Optical shaping apparatus and method

Abstract

The application provides an optical shaping device, comprising: a laser generator for generating a laser beam; a controllable microlens array comprising a plurality of controllable microlenses arranged in an array; a driving mechanism for driving the laser beam to irradiate on at least part of the controllable microlenses in sequence along a predetermined path, so that the controllable microlenses shape the laser beam; a detection module for detecting a light spot formed by the shaped laser beam at a predetermined position to obtain a light spot parameter; and an upper computer in communication connection with the detection module and the controllable microlens array, the upper computer adjusting the controllable microlens at the corresponding position according to the light spot parameter and position information corresponding to the light spot parameter. The technical scheme provided by the application can make the size of the laser spot and the laser intensity distribution uniform, and improve the uniformity of the laser annealing process.

Description

Technical Field

[0001] This invention relates to the field of laser annealing technology, and more particularly to an optical shaping device and method. Background Technology

[0002] Currently, mainstream laser annealing equipment typically uses Gaussian laser beams. Since uneven energy distribution within a Gaussian beam can affect the uniformity of annealing, a beam shaping system is generally required to transform the Gaussian beam into a flat-top beam for wafer annealing. Current beam shaping systems mainly use two-dimensional and three-dimensional telecentric lenses, but these systems have the following problems: During the processing of the wafer by a two-dimensional telecentric lens, design or manufacturing deviations can lead to uneven laser spot sizes at different locations on the wafer, resulting in decreased processing uniformity and inconsistent annealing effects. While using a three-dimensional telecentric lens can maintain a consistent spot size, the flat-top beam used in the annealing process means that compensation along the Z-axis with the three-dimensional telecentric lens still results in uneven beam quality within the spot, i.e., uneven power distribution, thus affecting the uniformity of the thermal annealing process. Summary of the Invention

[0003] The optical shaping device and method provided by the present invention can make the size of the laser spot and the distribution of the laser intensity uniform, thereby improving the uniformity of the laser annealing process.

[0004] In a first aspect, the present invention provides an optical shaping device, comprising:

[0005] A laser generator is used to produce a laser beam;

[0006] A controllable microlens array, comprising multiple controllable microlenses arranged in an array configuration;

[0007] A driving mechanism is used to drive the laser beam to sequentially irradiate at least a portion of the controllable microlenses along a predetermined path, so that the controllable microlenses shape the laser beam;

[0008] The detection module is used to detect the spot formed by the shaped laser beam at a predetermined position in order to obtain the spot parameters;

[0009] The host computer is communicatively connected to the detection module and the controllable microlens array. The host computer adjusts the controllable microlens at the corresponding positions based on the light spot parameters and the position information corresponding to the light spot parameters.

[0010] Optionally, the laser beam is shaped by two or more controllable microlenses to form two or more laser beams to be superimposed;

[0011] The optical shaping device also includes a Fourier lens, which is disposed in the optical path of the laser beams to be superimposed. The Fourier lens is used to superimpose two or more laser beams into one laser beam.

[0012] Optionally, the detection module includes:

[0013] A spot morphology detector is disposed in the optical path of the laser beam. The laser beam illuminates the spot morphology detector to form a spot, so that the spot morphology detector can detect the spot.

[0014] A motion platform, connected to the light spot morphology detector, is used to drive the light spot morphology detector to move along a path formed by multiple predetermined positions, so that the light spot morphology detector is on the shaped laser beam path.

[0015] Optionally, it also includes a wafer thickness detection module for detecting the thickness of the wafer to be processed;

[0016] The motion platform is also used to drive the spot morphology detector to a predetermined height based on the workpiece stage height and the thickness of the wafer to be processed.

[0017] Optionally, the controllable microlens can be a circular controllable microlens or a square controllable microlens.

[0018] Secondly, the present invention also provides an optical shaping method, comprising:

[0019] The laser beam is scanned along a predetermined path on a controllable microlens array so that some of the controllable microlenses in the controllable microlens array shape the laser beam.

[0020] The multiple light spots formed by the shaped laser beam along the predetermined path are detected sequentially to obtain the light spot parameters of the multiple light spots;

[0021] Based on the predetermined target parameters, determine whether the parameters of the multiple light spots meet the requirements;

[0022] Adjust the controllable microlens corresponding to the non-compliant spot parameters so that the controllable microlens can shape the laser beam to form a compliant spot on a predetermined path.

[0023] Optionally, sequentially irradiating the controllable microlens array with the laser beam along a predetermined path includes: sequentially irradiating two or more controllable microlenses with the laser beam along a predetermined path.

[0024] Optionally, sequentially irradiating the controllable microlens array with a laser beam along a predetermined path includes:

[0025] The laser beam is divided into two or more laser beams to be superimposed using two or more controllable microlenses;

[0026] The laser beams to be superimposed are superimposed into a single laser beam using a Fourier lens.

