Micro optical image stabilization module and camera module having the same

Abstract

The present invention discloses a micro optical anti-shake module and a camera module having the same, and relates to the field of optical anti-shake technology. A micro optical anti-shake module of the present invention, wherein: a frame-shaped X-axis flip plate is rotatably connected to a substrate, and an X-axis SMA wire assembly is energized and contracted to generate a torque to drive the X-axis flip plate to rotate relative to the substrate; a Y-axis flip plate is rotatably connected to the X-axis flip plate, and an Y-axis SMA wire assembly is energized and contracted to generate a torque to drive the Y-axis flip plate to rotate relative to the X-axis flip plate; a Z-axis motion assembly includes a Z-axis SMA drive assembly and a Z-axis rotating seat, and the Z-axis rotating seat is arranged in a circular hole of the Y-axis flip plate, and the Z-axis SMA wire assembly is used to drive the Z-axis rotating seat to rotate relative to the Z axis. The present invention can greatly reduce the driving burden of the Z-axis actuator and improve the sensitivity of anti-shake; in addition, the actuators all select SMA wire assemblies, which can not only ensure a continuous large and stable driving force but also avoid generating a magnetic field that affects the operation of other sensors.

Description

Technical Field

[0001] The present invention relates to the technical field of camera anti-shake, and in particular to a micro optical anti-shake module and a camera module having the same. Background Art

[0002] In recent years, the application of miniature camera modules has become more and more popular, and the application scope has been continuously expanded, including various handheld mobile devices, such as smart phones, tablet computers, etc. When taking photos with handheld mobile devices, the photos or videos taken are often blurred due to the inevitable human shaking factors, especially in low light conditions.

[0003] In order to solve the above technical problems, various micro anti-shake gimbals using voice coil motors as driving devices have been proposed in the related art. Most of these micro anti-shake gimbals have modules rotating around the optical axis set at the outermost periphery of the gimbal, resulting in a heavy burden on the optical axis rotating module; in addition, the magnetic field force of the rotating module driven by the voice coil motor is significantly attenuated when the module rotates, which is not suitable for large-angle rotation adjustment, resulting in limited anti-shake effect. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the related art. To this end, the present invention proposes a micro optical image stabilization module and a camera module having the same. The Z-axis driving burden is small, which is beneficial to improving the sensitivity of optical image stabilization; the SMA driving component has a large driving force, which is beneficial to improving the optical image stabilization performance.

[0005] According to a first aspect of the present invention, a micro optical image stabilization module includes:

[0006] A substrate, wherein the substrate is provided with a frame-shaped hollow portion;

[0007] A horizontal motion assembly, comprising an X-axis actuator and a Y-axis actuator, wherein the X-axis actuator comprises an X-axis flip plate and an X-axis SMA driving assembly, wherein the X-axis flip plate is frame-shaped and is rotatably connected to the substrate, wherein the X-axis SMA driving assembly connects the X-axis flip plate and the substrate, and wherein the X-axis SMA driving assembly is used to drive the X-axis flip plate to rotate along the X-axis relative to the substrate, wherein the Y-axis actuator comprises a Y-axis flip plate and a Y-axis SMA driving assembly, wherein the Y-axis flip plate is rotatably connected to the X-axis flip plate, wherein the Y-axis SMA driving assembly connects the Y-axis flip plate and the X-axis flip plate, and wherein the Y-axis SMA driving assembly is used to drive the Y-axis flip plate to rotate along the Y-axis relative to the X-axis flip plate;

[0008] The Z-axis motion assembly is arranged on the Y-axis flip plate, and includes a Z-axis SMA drive assembly and a Z-axis rotating seat. The Z-axis SMA drive assembly connects the Z-axis rotating seat and the Y-axis flip plate, and the Z-axis SMA drive assembly is used to drive the Z-axis rotating seat to rotate relative to the Z axis.

[0009] The micro optical image stabilization module according to the embodiment of the present invention has at least the following beneficial effects:

[0010] The X-axis flip plate and the Y-axis flip plate are rotatably connected, which effectively reduces the thickness of the horizontal actuator assembly, making it light and thin, and more other components can be arranged inside the handheld mobile device with extremely limited space. The Z-axis actuator is set on the Y-axis flip plate, and the Z-axis rotating seat follows the Y-axis flip plate to flip around the Y-axis, and the Y-axis flip plate follows the X-axis flip plate to flip around the X-axis. The Z-axis actuator only drives the Z-axis rotating seat to rotate around the optical axis, and three-axis anti-shake can be achieved. Compared with the related art in which the optical axis rotation module drives the X- and Y-axis rotation modules to rotate, the driving burden of the Z-axis actuator can be greatly reduced, and the movement sensitivity of the Z-axis rotating seat can be improved. The actuators of the X, Y, and Z axes all use SMA wire components, which can not only ensure a continuous large and stable driving force but also avoid generating magnetic fields that affect the operation of other sensors; in addition, the SMA wires of the X, Y, and Z axes operate independently without interfering with each other, effectively improving the response speed of the module and improving the accuracy of movement.

