Particulate detection module

Abstract

A particulate detection module includes: a base, a piezoelectric actuator, a laser component, a particulate sensor, and an outer cover. The base separates the air guide component support area and the laser setting area, and further incorporates a gas flow channel design. Finally, a drive circuit board is sealed on the bottom surface of the base, and the outer cover seals the surface of the base. This allows an air inlet groove in the base to define an air inlet path, and an air outlet groove in the base to define an air outlet path, which can significantly reduce the thickness of the particulate detection module.

Description

Technical Field

[0001] This case relates to a particulate detection module, and more particularly to an ultra-thin particulate detection module. Background Technology

[0002] Particulate matter refers to solid particles or droplets contained in gases. Due to their extremely small size, they can easily enter the lungs through nasal hairs, causing lung inflammation, asthma, or cardiovascular disease. If other pollutants adhere to particulate matter, the harm to the respiratory system will be further aggravated. In recent years, air pollution problems have become increasingly serious, especially the concentration of fine particulate matter (such as PM2.5), which is often too high. Monitoring the concentration of particulate matter has become increasingly important. However, because gases flow unpredictably with wind direction and volume, and most current gas quality monitoring stations for detecting particulate matter are fixed-point, it is impossible to confirm the current concentration of particulate matter in the surrounding environment. Therefore, a miniature and portable gas detection module is needed so that users can detect the concentration of particulate matter in their surroundings anytime and anywhere.

[0003] Please see Figure 1 This refers to a particulate detection module as shown in Taiwan Patent Application No. 107130404. Currently, the housing 11A of existing particulate detection devices 1A is limited in size by the gas guide 12A and the internal gas flow channels, making it difficult to reduce its volume. Figure 1 As indicated by the arrow, the gas path requires the gas to enter from the upper inlet, then be introduced into the lower layer, detected, and then guided by a micro-pump before finally returning to the upper outlet for discharge. This design of the gas channel structure is multi-layered, complex, and relatively tall, making it difficult to reduce the overall thickness of the particle detection module and implement it in miniaturized mobile devices or other portable electronic devices. Therefore, how to make the particle detection device thinner and lighter is an urgent problem that needs to be solved. Summary of the Invention

[0004] The main objective of this invention is to provide a particulate detection module in which a drive circuit board is attached to the second surface of a base, and an outer cover is attached to the first surface of the base. This allows an air inlet groove to define an air inlet path and an air outlet groove to define an air outlet path. Furthermore, a laser component is mounted on the drive circuit board, and the base is directly covered by the drive circuit board. The location of the piezoelectric actuator is separated from the location of the laser component, which can significantly reduce the thickness of the particulate detection module.

[0005] A generalized embodiment of this invention is a particle detection module, comprising: a base having: a first surface; a second surface relative to the first surface; a laser setting area formed by hollowing out from the first surface toward the second surface; an air inlet groove formed by recessing from the second surface and adjacent to the laser setting area, the air inlet groove having an air inlet communicating with the outside of the base, and a light-transmitting window penetrating through both side walls communicating with the laser setting area; and an air guiding component bearing area formed by recessing from the second surface and communicating with the air inlet groove, and located on the bottom surface. A vent hole and an outlet groove are provided, recessed from the first surface to the bottom surface of the air guide component support area, and formed by hollowing out the area of ​​the first surface that does not correspond to the air guide component support area from the first surface toward the second surface, communicating with the vent hole and having an outlet connecting to the outside of the base; a piezoelectric actuator is housed in the air guide component support area; a drive circuit board is covered and attached to the second surface of the base; a laser component is positioned on the drive circuit board and electrically connected to it, and is correspondingly housed in the laser setting area. The system includes a light beam that passes through the light-transmitting window and forms an orthogonal direction with the air inlet groove; a particle sensor, electrically connected to the drive circuit board and positioned at the orthogonal position of the air inlet groove and the light beam projected by the laser component, to detect particles passing through the air inlet groove and irradiated by the light beam projected by the laser component; and an outer cover covering the first surface of the base, having a side plate with an air inlet frame and an air outlet corresponding to the air inlet and outlet positions of the base, respectively. The air frame opening; wherein, the outer cover covers the first surface of the base, and the drive circuit board is sealed on the second surface, so that the air inlet groove defines an air inlet path and the air outlet groove defines an air outlet path, thereby enabling the piezoelectric actuator to accelerate and guide external gas from the air inlet opening into the air inlet path defined by the air inlet groove, and through the particle sensor to detect the particle concentration in the gas, and the gas is guided by the piezoelectric actuator, and discharged through the vent into the air outlet path defined by the air outlet groove, and finally discharged from the air outlet opening. Attached Figure Description

[0006] Figure 1 This is a three-dimensional schematic diagram of a particle detection module in the prior art.

[0007] Figure 2A This is a three-dimensional schematic diagram of the particle detection module in this case.

[0008] Figure 2B This is a three-dimensional schematic diagram of the particle detection module in this case from another angle.

[0009] Figure 2C The diagram shown is an exploded three-dimensional schematic of the particulate detection module in this case.

[0010] Figure 3A This is a three-dimensional schematic diagram of the base.

