Cleaning device, cleaning method, and cleaning system

Abstract

The application relates to the technical field of semiconductors, and discloses a cleaning device, a cleaning method and a cleaning system. The cleaning device comprises a cleaning box, a rotating table arranged in the cleaning box and used for placing and driving a to-be-cleaned object to rotate, an air vent arranged above the rotating table and used for inputting dust-free air into the cleaning box, a first baffle arranged around the rotating table, a second baffle and a third baffle extending upwards from the first baffle and towards the direction close to the inside of the first baffle, the second baffle being at least partially arranged above the rotating table, the third baffle being arranged above the second baffle, and the included angle between the third baffle and the rotating table being larger than the included angle between the second baffle and the rotating table, and a ventilation channel being formed between the second baffle, the first baffle and the rotating table. The cleaning device, the cleaning method and the cleaning system provided by the embodiment of the application can effectively reduce the particle residues on the surface of the to-be-cleaned object.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a cleaning apparatus, cleaning method and cleaning system. Background Technology

[0002] With the rapid development of semiconductor integrated circuit manufacturing technology, the feature size of integrated circuit chips has entered the deep submicron stage, and the feature size of key contaminants that cause failure or damage to ultra-fine circuits on the chip has also been greatly reduced.

[0003] In the manufacturing process of integrated circuits, semiconductor silicon wafers typically undergo multiple process steps such as thin film deposition, etching, and polishing. These process steps become important sites for contaminant generation. To maintain the cleanliness of the silicon wafer surface and eliminate contaminants deposited during each process step, the silicon wafer must be cleaned after each step. Therefore, cleaning is the most common process step in integrated circuit manufacturing, aiming to effectively control the contamination level at each step to achieve the objectives of each process.

[0004] To effectively remove contaminants from the surface of silicon wafers, existing technologies include specialized water washing machines for cleaning silicon wafers. In these machines, the silicon wafers are placed on a rotating platform within the single-wafer cleaning chamber and rotated at a certain speed. Simultaneously, a certain flow rate of water is sprayed onto the surface of the silicon wafers to clean them. Furthermore, baffles are installed around the cleaning station to prevent splashing of liquid droplets.

[0005] In addition, after the existing water washing machine cleans the silicon wafer, it is necessary to ventilate to blow away the residual droplets and other particles on the silicon wafer. At this time, a ventilation channel is formed between the baffle and the rotating table. The air is introduced into the ventilation channel, blows away the particles and is discharged from the ventilation channel.

[0006] However, the inventors of this invention have discovered that existing cleaning equipment has a slow airflow rate and poor effect in blowing away particles, leaving a large number of particles remaining on the silicon wafer surface. Summary of the Invention

[0007] The purpose of this invention is to provide a cleaning device, cleaning method, and cleaning system that can effectively reduce particulate residue on the surface of the object to be cleaned.

[0008] To address the aforementioned technical problems, embodiments of the present invention provide a cleaning device, comprising: a cleaning tank; a rotating platform disposed within the cleaning tank for placing and rotating an object to be cleaned; a ventilation opening disposed above the rotating platform for introducing dust-free air into the cleaning tank; a first baffle disposed around the rotating platform, the first baffle being spaced apart from the rotating platform; a second baffle and a third baffle extending upward from the first baffle and toward the interior of the first baffle, the second baffle being at least partially located above the rotating platform, the third baffle being located above the second baffle, and the angle between the third baffle and the rotating platform being greater than the angle between the second baffle and the rotating platform.

[0009] An embodiment of the present invention provides a cleaning method, comprising: placing the object to be cleaned on a rotating table in a cleaning device as described above; and after introducing dust-free air into the cleaning chamber through a vent, venting the cleaning chamber.

[0010] An embodiment of the present invention provides a cleaning system, characterized in that it includes: a control console and at least one cleaning device as described above.

