Separator plate assembly for electrochemical systems

CN112542595BActive Publication Date: 2026-08-21REINZ DETCHTONGUES GMBH
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Patent Information

Application Number
CN202011007932.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2019-09-23
Filing Date
2020-09-23
Publication Date
2026-08-21
Estimated Expiration
2040-09-23

AI Technical Summary

Technical Problem

[0010]然而,通过引入迄今已知类型的测量结构,所述装配误差通常不能以足够高的精度检测和/或校正

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Abstract

The present invention relates to a separator plate assembly (200) for an electrochemical system (1), comprising a first metal plate (2a) and a second metal plate (2b) in contact with each other at least in regions along their flat sides facing each other, the first metal plate (2a) comprising: a first through hole or a group of first through holes; and a first embossed structure surrounding the first through hole or the group of first through holes of the first metal plate (2a), the second metal plate (2b) comprising the first embossed structure at least partially arranged in a region of the second metal plate (2b) defined by a vertical projection of the first through hole or the group of first through holes of the first metal plate (2a) on the second metal plate (2b).
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Description

Technical Field

[0001] This document primarily relates to separator plate assemblies for use in electrochemical systems comprising a first metal plate and a second metal plate. Background Technology

[0002] Known electrochemical systems, such as fuel cell systems or electrochemical compressor systems, like electrolyzers, typically comprise stacked electrochemical cells, each separated from the others by metal separator plates. These separator plates are typically formed as bipolar plates. These separator plates or bipolar plates typically comprise two joined separate metal plates, which are typically welded together and are usually made of thin metal sheets. As a result, each separator plate or bipolar plate comprises a first metal plate and a second metal plate. The separator plates, or the separate plates forming the separator plates, can be used for, for example, electrical contact of electrodes in a single electrochemical cell (e.g., a fuel cell) and / or for electrical connection of adjacent cells (series connection of cells).

[0003] The separator plate, or the individual plate or metal plate forming the separator plate, may include channel structures configured to supply one or more media to the battery and / or remove reaction products. For example, the media may be a fuel (e.g., hydrogen or methanol), a reactant gas (e.g., air or oxygen), or a coolant. Such channel structures are typically arranged within the electrochemically active region (gas distribution structure / flow field). Furthermore, the separator plate, or the individual plate or metal plate forming the separator plate, may be configured to transfer waste heat generated during the conversion of electrical or chemical energy in the electrochemical cell, and to seal different media and / or channels to each other and / or relative to the outside. The aforementioned channel structures and / or sealing structures, specifically sealing flanges, are typically embossed into the individual plates using an embossing tool. Similar structures are also present in the separator plates of humidifiers used in electrochemical systems. The following description also applies to the separator plates of humidifiers.

[0004] It is known that one or more measuring structures are provided for each individual plate or separator plate.

[0005] These are structures formed on or on a plate and detectable by optical sensors, and pattern or image recognition software is used to establish a coordinate system aligned with the plate in a defined manner.

[0006] This coordinate system is used, for example, to measure a plate, to automatically position the plate in a tool, or to measure structures imprinted on or applied to the plate. The tool used to position the plate in a defined manner by measuring the structure can be, for example, a joining tool, a coating device, or a cutting device, specifically a stamping or laser cutting device. Some process steps can be performed at defined locations based on measurements associated with this measuring structure: for example, positioning laser welds, screen printing positioning for localized coatings, etc.

[0007] For example, a measurement structure of this type is known from the prior art DE102012002053A1, where it is referred to as a measurement feature. In a particular embodiment, the measurement feature according to DE102012002053A1 is a generally circular recess arranged in a protrusion on a plate. Such a circular recess can be easily located and its center determined using a known optical measurement system. An optical measurement system for locating this measurement structure includes, for example, a light source for illuminating the measurement structure and an image detector for recording an image of a plate having the measurement structure arranged on it, wherein the light source and camera can be arranged on the same side of the plate (reflected light method).

[0008] DE202015102771U1 relates to a metal plate for an electrochemical system, including a measurement structure integrally formed therein. The measurement structure has: at least two cuts in the plate; and a first deformable portion of the plate, arranged between and partially defined by the cuts, wherein the cutting edges of the cuts, partially spaced apart from each other by the first deformable portion, form at least two windows in the plate. Furthermore, the measurement structure has at least one second deformable portion of the plate. The plate is deformed by the second deformable portion in a region of the plate adjacent to the windows, such that the windows allow light incident on the plate to pass through perpendicularly to the flat surface of the plate. To position the measurement structure, a transmitted light processing method must be used, wherein a light source and an image detector are arranged on different sides of the plate, such that light emitted by the light source passes through the windows in the plate substantially perpendicular to the flat surface of the plate, and is detected by the image detector on the opposite side of the plate.

[0009] However, numerous additional inaccuracies can arise in the steps required to manufacture a separator plate or bipolar plate from two metal plates. Typically, at least two different tools are used during the processing of each individual separator plate, such as an embossing tool for deforming the individual plate in the region and a stamping tool for introducing through-holes into the individual plate. When an individual plate is not optimally positioned in at least one tool, this can cause the relative alignment of the embossed structure of that individual plate relative to the stamped structure of the same individual plate to deviate from the ideal relative alignment. Alternatively or additionally, when joining a first individual plate or first metal plate to a second individual plate or second metal plate, assembly errors may occur when the relative alignment of the two individual plates or metal plates to be joined in the joining tool deviates from the ideal relative alignment in the joining tool.

[0010] However, by introducing measurement structures of the types known to date, the assembly errors are often not detectable and / or corrected with sufficiently high accuracy. Furthermore, the types of measurement structures currently known may sometimes require time and / or need to be introduced into the separator plate. Summary of the Invention

[0011] Therefore, the object of the present invention is to manufacture a separator plate assembly suitable for use in an electrochemical system, comprising a first metal plate, a second metal plate, and at least one measuring structure. The measuring structure is designed to detect and / or correct as many assembly errors as possible that may occur during the manufacture of the separator plate assembly. Furthermore, the separator plate assembly including the measuring structure should be manufactured as easily and cost-effectively as possible. In addition, the present invention provides a method for manufacturing such a separator plate assembly.

[0012] This objective is achieved by the separator plate assembly for an electrochemical system according to technical solution 1 or 4 and the method for manufacturing the separator plate assembly according to technical solution 16 or 17. Detailed embodiments are described in the dependent technical solutions.

[0013] Therefore, in a first variation, a separator plate assembly for an electrochemical system is provided, comprising a first metal plate and a second metal plate, the first metal plate and the second metal plate being in contact with each other at least in a region along their flat sides facing each other, wherein the first metal plate includes: a first through-hole or a group of first through-holes; and a first imprinted structure surrounding the first through-hole or the group of first through-holes, and wherein the second metal plate further includes a first imprinted structure, the first imprinted structure being at least partially disposed in a region of the second metal plate defined by the vertical projection of the first through-hole or the group of first through-holes of the first metal plate onto the second metal plate. The first imprinted structure, the first through-hole or the group of first through-holes of the first metal plate, and the first imprinted structure of the second metal plate form a first measuring structure of the separator plate assembly.

[0014] Alternatively, in a second variation, a separator plate assembly for an electrochemical system is provided, comprising a first metal plate and a second metal plate, wherein the two metal plates are in contact with each other at least in a region along their flat sides facing each other, wherein the first metal plate includes a first embossed structure and a group of first through holes surrounding the first embossed structure, and wherein the second metal plate includes the first embossed structure, the first embossed structure being at least partially disposed in a region of the second metal plate defined by the group of first through holes of the first metal plate on the vertical projection of the first metal plate.

[0015] In both variations, the separator plate assembly described herein is largely suited to allow inaccuracies to be easily and quickly detected and corrected during the manufacturing of the separator plate assembly. For example, the arrangement and / or alignment of the first embossed structure of the first metal plate relative to the first through-hole or group of first through-holes of the first metal plate makes the offset between the embossing and stamping structures of the first metal plate visible. Similarly, the arrangement and / or alignment of the first embossed structure and / or the first through-hole or group of first through-holes of the first metal plate relative to the first embossed structure of the second metal plate makes the offset between the embossed and / or stamping structures of the first metal plate and the embossed structure of the second metal plate detectable and correctable, and more specifically, preferably already so before the first and second metal plates are joined. To identify the arrangement of the first embossed structure, the first through-hole or group of first through-holes of the first metal plate and the second embossed structure of the second metal plate, and to align the second embossed structure relative to the first embossed structure or the first through-hole or group of first through-holes of the first metal plate, known imaging and image recognition methods can be used, for example.

[0016] In both variations, the first embossed structure of the first metal plate may protrude fully or at least partially above the plane of the first plate, specifically protruding above the surface of the first metal plate opposite to the second metal plate in a direction opposite to the second metal plate and perpendicular to the plane of the first plate defined by the first metal plate. The first embossed structure of the first metal plate may include a full convex edge and / or a semi-convex edge. However, typically this type of convex edge does not have a sealing function.

[0017] In a first variation, the first embossed structure of the first metal plate may include an embossed structure that completely encloses a first through-hole or a group of first through-holes in the first metal plate. This is particularly convenient when only a single first through-hole exists in the first metal plate. The first embossed structure of the first metal plate may also include multiple substructures. These substructures may be arranged to surround the first through-hole or the group of first through-holes in the first metal plate. Then, the group of first through-holes in the first metal plate includes a through-hole surrounded by the first embossed structure or the substructures of the first embossed structure.

[0018] In a second variation, the first embossed structure of the second metal plate may include an embossed structure that completely encloses the first embossed structure of the first metal plate. The first embossed structure of the second metal plate may also include a plurality of substructures arranged to surround the first embossed structure of the first metal plate.

[0019] Apart from the area that protrudes from the plane of the plate, the first imprinted structure of the first metal plate may have a constant height, or the substructures of the first imprinted structure of the first metal plate may have the same maximum height, wherein the corresponding height is determined perpendicular to the plane of the first plate defined by the first metal plate.

[0020] The first metal plate may further include additional embossed structures. These additional embossed structures may include at least one sealing flange and / or at least one closed sealing flange for guiding a medium along the first metal plate and / or for sealing electrochemically active regions of the first metal plate. Then, a first through-hole or group of first through-holes in the first metal plate may be arranged outside the closed sealing flange of the first metal plate. The maximum height of the first embossed structure of the first metal plate may be less than the maximum height of the additional embossed structures, or less than the average height of the additional embossed structures. For example, the maximum height of the first embossed structure of the first metal plate may be less than the maximum or average height of the sealing flange embossed into the first metal plate, and more specifically, in a predetermined pressed state of the sealing flange of the first metal plate, the first embossed structure of the first metal plate itself is not pressed. Preferably, the height of the first embossed structure of the first metal plate and the height of the other embossed structure of the first metal plate, and specifically the height of the sealing protrusion of the first metal plate embossed into the first metal plate, are in each case perpendicular to the first plate plane defined by the first metal plate, and specifically determined to be perpendicular to one of the neutral fibers of the first metal plate or perpendicular to its surface.

[0021] The first embossed structure of the first metal plate can be spaced apart from the envelope surrounding the first through-hole, group of first through-holes, or group of first through-holes of the first metal plate. The distance can be varied circumferentially around the through-hole, wherein the embossed structure and the through-hole are ideally positioned relative to each other, i.e., without any offset. This is particularly true when the envelope of at least the first embossed structure of the first metal plate, or the first through-hole or group of first through-holes of the first metal plate, does not have continuous rotational symmetry. This distance is always determined at one or more points where there is a minimum distance between the edges of the embossed structure and the through-hole. Then, for example, the maximum distance between the first embossed structure of the first metal plate and at least one first through-hole of the first metal plate can be less than or equal to the maximum diameter of at least one first through-hole of the first metal plate. The maximum diameter d of the through-hole for the first through-hole or group of first through-holes of the first metal plate... max It can be applied under the following conditions: 1.0mm≤d max ≤10mm, and preferably 1.5mm≤d max ≤8mm.

[0022] The first imprinted structure of the first metal plate can be symmetrical. For example, the first imprinted structure of the first metal plate can be mirror-symmetrical with respect to a mirror plane. This mirror plane can then be located perpendicularly on the first plate plane defined by the first metal plate. The mirror plane of the first imprinted structure of the first metal plate can extend through the first through-hole or group of first through-holes in the first metal plate, and preferably through the centroid of the region defined by the envelope surrounding the first through-hole or group of first through-holes in the first metal plate.

[0023] The first embossed structure of the first metal plate may be rotationally symmetrical with respect to an axis of symmetry, wherein the axis of symmetry may be located perpendicularly on a first plate plane defined by the first metal plate. The axis of symmetry of the first embossed structure of the first metal plate may, for example, extend through a first through-hole or a group of first through-holes in the first metal plate, and preferably through the centroid of the region defined by the envelope surrounding the first through-hole or the group of first through-holes in the first metal plate.

[0024] The first embossed structure of the first metal plate may have discrete rotational symmetry with respect to its axis of symmetry, such as n-fold rotational symmetry, where n is a natural number, and where n ≥ 2, preferably n ≥ 3, and particularly preferably n ≥ 4. The first embossed structure of the first metal plate may also have continuous rotational symmetry with respect to its axis of symmetry.

[0025] Therefore, specifically, the first embossed structure of the first metal plate can be circular. However, it can also be polygonal, specifically a triangle or quadrilateral with rounded ends, and may include notches if desired. Oval, elliptical, elongated, or crescent-shaped first embossed structures are also possible. In all these shapes, depending on the mounting space, a semi-convex or solid convex cross-section may exist on one side of the first through-hole. Advantageously, a definite centroid of the first embossed structure can be determined, wherein this definite centroid lies in the orthogonal projection of the first through-hole or the envelope of the first through-hole onto the region of the second metal plate. If the first embossed structure consists of substructures, the substructures can be circular, oval, elliptical, elongated, or crescent-shaped. In a cross-sectional view, the complete convex shape typically appears on one side of a single first through-hole. Different substructures can be combined in the first embossed structure. If the first embossed structure consists of substructures, the centroids of the substructures are determined, and thus a center is formed by these centroids.

[0026] The envelope of the first through-hole edge or the group of first through-holes in the first metal plate, which defines and surrounds the first through-hole, can be symmetrical. Then, the envelope of the first through-hole edge or the group of first through-holes in the first metal plate is typically part of the first measuring structure of the separator plate assembly. For example, the envelope of the first through-hole edge or the group of first through-holes in the first metal plate can form a mirror symmetry with respect to a mirror plane, wherein the mirror plane can be perpendicularly located on the first plate plane defined by the first metal plate. The envelope of the first through-hole edge or the group of first through-holes in the first metal plate can be rotationally symmetrical with respect to an axis of symmetry, wherein the axis of symmetry can be perpendicularly located on the first plate plane defined by the first metal plate. The envelope of the first through-hole edge or the group of first through-holes in the first metal plate can have discrete rotational symmetry with respect to its axis of symmetry, such as k-fold rotational symmetry, where k is a natural number, and where k ≥ 2, preferably k ≥ 3, and particularly preferably k ≥ 4. The envelope of the first through-hole edge or the group of first through-holes in the first metal plate can also have continuous rotational symmetry with respect to its axis of symmetry.

[0027] Therefore, at least one first through-hole in the first metal plate can be circular. However, it can also be polygonal, particularly a triangle or quadrilateral with rounded ends, and may also include a notch if desired. Oval, elliptical, elongated, or crescent-shaped first through-holes are also possible. The aforementioned shapes can also be used for individual or all through-holes in a group of first through-holes, wherein it is preferred when all through-holes in the group of first through-holes have the same shape.

