Display panel and manufacturing method thereof, and display device

Abstract

The present application discloses a display panel and a method for manufacturing the same, and a display device. The display panel includes a substrate; a pixel definition layer located on one side of the substrate, the pixel definition layer including a plurality of pixel openings distributed in an array and a body portion surrounding the pixel openings; a carrier layer located on the side of the pixel definition layer facing away from the substrate; wherein the carrier layer is in contact with the metal, a trap is formed in the carrier layer to suppress the lateral conduction capability of the carrier layer, and the orthographic projection of the trap on the substrate overlaps with the orthographic projection of the body portion on the substrate. According to the embodiments of the present application, lateral leakage can be reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] As a flat display panel, Organic Light Emitting Display (OLED) display panel is widely used in various consumer electronic products such as mobile phones, televisions, personal digital assistants, digital cameras, laptops, desktop computers, etc. due to its advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display panels.

[0003] There are some common layers in the OLED display panel. Since the common layers have good conductivity, when controlling a certain luminous pixel to emit light, lateral leakage will occur, causing other luminous pixels to light up secretly.

[0004] Therefore, how to reduce lateral leakage has become a technical problem that technical personnel in this field need to solve urgently. Summary of the invention

[0005] Embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device, which can reduce lateral leakage.

[0006] In a first aspect, an embodiment of the present application provides a display panel, comprising: a substrate; a pixel definition layer located on one side of the substrate, the pixel definition layer comprising a plurality of pixel openings distributed in an array and a main body portion surrounding the pixel openings; a carrier layer located on the side of the pixel definition layer facing away from the substrate; wherein the carrier layer contacts the metal layer, and a trap is formed in the carrier layer to suppress the lateral conduction ability of the carrier layer, and the orthographic projection of the trap on the substrate overlaps with the orthographic projection of the main body portion on the substrate.

[0007] In a possible implementation of the first aspect, the carrier layer includes a transport material;

[0008] Preferably, the carrier layer includes a stacked hole injection layer, a hole transport layer and an electron blocking layer, the hole injection layer is located on a side of the hole transport layer facing the substrate, the electron blocking layer is located on a side of the hole transport layer facing away from the substrate, at least one of the hole injection layer, the hole transport layer and the electron blocking layer is in contact with the metal, and a trap is formed in at least one of the hole injection layer, the hole transport layer and the electron blocking layer;

[0009] Preferably, the hole injection layer is in contact with the metal layer, and traps are formed in the hole injection layer.

[0010] In a possible implementation of the first aspect, the material of the metal layer includes at least one of silver, magnesium, and aluminum;

[0011] Preferably, the orthographic projection of the metal layer on the substrate is in the shape of a strip or a grid.

[0012] Preferably, the orthographic projections of the plurality of traps on the substrate are in the shape of stripes or grids.

[0013] Preferably, the display panel further includes:

[0014] A first electrode is located between the carrier layer and the substrate, and the first electrode is exposed to the pixel opening;

[0015] A light-emitting layer is located in the pixel opening and partially located on the side of the carrier layer facing away from the first electrode, the light-emitting layer includes a plurality of light-emitting units with different light-emitting colors, and each light-emitting unit corresponds to the pixel opening one by one;

[0016] The second electrode layer is located on the side of the light-emitting layer facing away from the substrate, and the second electrode layer is a continuous structure.

[0017] In a second aspect, an embodiment of the present application provides a method for preparing a display panel, comprising:

[0018] forming a pixel definition layer on the substrate, wherein the pixel definition layer comprises a plurality of pixel openings distributed in an array and a body portion surrounding the pixel openings;

[0019] forming a carrier layer on a surface of the pixel definition layer facing away from the substrate;

[0020] A patterned metal layer is formed in contact with the carrier layer, and the orthographic projection of the patterned metal layer on the substrate overlaps with the orthographic projection of the main body on the substrate, so that the patterned metal layer reacts with the carrier layer to generate traps that inhibit the lateral conduction ability of the carrier layer.

