Display device and method of manufacturing a display device

Abstract

A display device and a method of manufacturing the same are provided. A display device including a first non-folded area, a second non-folded area spaced apart from the first non-folded area, and a folded area between the first non-folded area and the second non-folded area, includes a flexible display panel, a metal plate supporting the flexible display panel and including a recess in the folded area, the metal plate having a first thickness in the first non-folded area and the second non-folded area, and having a second thickness less than the first thickness in the folded area, a resin portion disposed in the recess, and a first adhesive layer disposed between the flexible display panel and the metal plate.

Description

Technical Field

[0001] Exemplary embodiments of the present invention generally relate to a display device and a method of manufacturing the same, and more specifically, to an inwardly foldable display device and a method of manufacturing the same. Background Technology

[0002] With technological advancements, display products with smaller size, lighter weight, and higher performance have been manufactured. Conventional cathode ray tube (CRT) televisions have been widely used in display devices due to their performance and price. However, recently, display devices that offer various advantages over CRT devices, such as plasma displays, liquid crystal displays, and organic light-emitting diode (OLED) displays, have attracted attention, particularly in terms of miniaturization, weight reduction, and low power consumption.

[0003] Recently, with the development of bendable and flexible display devices, research has been conducted on applying flexible display devices to mobile devices with foldable structures. For example, foldable display devices that include a folding region and are bendable have been developed. However, when a foldable display device is fully folded in the folding region (e.g., bent at an angle), the display element itself may be damaged. Therefore, there is a need to develop a support structure that is durable while preventing damage by limiting the radius of curvature of the bent foldable display device when the mobile device is folded. In particular, depending on the construction of the support structure, the quality of the foldable display device may deteriorate when wrinkles or minor irregularities in the display region are perceived by the user.

[0004] The information disclosed in this background section is only for understanding the background of the inventive concept, and therefore may contain information that does not constitute prior art. Summary of the Invention

[0005] The foldable display device and its manufacturing method, constructed according to exemplary embodiments of the present invention, provide improved quality.

[0006] Additional features of the inventive concept will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the inventive concept.

[0007] A display device according to an exemplary embodiment includes a first non-foldable region, a second non-foldable region spaced apart from the first non-foldable region, and a foldable region located between the first non-foldable region and the second non-foldable region. The device comprises: a flexible display panel; a metal plate supporting the flexible display panel and including a recess in the foldable region, the metal plate having a first thickness in the first and second non-foldable regions and a second thickness less than the first thickness in the foldable region; a resin portion disposed in the recess; and a first adhesive layer disposed between the flexible display panel and the metal plate.

[0008] The metal sheet may also include multiple opening patterns in the folded area.

[0009] Metal sheets may include stainless steel (SUS).

[0010] The initial thickness of the metal plate can be approximately 100 μm or less.

[0011] The resin portion may include a base and protrusions protruding from the base and disposed within a plurality of opening patterns, and the protrusions may be disposed between the base and the flexible display panel.

[0012] The resin portion may include a carbon component.

[0013] The resin component may include graphite powder.

[0014] The resin portion may have a lower modulus than the metal plate.

[0015] Air gaps can be formed in the opening pattern of a metal plate.

[0016] The air gap can be defined by the upper surface of the protrusion of the resin portion and the lower surface of the first adhesive layer.

[0017] The first non-folded area and the second non-folded area may be spaced apart in the first direction, and each of the plurality of opening patterns in the metal plate may extend in the second direction perpendicular to the first direction, and the plurality of opening patterns are arranged in a zigzag pattern in the first direction.

[0018] When viewed in a plan view, the opening pattern set at the edge of the metal plate in the second direction can have one side connected to the edge of the metal plate and have an open shape.

[0019] The flexible display panel can be configured to be located on the inside of the metal plate when the display device is folded due to the bending of the folding area.

[0020] The display device may further include: a pad layer disposed between the first adhesive layer and the flexible display panel, the pad layer comprising a foam material; and a second adhesive layer disposed between the pad layer and the flexible display panel.

[0021] A flexible display panel may include a flexible substrate, a thin-film transistor disposed on the flexible substrate, a first electrode electrically connected to the thin-film transistor, a light-emitting structure disposed on the first electrode, and a second electrode disposed on the light-emitting structure.

[0022] The display device may further include: a thin film encapsulation layer disposed on the second electrode, a third adhesive layer disposed on the thin film encapsulation layer, and a window layer disposed on the third adhesive layer.

[0023] A method for manufacturing a display device according to another exemplary embodiment includes a first non-foldable region, a second non-foldable region spaced apart from the first non-foldable region, and a foldable region located between the first non-foldable region and the second non-foldable region, comprising the steps of: forming a recess in a metal plate in the foldable region to have a first thickness in the first non-foldable region and the second non-foldable region, and having a second thickness in the foldable region less than the first thickness due to the recess; forming a resin portion in the recess of the metal plate; attaching a pad to the metal plate by using a first adhesive layer; and attaching a display panel structure including a flexible display panel to the pad.

[0024] The step of forming a recess in a metal plate in a folded area may include: forming a recess by removing a portion of the metal plate in the folded area through an etching process; and forming a plurality of opening patterns in the metal plate in the folded area through an etching process.

[0025] The steps may further include providing a resin solution in the recesses and multiple opening patterns of the metal plate to form a resin portion including a base and multiple protrusions protruding from the base and disposed within the multiple opening patterns.

[0026] The steps of forming the resin portion may include: providing a support portion having a plurality of protrusions corresponding to a plurality of opening patterns under a metal plate before providing a resin solution; and forming a resin portion including a base and a plurality of protrusions by providing a resin solution, and when the pad layer is attached to the metal plate by using a first adhesive layer, an air gap defined by the upper surface of the protrusions of the resin portion and the lower surface of the first adhesive layer can be formed in the opening pattern.

[0027] It will be understood that the foregoing general description and the following detailed description are exemplary and explanatory, and are intended to provide further explanation of the claimed invention. Attached Figure Description

[0028] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and, together with the description, serve to explain the inventive concept.

