such as ashing or similar methods. Accordingly, damage to other components can be minimized or prevented. In an exemplary embodiment, the thickness T2 of the covering layer 172 can be equal to or less than 1 μm. However, exemplary embodiments of the inventive concept are not limited thereto. For example, in another exemplary embodiment, the thickness T2 of the covering layer 172 can be in the range of about 0.70 μm to about 1 μm.

[0065] In an exemplary embodiment, the fifth insulating layer 170 and the cladding layer 172 can be formed using a photolithography process with halftone exposure. However, exemplary embodiments of the present invention are not limited thereto.

[0066] For example, a photoresist composite is coated in the display area DA and the bonding area PA2, and exposed in a manner such that the exposure amount corresponding to the fifth insulating layer 170 is different from the exposure amount corresponding to the cladding layer 172. Therefore, the fifth insulating layer 170 and the cladding layer 172, having different thicknesses than each other, can be formed in the same process.

[0067] Reference Figure 10 and Figure 11 A lower electrode layer 211 is formed on the fifth insulating layer 170 and the covering layer 172, and the lower electrode layer 211 is patterned to form the first electrode 212 of the light-emitting diode in the display area DA. Figure 10 In the exemplary embodiment shown, the first electrode 212 can be directly disposed on the top surface of the fifth insulating layer 170 and can penetrate the fifth insulating layer 170 to contact the connection electrode CE for electrical connection thereto. Figure 11 As shown in the exemplary embodiments, such as Figure 11As indicated by the dashed line representing the removed lower electrode layer 211, the lower electrode layer 211 can be completely removed in the bonding region PA2.

[0068] In an exemplary embodiment, the lower electrode layer 211 may have a multilayer structure including a metal oxide layer and a metal layer. The metal oxide layer may include at least one compound selected from indium tin oxide (ITO), indium zinc oxide (IZO), zinc tin oxide (ZTO), indium oxide (In2O3), zinc oxide (ZnO), and tin oxide, or combinations thereof. The metal layer may include at least one compound selected from gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), and titanium (Ti), or combinations thereof.

[0069] In an exemplary embodiment where the lower electrode layer 211 includes silver, silver ions can dissolve in the etchant during the etching process of the lower electrode layer 211. When the etchant containing silver ions comes into contact with aluminum, which has a relatively high ionization tendency, silver particles can be formed by electroreduction. These silver particles may migrate to the first electrode 212, potentially contaminating the stripping equipment or causing short circuits between touch-sensing electrodes formed in subsequent processes. Therefore, the reliability of the display device may be degraded due to the formation of silver particles.

[0070] According to an exemplary embodiment, the overlay layer 172 covers the aluminum layer of the first connection pad CP1 and the second connection pad CP2. Therefore, the formation of silver particles and the problems caused therefrom can be prevented. Thus, the reliability of the display device can be improved.

[0071] Reference Figure 12 A pixel definition layer 180 is formed in the display area DA. For example, as... Figure 12 In the exemplary embodiment shown, the pixel definition layer 180 may be formed directly on top of the first electrode 212 and the fifth insulating layer 170. The pixel definition layer 180 may have an opening that exposes at least a portion of the first electrode 212 (e.g., a portion of the upper surface of the first electrode 212). For example, the pixel definition layer 180 may include an organic insulating material.

[0072] An organic light-emitting layer 214 is formed on the first electrode 212. For example, the organic light-emitting layer 214 may be formed in an opening in the pixel definition layer 180. However, exemplary embodiments of the present invention are not limited thereto. For example, in other exemplary embodiments, the organic light-emitting layer 214 may extend above the upper surface of the pixel definition layer 180, or may be formed as a common layer extending above a plurality of pixels PX in the display area DA.

[0073] The organic light-emitting layer 214 may include at least a light-emitting layer. In an exemplary embodiment, the organic light-emitting layer 214 may further include at least one of a hole injection layer (HIL), a hole transporting layer (HTL), an electron transporting layer (ETL), and an electron injection layer (EIL). For example, the organic light-emitting layer 214 may include a low molecular weight organic compound or a high molecular weight organic compound.