[0011] Compared to existing technologies, this invention sets the angle between the second baffle and the rotating platform to be smaller than that between the third baffle and the rotating platform. When venting the cleaning chamber, the angle between the second baffle and the rotating platform is smaller than that of the third baffle in existing technologies. This results in a smaller effective venting area and more concentrated venting action. With the total amount of gas discharged remaining constant, a smaller effective area allows for higher air velocity during venting. Higher air velocity carries away more particles, effectively reducing particle residue on the surface of the object to be cleaned. Furthermore, clean air is introduced into the cleaning chamber through the vents, maintaining the cleanliness of the chamber and minimizing the impact of particles on the cleaning effect.

[0012] In addition, the angle between the second baffle and the rotating platform is less than or equal to 30° and greater than or equal to 20°.

[0013] Furthermore, the first baffle includes a first inner surface near the rotating platform. This first inner surface may be coated with a hydrophilic coating or may be a rough surface. The hydrophilic coating on the first inner surface effectively absorbs droplets splashed onto the surface by the object being cleaned during the rotation of the rotating platform, thereby reducing the likelihood of liquid re-splashing onto the object and further reducing particulate residue on the surface. Additionally, when the first inner surface is rough, droplets splashed onto it during rotation can adhere better to the surface, further reducing the likelihood of liquid re-splashing onto the object and further reducing particulate residue on the surface.

[0014] Furthermore, the second baffle includes a second inner surface near the rotating platform. This second inner surface may have a hydrophilic coating or a rough surface. The hydrophilic coating on the second inner surface effectively absorbs droplets splashed onto it by the object being cleaned during the rotation of the platform, reducing the likelihood of liquid re-splashing onto the object and further reducing particulate residue on its surface. Additionally, when the second inner surface is rough, droplets splashed onto it during rotation adhere better to the first inner surface, further reducing the likelihood of liquid re-splashing onto the object and minimizing particulate residue.

[0015] Additionally, the system includes a pressure control valve connected to the cleaning chamber. This valve controls the exhaust pressure within the cleaning chamber to be greater than or equal to 160 Pascals and less than or equal to 180 Pascals. The pressure control valve maintains the exhaust pressure within the cleaning chamber at 160 Pascals; a higher exhaust pressure results in a higher exhaust velocity, further reducing particle residue on the surface of the object to be cleaned. Maintaining the exhaust pressure within the cleaning chamber at 180 Pascals avoids wasting electrical resources due to excessive pressure.

[0016] Additionally, the system includes an exhaust pipe connected to the cleaning box and an anemometer installed inside the exhaust pipe to measure the exhaust velocity within the pipe. Installing the anemometer inside the exhaust pipe allows for real-time acquisition of the air velocity, facilitating control of the exhaust process.

[0017] Additionally, it includes a fan filter unit connected to the vent, which is used to introduce dust-free air into the cleaning chamber.

[0018] Additionally, it includes a fourth baffle extending downward from the rotary table, which is sandwiched with the first baffle to form an exhaust channel.

[0019] Additionally, it includes a positioning device disposed inside the fourth baffle for positioning the object to be cleaned. The positioning device positions the object to be cleaned, preventing damage during rotation due to misplacement. Furthermore, its placement inside the fourth baffle reduces the risk of damage to the electronic components of the positioning device from splashed liquid during cleaning.

[0020] Additionally, the system includes a fixing component mounted on the rotating platform for securing the object to be cleaned. This fixing component secures the object to be cleaned, preventing it from detaching from the rotating platform and causing damage during rotation. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the cleaning device provided in the first embodiment of the present invention; Figure 2 This is a schematic diagram of the cleaning results of a water washing device in the prior art; Figure 3 This is a schematic diagram of the cleaning result of the cleaning device provided in the first embodiment of the present invention; Figure 4 This is a schematic diagram of the cleaning device provided in the second embodiment of the present invention; Figure 5 This is a schematic diagram of the cleaning device provided in the third embodiment of the present invention; Figure 6 This is a schematic diagram of the cleaning device provided in the fourth embodiment of the present invention; Figure 7 This is an image showing wind speed versus total number of particles in an embodiment of the present invention; Figure 8 yes Figure 7 Particle image at midpoint 1; Figure 9 yes Figure 7 Particle image at midpoint 2; Figure 10 yes Figure 7 Particle image at midpoint 3; Figure 11 yes Figure 7 Particle image at midpoint 4; Figure 12 yes Figure 7 Particle image at midpoint 5; Figure 13 yes Figure 7 Particle image at midpoint 6; Figure 14 This is a flowchart of the cleaning method provided in the fifth embodiment of the present invention; Figure 15 This is a schematic diagram of the cleaning system provided in the sixth embodiment of the present invention.