[0028] The axis of symmetry of the first imprinted structure of the first metal plate may coincide with the axis of symmetry of the envelope of the first through-hole edge or the group of first through-holes of the first metal plate, or the minimum distance between these axes of symmetry may be less than the maximum distance. Alternatively or additionally, the mirror plane of the first imprinted structure of the first metal plate may coincide with or intersect with the mirror plane of the envelope of the first through-hole edge or the group of first through-holes of the first metal plate, or the minimum distance between these mirror planes may be less than the maximum distance.

[0029] The first embossed structure of the second metal plate may extend along a closed line. The first embossed structure of the second metal plate may also include multiple substructures. The first embossed structure of the second metal plate may protrude completely or at least partially above the plane of the second plate defined by the second metal plate. The first embossed structure of the second metal plate may protrude completely or at least partially above the second metal plate in a direction opposite to the first metal plate and perpendicular to the plane of the second metal plate. The first embossed structure of the second metal plate may protrude completely or at least partially above the second metal plate in a direction facing the first metal plate and perpendicular to the plane of the second metal plate. When the first embossed structure of the second metal plate protrudes above the plane of the second metal plate in a direction facing the first metal plate, the first embossed structure of the second metal plate may at least protrude and / or extend through at least one through-hole or group of through-holes in the first metal plate in the region above the plane of the first metal plate defined by the first metal plate.

[0030] The second metal plate may further include a first through-hole. The first through-hole of the second metal plate is typically part of a first measuring structure of the separator plate assembly. A first embossed structure of the second metal plate may be arranged around the first through-hole of the second metal plate. If the first embossed structure of the second metal plate includes substructures, these substructures may be arranged around the first through-hole of the second metal plate. The first embossed structure of the second metal plate may enclose the first through-hole of the second metal plate. However, similarly, when the first embossed structure of the second metal plate includes substructures, one, more, or all of these substructures may include the first through-hole, i.e., the first through-hole of the second metal plate. The first embossed structure of the second metal plate may be spaced apart from the first through-hole of the second metal plate.

[0031] Apart from the area protruding from the plane of the plate, the first embossed structure of the second metal plate may have a constant height, or the substructures of the first embossed structure of the second metal plate may have the same maximum height, wherein the corresponding height is determined perpendicular to the plane of the second plate defined by the second metal plate. For example, the first embossed structure of the second metal plate may include a full convex edge and / or a semi-convex edge.

[0032] The second metal plate may further include additional embossed structures. These additional embossed structures may include at least one closed sealing flange for guiding the medium along the second metal plate and / or for sealing the electrochemically active region of the second metal plate. The first embossed structure of the second metal plate may then be disposed outside the closed sealing flange of the second metal plate. The maximum height of the first embossed structure of the second metal plate may be less than the maximum height of the additional embossed structures, or less than the average height of the additional embossed structures of the second metal plate. For example, the maximum height of the first embossed structure of the second metal plate may be less than the maximum or average height of the sealing flange embossed into the second metal plate, and more specifically, in a predetermined pressed state of the sealing flange of the second metal plate, the first embossed structure of the second metal plate itself is not pressed. Preferably, the height of the first embossed structure of the second metal plate and the height of the additional embossed structures of the second metal plate, particularly the height of the sealing flange embossed into the second metal plate, are in each case determined perpendicular to the plane of the second plate defined by the second metal plate.

[0033] The first embossed structure of the second metal plate can be symmetrical. For example, the first embossed structure of the second metal plate can be mirror-symmetrical with respect to a mirror plane, wherein the mirror plane can be perpendicularly located on the second plate plane defined by the second metal plate. The first embossed structure of the second metal plate can also be rotationally symmetrical with respect to an axis of symmetry, wherein the axis of symmetry can be perpendicularly located on the second plate plane defined by the second metal plate. The first embossed structure of the second metal plate can have discrete rotational symmetry with respect to its axis of symmetry, for example, I-fold rotational symmetry, wherein I is a natural number, and wherein I ≥ 2, preferably I ≥ 3, and particularly preferably I ≥ 4. The first embossed structure of the second metal plate can also have continuous rotational symmetry with respect to its axis of symmetry.

[0034] Therefore, specifically, the first imprinted structure of the second metal plate can be circular. However, it can also be polygonal, particularly triangular or quadrilateral with rounded ends, and may include notches if necessary. Oval, elliptical, elongated, or crescent-shaped first through-holes are also possible. If the first imprinted structure consists of substructures, the substructures can be circular, polygonal with rounded corners, oval, elliptical, elongated, or crescent-shaped.

[0035] The axis of symmetry of the envelope of the first through-hole edge or the group of first through-holes in the first metal plate may coincide with the axis of symmetry of the first imprinted structure in the second metal plate, or the minimum distance between these axes of symmetry may be less than the maximum distance. Alternatively or additionally, the mirror plane of the envelope of the first through-hole edge or the group of first through-holes in the first metal plate may coincide with or intersect with the mirror plane of the first imprinted structure in the second metal plate, or the minimum distance between these mirror planes may be less than the maximum distance.

[0036] In particular, in the case of a first embossed structure comprising a second layer of substructures, the first embossed structure or its substructures may be located only partially in the region that appears during the orthogonal projection of the first through-hole or group of first through-holes onto the second metal plate. To determine the centroid or axis(s) or plane(s) of symmetry, the envelope surrounding a portion of the substructure located in that region is considered here.

[0037] The axis of symmetry of the first imprinted structure of the first metal plate may coincide with the axis of symmetry of the first imprinted structure of the second metal plate, or the minimum distance between these axes of symmetry may be less than the maximum distance. Alternatively or additionally, the mirror plane of the first imprinted structure of the first metal plate may coincide with or intersect the mirror plane of the first imprinted structure of the second metal plate, or the minimum distance between these mirror planes may be less than the maximum distance.

[0038] The edge of the first through-hole of the second metal plate defining and surrounding the first through-hole can be symmetrical. The edge of the first through-hole of the second metal plate is typically part of the first measuring structure of the separator plate assembly. For example, the edge of the first through-hole of the second metal plate can be mirror-symmetrical with respect to a mirror plane, wherein the mirror plane can be perpendicularly located on the second plate plane defined by the second metal plate. The first imprinted structure of the second metal plate can also be rotationally symmetrical with respect to an axis of symmetry, wherein the axis of symmetry can be perpendicularly located on the second plate plane defined by the second metal plate. The edge of the first through-hole of the second metal plate can have discrete rotational symmetry with respect to its axis of symmetry, for example, m-fold rotational symmetry, where m is a natural number, and where m ≥ 2, preferably m ≥ 3, and particularly preferably m ≥ 4. The edge of the first through-hole of the second metal plate can also have continuous rotational symmetry with respect to its axis of symmetry.

[0039] The axis of symmetry of the edge of the first through hole in the second metal plate may coincide with the axis of symmetry of the first imprinted structure of the second metal plate, or the minimum distance between these axes of symmetry may be less than the maximum distance. Alternatively or additionally, the mirror plane of the edge of the first through hole in the second metal plate may coincide with or intersect with the mirror plane of the first imprinted structure of the second metal plate, or the minimum distance between these mirror planes may be less than the maximum distance.

[0040] For the maximum diameter d of the first through hole in the second metal plate max It can be applied under the following conditions: 0.5mm≤d max ≤5mm. In this process, the first through-hole is smaller than the first imprinted structure of the second metal plate. The first through-hole of the second metal plate can be circular, which is particularly suitable for a maximum diameter d. max ≤1.0mm.

[0041] The first metal plate and the second metal plate can be connected to each other, preferably integrally connected. The first metal plate and the second metal plate can be welded to each other, preferably connected by one or more laser welding methods.

[0042] Additionally, the first metal plate may include: a second through-hole or a group of second through-holes; and a second embossing structure surrounding the second through-hole or the group of second through-holes of the first metal plate, and the second metal plate may include the second embossing structure disposed in the region of the second metal plate defined by the vertical projection of the second through-hole or the group of second through-holes of the first metal plate onto the second metal plate. Alternatively, the first metal plate may additionally include the second embossing structure and a group of second through-holes surrounding the second embossing structure, and the second metal plate may include the second embossing structure disposed in the region of the second metal plate defined by the vertical projection of the group of second through-holes of the first metal plate onto the second metal plate.

[0043] The second embossed structure of the first metal plate and the second through-hole or group of second through-holes together form the second measuring structure of the separator plate assembly. The second metal plate may further include a second through-hole, wherein the second embossed structure of the second metal plate may be arranged around the second through-hole of the second metal plate. The second through-hole of the second metal plate is generally part of the second measuring structure of the separator plate assembly. The second measuring structure of the separator plate assembly may be formed correspondingly to the first measuring structure of the separator plate assembly.

[0044] A first method for manufacturing a separator plate assembly for an electrochemical system, and preferably for manufacturing a separator plate assembly as described above, may include the following steps:

[0045] A first through hole or a group of first through holes is punched out from a first metal plate using a first tool;

[0046] The first embossing structure is embossed onto the first metal plate using a second tool.

[0047] Wherein, the first imprinting structure surrounds the first through hole or a group of first through holes, or the group of first through holes surrounds the first imprinting structure.

[0048] The first embossing structure is embossed onto the second metal plate in the third tool; and

[0049] The first metal plate and the second metal plate are positioned on top of each other such that the first metal plate and the second metal plate are in contact with each other at least in the region along their flat sides facing each other, and the first embossed structure of the second metal plate is arranged in the region of the second metal plate defined by the vertical projection of the first through hole or group of first through holes of the first metal plate onto the second metal plate.

[0050] The method may also include the following steps:

[0051] The distance between a first reference point and a second reference point is detected non-contactly, wherein the first reference point is determined based on a first imprinted structure of a first metal plate, and wherein the second reference point is determined based on a first imprinted structure of a second metal plate; and

[0052] When the deviation of the previously detected distance is not greater than the maximum distance, the first metal plate is connected to the second metal plate.

[0053] The method may also include the following steps:

[0054] When the deviation between the previously detected first reference point and the second reference point exceeds the maximum distance, the relative arrangement of the first and second metal plates is changed to reduce the distance between the first and second reference points. Preferably, the relative arrangement of the first and second metal plates is changed such that the distance between the first and second reference points is less than the maximum distance after the relative arrangement has been changed.

[0055] In the first method and alternative methods, non-contact detection of the distance between the first reference point and the second reference point may include: illuminating a first imprinted structure of a first metal plate and a second imprinted structure of a second metal plate with illumination light emitted by a light source; and detecting the illumination light reflected or scattered at the first imprinted structure of the first metal plate and at the first imprinted structure of the second metal plate using a detection device. The light source and the detection device may be arranged on the side of the metal plates positioned on top of each other, opposite to the second metal plate, such that the illumination light passes through a first through-hole or a group of first through-holes in the first metal plate and illuminates the first imprinted structure of the second metal plate.

[0056] In the first method and the alternative method, determining the first reference point may include determining a first position of the plane of symmetry or axis of symmetry of the first imprinted structure of the first metal plate, and determining the second reference point may include determining a second position of the plane of symmetry or axis of symmetry of the first imprinted structure of the second metal plate. Then, determining the distance between the first reference point and the second reference point may include determining the distance between the first position and the second position.

[0057] An alternative method for manufacturing a separator plate assembly for an electrochemical system, and preferably for manufacturing a separator plate assembly as described above, may include the following steps:

[0058] Cut from the first metal plate in the first tool, and specifically punch out the first through hole or a group of first through holes and the second through hole or a group of second through holes;

[0059] The first and second embossing structures are pressed into the first metal plate using a second tool.

[0060] Wherein, the first imprinting structure surrounds the first through hole or a group of first through holes, or the group of first through holes surrounds the first imprinting structure, and

[0061] The second imprint structure surrounds the second through hole or a group of second through holes, or a group of second through holes surrounds the second imprint structure, and

[0062] In the third tool, the first and second embossing structures are embossed onto the second metal plate, and

[0063] The first metal plate and the second metal plate are positioned on top of each other such that the first metal plate and the second metal plate are in contact with each other at least in the region along their flat sides facing each other, and a first embossed structure of the second metal plate is arranged in the region of the second metal plate defined by the vertical projection of the first through hole or group of first through holes of the first metal plate onto the second metal plate, and a second embossed structure of the second metal plate is arranged in the region of the second metal plate defined by the vertical projection of the second through hole or group of second through holes of the first metal plate onto the second metal plate.

[0064] Alternative methods may also include the following steps:

[0065] The distance between a first reference point and a second reference point is detected non-contactly, wherein the first reference point is determined based on a first imprint structure of a first metal plate, and wherein the second reference point is determined based on a first imprint structure of a second metal plate.

[0066] The distance between a third reference point and a fourth reference point is detected non-contactly, wherein the third reference point is determined based on a second imprinted structure of a first metal plate, and wherein the fourth reference point is determined based on a second imprinted structure of a second metal plate; and

[0067] When the deviation of the previously detected distance is not greater than the maximum distance, and the deviation of the previously detected distance between the third reference point and the fourth reference point is not greater than the maximum distance, the first metal plate is connected to the second metal plate.

[0068] Alternative methods may also include the following steps:

[0069] When the deviation between the previously detected first reference point and the second reference point is greater than the maximum distance, and / or

[0070] When the deviation between the previously detected distances between the third and fourth reference points exceeds the maximum distance, the relative arrangement of the first and second metal plates is changed so that the distance between the first and second reference points decreases and / or the distance between the third and fourth reference points decreases. In this process, preferably, the relative arrangement of the first and second metal plates is changed so that both the distance between the first and second reference points after the relative arrangement change, and the distance between the third and fourth reference points after the relative arrangement change, are less than the maximum distance.

[0071] Non-contact detection of the distance between the third reference point and the fourth reference point may include: illuminating the second imprinted structure of the first metal plate and the second imprinted structure of the second metal plate with illumination light emitted by a light source; and detecting the illumination light reflected or scattered at the second imprinted structure of the first metal plate and at the second imprinted structure of the second metal plate. The light source and the detection device may be arranged on the side of the metal plates positioned on top of each other, opposite to the second metal plate, such that the illumination light passes through the second through-hole or group of second through-holes in the first metal plate and illuminates the second imprinted structure of the second metal plate.

[0072] Determining the third reference point may include determining a third position of the plane of symmetry or axis of symmetry of the second imprinted structure of the first metal plate, and determining the fourth reference point may include determining a fourth position of the plane of symmetry or axis of symmetry of the second imprinted structure of the second metal plate. Then, determining the distance between the third and fourth reference points may include determining the distance between the third and fourth positions.

[0073] The first through-hole or a group of first through-holes is stamped into the first metal plate, and if necessary, the second through-hole or a group of second through-holes is preferably stamped into the first metal plate using the same tool, and specifically in the same stamping step as the stamping of at least one additional through-hole and / or its outer edge into the first metal plate. In this way, misalignment between at least one through-hole of the measuring structure and at least one additional through-hole and / or its outer edge is avoided.

[0074] The first imprinting structure of the first metal plate is imprinted, and if necessary, the imprinting of the second imprinting structure of the first metal plate is preferably performed in the same tool, and specifically in the same imprinting step as the imprinting of at least one other imprinting structure (e.g., the channel of the gas distribution structure of the first metal plate). In this way, the first imprinting structure of the measuring structure is avoided, and if necessary, the second imprinting structure of the measuring structure is offset from at least one other imprinting structure of the first metal plate.

[0075] The first imprinted structure of the second metal plate is imprinted, and if necessary, the second imprinted structure of the second metal plate is preferably imprinted in the same tool, and specifically in the same imprinting step as the imprinting of at least one other imprinted structure (e.g., the channel of the gas distribution structure of the second metal plate). In this way, the first imprinted structure of the measuring structure is avoided, and if necessary, the second imprinted structure of the measuring structure is offset from at least one other imprinted structure of the second metal plate.

[0076] A first through-hole is punched into the second metal plate, and if necessary, a second through-hole is preferably punched into the second metal plate using the same tool, and specifically in the same punching step as that used for punching out at least one additional through-hole and / or its outer edge in the second metal plate. In this way, misalignment between at least one through-hole in the measuring structure and at least one additional through-hole and / or its outer edge is avoided.