[0011] According to some embodiments of the micro-optical image stabilization module of the present invention, a circular hole is provided at the center of the Y-axis flip plate; the Z-axis rotating seat includes a rotating member and a support plate with a rotating table at the center, the support plate is in contact with the upper surface of the Y-axis flip plate, the rotating table is arranged in the circular hole, the rotating member is fixedly arranged on the outer bottom surface of the rotating table and in contact with the lower surface of the Y-axis flip plate, and the Z-axis SMA driving assembly is arranged on the bottom surface of the Y-axis flip plate and connected to the rotating member.

[0012] According to the micro optical image stabilization module of some embodiments of the present invention, protrusions are provided on the upper and lower surfaces of the Y-axis flip plate, the protrusions are arranged around the circular hole, the bottom surface of the support plate abuts against the protrusions on the upper surface of the Y-axis flip plate, and the rotating member abuts against the protrusions on the lower surface of the Y-axis flip plate.

[0013] According to the micro-optical image stabilization module of some embodiments of the present invention, four groups of Z-axis SMA drive components are provided, and each of the Z-axis SMA drive components includes a connecting plate and a Z-axis SMA wire; two "V"-shaped connecting plates are provided in the middle of the bottom surface of the rotating member, and the two ends of the "V"-shaped connecting plates constitute two connecting ears, and the openings of the two "V"-shaped connecting plates are arranged back to back, and the connecting plate is arranged on the bottom surface of the Y-axis flip plate, and the connecting plate in each group of the Z-axis SMA drive components is connected to one of the connecting ears through the Z-axis SMA wire.

[0014] According to the micro optical image stabilization module of some embodiments of the present invention, the rotating member includes an elastic arm, and one end of the elastic arm is connected to the Y-axis flip plate.

[0015] According to the micro optical image stabilization module of some embodiments of the present invention, a limiting groove is provided on the hole wall of the circular hole, a limiting block is provided on the rotating member, the limiting block cooperates with the limiting groove, and the width of the limiting groove is greater than the width of the limiting block.

[0016] According to the micro optical image stabilization module of some embodiments of the present invention, the X-axis flip plate and the base plate are movably connected via a pair of connecting balls.

[0017] The micro-optical image stabilization module according to some embodiments of the present invention further includes an upper adapter part and a lower adapter part, the upper adapter part and the lower adapter part are arranged opposite to each other, and an adapter groove is provided on the opposite side of the upper adapter part and the lower adapter part, and the connecting ball is rotatably arranged between the two adapter grooves of the upper adapter part and the lower adapter part; the upper adapter part, the lower adapter part and the connecting ball constitute a adapter structure, wherein two groups of the adapter structures are arranged between the substrate and the X-axis flip plate, one of the substrate and the X-axis flip plate is fixedly connected to the connecting ball, and the other is fixedly connected to the upper adapter part and the lower adapter part.

[0018] According to the micro optical image stabilization module of some embodiments of the present invention, the X-axis SMA drive assembly includes a first common end, a first control end and an X-axis SMA wire. The first common end is arranged on the X-axis flip plate and is located at the rotational connection between the X-axis flip plate and the substrate. The first control end has two pieces. The first control ends are arranged on the substrate and are located on both sides of the first common end. The first control ends are connected to the first common end through the X-axis SMA wire.

[0019] The camera module according to the second aspect of the present invention includes the above-mentioned micro optical image stabilization module.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0022] Figure 1 It is a three-dimensional diagram of an embodiment of the present invention.

[0023] Figure 2 It is a three-dimensional diagram of an embodiment of the present invention.

[0024] Figure 3 FIG. 1 is an exploded view of an SMA wire drive assembly in one embodiment of the present invention.

[0025] Figure 4 It is a front view of an embodiment of the present invention.

[0026] Figure 5 A side view of an embodiment of the present invention.

[0027] Figure 6 A side view of another SMA wire drive assembly according to an embodiment of the present invention.

[0028] Figure 7 FIG. 1 is a bottom view of a Z-axis SMA drive assembly according to an embodiment of the present invention.

[0029] Figure 8 This is an exploded view of an embodiment of the present invention.

[0030] Fig. 9 FIG. 1 is an exploded view of a substrate in an embodiment of the present invention.

[0031] Fig.10 It is a cross-sectional view of the connection ball in one embodiment of the present invention.

[0032] Fig.11 A three-dimensional diagram of an embodiment of another aspect of the present invention.

