Display device

Abstract

A display device is provided. The display device includes a display panel including a light emitting device for emitting light, and an input sensor disposed on the display panel. The input sensor includes a first insulating layer disposed on the display panel, a first conductive layer disposed on the first insulating layer, a second insulating layer covering the first conductive layer, and a second conductive layer disposed on the second insulating layer. At least one of the first insulating layer and the second insulating layer includes a plurality of diffraction patterns arranged to diffract at least a portion of light provided from the display panel.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2019-0131827, filed on October 23, 2019, with the Korean Intellectual Property Office, and Korean Patent Application No. 10-2020-0034290, filed on March 20, 2020, with the Korean Intellectual Property Office, each of which is incorporated herein by reference for all purposes, as fully set forth herein. Technical Field

[0002] Exemplary embodiments of the invention generally relate to display devices, and more specifically, to display devices with improved viewing angles. Background Technology

[0003] Electronic devices such as smartphones, tablets, laptops, and smart TVs are under development. These devices include display devices to provide information to users. With advancements in multimedia technology, the demand for display devices suitable for multimedia environments is constantly increasing. To meet this demand, various types of display devices have been developed, such as liquid crystal displays (LCDs) and organic light-emitting diode (OLED) displays.

[0004] Organic light-emitting diode (OLED) devices include organic light-emitting diodes configured to emit light. However, compared to the forward side, the light-emitting characteristics of organic light-emitting diodes are worse in the lateral direction, which results in a reduced lateral viewing angle of the organic light-emitting display device compared to the forward viewing angle.

[0005] The information disclosed in this background section is only for understanding the background of the inventive concept, and therefore may contain information that does not constitute prior art. Summary of the Invention

[0006] The applicant found that the reduction in the lateral viewing angle of an organic light-emitting display device compared to the forward viewing angle can be improved by diffracting light in the organic light-emitting display device.

[0007] The display device constructed according to the principles of the invention and exemplary embodiments has an improved lateral viewing angle, which can be achieved by setting a diffraction pattern in the input sensor of the display device.

[0008] In a display device constructed according to the principles of the invention and some exemplary embodiments, light emitted from an organic light-emitting diode can be diffracted by a diffraction pattern to improve color aberration problems that may occur when the viewing angle increases. Therefore, the overall viewing angle characteristics of the display device can be improved.

[0009] Additional features of the inventive concept will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practice of the inventive concept.

[0010] According to one aspect of the invention, a display device includes: a display panel including a light-emitting device for emitting light; and an input sensor disposed on the display panel, wherein the input sensor includes: a first insulating layer disposed on the display panel; a first conductive layer disposed on the first insulating layer; a second insulating layer covering the first conductive layer; and a second conductive layer disposed on the second insulating layer, wherein at least one of the first insulating layer and the second insulating layer includes a plurality of diffraction patterns arranged to diffract at least a portion of light provided from the display panel.

[0011] Multiple diffraction patterns can be set in the second insulating layer.

[0012] Multiple diffraction patterns can be set in the first insulating layer.

[0013] The multiple diffraction patterns may include: multiple first diffraction patterns disposed in a first insulating layer; and multiple second diffraction patterns disposed in a second insulating layer.

[0014] The first insulating layer may have a multilayer structure comprising at least two stacked sub-insulating layers.

[0015] The plurality of first diffraction patterns may include: a plurality of first sub-diffraction patterns disposed in the first sub-insulating layer of the first insulating layer; and a plurality of second sub-diffraction patterns disposed in the second sub-insulating layer of the first insulating layer and superimposed with the plurality of first sub-diffraction patterns, wherein the plurality of second diffraction patterns may be disposed in the second insulating layer superimposed with the plurality of second sub-diffraction patterns.

[0016] The display panel may also include an encapsulation layer covering the light-emitting devices, and a first insulating layer is disposed directly on the encapsulation layer.

[0017] The encapsulation layer may include: a first encapsulation layer covering multiple pixels; a second encapsulation layer disposed on the first encapsulation layer; and a third encapsulation layer disposed on the second encapsulation layer, wherein the first insulating layer may be disposed on the third encapsulation layer.

[0018] The first insulating layer may have a multilayer structure comprising at least two stacked sub-insulating layers, and the plurality of diffraction patterns may include: a plurality of first diffraction patterns disposed in the at least two stacked sub-insulating layers; and a plurality of second diffraction patterns disposed in the second insulating layer.

[0019] The multiple diffraction patterns may also include multiple third diffraction patterns disposed in the third encapsulation layer, superimposed on the multiple first diffraction patterns.

[0020] Multiple diffraction patterns may include multiple holes penetrating at least one of the first insulating layer and the second insulating layer.

[0021] Multiple holes can have one of the following shapes: approximately circular, approximately polygonal, approximately elliptical, and approximately elongated.

[0022] Multiple diffraction patterns can be columnar structures disposed in at least one of the first insulating layer and the second insulating layer.

[0023] Columnar structures can have one of the following shapes: roughly circular, roughly polygonal, roughly elliptical, or roughly elongated.

[0024] The input sensor may include an input sensing unit having a protective layer disposed on a second insulating layer, and each of the first and second insulating layers has a refractive index different from that of the protective layer.

[0025] The display panel may include multiple pixels, and each of the multiple pixels may include: an emitting region for emitting light, wherein a light-emitting device is disposed in the emitting region; and a non-emitting region adjacent to the emitting region.

[0026] Multiple diffraction patterns can be superimposed on the emission region.

[0027] Multiple diffraction patterns can be superimposed on non-emission regions.

[0028] The display panel may include a plurality of pixels, including a first pixel for emitting red light, a second pixel for emitting green light, and a third pixel for emitting blue light, and a plurality of diffraction patterns are superimposed on at least one of the first to third pixels.

[0029] Multiple diffraction patterns can be superimposed on the first pixel.

[0030] Multiple diffraction patterns can be superimposed on the first and third pixels.

[0031] According to another aspect of the invention, the display device includes: a display panel including a plurality of pixels for displaying an image, each of the plurality of pixels including a light-emitting device for emitting light; and an input sensor disposed on the display panel, wherein the input sensor includes: a sensing electrode; and an insulating layer disposed on or below the sensing electrode, the insulating layer including a plurality of diffraction patterns arranged to diffract at least a portion of light provided from the display panel, the plurality of diffraction patterns being superimposed on at least one of the plurality of pixels.

[0032] The sensing electrodes may include a first sensing electrode and a second sensing electrode that cross each other, and each of the first sensing electrode and the second sensing electrode includes a sensing portion and a connecting portion that connects adjacent sensing portions in the sensing portion.

[0033] The insulating layer may include: a first insulating layer, on which the connection portion of the first sensing electrode is disposed; and a second insulating layer, on which the sensing portion of the first sensing electrode, the sensing portion of the second sensing electrode, and the connection portion of the second sensing electrode are disposed, wherein the second insulating layer may cover the connection portion of the first sensing electrode, and the connection portion of the first sensing electrode may be electrically connected to the sensing portion of the first sensing electrode through a contact hole formed in the second insulating layer.

[0034] Multiple diffraction patterns can be set in at least one of the first insulating layer and the second insulating layer.

[0035] Multiple diffraction patterns may include multiple holes penetrating at least one of the first insulating layer and the second insulating layer.

[0036] The display device may further include a protective layer disposed on the second insulating layer to cover the sensing portion of the first sensing electrode, the sensing portion of the second sensing electrode, and the connection portion of the second sensing electrode.

[0037] The insulating layer may also include a third insulating layer disposed between the protective layer and the second insulating layer, and multiple diffraction patterns are disposed in the third insulating layer.

[0038] Multiple diffraction patterns can be disposed in the second insulating layer, and the insulating layer may also include a fourth insulating layer disposed below the first insulating layer.

[0039] Multiple diffraction patterns can be disposed in the second insulating layer, and the insulating layer may also include a fifth insulating layer disposed between the first insulating layer and the second insulating layer.

[0040] Multiple diffraction patterns may be disposed on the first insulating layer, and the second insulating layer may include diffraction opening portions superimposed on the multiple diffraction patterns formed on the first insulating layer.

[0041] Each of the sensing portion of the first sensing electrode and the sensing portion of the second sensing electrode may include a grid electrode having a grid shape.

[0042] When viewed in a plane, multiple diffraction patterns may not overlap with the grid electrodes.

[0043] The plurality of pixels may include a first pixel for emitting red light, a second pixel for emitting green light, and a third pixel for emitting blue light, and the plurality of diffraction patterns are superimposed on at least one of the first to third pixels.

[0044] Multiple diffraction patterns can be superimposed on the first pixel.

[0045] Multiple diffraction patterns can be superimposed on the first and third pixels.

[0046] The display panel may also include an encapsulation layer covering multiple pixels, and the input sensor includes an input sensing unit directly disposed on the encapsulation layer.

[0047] According to another aspect of the invention, the display device includes: a display panel including a plurality of pixels for displaying an image, each of the plurality of pixels including a light-emitting device for emitting light; and a diffraction pattern layer including a plurality of diffraction patterns arranged on the display panel to diffract at least a portion of light provided from the display panel, wherein the plurality of diffraction patterns are superimposed on at least one of the plurality of pixels.

[0048] The plurality of pixels may include a first pixel for emitting red light, a second pixel for emitting green light, and a third pixel for emitting blue light, and the plurality of diffraction patterns are superimposed on at least one of the first to third pixels.

[0049] Multiple diffraction patterns can be superimposed on the first pixel.

[0050] Multiple diffraction patterns can be superimposed on the first and third pixels.

[0051] The display device may also include an input sensor disposed on the display panel, wherein the diffraction pattern layer may be disposed between the display panel and the input sensor or disposed on the input sensor.

[0052] The display panel may also include an encapsulation layer covering multiple pixels, and the input sensor is directly mounted on the encapsulation layer.

[0053] The input sensor may include an input sensing unit, which includes: a first insulating layer directly disposed on the encapsulation layer; a first conductive layer disposed on the first insulating layer; a second insulating layer covering the first conductive layer; a second conductive layer disposed on the second insulating layer; and a protective layer covering the second conductive layer and the second insulating layer.

[0054] The diffraction pattern layer can be placed on the protective layer.

[0055] The diffraction pattern layer can be disposed between the encapsulation layer and the first insulating layer.

[0056] It will be understood that the foregoing general description and the following detailed description are exemplary and explanatory, and are intended to provide further explanation of the invention as claimed. Attached Figure Description

[0057] The accompanying drawings illustrate exemplary embodiments of the invention and, together with the description, serve to explain the inventive concept. The drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification.

[0058] Figure 1AThis is a perspective view of an exemplary embodiment of a display device constructed according to the principles of the invention.

[0059] Figure 1B yes Figure 1A An exploded perspective view of the display device.

[0060] Figure 1C It is along Figure 1B A sectional view taken by line I-I'.

[0061] Figure 2 yes Figure 1B A plan view of the display panel of the display device.

[0062] Figure 3 yes Figure 1B A plan view of an exemplary embodiment of the input sensing unit of a display device.

[0063] Figure 4A yes Figure 2 A magnified plan view of the area "FF".

[0064] Figure 4B yes Figure 3 A magnified plan view of the area "FF".

[0065] Figure 5A It is shown Figure 1B An exemplary embodiment of the display module along Figure 4B The sectional view taken from line II-II'.

[0066] Figure 5B It is shown Figure 3 The input sensing unit along Figure 3 The sectional view taken from line III-III'.

[0067] Figure 6A It is shown Figure 5A An enlarged cross-sectional view of part of the "GG".

[0068] Figure 6B yes Figure 5A A plan view of an exemplary embodiment of the second insulating layer.

[0069] Figures 7A to 7F yes Figure 5A A plan view of another exemplary embodiment of the second insulating layer.

[0070] Figure 8A and Figure 8B yes Figure 1B A cross-sectional view of another exemplary embodiment of the display module.

[0071] Figure 9A and Figure 9B yes Figure 1BA cross-sectional view of another exemplary embodiment of the display module.

[0072] Figure 10 yes Figure 1B A cross-sectional view of another exemplary embodiment of the display module.

[0073] Figure 11A and Figure 11B yes Figure 1B A cross-sectional view of another exemplary embodiment of the display module.

[0074] Figure 12 It is shown Figure 3 Another exemplary embodiment of the input sensing unit Figure 3 A magnified plan view of the area "FF".

[0075] Figures 13A to 13E It is shown Figure 1B An exemplary embodiment of the display module along Figure 12 A sectional view taken from line IV-IV'.

[0076] Figure 14A It is a graph showing the brightness ratio of red, green and blue light relative to the viewing angle.

[0077] Figure 14B It is a graph showing the correlated color temperature (CCT) characteristics relative to the viewing angle.

[0078] Figure 14C It is a graph showing the minimum perceptible chromatic aberration (MPCD) characteristics relative to the viewing angle.

[0079] Figure 15 It is shown Figure 3 Another exemplary embodiment of the input sensing unit Figure 3 A magnified plan view of the area "FF".

[0080] Figures 16A to 16C It is shown Figure 1B An exemplary embodiment of the display module along Figure 15 The sectional view taken by line V-V'.

[0081] Figure 17A It is a graph showing the correlated color temperature (CCT) characteristics relative to the viewing angle.

[0082] Figure 17B It is a graph showing the minimum perceptible chromatic aberration (MPCD) characteristics relative to the viewing angle.

[0083] Figure 18 yes Figure 1B A plan view of another exemplary embodiment of the input sensing unit of the display device.

[0084] Figure 19 yes Figure 1B A cross-sectional view of another exemplary embodiment of the display module.

[0085] Figure 20 yes Figure 1B A cross-sectional view of another exemplary embodiment of the display module.

[0086] Figure 21 yes Figure 1B A cross-sectional view of another exemplary embodiment of the display module.

[0087] Figure 22 yes Figure 1B A cross-sectional view of another exemplary embodiment of the display module.