[0077] The accompanying drawings illustrate an embodiment of an electrochemical system including a separator plate assembly of the type described herein, and will be described in more detail based on the following description. In the drawings:

[0078] Figure 1 A schematic three-dimensional view of an electrochemical system is shown, including multiple separator plates or bipolar plates arranged in a stacked manner.

[0079] Figure 2 It schematically shows the following based on Figure 1 A perspective view of the system with two separator plates, including the membrane electrode assembly (MEA) arranged between the separator plates;

[0080] Figure 3 It schematically shows the arrangement based on Figure 1 The system's cross-section is traversed through the system's stacked plates.

[0081] Figure 4A A top view of a separator plate including two measuring structures according to a first embodiment is schematically shown;

[0082] Figure 4B schematically shown Figure 4AA detailed view of a measurement structure;

[0083] Figure 4C A sectional view schematically shows Figure 4B The measurement structure in the middle;

[0084] Figures 5 to 9 Another embodiment of the measuring structure is schematically illustrated, each embodiment shown in cross-sectional view;

[0085] Figure 10 A sectional view schematically shows Figure 4C The measuring structure and sealing convex edge in the middle;

[0086] Figures 11 to 13 Another embodiment of the measuring structure is schematically illustrated, each embodiment being shown in a top view;

[0087] Figure 14A A schematic top view of a separator plate including a measuring structure according to another embodiment is shown;

[0088] Figure 14B A sectional view schematically shows Figure 14A The measurement structure in the middle;

[0089] Figures 15 to 19 Another embodiment of the measuring structure is schematically illustrated, each embodiment shown in a top view; and

[0090] Figures 20 to 21 A flowchart of a method for manufacturing a separator plate assembly according to the present invention is shown. Detailed Implementation

[0091] Figure 1 An electrochemical system 1 is shown, comprising a plurality of identical metal separator plates or bipolar plates 2 arranged in a stacked configuration along a z-direction 7. The stacked separator plates 2 are sandwiched between two end plates 3, 4. The z-direction 7 is also referred to as the stacking direction. In this example, system 1 is a fuel cell stack. Thus, in each case, two adjacent stacked separator plates 2 enclose an electrochemical cell between them, which is used, for example, to convert chemical energy into electrical energy. To form the electrochemical cell of system 1, corresponding membrane electrode assemblies (MEAs) are arranged between adjacent stacked separator plates 2 (e.g., see...). Figure 2 MEAs typically contain at least one membrane, such as an electrolyte membrane. Additionally, a gas diffusion layer (GDL) may be disposed on one or both surfaces of the MEA.

[0092] In alternative embodiments, system 1 can also be designed as an electrolyzer, an electrochemical compressor, or a redox flow battery. Separator plates can also be used in these electrochemical systems. The composition of these separator plates can then correspond to the composition of separator plate 2, as explained in more detail herein, even though the medium guiding onto or through the separator plates may differ from that used in fuel cell systems, whether in the case of an electrolyzer, an electrochemical compressor, or a redox flow battery. This also applies to separator plates, particularly those in humidifiers.

[0093] The z-axis 7, together with the x-axis 8 and y-axis 9, forms a right-handed Cartesian coordinate system. In each case, the separator plate 2 defines a plate plane, wherein the plate plane of the separator plate is parallel to the xy plane and therefore perpendicular to the stacking direction or the z-axis 7. The end plate 4 has a plurality of media connections 5 through which media can be supplied to and discharged from the system 1. These media that can be supplied to and discharged from the system 1 may include, for example, fuels such as molecular hydrogen or methanol, reaction gases such as air or oxygen, reaction products such as water vapor, or waste fuels or coolants such as water and / or ethylene glycol.

[0094] Figure 2 It shows Figure 1 A perspective view of two adjacent separator plates or bipolar plates 2 of an electrochemical system of type 1, and a membrane electrode assembly (MEA) 10 arranged between these adjacent separator plates 2 as known in the prior art, wherein, Figure 2 MEA10 is largely hidden by the separator plate 2 facing the observer. Repeated features are indicated by the same reference numerals in different figures, both here and below. The separator plate 2 consists of two integrally joined separate plates 2a, 2b (see, for example, see...). Figure 3 ) is formed, in which the first separate plate 2a, which faces only the observer, is in Figure 2 As can be seen, plate 2a conceals a second separate plate 2b. The separate plates 2a and 2b can be made of metal plates such as stainless steel. For example, the separate plates 2a and 2b can be welded together by laser welding.

[0095] Individual plates 2a and 2b have mutually aligned through holes, which form through openings 11a to 11c in separator plate 2. When multiple separator plates of the same type as separator plate 2 are stacked, the through openings 11a to 11c form conduits extending along the stacking direction 7 through the stacked components 2 (see...). Figure 1Typically, each conduit formed by through openings 11A to 11C is fluidly connected to one port 5 of the end plate 4 of system 1. For example, coolant can be introduced into or removed from the stack via the conduit formed by through opening 11a. Conversely, conduits formed by through openings 11b and 11c can be configured to supply fuel and reaction gases to the electrochemical cells of the fuel cell stack of system 1 and to remove reaction products from the stack.

[0096] To seal the through openings 11a-c relative to the interior of the stack 2 and relative to the surrounding environment, the first individual plate 2a includes a sealing system in the form of sealing beads 12-c, each arranged to surround and completely seal the through openings 11a-c. This sealing system is located opposite to the separator plate 2. Figure 2 On the observer's rear side, the second separate plate 2b includes a suitable sealing flange (not shown) for sealing the through openings 11a-c.

[0097] In the electrochemically active region 18, the first individual plate 2a is on its facing side Figure 2 The observer's front side includes a flow field 17, which comprises structures for guiding the reaction medium along the front side of a separate plate 2a. These structures are... Figure 2 The separator is provided by multiple webs and channels extending between the webs and defined by the webs. Furthermore, in the direction of separator plate 2... Figure 2 On the observer's front side, the first individual plate 2a also includes a distribution or collection area 20. The distribution or collection area 20 includes a structure configured to distribute and / or collect or gather media flowing from the active region 18 through the first of the two through openings 11b towards the second through opening 11b. Similarly, Figure 2 The distribution structure of the distribution or collection area 20 is provided by the web and the channels extending between the webs and defined by the web. Figure 2 The corresponding transition region 21, aligned parallel to the y-direction 9, is located at the transition between the distribution region 20 of the active region 18 and the flow field 17, on both sides of the flow field 17. In the transition region 21, for example, compared to adjacent regions 18, 20, the medium-guided structure in each case has a reduced height (see...). Figure 3 ).

[0098] Furthermore, the first individual plate 2a also includes another sealing system in the form of a circumferential flange 12d, which extends around the flow field 17 of the active region 18, the distribution or collection region 20, and the through openings 11b, 11c, and seals them relative to the through opening 11a, i.e., relative to the coolant circuit and relative to the surrounding environment of system 1. In each case, the second individual plate 2b includes a corresponding circumferential flange. The structure of the active region 18, the distribution structure of the distribution or collection region 20, and the sealing flanges 12a-d are integrally formed with the individual plate 2a, and are formed integrally with the individual plate 2a, for example, during an embossing or deep drawing process. The same applies to the sealing flange and the corresponding distribution structure of the second individual plate 2b. Outside the region surrounded by the circumferential flange 12d, a predominantly unstructured outer edge region 22 is generated in each individual plate 2a, 2b.

[0099] The pipes formed by the two through openings 11b or by the through openings 11b formed by the stack of plates passing through system 1 are respectively connected via the channel 13b in the sealing flange 12b, via the distribution structure of the distribution or collection area 20, and via the facing Figure 2 The flow field 17 in the active area 18 of the first individual plate 2a of the observer is fluidly connected to each other. Similarly, the pipes formed by the two through openings 11c or by the through openings 11c formed by the stack of plates through the system 1 are respectively connected via corresponding convex edge channels, via corresponding distribution structures, and via opposite directions. Figure 2 The observers are fluidly connected to each other via corresponding flow fields on the outer sides of the second individual plate 2b. Conversely, for example, through openings 11a or pipes formed by through openings 11a of the stack of plates through system 1 are fluidly connected to each other via cavities 19 enclosed or surrounded by individual plates 2a, 2b. The cavities 19 are used to guide coolant through the separator plates 2 and specifically to cool the electrochemically active regions 18 of the separator plates 2.

[0100] Figure 3 Schematic illustration of crossing Figure 1 A cross-sectional view of the plate stack of system 1, wherein the cutting plane is oriented along the z-direction and is therefore perpendicular to the plate plane of separator plate 2; for example, the cutting plane may be along... Figure 2The curved section AA extends in the middle. The stacked identical separator plates 2 respectively include a first metal separate plate 2a as described above and a second metal separate plate 2b as described above. Furthermore, an active region 18, a transition region 21, and a distribution or collection region 20 of the separator plates 2 are identified, wherein regions 18, 21, and 20 each include structures that guide the medium along the outer surface of the separator plates 2; specifically, each of these structures takes the form of a web and channels defined by the web. In the active region 18, channels 29 are shown on the surfaces of adjacent, oppositely spaced individual plates 2a and 2b, and cooling channels 19 between adjacent individual plates 2a and 2b. Similar to channels 29”, 19’ in distribution or collection area 20, channels 29’, 19’ are similarly highlighted in transition area 21. Between cooling channels 19, 19’, 19”, two separate plates 2a, 2b are positioned on top of each other in contact area 24 and are joined together there, in this example, by laser weld seam 23.

[0101] Prior art, corresponding membrane electrode assemblies (MEAs) 10 are arranged between stacked adjacent separator plates 2. Each MEA 10 includes: a membrane 14, such as an electrolyte membrane; and an edge segment 15 connected to the membrane 14, which is composed of two edge seals 15a, 15b. For example, the edge segment 15 or the edge seals 15a, 15b can be integrally bonded to the membrane 14 by, for example, adhesive or lamination. The edge segment 15 is formed of a thin film material, for example, a thermoplastic thin film material or a thermosetting thin film material.

[0102] In each case, the membrane 14 of MEA10 extends at least within the active region 18 of the adjacent separator plate 2, in which proton transfer can occur via or through the membrane 14. Furthermore, the membrane 14 extends at least partially into the transition region 21, but not into the distribution or collection region 20. In each case, the edge segment 15 of MEA10 is used for positioning, attaching, and sealing the membrane 14 between adjacent separator plates 2. When the separator plates 2 of system 1 are clamped between end plates 3 and 4 in the stacking direction (see...), Figure 1 For example, the edge segment 15 of MEA10 can be pressed between the sealing protrusions 12a to d of the corresponding adjacent separator plates 2 and / or at least between the circumferential protrusions 12d of the adjacent separator plates 2, thereby fixing the membrane 14 between the adjacent separator plates 2 in this way.

[0103] Edge segment 15 covers the corresponding distribution or collection area 20 of the adjacent separator plate 2. Additionally, as... Figure 3As shown, the edge segment 15 can also completely or at least partially cover the transition region 21 of the adjacent separator plate 2, or completely or at least partially extend into the transition region 21 of the adjacent separator plate 2 (see Figure 2 ). The edge segment 15 can also extend outwardly beyond the circumferential bead 12d, where the edge segment 15 can abut the outer edge regions 22 of the individual plates 2a, 2b.

[0104] Additionally, as Figure 3 shown, the gas diffusion layer 16 can be arranged in the active region 18. The gas diffusion layer 16 allows the incident flow on the membrane 14 to pass through as large an area as possible of the surface of the membrane 14, and thus can improve proton transfer via the membrane 14. For example, the gas diffusion layer 16 can be arranged on both sides of the membrane 14 in the active region 18 between the adjacent separator plates 2. The gas diffusion layer 16 can be formed, for example, of a non-woven fiber web or include a non-woven fiber web.

[0105] In Figure 3 the part of the exemplary embodiment shown, the two metal plates 2a, 2b are optimally positioned on top of each other. This enables the end faces 27a, 27b of the active region 18 to contact as much as possible, making the welding particularly easy and permanently stable. Additionally, this results in an ideal shape of the cooling channels 19, thus achieving optimal cooling. If the end faces 27a, 27b move relative to each other, this will make the welding more difficult and the flow of the coolant will be different, resulting in only insufficient cooling.

[0106] Figure 4A A top view on the separator plate 200 is shown, where the viewing direction is oriented along the negative z-direction 7. The separator plate 200 according to Figure 4A can have all the features of the separator plate 2 according to Figure 1 and Figure 2 . As previously mentioned, repeated features are labeled with the same reference numerals. Similar to the separator plate 2 according to Figure 1 and Figure 2 , the separator plate 200 according to Figure 4A thus includes two separate plates or metal plates 2a, 2b. The separate plates or metal plates 2a, 2b contact each other along their flat sides facing each other and are connected to each other along their flat sides facing each other. The metal plates 2a, 2b of the separator plate 200 are preferably integrally joined to each other by one or more welding connections (e.g., by one or more laser welding connections). And corresponding to the separator plate 2 according to Figure 1 and Figure 2 , the separator plate 2 according to Figure 4AThe separator plate 200 may include through openings 11a to c, a convex edge system 12a to d, an electrochemically active region 18, a distribution or collection region 20, a transition region 21 arranged between regions 18 and 20, and an outer edge region 22.

[0107] according to Figure 4A The separator plate 200 and according to Figure 1 and Figure 2 The difference of separator plate 2 is that, according to Figure 4A The separator plate 200 includes two measuring structures 400a and 400b.

[0108] According to Figure 4A In one embodiment of the separator plate 200, two measuring structures 400a and 400b are arranged in two corner regions of the generally rectangular separator plate 200, which is positioned diagonally opposite to each other. In an alternative embodiment, the measuring structures may of course be arranged in other regions of the outer edge region 22 of the separator plate 200 or the metal plates 2a and 2b. Naturally, in an alternative embodiment, the separator plate 200 may also include two or more measuring structures, for example, three, four, or more.

[0109] Figure 4B A top view shows the results according to Figure 4A A detailed illustration of the measuring structure 400a of the separator plate 200, wherein, with Figure 4A Similarly, the observation direction is oriented along the negative z-direction 7. And... Figure 4C It shows crossing Figure 4A and Figure 4B A cross-sectional view of the measuring structure 400a, wherein the cutting plane is oriented along the yz plane and is therefore parallel to the z-direction or stacking direction 7. (For emphasis) Figure 4B and Figure 4C Corresponding structures in the middle, these structures are at least partially transmitted through Figure 4B and Figure 4C The dotted lines in the diagram are connected to each other. According to... Figures 4A to 4C In the separator plate 200, measuring structures 400a and 400b are formed identically, such that the construction of measuring structure 400a described below is also applied by way of example to the construction of measuring structure 400b. However, in alternative embodiments, the same separator plate 200 may also include measuring structures formed differently. In further reference numerals in the figures, the distinguishing letters a and b are generally not used. However, in the following text, when comparisons or relationships between the two measuring structures 400a and 400b are involved, other elements are used with these two additional distinguishing letters. The names 2a and 2b of the two metal plates are irrelevant here.

[0110] according to Figures 4A to 4CThe measuring structure 400a includes: a through hole 431 in a first metal plate 2a; an embossing structure 432 surrounding the through hole 431 and embossed into the first metal plate 2a; a through hole 433 in a second metal plate 2b; and an embossing structure 434 surrounding the through hole 433 in the second metal plate 2b and embossed into the second metal plate 2b. The through hole 431 in the first metal plate 2a is surrounded and defined by an edge 435 of the through hole in the first metal plate, while the through hole 433 in the second metal plate 2b is surrounded and defined by an edge 436 of the through hole in the second metal plate 2b.

