Temperature-controlled delivery device and method

Abstract

The present application relates to a kind of temperature-controlled conveying device and method, temperature-controlled conveying device includes: temperature control mechanism, pick-and-place mechanism and heat transfer member.The above-mentioned temperature-controlled conveying device when using, in the process of processing wafer, since the environment where wafer is located needs temperature control, therefore, the temperature inside wafer processing equipment is guaranteed by temperature control device.Then, when wafer needs to be transferred after being processed in wafer processing equipment, wafer in wafer processing equipment is transferred by pick-and-place mechanism, simultaneously since heat transfer member can transfer the heat of temperature control mechanism, therefore, pick-and-place mechanism will be temperature-controlled (heating or cooling) under the action of heat transfer member, so as to ensure that wafer does not appear temperature difference change when being transferred on pick-and-place mechanism, i.e.wafer is transferred to another wafer processing equipment, temperature control mechanism does not need to heat wafer again, so as to reduce the processing time of wafer processing equipment to wafer, improve capacity.

Description

Technical Field

[0001] This invention relates to the technical field of wafer processing, and in particular to a temperature-controlled conveying device and method. Background Technology

[0002] Currently, wafers need to be kept at a certain temperature during processing within wafer processing equipment. However, when wafers are transferred between wafer processing units, heat is lost during the transfer process due to the gap between adjacent units. This necessitates a temperature control device to reheat the wafers upon entering the next processing unit, thus extending processing time and reducing throughput. Summary of the Invention

[0003] Therefore, it is necessary to provide a temperature-controlled conveying device and method that can reduce wafer processing time and increase production capacity.

[0004] The technical solution is as follows:

[0005] A temperature-controlled conveying device includes: a temperature control mechanism, a pick-and-place mechanism, and a heat transfer element. The temperature control mechanism is used to control the temperature of a wafer in a wafer processing equipment. The pick-and-place mechanism is used to transfer the wafer. The temperature control mechanism is connected to the heat transfer element, and the heat inside the temperature control mechanism can be transferred through the heat transfer element. The heat transfer element is mounted on the pick-and-place mechanism.

[0006] When the aforementioned temperature-controlled conveying device is in use, the temperature of the environment in which the wafer is located needs to be controlled during wafer processing. Therefore, the temperature control device maintains the internal temperature of the wafer processing equipment (referring to the equipment or process in which the wafer is processed). Then, when the wafer needs to be transferred after processing inside the wafer processing equipment, the pick-and-place mechanism transfers the wafer from inside the wafer processing equipment. Simultaneously, because the heat transfer element can transfer heat from the temperature control mechanism, the pick-and-place mechanism controls the temperature (heating or cooling) under the action of the heat transfer element, thereby ensuring that there is no temperature difference change when the wafer is transferred on the pick-and-place mechanism. This improves the temperature stability of the wafer itself and reduces the overlay error of the wafer in temperature-sensitive processes. In other words, after the wafer is transferred to another wafer processing equipment, the temperature control mechanism does not need to reheat the wafer, thereby reducing wafer processing time and increasing throughput.

[0007] A temperature-controlled conveying method, employing the temperature-controlled conveying device described above, includes the following steps:

[0008] The temperature control mechanism is used to control the temperature of the wafers in the wafer processing equipment.

[0009] Heat is transferred out of the temperature control mechanism through heat transfer components, and temperature control on the pick-up and put-down mechanism is achieved through heat transfer components.

[0010] Once the temperature on the pick-and-place mechanism reaches the preset temperature, the wafer is transferred.

[0011] In use, the temperature-controlled conveying method described above first adjusts the internal temperature of the wafer processing equipment to a preset temperature based on the processing conditions using a temperature control mechanism, thus achieving temperature control of the wafer. Then, because the same temperature control mechanism is used, the heat inside the mechanism is directly dissipated through a heat transfer element, allowing the pick-and-place mechanism to reach the preset temperature under the action of the heat transfer element. Finally, the temperature-controlled pick-and-place mechanism transfers the wafer. This temperature-controlled conveying method ensures that no temperature difference occurs during the transfer of the wafer on the pick-and-place mechanism. That is, after the wafer is transferred to another wafer processing device (or exposure machine), the temperature control mechanism does not need to reheat the wafer, thereby reducing the processing time of the wafer processing equipment and increasing throughput.