[0011] Figure 3B This is a three-dimensional schematic diagram of the base from another angle.

[0012] Figure 4 This is a three-dimensional schematic diagram of the base housing the laser assembly and particle sensor.

[0013] Figure 5A This is an exploded three-dimensional schematic diagram of the piezoelectric actuator and its base.

[0014] Figure 5B This is a three-dimensional schematic diagram of the piezoelectric actuator combined with the base.

[0015] Figure 6A This is an exploded three-dimensional schematic diagram of a piezoelectric actuator.

[0016] Figure 6B This is an exploded three-dimensional schematic diagram of a piezoelectric actuator from another angle.

[0017] Figure 7A This is a cross-sectional schematic diagram of the piezoelectric actuator integrated into the air guide assembly bearing area.

[0018] Figure 7B and Figure 7C for Figure 7A A schematic diagram of the operation of a piezoelectric actuator.

[0019] Figures 8A to 8C This is a schematic diagram of the gas path for the particulate detection module.

[0020] Figure 9 A schematic diagram of the beam path emitted by the laser component.

[0021] Figure 10A This is a cross-sectional schematic diagram of a microelectromechanical pump.

[0022] Figure 10B This is an exploded view of a microelectromechanical pump.

[0023] Figures 11A to 11C A schematic diagram illustrating the operation of a microelectromechanical pump.

[0024] Figure 12 A schematic diagram illustrating the application of a particulate monitoring module assembly in a miniaturized portable electronic device.

[0025] Figure 13 A schematic diagram illustrating the embedding of a particulate monitoring module for use in miniaturized mobile devices.

[0026] Explanation of reference numerals in the attached figures

[0027] 1A: Particulate Detection Device

[0028] 11A: Housing

[0029] 12A: Air guide

[0030] 1: Base

[0031] 100: Particle detection module

[0032] 11: First Surface

[0033] 12: Second Surface

[0034] 13: Laser Setting Area

[0035] 14: Intake Groove

[0036] 14a: Air intake

[0037] 14b: Light-transmitting window

[0038] 15: Air guide assembly bearing area

[0039] 15a: Vent hole

[0040] 15b: Positioning notch

[0041] 16: Vent groove

[0042] 16a: Air outlet

[0043] 16b: First interval

[0044] 16c: Second interval

[0045] 17: Light Trap Zone

[0046] 17a: Light trap structure

[0047] 2: Piezoelectric actuator

[0048] 2A: Portable electronic devices

[0049] 21: Jet nozzle plate

[0050] 210: Suspension tablets

[0051] 211: Hollow cavity

[0052] 212: Connector

[0053] 213: Gap

[0054] 22: Cavity Frame

[0055] 23: Actuator

[0056] 231: Piezoelectric carrier plate

[0057] 2311: Piezoelectric pin

[0058] 232: Adjust the resonant plate

[0059] 233: Piezoelectric plate

[0060] 24: Insulation Frame

[0061] 25: Conductive framework

[0062] 251: Conductive pin

[0063] 252: Conductive electrode

[0064] 26: Resonance Chamber

[0065] 27: Airflow chamber

[0066] 2a: Microelectromechanical pump

[0067] 21a: First substrate

[0068] 211a: Inlet hole

[0069] 212a: First surface

[0070] 213a: Second surface

[0071] 22a: First oxide layer

[0072] 221a: Combination Channel

[0073] 222a: Manifold Chamber

[0074] 23a: Second substrate

[0075] 231a: Silicon wafer layer

[0076] 2311a: Actuator

[0077] 2312a: Peripheral part

[0078] 2313a: Connecting part

[0079] 2314a: Fluid Channel

[0080] 232a: Second oxide layer

[0081] 2321a: Vibration chamber

[0082] 233a: Silicon layer

[0083] 2331a: Perforation

[0084] 2332a: Vibrating part

[0085] 2333a: Fixing part

[0086] 2334a: Third surface

[0087] 2335a: Fourth surface

[0088] 24a: Piezoelectric component

[0089] 241a: Lower electrode layer

[0090] 242a: Piezoelectric layer

[0091] 243a: Insulation layer

[0092] 244a: Upper electrode layer

[0093] 3: Driver circuit board

[0094] 3A: Mobile Device

[0095] 4: Laser Components

[0096] 5: Particle sensor

[0097] 6: Outer cover

[0098] 61: Side panel

[0099] 61a: Air intake frame

[0100] 61b: Air vent

[0101] 7a: First volatile organic compound sensor

[0102] 7b: Second volatile organic compound sensor

[0103] D: Light trap distance

[0104] H: Thickness

[0105] L: Length

[0106] W: Width Detailed Implementation

[0107] The embodiments that embody the features and advantages of this invention will be described in detail in the following description. It should be understood that this invention can have various variations in different forms, all of which do not depart from the scope of this invention, and the descriptions and illustrations herein are for illustrative purposes only and not intended to limit this invention.