[0029] Figure 1 This is a perspective view of a display device according to an exemplary embodiment.

[0030] Figure 2 It is shown Figure 1 A perspective view of the folded state of the display device.

[0031] Figure 3 It is shown Figure 1 A cross-sectional view of the folded area of ​​the display device and the portion adjacent to the folded area.

[0032] Figure 4 It is shown Figure 3 A plan view of the folded area of ​​the metal plate and the portion adjacent to the folded area.

[0033] Figure 5 It is shown Figure 3 A cross-sectional view of a portion of the flexible display panel structure of a display device.

[0034] Figure 6 This is a cross-sectional view showing the folded area and the portion adjacent to the folded area of ​​a display device according to another exemplary embodiment.

[0035] Figure 7A , Figure 7B , Figure 7C , Figure 7D and Figure 7E It shows the manufacturing process. Figure 3 A cross-sectional view of the method for displaying a device.

[0036] Figure 8A , Figure 8B , Figure 8C , Figure 8D and Figure 8E It shows the manufacturing process. Figure 6 A cross-sectional view of the method for displaying a device.

[0037] Figure 9 This is a block diagram illustrating an electronic device according to an exemplary embodiment.

[0038] Figure 10 This is an example illustrating an implementation as a smartphone. Figure 9 A perspective view of an electronic device. Detailed Implementation

[0039] In the following description, numerous specific details are set forth for purposes of explanation in order to provide a thorough understanding of various exemplary embodiments or implementations of the invention. As used herein, “implementation” and “method” are interchangeable terms and are non-limiting examples of apparatuses or methods employing one or more of the inventive concepts disclosed herein. However, it will be apparent that various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and apparatuses are illustrated in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Furthermore, the various exemplary embodiments may be different, but are not necessarily exclusive. For example, a particular shape, configuration, and characteristic of an exemplary embodiment may be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0040] Unless otherwise stated, the exemplary embodiments shown are to be understood as exemplary features providing details of variations in some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise stated, features, components, modules, layers, films, plates, regions and / or aspects of various embodiments (hereinafter individually or collectively referred to as “elements”) may be combined, separated, interchanged and / or rearranged in other ways without departing from the inventive concept.

[0041] The use of crosshairs and / or shading in the accompanying drawings is generally provided to clarify the boundaries between adjacent elements. By their very nature, unless specifically stated otherwise, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for specific materials, material properties, dimensions, scale, commonalities between illustrated elements, or / or any other characteristics, properties, or characteristics of the elements. Furthermore, the size and relative size of elements may be exaggerated in the drawings for clarity and / or descriptive purposes. A particular order of processes may be performed differently than the order described when exemplary embodiments can be implemented differently. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of their description. Additionally, similar reference numerals denote similar elements.

[0042] When a layer or element is referred to as being "on" another element or layer, "connected to," or "attached to" another element or layer, it can be directly on, directly connected to, or directly attached to the other element or layer, or there may be intermediate elements or layers present. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to," or "directly attached to" another element or layer, there are no intermediate elements or layers present. Therefore, the term "connection" can refer to a physical, electrical, and / or fluid connection with or without intermediate elements. Furthermore, the D1, D2, and D3 axes are not limited to the three axes of a Cartesian coordinate system, such as the x-axis, y-axis, and z-axis, and can be interpreted in a broader sense. For example, the D1, D2, and D3 axes can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0043] Although the terms “first,” “second,” etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element.

[0044] Spatial relative terms, such as “below,” “under,” “below,” “down,” “above,” “above,” “higher,” “side” (e.g., as in “sidewall”), and similar words, may be used herein for descriptive purposes to describe the relationship of one element(s) to another(s) shown in the figures. Spatial relative terms are intended to cover different orientations of the device in use, operation, and / or manufacture other than those depicted in the figures. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features would subsequently be oriented “above” other elements or features. Thus, the exemplary term “below” can include both upper and lower orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or located in other orientations), and, for its own sake, the spatial relative descriptive terms used herein should be interpreted accordingly.

[0045] The technical terms used herein are for the purpose of describing particular embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a” and “the” as used herein are intended to include the plural forms as well. Furthermore, the term “comprising,” as used in this specification, specifically indicates the presence of the mentioned features, integers, steps, operations, elements, components, and / or groups thereof, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximate terms, not as terms of degree, and, in their very nature, are used to account for inherent biases in measurements, calculations, and / or provided values ​​that will be apparent to those skilled in the art.

[0046] Various exemplary embodiments are described herein with reference to cross-sectional and / or exploded views as schematic illustrations of idealized exemplary embodiments and / or intermediate structures. Variations in the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, the exemplary embodiments disclosed herein should not be construed as limited to the illustrated shapes of specific areas, but will include shape deviations caused, for example, by manufacturing. In this way, the areas shown in the figures can be schematic in nature, and the shapes of these areas may not reflect the actual shapes of the areas of the device, and are not intended to be limiting in themselves.

[0047] As is customary in the art, exemplary embodiments of functional blocks, units, and / or modules are described and illustrated in the accompanying drawings. Those skilled in the art will appreciate that these blocks, units, and / or modules are physically implemented by electronic (or optical) circuitry such as logic circuits, discrete components, microprocessors, hardwired circuitry, memory elements, wiring connectors, and the like, which can be formed using semiconductor-based fabrication techniques or other manufacturing techniques. Where blocks, units, and / or modules are implemented by microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and optionally, they can be driven by firmware and / or software. It is also possible that each block, unit, and / or module can be implemented by dedicated hardware, or by a combination of dedicated hardware performing some functions and processors performing other functions (e.g., one or more programmed microprocessors and associated circuitry systems). Furthermore, each block, unit, and / or module of some exemplary embodiments can be physically separated into two or more interactive and discrete blocks, units, and / or modules without departing from the scope of the inventive concept. Furthermore, some exemplary embodiments of blocks, units, and / or modules can be physically combined into more complex blocks, units, and / or modules without departing from the scope of the inventive concept.

