Anode assembly

Abstract

The anode assembly provided by the present invention can easily pull the anode up from the electroplating tank. The anode assembly (30) comprises an anode structure (35) and an anode support (40), wherein the anode structure (35) comprises an anode (31) and a power supply component (37), and the anode support (40) comprises: an anode support frame (43) having a space (45) for arranging the anode structure (35), a conductive rod (50), and a power supply electrode (55) mounted on the end of the conductive rod (50); one end of the power supply component (37) is fixed to the anode (31), and the other end of the power supply component (37) is fixed to the conductive rod (50) in a removable manner. The anode support frame (43) comprises a positioning guide (47) into which the lower end of the anode structure (35) is inserted. The anode assembly (30) is configured so that when the power supply component (37) is removed from the conductive rod (50), the anode structure (35) can be separated from the anode support (40) and pulled up from the electroplating tank (10).

Description

Technical Field

[0001] The present invention relates to an anode assembly used in an electroplating device for electroplating workpieces such as rectangular substrates, wafers, panels, etc. Background Art

[0002] As an example of an electroplating device, an electrolytic plating device immerses a workpiece (e.g., a rectangular substrate, a wafer, etc.) held by a workpiece holder in a plating solution, and applies a voltage between the workpiece and the anode, thereby depositing a metal film on the surface of the workpiece. The electrolytic plating device is configured as follows: an anode held by an anode holder and a workpiece held by a workpiece holder are arranged oppositely in a plating tank in which a plating solution is stored so that the surfaces of the two are parallel, and a plating power source is used to energize between the anode and the workpiece, thereby performing electrical plating on the plated surface of the workpiece exposed from the workpiece holder. In such an electrolytic plating device, the anode gradually deteriorates due to use, so it is necessary to regularly remove the anode from the plating tank for replacement.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2009-46724

[0004] Patent Document 2: Japanese Patent Application Publication No. 2015-151553

[0005] In the past, in order to remove the anode from the electroplating tank for replacement, the anode holder had to be pulled out of the electroplating tank as a whole. After the anode holder was pulled out of the electroplating tank, the anode holder was disassembled outside the electroplating tank, and the used anode was removed from the anode holder and replaced with a new anode.

[0006] However, there is a recent trend of increasing the size of workpieces to be plated, and with this, the anode and the anode holder that holds the anode are also increasing in size. If the anode holder is increased in size, the weight of the anode holder increases, making it difficult to pull the entire anode holder out of the plating tank. Summary of the invention

[0007] Therefore, the present invention provides an anode assembly comprising an anode and an anode holder for holding the anode, and the anode can be easily pulled up from an electroplating tank.

[0008] In one embodiment, an anode assembly is provided, which is arranged longitudinally inside an electroplating tank, wherein the assembly comprises: an anode structure; and an anode holder which holds the anode structure, the anode structure comprising: an anode; and a power supply component which extends upward from the anode, the anode holder comprising: an anode support frame which has a space for arranging the anode structure; a conductive rod which is fixed to the upper end of the anode support frame and extends laterally from the anode support frame; and a power supply electrode which is mounted on the end of the conductive rod, one end of the power supply component being fixed to the anode, and the other end of the power supply component being removably fixed to the conductive rod, the anode support frame having a positioning guide which is inserted into the lower end of the anode structure, and when the power supply component is removed from the conductive rod, the anode structure can be separated from the anode holder and pulled up from the electroplating tank.

[0009] In one embodiment, the anode support frame includes a side surface guide portion extending along a side surface of the anode structure.

[0010] In one embodiment, the anode support frame is made of an insulator.

[0011] In one embodiment, the positioning guide portion has a tapered surface that is inclined obliquely downward toward the front of the anode support frame.

[0012] In one embodiment, the anode structure further includes an anode case that covers the back surface of the anode and supports the anode.

[0013] In one embodiment, the anode case is made of an insulator.

[0014] In one embodiment, the anode holder further includes a mask fixed to the anode support frame, wherein the mask has an opening located in front of the anode.

[0015] According to the present invention, the anode structure can be separated from the anode holder and pulled out of the electroplating tank in a state where the anode holder is installed in the electroplating tank. Therefore, the anode can be easily pulled out of the electroplating tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a longitudinal sectional front view showing one embodiment of the electrolytic plating apparatus.

[0017] Figure 2 This is a front perspective view of the anode assembly.

[0018] Figure 3 This is a perspective view of the back side of the anode assembly.

[0019] Figure 4 Yes means Figure 3 A sectional stereogram of the AA line section.