[0088] Figure 23 yes Figure 1B A cross-sectional view of another exemplary embodiment of the display module. Detailed Implementation

[0089] In the following description, numerous specific details are set forth for illustrative purposes to provide a thorough understanding of various exemplary embodiments or implementations of the invention. As used herein, “embodiment” and “implementation” are interchangeable terms as non-limiting examples of apparatuses or methods employing one or more of the inventive concepts disclosed herein. However, it will be apparent that various exemplary embodiments may be implemented without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and apparatuses are shown in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Furthermore, the various exemplary embodiments may differ, but are not necessarily exclusive. For example, the specific shape, construction, and characteristics of an exemplary embodiment may be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0090] Unless otherwise stated, the exemplary embodiments shown are to be understood as providing exemplary features of different details that may be used to implement the inventive concept in practice. Therefore, unless otherwise stated, features, components, modules, layers, films, panels, regions and / or aspects of various embodiments (hereinafter referred to individually or collectively as “elements” or “multiple elements”) may be further combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0091] Crosshairs and / or shading are typically used in accompanying drawings to clearly define the boundaries between adjacent elements. Thus, unless otherwise stated, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for a particular material, material properties, size, scale, commonalities between the elements shown, or any other characteristics, properties, etc. Furthermore, in the accompanying drawings, the dimensions and relative dimensions of elements may be exaggerated for clarity and / or descriptive purposes. A particular process sequence may be performed in a manner different from that described when exemplary embodiments can be implemented differently. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of their description. Moreover, the same reference numerals denote the same elements.

[0092] When a component or layer is referred to as being "on," "connected to," or "bonded to" another component or layer, the component or layer may be directly on, directly connected to, or directly bonded to the other component or layer, or there may be intermediate components or intermediate layers. However, when a component or layer is referred to as being "directly on," "directly connected to," or "directly bonded to" another component or layer, there are no intermediate components or intermediate layers. Therefore, the term "connection" can refer to a physical connection, electrical connection, and / or fluid connection with or without intermediate components. Furthermore, the D1, D2, and D3 axes are not limited to the three axes of a Cartesian coordinate system (such as the x, y, and z axes) and can be interpreted in a broader sense. For example, the D1, D2, and D3 axes can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0093] Although the terms "first," "second," etc., may be used here to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the publicly stated teachings, the first element discussed below may be referred to as the second element.

[0094] For descriptive purposes, spatial relative terms such as “below,” “under,” “below,” “down,” “above,” “above,” “higher,” and “side” (e.g., as in a “sidewall”) may be used herein to describe the relationship between one element and another (other) element as shown in the accompanying drawings. Spatial relative terms are intended to include different orientations of the device in use, operation, and / or manufacture other than those depicted in the drawings. For example, if the device in the drawings is flipped, an element described as “below” or “under” another element or feature would then be positioned “above” said other element or feature. Thus, the exemplary term “below” can include both above and below orientations. Furthermore, the device may be otherwise positioned (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein shall be interpreted accordingly.

[0095] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well. Furthermore, when the terms “comprising” and / or “including” and variations thereof are used in this specification, it indicates the presence of the stated features, integrals, steps, operations, elements, components, and / or groups thereof, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximate terms rather than terms of degree, and are thus used to interpret the inherent biases in measurements, calculated values, and / or provided values ​​that will be recognized by those skilled in the art.

[0096] Various exemplary embodiments are described herein with reference to cross-sectional views and / or exploded views that are schematic diagrams of idealized exemplary embodiments and / or intermediate structures. Thus, variations in the shapes illustrated will be anticipated, for example, due to manufacturing techniques and / or tolerances. Therefore, the exemplary embodiments disclosed herein should not be construed as limited to the specific shapes shown for the regions, but will include deviations in shape caused, for example, by manufacturing processes. In this way, the regions shown in the figures can be schematic in nature, and their shapes may not reflect the actual shapes of the regions of the device; thus, limitation is not intended.

[0097] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure is a part. Terms (such as those defined in a general dictionary) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formalized sense unless clearly defined herein.

[0098] Figure 1A This is a perspective view of an exemplary embodiment of a display device constructed according to the principles of the invention. Figure 1B yes Figure 1A Exploded perspective view of the display device Figure 1C It is along Figure 1B A sectional view taken by line I-I'.

[0099] Reference Figures 1A to 1C A display device (DD) can be an electronic device that is selectively activated by an electrical signal applied to it. A display device (DD) can be implemented in various forms. For example, a display device (DD) can be used in various electronic devices (such as smartwatches, tablets, laptops, computers, and smart TVs).

[0100] The display device DD may include a display surface IS, which is parallel to each of the first direction DR1 and the second direction DR2 and is used to display an image IM on the third direction DR3. The display surface IS on which the image IM is displayed may correspond to the front surface of the display device DD. The image IM may be a video image or a still image.

[0101] In the exemplary embodiment shown, the front or top surface and rear or bottom surface of each element or component may be defined based on the display orientation of the image IM (e.g., third-party DR3). The front and rear surfaces may be opposite each other on the third-party DR3, and the direction perpendicular to each of the front and rear surfaces may be parallel to the third-party DR3.

[0102] The distance between the front and rear surfaces of the display device DD on the third-party direction DR3 can correspond to the thickness of the display device DD on the third-party direction DR3. The directions indicated from the first direction to the third-party directions DR1, DR2, and DR3 can be relative concepts, and in the exemplary embodiment, they can be changed to indicate other directions.

[0103] The display device DD can sense external inputs provided from the outside. External inputs can include various types of input signals provided from outside the display device DD.

[0104] For example, external input can be touch input or non-touch input via the user's body or hand (such as a decrease in distance to the display device DD or a hovering event near the display device DD). Additionally, external input can be provided in various forms (such as force, pressure, temperature, and light).

[0105] The front surface of the display device DD may include a transmissive region TA and a border region BZA. The transmissive region TA may be the area on which an image IM is displayed. The image IM displayed on the transmissive region TA may be provided to the user. In the exemplary embodiment shown, the transmissive region TA has a generally rectangular shape with rounded corners. However, the exemplary embodiment is not limited to this, and for example, the transmissive region TA may have various shapes.

[0106] The border region BZA may be adjacent to the transmissive region TA. The border region BZA may have a predetermined color. The border region BZA may surround the transmissive region TA. Therefore, the shape of the transmissive region TA may be substantially defined by the border region BZA. However, the exemplary embodiments are not limited thereto. For example, the border region BZA may only be provided near one of the side regions of the transmissive region TA or may be omitted. Furthermore, the display device DD may be implemented in various forms, and the exemplary embodiments are not limited to specific examples of the display device DD.

[0107] like Figure 1B and Figure 1C As shown, the display device DD may include a window WM, an outer housing EDC, and a display module DM. The display module DM may include a display panel DP, an input sensor in the form of an input sensing unit ISP, and an anti-reflective device in the form of an anti-reflective unit RPP.

[0108] The window WM can be formed of a transparent material to allow image light to be emitted to the outside. For example, the window WM can be formed of or include glass, sapphire, plastic, etc. Figure 1A As shown, the window WM may have a single-layer structure, but the exemplary embodiments are not limited thereto; for example, the window WM may include multiple layers. For example, the border area BZA of the display device DD may be essentially an area of ​​the window WM on which a material of a particular color is printed. In an exemplary embodiment, the window WM may include a light-blocking pattern WBM for defining the border area BZA. The light-blocking pattern WBM may be a colored organic layer formed by, for example, a coating method.

[0109] According to an exemplary embodiment, the display panel DP can be a light-emitting display panel, but the exemplary embodiment is not limited to a specific type of display panel DP. For example, the display panel DP can be an organic light-emitting display panel, a quantum dot light-emitting display panel, or other known types of display panels. The emitting layer of an organic light-emitting display panel can be formed of or include organic light-emitting materials. The emitting layer of a quantum dot light-emitting display panel can include quantum dots, quantum rods, etc. For ease of description, the following description will refer to an example in which the display panel DP is an organic light-emitting display panel.

[0110] The input sensing unit (ISP) can be directly disposed on the display panel (DP). In an exemplary embodiment, the input sensing unit (ISP) can be formed continuously on the display panel (DP). For example, the input sensing unit (ISP) can be directly formed on the display panel (DP), and in this case, no adhesive film may be provided between the input sensing unit (ISP) and the display panel (DP).

[0111] The display panel (DP) can generate an image to be displayed externally, and the input sensing unit (ISP) can obtain information about the coordinates of external inputs (e.g., touch events).

[0112] An anti-reflective unit RPP can reduce the reflectivity of external light incident on a window WM from external space. In an exemplary embodiment, the anti-reflective unit RPP may include a phase retarder and a polarizer. The phase retarder may be film-type or liquid crystal coated type, and may include λ / 2 and / or λ / 4 phase retarders. The polarizer may also be film-type or liquid crystal coated type. A film-type polarizer may include a stretched synthetic resin film, while a liquid crystal coated polarizer may include liquid crystals arranged in a specific orientation. The phase retarder and polarizer may be implemented using a single polarizer film. The anti-reflective unit RPP may also include a protective film disposed on or below the polarizer film.

[0113] Reference Figure 1CThe anti-reflective unit RPP can be disposed on the input sensing unit ISP. In other words, the anti-reflective unit RPP can be disposed between the input sensing unit ISP and the window WM. The input sensing unit ISP, the anti-reflective unit RPP, and the window WM can be connected to each other through adhesive films. For example, a first adhesive film AF1 can be disposed between the input sensing unit ISP and the anti-reflective unit RPP, and a second adhesive film AF2 can be disposed between the anti-reflective unit RPP and the window WM. Therefore, the anti-reflective unit RPP can be connected to the input sensing unit ISP through the first adhesive film AF1, and the window WM can be connected to the anti-reflective unit RPP through the second adhesive film AF2. In an exemplary embodiment, each of the first adhesive film AF1 and the second adhesive film AF2 may include an optically transparent adhesive (OCA) film. However, the exemplary embodiment is not limited to the above materials of the first adhesive film AF1 and the second adhesive film AF2, and typical adhesive materials or typical adhesives can be used for the first adhesive film AF1 and the second adhesive film AF2. For example, the first adhesive film AF1 and the second adhesive film AF2 may include an optically transparent resin (OCR) film or a pressure-sensitive adhesive (PSA) film.

[0114] Reference Figure 1B The display module DM can display an image in response to an electrical signal applied to it, and can receive and output information from external inputs. An active area AA and a peripheral area NAA can be defined within the display module DM. The active area AA can be defined as the area used for emitting light to generate an image provided from the display module DM.

[0115] The peripheral region NAA can be configured to be adjacent to the effective region AA. For example, the peripheral region NAA can surround the effective region AA. However, the exemplary embodiment is not limited to this, and the shape of the peripheral region NAA can be changed in various ways. In the exemplary embodiment, the effective region AA of the display module DM can correspond to at least a portion of the transmissive region TA.

[0116] The display module DM may also include a main circuit board MCB, a flexible circuit film FCB, and a driver chip DIC.

[0117] The main circuit board (MCB) can be bonded to the flexible circuit film (FCB) and electrically connected to the display panel (DP). The MCB may include multiple driving elements. These driving elements may include circuitry for driving the display panel (DP).

[0118] The flexible circuit film (FCB) can be bonded to the display panel (DP) to electrically connect the display panel (DP) to the main circuit board (MCB). The driver chip (DIC) can be mounted on the flexible circuit film (FCB).

[0119] The driver chip DIC may include driving elements (e.g., data driving circuitry) for driving the pixels of the display panel DP. Although the display device DD is shown as having a flexible circuit film FCB, exemplary embodiments are not limited thereto. For example, multiple flexible circuit films may be incorporated into the display panel DP.

[0120] also, Figure 1B An example is shown in which the driver chip DIC is mounted on the flexible circuit film FCB, but the exemplary embodiments are not limited thereto. For example, the driver chip DIC can be directly mounted on the display panel DP. In this case, the portion of the display panel DP with the driver chip DIC mounted can be bent to face the rear surface of the display module DM.

[0121] The input sensing unit (ISP) can be electrically connected to the main circuit board (MCB) via a flexible circuit film (FCB). However, exemplary embodiments are not limited thereto. For example, the display module (DM) may also include an additional flexible circuit board for electrically connecting the input sensing unit (ISP) to the main circuit board (MCB).

[0122] The display module DM can be housed within an outer housing EDC. The outer housing EDC can be combined with a window WM to define the appearance of the display device DD. The outer housing EDC can absorb impacts from the outside and prevent contaminants or moisture from entering the display module DM, thus protecting the internal components housed within the outer housing EDC from contaminants or moisture. In an exemplary embodiment, the outer housing EDC may include multiple container members joined together.

[0123] In an exemplary embodiment, the display device DD may further include an electronic module, a power module, a bracket, etc. The electronic module includes various functional modules configured to operate the display module DM, the power module supplies power for various operations of the display device DD, and the bracket is connected to the display module DM and / or the external housing EDC to divide the internal space of the display device DD.

[0124] Figure 2 yes Figure 1B A plan view of the display panel of the display device. Figure 3 yes Figure 1B A plan view of an exemplary embodiment of the input sensing unit of a display device.

[0125] Reference Figure 2 and Figure 3 The display panel DP may include a drive circuit GDC, multiple signal lines SGL, and multiple pixels PX. The display panel DP may also include a pad (or "solder pad") portion PLD disposed in the peripheral area NAA. The pad portion PLD may include pixel pads D-PD connected to a corresponding signal line SGL.

[0126] Pixels PX can be set within the effective area AA. Each pixel PX may include an organic light-emitting diode (OLED) (e.g., see...). Figure 5A The driver circuit (GDC), signal line (SGL), pad portion (PLD), and pixel driver circuitry are connected to the organic light-emitting diode (OLED). Figure 5A The display circuit layer DP-CL is shown in the diagram.

[0127] The driving circuit GDC may include a gate driving circuit. The gate driving circuit can generate multiple gate signals and sequentially output these gate signals to multiple gate lines GL, as will be described below. The gate driving circuit can also output another control signal to the pixel driving circuit.

