Methods for manufacturing display devices and equipment for manufacturing display devices

Abstract

A method for manufacturing a display device and an apparatus for manufacturing a display device are provided. The method includes: providing a first substrate, a second substrate, and a plurality of connecting lines, wherein the first substrate has a base substrate, wherein a second substrate faces the first substrate, and wherein the plurality of connecting lines are disposed between the base substrate and the second substrate; grinding side surfaces of the base substrate, side surfaces of the second substrate, and side surfaces of the plurality of connecting lines; and simultaneously transferring a conductive film and laser-curing a conductive film, wherein the conductive film is transferred onto the ground side surfaces of the base substrate, the ground side surfaces of the second substrate, and the ground side surfaces of the plurality of connecting lines.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2019-0108371, filed on September 2, 2019, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] The present invention relates to a manufacturing apparatus for a display device and a method for manufacturing a display device. Background Technology

[0003] Display devices that display moving and still images can be used not only in portable electronic devices such as mobile phones, smartphones, tablet PCs, smartwatches, watch phones, mobile communication terminals, e-notebooks, e-books, portable multimedia players (PMPs), navigation devices, ultra-mobile PCs (UMPCs), etc., but also as displays for various products such as televisions (TVs), laptops, monitors, billboards, and Internet of Things (IoT) devices.

[0004] To drive the light-emitting devices of a display device, a printed circuit board (PCB) including driving circuitry, multiple signal lines electrically connecting the light-emitting devices, and multiple leads connected to the signal lines can be used. The display device may include a display area for displaying an image and a portion surrounding the display area that does not display an image (e.g., a bezel). Typically, to achieve a bezel-less display device, the signal lines and leads can be attached to the side surface of the display device. Summary of the Invention

[0005] According to an exemplary embodiment of the present invention, a method for manufacturing a display device includes: providing a first substrate, a second substrate, and a plurality of connecting lines, wherein the first substrate has a base substrate, wherein the second substrate faces the first substrate, and wherein the plurality of connecting lines are disposed between the base substrate and the second substrate; grinding a side surface of the base substrate, a side surface of the second substrate, and a side surface of the plurality of connecting lines; and simultaneously transferring a conductive film and laser-curing a conductive film, wherein the conductive film is transferred onto the ground side surface of the base substrate, the ground side surface of the second substrate, and the ground side surface of the plurality of connecting lines.

[0006] In an exemplary embodiment of the present invention, the transfer of the conductive film includes forming and pressing the conductive film on the polished side surface of the substrate, the polished side surface of the second substrate, and the polished side surface of the plurality of connecting lines.

[0007] In an exemplary embodiment of the present invention, a transparent pressing tool disposed on the conductive film is used to press the conductive film.

[0008] In an exemplary embodiment of the present invention, the transparent pressing tool comprises quartz or glass.

[0009] In an exemplary embodiment of the present invention, laser curing of the conductive film is performed by projecting a laser beam through a transparent pressing tool.

[0010] In an exemplary embodiment of the present invention, a continuous wave laser supply device is used to perform laser curing of the conductive film.

[0011] In an exemplary embodiment of the present invention, during the laser curing of the conductive film, the laser beam is focused on the front surface of the conductive film.

[0012] In an exemplary embodiment of the present invention, during the laser curing of the conductive film, the laser beam is focused on a region of the conductive film, and laser curing is performed while the focal position of the laser beam is changed.

[0013] In an exemplary embodiment of the present invention, the conductive film includes: a conductive layer disposed on a polished side surface of a substrate, a polished side surface of a second substrate, and a polished side surface of the plurality of connecting lines; and a protective layer disposed on the conductive layer.

[0014] In an exemplary embodiment of the present invention, the method further includes peeling a protective layer off one surface of the conductive layer after the transfer and laser curing of the conductive film.

[0015] In an exemplary embodiment of the invention, the method further includes, after peeling a protective layer from one surface of the conductive layer, patterning the conductive layer and forming a plurality of connecting pads disposed apart from each other in one direction.

[0016] In an exemplary embodiment of the present invention, the method further includes bonding a printed circuit board to the plurality of connection pads after the plurality of connection pads have been formed.

[0017] In an exemplary embodiment of the present invention, the step of bonding a printed circuit board to the plurality of connection pads includes: arranging the printed circuit board on the plurality of connection pads, and simultaneously pressing the arranged printed circuit board and laser bonding the printed circuit board to the plurality of connection pads, wherein the pressing of the arranged printed circuit board is performed using a transparent pressing tool disposed on the printed circuit board.

[0018] In an exemplary embodiment of the present invention, the step of laser bonding a printed circuit board to the plurality of connection pads is performed by projecting a laser beam through a transparent pressing tool, wherein the step of laser bonding a printed circuit board to the plurality of connection pads includes curing an anisotropic conductive film disposed between the leads of the printed circuit board and the connection pads.

[0019] In an exemplary embodiment of the present invention, during the simultaneous transfer and laser curing of conductive films on the polished side surface of the substrate, the polished side surface of the second substrate, and the polished side surface of the plurality of connecting lines, the conductive film extends to the first surface of the substrate, and the transfer and laser curing of the conductive film are performed on the first surface of the substrate.