[0012] The technical solution will be further explained below:

[0013] The pick-and-place mechanism is located at the opening of the wafer processing equipment. The pick-and-place mechanism includes a pick-and-place component and a drive arm. The pick-and-place component is connected to the drive arm. The pick-and-place component is used to extend into the wafer processing equipment to pick up and place wafers. The heat transfer component is in contact with the pick-and-place component.

[0014] The material handling component includes a mounting base, a first material handling arm, and a second material handling arm. The first material handling arm and the second material handling arm are spaced apart on the mounting base, and one end of the first material handling arm and one end of the second material handling arm both protrude from the mounting base. The mounting base is mounted and engaged with the drive arm.

[0015] The temperature-controlled conveying device also includes a first vacuum suction cup and a second vacuum suction cup. The first vacuum suction cup is mounted on the first picking arm, and the second vacuum suction cup is mounted on the second picking arm.

[0016] The heat transfer component includes a manifold, a first heat transfer tube, and a second heat transfer tube. The first heat transfer tube is attached to the first material receiving arm, and the second heat transfer tube is attached to the second material receiving arm. Both the first heat transfer tube and the second heat transfer tube are connected to one end of the manifold, and the other end of the manifold is connected to the temperature control mechanism.

[0017] The temperature-controlled conveying device also includes a plurality of bumps, which are mounted on the first picking arm and / or the second picking arm. One end of each bump protrudes from the gap between the first picking arm and the second picking arm. The bumps are used to provide auxiliary support for the wafer, and the support surface of the bumps is in the same plane as the support surfaces of the first picking arm and the second picking arm.

[0018] The temperature-controlled conveying device also includes a mounting base and an adjusting slide rail. The adjusting slide rail is mounted on the mounting base, and the picking and placing mechanism is slidably mounted on the adjusting slide rail.

[0019] The temperature-controlled conveying device also includes an exposure machine and a temperature stabilization mechanism. The exposure machine is used to expose the wafer, and the temperature stabilization mechanism is used to control the temperature of the wafer. The pick-and-place mechanism moves between the wafer processing equipment and the exposure machine. The temperature stabilization mechanism is connected to the temperature control mechanism and is located between the exposure machine and the wafer processing equipment.

[0020] The temperature control mechanism is a thermistor or a cooling water tank for the exposure lens. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a temperature-controlled conveying device according to an embodiment of the present invention;

[0022] Figure 2 This is a partial structural schematic diagram of the temperature-controlled conveying device according to an embodiment of the present invention;

[0023] Figure 3 This is a partial structural schematic diagram of the temperature-controlled conveying device according to another embodiment of the present invention;

[0024] Figure 4 This is a flowchart of a temperature-controlled conveying method according to an embodiment of the present invention.

[0025] Explanation of reference numerals in the attached figures:

[0026] 100 Temperature control mechanism; 200 Picking and placing mechanism; 210 Picking component; 211 Mounting substrate; 212 First picking arm; 213 Second picking arm; 214 Bump; 220 Drive arm; 230 First vacuum suction cup; 240 Second vacuum suction cup; 250 Bending transition plate; 251 First straight plate; 252 Second straight plate; 300 Heat transfer component; 310 Manifold; 320 First heat transfer pipe; 330 Second heat transfer pipe; 400 Wafer; 500 Mounting base; 510 Adjusting slide rail; 600 Temperature stabilization mechanism. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the scope of protection of this invention.

[0028] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0030] In this invention, "first" and "second" do not represent a specific quantity or order, but are merely used to distinguish names.

[0031] like Figures 1 to 3 As shown, in one embodiment, a temperature-controlled conveying device includes: a temperature control mechanism 100, a pick-and-place mechanism 200, and a heat transfer element 300. The temperature control mechanism 100 is used to control the temperature of a wafer 400 in a wafer processing device, the pick-and-place mechanism 200 is used to transfer the wafer 400, the temperature control mechanism 100 is connected to the heat transfer element 300, and the heat inside the temperature control mechanism 100 can be transferred through the heat transfer element 300, the heat transfer element 300 being mounted on the pick-and-place mechanism 200.