[0108] Please see Figures 2A to 2CAs shown, this invention provides a particle detection module 100, comprising a base 1, a piezoelectric actuator 2, a drive circuit board 3, a laser assembly 4, a particle sensor 5, and an outer cover 6. The base 1, piezoelectric actuator 2, drive circuit board 3, laser assembly 4, particle sensor 5, and outer cover 6 are modular structures made of micromaterials, and the module structure has a length, a width, and a height. The length, width, and height of the module structure are between 1 centimeter (mm) and 999 centimeters (mm), or between 1 micrometer (μm) and 999 micrometers (μm), or between 1 nanometer (nm) and 999 nanometers (nm), but are not limited thereto. In this embodiment, the module structure consisting of the base 1, piezoelectric actuator 2, drive circuit board 3, laser component 4, particle sensor 5, and outer cover 6 has a volume with a length between 1 micrometer and 999 micrometers, a width between 1 micrometer and 999 micrometers, and a height between 1 micrometer and 999 micrometers, or a volume with a length between 1 nanometer and 999 nanometers, a width between 1 nanometer and 999 nanometers, and a height between 1 nanometer and 999 nanometers, but is not limited thereto. The drive circuit board 3 is attached to the second surface 12 of the base 1. The laser component 4 is disposed on the drive circuit board 3 and electrically connected to it. The particle sensor 5 is also disposed on the drive circuit board 3 and electrically connected to it. The outer cover 6 covers the base 1 and is attached to the first surface 11 of the base 1. The outer cover 6 has a side plate 61 with an air inlet 61a and an air outlet 61b.

[0109] Please review Figure 3A and Figure 3B As shown, the base 1 has a first surface 11, a second surface 12, a laser setting area 13, an air inlet groove 14, an air guide component bearing area 15, and an air outlet groove 16. The first surface 11 and the second surface 12 are two surfaces arranged opposite to each other. The laser setting area 13 is formed by hollowing out from the first surface 11 toward the second surface 12. The air inlet groove 14 is formed by recessing from the second surface 12 and is adjacent to the laser setting area 13. The air inlet groove 14 has an air inlet 14a that communicates with the outside of the base 1 and corresponds to the air inlet frame 61a of the outer cover 6. A light-transmitting window 14b is passed through the two side walls and communicates with the laser setting area 13. Therefore, the first surface 11 of the base 1 is covered by the outer cover 6 and the second surface 12 is covered by the drive circuit board 3, so that the air inlet groove 14 defines an air inlet path.

[0110] The air-guiding component support area 15 is formed by a recess in the second surface 12 and connects to the air inlet groove 14, and has a vent 15a extending through the bottom surface; the air outlet groove 16 is provided with an air outlet 16a, which is correspondingly provided with the air outlet frame 61b of the outer cover 6. The air outlet groove 16 includes a first interval 16b formed by a recess in the first surface 11 corresponding to the vertical projection area of ​​the air-guiding component support area 15, and an area extending from the vertical projection area of ​​the non-air-guiding component support area 15, and is formed by a recess in the first surface 12. The second section 16c is formed by hollowing out the second surface 11 to the second surface 12, wherein the first section 16b and the second section 16c are connected to form a step, and the first section 16b of the air outlet groove 16 is connected to the vent hole 15a of the air guide component bearing area 15, and the second section 16c of the air outlet groove 16 is connected to the air outlet 16a; therefore, when the first surface 11 of the base 1 is covered by the outer cover 6 and the second surface 12 is covered by the drive circuit board 3, the air outlet groove 16 defines an air outlet path.

[0111] Figure 4 This is a schematic diagram of the base housing the laser assembly 4 and the particle sensor 5. Both the laser assembly 4 and the particle sensor 5 are mounted on the drive circuit board 3 and within the base 1. To clearly illustrate the positions of the laser assembly 4 and the particle sensor 5 relative to the base 1, the drive circuit board 3 is deliberately omitted in Figure 3. Please review. Figure 4 and Figure 2C The laser component 4 is housed in the laser setting area 13 of the base 1, and the particle sensor 5 is housed in the air intake groove 14 of the base 1 and aligned with the laser component 4. In addition, the laser component 4 corresponds to the light transmission window 14b, through which the laser light emitted by the laser component 4 passes, so that the laser light irradiates the air intake groove 14. The path of the beam emitted by the laser component 4 passes through the light transmission window 14b and forms an orthogonal direction with the air intake groove 14.

[0112] The laser component 4 emits a projected beam that enters the air intake groove 14 through the light-transmitting window 14b, irradiating the suspended particles contained in the gas within the air intake groove 14. When the beam comes into contact with the suspended particles, it scatters and generates projected light spots. The particle sensor 5 receives the projected light spots generated by the scattering and performs calculations to obtain relevant information about the particle size and concentration of the suspended particles contained in the gas. The particle sensor 5 is a PM2.5 sensor.

[0113] Please see Figure 5A and Figure 5BThe piezoelectric actuator 2 is housed in the air guide assembly support area 15 of the base 1. The air guide assembly support area 15 is square, with a positioning notch 15b at each of its four corners. The piezoelectric actuator 2 is positioned in the air guide assembly support area 15 through the four positioning notches 15b. In addition, the air guide assembly support area 15 is connected to the air inlet groove 14. When the piezoelectric actuator 2 is actuated, it draws gas from the air inlet groove 14 into the piezoelectric actuator 2 and passes the gas through the vent hole 15a of the air guide assembly support area 15 into the air outlet groove 16.