[0020] According to an exemplary embodiment of the present invention, a manufacturing apparatus for a display device includes: a polishing machine configured to polish a side surface of a substrate, a side surface of a second substrate, and a side surface of a plurality of connecting lines disposed between the substrate and the second substrate; and a conductive film transfer unit and a conductive film curing unit configured to simultaneously transfer a conductive film onto the polished side surface of the substrate, the polished side surface of the second substrate, and the polished side surface of the plurality of connecting lines, and to laser cure the conductive film on the polished side surface of the substrate, the polished side surface of the second substrate, and the polished side surface of the plurality of connecting lines. The conductive film includes a conductive layer and a protective layer disposed on the conductive layer.

[0021] In an exemplary embodiment of the present invention, a conductive film transfer unit presses a conductive film formed on a polished side surface of a substrate, a polished side surface of a second substrate, and a polished side surface of a plurality of connecting lines.

[0022] In an exemplary embodiment of the present invention, the conductive film transfer unit includes a pressing tool disposed on the conductive film, and the pressing tool includes quartz or glass.

[0023] In an exemplary embodiment of the present invention, the conductive film curing unit includes a first laser supply device, wherein the first laser supply device projects a continuous wave laser beam passing through a pressing tool and curing the conductive film.

[0024] In an exemplary embodiment of the present invention, the manufacturing apparatus further includes: a patterning laser configured to pattern a conductive layer and form a bonding pad; and a chip-on-film bonding unit configured to bond a printed circuit board to the bonding pad, wherein the chip-on-film bonding unit includes: a pressing unit configured to press the chip-on-film and includes a pressing tool comprising quartz or glass; and a second laser supply device configured to project a laser beam through the pressing unit and to solidify an anisotropic conductive film disposed between the leads of the printed circuit board and the bonding pad. Attached Figure Description

[0025] The above and other features of this disclosure will become more apparent from the detailed description of exemplary embodiments thereof with reference to the accompanying drawings, in which:

[0026] Figure 1 This is a flowchart illustrating a method for manufacturing a display device according to an exemplary embodiment of the present invention;

[0027] Figure 2 , Figure 3 , Figure 5 , Figure 8 and Figure 10 This is a perspective view illustrating the process operations of a method for manufacturing a display device according to an exemplary embodiment of the present invention;

[0028] Figure 4 It is along Figure 3 A sectional view taken by line IV-IV';

[0029] Figure 6 It is along Figure 5 A sectional view taken by line V-V';

[0030] Figure 7 It is shown Figure 6 A cross-sectional view showing the peeling of the protective film shown;

[0031] Figure 9 It is along Figure 8 A sectional view taken by line VII-VII';

[0032] Figure 11 It is along Figure 9 A cross-sectional view taken by line IX-IX';

[0033] Figure 12 yes Figure 11 An enlarged sectional view of region A;

[0034] Figure 13 This is a table showing a comparison between simultaneously operating the transfer conductive film and the laser-cured conductive film and sequentially operating the transfer conductive film and the laser-cured conductive film;

[0035] Figure 14 This is a perspective view of a process operation of a method for manufacturing a display device according to an exemplary embodiment of the present invention;

[0036] Figure 15 This is a perspective view of a process operation of a method for manufacturing a display device according to an exemplary embodiment of the present invention;

[0037] Figure 16 This is a perspective view of a process operation of a method for manufacturing a display device according to an exemplary embodiment of the present invention;

[0038] Figure 17 This is a block diagram of a manufacturing apparatus for a display device according to an exemplary embodiment of the present invention; and

[0039] Figure 18 This is a block diagram of a chip-on-film (COF) bonding unit according to an exemplary embodiment of the present invention. Detailed Implementation

[0040] Exemplary embodiments of the invention will now be described more fully below with reference to the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as being limited to the exemplary embodiments set forth herein.

[0041] It will be understood that when an element or layer is referred to as being "above" or "on" another element or layer, the element or layer may be directly on the other element or layer, or there may be an intermediate layer or element between them.

[0042] Throughout the specification, the same reference numerals may denote the same elements, so repeated descriptions may be omitted.

[0043] In the following description, exemplary embodiments of the present invention will be illustrated with reference to the accompanying drawings.

[0044] Figure 1 This is a flowchart illustrating a method for manufacturing a display device according to an exemplary embodiment of the present invention. Figure 2 , Figure 3 , Figure 5 , Figure 8 and Figure 10 This is a perspective view illustrating the process operation of a method for manufacturing a display device according to an exemplary embodiment of the present invention. Figure 4 It is along Figure 3 A sectional view taken from line IV-IV'. Figure 6 It is along Figure 5 A sectional view taken by line V-V'. Figure 7 It is shown Figure 6 The cross-sectional view showing the peeling of the protective film is shown. Figure 9 It is along Figure 8 A sectional view taken from line VII-VII'. Figure 11 It is along Figure 9 A sectional view taken from line IX-IX'. Figure 12 yes Figure 11 An enlarged sectional view of region A.

[0045] Reference Figures 1 to 12A method for manufacturing a display device according to an exemplary embodiment of the present invention may include providing a first substrate including a base substrate, a second substrate facing the first substrate, and a plurality of connecting lines disposed between the base substrate and the second substrate (S10). The method may further include polishing the side surfaces of the base substrate, the second substrate, and the plurality of connecting lines (S20), and simultaneously transferring a conductive film onto the polished side surfaces of the base substrate, the second substrate, and the plurality of connecting lines, and laser curing the conductive film (S30). The method further includes patterning the conductive film to form a plurality of bonding pads (or "soldering pads") disposed separately from each other in one direction (S40), and bonding a printed circuit board (PCB) onto the plurality of bonding pads (S50).