[0032] When the aforementioned temperature-controlled conveying device is in use, during the processing of wafer 400, the temperature of the environment in which wafer 400 is located needs to be controlled. Therefore, the temperature control device ensures the internal temperature of the wafer processing equipment (referring to the equipment or process in which wafer 400 is processed). Then, when wafer 400 needs to be transferred after processing inside the wafer processing equipment, the pick-and-place mechanism 200 transfers wafer 400 from inside the wafer processing equipment. At the same time, since the heat transfer element 300 can transfer heat from the temperature control mechanism 100, the pick-and-place mechanism 200 will control the temperature (heating up or cooling down) under the action of the heat transfer element 300. This ensures that there is no temperature difference change when wafer 400 is transferred on the pick-and-place mechanism 200, improves the temperature stability of wafer 400 itself, and reduces the overlay error of wafer 400 in temperature-sensitive processes. That is, after wafer 400 is transferred to another wafer processing equipment, the temperature control mechanism 100 does not need to reheat wafer 400, thereby reducing the processing time of wafer 400 by the wafer processing equipment and increasing production capacity.

[0033] Specifically, during the photolithography process on wafer 400, temperature variations can affect the wafer 400 manufacturing process, necessitating temperature control within the wafer processing equipment. However, the photolithography process on wafer 400 often requires processing through two or more wafer processing units. Therefore, during its movement, wafer 400 frequently passes through an area exposed to the external environment. This means that wafer 400 is prone to temperature changes during this process, resulting in a prolonged temperature control time for the wafer 400 when it enters the next wafer processing unit due to temperature fluctuations (often a decrease).

[0034] Furthermore, the wafer processing equipment used for lithography of wafer 400 is all temperature-controlled internally by a single temperature control mechanism 100. This eliminates the need for multiple temperature control mechanisms 100 corresponding to each wafer processing unit, effectively saving processing space required for wafer 400 lithography. This embodiment takes into account that temperature control mechanisms 100 are used for temperature control during wafer 400 lithography. Therefore, by adding a heat transfer element 300 to the existing temperature control mechanism 100, the pick-and-place mechanism 200 achieves its own temperature regulation under the action of the heat transfer element 300. In other words, this embodiment ensures that the temperature control mechanism 100 (referring to the existing temperature control mechanism 100 in the wafer 400 lithography process) can effectively control the temperature of each wafer processing unit, while also achieving temperature regulation of the pick-and-place mechanism 200. This allows for comprehensive temperature control of the wafer 400 during lithography, preventing temperature differences during wafer 400 transfer.

[0035] In one embodiment, considering the stringent requirements for environmental cleanliness and processing precision during the photolithography process of wafer 400, automated equipment is necessary, requiring multiple devices or wafer processing equipment to work together. If each transfer of wafer 400 introduces an error, then a temperature control mechanism 100 needs to adjust the temperature of wafer 400 after each transfer. That is, before wafer 400 enters the corresponding wafer processing equipment for processing, the temperature control mechanism 100 needs to regulate the temperature of wafer 400 until its surface temperature reaches the preset processing temperature before proceeding with the corresponding processing operation. Therefore, using the aforementioned temperature-controlled conveying device to control the temperature of wafer 400 during transfer can effectively reduce the time required for temperature adjustment of wafer 400 before processing by the wafer processing equipment, or allow processing to proceed directly after wafer 400 transfer without further temperature adjustment, significantly saving photolithography time and increasing production capacity.