[0074] In an exemplary embodiment, the organic light-emitting layer 214 may emit red, green, or blue light. In another exemplary embodiment, the organic light-emitting layer 214 may emit white light. In embodiments where the organic light-emitting layer 214 emits white light, the organic light-emitting layer 214 may have a multilayer structure including a red emitting layer, a green emitting layer, and a blue emitting layer, or a single-layer structure including a mixture of red emitting materials, green emitting materials, and blue emitting materials.

[0075] The second electrode 216 is formed on the organic light-emitting layer 214. In an exemplary embodiment, the second electrode 216 may be formed as a common layer extending over a plurality of pixels PX in the display area DA.

[0076] In an exemplary embodiment, the second electrode 216 can be used as a cathode. For example, depending on the emission type of the display device, the second electrode 216 can be formed as a transmission electrode or a reflection electrode. For example, when the second electrode 216 is a transmission electrode, the second electrode 216 may include at least one compound or a combination thereof selected from lithium (Li), calcium (Ca), lithium fluoride (LiF), aluminum (Al), magnesium (Mg), indium tin oxide (ITO), indium zinc oxide (IZO), zinc tin oxide (ZTO), indium oxide (In2O3), zinc oxide (ZnO), and tin oxide.

[0077] The encapsulation layer 220 can be disposed on the second electrode 216. For example, the encapsulation layer 220 can have a stacked structure including organic thin films and inorganic thin films. For example, as... Figure 12In the exemplary embodiments shown, the encapsulation layer 220 may include a first inorganic film 222, an organic film 224 disposed on the first inorganic film 222, and a second inorganic film 226 disposed on the organic film 224. For example, the bottom surface of the first inorganic film 222 may be directly disposed on the top surface of the second electrode 216. The bottom surface of the organic film 224 may be directly disposed on the top surface of the first inorganic film 222. The bottom surface of the second inorganic film 226 may be directly disposed on the top surface of the organic film 224. However, the exemplary embodiments of the present invention are not limited thereto, and the number of inorganic and organic films may vary. For example, the encapsulation layer 220 may include at least two organic films and at least three inorganic films.

[0078] In an exemplary embodiment, the organic film 224 may include a cured resin, such as polyacrylate. For example, the cured resin may be formed by a crosslinking reaction of monomers. For example, the first inorganic film 222 and the second inorganic film 226 may include inorganic materials, such as at least one compound selected from silicon oxide, silicon nitride, silicon carbide, aluminum oxide, tantalum oxide, hafnium oxide, chromium oxide, titanium oxide, etc.

[0079] The pixel definition layer 180, the organic light-emitting layer 214, the second electrode 216, and the encapsulation layer 220 may not be formed in the bonding region PA2, or they may be initially formed in the bonding region PA2 and subsequently removed.

[0080] In an exemplary embodiment, the touch sensing unit may be formed on the encapsulation layer 220. For example, the touch sensing unit can sense external input by detecting changes in capacitance, thereby obtaining the coordinate information of the external input.

[0081] For example, the lower touch insulating layer 310 can be formed on the encapsulation layer 220. Figure 12 In the exemplary embodiment shown, the bottom surface of the lower touch insulating layer 310 can be directly formed on the top surface of the second inorganic thin film 226. A first sensing conductive pattern can be formed on the lower touch insulating layer 310. The first sensing conductive pattern may include a bridge pattern 320. A touch intermediate insulating layer 330 can be formed on the first sensing conductive pattern. For example, as Figure 12 In the exemplary embodiment shown, the touch intermediate insulating layer 330 can be directly disposed on the top and side surfaces of the bridge pattern 320 and on the top surface of the lower touch insulating layer 310. At least one via can be formed through the touch intermediate insulating layer 330 to expose the bridge pattern 320. For example, in Figure 12 In the exemplary embodiment shown, two vias are formed through the touch intermediate insulating layer 330 to expose the bridge pattern 320. However, exemplary embodiments of the inventive concept are not limited thereto.

[0082] In an exemplary embodiment, the lower touch insulating layer 310, the first touch conductive layer 322 for forming the first sensing conductive pattern, and the touch intermediate insulating layer 330 may not be formed in the bonding region PA2; alternatively, the lower touch insulating layer 310, the first touch conductive layer 322 for forming the first sensing conductive pattern, and the touch intermediate insulating layer 330 may be formed in the bonding region PA2 and then removed.