[0046] Reference Figure 1 and Figure 2 The system may provide a first substrate 100, a second substrate 200 facing the first substrate 100, and a plurality of connecting lines 110 (S10). In addition, the first substrate 100 includes a first base substrate SUB1, and the plurality of connecting lines 110 are disposed between the first base substrate SUB1 and the second substrate 200.

[0047] A display device according to an exemplary embodiment of the present invention may include target panels 100 and 200.

[0048] Target panels 100 and 200 may each include a first substrate 100 and a second substrate 200. Additionally, target panels 100 and 200 may each include various elements disposed on the first substrate 100 and various elements disposed on the second substrate 200.

[0049] In an exemplary embodiment of the present invention, the target panels 100 and 200 may be a first substrate 100 and a second substrate 200, respectively.

[0050] Both target panels 100 and 200 may comprise, for example, organic light-emitting display panels. While the following embodiments illustrate a case where both target panels 100 and 200 comprise organic light-emitting display panels, the invention is not limited thereto. For example, target panels 100 and 200 may comprise other types of display panels, such as liquid crystal displays (LCDs), quantum dot organic light-emitting diode (QD-OLED) panels, quantum dot LCDs (QD-LCDs), quantum nano-light-emitting diode (nano-LED) panels, and micro-LEDs.

[0051] The various elements of the first substrate 100 may include multiple insulating layers, multiple conductive layers, at least one thin-film transistor (TFT), and an organic light-emitting element connected to the at least one TFT.

[0052] For example, the first substrate 100 may be a backplane substrate or a TFT substrate that includes the at least one TFT.

[0053] The second substrate 200 may face the first substrate 100 and be disposed on the first substrate 100. The second substrate 200 may include an encapsulation substrate that encapsulates the organic light-emitting element of the first substrate 100.

[0054] Each of the first substrate 100 and the second substrate 200 may include a matrix substrate. Each of the matrix substrates of the first substrate 100 and the second substrate 200 may include a rigid material such as glass or quartz. For example, the first substrate 100 may include a first matrix substrate SUB1.

[0055] The first substrate 100 may also include a connecting line 110 disposed between the first substrate SUB1 and the second substrate 200.

[0056] Target panels 100 and 200 may both have a rectangular shape with right angles at their corners in a plan view. However, the invention is not limited to this; for example, target panels 100 and 200 may both have a polygonal shape and may have rounded corners. Target panels 100 and 200 may both have a long side and a short side in a plan view. The short side of target panels 100 and 200 may be a side extending in the second direction DR2. The long side of target panels 100 and 200 may be a side extending in the first direction DR1. The first base 100 may have a planar shape substantially the same as the planar shape of the second base 200.

[0057] Then, refer to Figure 1 and Figure 2 The first substrate SUB1 can be polished (e.g., the first side surface) SUB1s, the second substrate 200 can be polished (e.g., the first side surface) 200s, and the side surfaces of multiple connecting lines 110 can be polished (e.g., the first side surface) 110s (S20).

[0058] As a result, the side surface portions of the first substrate 100 and the second substrate 200 (e.g., the upper short side surface portions in the first direction DR1) can be polished, so that one side surface of the first substrate 100 and one side surface 200s of the second substrate 200 can be aligned along the direction along which the second substrate 200 is viewed from the first substrate 100 (e.g., the third direction DR3). Regarding the other side surface portions of the first substrate 100 and the second substrate 200 (the lower short side surface portion in the first direction DR1 and extending along the second direction DR2, the first long side surface portion on one side in the second direction DR2 and extending along the first direction DR1, and the second long side surface portion on the other side in the second direction DR2 (e.g., opposite to the first long side surface portion) and extending along the first direction DR1), the side surfaces of the first substrate 100 and the second substrate 200 can be aligned along the thickness direction (e.g., the third direction DR3), but the invention is not limited thereto.

[0059] In the following text, the polished side surface of the first substrate 100 and the polished side surface 200s of the second substrate 200 will be referred to as the first side surface of the first substrate 100 and the first side surface 200s of the second substrate 200, respectively.

[0060] The connecting line 110 can pass from the display area of ​​the first substrate 100 through the non-display area (or, for example, the upper short side surface of the first substrate 100 in the first direction DR1). However, the invention is not limited thereto; for example, the connecting line 110 can extend from the display area of ​​the first substrate 100 to the long side surface of the first substrate 100. The connecting line 110 can be electrically connected to a pixel in the display area. The connecting line 110 can extend to the first side surface of the first substrate 100 and the first side surface 200s of the second substrate 200, so that the first side surface 110s of the connecting line 110 can be aligned with the first side surface of the first substrate 100 and the first side surface 200s of the second substrate 200 in the thickness direction. In other words, the first substrate 100, the connecting line 110, and the second substrate 200 are aligned in the third direction DR3.

[0061] Similar to the first substrate 100, which includes a first side surface, the first base substrate SUB1 of the first substrate 100 may include a first side surface SUB1s. For example, the first side surface SUB1s may be a portion of the first side surface of the first substrate 100. The first side surface SUB1s of the first base substrate SUB1, the first side surface 110s of the connecting line 110, and the first side surface 200s of the second substrate 200 may be aligned with each other on the third-direction DR3.