[0048] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms, such as those defined in common dictionaries, shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and shall not be interpreted in an ideal or overly rigid sense unless expressly so defined herein.

[0049] In the following, exemplary embodiments will be described in detail with reference to the accompanying drawings.

[0050] Figure 1 This is a perspective view of a display device according to an exemplary embodiment, and Figure 2 It is shown Figure 1 A perspective view of the folded state of the display device.

[0051] Reference Figure 1 and Figure 2 The display device may include a display panel structure PNS and a support structure SPS. The display panel structure PNS includes a flexible display panel PN, and the support structure SPS is configured to support the display panel structure PNS.

[0052] The display device may include a first non-foldable region RA1, a second non-foldable region RA2 spaced apart from the first non-foldable region RA1 in a first direction D1, and a foldable region FA disposed between the first non-foldable region RA1 and the second non-foldable region RA2.

[0053] The display panel structure PNS may include a display panel configured to display images (see [link to PNS]). Figure 3 The image can be displayed on the front surface of the display device. The front surface may include a display area and a non-display area surrounding the display area, and the display area may be formed by a first non-folded area RA1, a folded area FA, and a second non-folded area RA2.

[0054] The display device can be bent to fold and unfold via the folding area FA, and an inward-folding foldable display device can be realized so that the front surfaces configured to display images can face each other in the folded state.

[0055] Figure 3 It is shown Figure 1 A cross-sectional view of the folded area FA of the display device and the portion adjacent to the folded area FA, and Figure 4 It is shown Figure 3 A plan view of the folded area FA of the metal plate 100 and the portion adjacent to the folded area FA.

[0056] Reference Figures 1 to 4 The support structure SPS of the display device may include a metal plate 100, a resin portion 200, a third adhesive layer PSA3, a pad layer CS, and a second adhesive layer PSA2. The display panel structure PNS of the display device may include a flexible display panel PN, a first adhesive layer PSA1, a window layer CPI, and a protective layer PL.

[0057] The metal plate 100 can support the display panel structure PNS. The metal plate 100 may include metal. For example, the metal plate 100 may include stainless steel (SUS). In another exemplary embodiment, the metal plate 100 may include alloys (e.g., superelastic metals) such as nickel-titanium (Ni-Ti), nickel-aluminum (Ni-Al), copper-zinc-nickel (Cu-Zn-Ni), copper-aluminum-nickel (Cu-Al-Ni), copper-aluminum-manganese (Cu-Al-Mn), titanium-nickel-copper-molybdenum (Ti-Ni-Cu-Mo), cobalt-nickel-gallium:iron (Co-Ni-Ga:Fe), silver-nickel (Ag-Ni), gold-cadmium (Au-Cd), iron-platinum (Fe-Pt), iron-nickel (Fe-Ni), and indium-cadmium (In-Cd).

[0058] The metal plate 100 may have a first thickness t1 in the first non-folded region RA1 and the second non-folded region RA2, and because a recess (e.g., a recessed portion) is formed in the folded region FA, it may have a second thickness t2 in the folded region FA that is less than the first thickness t1. When the metal plate 100 includes SUS, the first thickness t1 may be approximately 150 μm and the second thickness t2 may be approximately 50 μm, but is not limited thereto. In some exemplary embodiments, the first thickness t1 may be approximately 100 μm or less.

[0059] The recess can be formed on the surface opposite to the surface of the metal plate 100 that contacts the third adhesive layer PSA3. The recess can be substantially filled by the resin portion 200.

[0060] Reference Figure 4 An opening pattern SL can be formed in the folded area FA of the metal plate 100. Each opening pattern SL can extend in the second direction D2. Multiple opening patterns SL can be arranged alternately in the first direction D1 and can extend in the second direction D2.

[0061] Additionally, the edge opening pattern SLE can be provided at the edge of the metal plate 100 along the second direction D2, and the edge opening pattern SLE can have a side connected to the edge of the metal plate 100, so that it has an open shape when viewed in a plan view.

[0062] Although the shape of each opening pattern SL has been illustrated and described as a substantially rectangular shape with rounded corners when viewed in a plan view, the inventive concept is not limited to a particular shape of the opening pattern SL. For example, in some exemplary embodiments, each opening pattern SL may have a substantially rectangular planar shape, a triangular planar shape, a rhomboid planar shape, a polygonal planar shape, a circular planar shape, a track-shaped planar shape, or an elliptical planar shape.

[0063] The resin portion 200 may be disposed in a recess of the metal plate 100. The resin portion 200 may include a base 210 and a protrusion 220 protruding from the base 210 and disposed within the opening pattern SL. The protrusion 220 may be disposed between the base 210 and the display panel structure PNS.

[0064] The resin portion 200 may include a low-modulus material with a modulus lower than that of the metal sheet 100. The resin portion 200 may include an elastomer with relatively high elasticity or relatively high resilience. For example, the resin portion 200 may include elastic materials such as polysiloxanes, polyurethanes, and thermoplastic polyurethanes (TPU). In another exemplary embodiment, the resin portion 200 may include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene (PP), polycarbonate (PC), polystyrene (PS), polysulfone (PSul), polyethylene (PE), polyphthalamide (PPA), polyethersulfone (PES), polyarylate (PAR), polycarbonate oxide (PCO), modified polyphenylene oxide (MPPO), and the like.

[0065] The resin portion 200 can prevent damage caused by repeated folding and unfolding by supporting a portion of the folding area FA of the relatively thin metal plate 100. Additionally, when the display device is repeatedly folded and unfolded, the resin portion 200 can prevent foreign matter from penetrating into the opening pattern SL. Furthermore, when the display device is repeatedly folded and unfolded, the resin portion 200 can be stretched and contracted to prevent the opening pattern SL from being exposed.