[0021] In a possible implementation of the second aspect, the carrier layer includes a hole injection layer, a hole transport layer and an electron blocking layer;

[0022] Forming a carrier layer on a surface of the pixel definition layer facing away from the substrate comprises:

[0023] forming a hole injection layer, a hole transport layer and an electron blocking layer on the surface of the pixel definition layer facing away from the substrate;

[0024] A patterned metal layer is formed in contact with the carrier layer, comprising:

[0025] forming a patterned metal layer in contact with at least one of the hole injection layer, the hole transport layer, and the electron blocking layer;

[0026] Preferably, a patterned metal layer is formed in contact with the hole injection layer;

[0027] Preferably, a patterned metal layer is formed on the side of the hole injection layer facing away from the substrate.

[0028] In a possible implementation of the second aspect, a patterned metal layer in contact with the carrier layer is formed, and an orthographic projection of the patterned metal layer on the substrate overlaps with an orthographic projection of the body portion on the substrate, including:

[0029] A patterned metal layer is formed in contact with the carrier layer, wherein the orthographic projection of the patterned metal layer on the substrate overlaps with the orthographic projection of the main body on the substrate, and the orthographic projection of the patterned metal layer on the substrate does not overlap with the orthographic projection of the side wall of the main body on the substrate.

[0030] In a possible implementation of the second aspect, the orthographic projection of the patterned metal layer on the substrate is in a strip shape or a grid shape.

[0031] In a possible implementation of the second aspect, the thickness of the patterned metal layer is 10 nm to 50 nm.

[0032] In a possible implementation of the second aspect, the material of the patterned metal layer includes at least one of silver, magnesium, and aluminum.

[0033] In a third aspect, an embodiment of the present application provides a display device, comprising a display panel according to any one of the embodiments of the first aspect, or a display panel prepared using the method for preparing a display panel according to any one of the embodiments of the second aspect.

[0034] According to the display panel and its preparation method and display device provided by the embodiments of the present application, since there are traps in the carrier layer that can suppress the lateral conduction capability of the carrier layer, and the orthographic projection of the trap on the substrate is located between the orthographic projections of the bottom surfaces of the adjacent pixel openings on the substrate, when a certain sub-pixel of the display panel is controlled to emit light, the carriers in the carrier layer cannot be transmitted to the adjacent sub-pixels, thereby reducing the possibility of the adjacent sub-pixels secretly lighting up, that is, reducing the lateral leakage of the display panel. In addition, the traps are generated by the contact between the metal layer and the carrier layer, so in the preparation process of the display panel, only one metal layer in contact with the carrier layer needs to be prepared to form a trap with the ability to suppress the lateral conduction capability of the carrier layer, which is relatively easy to implement in terms of process. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0036] Figure 1A cross-sectional schematic diagram of a display panel provided by an embodiment of the present application is shown;

[0037] Figure 2 A cross-sectional schematic diagram of a display panel provided by another embodiment of the present application is shown;

[0038] Figure 3 A cross-sectional schematic diagram of a display panel provided in yet another embodiment of the present application is shown;

[0039] Figure 4 A schematic top view of a display panel provided by an embodiment of the present application is shown;

[0040] Figure 5 A schematic top view of a display panel provided by another embodiment of the present application is shown;

[0041] Figure 6 A schematic diagram showing a process of a method for preparing a display panel provided by an embodiment of the present application;

[0042] Figure 7 A schematic diagram showing a process of a method for preparing a display panel provided in another embodiment of the present application;

[0043] Figure 8 A schematic structural diagram of a display device provided by an embodiment of the present application is shown. DETAILED DESCRIPTION

[0044] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0045] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0046] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. In addition, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0047] The light-emitting layer in the OLED display panel includes light-emitting layers of sub-pixels of different colors. The hole transport layer, hole injection layer, electron blocking layer, electron injection layer, electron transport layer and hole blocking layer corresponding to the light-emitting layers of these sub-pixels of different colors are usually formed in an open mask manner (that is, these film layers are all common layers). This results in the possibility that carriers may be transmitted laterally to adjacent sub-pixels during use, and the common layer leaks electricity and causes crosstalk, resulting in the problem of adjacent sub-pixels being slightly bright and inaccurate color display.