[0111] The through-hole 433 and the embossing structure 434 of the second metal plate 2b are arranged in a region 437 of the second metal plate 2b, which is defined by the vertical projection of the through-hole 431 of the first metal plate 2a, or by the vertical projection of the through-hole edge 435 surrounding the through-hole 431 of the first metal plate 2a onto the second metal plate 2b. In this way, light that is perpendicularly incident on the second metal plate 2b through the through-hole 431 of the first metal plate 2a can irradiate the embossing structure 434 and the through-hole 433 of the second metal plate 2b, or the through-hole edge 436 surrounding the through-hole 433 of the second metal plate 2b, and the embossing structure 434 and the through-hole edge 436 can reflect or scatter the light.

[0112] For example, the aforementioned vertical projection on the second metal plate 2b is a projection perpendicular to the plate plane 440 of the second metal plate 2b. The plate plane 440 of the second metal plate 2b is defined, for example, by the non-embossed areas of the second metal plate 2b, specifically by those non-embossed areas of the second metal plate 2b adjacent to the embossed structure 434 on the side of the embossed structure 434 facing away from the through hole 433. Correspondingly, the plate plane 439 of the first metal plate 2a can be defined by the non-embossed areas of the first metal plate 2a, for example, by those non-embossed areas of the first metal plate 2a adjacent to the embossed structure 432 on the side of the embossed structure 432 facing away from the through hole 431. Figures 4A to 4C In the exemplary embodiment of the separator plate 200 shown, the plate plane 439 of the first metal plate 2a and the plate plane 440 of the second metal plate 2b are respectively aligned parallel to the xy plane, and they can extend into the neutral fiber of the respective plate or onto one of its surfaces. Therefore, in Figure 4C In the process, the vertical projection of the through hole 431 of the first metal plate 2a or the through hole edge 435 of the first metal plate 2a surrounding the through hole 431 onto the second metal plate 2b occurs along the z-direction or the stacking direction 7.

[0113] Preferably, the embossing structure 432 of the first metal plate 2b is embossed into the first metal plate 2a together with another embossing structure of the first metal plate 2b in one and the same embossing tool. For example, the other embossing structure of the first metal plate 2a may include one or more sealing protrusions 12a to d, and / or the medium guiding structure may include one or more of regions 18, 20, 21 of the first metal plate 2a. Therefore, preferably, the through hole 431 of the first metal plate 2a is introduced into the first metal plate 2a together with another stamping or cutting structure of the first metal plate 2a in one and the same stamping or cutting tool, or stamped out of the first metal plate 2a. For example, the other stamping or cutting structure of the first metal plate 2a may include one or more through openings 11a to c of the first metal plate 2a. Thus, the offset between the center of the embossing structure 432 and the center of the through hole 431 of the first metal plate 2a is also a measurement of the offset between the other embossing structure and the other stamping or cutting structure of the first metal plate 2a.

[0114] Preferably, the embossed structure 434 of the second metal plate 2b is embossed into the second metal plate 2b together with another embossed structure of the second metal plate 2b in one and the same embossing tool. The other embossed structure of the second metal plate 2b may, for example, include one or more sealing flanges and / or media guiding structures of the second metal plate 2b, such as media guiding structures in the electrochemically active region, distribution or collection region, or transition region of the second metal plate 2b similar to regions 18, 20, 21 of the first metal plate 2a. Therefore, preferably, the through-hole 433 of the second metal plate 2b is introduced into the second metal plate 2b or stamped out from the second metal plate 2b together with another stamping or cutting structure of the second metal plate 2b in one and the same stamping or cutting tool. The other stamping or cutting structure of the second metal plate 2b may, for example, include one or more through openings of the second metal plate 2b, such as through openings 11a-c of the first metal plate 2a. Therefore, the offset between the center of the embossing structure 434 and the center of the through hole 433 of the second metal plate 2b is also a measurement of the offset between the other embossing structure and the other stamping or cutting structure of the second metal plate 2b.

[0115] When the first metal plate 2a is joined to the second metal plate 2b, the offset between the center of the embossed structure 432 of the first metal plate 2a and the center of the embossed structure 434 of the second metal plate 2b is also a measurement of the offset between another embossed structure of the first metal plate 2a and another embossed structure of the second metal plate 2b. Furthermore, when the first metal plate 2a is joined to the second metal plate 2b, the offset between the center of the through hole 431 of the first metal plate 2a and the center of the through hole 433 of the second metal plate 2b is also a measurement of the offset between another stamping or cutting structure of the first metal plate 2a and another stamping or cutting structure of the second metal plate 2b.

[0116] A method for manufacturing including according to Figures 4A to 4C The method for measuring the separator plate 200 of the 400A and 400b structures can also be found in... Figure 20 It is concluded that the method may include some or all of the following steps, for example:

[0117] A first through hole 431 is punched out from the first metal plate 2a in the first stamping tool (S31);

[0118] The first imprinting structure 432 of the first metal plate 2a is imprinted (P32) in the first imprinting tool;

[0119] A first through hole 433 is punched out from the second metal plate 2b in the second stamping tool (S33); and

[0120] The first embossing structure 434 is embossed (P34) onto the second metal plate 2b in the second embossing tool.

[0121] Usually, such as Figure 21 As shown, the corresponding structure of the same measuring structure 400b is also introduced into the first metal plate 2a and the second metal plate 2b in a corresponding manner, while performing the aforementioned steps.

[0122] In the first stamping tool, a first through hole 431a and a second through hole 431b are stamped out from the first metal plate 2a (S31a+b);

[0123] The first imprinting structure 432a and the second imprinting structure 432b of the first metal plate 2a are imprinted in the first imprinting tool (P32a+b);

[0124] In the second stamping tool, a first through hole 433a and a second through hole 433b are stamped from the second metal plate 2b (S33a+b); and

[0125] The first imprinting structure 434a and the second imprinting structure 434b are imprinted (P34) onto the second metal plate 2b in the second imprinting tool.

[0126] Subsequently, the first metal plate 2a and the second metal plate 2b are positioned (P) on top of each other such that the first metal plate 2a and the second metal plate 2b are in contact with each other at least in the region along their flat sides facing each other, and the measuring structures 400a, 400b as described above are formed. Therefore, in order to form the first measuring structure 400a, a first imprint structure 434 of the second metal plate 2b is arranged in the region 437 of the second metal plate 2b defined by the vertical projection of the through hole 433 of the first metal plate 2a onto the second metal plate 2b. The procedure for forming the second measuring structure 400b can be similar.

[0127] Preferably, the aforementioned additional stamping structure of the first metal plate 2a is also stamped out from the first metal plate 2a in the first stamping tool. Preferably, the aforementioned additional stamping structure of the second metal plate 2b is also stamped out from the second metal plate 2b in the second stamping tool. Preferably, the aforementioned additional embossing structure of the first metal plate 2a is also embossed into the first metal plate 2a in the first stamping tool using the same embossing steps as the first embossing structure 432 of the first metal plate 2a. And preferably, the aforementioned additional embossing structure of the second metal plate 2b is also embossed into the second metal plate 2b in the second stamping tool using the same embossing steps as the first embossing structure 434 of the second metal plate 2b.

[0128] Used to manufacture according to Figures 4A to 4C The method for the separator plate 200 may include non-contactly detecting (T) the distance between a first reference point and a second reference point, and between a third reference point and a fourth reference point. The aforementioned exemplary reference points are the centers of the aforementioned embossed structure and through-holes.

[0129] A first reference point is determined using a first measuring structure 400a, for example based on an embossed structure 432 and / or based on the through-hole edge 435 of the first metal plate 2a, and a second reference point is determined, for example based on an embossed structure 434 and / or based on the through-hole edge 436 of the second metal plate 2b. Similarly, a third and fourth reference point can be determined using the corresponding embossed structures and / or through-hole edges of the second measuring structure 400b.

[0130] If only one measurement structure 400a is considered, the following applies (see also...). Figure 20 ): When the deviation between the previously detected first reference point and the second reference point is not greater than the still acceptable maximum distance (Δ≤S) max When the first metal plate 2a is joined or bonded (V) to the second metal plate 2b in a joining tool, for example by laser welding, the first metal plate 2a may be connected or joined (V) to the second metal plate 2b. However, when the deviation of the previously detected distance between the first reference point and the second reference point is greater than the still acceptable maximum distance (Δ > S), the first metal plate 2a may be joined or bonded (V) to the second metal plate 2b by laser welding. max When the first metal plate 2a and the second metal plate 2b are arranged relative to each other, the distance between the first reference point and the second reference point can be reduced to a level less than or equal to the maximum distance that is still acceptable, and then the engagement (V) can be performed.

[0131] If we consider two measurement structures, 400a and 400b, the following applies (see also...). Figure 21 ): When the deviation (Δ) between the previously detected first reference point and the second reference point a ) and the deviation (Δ) of the distance between the third reference point and the fourth reference point. b () not greater than the still acceptable maximum distance (Δ)a ≤S max,a ∩Δ b ≤S max,b When the first metal plate 2a is joined or bonded to the second metal plate 2b in a joining tool, for example by laser welding.

[0132] However, when at least one of the previously detected deviations in the distance between the first and second reference points, and the distance between the third and fourth reference points, exceeds the still acceptable maximum distance (Δ),... a >S max,a ∪Δ b >S max,b When the first metal plate 2a and the second metal plate 2b are arranged relative to each other, the distance between the first reference point and the second reference point and the distance between the third reference point and the fourth reference point can be reduced to a level less than or equal to the maximum distance that is still acceptable.

[0133] Using the first measuring structure 400a to perform non-contact detection of the distance between the first reference point and the second reference point may include: illuminating the embossed structure 432 and the through-hole edge 435 of the first metal plate 2a and the embossed structure 434 and the through-hole edge 436 of the second metal plate 2b with illumination light emitted by a light source; and detecting the illumination light reflected or scattered at the embossed structure 432 and the through-hole edge 435 of the first metal plate 2a and the embossed structure 434 and the through-hole edge 436 of the second metal plate 2b with a detection device. The procedure for detecting the distance between the third reference point and the fourth reference point using the second measuring structure 400b may be very similar. The light source and the detection device may, for example, be arranged on the side of the metal plates 2a and 2b positioned on top of each other, away from the second metal plate 2b. For the first measuring structure 400a, the illumination light may then pass through the through-hole 431 of the first metal plate 2a and illuminate the embossed structure 434 and the through-hole edge 436 of the second metal plate 2b. Then, this also generally applies to the corresponding structure of the second measuring structure 400b.

[0134] Using the first measuring structure 400a, the determination of the first reference point may, for example, include the alignment and / or determination of the plane or axis of symmetry of the embossed structure 432 and / or the through-hole edge 435 of the first metal plate 2a. The determination of the second reference point may include the alignment and / or determination of the plane or axis of symmetry of the embossed structure 434 and / or the through-hole edge 436 of the second metal plate 2b. Then, the determination of the distance between the first and second reference points typically includes the determination of the distance between the first and second positions. Similarly, the third and fourth reference points can be determined using the second measuring structure 400b.

[0135] The determination of the positions of reference points based on the symmetry of the embossed structure and / or through-hole edges of the first metal plate 2a and the symmetry of the embossed structure and / or through-hole edges of the second metal plate 2b, in Figure 12 Figure 14 and Figure 15 Chinese reference Figures 4A to 4C The modified implementation of the measurement structure of type 400 has been described and will be described in more detail later.

[0136] Therefore, the measuring structures 400a, 400b can be primarily used to identify, during the manufacturing of the separator plate 200, undesirable offsets between structures embossed into the individual plates or metal sheets 2a, 2b of the separator plate 200 and structures removed or stamped from the individual plates or metal sheets 2a, 2b of the separator plate 200, and more specifically and preferably, already in the early stages of manufacturing, such as before joining or connecting the individual plates or metal sheets 2a, 2b. If, after the individual plates or metal sheets 2a, 2b have been processed in the cutting or stamping tool and in the embossing tool, an offset greater than the still acceptable maximum offset is established between the embossed and stamped structures of the individual plates or metal sheets 2a, 2b by the measuring structures 400a, 400b, then, for example, these metal sheets 2a, 2b can be sorted out.

[0137] Similarly, the measuring structures 400a, 400b can be used to identify deviations in the alignment of individual plates or metal plates 2a, 2b relative to an ideal relative alignment before the individual plates or metal plates 2a, 2b are connected or joined, and preferably, to correct such deviations by minimizing the deviations in relative alignment from the ideal relative alignment before the metal plates 2a, 2b are finally joined to form the separator plate 200.

[0138] Therefore, the measuring structures 400a and 400b can help ensure high precision during the manufacturing of the separator plate 200, thereby improving the quality of the separator plate 200.

[0139] according to Figures 4A to 4C Preferably, the through-hole edge 435 defining and surrounding the through-hole 431 and the embossed structure 432 of the first metal plate 2a are symmetrically formed in the measuring structure 400a. This allows, for example, the use of an image recognition device to determine the arrangement of the embossed structure 432 and the through-hole edge 435 of the first metal plate 2a particularly easily. Specifically, the through-hole edge 435 of the first metal plate 2a is symmetrically arranged and formed with respect to the axis of symmetry 438, and the embossed structure 432 of the first metal plate 2a is symmetrically arranged and formed with respect to the axis of symmetry 458. Here, the axes of symmetry 438, 458 are aligned perpendicular to the aforementioned plate planes 439, 440 of the first metal plate 2a and the second metal plate 2b, and therefore along the z-direction or stacking direction 7. Figures 4A to 4CThe through-hole 435 of the first metal plate 2a, which defines the embossed structure 432 of the first metal plate 2a, follows a circular path in the measuring structure 400a. Therefore, the embossed structure 432 and the through-hole edge 435 of the first metal plate 2a have continuous rotational symmetry with respect to the axes of symmetry 438 or 458, wherein the two axes of symmetry 438 and 458 coincide in this example. In an alternative embodiment, the embossed structure 432 and the through-hole edge 435 of the first metal plate 2a may also be formed and arranged, for example, to have only discrete rotational symmetry with respect to the axes of symmetry 438 and / or 458, respectively. Here, the two axes of symmetry 438, 458 extend through the through-hole 431 of the first metal plate 2a. The embossed structure 432 of the first metal plate 2a completely encloses the through-hole 431 of the first metal plate 2a. Because of the continuous rotational symmetry of the through-hole 431 with respect to the axis of symmetry 438, the mirror symmetry with respect to the exemplary mirror plane 445 perpendicular to the plate plane 439 and with respect to any other mirror plane extending perpendicular to the plate plane is defined by the axis of symmetry 438. Similarly, because of the continuous rotational symmetry of the embossed structure 432 with respect to the axis of symmetry 458, the mirror symmetry with respect to the exemplary mirror plane 455 perpendicular to the plate plane 439 and with respect to any other mirror plane perpendicular to the plate plane is defined by the axis of symmetry 458.

[0140] In a modified embodiment of the measuring structure 400a, it is conceivable that the through-hole edge 435 of the first metal plate 2a is symmetrical with respect to the first axis of symmetry 438, and the embossed structure 432 of the first metal plate 2a is symmetrical with respect to the second axis of symmetry 458, the second axis of symmetry 458 being spaced apart from the first axis of symmetry 438. According to... Figures 4A to 4C In the modification of the measuring structure 400a, this could be such that, for example, the positioning of the first metal plate 2a in the stamping tool for stamping the stamping structure 432 and for stamping other stamping structures (e.g., for stamping sealing flanges 12a-d) is defective and deviates from the ideal positioning of the first metal plate 2a in the stamping tool, and / or the positioning of the first metal plate 2a in the stamping tool for stamping the through hole 433 and for stamping other stamping structures (e.g., for stamping through openings 11a-c of the first metal plate 2a) is defective and deviates from the ideal positioning of the first metal plate 2a in the stamping tool. In this case, if the undesired distance between the first axis of symmetry 438 and the second axis of symmetry 458 is greater than the still acceptable maximum distance S... max For example, the first metal plate 2a can be selected without further processing.