[0128] The signal line SGL may include gate line GL, data line DL, power line PWL, and control signal line CSL. One gate line GL can be connected to a corresponding pixel PX within a pixel PX, and one data line DL can be connected to a corresponding pixel PX within a pixel PX. The power line PWL can be connected to a pixel PX. The control signal line CSL can provide control signals to the gate drive circuit. The signal line SGL can be stacked with the active area AA and the peripheral area NAA.

[0129] The pad portion of the PLD can be a flexible circuit film FCB (e.g., see...). Figure 1B The portion connected to it may include a pixel pad D-PD and an input pad I-PD. The pixel pad D-PD is used to connect the flexible circuit film FCB to the display panel DP, and the input pad I-PD is used to connect the flexible circuit film FCB to the input sensing unit ISP. This can be achieved by... Figure 5A The insulating layer in the display circuit layer DP-CL shown is exposed and some interconnects are set in the display circuit layer DP-CL to set the pixel pads D-PD and input pads I-PD.

[0130] Pixel pads (D-PDs) can be connected to the corresponding pixel PX within a pixel PX via signal line SGL. Additionally, the drive circuit GDC can be connected to one of the pixel pads (D-PDs).

[0131] Reference Figure 3The input sensing unit ISP may include first sensing electrodes IE1-1 to IE1-5, first signal lines SL1-1 to SL1-5 connected to the first sensing electrodes IE1-1 to IE1-5, second sensing electrodes IE2-1 to IE2-4, and second signal lines SL2-1 to SL2-4 connected to the second sensing electrodes IE2-1 to IE2-4. In an exemplary embodiment, the input sensing unit ISP may include a third signal line connected to the second sensing electrodes IE2-1 to IE2-4. In this case, the second signal lines SL2-1 to SL2-4 may be connected to the ends of the second sensing electrodes IE2-1 to IE2-4, and the third signal line may be connected to the opposite ends of the second sensing electrodes IE2-1 to IE2-4.

[0132] The first sensing electrodes IE1-1 to IE1-5 may intersect with the second sensing electrodes IE2-1 to IE2-4. The first sensing electrodes IE1-1 to IE1-5 may be arranged on the first direction DR1 and may extend on the second direction DR2.

[0133] Each of the first sensing electrodes IE1-1 to IE1-5 may include a first sensing portion SP1 and a first connecting portion CP1 disposed in the effective region AA. Each of the second sensing electrodes IE2-1 to IE2-4 may include a second sensing portion SP2 and a second connecting portion CP2 disposed in the effective region AA. Compared to the central first sensing portion SP1 of the first sensing portion SP1, the two first sensing portions SP1 located at opposite ends of the first sensing electrodes may have a smaller area or size (e.g., half the area). Compared to the central second sensing portion SP2 of the second sensing portion SP2, the two second sensing portions SP2 located at opposite ends of the second sensing electrodes may have a smaller area or size (e.g., half the area).

[0134] Figure 3 First sensing electrodes IE1-1 to IE1-5 and second sensing electrodes IE2-1 to IE2-4 are shown, but exemplary embodiments are not limited to the details of the first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4. For example, in exemplary embodiments, the first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4 may have shapes in which the sensing portions and connecting portions are not distinguished (e.g., strip shapes). The first sensing portion SP1 and the second sensing portion SP2 are shown to have a similar rhomboid shape, but exemplary embodiments are not limited to this. For example, each of the first sensing portion SP1 and the second sensing portion SP2 may be configured to have other generally polygonal shapes and one of other shapes.

[0135] In each of the first sensing electrodes IE1-1 to IE1-5, a first sensing portion SP1 may be arranged on the second direction DR2, and in each of the second sensing electrodes IE2-1 to IE2-4, a second sensing portion SP2 may be arranged on the first direction DR1. Each of the first connecting portions CP1 may connect to an adjacent first sensing portion SP1 of the first sensing portions SP1, and each of the second connecting portions CP2 may connect to an adjacent second sensing portion SP2 of the second sensing portions SP2.

[0136] The first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4 can have a grid shape. In this case, it is possible to reduce the distance between the sensing electrodes and the display panel DP (e.g., see...). Figure 2 The parasitic capacitance between the electrodes. Furthermore, as will be described below, the first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4 may not be connected to the emission regions PXA-R, PXA-G, and PXA-B (e.g., see...). Figure 4A The electrodes are stacked, and in this case, it is possible to prevent the first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4 from being identified or observed by the user.

[0137] The first sensing electrodes IE1-1 to IE1-5 and the second sensing electrodes IE2-1 to IE2-4 can be formed in a mesh shape of silver, aluminum, copper, chromium, nickel, titanium, etc., or may include silver, aluminum, copper, chromium, nickel, titanium, etc., which can be formed by a low-temperature process, but the exemplary embodiments are not limited thereto. Even when the input sensing unit ISP is formed by a continuous process, it is possible to prevent organic light-emitting diodes (OLEDs) (e.g., see...) from being processed. Figure 5A It was damaged.

[0138] The first signal lines SL1-1 to SL1-5 can be respectively connected to one end of the first sensing electrodes IE1-1 to IE1-5. In an exemplary embodiment, the input sensing unit ISP may further include signal lines connected to opposite ends of the first sensing electrodes IE1-1 to IE1-5.

[0139] The first signal lines SL1-1 to SL1-5 and the second signal lines SL2-1 to SL2-4 can be disposed in the peripheral area NAA. The input sensing unit ISP may include an input pad I-PD, which extends from the ends of the first signal lines SL1-1 to SL1-5 and the second signal lines SL2-1 to SL2-4 and is disposed in the peripheral area NAA.

[0140] Figure 4A yes Figure 2 A magnified plan view of region "FF". Figure 4B yes Figure 3 A magnified plan view of the area "FF".

[0141] Reference Figure 4A The display panel (DP) may include multiple pixels. In an exemplary embodiment, the multiple pixels may include multiple first pixels PX-R, multiple second pixels PX-G, and multiple third pixels PX-B with different sizes. In other words, the second pixels PX-G may have a smaller size than the first pixels PX-R and the third pixels PX-B, and the first pixels PX-R may have a smaller size than the third pixels PX-B. In an exemplary embodiment, the first pixels PX-R may be pixels that emit red light, the second pixels PX-G may be pixels that emit green light, and the third pixels PX-B may be pixels that emit blue light.

[0142] The first pixel PX-R can be arranged in the first direction DR1 and the second direction DR2. The first pixel PX-R and the third pixel PX-B can be alternately repeated and can be arranged in the first direction DR1 and the second direction DR2. The non-pixel region NPA can be set between the first pixel and the third pixel PX-R, PX-G and PX-B.

[0143] Figure 4A An example arrangement of the first to third pixels PX-R, PX-G, and PX-B is shown, but the exemplary embodiments are not limited thereto. For example, in an exemplary embodiment, the first pixel PX-R, the second pixel PX-G, and the third pixel PX-B may be arranged alternately in the second direction DR2. Furthermore, each of the first to third pixels PX-R, PX-G, and PX-B is shown as having a generally rectangular shape, but the exemplary embodiments are not limited thereto. For example, each of the first to third pixels PX-R, PX-G, and PX-B may be configured to have various shapes (e.g., polygonal, circular, and elliptical shapes). In an exemplary embodiment, the first to third pixels PX-R, PX-G, and PX-B may have different shapes. For example, the second pixel PX-G may have a generally hexagonal or generally octagonal shape, and the first pixel PX-R and the third pixel PX-B may have a generally rectangular or generally square shape.

[0144] exist Figure 4A In the example, the second pixel PX-G is shown to have a smaller size than the first pixel PX-R and the third pixel PX-B, but the exemplary embodiment is not limited thereto. For example, in the exemplary embodiment, the first to third pixels PX-R, PX-G and PX-B may have the same size.

[0145] Each of the first pixels PX-R may include a first emitting region PXA-R through which light is emitted and a first non-emitting region NPXA-R formed around or near the first emitting region PXA-R. Each of the second pixels PX-G may include a second emitting region PXA-G through which light is emitted and a second non-emitting region NPXA-G formed around or near the second emitting region PXA-G. Each of the third pixels PX-B may include a third emitting region PXA-B through which light is emitted and a third non-emitting region NPXA-B formed around or near the third emitting region PXA-B. The first non-emitting regions to the third non-emitting regions NPXA-R, NPXA-G, and NPXA-B may be defined as regions through which light is not emitted.

[0146] Reference Figure 4A and Figure 4B The first sensing portion SP1 of the input sensing unit ISP can have a grid shape. Each of the first sensing portions SP1 can include a grid electrode MSE patterned to have a grid shape. The first sensing portion SP1 can be configured to correspond to the non-pixel region NPA, and in this case, it is possible to increase the aperture ratio of the first to third pixels PX-R, PX-G, and PX-B and reduce the parasitic capacitance. The grid electrode MSE can be partially superimposed with the first to third non-emitting regions NPXA-R, NPXA-G, and NPXA-B.

[0147] The input sensing unit (ISP) may include one or more diffraction patterns. As used herein, "diffraction pattern" means a diffraction element that can be any type of discontinuity, such as a hole, a protrusion, a reduced-thickness portion, or other structure capable of diffracting light, and is arranged in a layer or component in a regular repeating sequence or an irregular random sequence. For example, diffraction patterns DFP may be arranged to be regularly spaced apart from each other at a substantially constant pitch and are used to diffract at least a portion of the light passing through the input sensing unit (ISP). Multiple diffraction patterns DFP may be superimposed with each of the emission regions PXA-R, PXA-G, and PXA-B of pixels PX-R, PX-G, and PX-B. In an exemplary embodiment, multiple diffraction patterns DFP may be superimposed with each of the emission regions PXA-R, PXA-G, PXA-B and the non-emission regions NPXA-R, NPXA-G, and NPXA-B of pixels PX-R, PX-G, and PX-B.

[0148] The diffraction pattern DFP can be set up without being superimposed on the non-pixel region NPA. In other words, the diffraction patterns DFP can be set up in such a way that they are not superimposed on the grid electrode MSE.

[0149] In an exemplary embodiment, each of the diffraction patterns DFP may have a generally circular shape when viewed in a plane. However, the exemplary embodiment is not limited to the shape of the diffraction pattern DFP. For example, the diffraction pattern DFP may be configured to have various shapes (e.g., generally polygonal, generally elliptical, and generally elongated shapes).

[0150] Figure 5A It is shown Figure 1B An exemplary embodiment of the display module along Figure 4B The sectional view taken from line II-II', and Figure 5B It is shown Figure 3 The input sensing unit along Figure 3 The sectional view taken from line III-III'. Figure 6A It is shown Figure 5A An enlarged cross-sectional view of part of the "GG" logo. Figure 6B yes Figure 5A A plan view of an exemplary embodiment of the second insulating layer.

[0151] Reference Figure 5A The display panel DP of the display module DM may include a substrate layer BL, a display circuit layer DP-CL disposed on the substrate layer BL, a display element layer DP-OLED disposed on the display circuit layer DP-CL, and an encapsulation layer TFE disposed on the display element layer DP-OLED. For example, the display panel DP may also include functional layers, such as an anti-reflective layer and a refractive index control layer.

[0152] The substrate layer BL may include a synthetic resin layer. The synthetic resin layer may be formed on a working substrate used to manufacture the display panel DP. Subsequently, conductive layers, insulating layers, etc., may be formed on the synthetic resin layer. When the working substrate is removed, the synthetic resin layer can serve as the substrate layer BL. The synthetic resin layer may be a polyimide resin layer, but exemplary embodiments are not limited to specific materials. Additionally, the substrate layer BL may include a glass substrate, a metal substrate, or an organic / inorganic composite substrate.

[0153] The display circuit layer DP-CL may include at least one insulating layer and circuit elements. Hereinafter, the insulating layer in the display circuit layer DP-CL will be referred to as an intermediate insulating layer. The intermediate insulating layer may include at least one inorganic intermediate layer and at least one organic intermediate layer. Circuit elements may include signal lines, pixel driving circuits, etc. The formation of the display circuit layer DP-CL may include the steps of forming an insulating layer, a semiconductor layer, and a conductive layer by a coating process or a deposition process, and the steps of patterning the insulating layer, the semiconductor layer, and the conductive layer by a photolithography and / or etching process.

[0154] The display element layer DP-OLED may include a pixel defining layer PDL and a plurality of organic light-emitting diodes (OLEDs). The pixel defining layer PDL may be formed of or include organic materials. Each of the plurality of OLEDs includes a first electrode AE, an emitter layer EML, and a second electrode CE. The first electrode AE ​​may be disposed on the display circuit layer DP-CL. The pixel defining layer PDL may be formed on the first electrode AE. An opening OP may be defined in the pixel defining layer PDL. The opening OP of the pixel defining layer PDL may expose at least a portion of the first electrode AE. In an exemplary embodiment, the pixel defining layer PDL may be omitted.

[0155] like Figure 4A and Figure 5A As shown, the display panel DP may include emitting regions PXA-R, PXA-G, and PXA-B, and non-emitting regions NPXA-R, NPXA-G, and NPXA-B disposed near the emitting regions PXA-R, PXA-G, and PXA-B. Each of the non-emitting regions NPXA-R, NPXA-G, and NPXA-B may surround a corresponding one of the emitting regions PXA-R, PXA-G, and PXA-B. In the illustrated exemplary embodiment, each of the emitting regions PXA-R, PXA-G, and PXA-B may be defined as a portion of the first electrode AE ​​exposed by the opening OP. A non-pixel region NPA may be defined between the non-emitting regions NPXA-R, NPXA-G, and NPXA-B. The first electrode AE ​​may be formed individually in each of the pixels PX-R, PX-G, and PX-B.

[0156] The emitting layer EML can be disposed on the first electrode AE. The emitting layer EML can be disposed in the region corresponding to the opening OP (center). In other words, the emitting layer EML can include multiple patterns individually and separately formed in pixels PX-R, PX-G, and PX-B. The emitting layer EML can be formed of or include at least one of organic and / or inorganic materials. The emitting layer EML can be configured to produce light of a specific color. For example, the emitting layer EML can produce red, green, or blue light.