[0033] Reference numerals:

[0034] substrate1;

[0035] X-axis flip plate 21; X-axis SMA wire assembly 22; X-axis SMA wire 221; first control end 222; first common end 223;

[0036] Y-axis flip plate 31; Y-axis SMA wire assembly 32; round hole 33; limiting groove 331; Y-axis SMA wire 321; second control end 322; second common end 323;

[0037] Z-axis rotating seat 41; support plate 411; rotating table 4111; rotating member 413; connecting ear 4131; elastic arm 4132; stopper 4133; Z-axis SMA driving assembly 42; protrusion 43; rotating frame 44; rotating arm 45;

[0038] A first Z-axis SMA wire 421a; a second Z-axis SMA wire 421b; a third Z-axis SMA wire 421c; a fourth Z-axis SMA wire 421d; a first connecting plate 422a; a second connecting plate 422b; a third connecting plate 422c; and a fourth connecting plate 422d;

[0039] Connecting ball 51; Adaptation structure 52;

[0040] Upper transition portion 52a; semicircular groove 52b; lower transition portion 52c;

[0041] Upper plate a; middle plate b; lower plate c;

[0042] The first upper plate a1; the second upper plate a2; the third upper plate a3;

[0043] The first middle layer board b1; the second middle layer board b2; the third middle layer board b3;

[0044] A first lower plate c1; a second lower plate c2; a third lower plate c3;

[0045] Camera module 6. DETAILED DESCRIPTION

[0046] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0047] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0048] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0049] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0050] Reference below Figures 1 to 10 The micro optical image stabilization module according to the first embodiment of the present invention is described.

[0051] The micro optical image stabilization module according to the first aspect of the present invention includes:

[0052] A substrate 1, wherein the substrate 1 is provided with a frame-shaped hollow portion;

[0053] A horizontal motion component includes an X-axis actuator and a Y-axis actuator, wherein the X-axis actuator includes an X-axis flip plate 21 and an X-axis SMA driving component 22, wherein the X-axis flip plate 21 is frame-shaped and is rotatably connected to the substrate 1, and the X-axis SMA driving component 22 connects the X-axis flip plate 21 and the substrate 1, and the X-axis SMA driving component 22 is used to drive the X-axis flip plate 21 to rotate along the X-axis relative to the substrate 1, and the Y-axis actuator includes a Y-axis flip plate 31 and a Y-axis SMA driving component 32, wherein the Y-axis flip plate 31 is rotatably connected to the X-axis flip plate 21, and the Y-axis SMA driving component 32 connects the Y-axis flip plate 31 and the X-axis flip plate 21, and the Y-axis SMA driving component 32 is used to drive the Y-axis flip plate 31 to rotate along the Y-axis relative to the X-axis flip plate 21;

[0054] The Z-axis motion assembly is arranged on the Y-axis flip plate 31, and includes a Z-axis SMA drive assembly 42 and a Z-axis rotating seat 41. The Z-axis SMA drive assembly 42 connects the Z-axis rotating seat 41 and the Y-axis flip plate 31, and is used to drive the Z-axis rotating seat 41 to rotate relative to the Z-axis.

[0055] Reference Figure 1 and Figure 2The substrate 1 is in a hollow frame shape, and the X-axis flip plate 21 is in a frame shape. For example, as shown in the figure, the frame shape can be rectangular, and of course, other symmetrical shapes, such as a circular frame, can also be used. The X-axis flip plate 21 is arranged inside the frame shape of the substrate 1 and is rotatably connected to the substrate 1. The X-axis flip plate 21 can flip along the X-axis relative to the substrate 1; the Y-axis flip plate 31 is arranged inside the frame shape of the X-axis flip plate 21 and is rotatably connected to the X-axis flip plate 21. The Y-axis flip plate 31 can flip along the Y-axis relative to the X-axis flip plate 21.

[0056] The X-axis SMA driving assembly 22 is symmetrically arranged along the rotation axis of the X-axis flip plate 21, and connects the substrate 1 and the X-axis flip plate 21, and is used to drive the X-axis flip plate 21 to flip in the substrate 1; the Y-axis SMA driving assembly 32 is symmetrically arranged along the rotation axis of the Y-axis flip plate 31, and connects the X-axis flip plate 21 and the Y-axis flip plate 31, and is used to drive the Y-axis flip plate 31 to flip in the X-axis flip plate 21.

[0057] refer to Figure 1 and Figure 2 , the Z-axis rotating seat 41 is arranged on the Y-axis flip plate 31; the Z-axis SMA driving assembly 42 includes a connecting plate 422 and a Z-axis SMA wire arranged on the lower surface of the Y-axis flip plate 31; there are at least two connecting plates 422, which are symmetrically arranged along the circular hole 33, and at least two Z-axis SMA wires are arranged, one end of the Z-axis SMA wire is connected to one of the connecting plates 422, and the other end is connected to the Z-axis rotating seat 41 and is separated from the rotation center of the Z-axis rotating seat 41 by a certain distance. When in use, an electrical signal is applied to one of the Z-axis SMA wires, so that it is energized and contracted to generate a torque to drive the Z-axis rotating seat 41 to rotate.

[0058] By such an arrangement, the Z-axis rotating seat 41 is arranged on the Y-axis flip plate 31. The Z-axis rotating seat 41 only needs to directly drive the lens module arranged on the Z-axis rotating seat 41 to rotate, which can greatly reduce the rotational inertia of the Z-axis rotating seat 41, thereby saving the driving force of the Z-axis SMA wire, which can save energy and improve the rotation sensitivity; in addition, the SMA wires of the X, Y, and Z axes operate independently without interfering with each other, effectively improving the response speed of the module, improving the accuracy of movement, and improving the optical image stabilization performance.