[0141] According to Figures 4A to 4CIn the measuring structure 400a, the imprinted structure 432 of the first metal plate 2a protrudes above the plate plane 439 of the first metal plate 2a along the positive z-direction 7, that is, along a direction opposite to the second metal plate 2b and perpendicular to the plate plane 439 of the first metal plate 2a. Here, the imprinted structure 432 of the first metal plate 2a is formed as a semi-convex edge. In an alternative embodiment, the imprinted structure 432 of the first metal plate 2a may also be formed as a fully convex edge, or the imprinted structure 432 of the first metal plate 2a may include a plurality of at least partially non-adjacent substructures, which may be defined, for example, by protrusions and / or depressions imprinted onto the first metal plate 2a. Figures 4A to 4C In the measuring structure 400, the imprinting structure 432 of the first metal plate 2a includes a first portion 432X and a second portion 432Y. The first portion 432X is inclined or angled relative to the plate plane 439 of the first metal plate 2a, and the second portion 432Y is parallel to the plate plane 439 of the first metal plate 2a, aligned with and surrounding the through-hole edge 435 of the first metal plate 2a. Figure 4C In the example shown, the first portion 432X of the embossed structure 432 of the first metal plate 2a forms a maximum angle of at least 50 degrees with the plate plane 439 of the first metal plate 2a. The first portion 432X transitions to the second portion 432Y.

[0142] Starting from and perpendicular to the plane 439 of the first metal plate 2a, the second portion 432Y of the embossed structure 432 of the first metal plate 2a has a constant height 441. For example, the height 441 is at least two or at least three times the thickness of the first metal plate 2a. Meanwhile, the maximum height 441 of the embossed structure 432 of the first metal plate 2a is less than the height of the sealing protrusions 12a-d of the first metal plate 2a, which is also determined starting from and perpendicular to the plane 439 of the first metal plate 2a. When the sealing protrusions 12a-d of the first metal plate 2a are pressed together to form a shape... Figure 1 When the plates are stacked as shown, the embossed structure 432 of the first metal plate 2a is not pressed together.

[0143] According to Figures 4A to 4C In the measuring structure 400a, for example, the diameter or maximum diameter d1 of the through hole 431 of the first metal plate 2a. max It is 5mm. In an alternative embodiment, the diameter d1 max The value can be between 1.5mm and 8mm. However, the diameter d1 max Values ​​less than 1.5 mm or greater than 8 mm can also be used. The maximum distance D1 between one end of the embossed structure 432 of the first metal plate 2a, which is opposite to the through hole 431 of the first metal plate 2a, and the edge 435 of the through hole of the first metal plate 2a. max Not exceeding 0.3*d1 maxHowever, in an alternative implementation, D1 max Larger values ​​can also be used. For example, in these cases, D1 max ≤d1 max D1 max ≤3*d1 max Or D1 max ≤5*d1 max It is applicable.

[0144] according to Figures 4A to 4C Preferably, the through-hole edge 436 defining and surrounding the through-hole 433 and the embossed structure 434 of the second metal plate 2b are symmetrically formed in the measuring structure 400a. This allows, for example, the use of an image recognition device to determine, particularly easily, the arrangement of the embossed structure 434 and the through-hole edge 436 of the second metal plate 2b. Specifically, the through-hole edge 436 of the second metal plate 2b is symmetrically arranged and formed with respect to the axis of symmetry 468, and the embossed structure 434 of the second metal plate 2b is symmetrically arranged and formed with respect to the axis of symmetry 448. Figures 4A to 4C The through-hole edge 436 of the second metal plate 2b and the embossed structure 434 of the second metal plate 2b follow a circular path in the measuring structure 400a. Therefore, the embossed structure 434 and the through-hole edge 436 of the second metal plate 2b have continuous rotational symmetry with respect to the axes of symmetry 468 and / or 448. In an alternative embodiment, the embossed structure 434 and the through-hole edge 436 of the second metal plate 2b may also be formed and arranged to have only discrete rotational symmetry with respect to the axes of symmetry 468 and / or 448. Here, the axes of symmetry 468 and 448 extend through the through-hole 433 of the second metal plate 2b. The embossed structure 434 of the second metal plate 2b completely encloses the through-hole 433 of the second metal plate 2b. In this example, the axes of symmetry 468 and 448 coincide with each other and with the aforementioned axis of symmetry 438 of the first through holes 431 and 458 of the first embossed structure 432 of the first metal plate 2a.

[0145] In a modified embodiment of the separator plate 200, it is conceivable that the through-hole edge 436 of the second metal plate 2b is symmetrical with respect to the third axis of symmetry 468, and the embossed structure 434 of the second metal plate 2b is symmetrical with respect to the fourth axis of symmetry 448, which is spaced apart from the third axis of symmetry. According to... Figures 4A to 4CIn modifications to the measuring structure, this could occur, for example, when the positioning of the second metal plate 2b in the stamping tool for stamping the stamping structure 434 and for stamping other stamping structures (e.g., sealing protrusions 12a-d for stamping the second metal plate 2b) is defective and deviates from the ideal positioning of the second metal plate 2b in the stamping tool, and / or when the positioning of the second metal plate 2b in the stamping tool for stamping the through hole 433 and for stamping other stamping structures (e.g., through openings 11a-c for stamping the first metal plate 2a) is defective and deviates from the ideal positioning of the second metal plate 2b in the stamping tool. In this case, if the undesired distance between the third axis of symmetry 468 and the fourth axis of symmetry 448 is greater than the still acceptable maximum distance S' max Then, for example, the second metal plate 2b can be selected without further processing.

[0146] According to Figures 4A to 4C In the measurement structure 400a, specifically, the symmetry axes 468 and 448 of the through-hole edge 435 of the first metal plate 2a and the embossing structure 434 of the second metal plate 2b also coincide, because both are also the same as the symmetry axis 438. However, in a modified embodiment of the measurement structure 400a, it is conceivable that the through-hole edge 435 of the first metal plate 2a is symmetrical, for example, with respect to the aforementioned first symmetry axis 438, and the embossing structure 434 of the second metal plate 2b is symmetrical with respect to the aforementioned fourth symmetry axis 448, which is spaced apart from the first symmetry axis. According to... Figures 4A to 4C In the modification of the measuring structure 400a, this could be a situation where, for example, the positioning of the first metal plate 2a and / or the second metal plate 2b in the joining tool used to connect the first metal plate 2a to the second metal plate 2b is defective and deviates from the ideal positioning of the first metal plate 2a and the second metal plate 2b in the joining tool. In this case, if the undesired distance between the first axis of symmetry 438 of the through-hole edge 435 of the first metal plate 2a and the fourth axis of symmetry 448 of the embossing structure 434 of the second metal plate 2b is greater than the still acceptable maximum distance S". max Then the positioning of the first metal plate 2a and / or the second metal plate 2b in the joining tool can be corrected such that the distance between the first axis of symmetry 438 and the fourth axis of symmetry 448 after correction is less than the still acceptable maximum distance S". max To optimize the positioning of metal plates 2a and 2b in the joining tool, the potentially undesirable distance between the corresponding axes of symmetry of the second measuring structure 400b is preferably also minimized until this distance is also less than the still acceptable maximum distance.

[0147] According to Figures 4A to 4CIn the measuring structure 400a, the imprinting structure 434 of the second metal plate 2b protrudes above the plate plane 440 of the second metal plate 2b along the negative z-direction 7, i.e., along a direction opposite to the first metal plate 2a and perpendicular to the plate plane 440 of the second metal plate 2b. Here, the imprinting structure 434 of the second metal plate 2b is formed as a semi-convex edge. In an alternative embodiment, the imprinting structure 434 of the second metal plate 2b may also be formed as a fully convex edge, or the imprinting structure 434 of the second metal plate 2b may include a plurality of at least partially non-adjacent substructures, which may be defined, for example, by protrusions and / or depressions imprinted onto the second metal plate 2b. The imprinting structure 434 of the second metal plate 2b includes a first portion 434X and a second portion 434Y, the first portion 434X being inclined or angled relative to the plate plane 440 of the second metal plate 2b, and the second portion 434Y being aligned parallel to the plate plane 440 of the second metal plate 2b and including the through-hole edge 436 of the second metal plate 2b. In the example shown, the first portion 434X of the embossed structure 434 of the second metal plate 2b forms a maximum angle of at least 50 degrees with the plate plane 440 of the second metal plate 2b. The first portion 434X transitions into the second portion 434Y.

[0148] Starting from and perpendicular to the plane 440 of the second metal plate 2b, the second portion 434Y of the embossed structure 434 of the second metal plate 2b has a constant height 442. For example, the height 442 is at least two or at least three times the thickness of the second metal plate 2b. Meanwhile, the maximum height 442 of the embossed structure 434 of the second metal plate 2b is less than the height of the sealing protrusion of the second metal plate 2b, which is also determined starting from and perpendicular to the plane 440 of the second metal plate 2b. When the sealing protrusions of the second metal plate 2b are pressed together to form a shape... Figure 1 When the plates are stacked as shown, the embossing structure 434 of the second metal plate 2b itself will not be pressed together.

[0149] According to Figures 4A to 4C In the measuring structure 400a, the diameter or maximum diameter d2 of the through hole 433 of the second metal plate 2b. max The diameter d1 is smaller than that of the through hole 431 in the first metal plate 2a. max Here, approximately d1 max =4*d2 max Applicable to d1 max and d2 max In an alternative embodiment, and specifically in an alternative embodiment that also has continuous rotational symmetry throughout the entire measurement structure, for example, 1.5*d² max ≤d1 max ≤8*d2 maxThis is applicable. For example, the diameter or maximum diameter d2 of the through hole 433 in the second metal plate 2b. max It is 2mm. In an alternative embodiment, the diameter d2 max Values ​​between 0.5mm and 5mm can be used, for example. However, the diameter d2 max A value greater than 5 mm can also be used. The maximum distance D2 between one end of the embossed structure 434 of the second metal plate 2b, which is opposite to the through hole 433 of the second metal plate 2b, and the edge 436 of the through hole of the second metal plate 2b. max Approximately 0.75*d² max However, in an alternative implementation, D2 max Other values ​​can also be used. For example, in these cases, D2 max =0,2*d2 max D2 max =d2 max D2 max ≤3*d2 max Or D2 max ≤5*d2 max It is applicable.

[0150] Figure 5 It shows crossing according to Figure 4A A cross-sectional view of the measuring structure 500 of the separator plate 200, wherein, as described above, the cutting plane is aligned along the yz plane and is therefore parallel to the z direction or stacking direction 7. According to Figure 5 The measurement structure 500 is based on Figures 4A to 4C The measurement structures 400a and 400b are variations. Measurement structure 500 can replace measurement structures 400a and 400b of separator plate 200. However, separator plate 200 may also include two types of measurement structures 400a, 400b, and 500, specifically including a total of two measurement structures. As described above, here and thereafter (except...) Figure 10 Apart from the reference numerals, identical or similar reference numerals are used to mark repeating features, specifically the same reference numerals relative to their last two digits (the first and second digits before the decimal point), however, the preceding digits (the third and possibly fourth digits before the decimal point) are numbered according to the figures in the reference numerals. To avoid repetition, the following mainly describes the reference numerals based on the figures in the reference numerals. Figure 5 The measurement structure 500 and according to Figures 4A to 4C The difference between measurement structures 400a and 400b. (The basis not explicitly described) Figure 5 The characteristics of the measurement structure 500 can be as follows: Figures 4A to 4C It is formed as described above in the measurement structures 400a and 400b.

[0151] according to Figure 5 The measurement structure 500 and according to Figures 4A to 4C The difference between the measuring structures 400a and 400b is that the second metal plate 2b does not include a through hole, but only includes an embossed structure 534. The embossed structure 534 of the second metal plate 2b has a recessed or raised configuration within the second metal plate 2b, protruding above the plate plane 540 of the second metal plate 2b in a direction opposite to the first metal plate 2b and perpendicular to the plate plane 540 of the second metal plate 2b. The maximum extension of the embossed structure 534 of the second metal plate 2b, parallel to the plate plane 540 of the second metal plate 2b, is less than the diameter or maximum diameter d1 of the through hole 531 of the first metal plate 2a. max For example, the maximum extension of the embossed structure 534 of the second metal plate 2b, which is parallel to the plate plane 540 of the second metal plate 2b, can be less than or equal to the diameter d1 of the through hole 531 of the first metal plate 2a. max Half of. As per [the original text] Figures 4A to 4C As in the measurement structures 400a and 400b, according to Figure 5 The embossing structures 532 and 534 in the measuring structure 500 can be formed and arranged symmetrically with respect to their shared axes of symmetry 558 and 548, respectively, and these axes of symmetry are identical, wherein the axes of symmetry 558 and 548 are aligned perpendicular to the plate planes 539 and 540 of the metal plates 2a and 2b. Simultaneously, the axes of symmetry 558 and 548 represent the lines of intersection of the mirror planes 545 and 554 passing through the embossing structures 532 and 534, respectively.

[0152] Figure 6 It shows crossing according to Figure 4A A cross-sectional view of the measuring structure 600 of the separator plate 200, wherein, as described above, the cutting plane is aligned along the yz plane and is therefore parallel to the z direction or stacking direction 7. According to Figure 6 The measurement structure 600 is based on Figures 4A to 4C Variations of measuring structures 400a and 400b. Measuring structure 600 can replace measuring structures 400a, 400b, or 500 of separator plate 200. However, separator plate 200 may also include only one, several (especially two in total), or all measuring structures 400a, 400b, 500, and 600. To avoid repetition, the following mainly describes the... Figure 6 The measurement structure 600 and according to Figures 4A to 4C The difference between measurement structures 400a and 400b. (The basis not explicitly described) Figure 6 The characteristics of the measurement structure 600 can be as follows: Figures 4A to 4C It is formed as described above in the measurement structures 400a and 400b.

[0153] according to Figure 6 The measurement structure 600 and according to Figures 4A to 4CThe difference between the measuring structures 400a and 400b is that the embossing structure 634 of the second metal plate 2b, formed as a semi-convex edge, protrudes above the plate plane 640 of the second metal plate 2b in a direction facing the first metal plate 2a and perpendicular to the plate plane 640 of the second metal plate 2b. This direction coincides with the z-direction or stacking direction 7. However, the embossing structure 634 does not protrude beyond the through-hole edge 635 of the through-hole 633 of the first metal plate 2a along the stacking direction 7. The height 642 of the embossing structure 634 of the second metal plate 2b may be equal to or possibly less than the height 641 of the embossing structure 632 of the first metal plate 2a, which is determined from and perpendicular to the plate plane 640 of the second metal plate 2b, and the height 641 is determined from and perpendicular to the plate plane 639 of the first metal plate 2a. The diameter of the embossing structure 234 of the second metal plate 2b is approximately 85% of the diameter of the through-hole 631 of the first metal plate 2a.

[0154] Figure 7 It shows crossing according to Figure 4A A cross-sectional view of the measuring structure 700 of the separator plate 200, wherein, as described above, the cutting plane is aligned along the yz plane and is therefore parallel to the z direction or stacking direction 7. According to Figure 7 The measurement structure 700 is based on Figure 5 A variation of the measuring structure 500. Measuring structure 700 can replace measuring structures 400a, 400b, 500, or 600 of the separator plate 200. However, the separator plate 200 may also include only one, several (especially two in total), or all of the measuring structures 400a, 400b, 500, 600, and 700. To avoid repetition, the following mainly describes the... Figure 7 The measurement structure 700 and according to Figure 5 The differences between the 500 measurement structures. (The basis not explicitly described) Figure 7 The characteristics of the measurement structure 700 can be as follows: Figure 5 The measurement structure is formed as described in 500.