[0048] To solve the above problems, embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device. Embodiments of the display panel, a method for manufacturing a display panel, and a display device will be described below in conjunction with the accompanying drawings.

[0049] An embodiment of the present application provides a display panel, which may be an organic light emitting diode display panel.

[0050] like Figure 1 As shown, the display panel 100 includes a substrate 10, a pixel definition layer 20, and a carrier layer 30. The pixel definition layer 20 is located on one side of the substrate 10, and the pixel definition layer 20 includes a plurality of pixel openings 21 distributed in an array and a body portion 22 surrounding the pixel openings. The carrier layer 30 is located on the side of the pixel definition layer facing away from the substrate 10. Exemplarily, the pixel openings 21 may correspond one to one with the sub-pixels of the display panel 100.

[0051] The carrier layer 30 and the metal layer ( Figure 1 The pixel definition layer 20 is in contact with the first region S1 and the second region S2 (not shown in the figure), and a trap (not shown in the figure) is formed in the carrier layer 30 to suppress the lateral conduction ability of the carrier layer 30, and the orthographic projection of the trap on the substrate 10 overlaps with the orthographic projection of the main body 22 of the pixel definition layer 20 on the substrate 10. Exemplarily, the carrier layer 30 includes a first region S1 and a second region S2, and the second region S1 is located between adjacent first regions S1, the orthographic projection of the second region S2 on the substrate 10 coincides with the orthographic projection of the main body 22 on the substrate 10, and the trap is located in the second region S2 of the carrier layer 30. The pixel opening 21 of the pixel definition layer 20 is generally used to define a sub-pixel, that is, in the embodiment of the present application, at least a trap that suppresses the lateral conduction ability of the carrier layer 30 is formed in the carrier layer 30 between adjacent sub-pixels.

[0052] According to the embodiment of the present application, since there are traps in the carrier layer 30 that suppress the lateral conduction capability of the carrier layer, and the orthographic projection of the traps on the substrate 10 overlaps with the orthographic projection of the main body 22 of the pixel definition layer 20 on the substrate 10, when a sub-pixel of the display panel is controlled to emit light, the carriers in the carrier layer 30 cannot be transmitted to the adjacent sub-pixels due to the existence of the traps, thereby reducing the possibility of the adjacent sub-pixels secretly lighting up, that is, it is possible to reduce the lateral leakage of the display panel. In addition, the traps are generated by the contact between the metal layer and the carrier layer 30, so in the preparation process of the display panel, only one metal layer in contact with the carrier layer 30 needs to be prepared to form a trap with the ability to suppress the lateral conduction capability of the carrier layer 30, which is relatively easy to implement in terms of process.

[0053] The carrier layer 30 may refer to a film layer including a hole transport material. The inventors of the present application have found through a large number of experiments that after the metal contacts the carrier layer 30 including the hole transport material, the carrier layer 30 can generate traps. Therefore, the traps in the embodiments of the present application can be generated by the contact between the metal layer and the carrier layer 30.

[0054] Exemplarily, the carrier layer 30 may be a single-layer film layer, or may be a multi-layer film layer stacked in layers, and each of the multi-layer film layers stacked in layers may include a hole transport material.