[0036] like Figure 1 As shown, in one embodiment, the pick-and-place mechanism 200 is located at the opening of the wafer processing equipment. The pick-and-place mechanism 200 includes a pick-and-place component 210 and a drive arm 220. The pick-and-place component 210 is connected to the drive arm 220 and is used to extend into the wafer processing equipment to pick up and place the wafer 400. The heat transfer component 300 is in contact with the pick-and-place component 210. Specifically, the wafer 400 needs to go through multiple different processes during photolithography, that is, it needs to be transferred to different wafer processing equipment for processing. At the same time, when the wafer 400 is processed inside the wafer processing equipment, it often has an opening on one side. External contaminant particles or impurities can easily enter the wafer processing equipment through this opening, thereby affecting the quality of the wafer 400. Therefore, a cover plate or cover curtain can be added to the opening of the wafer processing equipment. At this time, a sealed space is formed inside the wafer processing equipment (the sealed space can effectively prevent external contaminant particles or impurities from entering the wafer processing equipment). That is, after the wafer 400 is processed inside the wafer processing equipment, the cover plate or cover curtain needs to be removed first, and then the pick-and-place mechanism 200 is inserted into the wafer processing equipment to pick up and place the wafer 400.

[0037] Furthermore, a lifting motor or lifting cylinder is installed at the opening of the wafer processing equipment. When the opening of the wafer processing equipment is covered by a cover plate, there can be multiple cover plates, i.e., multiple cover plates are stacked on top of each other until the cover plate can cover the opening. At the same time, a guide post is also added at the opening, and multiple cover plates are fitted onto the guide post.

[0038] Furthermore, based on the protruding portion at the end of the cover plate after it is fitted onto the guide post, the position of the lifting motor or lifting cylinder at the opening of the wafer processing equipment is determined (i.e., the output end of the lifting motor or lifting cylinder can abut against the bottom cover plate). For example, when the pick-and-place mechanism 200 needs to enter the wafer processing equipment, the cover plate is lifted by the lifting motor or lifting cylinder, thereby releasing the cover plate from covering the opening of the wafer processing equipment. Then, after the pick-and-place mechanism 200 completes the pick-and-place of the wafer 400 inside the wafer processing equipment, the lifting motor or lifting cylinder is adjusted again to reset the cover plate until it covers the opening.

[0039] A roller and motor are installed at the opening of the wafer processing equipment. When the opening is covered by a cover curtain, one side of the cover curtain is connected to the roller, and the other side faces downwards from the opening. The motor drives the roller to rotate, and the cover curtain is rolled up on the roller. That is, when the pick-and-place mechanism 200 needs to enter the wafer processing equipment to pick up or place the wafer 400, the roller rotates clockwise (or counterclockwise) to roll up the cover curtain, thus releasing the cover curtain from the opening of the wafer processing equipment. After the pick-and-place mechanism 200 completes the pick-and-place of the wafer 400 and leaves the wafer processing equipment, the roller rotates counterclockwise (or clockwise) to lower the cover curtain until it completely covers the opening of the wafer processing equipment. This implementation method ensures the processing quality of the wafer 400 and improves the automation level of the wafer 400 processing process.

[0040] In one embodiment, specifically, multiple wafers 400 are often spaced apart along the height of the wafer processing equipment during processing inside the equipment. Therefore, the pick-and-place mechanism 200 sometimes only picks and places specific wafers 400 when it extends into the wafer processing equipment. In this embodiment, considering that the heat transfer element 300 needs to transfer heat to the pick-up element 210, the pick-up element 210 can be made of a material with thermal conductivity (e.g., plastic or metal). Further, the heat transfer element 300 is a heat transfer tube or heat transfer plate, one side of the pick-up element 210 is used to hold the wafer 400, and the heat transfer element 300 is mounted on the side of the pick-up element 210 facing away from the wafer 400. A mounting groove corresponding to the heat transfer element 300 is formed on the pick-up element 210 (the side facing away from the wafer 400), that is, the heat transfer element 300 is mounted in the mounting groove. This embodiment avoids the heat transfer element 300 from contacting other wafers 400 when it enters the wafer processing equipment with the pick-up element 210 to pick up and place wafers 400. Furthermore, the mounting slot can fix the heat transfer element 300, thereby facilitating its installation.