[0022] Reference numerals: 10—cleaning tank, 20—rotary table, 30—first baffle, 31—first inner surface, 40—second baffle, 41—second inner surface, 50—fan filter unit, 60—fixed component, 70—third baffle, 80—positioning device, 90—fourth baffle, 100—hydrophilic coating, 110—exhaust pipe, 120—anemometer. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this invention clearer, the various embodiments of this invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the various embodiments of this invention to facilitate a better understanding of this application. However, the technical solutions claimed in this application can be implemented even without these technical details and with various variations and modifications based on the following embodiments.

[0024] The first embodiment of the present invention relates to a cleaning device, such as... Figure 1 As shown, the system includes: a cleaning chamber 10; a rotating platform 20 disposed within the cleaning chamber 10, the rotating platform 20 for placing and rotating the object to be cleaned (generally referring to a silicon wafer after water washing, whose surface still contains fine droplets and other particles); a first baffle 30 surrounding the rotating platform 20; a second baffle 40 extending upward from the first baffle 30 and towards the interior of the first baffle 30; a third baffle 70 at least partially above the rotating platform 20; and a third baffle 70 above the second baffle 40, with the angle between the third baffle 70 and the rotating platform 20 being greater than the angle between the second baffle 40 and the rotating platform 20. Ventilation channels are formed between the second baffle 40 and the first baffle 30 and the rotating platform 20. Additionally, a vent is provided on the cleaning chamber 10 for introducing clean air into the cleaning chamber 10.

[0025] Compared with the prior art, in the cleaning device provided by the first embodiment of the present invention, the angle between the second baffle 40 and the rotating table 20 is smaller than the angle between the third baffle 70 and the rotating table 20. When venting the cleaning chamber 10, the smaller the angle between the second baffle 40 and the rotating table 20, the smaller the effective area of ​​the venting, and the more concentrated the venting effect. With the total amount of gas discharged remaining constant, the smaller the effective area, the greater the wind speed during venting. The greater the wind speed, the more particles are carried out, thereby effectively improving the cleaning effect of the object to be cleaned and reducing the particle residue on the surface of the object to be cleaned. The second baffle 40 is at least partially located above the rotating table 20, which can effectively block the droplets splashed from the rotating table 20, reducing the impact of the droplets on the electronic components inside the cleaning chamber 10, while allowing the airflow to flow downwards along the second baffle 40 and the first baffle 30, facilitating the airflow to carry away particles. In addition, a vent is provided to introduce dust-free air into the cleaning chamber 10, thereby ensuring the cleanliness inside the cleaning chamber 10 and preventing the micro-dust inside the cleaning chamber 10 from affecting the cleaning effect of the object to be cleaned. The third baffle 70 is longer than the second baffle 40, so as to effectively shield the liquid during cleaning and prevent droplets from splashing to the outside and affecting the components outside the baffle inside the cleaning tank 10.

[0026] Preferably, in this embodiment, a fan filter unit 50 connected to the ventilation opening is also included. The fan filter unit 50 is used to introduce dust-free air into the cleaning chamber 10. It is understood that in this embodiment, the fan filter unit 50 is located inside the cleaning chamber 10. However, in other embodiments of the present invention, the fan filter unit 50 may also be located outside the cleaning chamber 10. This is not limited here, and the specific configuration can be flexibly set according to actual needs.

[0027] Preferably, in this embodiment, a fixing member 60 for fixing the object to be cleaned is also included, and the fixing member 60 is disposed on the rotary table 20. The fixing member 60 is disposed on the rotary table 20 to fix the object to be cleaned, thereby ensuring a tight connection between the object to be cleaned and the rotary table 20, and preventing relative sliding between the rotary table 20 and the object to be cleaned during the cleaning process, or even the object to be cleaned falling off the rotary table 20 and causing damage to the object to be cleaned.