[0055] In some optional embodiments, please refer to Figure 2The carrier layer 30 may include a stacked hole injection layer 31, a hole transport layer 32, and an electron blocking layer 33, wherein the hole injection layer 31 is located on the side of the hole transport layer 32 facing the substrate, and the electron blocking layer 33 is located on the side of the hole transport layer 32 facing away from the substrate 10. At least one of the hole injection layer 31, the hole transport layer 32, and the electron blocking layer 33 may be in contact with the metal layer, and traps are formed in at least one of the hole injection layer 31, the hole transport layer 32, and the electron blocking layer 33.

[0056] The hole injection layer 31, the hole transport layer 32 and the electron blocking layer 33 are essentially composed of hole transport materials. Exemplarily, at least one patterned metal layer may be formed, so that the patterned metal layer is in contact with at least one of the hole injection layer 31, the hole transport layer 32 and the electron blocking layer 33, so that at least one of the hole injection layer 31, the hole transport layer 32 and the electron blocking layer 33 can generate traps, thereby destroying the lateral conduction capability of at least one of the hole injection layer 31, the hole transport layer 32 and the electron blocking layer 33, so as to reduce lateral leakage.

[0057] In some optional embodiments, the hole injection layer 31 may be in contact with the metal layer to form traps in the hole injection layer 31 .

[0058] In some optional embodiments, the material of the metal layer may include at least one of silver, magnesium, and aluminum. Silver, magnesium, and aluminum are relatively active metals. The inventors of the present application have found that, for example, silver atoms will penetrate the carrier layer 30 during the evaporation process of silver, and generate traps in the carrier layer 30. The same is true for magnesium and aluminum.

[0059] In some optional embodiments, during the preparation of the display panel 100, a patterned metal layer may be formed on the carrier layer 30 to generate traps. It is understood that if the patterned metal layer reacts completely with the carrier layer 30, the patterned metal layer no longer exists in the formed display panel. Figure 3 As shown, the formed display panel still has a patterned metal layer.

[0060] In some optional embodiments, such as Figure 4 As shown, the orthographic projection of the patterned metal layer 40 on the substrate 10 may be in the shape of a strip. Since the traps are generated by the contact between the patterned metal layer 40 and the carrier layer 30, the orthographic projection of the plurality of traps on the substrate 10 also substantially forms a strip.

[0061] In some other optional embodiments, such as Figure 5As shown, the orthographic projection of the patterned metal layer 40 on the substrate 10 may be in a grid shape. Since the traps are generated by the contact between the patterned metal layer 40 and the carrier layer 30, the orthographic projection of the plurality of traps on the substrate 10 also substantially forms a grid shape.

[0062] In the above embodiment, since the traps are generated by the contact between the metal layer and the carrier layer 30 , the orthographic projection of the patterned metal layer 40 on the substrate 10 is also located between the orthographic projections of the bottom surfaces OP1 of adjacent pixel openings 21 on the substrate 10 .

[0063] In some optional embodiments, please continue to refer to Figure 2 or Figure 3 The display panel 100 may further include a hole blocking layer 34, an electron transport layer 35, an electron injection layer 36, a first electrode 37, a second electrode layer 38 and a light-emitting layer. The hole blocking layer 34 is located on the side of the light-emitting layer facing away from the substrate 10, the electron transport layer 35 is located on the side of the hole blocking layer 24 facing away from the light-emitting layer, and the electron injection layer 36 is located on the side of the electron transport layer 35 facing away from the hole blocking layer 34. The first electrode 37 is located between the carrier layer 30 and the substrate 10, the light-emitting layer is located in the pixel opening 21 and on the side of the carrier layer 30 facing away from the first electrode 37, and the light-emitting layer includes a plurality of light-emitting units with different light-emitting colors, and the light-emitting units correspond to the pixel openings 21 one by one.

[0064] The second electrode layer 38 is located on the side of the electron injection layer 36 facing away from the electron transport layer 35, and the second electrode layer 38 may be a continuous structure. For example, the first electrode 37 may be an anode, and the second electrode layer 38 may be a cathode.