[0041] like Figure 1 and Figure 2 As shown, in one embodiment, the picking component 210 is a rigid flat plate or a rigid flat sheet. The temperature-controlled conveying device also includes a bending transition plate 250, which includes a first straight plate 251 and a second straight plate 252. The second control plate is connected to the drive arm 220. The second straight plate 252 is inclinedly disposed on the first straight plate 251, and the other end of the second straight plate 252 is connected to the picking component 210. At this time, the planes of the first straight plate 251 and the picking component 210 are parallel to each other. This embodiment takes into account that in actual operation, for example, when it is necessary to pick up and place the wafer 400 located at the bottom of the wafer processing equipment, due to the thickness of the drive arm 220 itself or the influence of its components, it is impossible to reach the corresponding position inside the wafer processing equipment by simply manipulating the drive arm 220. Therefore, the above embodiment achieves compensation for the extreme position of the drive arm 220 by tilting the second straight plate 252. In addition, the first straight plate 251 is parallel to the plane where the picking member 210 is located, making the force on the entire picking and placing mechanism 200 more uniform.

[0042] like Figure 2 and Figure 3 As shown, in one embodiment, the picking component 210 includes a mounting substrate 211, a first picking arm 212, and a second picking arm 213. The first picking arm 212 and the second picking arm 213 are spaced apart on the mounting substrate 211, with one end of the first picking arm 212 and one end of the second picking arm 213 protruding from the mounting substrate 211. The mounting substrate 211 is mounted and engaged with the drive arm 220. Specifically, the spacing between the first picking arm 212 and the second picking arm 213 is determined according to the diameter of the wafer 400, ensuring that the wafer 400 can be stably placed on the first picking arm 212 and the second picking arm 213 during wafer picking and placement. The mounting substrate 211 is used to connect the first picking arm 212 and the second picking arm 213 to the drive arm 220. Furthermore, to prevent temperature variations during wafer 400 transfer, a wafer mount is currently added, with a temperature controller installed inside. This temperature controller regulates the temperature of the entire wafer mount, allowing for temperature control even after the wafer 400 is placed on it. However, this method adds an extra temperature controller, increasing the wafer 400 processing cost. Also, since the temperature controller is inside the wafer mount, adjusting its settings requires disassembling the wafer mount, which is inconvenient. Additionally, after the wafer 400 is placed on the wafer mount, only one side of the mount is in contact with it, but the temperature controller controls the entire wafer mount. Therefore, this method increases both the energy consumption of the temperature controller and the preheating time of the wafer mount.

[0043] Compared to the above embodiments, the temperature-controlled conveying device utilizes the temperature control mechanism 100 already installed during the photolithography process of the wafer 400, that is, the heat inside the temperature control mechanism 100 is dissipated through the heat transfer element 300. Furthermore, the pick-and-place mechanism 200 supports the wafer 400 through the first pick-and-place arm 212 and the second pick-and-place arm 213. Moreover, in this embodiment, the heat transfer element 300 and the pick-and-place mechanism 200 are in close contact, meaning the heat transfer element 300 directly transfers heat to the pick-and-place mechanism 200, thereby achieving targeted temperature control of the pick-and-place mechanism 200.

[0044] In one embodiment, there is a gap between the first picking arm 212 and the second picking arm 213. This arrangement can increase the carrying area of ​​the picking component 210 on the wafer 400 on the one hand, and save the material used by the picking component 210 on the other hand.

[0045] like Figure 2 As shown, in one embodiment, when the wafer 400 is picked up and placed by the first picking arm 212 and the second picking arm 213, both the first vacuum chuck 230 and the second vacuum chuck 240 can adsorb the wafer 400 to prevent the wafer 400 from moving or accidentally falling during the transfer process. At the same time, the adsorption and fixation method can also prevent accidental scratches to the wafer 400.

[0046] In one embodiment, to ensure the wafer 400 is horizontally positioned after being placed on the first pick-up arm 212 and the second pick-up arm 213, a first groove can be formed on the first pick-up arm 212, and a second groove can be formed on the second pick-up arm 213. The first vacuum chuck 230 is placed in the first groove, and the second vacuum chuck 240 is placed in the second groove, with the concave suction surfaces of both the first and second vacuum chucks facing the wafer 400. This embodiment effectively avoids the influence of the thickness of the first and second vacuum chucks 230 on the horizontal placement of the wafer 400. Furthermore, both the first and second vacuum chucks 230 and the second vacuum chuck 240 are provided with multiple support rods inside, which provide support for the concave suction surfaces of the first and second vacuum chucks 230 and the second vacuum chuck 240. This avoids the first vacuum chuck 230 and the second vacuum chuck 240 from shrinking excessively after the air pressure is adjusted (the resulting suction force is too large and can easily damage the surface of the wafer 400).