[0155] according to Figure 7 The measurement structure 700 and according to Figure 5The difference in the measuring structure 500 is that the embossed structure 734 of the second metal plate 2b, which is formed as a recess or ridge in the second metal plate 2b, protrudes above the plate plane 740 of the second metal plate 2b in a direction facing the first metal plate 2a and perpendicular to the plate plane 740 of the second metal plate 2b. Here, this direction coincides with the positive z-direction or the stacking direction 7. Simultaneously, the embossed structure 734 of the second metal plate 2b protrudes at least in the region above the plate plane 739 of the first metal plate 2a along the positive z-direction 7. However, the embossed structure 734 does not protrude beyond the through-hole edge 735 of the through-hole 733 of the first metal plate 2a along the stacking direction 7, where the through-hole edge 735 is formed as part of the semi-convex edge of the embossed structure 732 of the first metal plate 2a. The height 742 of the embossing structure 734 of the second metal plate 2b may be equal to or may be less than the height 741 of the embossing structure 732 of the first metal plate 2a. The height 742 is determined from the plate plane 740 of the second metal plate 2b and perpendicular to it, while the height 741 is determined from the plate plane 739 of the first metal plate 2a and perpendicular to it.

[0156] Figure 8 It shows crossing according to Figure 4A A cross-sectional view of the measuring structure 800 of the separator plate 200, wherein, as described above, the cutting plane is aligned along the yz plane and is therefore parallel to the z-direction or stacking direction 7. According to Figure 8 The measurement structure 800 is based on Figure 7 A variation of the measuring structure 700. The measuring structure 800 can replace the measuring structures 400a, 400b, 500, 600, or 700 of the separator plate 200. However, the separator plate 200 may also include only one, several (especially two in total), or all of the measuring structures 400a, 400b, 500, 600, 700, and 800. To avoid repetition, the following mainly describes the... Figure 8 The measurement structure 800 and according to Figure 7 The differences between the measurement structures 700. (The basis not explicitly described) Figure 8 The characteristics of the measurement structure 800 can be as follows: Figure 7 The measurement structure is formed as described in 700.

[0157] according to Figure 8 The measurement structure 800 and according to Figure 7The difference in the measuring structure 700 is that the embossing structure 832 of the first metal plate 2a is formed as a fully convex edge. On the side facing away from the through hole 831 of the first metal plate 2a, the embossing structure 832 of the first metal plate 2a includes a first portion 832X that is inclined or angled relative to the plate plane 839 of the first metal plate 2a. A second portion 832Y, aligned parallel to the plate plane 839 of the first metal plate 2a, is adjacent to the first portion 832X. Furthermore, on the side facing the through hole 831 of the first metal plate 2a, the embossing structure 832 of the first metal plate 2a includes a third portion 832Z that is inclined or angled relative to the plate plane 839 of the first metal plate 2a and is adjacent to the second portion 832Y. For example, the first portion 832X and the third portion 832Z of the embossing structure 832 of the first metal plate 2a each form a maximum angle of at least 50 degrees with the plate plane 839 of the first metal plate 2a.

[0158] The embossed structure 832, formed as a fully convex edge of the first metal plate 2a, extends around the through hole 831 of the first metal plate 2a and is spaced apart from the through hole edge 835 of the first metal plate 2a that seals the through hole 831. For example, the minimum distance between the third portion 832Z of the embossed structure 832 facing the through hole 831 and the through hole edge 835 is approximately the maximum diameter d1 of the through hole 831 of the first metal plate 2a. max 45%. For example, the maximum distance of the first embossed structure 832, specifically the maximum distance between the first portion 832X of the embossed structure 832 facing away from the through hole 831 and the edge 835 of the through hole, can, for example, not be greater than the maximum diameter d1 of the through hole 831 of the first metal plate 2a. max Ten times, five times, or three times.

[0159] Figure 9 It shows crossing according to Figure 4A A cross-sectional view of the measuring structure 900 of the separator plate 200, wherein, as described above, the cutting plane is aligned along the yz plane and is therefore parallel to the z-direction or stacking direction 7. According to Figure 9 The measurement structure 900 is based on Figure 6 A variation of the measuring structure 600. The measuring structure 900 can replace the measuring structures 400a, 400b, 500, 600, 700, or 800 of the separator plate 200. However, the separator plate 200 may also include only one, several (especially two in total), or all of the measuring structures 400a, 400b, 500, 600, 700, 800, or 900. To avoid repetition, the following mainly describes the... Figure 9 The measurement structure 900 and according to Figure 6 The differences between the measurement structures 600. (The basis not explicitly described) Figure 9 The characteristics of the measurement structure 900 can be as follows: Figure 6 It is formed as described in the measurement structure 600 above.

[0160] according to Figure 9 The measurement structure 900 and according to Figure 6 The difference in the measuring structure 600 is that the embossing structure 934 of the second metal plate 2b is formed as a fully convex edge. On the side facing away from the through hole 933 of the second metal plate 2b, the embossing structure 934 of the second metal plate 2b includes a first portion 934X that is inclined or angled relative to the plate plane 940 of the second metal plate 2b. A second portion 934Y, aligned parallel to the plate plane 940 of the second metal plate 2b, is adjacent to the first portion 934a. Furthermore, on the side facing the through hole 933 of the second metal plate 2b, the embossing structure 934 of the second metal plate 2b includes a third portion 934Z that is inclined or angled relative to the plate plane 940 of the second metal plate 2b and is adjacent to the second portion 934Y. For example, the first portion 934X and the third portion 934Z of the embossing structure 934 of the second metal plate 2b each form a maximum angle of at least 50 degrees with the plate plane 940 of the second metal plate 2b.

[0161] The embossed structure 934 of the second metal plate 2b, which is formed as a fully convex edge, extends around the through hole 933 of the second metal plate 2b and is spaced apart from the through hole edge 936 of the second metal plate 2b that encloses the through hole 933.

[0162] In the observation direction or light incident direction along the negative z-direction 7, the embossed structure 934 of the second metal plate 2b, which is formed as a fully convex edge, is at least partially hidden by the first metal plate 2b, and specifically by the embossed structure 932 of the first metal plate 2a, which is formed as a semi-convex edge. Here, the first metal plate 2a completely hides the first portion 934X of the embossed structure 934 facing away from the through hole 933 of the second metal plate 2b, and hides approximately half of the second portion 934Y of the embossed structure 934. Therefore, light passing through the through hole 931 of the first metal plate 2a along the negative z-direction 7 only illuminates the third portion 934Z of the through hole 933 and a portion of the second portion 934Y of the embossed structure 934 of the second metal plate 2b, so as to illuminate the area corresponding to the semi-convex edge, which has at least one curved area.

[0163] Figure 10 It shows crossing according to Figure 4A Including according to Figures 4A to 4C A cross-sectional view of the separator plate 200 of the measuring structure 400, wherein, here, the sealing protrusion 412 is imprinted into a portion of the first metal plate 2a and the second metal plate 2b, indicated here by 412a and 412b. As described above, the cutting plane is aligned along the yz plane and is therefore parallel to the z direction or stacking direction 7.

[0164] from Figure 10 It can be concluded that when the sealing protrusion 412 has been pressed as expected, the height 441 of the embossed structure 432 of the first metal plate 2a, which is determined from the plate plane 439 of the first metal plate 2a and perpendicular to it, is still lower than the height 443 of the sealing protrusion 412a of the first metal plate 2a, which is determined from the plate plane 439 of the first metal plate 2a and perpendicular to it. Similarly, when the sealing protrusion 412 has been pressed as expected, the height 442 of the embossed structure 434 of the second metal plate 2b, which is determined from the plate plane 440 of the second metal plate 2b and perpendicular to it, is also lower than the height 444 of the sealing protrusion 412b of the second metal plate 2b, which is determined from the plate plane 440 of the second metal plate 2b and perpendicular to it.

[0165] Figure 11 A top view shows the results according to Figure 4A The measuring structure 1100 of the separator plate 200, wherein, as Figure 4A As shown, the observation direction is oriented along the negative z-direction 7. According to... Figure 11 The measurement structure 1100 is based on Figures 4A to 4C A variation of the measuring structure 400. Measuring structure 1100 can replace measuring structures 400a, 400b, 500, 600, 700, 800, or 900 of the separator plate 200. However, the separator plate 200 may also include only one, several (especially two in total), or all of the measuring structures 400a, 400b, 500, 600, 700, 800, 900, and 1100. To avoid repetition, the following mainly describes the... Figure 11 The measurement structure 1100 and according to Figures 4A to 4C The differences between the measurement structures 400. (The basis not explicitly described) Figure 11 The characteristics of the measurement structure 1100 can be as follows: Figures 4A to 4C It is formed as described above in the measuring structure 400.

[0166] according to Figure 11 The measurement structure 1100 and according to Figures 4A to 4CThe difference in the measuring structure 400 is that the through-hole edge 1131 of the first metal plate 2a has mirror symmetry only with respect to the mirror plane 1145. The route of the through-hole edge 1131 of the first metal plate 2a parallel to the xy plane or parallel to the plate plane of the first metal plate 2a has a triangular shape, which has rounded corners and slightly curved edges. The mirror plane is located perpendicularly on the plate plane 1139 of the first metal plate 2a and aligned parallel to the stacking direction 7. However, the embossed structure 1132 of the first metal plate 2a and the embossed structure 1134 and through-hole edge 1136 of the second metal plate 2b have continuous rotational symmetry with respect to their axes of symmetry 1158 and 1148, respectively, which are the same as each other. The axes of symmetry 1158 and 1148 are aligned along the stacking direction 7 and perpendicular to the plate planes of the metal plates 2a and 2b. The axes of symmetry 1158 and 1148 coincide with the mirror plane 1145, meaning that the axes of symmetry 1158 and 1148 extend into the interior of the mirror plane 1145. (This is in accordance with...) Figures 4A to 4C Compared to the measurement structure 400, the imprinted structure 1134 of the second metal plate 2b is further formed according to... Figure 11 The full convex edge in the measurement structure 1100, however, with Figure 9 Compared to the embossed structure 934, the entire embossed structure 1134 is located in the region 1137 defined by the vertical projection of the first through hole 1131 onto the second metal plate 2b.

[0167] Figure 12 A top view shows the results according to Figure 4A The measuring structure 1200 of the separator plate 200, wherein, as Figure 4A As shown, the observation direction is oriented along the negative z-direction 7. According to... Figure 12 The measurement structure 1200 is based on Figures 4A to 4C The measurement structure 1200 is a variation of the measurement structure 400. Measurement structure 1200 can replace measurement structures 400a, 400b, 500, 600, 700, 800, 900, or 1100 of the separator plate 200. However, the separator plate 200 may also include only one, several (especially two in total), or all of the measurement structures 400a, 400b, 500, 600, 700, 800, 900, 1100, and 1200. To avoid repetition, the following mainly describes the... Figure 12 The measurement structure 1200 and according to Figures 4A to 4C The differences between the measurement structures 400. (The basis not explicitly described) Figure 12 The characteristics of the measurement structure 1200 can be as follows: Figures 4A to 4C It is formed as described above in the measuring structure 400.

[0168] according to Figure 12 The measurement structure 1200 and according to Figures 4A to 4C The difference in the measurement structure 400 is that there is no through-hole edge in the second metal plate, and the imprint structure 1232 of the first metal plate 2a has only discrete rotational symmetry with respect to the axis of symmetry 1258, specifically fourfold rotational symmetry. The route of the imprint structure 1232 of the first metal plate 2a parallel to the xy plane or the plate plane of the first metal plate 2a has a square shape with rounded corners. However, the through-hole edge 1235 of the first metal plate 2a and the imprint structure 1234 and through-hole edge 1236 of the second metal plate 2b have continuous rotational symmetry with respect to the axes of symmetry 1238 and 1248, respectively. However, compared with the previous measurement structure, the axes of symmetry 1238 and 1258 and the axis of symmetry 1248 do not coincide here. Therefore, the mirror plane 1255A of the first through-hole 1231 and the mirror plane 1245A of the first imprint structure 1232 are also displaced relative to each other. However, the corresponding distance is less than the maximum permissible distance of 1250, thereby positioning the two metal plates 2a, 2b relative to each other and allowing them to be joined together with acceptable tolerances.

[0169] Figure 13 A top view shows the results according to Figure 4A The measuring structure 1300 of the separator plate 200, wherein, as Figure 4A As shown, the observation direction is oriented along the negative z-direction 7. According to... Figure 13 The measurement structure 1300 is based on Figure 13 A variation of the measuring structure 1200. The measuring structure 1300 can replace the measuring structures 400a, 400b, 500, 600, 700, 800, 900, 1100, and 1200 of the separator plate 200. However, the separator plate 200 may also include only one, several (especially two in total), or all of the measuring structures 400a, 400b, 500, 600, 700, 800, 900, 1100, 1200, and 1300. To avoid repetition, the following mainly describes the... Figure 13 The measurement structure 1300 and according to Figure 13 The differences between the measurement structures 1200. (The basis not explicitly described) Figure 13 The characteristics of the measurement structure 1300 can be as follows: Figure 12 It is formed as described above in the measuring structure 1200.

[0170] according to Figure 13 The measurement structure 1300 and according to Figure 12The difference in the measurement structure 1200 is that the embossing structure 1332 and through-hole edge 1335 of the first metal plate 2a and the embossing structure 1334 of the second metal plate 2b have discrete rotational symmetry only with respect to their respective axes of symmetry 1358, 1338, and 1348, wherein these axes of symmetry 1358, 1338, and 1348 have the same path, and more specifically, each axis of symmetry has double rotational symmetry. The path of the embossing structure 1232 of the first metal plate 2a, parallel to the xy plane or the plate plane of the first metal plate 2a, has a rectangular shape with rounded corners. Conversely, the paths of the through-hole edge 1335 of the first metal plate 2a and the embossing structure 1334 and through-hole edge 1336 of the second metal plate 2b have oval or elliptical shapes, respectively. Therefore, the first imprinted structure 1332 of the first metal plate 2a is mirror-symmetrical with respect to the first mirror plane 1345A and the second mirror plane 1345B; the edge 1335 of the first through hole of the first metal plate 2a is mirror-symmetrical with respect to the first mirror plane 1355A and the second mirror plane 1355B; and the first imprinted structure 1334 of the second metal plate 2b is mirror-symmetrical with respect to the first mirror plane 1354A and the second mirror plane 1354B. These first mirror planes 1345A, 1355A, and 1354A are identical to each other, and the second mirror planes 1345B, 1355B, and 1354B are also identical to each other. This also indicates that... Figure 12 The differences are as follows: The six aforementioned mirror planes 1345A, 1345B, 1355A, 1355B, 1354A, and 1354B are all located perpendicularly on the planes of the metal plates 2a and 2b, and aligned parallel to the stacking direction 7. Furthermore, the mirror planes 1345A, 1345B, 1355A, 1355B, and 1354A, 1354B are arranged in pairs, perpendicular to each other, and intersect along the same axes of symmetry 1358, 1338, and 1348 of the centroids forming the embossed structures 1332, 1334, and the through-hole 1331.

[0171] Figure 14A A top view shows the results according to Figure 4A The measuring structure 1400a of the separator plate 200, wherein, as Figure 4A As shown, the observation direction is oriented along the negative z-direction 7. Measurement structure 1400a can replace measurement structures 400a, 400b, 500, 600, 700, 800, 900, 1100, 1200, and 1300 of the separator plate 200. However, the separator plate 200 may also include only one, several (especially two in total), or all of the measurement structures 400a, 400b, 500, 600, 700, 800, 900, 1100, 1200, 1300, and 1400a.