[0066] The resin portion 200 may include a carbon component with excellent thermal conductivity to provide excellent thermal conductivity. The carbon component may include graphene, carbon nanotubes, graphite, and the like. For example, the resin portion 200 may include graphite powder.

[0067] The third adhesive layer PSA3 may be disposed on the metal plate 100. The third adhesive layer PSA3 may be bonded to a portion of the metal plate 100 and a portion of the resin portion 200. The third adhesive layer PSA3 may include optically clear adhesive (OCA), pressure-sensitive adhesive (PSA), photocurable resin or thermosetting resin and the like. For example, the adhesive may include PET, PEN, PP, PC, PS, PSul, PE, PPA, PES, PAR, PCO, MPPO and the like, and the resin may include epoxy resin, amino resin, phenolic resin, urea resin, melamine resin, unsaturated polyester resin, polyurethane resin, polyimide resin and the like.

[0068] The cushioning layer CS can be disposed on the third adhesive layer PSA3. The cushioning layer CS may include a ductile material so that the display panel structure PNS can be easily folded. For example, the cushioning layer CS may include foam-type materials such as polyurethane foam and polystyrene foam.

[0069] The second adhesive layer PSA2 can be disposed on the padding layer CS. The display panel structure PNS can be bonded to the second adhesive layer PSA2. The second adhesive layer PSA2 may include optically clear adhesive (OCA), pressure-sensitive adhesive (PSA), photocurable resin or thermosetting resin and the like. For example, the adhesive may include PET, PEN, PP, PC, PS, PSul, PE, PPA, PES, PAR, PCO, MPPO and the like, and the resin may include epoxy resin, amino resin, phenolic resin, urea resin, melamine resin, unsaturated polyester resin, polyurethane resin, polyimide resin and the like.

[0070] When the folded region FA of the metal plate 100, formed of a metallic material, is repeatedly folded and unfolded, the temperature at the portion of the folded region FA in which the opening pattern SL is formed rises, which may increase stress and cause cracking. According to the exemplary embodiment shown, the metal plate 100 is formed of metal to effectively dissipate heat from the display panel structure PNS. Additionally, the folded region FA of the metal plate 100 can be thinner than other portions and can have the opening pattern SL formed to improve flexibility. Furthermore, the resin portion 200 can be formed of a resin material including a carbon component with excellent thermal conductivity and low modulus to facilitate heat dissipation, improve the flatness of the outer surface, and reduce vibration noise during the folding of the display device within the folded region FA.

[0071] The flexible display panel PN can be disposed on the second adhesive layer PSA2. The flexible display panel PN can be a flexible organic light-emitting display panel, which will be discussed later. Figure 5 To describe it in more detail.

[0072] The first adhesive layer PSA1 can be disposed on the flexible display panel PN. The first adhesive layer PSA1 may include an optically clear adhesive (OCA), a pressure-sensitive adhesive (PSA), a photocurable resin or a thermosetting resin, and the like. For example, the adhesive may include PET, PEN, PP, PC, PS, PSul, PE, PPA, PES, PAR, PCO, MPPO, and the like, and the resin may include epoxy resin, amino resin, phenolic resin, urea resin, melamine resin, unsaturated polyester resin, polyurethane resin, polyimide resin, and the like.

[0073] The window layer CPI can be disposed on the first adhesive layer PSA1. The window layer CPI can be a transparent flexible film, such as ultrathin glass or transparent polyimide.

[0074] The protective layer PL can be placed on the window layer CPI and protect the window layer CPI. The protective layer PL can be bonded to the window layer CPI with an adhesive layer to facilitate replacement of the protective layer PL when needed.

[0075] Figure 5 It is shown Figure 3 A cross-sectional view of a portion of the flexible display panel PN of the display device PNS.

[0076] Reference Figure 3 and Figure 5 The flexible display panel PN may include a flexible substrate 300, a thin-film transistor (TFT), a first insulating layer 310, a second insulating layer 320, a through-hole insulating layer VIA, a pixel defining layer PDL, a light-emitting structure 380, a thin-film encapsulation layer TFE, and the like. The TFT may include an active pattern ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE. The light-emitting structure 380 may include a first electrode 381, a light-emitting layer 382, ​​and a second electrode 383.

[0077] The flexible substrate 300 may comprise a transparent or opaque material. The flexible substrate 300 may be disposed on the second adhesive layer PSA2. The flexible substrate 300 may be formed from a transparent resin substrate, such as a polyimide substrate. In this case, the polyimide substrate may comprise a first polyimide layer, a barrier film layer, a second polyimide layer, and the like. In some exemplary embodiments, the flexible substrate 300 may comprise a quartz substrate, a synthetic quartz substrate, a calcium fluoride substrate, a fluorine-doped (F-doped) quartz substrate, a soda-lime glass substrate, a non-alkali glass substrate, and the like.

[0078] A buffer layer can be disposed on the flexible substrate 300. The buffer layer prevents metal atoms or impurities from diffusing from the flexible substrate 300 into the thin-film transistor (TFT). The buffer layer can also allow the active pattern ACT to have approximately uniformity by adjusting the heat transfer rate during the crystallization process used to form the active pattern ACT. Additionally, the buffer layer can improve the flatness of the flexible substrate 300 surface when the surface of the flexible substrate 300 is non-uniform. Depending on the type of flexible substrate 300, two or more buffer layers can be disposed on the flexible substrate 300, or the buffer layer can be omitted. For example, the buffer layer may comprise an organic or inorganic material.

[0079] An active pattern ACT can be disposed on a flexible substrate 300. The active pattern ACT may include metal-oxide semiconductors, inorganic semiconductors such as amorphous silicon and polycrystalline silicon, organic semiconductors, and the like. The active pattern ACT may have a source region, a drain region, and a channel region between the source region and the drain region.