[0157] In the exemplary embodiment shown, the emitting layer EML is depicted as having a patterned structure, but the exemplary embodiment is not limited thereto. For example, the emitting layer EML may be configured to have a continuous structure spanning multiple emitting regions PXA-R, PXA-G, and PXA-B. Here, the emitting layer EML can produce white light. Furthermore, the emitting layer EML may have a multilayer structure referred to as "tandem".

[0158] like Figure 6AAs shown, the hole control layer HCL can be disposed between the emitter layer EML and the first electrode AE. For example, the hole control layer HCL can be disposed in all of the emitter regions PXA-R, PXA-G and PXA-B, the non-emitter regions NPXA-R, NPXA-G and NPXA-B, and the non-pixel region NPA.

[0159] The second electrode CE can be disposed on the emitter layer EML. The second electrode CE can be disposed in all of the emitter regions PXA-R, PXA-G and PXA-B, the non-emitter regions NPXA-R, NPXA-G and NPXA-B, and the non-pixel region NPA.

[0160] like Figure 6A As shown, the electronic control layer ECL can be further disposed between the emitter layer EML and the second electrode CE. For example, the electronic control layer ECL can be disposed in all of the emitter regions PXA-R, PXA-G and PXA-B, the non-emitter regions NPXA-R, NPXA-G and NPXA-B, and the non-pixel region NPA.

[0161] Reference Figure 5A and Figure 6A The encapsulation layer TFE can be disposed on the second electrode CE. The encapsulation layer TFE can hermetically seal the display element layer DP-OLED. The encapsulation layer TFE may include at least one insulating layer. In an exemplary embodiment, the encapsulation layer TFE may include at least one inorganic layer (hereinafter, the first inorganic encapsulation layer T-IL1). In an exemplary embodiment, the encapsulation layer TFE may also include at least one organic layer (hereinafter, the organic encapsulation layer T-OL) and at least one inorganic layer (hereinafter, the second inorganic encapsulation layer T-IL2). The organic encapsulation layer T-OL may be disposed between the first inorganic encapsulation layer T-IL1 and the second inorganic encapsulation layer T-IL2.

[0162] The first inorganic encapsulation layer T-IL1 and the second inorganic encapsulation layer T-IL2 can protect the display element layer DP-OLED from moisture or oxygen, and the organic encapsulation layer T-OL can protect the display element layer DP-OLED from contaminating materials such as dust particles. The first inorganic encapsulation layer T-IL1 and the second inorganic encapsulation layer T-IL2 may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, but the exemplary embodiments are not limited thereto. The organic encapsulation layer T-OL may be formed of an acrylic organic layer or may include an acrylic organic layer, but the exemplary embodiments are not limited thereto.

[0163] The input sensing unit (ISP) may include a first insulating layer IL1, a first conductive layer disposed thereon, a second insulating layer IL2 covering the first conductive layer, and a second conductive layer disposed on the second insulating layer IL2. The first insulating layer IL1 may be formed of or include an inorganic material, and may include, for example, a silicon nitride layer. The second inorganic encapsulation layer T-IL2, which serves as the top layer of the encapsulation layer TFE, may also be formed of or include a silicon nitride layer, which is formed under deposition conditions different from those used for the first insulating layer IL1.

[0164] Reference Figure 3 , Figure 4B , Figure 5A and Figure 5B The first conductive layer may be disposed on the first insulating layer IL1. The first conductive layer may include a first connection portion CP1. The second conductive layer may be disposed on the second insulating layer IL2. The second conductive layer may include a first sensing portion SP1, a second sensing portion SP2, and a second connection portion CP2.

[0165] A second insulating layer IL2 may be disposed between the first conductive layer and the second conductive layer. When viewed in cross-section, the second insulating layer IL2 can separate the first conductive layer from the second conductive layer. A first contact hole CNT1 and a second contact hole CNT2 may be disposed in the second insulating layer IL2 to partially expose the first connecting portion CP1. The first connecting portion CP1 can be bonded to a pair of adjacent first sensing portions SP1 through the first contact hole CNT1 and the second contact hole CNT2. The second connecting portion CP2 may be formed to pass through the separation space between an adjacent pair of first sensing portions SP1. The second connecting portion CP2 can be electrically connected to an adjacent pair of second sensing portions SP2.

[0166] Figure 5B A structure is shown in which a first conductive layer includes a first connection portion CP1, and a second conductive layer includes a first sensing portion SP1, a second sensing portion SP2, and a second connection portion CP2. However, exemplary embodiments are not limited thereto. For example, the first conductive layer may include the second connection portion CP2, and the second conductive layer may include the first sensing portion SP1, the second sensing portion SP2, and the first connection portion CP1. In an exemplary embodiment, the first conductive layer may include the first sensing portion SP1, the second sensing portion SP2, and the first connection portion CP1, and the second conductive layer may include the second connection portion CP2.

[0167] The second insulating layer IL2 may be formed of or comprise inorganic materials. For example, the second insulating layer IL2 may comprise a silicon nitride layer. In an exemplary embodiment, the second insulating layer IL2 may be thicker than the first insulating layer IL1.

[0168] The diffraction pattern DFP can be formed in at least one of the first insulating layer IL1 and the second insulating layer IL2. Figure 5A The diffraction pattern DFP formed in the second insulating layer IL2 is shown, but exemplary embodiments are not limited thereto.

[0169] The diffraction pattern DFP can be arranged at a substantially constant pitch to diffract at least a portion of the light emitted from the emitting layer EML. For example, the diffraction pattern DFP can diffract at least a portion of the light incident on the input sensing unit ISP. Each of the diffraction patterns DFP can be a hole penetrating the second insulating layer IL2. For example, the second insulating layer IL2 can include a plurality of holes. The plurality of holes are formed to penetrate the second insulating layer IL2 in a third-direction DR3 and are defined as the diffraction pattern DFP. The first insulating layer IL1 can be partially exposed by the diffraction pattern DFP.

[0170] The process of forming the diffraction pattern DFP in the second insulating layer IL2 can be performed concurrently with the process of forming the first contact hole CNT1 and the second contact hole CNT2 in the second insulating layer IL2. In other words, the diffraction pattern DFP and the first contact hole CNT1 and the second contact hole CNT2 can be formed simultaneously by the same process. Therefore, the additional patterning process for forming the diffraction pattern DFP can be omitted, and this makes it possible to reduce the number of masks required to manufacture the display device and the total process time.

[0171] The diffraction pattern DFP can be superimposed with the emitting regions PXA-R, PXA-G, and PXA-B. The diffraction pattern DFP can also be partially superimposed with the non-emitting regions NPXA-R, NPXA-G, and NPXA-B.

[0172] The diffraction pattern DFP may not be superimposed on the non-pixel region NPA. The first conductive layer and the second conductive layers SP1, SP2, CP1, and CP2 may be configured to correspond to the non-pixel region NPA. Therefore, the diffraction pattern DFP can be configured in such a way that it is not superimposed on the first conductive layer and the second conductive layers SP1, SP2, CP1, and CP2.

[0173] The input sensing unit ISP may also include a protective layer PL. The protective layer PL may cover the second insulating layer IL2 and the second conductive layers SP1, SP2, and CP2. Additionally, the protective layer PL may cover the first insulating layer IL1 exposed by the diffraction pattern DFP. For example, the protective layer PL may be formed to fill the diffraction pattern DFP.

[0174] The protective layer PL may be formed of or comprise organic materials. For example, the protective layer PL may be formed of or comprise acrylic resin. The protective layer PL may be thicker than the first insulating layer IL1 and the second insulating layer IL2. Furthermore, the protective layer PL may have a refractive index different from that of the first insulating layer IL1 and the second insulating layer IL2. For example, the protective layer PL may have a refractive index of about 1.6, and the first insulating layer IL1 and the second insulating layer IL2 may have a refractive index of about 1.9.

[0175] Reference Figure 6A Organic light-emitting diodes (OLEDs) can generate first light sources L1a, L1b, and L1c. The first light sources L1a, L1b, and L1c emitted from the OLED can pass through the encapsulation layer TFE and be incident on the input sensing unit (ISP). The first light sources L1a, L1b, and L1c emitted from the OLED can include forward light L1a, a first lateral light L1b, and a second lateral light L1c. The forward light L1a is in the upward direction (e.g., in the direction of...). Figure 1A The light beams (IS) propagate substantially perpendicularly to the third direction (DR3) of the display surface, while the first transverse light L1b and the second transverse light L1c propagate in directions different from the forward light L1a. For ease of explanation, Figure 6A Only some of the transverse beams L1b and L1c are shown (e.g., the first transverse beam L1b and the second transverse beam L1c that propagate in a direction inclined at a first angle θ1 to the forward beam L1a).

[0176] The first light L1a, L1b, and L1c emitted from the organic light-emitting diode (OLED) can be diffracted by the diffraction pattern DFP input to the sensing unit ISP to form the second light L2a, L2b, and L2c. The diffraction of the first light L1a, L1b, and L1c can be caused not only by the diffraction pattern DFP but also by the refractive index difference between the second insulating layer IL2 and the protective layer PL that fills the diffraction pattern DFP. For example, when there is a difference in refractive index between the protective layer PL and the second insulating layer IL2, the diffraction effect generated by the diffraction pattern DFP can occur more significantly compared to when there is no such difference.

[0177] The second beams L2a, L2b, and L2c may include a first diffracted beam L2a generated by the diffraction of the forward beam L1a, and a second diffracted beam L2b and a third diffracted beam L2c generated by the diffraction of the first transverse beam L1b and the second transverse beam L1c. The first diffracted beam L2a may include multiple beams, one of which propagates in the same direction as the forward beam L1a, while the others propagate in directions different from the forward beam L1a. In other words, the forward beam L1a may be emitted in both the transverse and forward directions. Similarly, the second diffracted beam L2b may include multiple beams, one of which propagates in the same direction as the first transverse beam L1b, while the others propagate in directions different from the first transverse beam L1b. Likewise, the third diffracted beam L2c may include multiple beams, one of which propagates in the same direction as the second transverse beam L1c, while the others propagate in directions different from the second transverse beam L1c. Therefore, the first transverse beam L1b and the second transverse beam L1c may be emitted in both the forward and transverse directions.

[0178] Since the first light L1a, L1b and L1c emitted from the organic light-emitting diode OLED is diffracted by the diffraction pattern DFP and propagates in various directions (e.g., forward and lateral directions) as described above, the color difference between the forward and lateral directions can be reduced, which makes it possible to improve the overall viewing angle characteristics of the display device DD.

[0179] Reference Figure 6A and Figure 6B The diffraction pattern DFP can be arranged with a specific or substantially constant pitch (hereinafter, arrangement pitch). The diffraction pattern DFP can be arranged in a first direction DR1 with a first arrangement pitch a1, and in a second direction DR2 with a second arrangement pitch a2. For example... Figure 6B As shown, the first arrangement pitch a1 and the second arrangement pitch a2 can be equal to each other, but the exemplary embodiment is not limited thereto. In other words, the first arrangement pitch a1 and the second arrangement pitch a2 can have different values.

[0180] Each of the diffraction patterns DFP can have a substantially constant width (i.e., diameter) b1. In an exemplary embodiment, the width b1 of each of the diffraction patterns DFP can be about 1 μm. The arrangement pitches a1 and a2 of the diffraction patterns DFP can be smaller than the width of a corresponding one of the emission regions PXA-R, PXA-G, and PXA-B.

[0181] like Figure 6BAs shown, when viewed in a plane, the diffraction pattern DFP can have a generally circular shape. Additionally, the diffraction pattern DFP can be arranged in a matrix shape. However, the exemplary embodiments are not limited to any particular shape or structure of the diffraction pattern DFP. For example, the diffraction pattern DFP can have one of a generally elliptical shape, a generally polygonal shape, and a generally elongated shape.

[0182] Figures 7A to 7F yes Figure 5A A plan view of another exemplary embodiment of the second insulating layer.

[0183] Reference Figure 7A and Figure 7B Each of the diffraction patterns DFP1 and DFP2 can be configured with a hole-shaped structure that penetrates the second insulating layer IL2. For example... Figure 7A As shown, the diffraction pattern DFP1 can have a generally quadrilateral aperture shape or a generally rectangular aperture shape. The diffraction pattern DFP1 can be arranged in a matrix shape.

[0184] Optionally, such as Figure 7B As shown, the diffraction pattern DFP2 may have an elongated shape that extends in a particular direction. Exemplary embodiments are not limited to a specific direction of extension of the diffraction pattern DFP2. For example, the diffraction pattern DFP2 may extend in a first direction DR1 and a second direction DR2, or in a direction that is angled to the first direction DR1 and the second direction DR2.

[0185] Reference Figure 7C The diffraction patterns DFP_O and DFP_E may include odd-numbered diffraction patterns DFP_O in odd-numbered rows and even-numbered diffraction patterns DFP_E in even-numbered rows. The odd-numbered diffraction patterns DFP_O may be arranged at a third arrangement pitch a3 in the row direction and at a fourth arrangement pitch a4 in the column direction. The even-numbered diffraction patterns DFP_E may be arranged at a fifth arrangement pitch a5 in the row direction and at a sixth arrangement pitch a6 in the column direction. The number of odd-numbered diffraction patterns DFP_O may differ from the number of even-numbered diffraction patterns DFP_E. In an exemplary embodiment, the third arrangement pitch a3 may have a value equal to or different from the fifth arrangement pitch a5, and the fourth arrangement pitch a4 may have a value equal to or different from the sixth arrangement pitch a6.

[0186] Odd-numbered diffraction patterns DFP_O and their adjacent even-numbered diffraction patterns DFP_E can be spaced apart by a first distance d1 in the row direction. Here, the third arrangement pitch a3 or the fifth arrangement pitch a5 can be twice the first distance d1. Odd-numbered diffraction patterns DFP_O and their adjacent even-numbered diffraction patterns DFP_E can be spaced apart by a second distance d2 in the column direction. Here, the fourth arrangement pitch a4 or the sixth arrangement pitch a6 can be twice the second distance d2.