[0062] Multiple connection lines 110 can be configured. These connection lines 110 can be spaced apart from each other in the second direction DR2. Although only four connection lines 110 are shown, five or more connection lines 110 can be configured.

[0063] The connecting wire 110 may include at least one metal such as molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W) and / or copper (Cu).

[0064] Similar to the first side surface of the first substrate 100, the connecting line 110 disposed on the first substrate 100 may include a first side surface 110s. The first side surface 110s of the connecting line 110 and the first side surface 200s of the second substrate 200 may be aligned with each other on the third-direction DR3.

[0065] Similar to the first substrate 100 which includes a first side surface, the first substrate SUB1 of the first substrate 100 may include a first side surface SUB1s. The first side surface 110s of the connecting line 110, the first side surface 200s of the second substrate 200, and the first side surface SUB1s of the first substrate SUB1 may be aligned with each other on the third direction DR3.

[0066] It can be used Figure 2The polishing apparatus 600 shown performs operation S20 of polishing a side surface SUB1s of a first substrate SUB1, a side surface 200s of a second substrate 200, and a first side surface 110s of a plurality of connecting lines 110. The polishing apparatus 600 can be disposed on a side surface SUB1s of the first substrate SUB1, a side surface 200s of the second substrate 200, and a side surface 110s of the plurality of connecting lines 110, and can polish these surfaces simultaneously while moving in one direction. The polishing apparatus 600 may include, for example, a wheel assembly. The wheel assembly may have a circular planar shape based on a plane formed by a first direction DR1 and a second direction DR2. For example, the side surface of the polishing device 600 may be parallel to the first side surface SUB1s of the first substrate SUB1, the first side surface 200s of the second substrate 200, and the first side surface 110s of the multiple connecting lines 110. A wheel device with a circular planar shape may have a central axis facing a third direction DR3 and rotate circularly to polish one side surface SUB1s of the first substrate SUB1, one side surface 200s of the second substrate 200, and the side surface 110s of the multiple connecting lines 110. For example, the central axis may extend in the third direction DR3.

[0067] The first substrate SUB1 may include a first surface SUB1a facing the second substrate 200 and a second surface SUB1b opposite to the first surface SUB1a. The second substrate 200 may include a first surface 200a facing the first substrate 100 and a second surface 200b opposite to the first surface 200a.

[0068] Then, refer to Figure 1 as well as Figures 3 to 6 The system can simultaneously perform operations such as transferring the conductive film 120a onto the polished first side surface of the first substrate 100, the polished first side surface 200s of the second substrate 200, and the polished first side surface 110s of the multiple connecting lines 110, as well as laser curing the conductive film 120a (S30). For example, the conductive film 120a can be transferred onto the polished first side surface SUB1s of the first substrate SUB1.

[0069] like Figure 3As shown, the operation of transferring the conductive film 120a onto the polished first side surface of the first substrate 100, the polished first side surface 200s of the second substrate 200, and the polished first side surface 110s of the plurality of connecting lines 110 may include arranging the conductive film 120a on the polished first side surface of the first substrate 100, the polished first side surface 200s of the second substrate 200, and the polished first side surface 110s of the plurality of connecting lines 110.

[0070] like Figure 4 As shown, the conductive film 120a may include a conductive layer 120a1 and a protective layer 120a2 disposed on the conductive layer 120a1. Before the conductive film 120a is disposed on the polished first side surface of the first substrate 100 (e.g., the polished first side surface SUB1s of the first substrate substrate SUB1), the polished first side surface 200s of the second substrate 200, and the polished first side surface 110s of the plurality of connecting lines 110, the conductive film 120a may also include a release film, which is spaced apart from the protective layer 120a2 and the conductive layer 120a1 is disposed between the release film and the protective layer 120a2. For example, the release film may be disposed on the bottom surface of the conductive layer 120a1. When the release film is placed on the polished first side surface of the first substrate 100, the polished first side surface 200s of the second substrate 200, and the polished first side surface 110s of the multiple connecting lines 110, the release film can be peeled off and removed from the conductive layer 120a1.

[0071] The conductive layer 120a1 can be disposed on the first side surface of the first substrate 100, the first side surface 200s of the second substrate 200, and the first side surface 110s of the plurality of connecting lines 110. The conductive layer 120a1 can also be directly disposed on the first side surface of the first substrate 100, the first side surface 200s of the second substrate 200, and the first side surface 110s of the plurality of connecting lines 110. As an additional example, the conductive layer 120a1 can be disposed on the first side surface SUB1s of the first substrate SUB1. The conductive layer 120a1 may include a conductive material. The conductive material may include at least one selected from silver (Ag), copper (Cu), and gold (Au). The conductive layer 120a1 according to an exemplary embodiment of the present invention may include silver.

[0072] The conductive film 120a can be formed on the entire surface of the polished first side surface of the first substrate 100, the polished first side surface 200s of the second substrate 200, and the polished first side surface 110s of the plurality of connecting lines 110. As an additional example, the conductive layer 120a1 can be formed on the polished first side surface SUB1s of the first substrate SUB1.

[0073] The protective layer 120a2 may comprise a material that can typically be used as a matrix material. The protective layer 120a2 may comprise, for example, polyethylene terephthalate (PET), but the invention is not limited thereto.