[0065] In some optional embodiments, the light-emitting unit includes at least a first light-emitting unit 511, a second light-emitting unit 512, and a third light-emitting unit 513, which emit light of different colors. Figure 2 As shown, the first light-emitting unit 511 may be a red light-emitting unit, the second light-emitting unit 512 may be a green light-emitting unit, and the third light-emitting unit 513 may be a blue light-emitting unit, and the three primary colors realize the full-color display of the OLED display panel. Of course, in other embodiments, other luminous colors may be used, for example, white, magenta, yellow, cyan, etc., which can be reasonably set according to the actual application. In other embodiments, the display panel may also include four or more light-emitting units 220 with different luminous colors.

[0066] In some optional embodiments, the substrate 10 may be a flexible substrate or a rigid substrate, which can be reasonably set as needed. Specifically, the material of the flexible substrate can be polyimide (PI), and the flexible substrate made of polyesterimide material is a polyesterimide substrate; of course, in other embodiments, other flexible materials in the prior art, such as a PET substrate made of plastic, can also be used, which can be reasonably set as needed.

[0067] In some optional embodiments, the substrate 10 may be a single-layer substrate; or a laminated substrate composed of a double layer or a plurality of layers. When the substrate 10 is composed of multiple layers, an insulating material may be filled between two adjacent layers. The insulating material may be an inorganic insulating material such as silicon oxide or silicon nitride. In other alternative embodiments, the insulating material may also be other inorganic insulating materials in the prior art, which is not limited in this embodiment.

[0068] Exemplarily, the substrate 10 may include a pixel circuit (not shown in the figure), which may be electrically connected to the first electrode 37, and an electrical signal may be applied to the first electrode 37 and to the second electrode layer 38 through the pixel circuit to realize the luminous display of the light-emitting unit.

[0069] The embodiment of the present application also provides a method for preparing a display panel. Figure 6 A schematic diagram of a method for manufacturing a display panel provided by an embodiment of the present application is shown. Figure 6 As shown, the method for preparing a display panel provided in the embodiment of the present application may include steps 501 to 504.

[0070] Step 501 : forming a pixel definition layer 20 on a substrate 10 , wherein the pixel definition layer 20 includes a plurality of pixel openings 21 distributed in an array and a body portion 22 surrounding the pixel openings.

[0071] As described above, the substrate 10 may be a flexible substrate or a rigid substrate. The substrate 10 may include a pixel circuit, which will not be described in detail herein. Exemplarily, one side of the substrate 10 has a first electrode 37. The pixel opening 21 of the pixel definition layer 20 formed therein exposes the first electrode 37.

[0072] Step 502 : forming a carrier layer 30 on the surface of the pixel definition layer 20 facing away from the substrate 10 .

[0073] Step 503, forming a patterned metal layer 40 in contact with the carrier layer 30, the orthographic projection of the patterned metal layer 40 on the substrate 10 overlaps with the orthographic projection of the main body 22 of the pixel definition layer 20 on the substrate 10, so that the patterned metal layer 30 reacts with the carrier layer 30 to produce a trap that inhibits the lateral conduction ability of the carrier layer.

[0074] As described above, if the patterned metal layer 40 reacts completely with the carrier layer 30, the patterned metal layer 40 no longer exists in the formed display panel. If the patterned metal layer 40 does not react completely with the carrier layer 30, Figure 3 As shown, the patterned metal layer 40 still exists in the formed display panel.

[0075] In some optional embodiments, the patterned metal layer 40 may be formed on the side of the carrier layer 30 facing away from the substrate 10. In other optional embodiments, the patterned metal layer 40 may be formed on the side of the carrier layer 30 facing the substrate 10. That is, the embodiment of the present application does not limit the order of forming the carrier layer 30 and the patterned metal layer 40.