[0172] The measuring structure 1400a includes an embossing structure 1432, which is embossed into a first metal plate 2a (shaded) and includes three substructures 1432A to C. The substructures 1432A to C of the embossing structure 1432 of the first metal plate 2a are each defined by an annular recess in the first metal plate 2a. Furthermore, the measuring structure 1400a includes a through-hole 1431 in the first metal plate 2a, which is surrounded and defined by a circular through-hole edge 1435. The substructures 1432A to C of the embossing structure 1432 of the first metal plate 2a are arranged around the through-hole 1431, and more specifically, the centroids 1446A to C of the three annular substructures 1432A to C form the corners of a triangle, specifically the corners of an equilateral triangle. This triangle further defines the centroid 1447 of the triangle or equilateral triangle.

[0173] The circular through-hole edge 1435 of the first metal plate 2a is arranged inside the triangle, and the centroid 1449 of the area or circular area spanned by the through-hole edge 1435 of the first metal plate 2a is defined. In the embodiment shown in FIG14, the centroid 1447 of the triangle spanned by corner points 1446A to C coincides with or approximately coincides with the centroid 1449 or center of the area or circular area spanned by the through-hole edge 1435.

[0174] Furthermore, the measuring structure 1400a also includes an embossed structure 1434 of the second metal plate 2b and a through hole 1433 of the second metal plate 2b, including a through hole edge 1436. In the top view of FIG14, only the region 1437 of the second metal plate 2b is visible, which can be illuminated or observed through the through hole 1431 of the first metal plate 2a. The embossed structure 1434 of the second metal plate 2b is evident in this region 1437 and is similar to the substructures 1432A-C of the embossed structure 1432 of the first metal plate, which is defined by an annular recess 1434 in the second metal plate 2b.

[0175] Figure 14B It shows along Figure 14A A curved cross-sectional view of the BB line. This shows that substructures 1432B and 1432C of the embossed structure 1432 each have a semi-convex edge shape and the same maximum height. The same applies to the uncut substructure 1432A, which is not shown in the background.

[0176] exist Figure 14A and Figure 14BIn the exemplary embodiment of the separator plate 200 shown, when the centroid 1447 of the triangle defined by the embossed structure 1432 of the first metal plate 2a and the centroid 1449 of the region defined by the through hole edge 1435 of the first metal plate 2a are both located within the region of the through hole 1433 of the second metal plate 2b, the metal plates 2a and 2b forming the separator plate 200 meet the first precision standard and are considered to be sufficiently and precisely aligned with each other.

[0177] When the second measuring structure of the separator plate 200, which is of the same type as the measuring structure 1400a described above and spaced apart from the first measuring structure 1400a, also meets the first accuracy standard described above, the metal plates 2a and 2b forming the separator plate 200 meet the second accuracy standard. Therefore, during the positioning of the metal plates 2a and 2b in the joining tool, for example, when the metal plates 2a and 2b meet the accuracy standard based on... Figure 14A and Figure 14B When considering the accuracy standards described here for the two measuring structures, metal plates 2a and 2b can be joined.

[0178] Figure 15 A top view shows the results according to Figure 4A The measuring structure 1500a of the separator plate 200, wherein, as Figure 4A As shown, the observation direction is oriented along the negative z-direction 7. Measurement structure 1500a can replace measurement structures 400a, 400b, 500, 600, 700, 800, 900, 1100, 1200, 1300, and 1400a of separator plate 200. However, separator plate 200 may also include only one, several (especially two in total), or all of the measurement structures 400a, 400b, 500, 600, 700, 800, 900, 1100, 1200, 1300, 1500a, and 1400a.

[0179] The measuring structure 1500a includes an embossing structure 1532, which is embossed into a first metal plate 2a (shaded) and includes two substructures 1532A to 1532B. The substructures 1532A to 1532B of the embossing structure 1532 in the first metal plate 2a are each defined by an annular recess in the first metal plate 2a. Furthermore, the measuring structure 1500a includes a through-hole 1531 in the first metal plate 2a, which is surrounded and defined by rounded rectangular through-hole edges 1535. The substructures 1532A to 1532B of the embossing structure 1532 in the first metal plate 2a are arranged on both sides of the through-hole 1531. The substructures 1532A to 1532B are arranged in a mirror-symmetrical manner with respect to two dashed mirror planes 1545A and 1545B, which are aligned parallel to the stacking direction 7. The rounded rectangular through-hole edge 1535 of the first metal plate 2a defines the centroid 1549 of the rectangular region, which is spanned by the through-hole edge 1535 and coincides with the axis of symmetry 1538 of the rectangular through-hole 1531.

[0180] Furthermore, the measuring structure 1500a includes an imprinting structure 1534 on the second metal plate 2b. Figure 15 In the top view, only region 1537 of the second metal plate 2b is visible, and this region 1537 can be illuminated or observed through the through-hole 1431 of the first metal plate 2a. Within this region 1537, the embossed structure 1534 of the second metal plate 2b is clearly visible, and this embossed structure 1534 includes two substructures 1534A to B. Similar to the substructures 1532A to B of the embossed structure 1532 of the first metal plate 2a, the substructures 1534A to B of the embossed structure 1534 of the second metal plate 2b are each defined by annular recesses in the second metal plate 2b. The substructures 1534A to B of the embossed structure 1534 of the first metal plate 2b are arranged in a mirror-symmetrical manner with respect to two mirror planes 1554A and 1554B, which are also aligned parallel to the stacking direction 7.

[0181] exist Figure 15 In the exemplary embodiment of the separator plate 200 shown, when the intersection point 1556 of the mirror planes 1554A and 1554B is located within a window 1550, for example, arranged to surround the centroid 1549 of a rectangular area spanned by the edge 1535 of the through hole, the metal plates 2a and 2b forming the separator plate 200 meet, for example, a first precision criterion and are considered to be sufficiently and precisely aligned relative to each other. As an alternative precision criterion, the distance (relative to the maximum permissible distance S) between the intersection point 1556 of the mirror planes 1554A and 1554B of the first embossed structure 1534 of the second layer 2b and the intersection point 1557 of the mirror planes 1545A and 1545B of the first through hole 1531 of the first layer 2a) can also be considered. maxHere, the standard is satisfied at least in the first approximation, because the intersection points 1556 and 1557 of the aforementioned mirror planes coincide at least in visual inspection.

[0182] When the second measuring structure 1500b of the separator plate 200 (not shown here), which is of the same type as the measuring structure 1500a described above and is spaced apart from the first measuring structure 1500a, also meets the first accuracy standard described above, the metal plates 2a and 2b forming the separator plate 200 meet the second accuracy standard. Therefore, during the positioning of the metal plates 2a and 2b in the joining tool, for example, when the metal plates 2a and 2b meet the accuracy standards described herein for the first and second measuring structures, the metal plates 2a and 2b can be joined.

[0183] Figure 16 A top view shows the relationship with Figure 4A Similar to the measuring structure 1600 of the separator plate 200, wherein, as Figure 4A As shown, the observation direction is oriented along the negative z-direction 7. Measurement structure 1600 can replace measurement structures 400a, 400b, 500, 600, 700, 800, 900, 1100, 1200, 1300, 1400a, and 1500a of separator plate 200. However, separator plate 200 may also include only one, several (especially two in total), or all of the measurement structures 400a, 400b, 500, 600, 700, 800, 900, 1100, 1200, 1300, 1400a, 1500a, and 1600.

[0184] Here, the first imprinted structure 1632 of the first metal plate 2a includes three substructures 1632A to C, which are arranged to surround the first through-hole 1631 of the first metal plate 2a. The first imprinted structure 1634 of the second metal plate 2b also includes three substructures 1634A to D, which are respectively arranged in their portions 1634A' to C' outside a region 1637 of the second metal plate 2b, which is defined by the vertical projection of at least one first through-hole 1631 of the first metal plate 2A onto the second metal plate 2b; as a result, only the remaining portions of the substructures 1634A to C can be illuminated, and the positioning of the two layers 2A, 2b relative to each other is performed via these remaining portions.

[0185] Figure 17 A top view shows the relationship with Figure 4A Similar to the measuring structure 1700 of the separator plate 200, wherein, as Figure 4AAs shown, the observation direction is oriented along the negative z-direction 7. Measurement structure 1700 can replace measurement structures 400a, 400b, 500, 600, 700, 800, 900, 1100, 1200, 1300, 1400a, 1500a, and 1600 of the separator plate 200. However, the separator plate 200 may also include only one, several (especially two in total), or all of the measurement structures 400a, 400b, 500, 600, 700, 800, 900, 1100, 1200, 1300, 1400a, 1500a, 1600, and 1700.

[0186] exist Figure 17 In the first metal plate 2a, the embossed structure 1732 includes substructures, namely two substructures 1732A-B. Compared to the previous exemplary embodiment, the measuring structure 1700 includes not only a first through-hole in the first metal plate 2a, but also a group 1731 of first through-holes having two through-holes 1731A-B. These are collectively surrounded by an envelope 1751, which is represented here by a long dashed line. It is evident that certain portions of the first embossed structure 1734 of the second metal plate 2b pass through the two through-holes 1731A-B, i.e., in the orthogonal projection of these through-holes 1731A-B onto the plane of the second metal plate 2b, certain portions 1734' of the first embossed structure of the second metal plate 2b are hidden by the first metal plate 2a between regions 1737A-B. In the optimal positioning of the two metal plates 2a, 2b relative to each other, such as Figure 17 As shown, the centroid 1749 of the envelope 1751 coincides with the centroid 1759 of the embossing structure 1734 of the second metal plate 2b and the centroid 1747 of the substructures 1732A to B of the embossing structure 1732 of the first metal plate 2a.

[0187] Figure 18 A top view shows the relationship with Figure 4A Similar to the measuring structure 1800 of the separator plate 200, wherein, as Figure 4A As shown, the observation direction is oriented along the negative z-direction 7. Measurement structure 1800 can replace measurement structures 400a, 400b, 500, 600, 700, 800, 900, 1100, 1200, 1300, 1400a, 1500a, 1600, and 1700 of separator plate 200. However, separator plate 200 may also include only one, several (especially two in total), or all of the measurement structures 400a, 400b, 500, 600, 700, 800, 900, 1100, 1200, 1300, 1400a, 1500a, 1600, 1700, and 1800.

[0188] Figure 18A measuring structure 1800 according to a second variation of the invention is shown. A first embossed structure 1832 of the first metal plate 2a has a semi-convex cross-section and is surrounded by a first through-opening group 1831, which includes three through-openings 1831A-C. Both the through-openings 1831A-C and the first embossed structure 1832 have a generally circular design. The first embossed structure 1832 of the first metal plate 2A is still surrounded by a first embossed structure 1834 of the second metal plate 2b, wherein only three portions 1834A-C are located in regions 1837A-C that appear during the orthogonal projection of the group 1831 of the first through-openings 1831A-C onto the second metal plate 2b. Two metal plates 2a and 2b are arranged very precisely relative to each other. The axis of symmetry 1858 of the first imprint structure 1832 of the first metal plate 2a, the axis of symmetry 1848 of the first imprint structure 1834 of the second metal plate 2b, and the axis of symmetry of the envelope 1851 of the group 1831 of the first through openings 1831A to C all coincide and are located at the centroid of the envelope 1851 of the group 1831 of the first through openings 1831A to C. Similarly, only the mirror plane 1855 of the group 1831 of the first through openings 1831A to C coincides with the mirror plane 1845A of the first imprint structure 1832 of the first metal plate 2a and the mirror plane 1854A of the first imprint structure 1834 of the second metal plate 2b, and also coincides with the mirror plane 1845B of the first imprint structure 1832 of the first metal plate 2a and the mirror plane 1854B of the first imprint structure 1834 of the second metal plate 2b.

[0189] Figure 19 A top view shows the relationship with Figure 4A Similar to the measuring structure 1900 of the separator plate 200, wherein, as Figure 4A As shown, the observation direction is oriented along the negative z-direction 7. Measurement structure 1900 can replace measurement structures 400a, 400b, 500, 600, 700, 800, 900, 1100, 1200, 1300, 1400a, 1500a, 1600, 1700, and 1800 of separator plate 200. However, separator plate 200 may also include only one, several (especially two in total), or all of the measurement structures 400a, 400b, 500, 600, 700, 800, 900, 1100, 1200, 1300, 1400a, 1500a, 1600, 1700, 1800, and 1900.

[0190] Figure 19The measuring structure 1900 according to a second variation of the invention is also shown. The first embossing structure 1932 of the first metal plate 2a is oval in top view and has a semi-convex cross-section, surrounded by a group 1931 of first through openings, which here includes two through openings 1931A-B. The first embossing structure 1932 of the first metal plate 2a is still surrounded by a first embossing structure 1934 of the second metal plate 2b, which includes substructures with two semi-convex shapes, embossing structures 1834A-B, which are entirely located in regions 1937A-B that appear during the orthogonal projection of the group 1931 of the first through openings 1931A-B onto the second metal plate 2b. Both the through openings 1931A-B and the substructures 1934A-B have a generally circular design. Two metal plates 2a and 2b are arranged very precisely relative to each other. The axis of symmetry 1958 of the first imprint structure 1932 of the first metal plate 2a, the axis of symmetry 1948 of the first imprint structure 1934 of the second metal plate 2b, and the axis of symmetry of the envelope 1951 of the group 1931 of the first through openings 1931A to B all coincide and are located at the centroid of the envelope 1951 of the group 1931 of the first through openings 1931A to B. Similarly, the mirror plane 1955A of the group 1931 of the first through openings 1931A to B coincides with the mirror plane 1945A of the first embossing structure 1932 of the first metal plate 2a and the mirror plane 1954A of the first embossing structure 1934 of the second metal plate 2b, and also coincides with the mirror plane 1955B of the group 1931 of the first through openings 1931A and 1945B of the first embossing structure 1932 of the first metal plate 2a and the mirror plane 1954B of the first embossing structure 1934 of the second metal plate 2b.

Claims

1. A separator plate assembly (200) for an electrochemical system (1), comprising a first metal plate (2a) and a second metal plate (2b), the first metal plate and the second metal plate being in contact with each other at least in a region along their flat sides facing each other. The first metal plate (2a) includes: A group (1731) of a first through hole (431, 531, 631, 731, 831, 931, 1131, 1231, 1331, 1431, 1531, 1631) or a first through hole (1731A~B); and a first embossing structure (432, 532, 632, 732, 832, 932, 1132, 1232, 1332, 1432, 1532, 1632, 1732), the first embossing structure A group (1731) of the first through holes (431, 531, 631, 731, 831, 931, 1131, 1231, 1331, 1431, 1531, 1631) or the first through holes (1731A~B) surrounding the first metal plate (2a), wherein the first through holes or the group of first through holes and the first embossing structure of the first metal plate (2a) are arranged in the outer edge region (22) of the first metal plate (2a). The second metal plate (2b) includes: a first embossed structure (434, 534, 634, 734, 834, 934, 1134, 1234, 1334, 1434, 1534, 1634, 1734), the first embossed structure being at least partially disposed in the second metal plate (2b) through the first through hole (431, 531, 631, 731, 831, 931, 1131, 1231, 1331) of the first metal plate (2A). The group (1731) of 1431, 1531, 1631) or the first through hole (1731A~B) is located in the area (437, 537, 637, 737, 837, 937, 1137, 1237, 1337, 1437, 1537, 1637, 1737A~B) defined by the vertical projection of the second metal plate (2b), wherein the first embossed structure of the second metal plate (2b) is arranged in the outer edge region of the second metal plate (2b). In this process, light can pass through the first through hole or group of first through holes of the first metal plate (2a) and irradiate the first imprint structure of the second metal plate (2b).

2. The separator plate assembly (200) as claimed in claim 1, characterized in that, The first embossed structure (432, 532, 632, 732, 832, 932, 1132, 1232, 1332) of the first metal plate (2a) includes an embossed structure that completely encloses the first through hole (431, 531, 631, 731, 831, 931, 1131, 1231, 1331) or the group of first through holes of the first metal plate (2a).