[0059] In some specific embodiments of the present invention, a circular hole 33 is provided at the center position of the Y-axis flip plate 31; the Z-axis rotating seat 41 includes a rotating member 413 and a support plate 411 with a rotating table 4111 provided at the center, the support plate 411 is in contact with the upper surface of the Y-axis flip plate 31, the rotating table 4111 is arranged in the circular hole 33, the rotating member 413 is fixedly arranged on the outer bottom surface of the rotating table 4111 and is in contact with the lower surface of the Y-axis flip plate 31, and the Z-axis SMA drive assembly 42 is arranged on the bottom surface of the Y-axis flip plate 31 and is connected to the rotating member 413.

[0060] Specifically, Figure 1 and Figure 2 As shown, the Z-axis rotating seat 41 is arranged in the circular hole 33, which is beneficial to reducing the overall thickness of the micro optical image stabilization module. Figure 3 As shown, the rotating member 413 is fixedly arranged on the outer bottom surface of the rotating table 4111, the supporting plate 411 abuts against the upper surface of the substrate 1, and the rotating member 413 abuts against the lower surface of the supporting plate 411 to jointly limit the position of the rotating seat on the Z axis.

[0061] In some specific embodiments of the present invention, protrusions 43 are provided on the upper and lower surfaces of the Y-axis flip plate 31, the protrusions 43 are arranged around the circular hole 33, the bottom surface of the support plate 411 abuts against the protrusions 43 on the upper surface of the Y-axis flip plate 31, and the rotating part 413 abuts against the protrusions 43 on the lower surface of the Y-axis flip plate 31.

[0062] refer to Figure 3 The protrusion 43 can be a circular disk or other shapes. When the Z-axis SMA wire contracts to generate a torque to pull the rotating member 413 to rotate, since the bottom surface of the support plate 411 abuts against the protrusion 43 on the upper surface of the Y-axis flip plate 31, and the rotating member 413 abuts against the protrusion 43 on the lower surface of the Y-axis flip plate 31, the contact area between the support plate 411, the rotating member 413 and the Y-axis flip plate 31 is small, which is conducive to reducing the suction force caused by the too close contact between the bottom surface of the support plate 411 and the upper surface of the Y-axis flip plate 31, and the rotating member 413 and the lower surface of the Y-axis flip plate 31. Therefore, the friction between the support plate 411, the rotating member 413 and the Y-axis flip plate 31 can be reduced, thereby reducing the driving force of the Z-axis SMA wire, which is conducive to saving energy consumption.

[0063] In some specific embodiments of the present invention, four groups of Z-axis SMA drive components 42 are provided, and each Z-axis SMA drive component 42 includes a connecting plate 422 and a Z-axis SMA wire; two "V"-shaped connecting plates are provided in the middle of the bottom surface of the rotating member 413, and the two ends of the "V"-shaped connecting plates constitute two connecting ears 4131, and the openings of the two "V"-shaped connecting plates are arranged back to back, and the connecting plate 422 is arranged on the bottom surface of the Y-axis flip plate 31, and the connecting plates in each group of Z-axis SMA drive components 42 are connected to one of the connecting ears 4131 through the Z-axis SMA wire.

[0064] refer to Figure 2 , Figure 3 and Figure 7The Z-axis SMA driving assembly 42 includes a first Z-axis SMA wire assembly and a second Z-axis SMA wire assembly. The first Z-axis SMA wire assembly includes a first connecting plate 422a, a second connecting plate 422b, a first Z-axis SMA wire 421a, and a second Z-axis SMA wire 421b. The first Z-axis SMA wire 421a connects the first connecting plate 422a and one of the connecting ears 4131, and the second Z-axis SMA wire 421b connects the second connecting plate 422b and one of the connecting ears 4131. When viewed from the bottom, the first Z-axis SMA wire 421a and the second Z-axis SMA wire 421b are perpendicular to each other. The second Z-axis SMA wire assembly includes a third connecting plate 422c, a fourth connecting plate 422d, a third Z-axis SMA wire 421c and a fourth Z-axis SMA wire 421d, wherein the third Z-axis SMA wire 421c connects the third connecting plate 422c and one of the connecting ears 4131, and the fourth Z-axis SMA wire 421d connects the fourth connecting plate 422d and one of the connecting ears 4131, and when viewed from above, the third Z-axis SMA wire 421c and the fourth Z-axis SMA wire 421d are perpendicular to each other. Among them, the two "V"-shaped connecting plates are of different heights; the first connecting plate 422a is of the same height as the fourth connecting plate 422d, and is at the same height as one of the "V"-shaped connecting plates; the second connecting plate 422b is of the same height as the third connecting plate 422c, and is at the same height as another "V"-shaped connecting plate; the first connecting plate 422a and the second connecting plate 422b are arranged adjacent to each other, and the third connecting plate 422c and the fourth connecting plate 422d are arranged adjacent to each other. By configuring in this way, the first Z-axis SMA wire 421a and the second Z-axis SMA wire 421b are spaced at a certain height, and the third Z-axis SMA wire 421c and the fourth Z-axis SMA wire 421d are spaced at a certain height, so as to prevent short circuits between the SMA wires or poor heat dissipation caused by too close distances. By such a configuration, any Z-axis SMA wire can be energized to cause it to contract and generate a torque, thereby pulling the rotating member 413 to rotate; the first Z-axis SMA wire 421a and the second Z-axis SMA wire 421b, or the third Z-axis SMA wire 421c and the fourth Z-axis SMA wire 421d can also be energized at the same time to cause them to contract at the same time to generate a torque to pull the Z-axis rotating seat 41 to slightly translate in one direction, thereby increasing the adjustment range; in addition, two "V"-shaped connecting pieces are arranged at the rotation center of the rotating member 413, and the Z-axis SMA wires connect the connecting ears 4131 on the "V"-shaped connecting pieces with each connecting plate 422, thereby shortening the distance from each Z-axis SMA wire to the rotation center. When the contraction length of the Z-axis SMA wire is constant, the closer to the rotation center, the larger the rotatable angle of the Z-axis rotating seat 41.