[0076] Exemplarily, the patterned metal layer 40 is formed on the side of the carrier layer 30 facing the substrate 10, a recessed portion can be formed on the side of the main body 22 of the pixel definition layer 20 facing away from the substrate 10, and then the patterned metal layer 40 is formed in the recessed portion, and then the carrier layer 30 in contact with the patterned metal layer 40 is formed.

[0077] According to the method for preparing a display panel provided in an embodiment of the present application, by making the patterned metal layer 40 contact the carrier layer 30, a trap that suppresses the lateral conduction capability of the carrier layer is formed in the carrier layer 30, and the orthographic projection of the trap on the substrate 10 overlaps with the orthographic projection of the main body 22 of the pixel definition layer 20 on the substrate 10, so when controlling the light emission of a certain sub-pixel, the carriers in the carrier layer 30 cannot be transmitted to the adjacent sub-pixels, thereby reducing the possibility of the adjacent sub-pixels secretly lighting up, that is, it is possible to reduce the lateral leakage of the display panel. In addition, the trap is generated by the contact between the metal and the carrier layer 30, so in the process of preparing the display panel, only one metal layer in contact with the carrier layer 30 needs to be prepared to form a trap with the ability to suppress the lateral conduction capability of the carrier layer 30, which is relatively easy to implement in terms of process.

[0078] Figure 7 A schematic diagram showing a method for manufacturing a display panel according to another embodiment of the present application is shown. Figure 2 and Figure 7 The carrier layer 30 may include a hole injection layer 31 , a hole transport layer 32 , and an electron blocking layer 33 .

[0079] Step 502 may specifically include: forming a hole injection layer 31 , a hole transport layer 32 and an electron blocking layer 33 on the surface of the pixel definition layer 20 facing away from the substrate 10 .

[0080] For example, the hole injection layer 31 , the hole transport layer 32 and the electron blocking layer 33 may be formed using an open mask.

[0081] The step 503 of forming a patterned metal layer 40 in contact with the carrier layer 30 may specifically include: forming the patterned metal layer 40 on at least one of the hole injection layer 31 , the hole transport layer 32 and the electron blocking layer 22 .

[0082] For example, only one patterned metal layer 40 may be formed, and the patterned metal layer 40 may be formed before or after any one of the hole injection layer 31, the hole transport layer 32, and the electron blocking layer 33 is formed. For another example, multiple patterned metal layers 40 may be formed, and a patterned metal layer 40 may be formed after the hole injection layer 31 is formed, a patterned metal layer 40 may be formed after the hole transport layer 32 is formed, and a patterned metal layer 40 may be formed after the electron blocking layer 33 is formed. Exemplarily, the patterned metal layer 40 may be formed using a high-precision metal mask (Fine Metal Mask, FMM).

[0083] In some optional embodiments, only one patterned metal layer 40 may be formed, and the patterned metal layer 40 is in contact with the hole injection layer 31. For example, the patterned metal layer 40 may be formed on the side of the hole injection layer 31 facing away from the substrate 10.

[0084] For example, the thickness of the hole injection layer 31 may be 5 nm to 20 nm, the thickness of the hole transport layer 32 may be 1000 nm to 2000 nm, and the thickness of the electron blocking layer 33 may be 10 nm to 100 nm.

[0085] In some optional embodiments, in step 503, a patterned metal layer 40 is formed in contact with the carrier layer 30, and the orthographic projection of the patterned metal layer 40 on the substrate 10 overlaps with the orthographic projection of the body part 22 on the substrate 10, which may specifically include: forming a patterned metal layer 40 in contact with the carrier layer 30, the orthographic projection of the patterned metal layer 40 on the substrate 10 overlaps with the orthographic projection of the body part 22 of the pixel definition layer 20 on the substrate 10, and the orthographic projection of the patterned metal layer 40 on the substrate 10 does not overlap with the orthographic projection of the side wall of the body part 22 of the pixel definition layer 20 on the substrate 10. In other words, the patterned metal layer 40 is formed only above the top surface of the body part 22, wherein the top surface of the body part 22 is the side surface of the body part 22 away from the substrate 10, so as to avoid affecting the longitudinal conduction capability of the carrier layer 30, where the longitudinal direction is a direction perpendicular to the light emitting surface of the display panel.