[0074] Reference Figure 5 The operation of transferring the conductive film 120a onto the polished first side surface of the first substrate 100, the polished first side surface 200s of the second substrate 200, and the polished first side surface 110s of the multiple connecting lines 110 can also include pressing the conductive film 120a after the operation of laying the conductive film 120a to form a conductive film 120b with a substantially constant thickness. Figure 6 As shown, the conductive film 120b may include a conductive layer 120a1_1 and a protective layer 120a2 disposed on the conductive layer 120a1_1.

[0075] A transparent pressing tool 700 disposed on the conductive film 120a can be used to press the conductive film 120a and form a conductive film 120b with a substantially constant thickness. The transparent pressing tool 700 can be disposed directly on the protective layer 120a2 of the conductive film 120a.

[0076] The transparent pressing tool 700 may include a transparent material such as quartz or glass. For example, the transparent pressing tool 700 may be a block made of quartz, glass, etc.

[0077] A conductive film 120a can be formed on the polished first side surface of the first substrate 100, the polished first side surface 200s of the second substrate 200, and the polished first side surface 110s of the multiple connecting lines 110, pressed downward along the first direction DR1 using a transparent pressing tool 700. The conductive layer 120a1_1 of the pressed conductive film 120b can be uniformly extended in the second direction DR2 and the third direction DR3, and has a substantially constant thickness in the first direction DR1.

[0078] In the method of manufacturing a display device according to an exemplary embodiment of the present invention, the operations of transferring the conductive film 120b onto the polished first side surface of the first substrate 100, the polished first side surface 200s of the second substrate 200, and the polished first side surface 110s of the plurality of connecting lines 110, as well as the operation of laser curing the conductive film 120a located on the polished first side surface of the first substrate 100, the polished first side surface 200s of the second substrate 200, and the polished first side surface 110s of the plurality of connecting lines 110, can be performed substantially simultaneously.

[0079] like Figure 5 As shown, the operation of laser curing conductive film 120a can be performed such that a laser beam is projected to pass through transparent pressing tool 700.

[0080] It will be understood that when the operation of transferring the conductive film 120b onto the polished first side surface of the first substrate 100, the polished first side surface 200s of the second substrate 200, and the polished first side surface 110s of the plurality of connecting lines 110 is performed, this operation is referred to as being performed substantially simultaneously with the operation of laser curing the conductive film 120a located on the polished first side surface of the first substrate 100, the polished first side surface 200s of the second substrate 200, and the polished first side surface 110s of the plurality of connecting lines 110. The operation of forming a conductive film 120a can be performed first, and then the operation of pressing the conductive film 120a formed on the polished first side surface of the first substrate 100, the polished first side surface 200s of the second substrate 200, and the polished first side surface 110s of the multiple connecting lines 110 can be performed substantially simultaneously, and the operation of laser curing the conductive film 120a located on the polished first side surface of the first substrate 100, the polished first side surface 200s of the second substrate 200, and the polished first side surface 110s of the multiple connecting lines 110 can be performed.

[0081] For example, the operation of pressing the conductive film 120a formed on the polished first side surface of the first substrate 100, the polished first side surface 200s of the second substrate 200, and the polished first side surface 110s of the multiple connecting lines 110 can be performed sequentially before or after the operation of laser curing the conductive film 120a formed on the polished first side surface of the first substrate 100, the polished first side surface 200s of the second substrate 200, and the polished first side surface 110s of the multiple connecting lines 110.

[0082] For example, it is possible to perform an operation in which a conductive film 120a formed on a polished first side surface of a first substrate 100, a polished first side surface 200s of a second substrate 200, and a polished first side surface 110s of multiple connecting lines 110 are pressed downwards along a first direction DR1 using a transparent pressing tool 700, and simultaneously the conductive film 120a is cured such that a laser beam is projected through the transparent pressing tool 700. However, when the laser beam reaches the conductive film 120a through the transparent pressing tool 700 and the transparent pressing tool 700 presses the conductive film 120a, it is also possible to perform the operation of curing the conductive film 120a in chronological order before the operation of pressing the conductive film 120a. However, even if the operations are performed in chronological order, since the operation of pressing the conductive film 120a with the transparent pressing tool 700 and the operation of curing the conductive film 120a with a laser beam that has already been effectively transmitted through the transparent pressing tool 700 are performed during the same process, the two operations are essentially performed simultaneously.

[0083] The operation of laser curing the conductive film 120a can be performed using a first laser supply device 800. The first laser supply device 800 can be a continuous wave (CW) laser supply device.

[0084] When the focus of the laser beam is positioned on the front surface of the conductive film 120a, the operation of laser curing the conductive film 120a can be performed. This front surface is the front surface (e.g., the top surface) viewed along the first direction DR1. For example, the focus position of the laser beam projected by the first laser supply device 800 can be adjusted so that the laser beam is projected onto the front surface of the conductive film 120a viewed along the first direction DR1.

[0085] Then, refer to Figure 7 The protective layer 120a2 can be peeled off and removed from one surface of the conductive layer 120a1_1. Therefore, said one surface of the conductive layer 120a1_1 can be exposed to the outside.

[0086] Then, refer to Figure 1 , Figure 8 and Figure 9 The conductive layer 120a1_1 can be patterned to form a plurality of connecting pads 120c disposed apart from each other in one direction (S40). For example, the plurality of connecting pads 120c can be spaced apart from each other along the second direction DR2.