[0020] Figure 5 Yes means Figure 3 A sectional stereogram of the BB line section.

[0021] Figure 6 This is a diagram showing a state in which the anode structure is removed from the anode holder.

[0022] Figure 7 This is a schematic diagram for explaining the operation of removing the anode structure from the anode holder.

[0023] Figure 8 This is a schematic diagram for explaining the operation of attaching the anode structure to the anode holder.

[0024] Fig. 9 This is a diagram showing a state where the anode and the power supply member are removed from the anode case.

[0025] Fig.10 It is a diagram showing another embodiment of the anode structure.

[0026] Fig.11 This is a front perspective view showing still another embodiment of the anode assembly.

[0027] Fig.12 This is a diagram showing a state in which the anode structure is removed from the anode holder.

[0028] Fig.13 This is a diagram showing a state where the anode and the power supply member are removed from the anode case.

[0029] Explanation of reference numerals: 1…electrolytic plating device; 10…plating tank; 12…overflow tank; 14…pump; 16…plating solution circulation pipeline; 20…temperature regulating unit; 22…filter; 24…workpiece holder; 26…electroplating power supply; 30…anode assembly; 31…anode; 32…stirrer; 34…adjusting plate; 34a…opening; 35…anode structure; 35a…conical surface; 37…power supply component; 40…anode holder; 41…mask; 42…opening; 43…anode support frame; 44…mask holding component; 45…space; 46…side guide; 47…positioning guide; 47a…conical surface; 50…conductive rod; 55…power supply electrode; 56…screw (fastener); 60…anode box; 62…screw (fastener); 65…recess. DETAILED DESCRIPTION

[0030] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

[0031] Figure 1 1 is a longitudinal sectional front view showing one embodiment of an electrolytic plating device. Figure 1As shown, the electrolytic plating apparatus 1 includes a plating tank 10. A plating solution is held in the plating tank 10. An overflow tank 12 is provided adjacent to the plating tank 10 to receive the plating solution overflowing from the upper edge of the plating tank 10.

[0032] One end of a plating solution circulation line 16 provided with a pump 14 is connected to the bottom of the overflow tank 12, and the other end of the plating solution circulation line 16 is connected to the bottom of the plating tank 10. The plating solution accumulated in the overflow tank 12 is returned to the plating tank 10 through the plating solution circulation line 16 as the pump 14 is driven. The plating solution circulation line 16 is provided with: a temperature regulating unit 20 located on the downstream side of the pump 14 and regulating the temperature of the plating solution, and a filter 22 for removing foreign matter in the plating solution.

[0033] The electrolytic plating device 1 comprises: a workpiece holder 24, an anode assembly 30, and a plating power source 26 for holding a workpiece (electroplated body) W in a detachable manner and immersing the workpiece W in a vertical state in a plating solution in a plating tank 10. The workpiece holder 24 and the anode assembly 30 are arranged longitudinally inside the plating tank 10 and face each other. The plating power source 26 is arranged outside the plating tank 10. There is also a case where a membrane sheet (not shown) such as a neutral diaphragm or an ion exchange membrane is arranged around the anode assembly 30. As examples of the workpiece W to be plated, wafers, rectangular substrates, printed wiring boards, panels, etc. constituting semiconductor devices can be cited.

[0034] The anode assembly 30 includes an anode structure 35 and an anode holder 40 for holding the anode structure 35. The anode structure 35 includes: an anode 31, a power supply component 37 extending upward from the anode 31, and an anode box 60 for supporting the anode 31. The anode holder 40 includes an anode support frame 43 and a conductive rod 50 fixed to the upper end of the anode support frame 43. One end of the power supply component 37 is fixed to the anode 31, and the other end of the power supply component 37 is fixed to the conductive rod 50 in a removable manner. The anode box 60 covers the back side of the anode 31. The anode 31 of the present embodiment is an insoluble anode, but in one embodiment, the anode 31 may also be a soluble anode.

[0035] If the workpiece holder 24 and the anode assembly 30 holding the workpiece W are arranged in the electroplating tank 10, the workpiece W and the anode 31 are facing each other in the electroplating tank 10. A conductive layer (e.g., a seed layer) is pre-formed on the surface (electroplated surface) of the workpiece W. The anode 31 is electrically connected to the positive electrode of the electroplating power supply 26 via the power supply component 37 and the conductive rod 50. The conductive layer of the workpiece W is connected to the negative electrode of the electroplating power supply 26 via the workpiece holder 24. If the electroplating power supply 26 applies a voltage between the anode 31 and the workpiece W, the workpiece W is electroplated in the presence of the electroplating solution, and a metal film (e.g., a copper film) is precipitated on the surface of the workpiece W.