[0086] In some optional embodiments, such as Figure 4As shown, the orthographic projection of the patterned metal layer 40 on the substrate 10 may be in the shape of a strip. The strip-shaped patterned metal layer 40 is located between adjacent pixel openings 21. Figure 5 As shown, the orthographic projection of the patterned metal layer 40 on the substrate 10 may be in a grid shape. The pixel opening 21 may be surrounded by a grid.

[0087] In some optional embodiments, the thickness of the patterned metal layer 40 may be 10 nm to 50 nm. In this way, the effect of reducing the lateral leakage of the display panel can be achieved, and the thickness of the patterned metal layer 40 can be prevented from being too thick.

[0088] In some optional embodiments, the material of the patterned metal layer 40 may include at least one of silver, magnesium, and aluminum. As described above, silver, magnesium, and aluminum are relatively active metals. For example, during the evaporation of silver, silver atoms will penetrate the carrier layer 30 and generate traps in the carrier layer 30. The same is true for magnesium and aluminum.

[0089] In some optional embodiments, after step 501 and before step 502, as Figure 2 As shown, the method for manufacturing a display panel provided in an embodiment of the present application may further include: forming a first electrode 37 on the substrate 10. The first electrode 37 may correspond to the pixel opening 21 one by one. The first electrode 37 may be an anode.

[0090] In some optional embodiments, after step 503, as Figure 2 As shown, the method for preparing the display panel provided in the embodiment of the present application may further include: forming a light-emitting layer in the pixel opening 21 and on the side of the carrier layer 30 facing away from the first electrode 37, the light-emitting layer including a plurality of light-emitting units with different light-emitting colors, each light-emitting unit corresponding to the pixel opening 21 one by one; forming a hole blocking layer 34 on the side of the light-emitting layer facing away from the substrate 10, forming an electron transport layer 35 on the side of the hole blocking layer 34 facing away from the light-emitting layer, forming an electron injection layer 36 on the side of the electron transport layer 35 facing away from the hole blocking layer 34, and forming a second electrode 38 on the side of the electron injection layer 36 facing away from the electron transport layer 35. The second electrode 38 may be a whole-surface structure. The second electrode 38 may be a cathode.

[0091] The present application also provides a display device, including the display panel provided by the present application. Figure 8 , Figure 8 It is a structural schematic diagram of a display device provided in an embodiment of the present application. Figure 8 The provided display device 1000 includes the display panel 100 provided by any of the above embodiments of the present application, or includes a display panel manufactured using the display panel manufacturing method described in any of the above embodiments. Figure 8The embodiment only takes a mobile phone as an example to illustrate the display device 1000. It can be understood that the display device provided in the embodiment of the present application can be a computer, a television, a car display device or other display device with a display function, and the present application does not make specific restrictions on this. The display device provided in the embodiment of the present application has the beneficial effects of the display panel provided in the embodiment of the present application. For details, please refer to the specific description of the display panel in the above embodiments, and this embodiment will not be repeated here.

[0092] According to the embodiments described above in the present application, these embodiments do not describe all the details in detail, nor do they limit the present application to the specific embodiments described. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: include: substrate; A pixel definition layer, located on one side of the substrate, the pixel definition layer comprising a plurality of pixel openings distributed in an array and a body portion located between the pixel openings; A carrier layer, located on a side of the pixel definition layer facing away from the substrate; The carrier layer contacts the metal layer, a trap is formed in the carrier layer to suppress the lateral conduction capability of the carrier layer, and the orthographic projection of the trap on the substrate overlaps with the orthographic projection of the main body on the substrate; The carrier layer includes a transport material; The carrier layer includes a stacked hole injection layer, a hole transport layer and an electron blocking layer, wherein the hole injection layer is located on a side of the hole transport layer facing the substrate, and the electron blocking layer is located on a side of the hole transport layer facing away from the substrate, and at least one of the hole injection layer, the hole transport layer and the electron blocking layer is in contact with the metal layer, and the trap is formed in at least one of the hole injection layer, the hole transport layer and the electron blocking layer; The metal layer is located on a side of the hole injection layer facing away from the substrate.