[0047] like Figure 3As shown, in one embodiment, the heat transfer element 300 includes a manifold 310, a first heat transfer pipe 320, and a second heat transfer pipe 330. The first heat transfer pipe 320 is attached to the first picking arm 212, and the second heat transfer pipe 330 is attached to the second picking arm 213. Both the first heat transfer pipe 320 and the second heat transfer pipe 330 are connected to one end of the manifold 310, and the other end of the manifold 310 is connected to the temperature control mechanism 100. Specifically, the first heat transfer pipe 320 is attached to the first picking arm 212, and the second heat transfer pipe 330 is attached to the second picking arm 213. This allows the heat transfer element 300 to simultaneously control the temperature of both picking arms (the first picking arm 212 and the second picking arm 213), greatly improving the temperature control efficiency of the picking element 210. More specifically, an insulation sleeve is fitted over the outside of the manifold 310 to ensure that excessive heat loss occurs when the heat is transferred to the first heat transfer pipe 320 and the second heat transfer pipe 330.

[0048] like Figure 2 and Figure 3 As shown, in one embodiment, the temperature-controlled conveying device further includes a plurality of bumps 214. The plurality of bumps 214 are mounted on the first pick-up arm 212 and / or the second pick-up arm 213, with one end of each bump protruding within the gap between the first pick-up arm 212 and the second pick-up arm 213. The bumps 214 provide auxiliary support for the wafer 400, and the support surfaces of the bumps 214, the first pick-up arm 212, and the second pick-up arm 213 are all in the same plane. Specifically, the plurality of bumps 214 receive heat transferred from the first pick-up arm 212 and the second pick-up arm 213, meaning that the plurality of bumps 214 can control the temperature of the wafer 400 portion located in the gap area, and also ensure that the wafer 400 is heated evenly when placed on the pick-up and drop-off mechanism 200. More specifically, the bump 214 is in the same plane as the first pick-up arm 212 and the second pick-up arm 213, ensuring that the wafer 400 can be stably placed on the pick-up member 210.

[0049] like Figure 1 As shown, in one embodiment, the temperature-controlled conveying device further includes a mounting base 500 and an adjusting slide rail 510. The adjusting slide rail 510 is mounted on the mounting base 500, and the pick-and-place mechanism 200 is slidably mounted on the adjusting slide rail 510. Specifically, depending on the actual processing environment, the pick-and-place mechanism 200 can be positioned on the mounting base 500 to achieve the optimal pick-and-place position. Simultaneously, graduation lines can be added to the slide rail to ensure greater precision during movement of the pick-and-place mechanism.

[0050] In one embodiment, the temperature-controlled conveying device further includes an exposure machine and a temperature stabilizing mechanism 600. The exposure machine is used to expose the wafer 400, and the temperature stabilizing mechanism 600 is used to control the temperature of the wafer 400. The pick-and-place mechanism 200 moves between the wafer processing equipment and the exposure machine. The temperature stabilizing mechanism 600 is connected to the temperature control mechanism 100 and is located between the exposure machine and the wafer processing equipment.

[0051] Specifically, there is one or more pick-and-place mechanisms 200. For example, when there is only one pick-and-place mechanism 200: After the wafer 400 is processed in the wafer processing equipment, the pick-and-place mechanism 200 removes the wafer 400 from the wafer processing equipment. During the movement of the wafer 400 along with the pick-and-place mechanism 200, the heat transferred by the heat transfer element 300 ensures the temperature stability of the wafer 400 during the transport process. At the same time, the pick-and-place mechanism 200 first transfers the wafer 400 to the temperature stabilization unit 600 (TSU) for temperature correction control. The temperature stabilization unit 600 can further improve the coverage error of the wafer 400 for temperature-sensitive processes. In this embodiment, the processing time of the wafer 400 on the temperature stabilization unit 600 is 8 seconds. After the wafer 400 has undergone temperature calibration on the temperature stabilization mechanism 600, the pick-and-place mechanism 200 removes the wafer 400 from the temperature stabilization mechanism 600 again, and continues to control the temperature of the wafer 400 through the heat transfer element 300 until the pick-and-place mechanism 200 transfers the wafer 400 onto the exposure machine. This entire process achieves comprehensive and effective temperature control of the wafer 400, thereby improving the temperature stability of the wafer 400 and reducing coverage errors in temperature-sensitive processes.