[0080] A first insulating layer 310 may be disposed on the active pattern ACT. For example, the first insulating layer 310 may substantially cover the active pattern ACT on the flexible substrate 300 and may have a substantially flat upper surface without creating steps around the active pattern ACT. In some exemplary embodiments, the first insulating layer 310 may be configured to have a uniform thickness along the contour of the active pattern ACT while covering the active pattern ACT on the flexible substrate 300. The first insulating layer 310 may include silicon compounds, metal oxides, and the like. For example, the first insulating layer 310 may include silicon oxide (SiO2). x ), silicon nitride (SiN) x ), silicon oxynitride (SiO) x N y ), silicon dioxide (SiO2) x C y ), silicon carbide (SiC) x N y ), aluminum oxide (AlO) x ), aluminum nitride (AlN) x ), tantalum oxide (TaO) x ), Hafnium oxide (HfO) x Zirconium oxide (ZrO) x Titanium oxide (TiO) x (and similar materials). In some exemplary embodiments, the first insulating layer 310 may have a multilayer structure comprising multiple insulating layers. For example, the multiple insulating layers may have different thicknesses or comprise different materials.

[0081] A gate pattern, including the gate electrode GE, can be disposed on the first insulating layer 310. The gate pattern can be configured to overlap with the channel region of the active pattern ACT. The gate electrode GE may include metals, alloys, metal nitrides, conductive metal oxides, transparent conductive materials, and the like. For example, the gate electrode GE may include gold (Au), silver (Ag), aluminum (Al), tungsten (W), copper (Cu), platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), molybdenum (Mo), scandium (Sc), neodymium (Nd), iridium (Ir), aluminum-containing alloys, and aluminum nitride (AlN). x ), silver-containing alloys, tungsten nitride (WN) x ), copper-containing alloys, molybdenum-containing alloys, titanium nitride (TiN) x ), Chromium nitride (CrN) x ), Tantalum nitride (TaN) x ), SrRuO x O y ), zinc oxide (ZnO) x Indium Tin Oxide (ITO), Tin Oxide (SnO) x Indium oxide (InO) x Gallium oxide (GaO) x Indium zinc oxide (IZO) and the like. These can be used alone or in combination. In some exemplary embodiments, the gate pattern may include a multilayer structure comprising multiple metal layers. For example, the multiple metal layers may have different thicknesses or comprise different materials.

[0082] The second insulating layer 320 may be disposed on the gate pattern. For example, the second insulating layer 320 may substantially cover the gate pattern on the first insulating layer 310 and may have a substantially flat upper surface without creating steps around the gate pattern. In some exemplary embodiments, the second insulating layer 320 may be configured to have a uniform thickness along the contour of the gate pattern while covering the gate pattern on the first insulating layer 310. The second insulating layer 320 may comprise silicon compounds, metal oxides, and the like. In some exemplary embodiments, the second insulating layer 320 may have a multilayer structure comprising multiple insulating layers. For example, the multiple insulating layers may have different thicknesses or comprise different materials.

[0083] Data patterns, including the source electrode SE and drain electrode DE of a thin-film transistor (TFT), can be disposed on a second insulating layer 320. The source electrode SE can be connected to the source region of the active pattern ACT via a contact hole formed by removing a first portion of the first insulating layer 310 and a first portion of the second insulating layer 320. Similarly, the drain electrode DE can be connected to the drain region of the active pattern ACT via a contact hole formed by removing a second portion of the first insulating layer 310 and a second portion of the second insulating layer 320. The data patterns can include metals, alloys, metal nitrides, conductive metal oxides, transparent conductive materials, and the like. These can be used individually or in combination. In some exemplary embodiments, the data pattern can have a multilayer structure comprising multiple metal layers. For example, the multiple metal layers can have different thicknesses or comprise different materials.

[0084] Therefore, a thin-film transistor (TFT) including an active pattern ACT, a first insulating layer 310, a gate electrode GE, a second insulating layer 320, a source electrode SE, and a drain electrode DE can be formed.

[0085] Although thin-film transistors (TFTs) have been shown and described as having a top-gate structure, the inventive concept is not limited thereto. For example, in some exemplary embodiments, thin-film transistor TFTs may have a bottom-gate structure, a dual-gate structure, or a similar structure.

[0086] A via insulating layer VIA can be disposed on the second insulating layer 320 and the data pattern. For example, the via insulating layer VIA can be configured to have a relatively thick thickness. In this case, the via insulating layer VIA can have a substantially flat upper surface. To form the flat upper surface of the via insulating layer VIA, a planarization process can be performed on the via insulating layer VIA. In some exemplary embodiments, the via insulating layer VIA can be configured to have a uniform thickness along the contour of the data pattern on the second insulating layer 320. The via insulating layer VIA can be formed of organic or inorganic materials. In some exemplary embodiments, the via insulating layer VIA may include organic materials. For example, the via insulating layer VIA may include photoresist, polyacrylic resin, polyimide resin, polyamide resin, siloxane resin, acrylic resin, epoxy resin, and the like.

[0087] The first electrode 381 may be disposed on the via insulating layer VIA. The first electrode 381 can be electrically connected to the thin-film transistor (TFT) via a contact hole formed by removing a portion of the via insulating layer VIA. The first electrode 381 may comprise a metal, alloy, metal nitride, conductive metal oxide, transparent conductive material, and the like. These may be used alone or in combination. In some exemplary embodiments, the first electrode 381 may have a multilayer structure comprising multiple metal layers. For example, the multiple metal layers may have different thicknesses or comprise different materials.

[0088] The pixel defining layer (PDL) can be disposed on the via insulating layer (VIA). For example, the PDL can cover both sides of the first electrode 381 while exposing a portion of the upper surface of the first electrode 381. The PDL can be formed of organic or inorganic materials. In some exemplary embodiments, the PDL may include an organic material.