[0083] Reference Figure 14 Remove the coating layer 172 in the bonding region PA2, as follows: Figure 14 The dashed line indicates the removed coating layer 172. In an exemplary embodiment, the coating layer 172 can be removed by an ashing process using oxygen and the like. However, exemplary embodiments of the inventive concept are not limited thereto. Therefore, the side surfaces of the second intermediate conductive layer CP1c and the second intermediate conductive layer CP2c can be exposed.

[0084] Reference Figure 15 A second sensing conductive pattern can be formed on the touch intermediate insulating layer 330 in the display area DA.

[0085] The second sensing conductive pattern may include a first touch electrode and a second touch electrode. The first touch electrode may be electrically insulated from the second touch electrode. For example, the first touch electrode may include an array of multiple electrode patterns arranged along a first direction D1. The second touch electrode may include an array of multiple electrode patterns arranged along a second direction D2, which intersects with the first direction D1.

[0086] For example, the first touch electrode may include a first electrode pattern 342a and a second electrode pattern 342b, which are spaced apart from each other along a direction parallel to the upper surface of the substrate 110. The first electrode pattern 342a and the second electrode pattern 342b can be electrically connected to each other through a via electrical contact bridge pattern 320 of the intermediate insulating layer 330.

[0087] The second touch electrode may include multiple electrode patterns and a connecting portion 344, the connecting portion 344 being disposed in the same layer as the multiple electrode patterns and continuously connected to the electrode patterns.

[0088] The touch protective layer 350 can be formed on the second sensing conductive pattern. For example, as... Figure 15 In the exemplary embodiment shown, the bottom surface of the touch protection layer 350 can be directly disposed on the top surface of the first electrode pattern 342a and the second electrode pattern 342b.

[0089] Reference Figure 16The upper conductive layer CP1d of the first connecting pad CP1 and the upper conductive layer CP2d of the second connecting pad CP2 are respectively formed on the second intermediate conductive layer CP1c of the first connecting pad CP1 and the second intermediate conductive layer CP2c of the second connecting pad CP2 in the bonding region PA2.

[0090] In an exemplary embodiment, the upper conductive layer CP1d of the first connecting pad CP1 and the upper conductive layer CP2d of the second connecting pad CP2 can be formed of the same layer as the second sensing conductive pattern. The upper conductive layer CP1d of the first connecting pad CP1 and the upper conductive layer CP2d of the second connecting pad CP2 can directly contact portions of the upper and side surfaces of the second intermediate conductive layer CP1c of the first connecting pad CP1 and portions of the upper and side surfaces of the second intermediate conductive layer CP2c of the second connecting pad CP2, respectively, without any intervening intermediate components (e.g., insulating layers, etc.). For example, as... Figure 16 In the exemplary embodiment, the upper conductive layer CP1d and the upper conductive layer CP2d can directly contact and cover the entire upper surface and lateral side surface of the second intermediate conductive layer CP1c of the first connecting pad CP1 and the entire upper surface and lateral side surface of the second intermediate conductive layer CP2c of the second connecting pad CP2, respectively.

[0091] The lower touch insulating layer 310 and the intermediate touch insulating layer 330 may each comprise an inorganic insulating material. For example, in an exemplary embodiment, the lower touch insulating layer 310 and the intermediate touch insulating layer 330 may each comprise at least one compound selected from silicon oxide, silicon nitride, and silicon carbide, or a combination thereof. Furthermore, the lower touch insulating layer 310 and the intermediate touch insulating layer 330 may comprise an insulating metal oxide, such as at least one compound selected from aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, etc. In an exemplary embodiment, the lower touch insulating layer 310 and the intermediate touch insulating layer 330 may comprise silicon nitride.

[0092] The first and second sensing conductive patterns comprise conductive materials. For example, each of the first and second sensing conductive patterns may comprise a metal, a conductive metal oxide, a conductive polymer, graphene, carbon nanotubes, or a combination thereof. In an exemplary embodiment, the metal may comprise at least one selected from molybdenum, silver, titanium, copper, and aluminum, or alloys thereof. For example, the metal may be configured to have the shape of a continuous thin film or nanowire. In an exemplary embodiment, the conductive metal oxide may be at least one compound selected from indium tin oxide, indium zinc oxide, zinc tin oxide, indium oxide, zinc oxide, and tin oxide, or a combination thereof. The first and second sensing conductive patterns may each have a single-layer structure or a multilayer structure comprising different materials.

