A flip-chip LED device

Abstract

The invention discloses a flip-chip LED device, comprising a substrate, a plurality of front pads, a plurality of back pads, through holes and four groups of pixel points arranged in a square shape; the front pads and the back pads are arranged on two different sides of the substrate; the pixel points include an RGB chip group, and the RGB chip group includes three positive electrodes and three negative electrodes; the front pads include a front positive pad and a front negative pad; the front positive pad includes a pair of positive edge pads and a pair of positive middle pads, the positive edge pads have two extensions extending toward the middle position of the substrate, and the positive middle pad is arranged between the two extensions; the front negative pad includes a pair of negative edge pads and a pair of negative middle pads arranged between the negative edge pads; the negative edge pad is connected to one of the negative electrodes adjacent to the four pixel points, and the other two negative electrodes of the four pixel points are respectively connected to the adjacent negative middle pads; the invention reduces the difficulty of processing and manufacturing the substrate.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductors, and in particular relates to a flip-chip LED device. Background Art

[0002] LED chips are mostly manufactured using either the upright or flip-chip method. The upright method adds a wire bonding process, which increases the complexity of the process and reduces the reliability of the product. The flip-chip method has multiple through holes in the middle of the substrate, and the position design of the back pad must be considered at the same time, which limits the arrangement and connection of the front metal pad. The width of the metal layer and the spacing between the metal layers must be very small to meet the design requirements, and the substrate is difficult to process and manufacture. Summary of the invention

[0003] In order to overcome the above technical defects, the present invention provides a flip-chip LED device to reduce the difficulty of processing and manufacturing the substrate.

[0004] In order to solve the above problems, the present invention is implemented according to the following technical solutions:

[0005] The present invention provides a flip-chip LED device, comprising a substrate, a plurality of front solder pads, a plurality of back solder pads, through holes and four groups of pixel points arranged in a square shape;

[0006] The front solder pad and the back solder pad are arranged on two different sides of the substrate;

[0007] The through hole is located on the front pad, so that the back pad is connected to the front pad through the through hole;

[0008] The pixel point includes an RGB chipset, and the RGB chipset includes three positive electrodes and three negative electrodes; the front pad includes a front positive pad and a front negative pad;

[0009] The front positive electrode pad includes a pair of positive electrode edge pads vertically arranged at the edge of the substrate, and a pair of positive electrode middle pads arranged beside the positive electrode edge pads, the positive electrode edge pads have two extensions extending toward the middle position of the substrate, and the positive electrode middle pad is arranged between the two extensions; RGB chips in the same group of pixel points, wherein the positive electrodes of two RGB chips are connected to the positive electrode edge pads, and the two RGB chips are adjacent, and the positive electrode of the remaining RGB chip is connected to the positive electrode middle pad.

[0010] The positive negative electrode pad includes a pair of negative electrode edge pads and a pair of negative electrode middle pads arranged between the negative electrode edge pads; the negative electrode edge pad is connected to one of the negative electrodes adjacent to the four pixel points, and the other two negative electrodes of the four pixel points are respectively connected to the adjacent negative electrode middle pads.

[0011] Furthermore, the substrate is a square structure.

[0012] Furthermore, the negative electrode edge pad is an "I"-shaped structure, and both ends of the negative electrode edge pad are connected to one of the negative electrodes of the four pixel points.

[0013] Furthermore, the negative electrode middle pad is an I-shaped structure, and both left and right ends of the negative electrode middle pad are connected to the other two negative electrodes of the same pixel point.

[0014] Furthermore, the positive electrode middle pad is an "I"-shaped structure, and both ends of the positive electrode middle pad are connected to one of the positive electrodes of the four pixel points.

[0015] Furthermore, both ends of the positive electrode edge pad are connected to the other two positive electrodes of the four pixel points.

[0016] Furthermore, the through holes are symmetrically arranged along the center of the substrate.