[0065] In some specific embodiments of the present invention, the rotating member includes an elastic arm 4132 , and one end of the elastic arm 4132 is connected to the Y-axis flip plate 31 .

[0066] refer to Figure 3, the elastic arm 4132 is serpentine and bends multiple times. There are two elastic arms 4132, which are respectively located between the first Z-axis SMA wire 421a and the fourth Z-axis SMA wire 421d, and between the third Z-axis SMA wire 421c and the second Z-axis SMA wire 421b. Such a setting can prevent the elastic arm 4132 from affecting the contraction of the Z-axis SMA wire. Since the SMA wire contracts when it is powered on, it is in a relaxed state when it is not powered on and cannot be restored to its original state. Therefore, the setting of the elastic arm 4132 can play a reset role. Setting the elastic arm 4132 into a serpentine shape with multiple bends is conducive to improving the elasticity of the elastic arm 4132. When the Z-axis SMA drive assembly 42 contracts when it is powered on, the elastic arm 4132 has better elasticity and has less obstruction to the movement of the Z-axis SMA drive assembly 42; when the Z-axis SMA drive assembly 42 stops being powered on, the better elasticity of the elastic arm 4132 enables it to quickly rotate and reset the Z-axis rotating seat 41.

[0067] In some specific embodiments of the present invention, a limiting groove 331 is provided on the hole wall of the circular hole 33, and a limiting block 4133 is provided on the rotating member 413. The limiting block 4133 cooperates with the limiting groove 331, and the width of the limiting groove 331 is greater than the width of the limiting block 4133.

[0068] refer to Figure 3 A limit block 4133 is arranged on the rotating member 413 along the circumferential direction of the rotating platform 4111. The limit block 4133 extends into the limit slot 331 in the circular hole 33 and cooperates with the limit slot 331 to play a limiting role. Specifically, when the Z-axis rotating seat 41 is shaken in the X-axis or Y-axis direction by an external force, the cooperation between the limit slot 331 and the limit block 4133 can limit the shaking amplitude within a certain range, thereby preventing the SMA line in the Z-axis SMA driving assembly 42 from being torn off due to excessive shaking amplitude.

[0069] refer to Figure 8 In some specific embodiments of the present invention, the rotating member 413 includes a rotating arm 45 and a rotating frame 44. The rotating frame 44 is fixedly arranged on the outer bottom surface of the rotating platform 4111. The rotating frame 44 is provided with a plurality of supporting feet, each supporting foot is respectively in contact with the protrusion 43, and the elastic arm 4132 is integrally formed with the rotating frame 44; the rotating arm 45 is fixedly attached to the bottom surface of the rotating frame 44, and the "V"-shaped connecting piece is fixedly arranged at the bottom center of the rotating arm 45. By such a configuration, the processing and assembly process can be simplified and the production efficiency can be improved.

[0070] In some specific embodiments of the present invention, the X-axis flip plate 21 and the base plate 1 are movably connected via a pair of connecting balls 51 ; the Y-axis flip plate 31 and the X-axis flip plate 21 are also movably connected via a pair of connecting balls 51 .

[0071] In some specific embodiments of the present invention, an upper adapter portion 52a and a lower adapter portion 52c are further included. The upper adapter portion 52a and the lower adapter portion 52c are arranged opposite to each other, and adapter grooves are arranged on the opposite sides of the upper adapter portion 52a and the lower adapter portion 52c. The connecting ball 51 is rotatably arranged between the two adapter grooves of the upper adapter portion 52a and the lower adapter portion 52c; the upper adapter portion 52a, the lower adapter portion 52c and the connecting ball constitute a transfer structure 52, wherein two groups of transfer structures 52 are arranged between the substrate 1 and the X-axis flip plate 21, one of the substrate 1 and the X-axis flip plate 21 is fixedly connected to the connecting ball 51, and the other is fixedly connected to the upper adapter portion 52a and the lower adapter portion 52c.