[0114] Please review Figure 6A and Figure 6B The piezoelectric actuator 2 includes: an air jet plate 21, a cavity frame 22, an actuator 23, an insulating frame 24, and a conductive frame 25.

[0115] The jet nozzle 21 is made of a flexible material and has a suspension plate 210, a hollow hole 211, and multiple connectors 212. The suspension plate 210 is a flexible, vibrating sheet structure, and its shape and size roughly correspond to the inner edge of the air guide assembly support area 15, but are not limited thereto. The shape of the suspension plate 210 can also be square, circular, elliptical, triangular, or polygonal. The hollow hole 211 passes through the center of the suspension plate 210 to allow gas flow. In this embodiment, there are four connectors 212, and their number and type mainly correspond to the positioning notch 15b of the air guide assembly support area 15. Each connector 212 and its corresponding positioning notch 15b form a snap-fit ​​structure to engage and fix each other, so that the piezoelectric actuator 2 can be placed in the air guide assembly support area 15.

[0116] A cavity frame 22 is stacked on the jet orifice plate 21, and its shape corresponds to the jet orifice plate 21. An actuator 23 is stacked on the cavity frame 22, and a resonant cavity 26 is defined between the actuator 22 and the suspension plate 210. An insulating frame 24 is stacked on the actuator 23, and its appearance is similar to that of the cavity frame 22. A conductive frame 25 is stacked on the insulating frame 24, and its appearance is similar to that of the insulating frame 24. The conductive frame 25 has a conductive pin 251 and a conductive electrode 252. The conductive pin 251 extends outward from the outer edge of the conductive frame 25, and the conductive electrode 252 extends inward from the inner edge of the conductive frame 25. Furthermore, the actuator 23 further includes a piezoelectric carrier plate 231, an adjusting resonance plate 232, and a piezoelectric plate 233. The piezoelectric carrier plate 231 is supported and stacked on the cavity frame 22, the adjusting resonance plate 232 is supported and stacked on the piezoelectric carrier plate 231, and the piezoelectric plate 233 is supported and stacked on the adjusting resonance plate 232. The adjusting resonance plate 232 and the piezoelectric plate 233 are housed within the insulating frame 24 and are electrically connected to the piezoelectric plate 233 by the conductive electrode 252 of the conductive frame 25. The piezoelectric carrier plate 231 and the adjusting resonance plate 232 are both made of conductive materials. The piezoelectric carrier plate 231 has a piezoelectric pin 2311, which is connected to the conductive pin 251. The drive circuit (not shown) on the drive circuit board 3 receives drive signals (drive frequency and drive voltage). The drive signal forms a loop through the piezoelectric pin 2311, piezoelectric carrier plate 231, adjustment resonant plate 232, piezoelectric plate 233, conductive electrode 252, conductive frame 25, and conductive pin 251. The insulating frame 24 isolates the conductive frame 25 from the actuator 23 to prevent short circuits, allowing the drive signal to be transmitted to the piezoelectric plate 233. After receiving the drive signal (drive frequency and drive voltage), the piezoelectric plate 233 deforms due to the piezoelectric effect, further driving the piezoelectric carrier plate 231 and adjustment resonant plate 232 to produce reciprocating bending vibrations.

[0117] As described above, the resonant plate 232 is located between the piezoelectric plate 233 and the piezoelectric carrier plate 231, serving as a buffer between the two, and can adjust the vibration frequency of the piezoelectric carrier plate 231. Basically, the thickness of the resonant plate 232 is greater than the thickness of the piezoelectric carrier plate 231, and the thickness of the resonant plate 232 is variable, thereby adjusting the vibration frequency of the actuator 23.

[0118] Please also refer to Figure 6A , Figure 6B and Figure 7A Multiple connectors 212 define multiple gaps 213 between the inner edge of the suspension plate 210 and the air guide assembly bearing area 15 to allow gas to flow.

[0119] Please refer to the following first. Figure 7AThe jet nozzle 21, cavity frame 22, actuator 23, insulating frame 24, and conductive frame 25 are stacked sequentially and disposed in the gas guiding assembly support area 15. A gas flow chamber 27 is formed between the jet nozzle 21 and the bottom surface (not shown) of the gas guiding assembly support area 15. The gas flow chamber 27 is connected to the resonant chamber 26 between the actuator 23, cavity frame 22, and suspension plate 210 through the hollow hole 211 of the jet nozzle 21. By controlling the vibration frequency of the gas in the resonant chamber 26 to be close to the vibration frequency of the suspension plate 210, the resonant chamber 26 and the suspension plate 210 can generate a Helmholtz resonance effect, thereby improving the gas transmission efficiency.