[0017] Furthermore, the front solder pads are symmetrically arranged along the center of the substrate.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] The present invention discloses a flip-chip LED device, wherein the front positive electrode pads are arranged on both sides of the edge of a substrate; the front negative electrode pads are arranged between the front positive electrode pads, the positive electrode middle pad is connected to one of the positive electrodes adjacent to four pixel points, and the negative electrode edge pad is connected to one of the negative electrodes adjacent to the four pixel points, so that the RGB chip for controlling the pixel points can be individually lit up while reducing the number of through holes in the middle of the substrate, thereby reducing the processing accuracy and difficulty of the flip-chip LED device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The specific embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings, wherein:

[0021] Figure 1 A schematic diagram of a front solder pad of a flip-chip LED device in the prior art;

[0022] Figure 2 It is a structural schematic diagram of the front side of the substrate in Example 1;

[0023] Figure 3 is a schematic structural diagram of the back side of the substrate in Example 1;

[0024] Figure 4 This is a schematic diagram of the structure of the flip-chip LED device in Example 1.

[0025] Marking instructions: 1. Substrate; 2. Front pad; 21. Front positive pad; 211. Positive edge pad; 212. Positive middle pad; 22. Front negative pad; 221. Negative edge pad; 222. Negative middle pad; 3. Back pad; 4. Through hole; 5. Pixel point. DETAILED DESCRIPTION

[0026] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0027] Under traditional technology, reference Figure 1 , the number of through holes in the middle of the substrate is large, resulting in a complex arrangement of the circuit layer on the back, with a small spacing. There are tolerances in the substrate processing, and there is a risk of short circuit, which requires high precision in substrate processing.

[0028] Example 1

[0029] This embodiment discloses a flip-chip LED device. Figure 2-3 , comprising a substrate 1, a plurality of front pads 2, a plurality of back pads 3, a through hole 4 and four groups of pixel points 5 arranged in a square shape;

[0030] The front solder pad 2 and the back solder pad 3 are arranged on two different sides of the substrate 1;

[0031] The through hole 4 is located on the front pad 2, so that the back pad 3 is connected to the front pad 2 through the through hole 4;

[0032] The pixel point 5 includes an RGB chipset, and the RGB chipset includes 3 positive electrodes and 3 negative electrodes;

[0033] Specifically, the RGB chip includes a red light emitting chip, a blue light emitting chip, and a green light emitting chip. The red light emitting chip, the blue light emitting chip, and the green light emitting chip are each provided with a positive electrode and a negative electrode, and the positive electrode and the negative electrode are used to control the individual point quantity control of each chip.

[0034] The front pad 2 includes a front positive electrode pad 21 and a front negative electrode pad 22;

[0035] The front positive electrode pad 21 includes a pair of positive electrode edge pads 211 vertically arranged at the edge of the substrate 1, and a pair of positive electrode middle pads 212 arranged beside the positive electrode edge pads 211, the positive electrode edge pad 211 has two extensions extending toward the middle position of the substrate 1, and the positive electrode middle pad 212 is arranged between the two extensions; in the RGB chips in the same group of pixel points, the positive electrodes of two RGB chips are connected to the positive electrode edge pad 211, and the two RGB chips are adjacent, and the positive electrode of the remaining RGB chip is connected to the positive electrode middle pad 212.

[0036] The positive negative electrode pad 22 includes a pair of negative electrode edge pads 221 and a pair of negative electrode middle pads 222 arranged between the negative electrode edge pads 221; the negative electrode edge pad 221 is connected to one of the negative electrodes adjacent to the four pixel points 5, and the other two negative electrodes of the four pixel points 5 are respectively connected to the adjacent negative electrode middle pads 222.