[0093] In an exemplary embodiment, the upper conductive layers CP1d and CP2d may be formed of the same layers as the second sensing conductive pattern. However, the exemplary embodiments of the present invention are not limited thereto. For example, the upper conductive layers CP1d and CP2d may be formed of the same layers as the first sensing conductive pattern, or they may have a multilayer structure in which they are formed of the same layers as both the first and second sensing conductive patterns. In another exemplary embodiment, the first connection pad CP1 and the second connection pad CP2 may not include the upper conductive layers CP1d and CP2d formed by the first touch conductive layer 322. Therefore, the second intermediate conductive layer CP1c and the second intermediate conductive layer CP2c may be used as upper conductive layers connected to the conductive bonding member.

[0094] Reference Figure 17 The driver portion DC, including the driver chip, can be bonded in the bonding region PA2. In an exemplary embodiment, the driver portion DC can be bonded and electrically connected to the first connection pad CP1 and the second connection pad CP2 via multiple conductive bonding members BP1 and BP2. Figure 17 In the exemplary embodiment, the multiple bottom surfaces of the multiple conductive bonding members BP1 and BP2 can respectively directly contact the top surface of the upper conductive layer CP1d of the first connecting pad CP1 and the top surface of the upper conductive layer CP2d of the second connecting pad CP2. The multiple top surfaces of the multiple conductive bonding members BP1 and BP2 can respectively contact the bottom surface of the connecting terminal CT1 of the first connecting pad CP1 and the bottom surface of the connecting terminal CT2 of the second connecting pad CP2. The top surfaces of the connecting terminal CT1 of the first connecting pad CP1 and the top surfaces of the connecting terminal CT2 of the second connecting pad CP2 directly contact the bottom surface of the drive unit DC. In the exemplary embodiment, the multiple conductive bonding members BP1 and BP2 can be metal bumps. However, the exemplary embodiments of the present invention are not limited thereto. In another exemplary embodiment, an anisotropic conductive film including conductive balls or the like can be used as a conductive bonding member. The multiple conductive bonding members BP1 and BP2 can be electrically connected to the drive unit DC through the connecting terminal CT1 of the first connecting pad CP1 and the connecting terminal CT2 of the second connecting pad CP2 to transmit a drive signal from the drive unit DC to the first connecting pad CP1 and the second connecting pad CP2.

[0095] In an exemplary embodiment, a coating layer 172 is formed in the bonding region PA2 to prevent exposure of the conductive layer, including aluminum. This prevents particle formation due to the reduction of metal ions. Furthermore, the coating layer 172 comprises an organic material sensitive to heat and moisture, but it is removed during the process of forming the touch sensing portion prior to the bonding process. This prevents bonding failures and increases the size of the bonding contact surface. Consequently, the reliability of the display device can be improved.

[0096] Figures 18 to 20 This is a cross-sectional view showing the bonding area PA2 of the display device according to an exemplary embodiment.

[0097] Reference Figure 18 The first and second connection pads CP1 and CP2, respectively disposed in the bonding region PA2, include lower conductive layers CP1a and CP2a, first intermediate conductive layers CP1b and CP2b, second intermediate conductive layers CP1c and CP2c, and upper conductive layers CP1d and CP2d. The lower conductive layer CP1a of the first connection pad CP1 and the lower conductive layer CP2a of the second connection pad CP2 can be formed from the same layer as the first gate metal pattern or the second gate metal pattern formed in the display region DA. The first intermediate conductive layer CP1b of the first connection pad CP1 and the first intermediate conductive layer CP2b of the second connection pad CP2 can be formed from the same layer as the first source metal pattern disposed in the display region DA. The second intermediate conductive layer CP1c of the first connection pad CP1 and the second intermediate conductive layer CP2c of the second connection pad CP2 can be formed from the same layer as the second source metal pattern disposed in the display region DA. The upper conductive layer CP1d of the first connecting pad CP1 and the upper conductive layer CP2d of the second connecting pad CP2 can be formed from the same layer as the sensing conductive pattern of the touch sensing part provided in the display area DA.