[0120] Figure 7B and Figure 7C for Figure 7A Please review the schematic diagram of the piezoelectric actuator operation first. Figure 7B As shown, when the piezoelectric plate 233 moves away from the bottom surface of the air guide assembly bearing area 15, it drives the suspension plate 210 of the jet nozzle plate 21 to move away from the bottom surface of the air guide assembly bearing area 15, causing the volume of the airflow chamber 27 to expand rapidly. The internal pressure drops, creating a negative pressure that attracts gas from outside the piezoelectric actuator 2 through multiple gaps 213 and into the resonant chamber 26 via the hollow holes 211, increasing the air pressure inside the resonant chamber 26 and generating a pressure gradient. For example... Figure 7C As shown, when the piezoelectric plate 233 drives the suspension plate 210 of the jet nozzle 21 to move towards the bottom surface of the guide gas assembly bearing area 15, the gas in the resonant chamber 26 flows out rapidly through the hollow hole 211, compressing the gas in the airflow chamber 27, and causing the converged gas to be ejected rapidly and in large quantities in an ideal gas state close to Bernoulli's law. According to the principle of inertia, the internal air pressure of the resonant chamber 26 after exhaust is lower than the equilibrium air pressure, which will guide the gas to re-enter the resonant chamber 26. Therefore, through repeated... Figure 7B and Figure 7C After the action, the piezoelectric plate 233 reciprocates and vibrates, and the vibration frequency of the gas in the resonant chamber 26 is controlled to be close to the vibration frequency of the piezoelectric plate 233, so as to generate the Helmholtz resonance effect and realize the high-speed and large-volume transmission of gas.

[0121] Please see Figures 8A to 8C , Figures 8A to 8C This is a schematic diagram of the gas path for the particulate detection module. (First review...) Figure 8A All gas enters through the air inlet 61a of the outer cover 6, passes through the air inlet 14a into the air inlet groove 14 of the base 1, and flows to the position of the particulate sensor 5. Figure 8BAs shown, the piezoelectric actuator 2 continuously drives the intake gas, facilitating rapid and stable flow of external gas. Above the particle sensor 5, the laser assembly 4 emits a projection beam that enters the intake groove 14 through the light-transmitting window 14b, illuminating the suspended particles in the gas passing above the particle sensor 5. When the beam contacts the suspended particles, it scatters and generates projection points. The particle sensor 5 receives these projection points and calculates the particle size and concentration of the suspended particles in the gas. Meanwhile, the gas above the particle sensor 5 is continuously driven by the piezoelectric actuator 2 and guided into the vent 15a of the air guide assembly's carrying area 15, entering the first section 16b of the outlet groove 16, and finally... Figure 8C As shown, after the gas enters the first section 16b of the outlet groove 16, the gas will be continuously supplied into the first section 16b by the piezoelectric actuator 2. The gas in the first section 16b will be pushed to the second section 16c, and finally discharged outward through the outlet 16a and the outlet frame 61b.

[0122] like Figure 9 As shown, the base 1 further includes a light trap area 17, which is formed by hollowing out from the first surface 11 to the second surface 12 and corresponds to the laser setting area 13. The light trap area 17 allows the light beam emitted by the laser component 4 to be projected into it through the light transmission window 14b. The light trap area 17 is provided with a cone-shaped light trap structure 17a, which corresponds to the path of the light beam emitted by the laser component 4. In addition, the light trap structure 17a causes the projected light beam emitted by the laser component 4 to be reflected into the light trap area 17 through the cone-shaped structure, avoiding the light beam from being reflected to the position of the particle sensor 5. The position of the projected light beam received by the light trap structure 17a and the light transmission window 14b are maintained at a light trap distance D. This light trap distance D must be greater than 3mm. When the light trap distance D is less than 3mm, the projected light beam reflected on the light trap structure 17a will be directly reflected back to the position of the particle sensor 5 due to too much stray light, causing distortion of the detection accuracy.

[0123] Please continue reviewing. Figure 9 and Figure 2CThe particulate detection module 100 of this invention can not only detect particulates in the gas, but also further detect the characteristics of the introduced gas. Therefore, the particulate detection module 100 of this invention further includes a first volatile organic compound sensor 7a, which is positioned on the drive circuit board 3 and electrically connected to it, and is housed in the outlet groove 16 to detect the gas exiting the outlet path, thereby detecting the concentration of volatile organic compounds contained in the gas in the outlet path. Alternatively, the particulate detection module 100 of this invention further includes a second volatile organic compound sensor 7b, which is positioned on the drive circuit board 3 and electrically connected to it. The second volatile organic compound sensor 7b is housed in the light trap area 17, and detects the concentration of volatile organic compounds in the gas that enters the light trap area 17 through the inlet path of the inlet groove 14 and through the light transmission window 14b.

[0124] As described above, the particle detection module 100 of this invention features a structural design with a properly configured laser setting area 13, air inlet groove 14, air guide component bearing area 15, and air outlet groove 16 on the base 1. Combined with the sealing design of the outer cover 6 and the drive circuit board 3, the outer cover 6 covers the first surface 11 of the base 1, and the drive circuit board 3 covers the second surface 12. This allows the air inlet groove 14 to define an air inlet path, and the air outlet groove 16 to define an air outlet path, forming a single-layer air guide channel. This reduces the overall height of the particle detection module 100, resulting in a length L between 10mm and 35mm, a width W between 10mm and 35mm, and a thickness H between 1mm and 6.5mm. This facilitates its assembly and integration with components such as… Figure 12 The miniaturized portable electronic device 2A shown may be advantageous for assembly and integration with, for example... Figure 13 The miniaturized mobile device 3A shown is easy for users to carry to detect the concentration of surrounding particles. Furthermore, another embodiment of the piezoelectric actuator 2 in this invention can be a microelectromechanical pump 2a; please refer to [link to relevant documentation]. Figure 10A and Figure 10B The microelectromechanical pump 2a includes a first substrate 21a, a first oxide layer 22a, a second substrate 23a, and a piezoelectric component 24a.