[0036] The anode holder 40 also includes a mask 41 made of a dielectric for adjusting the electric field formed between the anode 31 and the workpiece W. The mask 41 is fixed to the anode support frame 43, and the mask 41 is arranged on the front surface of the anode holder 40 (the surface opposite to the workpiece holder 24). The mask 41 has an opening 42 for the current flowing between the anode 31 and the workpiece W to pass through, and the opening 42 is located in front of the anode 31. By providing such a mask 41, the film thickness of the workpiece W in the central part and the peripheral part can be adjusted. Therefore, the electrolytic plating device 1 can improve the uniformity of the thickness of the metal film formed on the workpiece W due to electroplating.

[0037] A stirrer 32 is disposed between the workpiece holder 24 and the anode 31, and stirs the plating solution by reciprocating in parallel with the surface of the workpiece W. By stirring the plating solution with the stirrer 32, sufficient metal ions can be uniformly supplied to the surface of the workpiece W. In addition, an adjustment plate 34 made of a dielectric is disposed between the stirrer 32 and the anode 31 to make the potential distribution over the entire surface of the workpiece W more uniform.

[0038] The adjustment plate 34 has an opening 34a through which current flows between the anode 31 and the workpiece W. The adjustment plate 34 has a function of adjusting the electric field formed between the anode 31 and the workpiece W, and can improve the uniformity of the thickness of the metal film formed on the workpiece W by electroplating.

[0039] Figure 2 is a front perspective view of the anode assembly 30, Figure 3 It is a rear perspective view of the anode assembly 30 . Figure 4 Yes means Figure 3 The sectional stereogram of the AA line section, Figure 5 Yes means Figure 3 BB line cross-sectional stereogram. As described above, the anode structure 35 comprises: an anode 31, a power supply component 37 extending upward from the anode 31, and an anode box 60 supporting the anode 31. The anode support 40 comprises an anode support frame 43 and a conductive rod 50 fixed to the upper end of the anode support frame 43. In the present embodiment, the workpiece W is a rectangular substrate, and the anode 31 has a quadrilateral shape similar to the rectangular substrate. In one embodiment, the workpiece W may also be a circular wafer, and the anode 31 may also be circular.

[0040] The anode box 60 and the anode support frame 43 are made of an insulator. As an example of the insulator constituting the anode box 60 and the anode support frame 43, vinyl chloride can be cited. The power supply component 37 and the conductive rod 50 are made of a conductor such as metal. As an example of a conductor constituting the conductive rod 50, titanium can be cited. The anode box 60 has a handle 61 at its upper portion. In the present embodiment, two handles 61 are provided on both sides of the power supply component 37.

[0041] The mask 41 is supported by the anode support frame 43. A mask holding member 44 for fixing the mask 41 to the anode support frame 43 is fixed to the front surface of the anode support frame 43. The mask holding member 44 is located outside the opening 42 of the mask 41 and does not hinder the electric field formed by the anode 31 exposed from the opening 42.

[0042] like Figure 4 and Figure 5 As shown in FIG. 1 , the anode support frame 43 includes: a side guide portion 46 for guiding the side of the anode structure 35, and a positioning guide portion 47 inserted into the lower end of the anode structure 35. Specifically, the side guide portion 46 extends along the side of the anode structure 35, and the positioning guide portion 47 extends along the lower end of the anode structure 35. The positioning guide portion 47 has a tapered surface 47a (see FIG. 4B ) that is inclined obliquely downward toward the front of the anode support frame 43. Figure 3 and Figure 5 ). In addition, if Figure 5 As shown, the anode structure 35 has a tapered surface 35a at its lower end. The tapered surface 35a has a shape that is inclined obliquely upward toward the rear of the anode structure 35 and is in surface contact with the tapered surface 47a of the positioning guide 47. According to the structure of the side guide 46 and the positioning guide 47, the relative position of the anode structure 35 with respect to the anode support 40 is fixed, and the anode structure 35 is stably held on the anode support 40.

[0043] like Figure 5 As shown, the positioning guide 47 has a groove shape extending along the lower end of the anode structure 35. The lower end of the anode structure 35 is inserted into the groove-shaped positioning guide 47. The tapered surface 35a of the anode structure 35 and the tapered surface 47a of the positioning guide 47 are provided to facilitate the insertion of the lower end of the anode structure 35 into the positioning guide 47. As long as the lower end of the anode structure 35 itself has a shape that is easily inserted into the positioning guide 47, the tapered surface 35a can be omitted.