[0037] In some embodiments, the negative electrode edge pad 221 is a "I"-shaped structure, and both ends of the negative electrode edge pad 221 are connected to one of the negative electrodes of the four pixel points 5. The negative electrode middle pad 222 is an "I"-shaped structure, and both left and right ends of the negative electrode middle pad 222 are connected to the other two negative electrodes of the same pixel point 5. The positive electrode middle pad 212 is a "I"-shaped structure, and both ends of the positive electrode middle pad 212 are connected to one of the positive electrodes of the four pixel points 5. Both ends of the positive electrode edge pad 211 are connected to the other two positive electrodes of the four pixel points 5.

[0038] Specifically, since the four pixel points 5 are arranged in a square shape, the present embodiment optimizes the design of the front pad 2 on the substrate 1, so that each pixel point 5, the red light emitting chip, the blue light emitting chip, and the green light emitting chip of each pixel point 5 can be individually controlled by a group of positive and negative electrodes. Figure 4 Taking pixel 5 located in the upper left corner as an example, the first group of positive and negative electrodes are connected to the positive edge pad 211 and the negative edge pad 221 respectively, the second group of positive and negative electrodes are connected to the positive edge pad 211 and the negative middle pad 222 respectively, and the third group of positive and negative electrodes are connected to the positive middle pad 212 and the negative middle pad 222 respectively, so as to realize separate lighting control of each group.

[0039] This embodiment reduces the number of through holes 4 in the middle of the substrate 1 by optimizing the design of the front pad 2 on the substrate 1, lowers the processing accuracy requirements and difficulty, and can achieve an arrangement of pixel points 5 with a pitch of less than 0.5 mm.

[0040] In some embodiments, the substrate 1 is a square structure, and the through hole 4 and the front pad 2 are symmetrically arranged along the center of the substrate 1 .

[0041] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Therefore, any modification, equivalent change and modification made to the above embodiment according to the technical essence of the present invention without departing from the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A flip-chip LED device, characterized in that: It includes a substrate, a plurality of front pads, a plurality of back pads, a through hole and four groups of pixel points arranged in a square shape; The front solder pad and the back solder pad are arranged on two different sides of the substrate; The through hole is located on the front pad, so that the back pad is connected to the front pad through the through hole; The pixel point includes an RGB chip group, and the RGB chip group includes 3 positive electrodes and 3 negative electrodes; the front pad includes a front positive pad and a front negative pad; the front positive pad includes a pair of positive edge pads vertically arranged at the edge of the substrate, and a pair of positive middle pads arranged beside the positive edge pads, the positive edge pads have two extensions extending to the middle position of the substrate, and the positive middle pad is arranged between the two extensions; RGB chips in the same group of pixel points, wherein the positive electrodes of two RGB chips are connected to the positive edge pads, and the two RGB chips are adjacent, and the positive electrode of the remaining RGB chip is connected to the positive middle pad; The front negative electrode pad includes a pair of negative electrode edge pads and a pair of negative electrode middle pads arranged between the negative electrode edge pads; the negative electrode edge pad is connected to one of the negative electrodes adjacent to the four pixel points, and the other two negative electrodes of the four pixel points are respectively connected to the adjacent negative electrode middle pads; The negative electrode edge pad is of a "I"-shaped structure, and both ends of the negative electrode edge pad are connected to one of the negative electrodes of the four pixel points; The negative electrode middle pad is an "I"-shaped structure, and the left and right ends of the negative electrode middle pad are connected to the other two negative electrodes of the four pixel points; The positive electrode middle pad is an "I"-shaped structure, and both ends of the positive electrode middle pad are connected to one of the positive electrodes of the four pixel points; Both ends of the positive electrode edge pad are connected to the other two positive electrodes of the four pixel points.

2. The flip-chip LED device according to claim 1, characterized in that: The substrate is a square structure.

3. The flip-chip LED device according to claim 2, characterized in that: The through holes are symmetrically arranged along the center of the substrate.

4. The flip-chip LED device according to claim 2, characterized in that: The front side pads are symmetrically arranged along the center of the substrate.

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