[0125] The first substrate 21a is a silicon wafer with a thickness between 150 and 400 micrometers (μm). The first substrate 21a has a plurality of inflow holes 211a, a first surface 212a, and a second surface 213a. In this embodiment, the number of the plurality of inflow holes 211a is four, but not limited to this. Each inflow hole 211a extends from the second surface 213a to the first surface 212a. In order to improve the inflow effect, the inflow hole 211a is tapered from the second surface 213a to the first surface 212a.

[0126] The first oxide layer 22a is a silicon dioxide (SiO2) thin film with a thickness between 10 and 20 micrometers (μm). The first oxide layer 22a is stacked on the first surface 212a of the first substrate 21a. The first oxide layer 22a has multiple confluence channels 221a and a confluence chamber 222a. The number and position of the confluence channels 221a correspond to the inflow holes 211a of the first substrate 21a. In this embodiment, there are also four confluence channels 221a. One end of each of the four confluence channels 221a is connected to one of the four inflow holes 211a of the first substrate 21a, and the other end of each confluence channel 221a is connected to the confluence chamber 222a. After the gas enters through the inflow holes 211a, it converges into the confluence chamber 222a through the corresponding confluence channels 221a.

[0127] The second substrate 23a is a silicon-on-insulator (SOI) wafer, comprising: a silicon wafer layer 231a, a second oxide layer 232a, and a silicon material layer 233a; the silicon wafer layer 231a has a thickness between 10 and 20 micrometers (μm) and has an actuating portion 2311a, an outer peripheral portion 2312a, multiple connecting portions 2313a, and multiple fluid channels 2314a. The actuating portion 2311a is circular; the outer peripheral portion 2312a is hollow and ring-shaped, surrounding the periphery of the actuating portion 2311a; the multiple connecting portions 2313a are respectively located between the actuating portion 2311a and the outer peripheral portion 2312a, connecting the two and providing elastic support. The multiple fluid channels 2314a are formed around the periphery of the actuating portion 2311a and are respectively located between the multiple connecting portions 2313a.

[0128] The second oxide layer 232a is a silicon monoxide layer with a thickness between 0.5 and 2 micrometers (μm), formed on the silicon wafer layer 231a, and is in the form of a hollow ring, defining a vibration chamber 2321a with the silicon wafer layer 231a. The silicon material layer 233a is circular, stacked on the second oxide layer 232a and bonded to the first oxide layer 22a. The silicon material layer 233a is a silicon dioxide (SiO2) thin film with a thickness between 2 and 5 micrometers (μm), and has a through hole 2331a, a vibration part 2332a, a fixing part 2333a, a third surface 2334a and a fourth surface 2335a. A perforation 2331a is formed at the center of the silicon layer 233a. The vibration part 2332a is located in the peripheral area of ​​the perforation 2331a and is perpendicular to the vibration chamber 2321a. The fixing part 2333a is in the peripheral area of ​​the silicon layer 233a and is fixed to the second oxide layer 232a by the fixing part 2333a. The third surface 2334a is bonded to the second oxide layer 232a, and the fourth surface 2335a is bonded to the first oxide layer 22a. The piezoelectric component 24a is stacked on the actuation part 2311a of the silicon wafer layer 231a.

[0129] The piezoelectric component 24a includes a lower electrode layer 241a, a piezoelectric layer 242a, an insulating layer 243a, and an upper electrode layer 244a. The lower electrode layer 241a is stacked on the actuation portion 2311a of the silicon wafer layer 231a, and the piezoelectric layer 242a is stacked on the lower electrode layer 241a. The two are electrically connected through their contact area. In addition, the width of the piezoelectric layer 242a is smaller than the width of the lower electrode layer 241a, so that the piezoelectric layer 242a cannot completely cover the lower electrode layer 241a. An insulating layer 243a is stacked on a portion of 242a and on the portion of the lower electrode layer 241a not covered by the piezoelectric layer 242a. Finally, an upper electrode layer 244a is stacked on the remaining surfaces of the insulating layer 243a and the piezoelectric layer 242a not covered by the insulating layer 243a, allowing the upper electrode layer 244a to make contact with the piezoelectric layer 242a for electrical connection. At the same time, the insulating layer 243a is used to block the upper electrode layer 244a and the lower electrode layer 241a, preventing them from making direct contact and causing a short circuit.