[0052] For example, when there are two pick-and-place mechanisms 200 (for ease of distinction, the two pick-and-place mechanisms 200 are divided into a first pick-and-place mechanism and a second pick-and-place mechanism), firstly, the processed wafer 400 is taken out from the wafer processing equipment by the first pick-and-place mechanism. Then, the wafer 400 is transferred to the temperature stabilization unit 600 (TSU) for temperature calibration. After the temperature stabilization unit 600 completes the temperature calibration of the wafer 400, the second pick-and-place mechanism transfers the wafer 400 again, and finally transfers it to the exposure stage exposure machine. (In the above process, both the first and second pick-and-place mechanisms receive heat through heat transfer components, thus achieving temperature control of the wafer.)

[0053] Furthermore, the temperature control mechanism 100 is a thermistor or a lens cooling water cabinet (LCWC). In this embodiment, the temperature control mechanism 100 is a lens cooling water cabinet, which generates a temperature-controlled liquid (liquid at a specific temperature). This liquid is then transported to the wafer processing equipment, the temperature stabilization unit 600 (TSU), and, via the heat transfer element 300, to the loading / unloading mechanism 200, etc. This arrangement allows for temperature control of all equipment used in wafer 400 processing, while ensuring that the wafer 400 operates within a uniform temperature environment during processing, eliminating the need for operators to adjust the temperature control coefficients between different devices. Figure 4 As shown, in one embodiment, a temperature-controlled conveying method, employing the temperature-controlled conveying device described in any of the above embodiments, includes the following steps:

[0054] S100, the temperature control mechanism 100 is used to control the temperature of the wafer 400 taken out from the wafer processing equipment;

[0055] S200: Heat is transferred out of the temperature control mechanism 100 through the heat transfer element 300, and temperature control on the pick-up and put-down mechanism 200 is achieved through the heat transfer element 300.

[0056] S300: After the temperature on the pick-and-place mechanism 200 reaches the preset temperature, the wafer 400 is transferred.

[0057] In use, the temperature-controlled conveying method described above first adjusts the internal temperature of the wafer processing equipment to a preset temperature using the temperature control mechanism 100, based on the processing conditions, thus achieving temperature control of the wafer 400. Then, because the same temperature control mechanism 100 is used for temperature control, the heat inside the temperature control mechanism 100 is directly discharged through the heat transfer element 300. This allows the pick-and-place mechanism 200 to reach the preset temperature under the action of the heat transfer element 300. Finally, the temperature-controlled pick-and-place mechanism 200 transfers the wafer 400. This temperature-controlled conveying method ensures that no temperature difference occurs when the wafer 400 is transferred on the pick-and-place mechanism 200. That is, after the wafer 400 is transferred to another wafer processing device, the temperature control mechanism 100 does not need to reheat the wafer 400, thereby reducing the processing time of the wafer 400 and increasing throughput.

[0058] Furthermore, considering that the pick-and-place mechanism 200 performs the wafer pick-and-place operation first, and then the heat transfer element 300 controls the temperature of the pick-and-place mechanism 200, a temperature difference may occur between the surface temperature of the pick-and-place mechanism 200 and the surface temperature of the wafer 400, thus affecting the temperature control effect of the pick-and-place mechanism 200 on the wafer 400. Therefore, the pick-and-place mechanism 200 must reach a preset temperature before picking up or placing the wafer 400. Since the heat transfer element 300 needs to transfer heat to the pick-and-place mechanism 200 for a certain period of time before the pick-and-place mechanism 200 can reach the preset temperature, the pick-and-place mechanism 200 performs a certain period of preheating preparation before picking up or placing the wafer 400.