[0072] When the connecting ball 51 is arranged outside the frame of the X-axis flip plate 21, the upper connecting part 52a and the lower connecting part 52c are arranged inside the frame of the substrate 1; when the connecting ball 51 is arranged inside the frame of the substrate 1, the upper connecting part 52a and the lower connecting part 52c are arranged outside the frame of the X-axis flip plate 21. In the following embodiment, the upper connecting part 52a and the lower connecting part 52c are arranged inside the frame of the substrate 1, and the connecting ball 51 is arranged inside the frame of the X-axis flip plate 21. The connecting ball 51 is arranged in this way, which can reduce the rotation resistance of the X-axis flip plate 21 when it rotates relative to the substrate 1, so that the X-axis flip plate 21 rotates more smoothly; the connecting ball 51 is rotatably arranged between the upper connecting part 52a and the lower connecting part 52c, so that the X-axis flip plate 21 can be supported by sufficient force, thereby improving the stability of the X-axis flip plate 21 when it rotates.

[0073] It should be understood that, in order to realize the rotational connection between the Y-axis flip plate 31 and the X-axis flip plate 21, two sets of adapter structures 52 are also arranged between the X-axis flip plate 21 and the Y-axis flip plate 31; wherein, one of the X-axis flip plate 21 and the Y-axis flip plate 31 is fixedly connected to the connecting ball 51, and the other is fixedly connected to the upper adapter part 52a and the lower adapter part 52c. Specifically, when the connecting ball 51 is arranged outside the Y-axis flip plate 31, the upper adapter part 52a and the lower adapter part 52c are arranged inside the frame of the X-axis flip plate 21; when the connecting ball 51 is arranged inside the frame of the X-axis flip plate 21, the upper adapter part 52a and the lower adapter part 52c are arranged outside the Y-axis flip plate 31.

[0074] refer to Fig.10 The distance between the bottom of the transition groove of the upper transition part 52a and the lower transition part 52c is equal to the diameter of the connecting ball 51, which can limit the movement of the connecting ball 51 in the vertical direction; there is a gap between the groove wall of the transition groove except the groove bottom and the connecting ball 51, so that the connecting ball 51 can move slightly left and right, reducing the friction between the connecting ball 51 and the transition groove when rotating, and preventing the connecting ball 51 from being stuck between the upper transition part 52a and the lower transition part 52c and unable to move.

[0075] By providing the upper adapter portion 52a and the lower adapter portion 52c, the rotation and movement of the X-axis flip plate 21 and the Y-axis flip plate 31 can be controlled within a certain range, thereby preventing the SMA wire from being torn or colliding with other components due to excessive flip angles caused by external forces.

[0076] There are other embodiments of the present invention, see Fig. 9 .like Fig. 9 As shown, the substrate 1, the X-axis flip plate 21 and the Y-axis flip plate 31 are all composite plate structures, and the composite plate structure includes an upper plate a, a middle plate b and a lower plate c, that is, the substrate 1 includes a first upper plate a1, a first middle plate b1 and a first lower plate c1, the X-axis flip plate 21 includes a second upper plate a2, a second middle plate b2 and a second lower plate c2, and the Y-axis flip plate 31 includes a third upper plate a3, a third middle plate b3 and a third lower plate c3. The substrate 1, the X-axis flip plate 21 and the Y-axis flip plate 31 are set as composite plates, and the upper plate a and the lower plate c are made of metal materials, which can improve the structural strength of the plate and prevent the plate from being deformed after other components are installed on the Z-axis rotating seat 41, thereby causing the connection ball 51 to rotate unsmoothly. Before assembly, it is only necessary to bond the upper plate a, the middle plate b and the lower plate c together after they are processed separately to complete the assembly, which greatly improves the assembly efficiency and reduces the assembly cost.

[0077] The first upper plate a1, the second upper plate a2, and the third upper plate a3 are formed by stamping and cutting a whole piece of metal plate, and the first lower plate c1, the second lower plate c2, and the third lower plate c3 are also formed by stamping and cutting a whole piece of metal plate. Fig. 9 The upper transition portion 52a on the substrate 1 is formed by stamping and cutting the first upper plate a1, and the lower transition portion 52c is formed by stamping and cutting the first lower plate c1. The upper transition portion 52a on the X-axis flip plate 21 is formed by stamping and cutting the second upper plate a2, and the lower transition portion 52c is formed by stamping and cutting the second lower plate c2. The use of a single stamping and cutting process can ensure assembly accuracy, so that the substrate 1, the X-axis flip plate 21, and the Y-axis flip plate 31 can move smoothly. In addition, a semicircular groove 52b is provided on the middle plate a, between the upper transition portion 52a and the lower transition portion 52c. Specifically, the semicircular groove 52b is provided on the first middle plate b1 and the second middle plate b2. Fig. 9 and Fig.10 The radius of the semicircular groove 52b is larger than the radius of the connecting ball 51, and its center coincides with the center of the connecting ball 51. The semicircular groove is provided on the middle plate b to allow the connecting ball 51 to move slightly left and right, and at the same time control the moving range of the connecting ball 51 to prevent the connecting ball 51 from moving too far and breaking the SMA wire.