[0098] In an exemplary embodiment, no insulating layer is provided between the first intermediate conductive layers CP1b and CP2b of the first connecting pad CP1 and the second connecting pad CP2 and the second intermediate conductive layers CP1c and CP2c of the first connecting pad CP1 and the second connecting pad CP2. The second intermediate conductive layers CP1c and CP2c of the first connecting pad CP1 and the second connecting pad CP2 directly contact and cover the side surfaces and top surfaces of the first intermediate conductive layers CP1b and CP2b, respectively. For example, as... Figure 17 In the exemplary embodiment shown, the inorganic layer 162 or any other layer of the fourth insulating layer 160 may not be disposed between the second intermediate conductive layers CP1c and CP2c of the first connecting pads CP1 and CP2 and the first intermediate conductive layers CP1b and CP2b of the first connecting pads CP1 and CP2. Therefore, even without an insulating layer covering the first intermediate conductive layers CP1b and CP2b, contact between the first intermediate conductive layers CP1b and CP2b and silver ions in the etchant can be prevented. Thus, electroreduction of silver ions and the resulting silver particles can be prevented.

[0099] Furthermore, the side surfaces of the second intermediate conductive layer CP1c of the first connecting pad CP1 and the second intermediate conductive layer CP2c of the second connecting pad CP2 are covered by a cladding layer 172 to prevent the electroreduction of silver ions. The cladding layer 172 can be removed before the upper conductive layers CP1d and CP2d are formed.

[0100] Reference Figure 19 The first connection pad CP1 and the second connection pad CP2 disposed in the bonding area PA2 respectively include a lower conductive layer CP1a and a lower conductive layer CP2a, a first intermediate conductive layer CP1b and a first intermediate conductive layer CP2b, and an upper conductive layer CP1d and an upper conductive layer CP2d. Figure 19 An exemplary embodiment may not include, for example Figure 18 The exemplary embodiment shows a second intermediate conductive layer CP1c for the first connection pad CP1 and a second intermediate conductive layer CP2c for the second connection pad CP2. The lower conductive layer CP1a of the first connection pad CP1 and the lower conductive layer CP2a of the second connection pad CP2 can be formed from the same layer as the first gate metal pattern or the second gate metal pattern disposed in the display area DA. The first intermediate conductive layer CP1b of the first connection pad CP1 and the first intermediate conductive layer CP2b of the second connection pad CP2 can be formed from the same layer as the first source metal pattern disposed in the display area DA. The upper conductive layers CP1d and CP2d can be formed from the same layer as the sensing conductive pattern disposed in the touch sensing portion of the display area DA.

[0101] During the formation of the first electrode 212 of the organic light-emitting diode disposed in the display area DA, the side surfaces of the first intermediate conductive layer CP1b and the side surfaces of the first intermediate conductive layer CP2b are covered by a coating layer 172 to prevent the electroreduction of silver ions. The coating layer 172 can be removed before the upper conductive layers CP1d and CP2d are formed thereon.

[0102] Reference Figure 20The first and second connection pads CP1 and CP2, respectively disposed in the bonding region PA2, include lower conductive layers CP1a and CP2a, first intermediate conductive layers CP1b and CP2b, second intermediate conductive layers CP1c and CP2c, and upper conductive layers CP1d and CP2d. The lower conductive layers CP1a and CP2a of the first and second connection pads CP1 and CP2 can be formed from the same layer as the first or second gate metal pattern disposed in the display region DA. The first intermediate conductive layers CP1b and CP2b of the first and second connection pads CP1 and CP2 can be formed from the same layer as the first source metal pattern disposed in the display region DA. The second intermediate conductive layers CP1c and CP2c of the first and second connection pads CP1 and CP2 can be formed from the same layer as the second source metal pattern disposed in the display region DA. The upper conductive layer CP1d and the upper conductive layer CP2d can be formed from the same layer as the sensing conductive pattern of the touch sensing part provided in the display area DA.

[0103] In an exemplary embodiment, after the upper conductive layer CP1d and the upper conductive layer CP2d are formed, the covering layer 172 covering the side surface of the second intermediate conductive layer CP1c and the side surface of the second intermediate conductive layer CP2c can be removed.