[0028] Specifically, in this embodiment, the fixing member 60 is a fixing clip. It is understood that the fixing member 60 being a fixing clip is only a specific example in this embodiment and does not constitute a limitation. In other embodiments of the present invention, the fixing member 60 may also be other structures, such as suction cups, etc., which will not be listed here. The specific design can be flexibly set according to actual needs.

[0029] Furthermore, in this embodiment, the contact point between the first baffle 30 and the second baffle 40 ( Figure 1 Point A in the middle) and the contact point between the first baffle 30 and the third baffle 70 ( Figure 1 The distance between point B and point C is 3 centimeters.

[0030] In addition, this embodiment also includes a positioning device 80 for positioning the object to be cleaned. The positioning device 80 is set to position the object to be cleaned to prevent damage to the object during the rotation cleaning process due to placement deviation.

[0031] Furthermore, in this embodiment, a fourth baffle 90 extending downward from the rotating stage 20 is also included, which, together with the first baffle 30, forms an exhaust channel; a positioning device 80 is disposed inside the fourth baffle 90. By placing the positioning device 80 inside the fourth baffle 90, the possibility of droplets generated during cleaning and exhaust falling onto the positioning device 80 can be effectively reduced, thus reducing damage to the electronic components within the positioning device 80 caused by the droplets.

[0032] The following is a detailed description of specific usage examples of the cleaning device provided in the first embodiment of the present invention, such as... Figure 2 The diagram shown illustrates the cleaning results of a water washing device in the prior art. Figure 3The diagram shown is a schematic representation of the cleaning results of the cleaning apparatus provided in the first embodiment of this application; the first circle represents the particle count before testing, the second circle represents the particle count after the cleaning process, and the third circle represents the result of subtracting the particle count from the first circle. It is evident that the number of particles cleaned by the cleaning apparatus provided in the first embodiment of this application is significantly less than the number of particles cleaned by existing water washing apparatuses. It is understood that... Figure 2 and Figure 3 This is merely a schematic diagram of the experimental results and does not constitute any limitation.

[0033] The second embodiment of the present invention relates to a cleaning device, such as... Figure 4 As shown, the second embodiment is largely the same as the first embodiment, and it also includes a cleaning box 10, a cleaning table 20, a first baffle 30, a second baffle 40, a fan filter unit 50, a fixing member 60, a third baffle 70, a positioning device 80, and a fourth baffle 90; the difference is that in this embodiment, the first baffle 30 includes a first inner surface 31 near the rotating table 20, and the cleaning device also includes a hydrophilic coating 100 disposed on the first inner surface 31.

[0034] Specifically, in this embodiment, the hydrophilic coating 100 is made of dimethylacetamide. It is understood that the use of dimethylacetamide as the material of the hydrophilic coating 100 is merely a specific example in this embodiment and does not constitute a limitation. In other embodiments of the present invention, the material of the hydrophilic coating 100 may also be resin or the like; this is not limited here, and can be flexibly set according to actual needs.

[0035] Compared with the prior art, the cleaning device provided by the second embodiment of the present invention retains all the technical effects of the first embodiment, while providing a hydrophilic coating 100 on the inner surface of the first baffle 30. Since there is a splashing phenomenon during the cleaning process, that is, the liquid that is thrown out of the object to be cleaned is splashed back to the object to be cleaned by the first baffle 30. The addition of the hydrophilic coating 100 to the first inner surface 31 increases the hydrophilicity. The hydrophilic coating 100 has better absorption performance for droplets. After water vapor splashes onto the first inner surface 31, it is adsorbed by the hydrophilic coating 100, reducing the splashing phenomenon and further improving the cleaning effect.

[0036] Preferably, in this embodiment, the second baffle 40 includes a second inner surface 41 near the rotating platform 20, and a hydrophilic coating 100 is provided on the second inner surface 41. The hydrophilic coating 100 on the second inner surface 41 further adsorbs splashed droplets, further reduces the backsplashing process of droplets, and better improves the cleaning effect.