[0078] In some specific embodiments of the present invention, the X-axis SMA drive assembly 22 includes a first common end 223, a first control end 222 and an X-axis SMA wire 221. The first common end 223 is arranged on the X-axis flip plate 21 and is located at the rotational connection between the X-axis flip plate 21 and the substrate 1. The first control end 222 has two pieces. The first control end 222 is arranged on the substrate 1 and is located on both sides of the first common end 223. The first control ends 222 are connected to the first common end 221 through the X-axis SMA wire.

[0079] It should be understood that the Y-axis SMA drive assembly 32 is configured in the same manner as the X-axis SMA drive assembly 22, that is, the Y-axis SMA drive assembly includes a second common end 323, a second control end 322 and a Y-axis SMA wire 321, the second common end 323 is disposed on the Y-axis flip plate 31 and is located at the rotational connection between the Y-axis flip plate 31 and the X-axis flip plate 21, the second control end 322 has two pieces, the second control end 322 is disposed on the X-axis flip plate 21 and is located on both sides of the second common end 323, and the second control ends 322 are connected to the second common end 323 via the Y-axis SMA wire 321.

[0080] Specifically, multiple X-axis SMA drive assemblies 22 and Y-axis SMA drive assemblies 32 may be provided. Figure 3 As shown, two X-axis SMA drive assemblies 22 are provided, and the two X-axis SMA drive assemblies 22 are both located on one side of the X-axis flip plate 21, and are symmetrically arranged on the upper surface and lower surface of the X-axis flip plate 21 and the substrate 1; two Y-axis SMA drive assemblies 32 are also provided, and are symmetrically arranged on the upper surface and lower surface of the Y-axis flip plate 31 and the X-axis flip plate 21.

[0081] The operating principle of SMA wire assembly can be referred to Figure 4 When the X-axis flip plate 21 needs to be rotated relative to the substrate 1, the X-axis SMA wire 221 can be energized through the first common end 223 and the first control end 222 at both ends of a certain X-axis SMA wire 221, that is, the 221a segment and the 221c segment of the X-axis SMA wire 221 are energized and contracted at the same time, and the 221b segment and the 221d segment remain in a relaxed state without an electrical signal, and the X-axis flip plate 21 is flipped counterclockwise relative to the substrate 1; the 221b segment and the 221d segment of the X-axis SMA wire 221 are energized at the same time to contract, and the 221a segment and the 221c segment remain in a relaxed state without an electrical signal, and the X-axis flip plate 21 is flipped clockwise relative to the substrate 1. Similarly, refer to Figure 5When it is necessary to rotate the Y-axis flip plate 31 relative to the X-axis flip plate 21, the 321a segment and the 321c segment of the Y-axis SMA wire 321 can be energized and contracted at the same time, or the 321b segment and the 321d segment of the Y-axis SMA wire 321 can be energized and contracted at the same time, so that the Y-axis flip plate 31 can be flipped counterclockwise or clockwise relative to the X-axis flip plate 21 to achieve the anti-shake purpose.

[0082] It should be understood that there is a second configuration method for the X-axis SMA drive assembly 22 and the Y-axis SMA drive assembly 32, such as Figure 6 As shown. Four X-axis SMA drive components 22 are provided, each in a group of two; the first common end 223 in one group of X-axis SMA drive components 22 is symmetrically arranged at two rotating connections on the upper surface of the X-axis flip plate 21, and the first control end 222 is symmetrically arranged at the corresponding position of the substrate 1; another group of X-axis SMA drive components 22 is symmetrically arranged on the lower surface of the X-axis flip plate 21 and the substrate 1. Four Y-axis SMA drive components 32 are also provided, each in a group of two; the second common end 323 in one group of Y-axis SMA drive components 32 is symmetrically arranged at two rotating connections on the upper surface of the Y-axis flip plate 31, and the second control end 322 is symmetrically arranged at the corresponding position of the Y-axis flip plate 31; another group of Y-axis SMA drive components 32 is symmetrically arranged on the lower surface of the X-axis flip plate 21 and the Y-axis flip plate 31.

[0083] The camera module according to the second aspect of the present invention includes the above-mentioned micro optical image stabilization module. Fig.11 The camera module 6 is arranged in the Z-axis rotating seat 41 on the micro optical anti-shake module. The micro optical anti-shake module can drive the camera module 6 to move in the X, Y, and Z axis directions to achieve an anti-shake effect. The driving force is large and the adjustment is rapid, so that the camera module 6 has better optical anti-shake performance.