[0089] A light-emitting layer 382 may be disposed on the pixel defining layer (PDL) and the first electrode 381. The light-emitting layer 382 may include at least one of a variety of light-emitting materials, which are capable of emitting light of various colors, such as red, green, and blue, depending on the sub-pixel. In some exemplary embodiments, the light-emitting layer 382 may be formed by stacking multiple light-emitting materials capable of generating different colors of light, such as red, green, and blue, so that it can emit white light as a whole. In this case, a color filter may be disposed on the light-emitting layer 382, ​​which is disposed on the first electrode 381. The color filter may include at least one of a red color filter, a green color filter, and a blue color filter. In some exemplary embodiments, the color filter may include a yellow color filter, a cyan color filter, and a magenta color filter. The color filter may include a photosensitive resin or a colored photoresist.

[0090] The second electrode 383 may be disposed on the light-emitting layer 382 and the pixel defining layer PDL. The second electrode 383 may include metals, alloys, metal nitrides, conductive metal oxides, transparent conductive materials, and the like. These may be used individually or in combination. In some exemplary embodiments, the second electrode 383 may have a multilayer structure comprising multiple metal layers. For example, the multiple metal layers may have different thicknesses or comprise different materials.

[0091] A thin-film encapsulation layer (TFE) can be disposed on the second electrode 383. The TFE may comprise at least one alternating layer of inorganic and organic layers. For example, the TFE may comprise a first inorganic layer, an organic layer on the first inorganic layer, and a second inorganic layer disposed on the organic layer. The TFE prevents the light-emitting layer 382 from deteriorating due to the penetration of moisture, oxygen, or the like. Furthermore, the TFE protects the flexible display panel PN from external impacts. Additionally, the TFE improves the flatness of the flexible display panel PN.

[0092] In the exemplary embodiments shown, although the display device has been described as including an organic light-emitting display panel, the inventive concept is not limited thereto. In some exemplary embodiments, the display device may include a liquid crystal display (LCD), a field emission display (FED), a plasma display panel (PDP), or an electrophoretic display (EPD) device.

[0093] Figure 6 This is a cross-sectional view showing the folded region FA and the portion adjacent to the folded region FA of a display device according to another exemplary embodiment.

[0094] Reference Figure 6 In addition to forming an air gap AG in the opening pattern SL of the metal plate 100, the display device and Figure 3 The display devices are essentially the same. Therefore, repeated descriptions of the essentially the same components already described above will be omitted.

[0095] A display device according to the exemplary embodiment shown may include a display panel structure PNS and a support structure SPS, wherein the display panel structure PNS includes a flexible display panel PN and the support structure SPS is configured to support the display panel structure PNS.

[0096] The support structure SPS of the display device may include a metal plate 100, a resin portion 200, a third adhesive layer PSA3, a padding layer CS, and a second adhesive layer PSA2. The display panel structure PNS of the display device may include a flexible display panel PN, a first adhesive layer PSA1, a window layer CPI, and a protective layer PL.

[0097] An air gap AG can be formed in the opening pattern SL of the metal plate 100. The air gap AG can be defined by the upper surface of the protrusion 220 of the resin portion 200 and the lower surface of the third adhesive layer PSA3.

[0098] When the folding region FA of the display device is bent, a portion of the resin portion 200 can be pushed upward or downward relative to the opening pattern SL of the metal plate 100. In this case, pressure can be applied in the direction of the flexible display panel PN or in the opposite direction, and this pressure can form uneven portions on the display surface. However, in the display device according to the exemplary embodiment shown, since an air gap AG is formed in the opening pattern SL of the metal plate 100, the formation of uneven portions on the display surface when the folding region FA of the display device is bent can be prevented or at least suppressed.

[0099] Therefore, the quality of the display surface of the display device can be improved, and wrinkles and similar features in the folded area FA can be prevented or at least suppressed.

[0100] Furthermore, since an air gap AG is formed without filling the opening pattern SL of the metal plate 100 with the protrusion 220 of the resin portion 200, the bonding strength between the upper surface of the metal plate 100 in the folded region FA and the third adhesive layer PSA3 can be increased due to the air gap AG.

[0101] Figures 7A to 7E It shows the manufacturing process. Figure 3 A cross-sectional view of the method for displaying a device.

[0102] Reference Figure 7A An initial etching process can be performed on the metal plate 100 to remove a portion of the metal plate 100 corresponding to the folded region FA. For example, a photoresist layer can be formed on the metal plate 100, and the photoresist layer can be exposed and developed to form a photoresist pattern covering the first non-folded region RA1 and the second non-folded region RA2. Then, the metal plate 100 can be etched using the photoresist pattern as an etching barrier, so that the metal plate 100 can be formed to have a first thickness t1 in the first non-folded region RA1 and the second non-folded region RA2, and a second thickness t2 in the folded region FA that is less than the first thickness t1.

[0103] Reference Figure 7B An opening pattern SL can be formed in the folded region FA of the metal plate 100 through a secondary etching process. For example, a photoresist layer can be formed on the metal plate 100, and the photoresist layer can be exposed and developed so that the photoresist pattern can cover a portion of the first non-folded region RA1, the second non-folded region RA2, and the folded region FA. Then, the metal plate 100 can be etched using the photoresist pattern as an etching barrier to form the opening pattern SL.

[0104] Although the primary and secondary etching processes have been described as being performed by separate processes, in some exemplary embodiments, the portion having a first thickness t1 and the opening pattern SL can be formed by an etching process using a halftone mask or the like.

[0105] Reference Figure 7C A resin portion 200 can be formed on the metal plate 100. The resin portion 200 can be formed in a recess in the folded region FA of the metal plate 100, the recess corresponding to a portion removed by a primary etching process and a secondary etching process. For example, a resin solution can be injected and cured to form a resin portion 200 including a base 210 and a protrusion 220 disposed in an opening pattern SL of the metal plate 100.

[0106] Reference Figure 7D A third adhesive layer PSA3, a padding layer CS, and a second adhesive layer PSA2 can be formed on the metal plate 100. For example, after attaching the third adhesive layer PSA3 and the second adhesive layer PSA2 to the two sides of the padding layer CS respectively, the third adhesive layer PSA3 is attached to the surface of the metal plate 100 opposite to the base 210 of the resin portion 200. In this way, the support structure SPS can be formed.