[0130] Please refer to section 11A to... Figure 11C Figures 11A to 11C are schematic diagrams illustrating the operation of the microelectromechanical pump 2a. Please refer to them first. Figure 11A After receiving the driving voltage and driving signal (not shown) transmitted by the driving circuit board 3, the lower electrode layer 241a and upper electrode layer 244a of the piezoelectric component 24a conduct them to the piezoelectric layer 242a. Upon receiving the driving voltage and driving signal, the piezoelectric layer 242a begins to deform due to the inverse piezoelectric effect, causing the actuator 2311a of the silicon wafer layer 231a to begin to displace. When the piezoelectric component 24a causes the actuator 2311a to move upward and increase the distance between it and the second oxide layer 232a, the volume of the vibration chamber 2321a of the second oxide layer 232a will increase, creating a negative pressure inside the vibration chamber 2321a, and drawing the gas from the confluence chamber 222a of the first oxide layer 22a into it through the perforation 2331a. Please continue reading. Figure 11B When the actuator 2311a is pulled upward by the piezoelectric component 24a, the vibrating part 2332a of the silicon layer 233a will also be moved upward due to the resonance principle. When the vibrating part 2332a moves upward, it will compress the space of the vibration chamber 2321a and push the gas in the vibration chamber 2321a to move towards the fluid channel 2314a of the silicon wafer layer 231a, allowing the gas to be discharged upward through the fluid channel 2314a. While the vibrating part 2332a moves upward to compress the vibration chamber 2321a, the volume of the manifold 222a increases due to the displacement of the vibrating part 2332a, creating a negative pressure inside. This draws in the gas outside the microelectromechanical pump 2a through the inlet hole 211a, and finally... Figure 11CAs shown, when the piezoelectric component 24a drives the actuator 2311a of the silicon wafer layer 231a to move downward, it pushes the gas in the vibration chamber 2321a into the fluid channel 2314a and discharges the gas. The vibration part 2332a of the silicon layer 233a is also driven downward by the actuator 2311a, and the gas in the compressed manifold 222a moves into the vibration chamber 2321a through the perforation 2331a. When the piezoelectric component 24a drives the actuator 2311a to move upward, the volume of the vibration chamber 2321a will increase significantly, and thus there will be a higher suction force to draw the gas into the vibration chamber 2321a. The above actions are repeated, so that the piezoelectric component 24a continuously drives the actuator 2311a to move up and down, thereby causing the vibration part 2332a to move up and down in conjunction. By changing the internal pressure of the microelectromechanical pump 2a, it continuously draws in and discharges gas, thereby completing the operation of the microelectromechanical pump 2a.

[0131] Of course, in order to embed the particulate detection module 100 in this case into the mobile device 3A, the piezoelectric actuator 2 can be replaced by the structure of the microelectromechanical pump 2a, so that the overall size of the particulate detection module 100 is further reduced, resulting in the length L and width W of the particulate detection module 100 being reduced to between 2mm and 4mm, and the thickness H being between 1mm and 3.5mm. This allows it to be implemented in mobile devices such as the current thin 5mm thick smartphones 3A, so that the detection module can be directly embedded in the smartphone, allowing users to detect the surrounding air quality in real time.

[0132] In summary, the particle detection module provided in this application has a laser component directly mounted on a drive circuit board, which is attached to the second surface of the base. The first surface of the base is covered by an outer cover, thereby defining an air intake path in the air intake groove and an air exhaust path in the air exhaust groove. This significantly reduces the thickness of the particle detection module. Furthermore, separating the piezoelectric actuator from the laser component, along with the gas channel design, prevents the piezoelectric actuator from interfering with the operation of the laser component and the particle sensor. This also reduces the size of the particle detection module, with its length reduced to between 10mm and 35mm, its width to between 10mm and 35mm, and its thickness to between 1mm and 6.5mm. This makes the particle detection module easy to carry. Moreover, by utilizing the light trap structure in the light trap area, the scattered light generated after the laser beam from the particle sensor contacts the base itself is reduced from re-entering the particle sensor, thereby improving the detection efficiency of the particle sensor. This design is highly industrially applicable and progressive.

Claims

1. A particle detection module, characterized in that, Include: A base, having: The first surface; A second surface, relative to the first surface; A laser setting area is formed by hollowing out from the first surface toward the second surface; An air inlet groove is formed by a recess in the second surface and is adjacent to the laser setting area. The air inlet groove is provided with an air inlet that connects to the outside of the base, and a light-transmitting window that passes through both side walls and connects to the laser setting area. An air guide component bearing area is formed by a recess in the second surface and connects to the air inlet groove, and has a vent hole through the bottom surface. A light trap area is formed by hollowing out from the first surface toward the second surface and corresponding to the laser setting area. An air outlet groove is formed by recessing from the first surface to the bottom surface of the air guide component support area, and hollowing out from the first surface toward the second surface in the area of ​​the first surface that does not correspond to the air guide component support area. It communicates with the air hole and has an air outlet that connects to the outside of the base. A piezoelectric actuator is housed in the air guide assembly bearing area; A drive circuit board is covered and attached to the second surface of the base; A laser component is positioned on the drive circuit board and electrically connected to it, and is correspondingly housed in the laser setting area. The path of the emitted beam passes through the light-transmitting window and forms an orthogonal direction with the air inlet groove. A particle sensor is positioned on the drive circuit board and electrically connected thereto, and is housed at a position perpendicular to the path of the beam projected by the laser component, so as to detect particles that pass through the air inlet groove and are irradiated by the beam projected by the laser component. An outer cover, covering the first surface of the base, and having a side plate, the side plate having an air inlet frame and an air outlet frame respectively corresponding to the air inlet and air outlet of the base; and A second volatile organic compound sensor is electrically connected and positioned on the drive circuit board, and housed in the light trap area. It detects the gas introduced into the light trap area through the air intake path of the air intake groove and the light-transmitting window. The base, piezoelectric actuator, drive circuit board, laser assembly, particle sensor, and outer cover are a modular structure made of micromaterials. The modular structure has a length, a width, and a height. The outer cover covers the first surface of the base, and the drive circuit board covers the second surface, so that the air inlet groove defines an air inlet path and the air outlet groove defines an air outlet path. This allows the piezoelectric actuator to accelerate and guide external gas from the air inlet frame into the air inlet path defined by the air inlet groove. The particle sensor detects the particle concentration in the gas, and the gas is guided by the piezoelectric actuator, discharged through the vent into the air outlet path defined by the air outlet groove, and finally discharged from the air outlet frame.