[0187] Reference Figure 7D and Figure 7E The diffraction patterns DFP3 and DFP4 can have a columnar shape, wherein the columnar shape can be one of a generally circular shape, a generally polygonal shape, a generally elliptical shape, and a generally elongated shape. In an exemplary embodiment, the diffraction patterns DFP3 and DFP4 can be island-shaped patterns spaced apart from each other. A diffraction opening portion D-OP having a size corresponding to the emission area of ​​each pixel can be disposed in the second insulating layer IL2, and the diffraction pattern DFP3 or DFP4 can be disposed in the diffraction opening portion D-OP.

[0188] like Figure 7D As shown, the diffraction pattern DFP3 can have a generally cylindrical shape. The diffraction pattern DFP3 can be arranged in a matrix shape.

[0189] like Figure 7E As shown, the diffraction pattern DFP4 can have a polygonal columnar shape (e.g., a roughly quadrilateral columnar shape, a roughly pentagonal columnar shape, or a roughly hexagonal columnar shape). Alternatively, the diffraction pattern DFP4 can be an elongated columnar pattern that extends in a particular direction.

[0190] Reference Figure 7F The diffraction patterns DFP3_O and DFP3_E can include an odd-numbered diffraction pattern DFP3_O in an odd-numbered row and an even-numbered diffraction pattern DFP3_E in an even-numbered row. The odd-numbered diffraction pattern DFP3_O can have the same shape as the even-numbered diffraction pattern DFP3_E. For example, both the odd-numbered and even-numbered diffraction patterns DFP3_O can have a cylindrical shape.

[0191] Odd-numbered diffraction patterns DFP3_O can be arranged at a third arrangement pitch a3 in the row direction and at a fourth arrangement pitch a4 in the column direction. Even-numbered diffraction patterns DFP3_E can be arranged at a fifth arrangement pitch a5 in the row direction and at a sixth arrangement pitch a6 in the column direction. The number of odd-numbered diffraction patterns DFP3_O in odd-numbered rows can be different from the number of even-numbered diffraction patterns DFP3_E in even-numbered rows. In an exemplary embodiment, the third arrangement pitch a3 can have a value equal to or different from the fifth arrangement pitch a5, and the fourth arrangement pitch a4 can have a value equal to or different from the sixth arrangement pitch a6.

[0192] The odd-numbered diffraction pattern DFP3_O and its adjacent even-numbered diffraction pattern DFP3_E can be spaced apart from each other by a first distance d1 in the row direction. Here, the third arrangement pitch a3 and the fifth arrangement pitch a5 can be twice the first distance d1. The odd-numbered diffraction pattern DFP3_O and its adjacent even-numbered diffraction pattern DFP3_E can be spaced apart from each other by a second distance d2 in the column direction. Here, the fourth arrangement pitch a4 and the sixth arrangement pitch a6 can be twice the second distance d2.

[0193] Figure 8A and Figure 8B yes Figure 1B A cross-sectional view of another exemplary embodiment of the display module.

[0194] Reference Figure 3 , Figure 4B and Figure 8A The input sensing unit ISP of the display module DM may include a first insulating layer IL1, a first conductive layer and second conductive layers SP1, SP2, CP1 and CP2, a second insulating layer IL2 and a protective layer PL.

[0195] The diffraction pattern DFP can be set in the first insulating layer IL1 and the second insulating layer IL2. (The last sentence appears to be incomplete and possibly refers to a different context.) Figure 5A Compared to the display module DM shown in the image, Figure 8A The diffraction pattern DFP in the display module DM may include a plurality of first diffraction patterns DFP1-1 formed in the first insulating layer IL1 and a plurality of second diffraction patterns DFP1-2 formed in the second insulating layer IL2. The second diffraction patterns DFP1-2 may be configured to correspond to the first diffraction patterns DFP1-1. For example, the second diffraction patterns DFP1-2 may be disposed on the first diffraction patterns DFP1-1.

[0196] Each of the first diffraction patterns DFP1-1 may be a first aperture penetrating the first insulating layer IL1, and each of the second diffraction patterns DFP1-2 may be a second aperture penetrating the second insulating layer IL2. For example, the first insulating layer IL1 includes a plurality of first apertures penetrating the first insulating layer IL1 on the third-direction DR3 and defining the first diffraction pattern DFP1-1. The second insulating layer IL2 includes a plurality of second apertures penetrating the second insulating layer IL2 on the third-direction DR3 and defining the second diffraction pattern DFP1-2. The diffraction pattern DFP may include apertures defined by the first diffraction pattern DFP1-1 and the second diffraction pattern DFP1-2. The second inorganic encapsulation layer T-IL2, which is the topmost layer of the encapsulation layer TFE, may be partially exposed by the diffraction pattern DFP.

[0197] The first diffraction pattern DFP1-1 and the second diffraction pattern DFP1-2 can have the same characteristics as... Figures 6B to 7FThe diffraction patterns DFP and DFP1-DFP4 shown herein have a fundamentally similar structure. Therefore, detailed descriptions of the structure of each of the first diffraction pattern DFP1-1 and the second diffraction pattern DFP1-2 will be omitted to avoid redundancy.

[0198] The first diffraction pattern DFP1-1 and the second diffraction pattern DFP1-2 can be superimposed with the emission regions PXA-R, PXA-G, and PXA-B. The first diffraction pattern DFP1-1 and the second diffraction pattern DFP1-2 can be partially superimposed with the non-emission regions NPXA-G, NPXA-R, and NPXA-B.

[0199] The input sensing unit (ISP) may also include a protective layer (PL). The protective layer (PL) may cover the second insulating layer (IL2) and the second conductive layers (SP1, SP2, and CP2). Additionally, the protective layer (PL) may cover the second inorganic encapsulation layer (T-IL2) exposed by the diffraction pattern (DFP). In other words, the protective layer (PL) may be formed to fill the diffraction pattern (DFP).

[0200] The protective layer PL can be formed of or comprise organic materials. For example, the protective layer PL can be formed of or comprise acrylic resin. The protective layer PL can be thicker than the first insulating layer IL1 and the second insulating layer IL2. Furthermore, the protective layer PL can have a refractive index different from that of the first insulating layer IL1 and the second insulating layer IL2. For example, the protective layer PL can have a refractive index of about 1.6, and the first insulating layer IL1 and the second insulating layer IL2 can have a refractive index of about 1.9. Therefore, light incident on the diffraction patterns DFP1-1 and DFP1-2 can be diffracted by the diffraction patterns DFP1-1 and DFP1-2, and is diffracted due to the refractive index difference between the first insulating layer IL1 and the second insulating layer IL2 and the protective layer PL filling the diffraction patterns DFP1-1 and DFP1-2.

[0201] Reference Figure 8B The first insulating layer IL1 may include a first sub-insulating layer SIL1 and a second sub-insulating layer SIL2. The first sub-insulating layer SIL1 may be directly disposed on the encapsulation layer TFE, and the second sub-insulating layer SIL2 may be disposed on the first sub-insulating layer SIL1. The first sub-insulating layer SIL1 and the second sub-insulating layer SIL2 may be formed of or comprise inorganic materials. In an exemplary embodiment, the first sub-insulating layer SIL1 and the second sub-insulating layer SIL2 may be formed of or comprise the same material. For example, each of the first sub-insulating layer SIL1 and the second sub-insulating layer SIL2 may include a silicon nitride layer, and the first sub-insulating layer SIL1 and the second sub-insulating layer SIL2 may be formed under different deposition conditions.

[0202] The first diffraction pattern DFP1-1 disposed in the first insulating layer IL1 may include a plurality of first sub-diffraction patterns SDFP1 disposed in the first sub-insulating layer SIL1 and a plurality of second sub-diffraction patterns SDFP2 disposed in the second sub-insulating layer SIL2. The second sub-diffraction patterns SDFP2 may be configured to correspond to the first sub-diffraction patterns SDFP1. In addition, the second diffraction pattern DFP1-2 may be configured to correspond to the first diffraction pattern DFP1-1, which includes the first sub-diffraction patterns SDFP1 and the second sub-diffraction patterns SDFP2.

[0203] Each of the first sub-diffraction patterns SDFP1 may be a first sub-via penetrating the first sub-insulating layer SIL1, and each of the second sub-diffraction patterns SDFP2 may be a second sub-via penetrating the second sub-insulating layer SIL2. For example, the first sub-insulating layer SIL1 includes a plurality of first sub-vias penetrating the first sub-insulating layer SIL1 and defining the first sub-diffraction pattern SDFP1 on the third-direction DR3. The second sub-insulating layer SIL2 includes a plurality of second sub-vias penetrating the second sub-insulating layer SIL2 and defining the second sub-diffraction pattern SDFP2 on the third-direction DR3. The diffraction pattern DFP may include a hole defined by the first sub-via SDFP1, the second sub-via SDFP2, and the second diffraction pattern DFP1-2. The second inorganic encapsulation layer T-IL2, which is the topmost layer of the encapsulation layer TFE, may be partially exposed by the diffraction pattern DFP.

[0204] The input sensing unit (ISP) may also include a protective layer (PL). The protective layer (PL) may cover the second insulating layer (IL2) and the second conductive layers (SP1, SP2, and CP2). Additionally, the protective layer (PL) may cover the second inorganic encapsulation layer (T-IL2) exposed by the diffraction pattern (DFP). In other words, the protective layer (PL) may be formed to fill the diffraction pattern (DFP).

[0205] Light incident on diffraction patterns SDFP1, SDFP2 and DFP1-2 can be diffracted by diffraction patterns SDFP1, SDFP2 and DFP1-2, and is diffracted by the refractive index difference between the first insulating layer IL1 and the second insulating layer IL2 and the protective layer PL that fills the diffraction patterns SDFP1, SDFP2 and DFP1-2.

[0206] Figure 9A and Figure 9B yes Figure 1B A cross-sectional view of another exemplary embodiment of the display module.

[0207] Reference Figure 9AThe diffraction pattern DFP can be disposed in the first insulating layer IL1 and the second insulating layer IL2. The diffraction pattern DFP can include a first diffraction pattern DFP1-1 formed in the first insulating layer IL1 and a second diffraction pattern DFP1-2 formed in the second insulating layer IL2. Each of the first diffraction patterns DFP1-1 can be a pore-like structure penetrating the first insulating layer IL1, and each of the second diffraction patterns DFP1-2 can be a pore-like structure penetrating the second insulating layer IL2.

[0208] In an exemplary embodiment, the encapsulation layer TFE may include a third diffraction pattern DFP1-3 configured to correspond to the first diffraction pattern DFP1-1 and the second diffraction pattern DFP1-2. For example, the third diffraction pattern DFP1-3 may be disposed in a second inorganic encapsulation layer T-IL2, which is the topmost layer of the encapsulation layer TFE. Each of the third diffraction patterns DFP1-3 may be a recessed structure (such as a groove) that is recessed relative to the top surface of the second inorganic encapsulation layer T-IL2. However, the exemplary embodiment is not limited thereto. For example, the third diffraction pattern DFP1-3 may be a hole-like structure that penetrates the second inorganic encapsulation layer T-IL2.

[0209] The first diffraction pattern DFP1-1 to the third diffraction pattern DFP1-3 can be formed in the first insulating layer IL1, the second insulating layer IL2, and the second inorganic encapsulation layer T-IL2, respectively, and the protective layer PL can be configured to fill the regions in which the first diffraction pattern DFP1-1 to the third diffraction pattern DFP1-3 are formed. Therefore, light emitted from the emitting layer EML can be diffracted due to the refractive index differences between the second inorganic encapsulation layer T-IL2 and the protective layer PL, and between the first insulating layer IL1, the second insulating layer IL2, and the protective layer PL.

[0210] Reference Figure 9B The encapsulation layer TFE may include a third diffraction pattern DFP1-3 configured to correspond to the first sub-diffraction pattern SDFP1 and the second sub-diffraction pattern SDFP2. For example, the third diffraction pattern DFP1-3 may be disposed in the second inorganic encapsulation layer T-IL2, which is the topmost layer of the encapsulation layer TFE. Each of the third diffraction patterns DFP1-3 may be a recessed structure (such as a groove) that is recessed relative to the top surface of the second inorganic encapsulation layer T-IL2. However, exemplary embodiments are not limited thereto. For example, the third diffraction pattern DFP1-3 may be a hole-like structure that penetrates the second inorganic encapsulation layer T-IL2.

[0211] Figure 10 yes Figure 1B A cross-sectional view of another exemplary embodiment of the display module.

[0212] Reference Figure 10The input sensing unit ISP may further include a third insulating layer IL3 disposed between the protective layer PL and the second insulating layer IL2. The third insulating layer IL3 may be formed of or comprise an inorganic material. For example, the third insulating layer IL3 may comprise a silicon nitride layer. In an exemplary embodiment, the third insulating layer IL3 may be thicker than the first insulating layer IL1 and the second insulating layer IL2.

[0213] In an exemplary embodiment, multiple diffraction patterns DFP2-2 may be disposed in the third insulating layer IL3. The diffraction patterns DFP2-2 may have the same characteristics as... Figures 6B to 7F The diffraction patterns DFP and DFP1-DFP4 shown are fundamentally similar structures. Diffraction pattern DFP2-2 can diffract at least a portion of the light emitted from the emission layer EML. For example, diffraction pattern DFP2-2 can diffract at least a portion of the light incident on the input sensing unit ISP.

[0214] In an exemplary embodiment, each of the diffraction patterns DFP2-2 may be a hole penetrating the third insulating layer IL3. For example, the third insulating layer IL3 may include a plurality of holes penetrating the third insulating layer IL3 on the third-direction DR3 and defining the diffraction pattern DFP2-2. The second insulating layer IL2 may be partially exposed by the diffraction pattern DFP2-2.