[0107] Reference Figure 7E The display panel structure PNS can be attached to the second adhesive layer PSA2 of the support structure SPS so that the display device can be manufactured.

[0108] The display panel structure PNS may include a flexible display panel PN, a first adhesive layer PSA1 disposed on the flexible display panel PN, a window layer CPI disposed on the first adhesive layer PSA1, and a protective layer PL disposed on the window layer CPI. For example, the display panel structure PNS can be formed by attaching the window layer CPI and the protective layer PL to the flexible display panel PN using the first adhesive layer PSA1. The flexible display panel PN may be a flexible organic light-emitting display panel.

[0109] Figures 8A to 8E It shows the manufacturing process. Figure 6 A cross-sectional view of a method for manufacturing a display device. Apart from forming the air gap AG, the manufacturing method according to the exemplary embodiment shown is consistent with the above-mentioned method. Figures 7A to 7E The methods described are essentially the same. For the sake of the part itself, repeated descriptions of the essentially identical steps described above will be omitted.

[0110] Reference Figure 8AThe portion of the metal plate 100 corresponding to the folded region FA can be partially removed, so that the metal plate 100 can be formed to have a first thickness t1 in the first non-folded region RA1 and the second non-folded region RA2 and a second thickness t2 in the folded region FA that is less than the first thickness t1.

[0111] Reference Figure 8B An opening pattern SL can be formed in the folded area FA of the metal plate 100.

[0112] Reference Figure 8C The resin portion 200 can be formed on the metal plate 100. A support portion 10 can be disposed below the metal plate 100, and a protrusion 12 can be formed on the support portion 10 to correspond to the opening pattern SL of the metal plate 100. In this case, the resin solution used to form the resin portion 200 may not fill the protrusion 12. Therefore, one end of each protrusion 220 of the resin portion 200 can have a recessed shape. This recessed shape can provide space for forming the air gap AG, which will be described later.

[0113] Reference Figure 8D The support portion 10 can be removed from the metal plate 100, and a third adhesive layer PSA3, a padding layer CS, and a second adhesive layer PSA2 can be formed on the metal plate 100. For example, after the third adhesive layer PSA3 and the second adhesive layer PSA2 are respectively attached to the two sides of the padding layer CS, the third adhesive layer PSA3 is attached to the surface of the metal plate 100 opposite to the base 210 of the resin portion 200. In this way, the support structure SPS can be formed.

[0114] Since the recessed shape is formed at one end of the protrusion 220 of the resin portion 200, the air gap AG can be formed between the lower surface of the third adhesive layer PSA3 and the upper surface of the protrusion 220.

[0115] Reference Figure 8E The display panel structure PNS can be attached to the second adhesive layer PSA2 of the support structure SPS so that the display device can be manufactured.

[0116] The display panel structure PNS may include a flexible display panel PN, a first adhesive layer PSA1 disposed on the flexible display panel PN, a window layer CPI disposed on the first adhesive layer PSA1, and a protective layer PL disposed on the window layer CPI.

[0117] Figure 9 This is a block diagram illustrating an electronic device 500 according to an exemplary embodiment, and Figure 10 This is an example illustrating an implementation as a smartphone. Figure 9 A perspective view of the electronic device 500.

[0118] Reference Figure 9 and Figure 10 Electronic device 500 may include processor 510, memory device 520, storage device 530, input / output (I / O) device 540, power supply 550, and display device 560. Display device 560 may include... Figure 1 The display device. Furthermore, the electronic device 500 may also include multiple ports for communicating with video cards, sound cards, memory cards, Universal Serial Bus (USB) devices, other electronic devices, etc. In an exemplary embodiment, such as Figure 10 As shown, electronic device 500 can be implemented as a foldable smartphone. However, electronic device 500 is not limited to this. For example, electronic device 500 can be implemented as a cellular phone, video phone, smart tablet, smartwatch, tablet PC, car navigation system, computer monitor, laptop computer, head-mounted display (HMD) device, etc.

[0119] Processor 510 can perform various computing functions. Processor 510 can be a microprocessor, a central processing unit (CPU), an application processor (AP), etc. Processor 510 can be connected to other components via address buses, control buses, data buses, etc. Furthermore, processor 510 can be connected to expansion buses, such as the Peripheral Component Interconnect (PCI) bus. Memory device 520 can store data used for the operation of electronic device 500. For example, memory device 520 may include at least one non-volatile memory device, such as an erasable programmable read-only memory (EPROM) device, an electrically erasable programmable read-only memory (EEPROM) device, a flash memory device, a phase-change random access memory (PRAM) device, a resistive random access memory (RRAM) device, a nano-floating gate memory (NFGM) device, a polymer random access memory (PoRAm) device, a magnetic random access memory (MRAM) device, a ferroelectric random access memory (FRAM) device, and / or at least one volatile memory device, such as a dynamic random access memory (DRAM) device, a static random access memory (SRAM) device, etc. The storage device 530 may include solid-state drive (SSD) devices, hard disk drive (HDD) devices, CD-ROM devices, etc. The I / O device 540 may include input devices such as a keyboard, keypad, mouse, touchpad, touchscreen, etc., and output devices such as a printer, speaker, etc. The power supply 550 provides power for the operation of the electronic device 500.

[0120] Display device 560 can be connected to other components via a bus or other communication link. In some exemplary embodiments, I / O device 540 may include display device 560. As described above, display device 560 may include a first non-folding region, a second non-folding region spaced apart from the first non-folding region, and a folded region between the first and second non-folding regions. The display device may include a flexible display panel, a metal plate configured to support the flexible display panel and having a first thickness in the first and second non-folding regions and a second thickness in the folded region due to recesses formed in the folded region, a resin portion disposed in the recesses, and a first adhesive layer disposed between the flexible display panel and the metal plate. The metal plate may be formed of metal to effectively dissipate (or dissipate) heat from the flexible display panel. Additionally, the folded region of the metal plate may be formed thinner than other portions, and an opening pattern may be formed in the folded region to improve bendability. In addition, the resin portion can be formed of a resin material that includes a carbon component with excellent thermal conductivity and a low modulus, so as to dissipate heat, improve the flatness of the outer surface, and reduce vibration noise generated by the folded display device in the folding area.