[0059] In one embodiment, during the transfer of wafer 400 via the pick-and-place mechanism 200, the overlay error of the wafer 400 process is also detected (the smaller the overlay error during the photolithography process of wafer 400, the higher the quality of the finished product). That is, for wafer 400, which is sensitive to temperature differences, the magnitude of the overlay error can be detected to determine whether the temperature control of wafer 400 meets preset requirements. For example, if the pick-and-place mechanism 200 does not perform temperature control when wafer 400 is transferred, temperature changes will occur on wafer 400, resulting in a larger error when detecting the overlay error.

[0060] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0061] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A temperature-controlled conveying device, characterized in that, include: The equipment includes a temperature control mechanism, a pick-and-place mechanism, and a heat transfer component. The temperature control mechanism is used to control the temperature of the wafer in the wafer processing equipment. The pick-and-place mechanism is used to transfer the wafer. The temperature control mechanism is connected to the heat transfer component, and the heat inside the temperature control mechanism can be transferred through the heat transfer component. The heat transfer component is mounted on the pick-and-place mechanism. The pick-and-place mechanism is located at the opening of the wafer processing equipment. The pick-and-place mechanism includes a pick-and-place component and a drive arm. The pick-and-place component is connected to the drive arm. The pick-and-place component is used to extend into the wafer processing equipment to pick up and place wafers. The heat transfer component is in contact with the pick-and-place component. The material handling component includes a mounting base plate, a first material handling arm, and a second material handling arm. The first material handling arm and the second material handling arm are spaced apart on the mounting base plate, and one end of the first material handling arm and one end of the second material handling arm both protrude from the mounting base plate. The mounting base plate is mounted and engaged with the drive arm. The heat transfer component includes a manifold, a first heat transfer tube, and a second heat transfer tube. The first heat transfer tube is attached to the first material receiving arm, and the second heat transfer tube is attached to the second material receiving arm. Both the first heat transfer tube and the second heat transfer tube are connected to one end of the manifold, and the other end of the manifold is connected to the temperature control mechanism. It also includes a plurality of bumps, which are mounted on the first pick-up arm and / or the second pick-up arm. One end of each bump protrudes from the gap between the first pick-up arm and the second pick-up arm. The bumps are used to provide auxiliary support for the wafer, and the support surface of the bumps is in the same plane as the support surfaces of the first pick-up arm and the second pick-up arm.

2. The temperature-controlled conveying device according to claim 1, characterized in that, It also includes a first vacuum suction cup and a second vacuum suction cup, the first vacuum suction cup being mounted on the first picking arm and the second vacuum suction cup being mounted on the second picking arm.

3. The temperature-controlled conveying device according to claim 1 or 2, characterized in that, It also includes a mounting base and an adjusting slide rail, wherein the adjusting slide rail is mounted on the mounting base and the picking and placing mechanism is slidably mounted on the adjusting slide rail.

4. The temperature-controlled conveying device according to claim 3, characterized in that, It also includes an exposure machine and a temperature stabilization mechanism. The exposure machine is used to expose the wafer, and the temperature stabilization mechanism is used to control the temperature of the wafer. The pick-and-place mechanism moves between the wafer processing equipment and the exposure machine. The temperature stabilization mechanism is connected to the temperature control mechanism and is located between the exposure machine and the wafer processing equipment.

5. The temperature-controlled conveying device according to claim 4, characterized in that, The temperature control mechanism is a thermistor or a cooling water tank for the exposure lens.

6. A temperature-controlled conveying method, employing the temperature-controlled conveying device as described in any one of claims 1 to 5, characterized in that, Includes the following steps: A temperature control mechanism is used to control the temperature of the wafers taken out of the wafer processing equipment; Heat is transferred out of the temperature control mechanism through heat transfer components, and temperature control on the pick-up and put-down mechanism is achieved through heat transfer components. Once the temperature on the pick-and-place mechanism reaches the preset temperature, the wafer is transferred.

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