2. The display panel according to claim 1, characterized in that: The hole injection layer is in contact with the metal layer, and the trap is formed in the hole injection layer.

3. The display panel according to claim 1, characterized in that: The material of the metal layer includes at least one of silver, magnesium, and aluminum.

4. The display panel according to claim 1, characterized in that: The orthographic projection of the metal layer on the substrate is in the shape of a strip or a grid.

5. The display panel according to claim 1, characterized in that: The orthographic projections of the plurality of traps on the substrate are in the shape of stripes or grids.

6. The display panel according to claim 1, characterized in that: The display panel further includes: A first electrode is located between the carrier layer and the substrate, and the first electrode is exposed to the pixel opening; a light-emitting layer, located in the pixel opening and on the side of the carrier layer facing away from the first electrode, the light-emitting layer comprising a plurality of light-emitting units with different light-emitting colors, each of the light-emitting units corresponding to the pixel opening one by one; The second electrode layer is located on the side of the light-emitting layer facing away from the substrate, and the second electrode layer is a continuous structure.

7. A method for preparing a display panel, characterized in that: include: forming a pixel definition layer on a substrate, wherein the pixel definition layer comprises a plurality of pixel openings distributed in an array and a body portion located between the pixel openings; forming a carrier layer on a surface of the pixel definition layer facing away from the substrate; forming a patterned metal layer in contact with the carrier layer, wherein the orthographic projection of the patterned metal layer on the substrate overlaps with the orthographic projection of the main body on the substrate, so that the patterned metal layer reacts with the carrier layer to generate traps that inhibit the lateral conduction capability of the carrier layer; The carrier layer includes a hole injection layer, a hole transport layer and an electron blocking layer; The forming of a carrier layer on a surface of the pixel definition layer facing away from the substrate comprises: forming the hole injection layer, the hole transport layer and the electron blocking layer on the surface of the pixel definition layer facing away from the substrate; The forming of a patterned metal layer in contact with the carrier layer comprises: forming the patterned metal layer in contact with at least one of the hole injection layer, the hole transport layer, and the electron blocking layer; The patterned metal layer is formed on a side of the hole injection layer facing away from the substrate.

8. The method for preparing a display panel according to claim 7, characterized in that: The patterned metal layer is formed in contact with the hole injection layer.

9. The method for preparing a display panel according to claim 7, characterized in that: The forming of a patterned metal layer in contact with the carrier layer, wherein the orthographic projection of the patterned metal layer on the substrate overlaps with the orthographic projection of the main body on the substrate, comprises: A patterned metal layer is formed in contact with the carrier layer, wherein the orthographic projection of the patterned metal layer on the substrate overlaps with the orthographic projection of the main body on the substrate, and the orthographic projection of the patterned metal layer on the substrate does not overlap with the orthographic projection of the side wall of the main body on the substrate.

10. The method for preparing a display panel according to claim 7, characterized in that: The orthographic projection of the patterned metal layer on the substrate is in a stripe shape or a grid shape.

11. The method for preparing a display panel according to claim 7, characterized in that: The thickness of the patterned metal layer is 10 nm to 50 nm.

12. The method for preparing a display panel according to claim 7, characterized in that: The material of the patterned metal layer includes at least one of silver, magnesium and aluminum.

13. A display device, characterized in that: A display panel comprising the display panel according to any one of claims 1 to 6, or a display panel prepared by the method for preparing a display panel according to any one of claims 7 to 12.

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