[0087] like Figure 8 As shown, the second laser supply device 900 can be used to perform operation S40 of forming a plurality of connecting pads 120c that are separated from each other in one direction by patterning the conductive layer 120a1_1.

[0088] The second laser supply device 900 may differ from the CW laser supply device. For example, the laser beam projected by the second laser supply device 900 may have pulses generated at a constant repetition rate over a predetermined time period. For example, the second laser supply device 900 may be a short-pulse laser supply device configured to provide short-pulse lasers.

[0089] like Figure 8 As shown, due to the second laser supply device 900, the conductive layer 120a1_1 can be formed as a plurality of connecting pads 120c spaced apart from each other on the second direction DR2.

[0090] Each of the connecting pads 120c can be electrically connected to a corresponding one of the connecting lines 110 in the first direction DR1. For example, each of the connecting pads 120c can be disposed on a corresponding connecting line 110.

[0091] Reference Figure 1 as well as Figures 10 to 12 The printed circuit board (PCB) 300 can be bonded to multiple connection pads 120c (S50).

[0092] The operation S50 of bonding PCB 300 to multiple connection pads 120c may include placing PCB 300 on multiple connection pads 120c, pressing the placed PCB 300, and laser bonding PCB 300 to multiple connection pads 120c.

[0093] PCB 300 may include a substrate film 310 and multiple leads 330, each of the multiple leads 330 corresponding to and electrically connected to one of the multiple connection pads 120c. PCB 300 may also include a driver integrated circuit (IC) 390 electrically connected to the multiple leads 330.

[0094] PCB 300 can be a flexible film, such as a flexible PCB, PCB, or chip on film (COF).

[0095] The driver IC 390 can be, for example, a data driver IC, and a COF implemented as a data driver chip can be applied to the driver IC 390.

[0096] Although Figure 10 The illustration shows a case where the PCB 300 is only attached to the first side surface of the target panels 100 and 200, but the invention is not limited thereto. The PCB 300 may be disposed on at least one of the first side surface of the target panels 100 and 200 and other side surfaces of the target panels 100 and 200 (e.g., the lower short side portion on the first direction DR1, the long side portion on one side of the second direction DR2, and the long side portion on the other side of the second direction DR2).

[0097] like Figure 10 As shown, a transparent pressing tool 1000, which is set on PCB 300, can be used to perform the pressing operation on the set PCB 300. The transparent pressing tool 1000 can be used in conjunction with the above-mentioned reference... Figure 5 The described transparent pressing tool 700 is basically the same.

[0098] Reference Figure 11 An anisotropic conductive film 130 can also be provided between the lead 330 and the connecting pad 120c. For example... Figure 12 As shown, the anisotropic conductive film 130 may include a plurality of conductive balls 130b configured to electrically connect the lead 330 to the connecting pad 120c and an insulating resin 130a in which the plurality of conductive balls 130b are disposed.

[0099] The operation of pressing the PCB 300 may include pressing the anisotropic conductive film 130 by pressing the transparent pressing tool 1000 downward along the first direction DR1 and bonding and electrically connecting the leads 330 to the connecting pad 120c.

[0100] In the method of manufacturing a display device according to an exemplary embodiment of the present invention, the operation of pressing the set PCB 300 and the operation of laser bonding the set PCB 300 to the connecting pad 120c can be performed substantially simultaneously.

[0101] The laser bonding PCB 300 can be operated so that the laser beam is projected through the transparent pressing tool 1000.

[0102] Because of the laser bonding operation of PCB 300, the anisotropic conductive film 130 inserted between PCB 300 and connector pad 120c can be cured, thus bonding PCB 300 to connector pad 120c.

[0103] The operation of laser bonding PCB 300 can be performed using a third laser supply device 1100. The third laser supply device 1100 can be a CW laser supply device. The third laser supply device 1100 can have a construction that is substantially the same as that of the first laser supply device 800.

[0104] After bonding PCB 300 to connector pad 120c, as Figure 11 As shown, the PCB 300 can be bent onto another surface of the first substrate 100 (or the second surface SUB1b of the first substrate SUB1). For example, the other surface of the first substrate 100 can be opposite to the second substrate 200.

[0105] In the method for manufacturing a display device according to an exemplary embodiment of the present invention, since the conductive film 120a is laser-cured, the curing rate of the conductive film 120b (e.g., the curing rate of the conductive layer 120a1_1 of the conductive film 120b) can be higher than the curing rate when the conductive film 120a is thermally cured. When the curing rate of the conductive layer 120a1_1 is high, the resistance of the conductive layer 120a1_1 can be lower than the resistance of the conductive layer formed using a thermal curing process.

[0106] Figure 13 This table compares the process specifications between simultaneous operation of transfer conductive film and laser-cured conductive film and sequential operation of transfer conductive film and laser-cured conductive film.

[0107] Reference Figure 13 The left column shows the technical parameters of the process of laser curing the conductive film 120a after transferring the conductive film 120a, while the right column shows the technical parameters of the process of simultaneously transferring the conductive film 120a and laser curing the conductive film 120a.

