Conductive composition and method for manufacturing micro light emitting diode display device

Abstract

The present disclosure provides a conductive composition and a method for manufacturing a micro-light emitting diode display device. The conductive composition comprises: 5 to 90 parts by weight of a monomer, 10 to 95 parts by weight of an epoxy resin, and 50 to 150 parts by weight of a conductive powder. The total weight of the monomer and the epoxy resin is 100 parts by weight. The monomer has n reactive functional groups, and n is 1, 2, 3 or 4, wherein the molecular weight of the monomer is less than or equal to 350. The epoxy equivalent weight of the epoxy resin is 160 g / equivalent to 3500 g / equivalent. In addition, the weight of the monomer, the number of reactive groups of the monomer, the molecular weight of the monomer, the weight of the epoxy resin, and the epoxy equivalent weight of the epoxy resin conform to a specific relationship.

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