[0104] Therefore, the upper conductive layers CP1d and CP2d may not be formed on the cover layer 172. Therefore, the widths of the upper conductive layers CP1d and CP2d of the first and second connection pads CP1 and CP2 (e.g., in a direction parallel to the upper surface of the substrate 110) may be equal to or less than the widths of the second intermediate conductive layers CP1c and CP2c. Therefore, the entire lower surface of the upper conductive layers CP1d and CP2d of the first and second connection pads CP1 and CP2 can contact the upper surfaces of the second intermediate conductive layers CP1c and CP2c of the first and second connection pads CP1 and CP2.

[0105] like Figures 18 to 20As shown, exemplary embodiments may include connection pads with various configurations. It should be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are used only to distinguish one element, component, area, layer, or portion from another. Therefore, without departing from the teachings of this document, “first element,” “component,” “area,” “layer,” or “portion” discussed below may be referred to as a second element, component, area, layer, or portion.

[0106] Furthermore, exemplary embodiments of the present invention are not limited to display devices including connection pads containing an aluminum layer. Connection pads may comprise various metals or alloys thereof.

[0107] Exemplary embodiments of the present invention can be applied to various display devices. For example, exemplary embodiments can be applied to vehicle display devices, ship display devices, aircraft display devices, portable communication devices, display devices for display or for information transfer, medical display devices, etc.

[0108] The foregoing is a description of exemplary embodiments of the inventive concept and should not be construed as limiting it. Although exemplary embodiments have been described, those skilled in the art will readily understand that many modifications are possible in the exemplary embodiments without substantially departing from the novel teachings and aspects of the inventive concept. Therefore, all such modifications are intended to be included within the scope of the inventive concept. It will thus be understood that the foregoing is a description of various exemplary embodiments and is not to be construed as limiting to the specific exemplary embodiments disclosed, and that such modifications to the disclosed exemplary embodiments and other exemplary embodiments are intended to be included within the scope of the inventive concept.

Claims

1. A display device, comprising: Light-emitting elements are located in the display area; The driving element is electrically connected to the light-emitting element; An encapsulation layer covers the light-emitting element; as well as Connecting pads are disposed in the bonding area outside the display area. Each connecting pad includes a lower conductive layer, an intermediate conductive layer, and an upper conductive layer. The intermediate conductive layer is disposed on the lower conductive layer, and the upper conductive layer is disposed on the intermediate conductive layer. The intermediate conductive layer includes a first intermediate conductive layer and a second intermediate conductive layer disposed on the first intermediate conductive layer. An inorganic layer is partially sandwiched between the first intermediate conductive layer and the second intermediate conductive layer. The lower surface of the upper conductive layer is in continuous contact with the upper surface and side surface of the second intermediate conductive layer, and no intermediate component is provided between the upper conductive layer and the second intermediate conductive layer.

2. The display device according to claim 1, wherein, The display device further includes: A touch sensing unit is disposed on the encapsulation layer, the touch sensing unit including a sensing conductive pattern; The driving element includes: Gate metal pattern, including gate electrode; and The source metal pattern includes a drain electrode, which is connected to the light-emitting element via a connecting electrode.

3. The display device according to claim 2, wherein, The lower conductive layer is disposed in the same layer as the gate metal pattern, and the upper conductive layer is disposed in the same layer as the sensing conductive pattern.

4. The display device according to claim 3, wherein, The source metal pattern includes a first source metal pattern and a second source metal pattern, the first source metal pattern including the drain electrode, and the second source metal pattern including the connection electrode; as well as The first intermediate conductive layer and the first source metal pattern are disposed in the same layer, and the second intermediate conductive layer and the second source metal pattern are disposed in the same layer.

5. The display device according to claim 1, further comprising: A touch sensing unit is disposed on the encapsulation layer; The touch sensing unit includes a first sensing conductive pattern, a touch intermediate insulating layer, and a second sensing conductive pattern. The touch intermediate insulating layer covers the first sensing conductive pattern, and the second sensing conductive pattern is disposed on the touch intermediate insulating layer. The upper conductive layer and the second sensing conductive pattern are disposed in the same layer.

6. The display device according to claim 1, wherein, The intermediate conductive layer includes an aluminum layer and a titanium layer, with the titanium layer disposed on the aluminum layer.

7. The display device according to claim 6, wherein, The first electrode of the light-emitting element comprises silver.

8. The display device according to claim 1, further comprising a drive portion coupled to the connecting pad, wherein, The connection pad is electrically connected to the drive unit via at least one conductive bonding member.

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