[0108] To describe the left column, the transfer of conductive film 120a was performed using a hot metal tool. During the pressing with the hot metal tool, the temperature was approximately 100°C, the pressing pressure was approximately 2 kgf, and the pressing time was approximately 10 seconds. Furthermore, the conductive film 120a was cured using a laser supply device with an output of approximately 20.6 W. The output speed of the laser supply device was approximately 15 mm / s, and the process time for the curing process was approximately 4 seconds.

[0109] In the right column, the pressing pressure is 2 kgf, and the curing of the conductive film 120a is performed using a laser supply device with an output of about 35 W, and the pressing and curing time is about 5 seconds.

[0110] Compared to performing the pressing of conductive film 120a and curing of conductive film 120a separately, performing the pressing of conductive film 120a and curing of conductive film 120a simultaneously under the conditions corresponding to the right column reduces the overall process time.

[0111] In the following description, exemplary embodiments of the present invention will be described. In the embodiments below, components that are the same as those in the above embodiments may be represented by the same reference numerals, and therefore their descriptions may be omitted or simplified for brevity.

[0112] Figure 14 This is a perspective view of a process operation of a method for manufacturing a display device according to an exemplary embodiment of the present invention.

[0113] Reference Figure 14 The method of manufacturing a display device according to this exemplary embodiment and the method according to Figure 5The difference in the method of manufacturing a display device in the exemplary embodiment shown may be that a first laser supply device 800_1 is used to perform the operation of laser curing the conductive film 120a.

[0114] and Figure 5 The first laser supply device 800 is the same as the first laser supply device 800_1, which can be a CW laser supply device.

[0115] During the operation of the laser-cured conductive film 120a according to this embodiment, the focal point of the laser beam is positioned at a local area of ​​the conductive film 120a as viewed from the first direction DR1. For example, the focal point position of the laser beam projected by the first laser supply device 800_1 can be adjusted so that the laser beam is projected onto a local area of ​​the conductive film 120a. The focal point position of the laser beam of the first laser supply device 800_1 can be changed. For example, the focal point position of the laser beam of the first laser supply device 800_1 can be changed so that the laser beam is projected onto the front surface of the conductive film 120a.

[0116] The changed focal position can form a line shape based on the attached drawing, but the invention is not limited thereto.

[0117] Figure 15 This is a perspective view of a process operation of a method for manufacturing a display device according to an exemplary embodiment of the present invention.

[0118] Reference Figure 15 The method of manufacturing a display device according to this exemplary embodiment and the method according to Figure 5 The difference in the exemplary embodiment shown is that the conductive film 120b_1 extends from the first side surface SUB1s of the first substrate SUB1 to the second surface SUB1b of the first substrate SUB1. Additionally, the conductive film 120b_1 is pressed and laser-cured on the second surface SUB1b of the first substrate SUB1.

[0119] For the sake of brevity, the use of "and" can be omitted in the following text. Figure 4 and Figure 5 The descriptions in the text are essentially the same as other descriptions.

[0120] Figure 16 This is a perspective view of a process operation of a method for manufacturing a display device according to an exemplary embodiment of the present invention.

[0121] Reference Figure 16 The method of manufacturing a display device according to this exemplary embodiment and the method according to Figure 15The difference in the exemplary embodiment shown may be that a first laser supply device 800_1 is used to perform the laser curing operation of the conductive film 120b_1. For example, during the laser curing operation of the conductive film 120b_1, Figure 16 The first laser supply device 800_1 shown focuses the laser beam onto a localized area of ​​the conductive film 120b_1. (Refer to...) Figure 15 The first laser supply device 800 provides a laser beam to the surface of the conductive film 120b_1 facing the first direction DR1.

[0122] For the sake of brevity, the following text may omit the use of "and". Figure 4 , Figure 5 , Figure 14 and Figure 15 The descriptions in the text are essentially the same as other descriptions.

[0123] The manufacturing apparatus for the display device will be described below. In the exemplary embodiments of the present invention below, components that are the same as those in the above embodiments may be denoted by the same reference numerals, and their descriptions may be omitted or simplified for brevity.

[0124] Figure 17 This is a block diagram of a manufacturing apparatus for a display device according to an exemplary embodiment of the present invention, and Figure 18 This is a block diagram of a COF bonding unit according to an exemplary embodiment of the present invention.

[0125] The manufacturing apparatus 1 for a display device according to an exemplary embodiment may include a polishing unit 10 (e.g., a polishing machine), a conductive film transfer / curing unit 20, a laser patterning unit 30, and a COF bonding unit 40.

[0126] The polishing unit 10 may have the same characteristics as the above reference. Figure 2 The described polishing apparatus 600 has the same structure. The conductive film transfer / curing unit 20 may have its own... Figure 5 The transparent pressing tool 700 and the corresponding component in the first laser supply device 800 have the same components. The laser patterning unit 30 may have the same components as... Figure 8 The second laser supply device 900 has the same structure. The COF bonding unit 40 can have its own... Figure 10 The transparent pressing tool 1000 and the corresponding components in the third laser supply device 1100 are the same components.

[0127] The grinding unit 10 can grind a side surface SUB1s of the first substrate SUB1, a side surface 200s of the second substrate 200 facing the first substrate SUB1, and the side surface 110s of the multiple connecting lines 110 disposed between the first substrate SUB1 and the second substrate 200.