[0044] like Figure 2 and Figure 3 As shown in the figure, the conductive rod 50 is fixed to the upper end of the anode support frame 43 and extends from the anode support frame 43 in the horizontal direction. The anode support 40 is provided with a power supply electrode 55 mounted on the end of the conductive rod 50. An electric contact not shown is mounted on the electroplating tank 10, and the electric contact is connected to the positive electrode of the electroplating power supply 26. If the anode assembly 30 is set in the electroplating tank 10, the power supply electrode 55 contacts the electric contact on the electroplating tank 10. The electroplating power supply 26 can supply power to the anode 31 via the power supply electrode 55, the conductive rod 50, and the power supply component 37.

[0045] One end (lower end) of the power supply component 37 is fixed to the anode 310. Figure 3As shown, the other end (upper end) of the power supply component 37 is removably fixed to the conductive rod 50 by means of a plurality of screws 56 as fasteners. The anode structure 35 is fixed to the anode bracket 40 only by means of the plurality of screws 56. Therefore, the power supply component 37 can be removed from the conductive rod 50 and the anode structure 35 can be removed from the anode bracket 40 by removing the screws 56. In one embodiment, a single screw 56 may be provided as a fastener.

[0046] Figure 6 3 is a diagram showing a state in which the anode structure 35 is removed from the anode holder 40. By fastening the anode structure 35 with a plurality of screws 56 (see Figure 3 ) is removed from the power supply component 37, so that the anode structure 35 can be removed from the anode support 40. The user can grab the handle 61 of the anode box 60 and pull the anode structure 35 from the plating tank 10.

[0047] The anode support frame 43 has a shape surrounding the periphery of the anode 31. The anode support frame 43 has a space 45 in which the anode structure 35 is arranged. The space 45 is a space open to the front and rear of the anode support frame 43. A part of the anode structure 35 is arranged in the space 45. Specifically, the anode 31 and a part of the anode box 60 are arranged in the space 45.

[0048] Figure 7 Schematic diagram for explaining the operation of removing the anode structure 35 from the anode holder 40. First, the plurality of screws 56 are removed from the conductive rod 50, and the anode structure 35 is tilted backward until the upper portion of the anode 31 moves outward from the space 45 of the anode holder 40. At this time, the lower end of the anode structure 35 remains inserted into the positioning guide 47. Afterwards, the anode structure 35 is pulled upward as a whole, so that the anode structure 35 can be removed from the plating tank 10 while the anode holder 40 remains in the plating tank 10.

[0049] The plurality of screws 56 and the conductive rod 50 are located above the electroplating tank 10, so that the removal operation of the anode structure 35 can be performed from the outside of the electroplating tank 10. Therefore, by removing the plurality of screws 56 from the conductive rod 50, the power supply component 37 can be removed from the conductive rod 50, and the anode structure 35 can be separated from the anode support 40 and pulled up from the electroplating tank 10.

[0050] The anode 31 is made of a relatively thin metal plate. The anode box 60 is made of an insulator and has a thin plate shape. Therefore, even if the anode 31 and the anode holder 40 are enlarged along with the enlargement of the workpiece W, the anode structure 35 can be constructed to be relatively light relative to the anode holder 40. As a result, the anode structure 35 can be easily pulled up from the electroplating tank 10.

[0051] Figure 8 Schematic diagram for explaining the operation of installing the anode structure 35 on the anode holder 40. When the anode holder 40 is set in the electroplating tank 10, the anode structure 35 is moved toward the inside of the electroplating tank 10. More specifically, the anode structure 35 is lowered in a state where the anode structure 35 is slightly tilted as a whole until the lower end of the anode structure 35 is inserted into the positioning guide 47. The positioning guide 47 has a tapered surface 47a, so that the lower end of the anode structure 35 can be easily inserted into the positioning guide 47. After that, the upper part of the anode structure 35 is moved toward the anode holder 40 while the lower end of the anode structure 35 is inserted into the positioning guide 47, so that the power supply component 37 is in contact with the conductive rod 50 of the anode holder 40. The anode 31 is accommodated in the space 45 of the anode holder 40 as a whole. Then, the power supply component 37 is fixed to the conductive rod 50 of the anode holder 40 by a plurality of screws 56. The anode structure 35 is held by the anode holder 40 by the screws 56 and the positioning guides 47 .