2. The particle detection module as described in claim 1, characterized in that, The volume formed by the module structure when its length is between 1 cm and 999 cm, its width is between 1 cm and 999 cm, and its height is between 1 cm and 999 cm.

3. The particle detection module as described in claim 1, characterized in that, The air guide assembly has a positioning notch at each of the four corners of its bearing area, which allows the piezoelectric actuator to be embedded and positioned.

4. The particle detection module as described in claim 1, characterized in that, The light trap area is provided with a light trap structure with an oblique conical surface, which is set to correspond to the beam path. The position of the projection light source received by the light trap structure is maintained at a light trap distance from the light-transmitting window.

5. The particle detection module as described in claim 4, characterized in that, The light trap has a distance greater than 3mm.

6. The particle detection module as described in claim 1, characterized in that, This particulate sensor is a PM2.5 sensor.

7. The particle detection module as described in claim 1, characterized in that, The piezoelectric actuator includes: An air jet orifice plate includes multiple connectors, a suspension plate, and a hollow hole. The suspension plate is bendable and vibrates. The multiple connectors are adjacent to the periphery of the suspension plate, and the hollow hole is formed at the center of the suspension plate. The suspension plate is fixedly installed by the multiple connectors, which provide elastic support for the suspension plate. An airflow chamber is formed between the bottoms of the air jet orifice plate, and at least one gap is formed between the multiple connectors and the suspension plate. A cavity frame supports the suspended plate; A uniformly moving body, supported and stacked on the cavity frame, is subjected to voltage to generate reciprocating bending vibration; An insulating frame is supported and stacked on the actuator; as well as A conductive frame is stacked on the insulating frame; The actuator, the cavity frame, and the suspension plate form a resonant chamber. By driving the actuator to cause the jet orifice plate to resonate, the suspension plate of the jet orifice plate will reciprocate and vibrate, so that the gas enters the airflow chamber through the gap and is then discharged, thereby realizing the transmission and flow of the gas.

8. The particle detection module as described in claim 7, characterized in that, The actuator includes: A piezoelectric carrier plate is stacked on the cavity frame; One resonant plate is adjusted and placed on the piezoelectric carrier plate; as well as A piezoelectric plate is supported and stacked on the adjusting resonant plate to receive voltage and drive the piezoelectric plate and the adjusting resonant plate to produce reciprocating bending vibrations.

9. The particle detection module as described in claim 1, characterized in that, It further includes a first volatile organic compound sensor, which is electrically connected to the drive circuit board and housed in the gas outlet groove to detect the gas exiting the gas outlet path.

10. The particle detection module as described in claim 1, characterized in that, This piezoelectric actuator is a microelectromechanical pump, comprising: A first substrate having a plurality of inflow holes, the plurality of inflow holes being tapered; A first oxide layer is stacked on the first substrate. The first oxide layer has multiple confluence channels and a confluence chamber. The multiple confluence channels are connected between the confluence chamber and the multiple inflow holes. A second substrate, bonded to the first substrate, comprising: A silicon wafer layer having: The moving part is circular; An outer peripheral portion, in the form of a hollow ring, surrounds the periphery of the actuating part; Multiple connecting parts are respectively connected between the actuating part and the outer peripheral part; and Multiple fluid channels surround the periphery of the actuating part and are respectively located between the multiple connecting parts; A second oxide layer, formed on the silicon wafer layer, is a hollow ring and defines a vibration chamber with the silicon wafer layer; and A silicon layer, circular in shape, is located in the second oxide layer and bonded to the first oxide layer, having: A perforation is formed at the center of the silicon layer; A vibrating part is located in the surrounding area of ​​the perforation; and A fixing part is located in the peripheral area of ​​the silicon material layer; and A piezoelectric component, in the shape of a circle, is stacked on the actuation portion of the silicon wafer layer.

11. The particle detection module as described in claim 10, characterized in that, The piezoelectric component includes: One electrode layer; A piezoelectric layer is stacked on the lower electrode layer; An insulating layer is laid on a portion of the surface of the piezoelectric layer and a portion of the surface of the lower electrode layer; as well as An upper electrode layer is stacked on the insulating layer and the remaining surface of the piezoelectric layer where the insulating layer is not present, for electrical connection with the piezoelectric layer.

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