[0121] Exemplary implementations can be applied to display devices (e.g., organic light-emitting display devices) and electronic devices including such display devices. For example, exemplary implementations can be applied to smartphones, cellular phones, video phones, smart tablets, smartwatches, tablet PCs, car navigation systems, televisions, computer monitors, laptops, head-mounted display devices, etc.

[0122] According to an exemplary embodiment, the display device may include a first non-foldable region, a second non-foldable region spaced apart from the first non-foldable region, and a folded region between the first and second non-foldable regions. The display device may include a flexible display panel, a metal plate configured to support the flexible display panel and having a first thickness in the first and second non-foldable regions and a second thickness in the folded region due to recesses formed therein, a resin portion disposed in the recesses, and a first adhesive layer disposed between the flexible display panel and the metal plate. The metal plate may be formed of metal to effectively dissipate (or dissipate) heat from the flexible display panel. Additionally, the folded region of the metal plate may be formed thinner than other portions and may have an opening pattern to improve bendability. Furthermore, the resin portion may be formed of a resin material including a carbon component with excellent thermal conductivity and a low modulus to dissipate heat, improve flatness with respect to the outer surface, and reduce vibration noise caused by folding in the folded region.

[0123] Although certain exemplary embodiments and implementations have been described herein, other embodiments and variations will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but rather to the broader scope of the appended claims and the various obvious variations and equivalent arrangements that will be apparent to those skilled in the art.

Claims

1. A display device, comprising: The display device includes a first non-foldable region, a second non-foldable region spaced apart from the first non-foldable region, and a foldable region located between the first non-foldable region and the second non-foldable region. Flexible display panel; A metal plate supports the flexible display panel and includes a recess in the folded region. The metal plate has a first thickness in the first non-folded region and the second non-folded region and has a second thickness in the folded region that is less than the first thickness. The resin portion is disposed in the recess; and A first adhesive layer is disposed between the flexible display panel and the metal plate. The metal plate further includes multiple opening patterns in the folded area. The resin portion includes a base and a plurality of protrusions protruding from the base and disposed within the plurality of opening patterns; and the plurality of protrusions are disposed between the base and the flexible display panel. The air gap is formed in the opening pattern of the metal plate.

2. The display device according to claim 1, wherein, The metal plate includes stainless steel.

3. The display device according to claim 2, wherein, The first thickness of the metal plate is 100 µm or less.

4. The display device according to claim 1, wherein, The resin portion includes a carbon component.

5. The display device according to claim 4, wherein, The resin component includes graphite powder.

6. The display device according to claim 1, wherein, The resin portion has a lower modulus than the metal plate.

7. The display device according to claim 1, wherein, The air gap is defined by the upper surface of the protrusion of the resin portion and the lower surface of the first adhesive layer.

8. The display device according to claim 1, wherein, The first non-folded region and the second non-folded region are spaced apart in a first direction; and Each of the plurality of opening patterns in the metal plate extends in a second direction perpendicular to the first direction, and the plurality of opening patterns are arranged in a zigzag pattern in the first direction.

9. The display device according to claim 8, wherein, When viewed in a plan view, the opening pattern disposed at the edge of the metal plate in the second direction has one side connected to the edge of the metal plate and has an open shape.

10. The display device according to claim 1, wherein, The flexible display panel is configured to be located on the inside of the metal plate when the display device is in a folded state due to the bending of the folding area.

11. The display device according to claim 1, further comprising: A padding layer is disposed between the first adhesive layer and the flexible display panel, the padding layer comprising a foam material; as well as A second adhesive layer is disposed between the padding layer and the flexible display panel.

12. The display device according to claim 1, wherein, The flexible display panel includes: Flexible substrate; Thin-film transistors are disposed on the flexible substrate; The first electrode is electrically connected to the thin-film transistor; A light-emitting structure is disposed on the first electrode; and The second electrode is disposed on the light-emitting structure.

13. The display device according to claim 12, further comprising: A thin-film encapsulation layer is disposed on the second electrode; A third adhesive layer is disposed on the thin film encapsulation layer; as well as A window layer is disposed on the third adhesive layer.

14. A method of manufacturing a display device, the display device comprising a first non-foldable region, a second non-foldable region spaced apart from the first non-foldable region, and a foldable region located between the first non-foldable region and the second non-foldable region, the method comprising: A recess is formed on the metal plate in the folded region to have a first thickness in the first non-folded region and the second non-folded region, and a second thickness in the folded region that is less than the first thickness due to the recess; A resin portion is formed in the recess of the metal plate; The pad is attached to the side of the metal plate opposite to the base of the resin portion by using a first adhesive layer; as well as The display panel structure, including the flexible display panel, is attached to the padding layer. Wherein, forming a recess in the metal plate in the folded region includes: The recess is formed by removing a portion of the metal plate in the folded area through an etching process; and Multiple opening patterns are formed in the metal plate in the folded area by etching. The method further includes providing a resin solution into the recesses and the plurality of opening patterns of the metal plate to form a resin portion, the resin portion including the base and a plurality of protrusions protruding from the base and disposed within the plurality of opening patterns. The resin portion comprises: Before the resin solution is provided, a support portion having a plurality of protrusions corresponding to the plurality of opening patterns is provided below the metal plate; The resin portion comprising the base and the plurality of protrusions is formed by providing the resin solution; and Remove the support portion from the metal plate, and When the pad is attached to the metal plate using the first adhesive layer, an air gap is formed in the opening pattern, defined by the upper surface of the protrusion of the resin portion and the lower surface of the first adhesive layer.

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