[0052] like Figure 4 and Figure 5 As shown, the anode support frame 43 has a side guide 46 and a positioning guide 47. The position of the anode structure 35 relative to the anode holder 40 is fixed by the side guide 46 and the positioning guide 47. Thus, when the anode structure 35 is mounted on the anode holder 40, the structure 35 can be returned to its original position with high accuracy.

[0053] like Figure 6 As shown, the power supply member 37 is removably fixed to the anode box 60 by a plurality of screws 62 as fasteners. The power supply member 37 extends upward from the anode box 60. The anode 31 and the power supply member 37 can be removed from the anode box 60 by removing the screws 62. In one embodiment, a single screw 62 may be provided as a fastener.

[0054] Fig. 9 1 is a diagram showing a state in which the anode 31 and the power supply member 37 are removed from the anode box 60. The anode 31 is configured to be pluggable in the anode box 60. More specifically, the anode box 60 has a recess 65 on its front surface. The recess 65 has a size that allows the anode 31 to be accommodated in the recess 65 as a whole. The recess 65 has a shape that surrounds at least the two side portions and the lower end of the anode 31.

[0055] If the plurality of screws 62 are removed, the anode 31 can be slid upward (in the direction in which the power supply member 37 extends). Therefore, the anode 31 can be pulled out from the anode case 60. Similarly, by sliding the anode 31 into the anode case 60, the anode 31 can be accommodated in the recess 65 of the anode case 60.

[0056] Fig.10 It is a diagram showing another embodiment of the anode structure 35 . Fig.10 The anode structure 35 is shown in a state where it is removed from the anode holder 40. Figures 1 to 8 The anode structure 35 of this embodiment is the same as that of the embodiment described above, so the repeated description thereof is omitted. Figures 1 to 8 The embodiment described is different in that the anode case 60 is not provided. The lower end of the anode 31 is inserted into the positioning guide 47. In the present embodiment, the anode structure 35 can be configured to be more lightweight.

[0057] Figure 11 to Figure 13 Schematic diagram showing still another embodiment of the anode assembly 30. The details of this embodiment not particularly described and reference Figures 1 to 9 The embodiments described are the same, so the repeated description is omitted. Figures 1 to 9 In the embodiment described above, the anode 31 has a quadrilateral shape, but in this embodiment, the anode 31 has a circular shape, and the opening 42 of the mask 41 also has a circular shape. In this embodiment, a circular wafer or the like can be used as the workpiece W to be plated. Fig.10 The described embodiments can also be applied to Figure 11 to Figure 13 This embodiment is shown.

[0058] The above-mentioned embodiments are recorded for the purpose of enabling people with common knowledge in the technical field to which the present invention belongs to implement the present invention. As long as one is skilled in the art, various modifications of the above-mentioned embodiments can certainly be carried out, and the technical idea of ​​the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, and can be interpreted within the maximum scope of the technical idea defined by the claims.

Claims

1. An anode assembly, arranged longitudinally inside an electroplating tank, characterized in that: The structure is composed of: an anode structure; and an anode support that holds the anode structure, The anode structure comprises: an anode; and a power supply member extending upward from the anode, The anode support comprises: an anode support frame having a space for arranging the anode structure; A conductive rod fixed to the upper end of the anode support frame and extending from the anode support frame in a lateral direction; as well as a power supply electrode mounted at the end of the conductive rod, One end of the power supply component is fixed to the anode, and the other end of the power supply component is removably fixed to the conductive rod. The anode support frame has a positioning guide portion into which the lower end of the anode structure is inserted. When the power supply component is removed from the conductive rod, the anode support can be left in the electroplating tank while the anode structure is separated from the anode support and pulled out of the electroplating tank. The anode support further comprises a mask fixed to the anode support frame. The mask has an opening located in front of the anode.

2. The anode assembly according to claim 1, characterized in that: The anode support frame includes a side surface guide portion extending along a side surface of the anode structure.

3. The anode assembly according to claim 1 or 2, characterized in that: The anode supporting frame is made of an insulator.

4. The anode assembly according to claim 1 or 2, characterized in that: The positioning guide has a tapered surface that is inclined obliquely downward toward the front of the anode support frame.

5. The anode assembly according to claim 1 or 2, characterized in that: The anode structure further includes an anode case that covers the back surface of the anode and supports the anode.

6. The anode assembly according to claim 5, characterized in that: The anode box is made of an insulator.

7. The anode assembly according to claim 5, characterized in that: The anode box has a handle at its upper portion.

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