3. The separator plate assembly (200) as described in any of the preceding claims, characterized in that, The first embossed structure (1432, 1532, 1632, 1732) of the first metal plate (2a) includes a plurality of substructures (1432A~C, 1532A~B, 1632A~C, 1732A~B), which are arranged as a group (1731) surrounding the first through hole (1431, 1531, 1631) or the first through hole (1731A~B) of the first metal plate (2a).

4. A separator plate assembly (200) for an electrochemical system (1), comprising a first metal plate (2a) and a second metal plate (2b), the first metal plate and the second metal plate being in contact with each other at least in a region along their flat sides facing each other. The first metal plate (2a) includes a first embossed structure (1832, 1993) and a group (1831) of first through holes (1831A~C, 1931A~B) surrounding the first embossed structure (1832, 1932), wherein, The first through hole assembly and the first embossed structure of the first metal plate (2a) are arranged in the outer edge region (22) of the first metal plate (2a). The second metal plate (2b) includes a first embossed structure (1834, 1934), which is at least partially arranged in an area (1837, 1937) of the second metal plate (2b) defined by the vertical projection of the group (1831, 1931) of the first through holes (1831A~C) of the first metal plate (2a) onto the second metal plate (2b), wherein the first embossed structure of the second metal plate (2b) is arranged in the outer edge region of the second metal plate (2b). In this process, light can pass through the first through hole of the first metal plate (2a) and irradiate the first imprint structure of the second metal plate (2b).

5. The separator plate assembly (200) as claimed in claim 4, characterized in that, The first embossed structure (1934) of the second metal plate (2a) includes an embossed structure (1934) that completely encloses the first embossed structure (1932) of the first metal plate (2a).

6. The separator plate assembly (200) as claimed in any one of claims 4 or 5, characterized in that, The first embossed structure (1834) of the second metal plate (2a) includes a plurality of substructures (183A~C) arranged around the first embossed structure (1832) of the first metal plate (2a).

7. The separator plate assembly (200) as claimed in claim 1 or 4, characterized in that, The first embossed structure (432, 532, 632, 732, 832, 932, 1432) of the first metal plate (2a) protrudes completely or at least partially above the first plate plane (439, 539, 639, 739, 839, 939, 1439) in a direction opposite to the second metal plate (2b) and perpendicular to the first plate plane (439, 539, 639, 739, 839, 939, 1439), the first plate plane being defined by the first metal plate (2a).

8. The separator plate assembly (200) as claimed in claim 1 or 4, characterized in that, The first embossed structure (432, 532, 632, 732, 832, 932, 1132, 1232, 1332, 1432, 1532, 1632, 1732, 1832, 1932) of the first metal plate (2a) is spaced apart from the first through hole (431, 531, 631, 731, 831, 931, 1131, 1231, 1331, 1431, 1531, 1631) of the first metal plate (2a), or spaced apart from the envelope (1751, 1851, 1951) of the group (1731, 1831A~C, 1931A~B) surrounding the first through hole (1731A~B).

9. The separator plate assembly (200) as claimed in claim 1 or 4, characterized in that, The first embossed structure (432, 532, 632, 732, 832, 932, 1132, 1232, 1332, 1432, 1532, 1632, 1732, 1832, 1932) of the first metal plate (2a) is relative to at least one mirror plane (445, 545, 645, 745, 845, 945, 1145, 1245A~B, 1345, 14). 45, 1545A~B, 1645, 1745, 1845A~B, 1945A~B) are mirror symmetrical, and the mirror plane is perpendicularly located on the first metal plate plane (439, 539, 639, 739, 839, 939, 1139, 1239, 1339, 1439, 1539, 1639, 1739, 1839, 1939) defined by the first metal plate (2a).

10. The separator plate assembly (200) as claimed in claim 1 or 4, characterized in that, The first embossed structures (432, 532, 632, 732, 832, 932, 1132, 1232, 1332, 1432, 1532, 1632, 1732, 1832, 1932) of the first metal plate (2a) are symmetrical about the axes of symmetry (458, 558, 658, 758, 858, 958, 1158, 1258, 1358). The first metal plate (2a) is rotationally symmetrical about 1458, 1558, 1658, 1758, 1858, and 1958, with the axis of symmetry located perpendicularly on the first plate plane (439, 539, 639, 739, 839, 939, 1139, 1239, 1339, 1439, 1539, 1639, 1739, 1839, and 1939) defined by the first metal plate (2a).

11. The separator plate assembly (200) as claimed in claim 1 or 4, characterized in that, The envelope (1751, 1851, 1951) of the first through-hole edge (435, 535, 635, 735, 835, 935, 1135, 1235, 1335, 1435, 1535, 1635) or the group (1731, 1831, 1931) of the first through-hole (1731A~B, 1831A~C, 1931A~B) of the first metal plate (2a) relative to at least one mirror plane (455, 555, 655, 755, 85). 5, 955, 1155, 1255A~B, 1355A~B, 1455, 1555A~B, 1655, 1755, 1855, 1955A~B) are mirror symmetrical, and the mirror plane is perpendicularly located on the first plate plane (439, 539, 639, 739, 839, 939, 1139, 1239, 1339, 1439, 1539, 1639, 1739, 1839, 1939) defined by the first metal plate (2a).

12. The separator plate assembly (200) as claimed in claim 1 or 4, characterized in that, The envelope (1751, 1851, 1951) of the first through-hole edge (435, 535, 635, 735, 835, 935, 1235, 1335, 1435, 1535, 1635) or the group (1731, 1831, 1931) of the first through-hole (1731A~B, 1831A~C, 1931A~B) of the first metal plate (2a) relative to the axis of symmetry (438, 538, 638) of the first through-hole edge (435, 535, 635, 735, 835, 935, 1235, 1335, 1435, 1535, 1635) of the first through-hole (1731A~B, 1831A~C, 1931A~B) of the first through-hole (1731A~B, 1831, 1931) of the first through-hole (1731A~B, 1831A~C, 1931) of the first through-hole (2a) of the first metal plate (2a) is relative to the axis of symmetry (438, 538, 638). The first plate (2a) is rotationally symmetrical about 738, 838, 938, 1238, 1338, 1438, 1538, 1638, 1738, 1838, and 1938, with the axis of symmetry located perpendicularly on the first plate plane (2a) defined by the first metal plate (2a).

13. The separator plate assembly (200) as claimed in claim 1 or 4, characterized in that, The second metal plate (2b) includes a first through hole (433, 633, 933, 1133, 1433), and the first embossed structure (434, 634, 934, 1134, 1434) of the second metal plate (2b) is arranged to surround the first through hole (433, 633, 933, 1133, 1433) of the second metal plate (2b).

14. The separator plate assembly (200) as claimed in claim 1 or 4, characterized in that, The first embossed structure (434, 534, 634, 734, 834, 934, 1134, 1234, 1334, 1434, 1534, 1634, 1734, 1834, 1934) of the second metal plate (2b) relative to the first embossed structure (434, 534, 634, 734, 834, 934, 1134, 1234, 1334, 1434, 1534, 1634, 173) of the second metal plate (2b). The mirror planes (454, 554, 654, 754, 854, 954, 1154, 1254A~B, 1354A~B, 1454, 1554A~B, 1654, 1754, 1854A~B, 1954A~B) of the second metal plate (2b) are mirror symmetrical, and the mirror planes are perpendicularly located on the second metal plate plane (440, 540, 640, 740, 840, 940, 1440) defined by the second metal plate (2b).

15. The separator plate assembly (200) as claimed in claim 1 or 4, characterized in that, The first embossed structure (434, 534, 634, 734, 834, 934, 1134, 1234, 1334, 1434, 1534, 1634, 1734, 1834, 1934) of the second metal plate (2b) is symmetrical about the axis of symmetry (448, 548, 648, 748, 848, 948, 1148, 1248, 1348, 1448) of the first embossed structure of the second metal plate (2b) with respect to the axis of symmetry (448, 548, 648, 748, 848, 948, 1148, 1248, 1348, 1448) of the first embossed structure of the second metal plate (2b). The axes of symmetry (448, 548, 648, 748, 848, 948, 1148, 1248, 1348, 1448, 1548, 1648, 1748, 1848, 1948) are rotationally symmetrical and are located vertically on the second plate plane (440, 540, 640, 740, 840, 940, 1440) defined by the second metal plate (2b).

16. A method of manufacturing a separator plate assembly (200) for an electrochemical system, comprising the steps of: In the first tool, a first through hole (431) or a group of first through holes (1731A~B, 1831A~C, 1931A~B) is punched out from the first metal plate (2a) (S31). In the second tool, the first embossing structure (432, 1732A~B, 1832, 1932) is embossed (P32) onto the first metal plate (2a). The first embossed structure (432, 1732A~B) surrounds the first through hole (431) or the group of first through holes (1731A~B) (1731), or the group of first through holes (1831A~C, 1931A~B) surrounds the first embossed structure (1832, 1932). In the third tool, the first imprinted structure (434, 1734, 1834A~C, 1934A~B) is imprinted (P34) onto the second metal plate (2b); as well as The first metal plate (2a) and the second metal plate (2b) are positioned (P) on top of each other such that the first metal plate (2a) and the second metal plate (2b) are in contact with each other at least in the region along their flat sides facing each other, and the first embossed structure (434, 1734, 1834A~C, 1934A~B) of the second metal plate (2b) is at least partially arranged in the second metal plate (2b through the first through hole (431) or the first through hole of the first metal plate (2a). The group of (1731A~B, 1831A~C, 1931A~B) is located in the area (437, 1737A~B, 1837A~C, 1937A~B) defined by the vertical projection of its group on the second metal plate (2b), wherein the first through hole or group of first through holes of the first metal plate (2a) and the first embossing structure are arranged in the outer edge region (22) of the first metal plate (2a), and the first embossing structure of the second metal plate (2b) is arranged in the outer edge region of the second metal plate (2b). Light is passed through the first through hole or group of first through holes in the first metal plate (2a) and irradiated onto the first imprinted structure of the second metal plate (2b), thereby enabling the detection of an offset between the first imprinted structure of the first metal plate (2a) and the first imprinted structure of the second metal plate (2b).

17. The method as described in claim 16, characterized in that, It also includes the following steps: The distance between a first reference point and a second reference point is detected non-contactly, wherein the first reference point is determined based on the first imprinted structure (432a) of the first metal plate (2a), and wherein the second reference point is determined based on the first imprinted structure (434a) of the second metal plate (2b); and If the previously detected deviation (Δ, Δ) between the first reference point and the second reference point a ) not greater than the maximum distance (S) max S max,a If the first metal plate (2a) is connected to the second metal plate (2b) (Va+b), then the first metal plate (2a) will be connected to the second metal plate (2b) (Va+b).

18. The method as described in claim 17, characterized in that, It also includes the following steps: If the previously detected deviation (Δ) between the first reference point and the second reference point is greater than the maximum distance (S) max If the relative arrangement of the first metal plate (2a) and the second metal plate (2b) with respect to each other is changed, the distance between the first reference point and the second reference point will be reduced.

19. A method of manufacturing a separator plate assembly (200) for an electrochemical system, comprising the following steps: In the first tool, (S31a+b) is cut from the first metal plate (2a), and specifically, a first through hole (431a) or a group of first through holes and a second through hole (431b) or a group of second through holes are punched out; In the second tool, the first embossing structure (432a) and the second embossing structure (432b) are embossed (P32a+b) onto the first metal plate (2a). The first embossing structure (432a) surrounds the first through hole (431a) or a group of first through holes, or a group of first through holes surrounds the first embossing structure. The second embossed structure (432b) surrounds the second through hole (431b) or a group of second through holes, or a group of second through holes surrounds the second embossed structure, and In the third tool, the first embossing structure (434a) and the second embossing structure (434b) are embossed (P34a+b) into the second metal plate (2b). The first metal plate (2a) and the second metal plate (2b) are positioned (P) on top of each other such that the first metal plate (2a) and the second metal plate (2b) are in contact with each other at least in the region along their flat sides facing each other, and the first embossed structure (434a) of the second metal plate is at least partially arranged in the region (437a) of the second metal plate defined by the vertical projection of the first through hole (431a) or the group of first through holes of the first metal plate onto the second metal plate, and the second embossed structure (434a) of the second metal plate (2b) is also arranged in the region (437a) of the second metal plate (2b). An embossed structure (434b) is at least partially disposed in a region (437b) of the second metal plate (2b) defined by the vertical projection of the second through hole (431b) or group of second through holes of the first metal plate (2a) onto the second metal plate (2b), wherein the first through hole (431a) or group of first through holes of the first metal plate (2a) and the first embossed structure are disposed in the outer edge region (22) of the first metal plate (2a), and the first embossed structure of the second metal plate (2b) is disposed in the outer edge region of the second metal plate (2b). The light passes through the first through hole or group of first through holes of the first metal plate (2a) and is perpendicularly irradiated onto the first imprinted structure of the second metal plate (2b), so that when there is an offset between the first imprinted structure of the first metal plate (2a) and the first imprinted structure of the second metal plate (2b), the offset can be detected.

20. The method as described in claim 19, characterized in that, It also includes the following steps: The distance between a first reference point and a second reference point is detected non-contactly, wherein the first reference point is determined based on the first imprinted structure (432a) of the first metal plate (2a), and wherein the second reference point is determined based on the first imprinted structure (434a) of the second metal plate (2b). and non-contact detection of the distance between a third reference point and a fourth reference point, wherein the third reference point is determined based on the second embossed structure (432b) of the first metal plate (2a), and wherein the fourth reference point is determined based on the second embossed structure (434b) of the second metal plate (2b) (T); and If the previously detected deviation (Δ, Δ) between the first reference point and the second reference point a ) not greater than the maximum distance (S) max S max,a ), and the previously detected deviation (Δ) between the third reference point and the fourth reference point b ) not greater than the maximum distance (S) max,b If the first metal plate (2a) is connected to the second metal plate (2b) (Va+b), then the first metal plate (2a) will be connected to the second metal plate (2b) (Va+b).

21. The method as described in claim 20, characterized in that, It also includes the following steps: If the previously detected deviation (Δ) between the first reference point and the second reference point a ) is greater than the maximum distance (S) max,a ), and / or if the previously detected deviation (Δ) between the third reference point and the fourth reference point b ) is greater than the maximum distance (S) max,b The relative arrangement of the first metal plate (2a) and the second metal plate (2b) relative to each other is changed such that the distance between the first reference point and the second reference point decreases after the relative arrangement is changed, and / or the distance between the third reference point and the fourth reference point decreases.

22. The method as described in claim 20 or 21, characterized in that, Non-contact detection of the distance between the first reference point and the second reference point includes: illuminating the first imprinted structure (432a) of the first metal plate (2a) with illumination light emitted by a light source, and at least partially illuminating the second imprinted structure (434a) of the second metal plate (2b); and detecting the illumination light reflected or scattered at the first imprinted structure (432a) of the first metal plate (2a) and at the first imprinted structure of the second metal plate (2b) using a detection device; and Non-contact detection of the distance between the third reference point and the fourth reference point includes: illuminating the second imprinted structure (432b) of the first metal plate (2a) with illumination light emitted by a light source, and at least partially illuminating the second imprinted structure (434b) of the second metal plate (2b); and detecting the illumination light reflected or scattered at the second imprinted structure of the first metal plate (2a) and the second imprinted structure of the second metal plate (2b) using a detection device, wherein the light source and the detection device... The measuring device is arranged on the side of the metal plates positioned on top of each other, away from the second metal plate (2b), such that the illumination light passes through at least one first through hole (431a) or a group of first through holes in the first metal plate (2a) and illuminates the first embossed structure (434a) of the second metal plate (2b), and passes through at least one second through hole (431b) or a group of second through holes (434b) in the first metal plate (2a) and illuminates the second embossed structure (434b) of the second metal plate (2b).

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