[0215] A protective layer PL can be disposed on the third insulating layer IL3. The diffraction pattern DFP2-2 can be filled by the protective layer PL. Therefore, light emitted from each emitting layer EML can be diffracted due to the refractive index difference between the third insulating layer IL3 and the protective layer PL.

[0216] Figure 11A and Figure 11B yes Figure 1B A cross-sectional view of another exemplary embodiment of the display module.

[0217] Reference Figure 11AThe input sensing unit ISP may include a diffraction pattern DFP formed in the second insulating layer IL2. The input sensing unit ISP may also include a fourth insulating layer OL1 disposed below the second insulating layer IL2. The fourth insulating layer OL1 may be disposed between the first insulating layer IL1 and the second insulating layer IL2. The fourth insulating layer OL1 may be formed of or include an organic material. In an exemplary embodiment, the fourth insulating layer OL1 may be formed of or include an acrylic resin. The fourth insulating layer OL1 may be formed of the same organic material as the protective layer PL, but the fourth insulating layer OL1 may be formed under different process conditions than those used for the protective layer PL. For example, each of the fourth insulating layer OL1 and the protective layer PL may be formed of or include a negative photoresist material, and the photocuring temperature of the fourth insulating layer OL1 may be higher than that of the protective layer PL.

[0218] The fourth insulating layer OL1 may be thicker than the first insulating layer IL1. In an exemplary embodiment, the fourth insulating layer OL1 may have a thickness ranging from about 1.0 μm to about 10 μm. Due to the fourth insulating layer OL1 disposed between the first insulating layer IL1 and the second insulating layer IL2, the distance between the diffraction pattern DFP of the second insulating layer IL2 and the organic light-emitting diode OLED can be increased.

[0219] Reference Figure 11B The input sensing unit ISP may further include a fifth insulating layer OL2 disposed below a second insulating layer IL2 having a diffraction pattern DFP. The fifth insulating layer OL2 may be disposed between the first insulating layer IL1 and the encapsulation layer TFE. For example, the fifth insulating layer OL2 may be disposed between the first insulating layer IL1 and the second inorganic encapsulation layer T-IL2. The fifth insulating layer OL2 may be formed of or comprise an organic material. In an exemplary embodiment, the fifth insulating layer OL2 may be formed of or comprise an acrylic resin. The fifth insulating layer OL2 may be formed of the same organic material as the protective layer PL, but in an exemplary embodiment, the fifth insulating layer OL2 may be formed under process conditions different from those used for the protective layer PL. For example, each of the fifth insulating layer OL2 and the protective layer PL may be formed of or comprise a negative photoresist material, and the photocuring temperature of the fifth insulating layer OL2 may be higher than that of the protective layer PL.

[0220] In order to form the desired distance between the diffraction pattern DFP and the organic light-emitting diode OLED, the thickness of each of the fourth insulating layer OL1 and the fifth insulating layer OL2 can be adjusted or at least one of the fourth insulating layer OL1 and the fifth insulating layer OL2 can be omitted.

[0221] Figure 12 It is shown Figure 3 Another exemplary embodiment of the input sensing unit Figure 3 An enlarged plan view of the region "FF", and Figures 13A to 13E It is shown Figure 1B An exemplary embodiment of the display module along Figure 12 A sectional view taken from line IV-IV'.

[0222] Reference Figure 12 The input sensing unit (ISP) may include a red diffraction pattern DFP-R, which is arranged at a substantially constant pitch and diffracts at least a portion of the light incident on the input sensing unit (ISP). The red diffraction pattern DFP-R may be configured to correspond to at least one of pixels PX-R, PX-G, and PX-B. In an exemplary embodiment, the red diffraction pattern DFP-R may be configured to correspond to the first pixel PX-R among the first to third pixels PX-R, PX-G, and PX-B. Therefore, the red diffraction pattern DFP-R can diffract a portion of the red light incident on the input sensing unit (ISP) (i.e., lateral red light). The red diffraction pattern DFP-R may be superimposed on the first emitting region PXA-R among the first to third emitting regions PXA-R, PXA-G, and PXA-B. The red diffraction pattern DFP-R may also be superimposed on a first non-emitting region NPXA-R adjacent to the first emitting region PXA-R.

[0223] The red diffraction pattern DFP-R can be set up without overlapping with the non-pixel region NPA. In other words, the red diffraction pattern DFP-R can be set up in such a way that they are not overlapped with the grid electrode MSE.

[0224] In an exemplary embodiment, the red diffraction pattern DFP-R may have a generally circular shape when viewed in a plane. However, the exemplary embodiment is not limited to a specific shape of the red diffraction pattern DFP-R. For example, the red diffraction pattern DFP-R may be configured to have various shapes (e.g., generally polygonal, generally elliptical, and generally elongated).

[0225] Reference Figure 3 , Figure 12 and Figure 13A The input sensing unit ISP may include a first insulating layer IL1, a first conductive layer thereon, a second insulating layer IL2 covering the first conductive layer, and a second conductive layer disposed on the second insulating layer IL2.

[0226] A first conductive layer may be disposed on a first insulating layer IL1. The first conductive layer may include a first connecting portion CP1. The second conductive layer may include a first sensing portion SP1, a second sensing portion SP2, and a second connecting portion CP2.

[0227] A second insulating layer IL2 can be disposed between the first conductive layer and the second conductive layer. When viewed in cross-section, the second insulating layer IL2 can separate the first conductive layer from the second conductive layer.

[0228] The first insulating layer IL1 and the second insulating layer IL2 may be formed of or comprise inorganic materials. For example, either or at least one of the first insulating layer IL1 and the second insulating layer IL2 may comprise a silicon nitride layer. In an exemplary embodiment, the second insulating layer IL2 may be thicker than the first insulating layer IL1.

[0229] The red diffraction pattern DFP-R can be formed in at least one of the first insulating layer IL1 and the second insulating layer IL2. In an exemplary embodiment, as shown... Figure 13A As shown, the red diffraction pattern DFP-R can be formed in the second insulating layer IL2, but the exemplary embodiments are not limited thereto.

[0230] The red diffraction pattern DFP-R can be disposed in the first emission region PXA-R among the first emission regions to the third emission regions PXA-R, PXA-G, and PXA-B. The red diffraction pattern DFP-R can be arranged with a substantially constant pitch. The red diffraction pattern DFP-R can diffract a portion of the light emitted from the emission layer EML (hereinafter, red light) in the first emission region PXA-R. For example, the red diffraction pattern DFP-R can diffract a portion of the red light propagating in the lateral direction (i.e., lateral red light).

[0231] Figure 13A The diagram illustrates a structure in which the red diffraction pattern DFP-R is configured to correspond to the first pixel PX-R, but the exemplary embodiment is not limited thereto. In the exemplary embodiment, the red diffraction pattern DFP-R may be configured to correspond to at least one of the first to third pixels PX-R, PX-G, and PX-B. For example, the red diffraction pattern DFP-R may be configured to correspond to either the second pixel PX-G or the third pixel PX-B among the first to third pixels PX-R, PX-G, and PX-B, or it may be configured to correspond to some of the first to third pixels PX-R, PX-G, and PX-B (e.g., the first pixel PX-R and the second pixel PX-G, the first pixel PX-R and the third pixel PX-B, or the second pixel PX-G and the third pixel PX-B).

[0232] Reference Figure 13BThe red diffraction pattern DFP-R may be included in the first insulating layer IL1 and the second insulating layer IL2 to correspond to the first emission region PXA-R. The red diffraction pattern DFP-R may include a plurality of first diffraction patterns DFP1-R formed in the first insulating layer IL1 and a plurality of second diffraction patterns DFP2-R formed in the second insulating layer IL2.

[0233] Each of the first diffraction patterns DFP1-R may be a first aperture penetrating the first insulating layer IL1, and each of the second diffraction patterns DFP2-R may be a second aperture penetrating the second insulating layer IL2. For example, the first insulating layer IL1 may include a plurality of first apertures penetrating the third-direction DR3 to define the first diffraction pattern DFP1-R. The second insulating layer IL2 may include a plurality of second apertures penetrating the third-direction DR3 to define the second diffraction pattern DFP2-R. The red diffraction pattern DFP-R may include apertures defined by the first diffraction pattern DFP1-R and the second diffraction pattern DFP2-R. The second inorganic encapsulation layer T-IL2, which is the topmost layer of the encapsulation layer TFE, may be partially exposed by the diffraction pattern DFP-R.

[0234] The first diffraction pattern DFP1-R and the second diffraction pattern DFP2-R can have the same characteristics as... Figures 6B to 7F The diffraction patterns DFP and DFP1-DFP4 shown herein have a fundamentally similar structure. Therefore, detailed descriptions of the structure of each of the first diffraction pattern DFP1-R and the second diffraction pattern DFP2-R will be omitted to avoid redundancy.

[0235] Reference Figure 13C The first insulating layer IL1 may include a first sub-insulating layer SIL1 and a second sub-insulating layer SIL2. The first sub-insulating layer SIL1 may be directly disposed on the encapsulation layer TFE, and the second sub-insulating layer SIL2 may be disposed on the first sub-insulating layer SIL1. The first sub-insulating layer SIL1 and the second sub-insulating layer SIL2 may be formed of or comprise inorganic materials. In an exemplary embodiment, the first sub-insulating layer SIL1 and the second sub-insulating layer SIL2 may be formed of or comprise the same material. For example, each of the first sub-insulating layer SIL1 and the second sub-insulating layer SIL2 may include a silicon nitride layer, and the first sub-insulating layer SIL1 and the second sub-insulating layer SIL2 may be formed under different deposition conditions.

[0236] The first diffraction pattern DFP1-R disposed in the first insulating layer IL1 to correspond to the first emission region PXA-R may include a plurality of first sub-diffraction patterns SDFP1-R disposed in the first sub-insulating layer SIL1 and a plurality of second sub-diffraction patterns SDFP2-R disposed in the second sub-insulating layer SIL2. The second sub-diffraction pattern SDFP2-R may be configured to correspond to the first sub-diffraction pattern SDFP1-R. Furthermore, the second diffraction pattern DFP2-R may be configured to correspond to both the first sub-diffraction pattern SDFP1-R and the second sub-diffraction pattern SDFP2-R.

[0237] Each of the first sub-diffraction patterns SDFP1-R may be a first sub-via penetrating the first sub-insulating layer SIL1, and each of the second sub-diffraction patterns SDFP2-R may be a second sub-via penetrating the second sub-insulating layer SIL2. For example, the first sub-insulating layer SIL1 may include a plurality of first sub-vias penetrating the first sub-insulating layer SIL1 on the third-direction DR3 to define the first sub-diffraction pattern SDFP1-R. The second sub-insulating layer SIL2 may include a plurality of second sub-vias penetrating the second sub-insulating layer SIL2 on the third-direction DR3 to define the second sub-diffraction pattern SDFP2-R. The red diffraction pattern DFP-R may include a hole defined by the first sub-via SDFP1-R, the second sub-via SDFP2-R, and the second diffraction pattern DFP2-R. The second inorganic encapsulation layer T-IL2, which is the topmost layer of the encapsulation layer TFE, may be partially exposed by the holes of the red diffraction pattern DFP-R.

[0238] Reference Figure 13D The red diffraction pattern DFP-R can be formed in the first insulating layer IL1 and the second insulating layer IL2 to correspond to the first emission region PXA-R. For example, the first diffraction pattern DFP1-R can be formed in the first insulating layer IL1, and the second diffraction pattern DFP2-R can be formed in the second insulating layer IL2.

[0239] In an exemplary embodiment, the encapsulation layer TFE may include a third diffraction pattern DFP3-R configured to correspond to the first diffraction pattern DFP1-R and the second diffraction pattern DFP2-R. For example, the third diffraction pattern DFP3-R may be disposed in the second inorganic encapsulation layer T-IL2, which is the topmost layer of the encapsulation layer TFE. The third diffraction pattern DFP3-R may be a recessed structure that is recessed relative to the top surface of the second inorganic encapsulation layer T-IL2. However, the exemplary embodiment is not limited thereto. For example, in an exemplary embodiment, the third diffraction pattern DFP3-R may be a hole-like structure that penetrates the second inorganic encapsulation layer T-IL2.

[0240] As an example, the first insulating layer IL1 includes Figure 13CIn the case of a first sub-insulating layer SIL1 and a second sub-insulating layer SIL2, the first diffraction pattern DFP1-R disposed in the first insulating layer IL1 may include a first sub-diffraction pattern SDFP1-R disposed in the first sub-insulating layer SIL1 (for example, see...). Figure 13C ) and the second sub-diffraction pattern SDFP2-R disposed in the second sub-insulating layer SIL2 (for example, see Figure 13C In this case, the third diffraction pattern DFP3-R of the encapsulation layer TFE can be set to correspond to the first sub-diffraction pattern SDFP1-R and the second sub-diffraction pattern SDFP2-R.

[0241] Reference Figure 13E The input sensing unit ISP may further include a third insulating layer IL3 disposed between the protective layer PL and the second insulating layer IL2. The third insulating layer IL3 may be formed of or comprise an inorganic material. For example, the third insulating layer IL3 may comprise a silicon nitride layer. In an exemplary embodiment, the third insulating layer IL3 may be thicker than the first insulating layer IL1 and the second insulating layer IL2.

[0242] In an exemplary embodiment, a plurality of red diffraction patterns DFP4-R may be disposed in the third insulating layer IL3 to correspond to the first emitting region PXA-R. The red diffraction patterns DFP4-R may have the same characteristics as... Figures 6B to 7F The diffraction patterns DFP and DFP1-DFP4 shown are substantially similar in structure. The red diffraction pattern DFP4-R can diffract at least a portion of the red light emitted from the emission layer EML of the first pixel PX-R. For example, the red diffraction pattern DFP4-R can diffract at least a portion of the red light propagating toward the input sensing unit ISP.

[0243] In an exemplary embodiment, each of the red diffraction pattern DFP4-R may be a hole penetrating the third insulating layer IL3. For example, the third insulating layer IL3 may include a plurality of third holes penetrating the third insulating layer IL3 on the third-direction DR3 and defined as the red diffraction pattern DFP4-R. The second insulating layer IL2 may be partially exposed by the red diffraction pattern DFP4-R.