[0037] The third embodiment of the present invention relates to a cleaning device, such as... Figure 5As shown, the third embodiment is largely the same as the first embodiment, and it also includes a cleaning box 10, a cleaning table 20, a first baffle 30, a second baffle 40, a fan filter unit 50, a fixing member 60, a third baffle 70, a positioning device 80, and a fourth baffle 90; the difference is that in this embodiment, the first baffle 30 includes a first inner surface 31 near the rotating table 20, and the first inner surface 31 is a rough surface.

[0038] Compared with the prior art, the cleaning device provided by the third embodiment of the present invention retains all the technical effects of the first embodiment, while setting the first inner surface 31 as a rough surface. When droplets splash onto the first inner surface 31, the rough surface can better absorb the splashed droplets, reduce the back splashing phenomenon, and further improve the cleaning effect.

[0039] Preferably, in this embodiment, the second baffle 40 includes a second inner surface 41 near the rotating platform 20, and the second inner surface 41 is a rough surface. The rough surface of the second inner surface 41 further adsorbs the splashed droplets, further reducing the backsplashing process of the droplets and improving the cleaning effect.

[0040] The fourth embodiment of the present invention relates to a cleaning device, such as... Figure 6 As shown, the second embodiment is largely the same as the first embodiment, also including a cleaning tank 10, a cleaning table 20, a first baffle 30, a second baffle 40, a fixing member 50, a third baffle 60, a positioning device 70, a fourth baffle 80, and a fan filter unit 90; the difference is that in this embodiment, a pressure control valve (not shown) connected to the cleaning tank 10 is also included. The pressure control valve is used to control the exhaust pressure in the cleaning tank 10 to be greater than or equal to 160 Pascals and less than or equal to 180 Pascals.

[0041] Compared with the prior art, the fourth embodiment of the present invention retains all the technical effects of the first embodiment, and controls the exhaust pressure in the cleaning tank 10 to be greater than or equal to 160 Pascal by using a pneumatic control valve. The higher the exhaust pressure, the greater the wind speed during exhaust, thereby further reducing the particle residue on the surface of the object to be cleaned. At the same time, the exhaust pressure in the cleaning tank 10 is controlled to be less than or equal to 180 Pascal by using a pneumatic control valve, thereby effectively reducing the power consumption caused by excessive air pressure and effectively saving power resources.

[0042] Preferably, in this embodiment, it further includes an exhaust pipe 110 connected to the cleaning chamber 10, and an anemometer 120 disposed inside the exhaust pipe 110. The anemometer 120 is used to measure the exhaust air velocity inside the exhaust pipe 110. By setting the anemometer 120 to measure the exhaust air velocity inside the exhaust pipe 110, the exhaust air velocity can be monitored in real time. When the exhaust air velocity is too low, the air pressure control valve can control the exhaust air pressure inside the cleaning chamber 10 to increase the exhaust air velocity, thereby increasing the exhaust air velocity and ensuring the cleaning effect of the items to be cleaned.

[0043] The following are examples illustrating the above embodiments. It should be understood that the following are merely specific examples of the embodiments of the present invention and do not constitute a limitation.

[0044] Tables 1 and 2 show the wind speeds under different exhaust pressures. It can be seen that the higher the exhaust pressure, the higher the wind speed.

[0045]

[0046] Table 1

[0047] Table 2 Figure 7 The number of particles at different wind speeds. Figure 8 for Figure 7 The particle test image at midpoint 1, Figure 9 for Figure 7 The particle test image at midpoint 2, Figure 10 for Figure 7 The particle test image at midpoint 3, Figure 11 for Figure 7 The particle test image at midpoint 4, Figure 12 for Figure 7 The particle test image at midpoint 5, Figure 13 for Figure 7 Particle test image at midpoint 6. Figures 8 to 13 In the diagram, the first circle represents the particle size before testing, the second circle represents the particle size distribution after the cleaning process, and the third circle is the result of subtracting the particle size distribution from the first circle. Figures 7 to 13 It can be seen that when the wind speed is less than 5.7 m / s, the number of particles decreases significantly as the wind speed increases. When the wind speed is greater than 5.7 m / s, the number of particles gradually stabilizes as the wind speed increases. Therefore, within a certain wind speed range, the higher the wind speed, the better the cleaning effect.