[0128] The conductive film transfer / curing unit 20 can simultaneously transfer and laser-cur a conductive film 120a on the polished first side surface SUB1s of the first substrate SUB1, the polished first side surface 200s of the second substrate 200 facing the first substrate SUB1, and the polished side surface 110s of the multiple connecting lines 110 disposed between the first substrate SUB1 and the second substrate 200. Here, the conductive film 120a may include a conductive layer 120a1 and a protective layer 120a2 disposed on the conductive layer 120a1.

[0129] The conductive film transfer unit 20 can be formed as a conductive film 120a pressed onto a polished first side surface SUB1s of a first substrate SUB1, a polished first side surface 200s of a second substrate 200 facing the first substrate SUB1, and polished side surfaces 110s of a plurality of connecting lines 110 disposed between the first substrate SUB1 and the second substrate 200. The conductive film transfer unit 20 may include a transparent pressing tool 700 disposed on the conductive film 120a, and the transparent pressing tool 700 may include, for example, quartz or glass.

[0130] The conductive film curing unit 20 may include a first laser supply device 800. The first laser supply device 800 may be configured to project a CW laser beam through the transparent pressing tool 700 to cure the conductive film 120a.

[0131] The laser patterning unit 30 can pattern the conductive layer 120a1 and form the connection pad 120c. The COF bonding unit 40 can bond the PCB to the connection pad 120c. The COF bonding unit 40 may include a pressing unit 43 and a laser supply unit 41. The pressing unit 43 is configured to press COF (see reference). Figure 10 In the PCB 300, the laser supply unit 41 is configured to project a laser beam through the pressing unit 43 and cure the anisotropic conductive film 130 disposed between the lead 330 and the connecting pad 120c of the PCB. The pressing unit 43 may be the same as the conductive film transfer unit 20, and the laser supply unit 41 may be the same as the conductive film curing unit 20.

[0132] The method for manufacturing a display device and the manufacturing equipment for the display device according to exemplary embodiments of the present invention can reduce the process time spent on the transfer and curing of the bonding pads.

[0133] The effects of the present invention are not limited to the examples described above, and may include a variety of other effects.

[0134] Although the present invention has been described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and detail may be made to the invention without departing from the spirit and scope thereof.

Claims

1. A method for manufacturing a display device, the method comprising: A first substrate, a second substrate, and a plurality of connecting lines are provided, wherein the first substrate has a base substrate, the second substrate faces the first substrate, and the plurality of connecting lines are disposed between the base substrate and the second substrate; Grind the side surfaces of the substrate, the second substrate, and the multiple connecting lines; Simultaneously, a conductive film is transferred and laser-cured, wherein the conductive film is transferred onto the polished side surface of the substrate, the polished side surface of the second substrate, and the polished side surface of the plurality of connecting lines, wherein the conductive film includes: a conductive layer disposed on the polished side surface of the substrate, the polished side surface of the second substrate, and the polished side surface of the plurality of connecting lines, and a protective layer disposed on the conductive layer; Peel the protective layer from one surface of the conductive layer; The conductive layer is patterned to form a plurality of connecting pads spaced apart from each other in one direction; and The printed circuit board is bonded to the plurality of connection pads via anisotropic conductive film.

2. The method according to claim 1, wherein, The transfer of the conductive film includes forming the conductive film on the polished side surface of the substrate, the polished side surface of the second substrate, and the polished side surface of the plurality of connecting lines, and pressing the conductive film.

3. The method according to claim 2, wherein, The pressing of the conductive film is performed using a transparent pressing tool disposed on the conductive film.

4. The method according to claim 3, wherein, The transparent pressing tool includes quartz or glass.

5. The method according to claim 3, wherein, The laser curing of the conductive film is performed by projecting a laser beam through the transparent pressing tool.

6. The method according to claim 5, wherein, The laser curing of the conductive film is performed using a continuous wave laser supply device.

7. The method according to claim 6, wherein, During the laser curing of the conductive film, the laser beam is focused on the front surface of the conductive film.

8. The method according to claim 6, wherein, During the laser curing of the conductive film, the laser beam is focused on a region of the conductive film, and the laser curing is performed while the focal position of the laser beam is changed.

9. A manufacturing apparatus for a display device, the manufacturing apparatus comprising: A grinding machine is configured to grind the side surface of a base plate, the side surface of a second base plate, and the side surface of a plurality of connecting lines disposed between the base plate and the second base plate. A conductive film transfer unit and a conductive film curing unit are configured to simultaneously transfer a conductive film onto the polished side surface of the substrate, the polished side surface of the second substrate, and the polished side surface of the plurality of connecting lines, and laser-cur the conductive film located on the polished side surface of the substrate, the polished side surface of the second substrate, and the polished side surface of the plurality of connecting lines, wherein the conductive film includes a conductive layer disposed on the polished side surface of the substrate, the polished side surface of the second substrate, and the polished side surface of the plurality of connecting lines, and a protective layer disposed on the conductive layer; A laser patterning unit is configured to pattern the conductive layer after a protective layer is peeled off from one surface of the conductive layer to form a plurality of connecting pads spaced apart from each other in one direction; and COF bonding units are configured to bond printed circuit boards to the plurality of bonding pads via anisotropic conductive films.

10. The manufacturing equipment according to claim 9, wherein, The conductive film is formed by the conductive film transfer unit pressing the conductive film onto the polished side surface of the substrate, the polished side surface of the second substrate, and the polished side surface of the plurality of connecting lines.

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