[0244] A protective layer PL can be disposed on the third insulating layer IL3. Multiple diffraction patterns DFP4-R can be filled by the protective layer PL. Therefore, red light emitted from each emitting layer EML can be diffracted due to the refractive index difference between the third insulating layer IL3 and the protective layer PL, and diffracted by the red diffraction pattern DFP4-R.

[0245] Figure 14A It is a graph showing the brightness ratio of red, green, and blue light relative to the viewing angle. Figure 14BIt is a graph showing the correlated color temperature (CCT) characteristics relative to the viewing angle, and Figure 14C It is a graph showing the minimum perceptible chromatic aberration (MPCD) characteristics relative to the viewing angle.

[0246] exist Figure 14A In the diagram, the first R-curve G-R1 shows the change in the luminance ratio of red light relative to the viewing angle in a comparative example, where the diffraction pattern is not formed in the first to third pixels PX-R, PX-G, and PX-B. The G-curve GG shows the change in the luminance ratio of green light relative to the viewing angle in a comparative example, where the diffraction pattern is not formed in the first to third pixels PX-R, PX-G, and PX-B. The B-curve GB shows the change in the luminance ratio of blue light relative to the viewing angle in a comparative example, where the diffraction pattern is not formed in the first to third pixels PX-R, PX-G, and PX-B. The second R-curve G-R2 shows the change in the luminance ratio of red light relative to the viewing angle in an exemplary embodiment, where the red diffraction pattern DFP-R is formed corresponding to the first pixel PX-R.

[0247] exist Figure 14B In the first graph G1, the correlation color temperature (CCT) characteristic changes with viewing angle in a comparative example where the diffraction pattern is not formed in the first to third pixels PX-R, PX-G, and PX-B. The second graph G2 shows the CCT characteristic changes with viewing angle in an exemplary embodiment where the red diffraction pattern DFP-R is formed corresponding to the first pixel PX-R.

[0248] exist Figure 14C In the comparison example, the third graph G3 shows the change of the minimum perceptible color difference (MPCD) characteristic with respect to the viewing angle, in which the diffraction pattern is not formed in the first to third pixels PX-R, PX-G and PX-B. The fourth graph G4 shows the change of the MPCD characteristic with respect to the viewing angle in an exemplary embodiment, in which the red diffraction pattern DFP-R is formed corresponding to the first pixel PX-R.

[0249] Figure 14AThe illustration shows a comparative example where the diffraction pattern is not formed in the first to third pixels PX-R, PX-G, and PX-B. As the viewing angle increases, the brightness ratio of green light increases, but the brightness ratio of red and blue light decreases. However, when the red diffraction pattern DFP-R is formed corresponding to the first pixel PX-R, the brightness ratio of red light remains essentially constant even as the viewing angle increases. This indicates that when red light emitted from the first pixel PX-R is diffracted by the red diffraction pattern DFP-R, the brightness ratio of red light in the lateral direction can be increased. Furthermore, this result shows that the viewing angle can be increased, and the phenomenon where green light is more clearly identified as green can be improved.

[0250] In comparison, such as Figure 14B and Figure 14C As shown, when the red diffraction pattern DFP-R is formed to correspond to the first pixel PX-R, the change in CCT characteristics caused by the change in viewing angle is reduced compared to the comparative example. Furthermore, when the red diffraction pattern DFP-R is formed to correspond to the first pixel PX-R, the rate of increase in MPCD characteristics is reduced even when the viewing angle increases compared to the comparative example.

[0251] As mentioned above, when the diffraction pattern DFP-R is set in a specific pixel PX-R, it is possible to improve the phenomenon that light of a specific color is more clearly identified, and thus improve the overall viewing characteristics.

[0252] Figure 15 It is shown Figure 3 Another exemplary embodiment of the input sensing unit Figure 3 A magnified plan view of region "FF". Figures 16A to 16C It is shown Figure 1B The display module along Figure 15 The sectional view taken by line V-V'.

[0253] Reference Figure 15The input sensing unit (ISP) may include a plurality of diffraction patterns DFP-R and DFP-B, which are arranged at a substantially constant pitch and diffract at least a portion of the light incident on the input sensing unit (ISP). The diffraction patterns DFP-R and DFP-B may be configured to correspond to at least one of pixels PX-R, PX-G, and PX-B (e.g., two pixels). In an exemplary embodiment, the diffraction patterns DFP-R and DFP-B may include a plurality of red diffraction patterns DFP-R and a plurality of blue diffraction patterns DFP-B. The red diffraction pattern DFP-R may be configured to correspond to the first pixel PX-R among the first to third pixels PX-R, PX-G, and PX-B, and the blue diffraction pattern DFP-B may be configured to correspond to the third pixel PX-B among the first to third pixels PX-R, PX-G, and PX-B. In an exemplary embodiment, the diffraction pattern may include a green diffraction pattern configured to correspond to the second pixel PX-G and a blue diffraction pattern DFP-B configured to correspond to the third pixel PX-B.

[0254] The red diffraction pattern DFP-R can diffract a portion of the red light incident on the input sensing unit ISP, and the blue diffraction pattern DFP-B can diffract a portion of the blue light incident on the input sensing unit ISP.

[0255] The red diffraction pattern DFP-R and the blue diffraction pattern DFP-B can be superimposed on the first emission region PXA-R and the third emission region PXA-B, respectively, from the first emission region to the third emission region PXA-R, PXA-G, and PXA-B. The red diffraction pattern DFP-R can also be superimposed on the first non-emission region NPXA-R adjacent to the first emission region PXA-R, and the blue diffraction pattern DFP-B can also be superimposed on the third non-emission region NPXA-B adjacent to the third emission region PXA-B.

[0256] The red diffraction pattern DFP-R and the blue diffraction pattern DFP-B can be separated from the non-pixel region NPA. In other words, the diffraction patterns DFP-R and DFP-B can be configured in such a way that they are not superimposed on the grid electrode MSE.

[0257] In an exemplary embodiment, the red diffraction pattern DFP-R and the blue diffraction pattern DFP-B may have a generally circular shape when viewed in a plane. However, the exemplary embodiment is not limited to the specific shapes of the red diffraction pattern DFP-R and the blue diffraction pattern DFP-B. In an exemplary embodiment, the red diffraction pattern DFP-R and the blue diffraction pattern DFP-B may have the same shape when viewed in a plane. However, the exemplary embodiment is not limited to this. For example, the red diffraction pattern DFP-R and the blue diffraction pattern DFP-B may have different shapes when viewed in a plane.

[0258] Reference Figure 3 , Figure 15 and Figure 16A The input sensing unit ISP may include a first insulating layer IL1, a first conductive layer thereon, a second insulating layer IL2 covering the first conductive layer, and a second conductive layer disposed on the second insulating layer IL2.

[0259] The red diffraction pattern DFP-R and the blue diffraction pattern DFP-B can be formed in at least one of the first insulating layer IL1 and the second insulating layer IL2. Figure 16A The red diffraction pattern DFP-R and the blue diffraction pattern DFP-B formed in the second insulating layer IL2 are shown, but the exemplary embodiments are not limited thereto.

[0260] A red diffraction pattern DFP-R can be disposed in the first emission region PXA-R among the first to third emission regions PXA-R, PXA-G, and PXA-B, and a blue diffraction pattern DFP-B can be disposed in the third emission region PXA-B. The red and blue diffraction patterns DFP-R and DFP-B can be arranged with a substantially constant pitch. The red diffraction pattern DFP-R can diffract at least a portion of the light emitted from the emission layer EML (hereinafter, red light) in the first emission region PXA-R. For example, the red diffraction pattern DFP-R can diffract at least a portion of the red light propagating toward the input sensing unit ISP. The blue diffraction pattern DFP-B can diffract at least a portion of the light emitted from the emission layer EML (hereinafter, blue light) in the third emission region PXA-B. For example, the blue diffraction pattern DFP-B can diffract at least a portion of the blue light propagating toward the input sensing unit ISP.

[0261] Reference Figure 16BA red diffraction pattern DFP-R can be formed in the first insulating layer IL1 and the second insulating layer IL2 to correspond to the first emitting region PXA-R, and a blue diffraction pattern DFP-B can be formed in the first insulating layer IL1 and the second insulating layer IL2 to correspond to the third emitting region PXA-B. The red diffraction pattern DFP-R can include multiple first red diffraction patterns DFP1-R formed in the first insulating layer IL1 and multiple second red diffraction patterns DFP2-R formed in the second insulating layer IL2. Specifically, the second red diffraction pattern DFP2-R can be configured to correspond to the first red diffraction pattern DFP1-R. For example, the second red diffraction pattern DFP2-R can be disposed on the first red diffraction pattern DFP1-R. The blue diffraction pattern DFP-B can include multiple first blue diffraction patterns DFP1-B formed in the first insulating layer IL1 and multiple second blue diffraction patterns DFP2-B formed in the second insulating layer IL2. Specifically, the second blue diffraction pattern DFP2-B can be configured to correspond to the first blue diffraction pattern DFP1-B. In other words, the second blue diffraction pattern DFP2-B can be set on the first blue diffraction pattern DFP1-B.

[0262] Each of the first red diffraction pattern DFP1-R and the first blue diffraction pattern DFP1-B may be a hole-like structure penetrating the first insulating layer IL1, and each of the second red diffraction pattern DFP2-R and the second blue diffraction pattern DFP2-B may be a hole-like structure penetrating the second insulating layer IL2. For example, the first insulating layer IL1 may include a plurality of first red holes and a plurality of first blue holes formed to penetrate the first insulating layer IL1 in the third direction DR3. The plurality of first red holes may be defined as the first red diffraction pattern DFP1-R, and the plurality of first blue holes may be defined as the first blue diffraction pattern DFP1-B. The second insulating layer IL2 may include a plurality of second red holes and a plurality of second blue holes formed to penetrate the second insulating layer IL2 in the third direction DR3. The plurality of second red holes may be defined as the second red diffraction pattern DFP2-R, and the plurality of second blue holes may be defined as the second blue diffraction pattern DFP2-B. The red diffraction pattern DFP-R may include a first aperture defined by a first red diffraction pattern DFP1-R and a second red diffraction pattern DFP2-R, and the blue diffraction pattern DFP-B may include a second aperture defined by a first blue diffraction pattern DFP1-B and a second blue diffraction pattern DFP2-B. The second inorganic encapsulation layer T-IL2, which is the top layer of the encapsulation layer TFE, may be partially exposed by the first diffraction pattern DFP-R and the second diffraction pattern DFP-B.

[0263] The red diffraction pattern DFP-R and the blue diffraction pattern DFP-B can have the same characteristics as... Figures 6B to 7FThe diffraction patterns DFP and DFP1-DFP4 shown have a fundamentally similar structure. Therefore, detailed descriptions of the structure of each of the red diffraction pattern DFP-R and the blue diffraction pattern DFP-B will be omitted to avoid redundancy.

[0264] In an exemplary embodiment, the first insulating layer IL1 may include Figure 13C The diagram shows a first sub-insulating layer SIL1 and a second sub-insulating layer SIL2. In this case, the first red diffraction pattern DFP1-R may include a first sub-red diffraction pattern disposed in the first sub-insulating layer SIL1 and a second sub-red diffraction pattern disposed in the second sub-insulating layer SIL2. Similarly, the first blue diffraction pattern DFP1-B may include a first sub-blue diffraction pattern disposed in the first sub-insulating layer SIL1 and a second sub-blue diffraction pattern disposed in the second sub-insulating layer SIL2.

[0265] Furthermore, a third red diffraction pattern corresponding to the first red diffraction pattern DFP1-R and a third blue diffraction pattern corresponding to the first blue diffraction pattern DFP1-B can be disposed in the encapsulation layer TFE. When the first insulating layer IL1 includes a first sub-insulating layer SIL1 and a second sub-insulating layer SIL2, the first sub-red diffraction pattern and the second sub-red diffraction pattern can be configured to correspond to the third red diffraction pattern disposed in the encapsulation layer TFE. Additionally, when the first insulating layer IL1 includes a first sub-insulating layer SIL1 and a second sub-insulating layer SIL2, the first sub-blue diffraction pattern and the second sub-blue diffraction pattern can be configured to correspond to the third blue diffraction pattern disposed in the encapsulation layer TFE.

[0266] Reference Figure 16C The input sensing unit ISP may also include a third insulating layer IL3 disposed between the protective layer PL and the second insulating layer IL2.

[0267] In an exemplary embodiment, a plurality of red diffraction patterns DFP4-R may be disposed in the third insulating layer IL3 to correspond to the first emitting region PXA-R, and a plurality of blue diffraction patterns DFP4-B may be disposed in the third insulating layer IL3 to correspond to the third emitting region PXA-B. Each of the red diffraction pattern DFP4-R and the blue diffraction pattern DFP4-B may have the same characteristics as... Figures 6B to 7F The diffraction patterns DFP and DFP1-DFP4 shown are substantially similar in structure. The red diffraction pattern DFP4-R can diffract at least a portion of the red light emitted from the emission layer EML of the first pixel PX-R, and the blue diffraction pattern DFP4-B can diffract at least a portion of the blue light emitted from the emission layer EML of the third pixel PX-B.

[0268] In an exemplary embodiment, each of the red diffraction pattern DFP4-R and the blue diffraction pattern DFP4-B may be a porous structure penetrating the third insulating layer IL3. Therefore, the second insulating layer IL2 may be partially exposed by the red diffraction pattern DFP4-R and the blue diffraction pattern DFP4-B.

[0269] A protective layer PL can be disposed on the third insulating layer IL3. The red diffraction pattern DFP4-R and the blue diffraction pattern DFP4-B can be filled by the protective layer PL. Therefore, the red and blue light emitted from each emitting layer EML can be diffracted due to the refractive index difference between the third insulating layer IL3 and the protective layer PL.