[0048] The fourth embodiment of the present invention relates to a cleaning method, such as... Figure 14 As shown, it includes the following steps: Step S101: Place the object to be cleaned on the rotating table in the cleaning device.

[0049] Specifically, in this embodiment, the cleaning device is the same as the cleaning device provided in other embodiments of the present invention.

[0050] Step S102: After introducing clean air into the cleaning chamber through the vent, exhaust the cleaning chamber.

[0051] Preferably, in this embodiment, before venting the cleaning chamber, the exhaust pressure inside the cleaning chamber is controlled by a pressure control valve to be greater than or equal to 160 Pascals and less than or equal to 180 Pascals.

[0052] Compared with the prior art, the cleaning method provided in the fourth embodiment of the present invention uses the cleaning device provided in the foregoing embodiments of the present invention to clean the object to be cleaned. Therefore, the cleaning method provided in the fourth embodiment of the present invention also has the technical effects of the foregoing embodiments, which will not be described in detail here.

[0053] The fifth embodiment of the present invention relates to a cleaning system, such as... Figure 15 As shown, it includes a control console 1100 and at least one cleaning device 1200 as provided in other embodiments of the present invention.

[0054] Compared with the prior art, the cleaning system provided by the fifth embodiment of the present invention includes at least one cleaning device as provided by the foregoing embodiments of the present invention. Therefore, the cleaning system provided by the fifth embodiment of the present invention also has the technical effects as provided by the foregoing embodiments, which will not be elaborated here.

[0055] Those skilled in the art will understand that the above embodiments are specific examples of implementing the present invention, and in practical applications, various changes in form and detail may be made without departing from the spirit and scope of the present invention.

Claims

1. A cleaning device, characterized in that, include: Cleaning box; A rotating platform installed inside the cleaning tank for placing and rotating the object to be cleaned. A ventilation opening is provided above the rotating table, and the ventilation opening is used to introduce dust-free air into the cleaning chamber; A first baffle is arranged around the rotary table; A second baffle and a third baffle extend upward from the first baffle and toward the interior of the first baffle, the second baffle being at least partially located above the rotating platform, the third baffle being located above the second baffle, and the angle between the third baffle and the rotating platform being greater than the angle between the second baffle and the rotating platform; A ventilation channel is formed between the second baffle and the first baffle and the rotating platform; the angle between the second baffle and the rotating platform is less than or equal to 30° and greater than or equal to 20°. The first baffle includes a first inner surface near the rotating platform, and the first inner surface is provided with a hydrophilic coating, or the first inner surface is a rough surface; The second baffle includes a second inner surface near the rotating platform, on which the hydrophilic coating is disposed, or the second inner surface is a rough surface.

2. The cleaning device according to claim 1, characterized in that, It also includes a pneumatic control valve connected to the cleaning chamber, the pneumatic control valve being used to control the exhaust pressure in the cleaning chamber to be greater than or equal to 160 Pascals and less than or equal to 180 Pascals.

3. The cleaning device according to claim 1, characterized in that, It also includes an exhaust pipe connected to the cleaning box and an anemometer installed inside the exhaust pipe for measuring the exhaust wind speed inside the exhaust pipe.

4. The cleaning device according to claim 1, characterized in that, It also includes a fan filter unit connected to the vent, the fan filter unit being used to input dust-free air into the cleaning box; It also includes a fourth baffle extending downward from the rotary table, the fourth baffle and the first baffle being sandwiched to form an exhaust channel; It also includes a positioning device disposed inside the fourth baffle for positioning the object to be cleaned; and a fixing member disposed on the rotating table for fixing the object to be cleaned.

5. A cleaning method, characterized in that, include: The object to be cleaned is placed on a rotating table in the cleaning apparatus as described in any one of claims 1 to 4; After clean air is introduced into the cleaning chamber through the vent, the cleaning chamber is vented.

6. The cleaning method according to claim 5, characterized in that, Before venting the cleaning tank, the process also includes: The exhaust pressure in the cleaning chamber is controlled by a pneumatic control valve to be greater than or equal to 160 Pascals and less than or equal to 180 Pascals.

7. A cleaning system, characterized in that, include: It includes a control console and at least one cleaning device as described in any one of claims 1 to 4.

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