[0084] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A micro optical image stabilization module, characterized in that: include: A substrate, wherein the substrate is provided with a frame-shaped hollow portion; A horizontal motion component, comprising an X-axis actuator and a Y-axis actuator, wherein the X-axis actuator comprises an X-axis flip plate and an X-axis SMA driving component, wherein the X-axis flip plate is frame-shaped, the X-axis flip plate is arranged inside the frame of the substrate and is rotatably connected to the substrate, the X-axis SMA driving component connects the X-axis flip plate and the substrate, and the X-axis SMA driving component is used to drive the X-axis flip plate to rotate along the X-axis relative to the substrate, the Y-axis actuator comprises a Y-axis flip plate and a Y-axis SMA driving component, the Y-axis flip plate is arranged inside the frame of the X-axis flip plate and is rotatably connected to the X-axis flip plate, the Y-axis SMA driving component connects the Y-axis flip plate and the X-axis flip plate, and the Y-axis SMA driving component is used to drive the Y-axis flip plate to rotate along the Y-axis relative to the X-axis flip plate; A Z-axis motion assembly is disposed on the Y-axis flip plate, comprising a Z-axis SMA drive assembly and a Z-axis rotating seat, wherein the Z-axis SMA drive assembly connects the Z-axis rotating seat and the Y-axis flip plate, and the Z-axis SMA drive assembly is used to drive the Z-axis rotating seat to rotate relative to the Z-axis; A circular hole is provided at the center of the Y-axis flip plate; the Z-axis rotating seat comprises a rotating member and a support plate with a rotating table at the center, the support plate is in contact with the upper surface of the Y-axis flip plate, the rotating table is arranged in the circular hole, the rotating member is fixedly arranged on the outer bottom surface of the rotating table and in contact with the lower surface of the Y-axis flip plate, and the Z-axis SMA driving assembly is arranged on the bottom surface of the Y-axis flip plate and connected to the rotating member; Among them, the substrate, the X-axis flip plate and the Y-axis flip plate are all composite plate structures, and the composite plate structure includes an upper plate, a middle plate and a lower plate. Specifically: the substrate includes a first upper plate, a first middle plate and a first lower plate, the X-axis flip plate includes a second upper plate, a second middle plate and a second lower plate, and the Y-axis flip plate includes a third upper plate, a third middle plate and a third lower plate.

2. The micro optical image stabilization module according to claim 1, characterized in that: Protrusions are provided on the upper and lower surfaces of the Y-axis flip plate, and the protrusions are arranged around the circular hole. The bottom surface of the support plate abuts against the protrusions on the upper surface of the Y-axis flip plate, and the rotating member abuts against the protrusions on the lower surface of the Y-axis flip plate.

3. The micro optical image stabilization module according to claim 1, characterized in that: The Z-axis SMA drive components are provided with four groups, each of which includes a connecting plate and a Z-axis SMA wire; two "V"-shaped connecting plates are provided in the middle of the bottom surface of the rotating member, and the two ends of the "V"-shaped connecting plates constitute two connecting ears, and the openings of the two "V"-shaped connecting plates are arranged back to back, and the connecting plate is arranged on the bottom surface of the Y-axis flip plate, and the connecting plate in each group of the Z-axis SMA drive components is connected to one of the connecting ears through the Z-axis SMA wire.

4. The micro optical image stabilization module according to claim 1, characterized in that: The rotating member includes an elastic arm, one end of which is connected to the Y-axis flip plate.

5. The micro optical image stabilization module according to claim 1, characterized in that: The hole wall of the circular hole is provided with a limiting groove, and the rotating member is provided with a limiting block, the limiting block cooperates with the limiting groove, and the width of the limiting groove is greater than the width of the limiting block.

6. The micro optical image stabilization module according to claim 1, characterized in that: The X-axis flip plate and the base plate are movably connected via a pair of connecting balls.

7. The micro optical image stabilization module according to claim 6, characterized in that: It also includes an upper adapter part and a lower adapter part, the upper adapter part and the lower adapter part are arranged opposite to each other, and an adapter groove is provided on the opposite side of the upper adapter part and the lower adapter part, and the connecting ball is rotatably arranged between the two adapter grooves of the upper adapter part and the lower adapter part; the upper adapter part, the lower adapter part and the connecting ball constitute a adapter structure, wherein two groups of the adapter structure are arranged between the substrate and the X-axis flip plate, one of the substrate and the X-axis flip plate is fixedly connected to the connecting ball, and the other is fixedly connected to the upper adapter part and the lower adapter part.

8. The micro optical image stabilization module according to claim 1, characterized in that: The X-axis SMA drive assembly includes a first common end, a first control end and an X-axis SMA wire. The first common end is arranged on the X-axis flip plate and is located at the rotation connection between the X-axis flip plate and the substrate. The first control end has two pieces. The first control ends are arranged on the substrate and are located on both sides of the first common end. The first control ends are connected to the first common end through the X-axis SMA wire.

9. A camera module, characterized in that: A micro optical image stabilization module comprising any one of claims 1 to 8.

Images