[0270] Figure 17A It is a graph showing the correlated color temperature (CCT) characteristics relative to the viewing angle. Figure 17B It is a graph showing the minimum perceptible chromatic aberration (MPCD) characteristics relative to the viewing angle.

[0271] exist Figure 17A In the comparison example, the fifth graph G5 shows the change of CCT characteristics relative to the viewing angle. In the comparison example, the diffraction pattern is not formed in the first to third pixels PX-R, PX-G, and PX-B. The sixth graph G6 shows the change of CCT characteristics relative to the viewing angle in the exemplary embodiment. In the exemplary embodiment, the red diffraction pattern DFP-R and the blue diffraction pattern DFP-B are formed corresponding to the first pixel PX-R and the third pixel PX-B, respectively.

[0272] exist Figure 17B In the above, the seventh graph G7 shows the change of MPCD characteristics relative to the viewing angle in the comparative example, in which the diffraction pattern is not formed in the first to third pixels PX-R, PX-G and PX-B. The eighth graph G8 shows the change of MPCD characteristics relative to the viewing angle in the exemplary embodiment, in which the red diffraction pattern DFP-R and the blue diffraction pattern DFP-B are formed corresponding to the first pixel PX-R and the third pixel PX-B, respectively.

[0273] like Figure 17A and Figure 17B As shown, compared to the comparative example, when the red diffraction pattern DFP-R and the blue diffraction pattern DFP-B are formed corresponding to the first pixel PX-R and the third pixel PX-B, respectively, the change in CCT characteristics caused by the change in viewing angle is reduced. Furthermore, compared to the comparative example, when the red diffraction pattern DFP-R and the blue diffraction pattern DFP-B are formed corresponding to the first pixel PX-R and the third pixel PX-B, respectively, the rate of increase in MPCD characteristics is reduced even when the viewing angle increases.

[0274] As described above, when the diffraction patterns DFP-R and DFP-B are respectively set in specific pixels PX-R and PX-B, it is possible to improve the phenomenon that light of a specific color is more clearly identified, and thus improve the overall viewing characteristics.

[0275] Figure 18 yes Figure 1B A plan view of another exemplary embodiment of the input sensing unit of the display device. Figure 19 yes Figure 1B A cross-sectional view of another exemplary embodiment of the display module.

[0276] Reference Figure 18 The input sensing unit ISP2 may include multiple sensing electrodes IE and multiple signal lines SL. The sensing electrodes IE may have specific coordinate information. For example, the sensing electrodes IE may be arranged in a matrix shape and each may be connected to a signal line SL. The sensing electrodes IE and signal lines SL may be disposed in an effective region AA. Each signal line SL may include a portion disposed in the effective region AA and another portion disposed in a peripheral region NAA. In the illustrated exemplary embodiment, the input sensing unit ISP2 may be configured to acquire coordinate information of an external input in a self-capacitance manner.

[0277] The input sensing unit ISP2 can extend from the end of the signal line SL and may include an input pad I-PD disposed in the peripheral region NAA. According to the illustrated embodiment, the pad portion PLD of the input sensing unit ISP2 may have a similar shape to... Figure 3 The pad portion of the input sensing unit ISP shown in the figure has a basically similar structure to the PLD.

[0278] In the exemplary embodiment shown, each of the sensing electrodes IE may have a grid shape.

[0279] like Figure 19 As shown, the input sensing unit ISP2 may include an insulating layer IL, a conductive layer disposed on the insulating layer IL, and a protective layer PL covering the conductive layer. The insulating layer IL may be formed of or include inorganic materials. For example, the insulating layer IL may include a silicon nitride layer. The conductive layer may be disposed on the insulating layer IL. The conductive layer may include sensing electrodes IE.

[0280] Multiple diffraction patterns DFP5 can be formed in the insulating layer IL. The diffraction patterns DFP5 can be arranged with a substantially constant pitch and can diffract at least a portion of the light emitted from the emitting layer EML. For example, the diffraction patterns DFP5 can diffract at least a portion of the light propagating towards the input sensing unit ISP2. Each of the diffraction patterns DFP5 can be a hole-like structure penetrating the insulating layer IL. Therefore, the top surface of the encapsulation layer TFE can be partially exposed by the diffraction patterns DFP5.

[0281] The diffraction pattern DFP5 can be superimposed with the emitting regions PXA-G, PXA-R, and PXA-B. The diffraction pattern DFP5 can also be partially superimposed with the non-emitting regions NPXA-G, NPXA-R, and NPXA-B.

[0282] The diffraction pattern DFP5 may not be superimposed on the non-pixel region NPA. The sensing electrode IE may be configured to correspond to the non-pixel region NPA. Therefore, the diffraction patterns DFP5 can be configured in such a way that they are not superimposed on the sensing electrode IE.

[0283] The protective layer PL can cover the top surface of the encapsulation layer TFE exposed by the diffraction pattern DFP5. For example, the protective layer PL can be formed to fill multiple holes in the diffraction pattern DFP5.

[0284] The protective layer PL may be formed of or comprise organic materials. The protective layer PL may be formed of or comprise acrylic resin. The protective layer PL may be thicker than the insulating layer IL. Furthermore, the protective layer PL may have a different refractive index than the insulating layer IL. For example, the protective layer PL may have a refractive index of about 1.6, and the insulating layer IL may have a refractive index of about 1.9.

[0285] Figure 19 The diagram illustrates a structure in which the diffraction pattern DFP5 is configured to correspond to each of the first to third emission regions PXA-R, PXA-G, and PXA-B. However, the exemplary embodiments are not limited thereto. For example, the diffraction pattern DFP5 may be configured to correspond to some of the emission regions of the first to third emission regions PXA-R, PXA-G, and PXA-B (e.g., the first emission region PXA-R, or the first emission region PXA-R and the third emission region PXA-B).

[0286] Figure 20 yes Figure 1B A cross-sectional view of another exemplary embodiment of the display module. Figure 21 yes Figure 1B A cross-sectional view of another exemplary embodiment of the display module. Figure 22 yes Figure 1B A cross-sectional view of another exemplary embodiment of the display module. Figure 23 yes Figure 1B A cross-sectional view of another exemplary embodiment of the display module.

[0287] Reference Figure 20 The display module DM may include a diffraction pattern layer DFL configured to diffract at least a portion of the light emitted from the display panel DP. The diffraction pattern layer DFL may be formed of or include one of inorganic and organic materials.

[0288] The diffraction pattern layer DFL may include diffraction patterns DFP-R arranged at a substantially constant pitch. In an exemplary embodiment, the diffraction pattern layer DFL may be directly disposed on the input sensing unit ISP3. For example, the diffraction pattern layer DFL may be disposed on the protective layer PL of the input sensing unit ISP3.

[0289] The diffraction pattern DFP-R may include a red diffraction pattern DFP-R set to correspond to at least one of the first to third pixels PX-R, PX-G and PX-B (e.g., the first pixel PX-R).

[0290] Each of the red diffraction patterns DFP-R can be a hole that penetrates the diffraction pattern layer DFL. For example, the diffraction pattern layer DFL can include holes that penetrate the diffraction pattern layer DFL and serve as holes in the red diffraction pattern DFP-R. The protective layer PL, which is the topmost layer of the input sensing unit ISP3, can be partially exposed by the diffraction pattern DFP-R.

[0291] The red diffraction pattern DFP-R can be superimposed on the first emission region PXA-R among emission regions PXA-R, PXA-G, and PXA-B. Additionally, the red diffraction pattern DFP-R can be partially superimposed on the first non-emission region NPXA-R surrounding the first emission region PXA-R.

[0292] The first adhesive film AF1 and the anti-reflection unit RPP can be disposed on the diffraction pattern layer DFL. The anti-reflection unit RPP can be bonded to the diffraction pattern layer DFL through the first adhesive film AF1. The first adhesive film AF1 can be formed to fill the diffraction pattern DFP-R. However, the exemplary embodiment is not limited thereto. In the exemplary embodiment, an air layer can be formed in the diffraction pattern DFP-R.

[0293] In an exemplary embodiment, a capping layer may be further disposed between the diffraction pattern layer DFL and the first adhesive film AF1. The capping layer may be formed of or comprise organic or inorganic materials. Here, organic materials may include at least one selected from acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin. Furthermore, inorganic materials may include at least one selected from alumina, titanium dioxide, silicon dioxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0294] Reference Figure 22The diffraction pattern layer DFL can be disposed between the display panel DP and the input sensing unit ISP3. In an exemplary embodiment, the diffraction pattern layer DFL can be directly disposed on the display panel DP. For example, the diffraction pattern layer DFL can be directly disposed on the encapsulation layer TFE of the display panel DP. In this case, the second inorganic encapsulation layer T-IL2, which is the topmost layer of the encapsulation layer TFE, can be partially exposed by the diffraction pattern DFP-R. In this case, the first insulating layer IL1 of the input sensing unit ISP3 can be formed to fill the diffraction pattern DFP-R.

[0295] Reference Figure 21 and Figure 23 The diffraction pattern layer DFL may include a red diffraction pattern DFP-R set to correspond to the first pixel PX-R among the first to third pixels PX-R, PX-G and PX-B, and a blue diffraction pattern DFP-B set to correspond to the third pixel PX-B.

[0296] exist Figure 21 In the display module DM, in addition to the separately set blue diffraction pattern DFP-B, the diffraction pattern layer DFL can have the same characteristics as... Figure 20 The display module DM (i.e., diffraction pattern layer DFL) has a basically the same structure.

[0297] exist Figure 23 In the display module DM, in addition to the separately set blue diffraction pattern DFP-B, the diffraction pattern layer DFL can have the same characteristics as... Figure 22 The display module DM (i.e., diffraction pattern layer DFL) has a basically the same structure.

[0298] While certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but is limited to the broader scope of the appended claims and various obvious modifications and equivalent arrangements as will be apparent to those skilled in the art.

Claims

1. A display device, the display device comprising: Display panel, including light-emitting devices for emitting light; as well as The input sensor is located on the display panel. The input sensor includes: a first insulating layer disposed on the display panel; a first conductive layer disposed on the first insulating layer; a second insulating layer covering the first conductive layer; and a second conductive layer disposed on the second insulating layer. Wherein, at least one of the first insulating layer and the second insulating layer includes a plurality of diffraction patterns not covered thereunder and arranged to diffract at least a portion of the light provided from the display panel, and The plurality of diffraction patterns are not superimposed on the first conductive layer and the second conductive layer.

2. The display device according to claim 1, wherein, The plurality of diffraction patterns are disposed in the second insulating layer.

3. The display device according to claim 1, wherein, The plurality of diffraction patterns are disposed in the first insulating layer.

4. The display device according to claim 1, wherein, The plurality of diffraction patterns include: Multiple first diffraction patterns are disposed in the first insulating layer; and Multiple second diffraction patterns are disposed in the second insulating layer.

5. The display device according to claim 4, wherein, The first insulating layer has a multilayer structure comprising at least two stacked sub-insulating layers.

6. The display device according to claim 5, wherein, The plurality of first diffraction patterns include: Multiple first sub-diffraction patterns are disposed in the first sub-insulating layer of the first insulating layer; and Multiple second sub-diffraction patterns are disposed in the second sub-insulating layer of the first insulating layer and superimposed on the multiple first sub-diffraction patterns. The plurality of second diffraction patterns and the plurality of second sub-diffraction patterns are disposed in the second insulating layer in an overlapping manner.

7. The display device according to claim 1, wherein: The display panel also includes an encapsulation layer covering the light-emitting device, and The first insulating layer is disposed directly on the encapsulation layer.

8. The display device according to claim 7, wherein, The encapsulation layer includes: The first encapsulation layer covers multiple pixels; A second encapsulation layer is disposed on the first encapsulation layer; and The third encapsulation layer is disposed on the second encapsulation layer. The first insulating layer is disposed on the third encapsulation layer.

9. The display device according to claim 8, wherein: The first insulating layer has a multilayer structure comprising at least two stacked sub-insulating layers, and The plurality of diffraction patterns include: a plurality of first diffraction patterns disposed in the at least two stacked sub-insulating layers; and a plurality of second diffraction patterns disposed in the second insulating layer.

10. The display device according to claim 9, wherein, The plurality of diffraction patterns also include a plurality of third diffraction patterns disposed in the third encapsulation layer, superimposed on the plurality of first diffraction patterns.

11. The display device according to claim 1, wherein, The plurality of diffraction patterns include a plurality of holes penetrating at least one of the first insulating layer and the second insulating layer.

12. The display device according to claim 11, wherein, The plurality of holes have one of the following shapes: circular, polygonal, elliptical, and elongated.

13. The display device according to claim 1, wherein, The plurality of diffraction patterns are columnar structures disposed in at least one of the first insulating layer and the second insulating layer.

14. The display device according to claim 13, wherein, The columnar structure has one of the following shapes: circular, polygonal, elliptical, and elongated.

15. The display device according to claim 1, wherein: The input sensor also includes a protective layer disposed on the second insulating layer, and Each of the first insulating layer and the second insulating layer has a refractive index different from that of the protective layer.

16. The display device according to claim 1, wherein: The display panel includes multiple pixels, and Each of the plurality of pixels includes: an emitting region for emitting light, wherein the light-emitting device is disposed in the emitting region; and a non-emitting region adjacent to the emitting region.

17. The display device according to claim 16, wherein, The plurality of diffraction patterns are superimposed on the emission region at least once.

18. The display device according to claim 16, wherein, The plurality of diffraction patterns are superimposed on the non-emission region.

19. The display device according to claim 1, wherein: The display panel includes a plurality of pixels, including a first pixel for emitting a first light, a second pixel for emitting a second light having a wavelength different from that of the first light, and a third pixel for emitting a third light having a wavelength different from both the wavelength of the first light and the wavelength of the second light. The plurality of diffraction patterns are superimposed on at least one of the first to the third pixels.

20. The display device according to claim 19, wherein, The plurality of diffraction patterns are superimposed on the first pixel.

21. The display device according to claim 19, wherein, The plurality of diffraction patterns are superimposed on the first pixel and the third pixel.

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