[0027] Optionally, sequentially detecting multiple light spots formed by the shaped laser beam along a predetermined path includes:

[0028] The spot morphology detector is set on the plane where the wafer is processed;

[0029] The spot morphology detector is controlled to move along a predetermined path so that the shaped laser beam irradiates the spot morphology detector to form a spot;

[0030] A spot morphology detector is used to detect the spot in real time to obtain the spot parameters.

[0031] Optionally, before setting the spot morphology inspection instrument on the plane where the wafer is processed, the following steps are included:

[0032] Inspect the thickness of the wafer to be processed;

[0033] The plane on which the wafer is located during processing is determined based on the thickness of the wafer to be processed and the height of the workpiece stage.

[0034] In the technical solution of this invention, a controllable microlens array is used to shape the laser beam, and the shaped laser spot is detected. When the laser spot is detected to be unsatisfactory, some of the controllable microlenses in the controllable microlens array can be adjusted so that the shaping result of the corresponding part of the spot by the controllable microlenses can be adjusted, thereby making the size of the laser spot and the distribution of laser light intensity uniform, and improving the uniformity of the laser annealing process. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of an optical shaping device according to an embodiment of the present invention shaping a laser beam;

[0036] Figure 2 This is a partial view of an array of circular controllable microlenses formed by an optical shaping device according to another embodiment of the present invention;

[0037] Figure 3 This is a partial oblique view of an array of square controllable microlenses formed by an optical shaping device according to an embodiment of the present invention;

[0038] Figure 4 This is a schematic diagram of another embodiment of the optical shaping device of the present invention, which uses a Fourier lens to superimpose light beams;

[0039] Figure 5 This is a schematic diagram of a laser annealing apparatus having an optical shaping device according to another embodiment of the present invention;

[0040] Figure 6 This is an isometric view of a beam detection device according to another embodiment of the present invention;

[0041] Figure 7 for Figure 6 The main view;

[0042] Figure 8 for Figure 6 The left view;

[0043] Figure 9 for Figure 6 Top view;

[0044] Figure 10 This is a top view of a controllable microlens array cleaning device according to another embodiment of the present invention;

[0045] Figure 11 This is an isometric view of a controllable microlens array cleaning device according to another embodiment of the present invention;

[0046] Figure 12 This is a process flow diagram for laser annealing. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0048] This invention provides an optical shaping device, such as... Figure 1-3 The following are included:

[0049] Laser generator 1 is used to generate a laser beam; in some embodiments, laser generator 1 generates a laser beam, which is expanded and collimated, and after initial shaping, it enters the subsequent controllable microlens array 11 for shaping.

[0050] A controllable microlens array 11 includes a plurality of controllable microlenses 1101 arranged in an array. In some embodiments, the controllable microlens array 11 includes a plurality of controllable microlenses, and the plurality of controllable microlenses 1101 are arranged in an array. The angle and focal length of the controllable microlenses 1101 are adjustable, and the adjustment can be performed mechanically or by voltage control. As the laser beam moves along a predetermined path, the laser spot formed by the laser beam on the controllable microlens array 11 sequentially covers a portion of the controllable microlenses 1101 along the predetermined path. As a preferred embodiment, the controllable microlenses 1101 are circular or square.

[0051] A driving mechanism is used to drive the laser beam to sequentially irradiate at least a portion of the controllable microlenses 1101 along a predetermined path, so that the controllable microlenses 1101 shape the laser beam. In some embodiments, the driving mechanism is typically a galvanometer mechanism, and the position or direction of the laser beam 8 can be changed by adjusting the angle or position of the mirrors in the galvanometer mechanism. In some preferred embodiments, the predetermined path is the same as the laser beam movement path during the wafer annealing process, thereby enabling more accurate simulation of the wafer annealing process and making the adjustment result of the controllable microlens array 11 more accurate.

[0052] A detection module is used to detect the light spot formed by the shaped laser beam at a predetermined position to obtain light spot parameters; in some embodiments, the detection module is used to detect the size, shape, and intensity distribution of the laser light spot. As the laser beam moves, the controllable microlens 1101 used to shape the laser beam also changes continuously. When the light spot formed by the shaped laser beam does not meet the quality requirements, it can be confirmed that the controllable microlens 1101 used to shape the laser beam needs to be adjusted.

[0053] The host computer is communicatively connected to the detection module and the controllable microlens array 11. Based on the light spot parameters and their corresponding position information, the host computer adjusts the controllable microlenses 1101 at the corresponding positions. The host computer stores the light spot parameters, the correspondence between the light spot parameters and their positions, and adjusts the controllable microlenses 1101. Upon receiving the light spot parameters and their corresponding positions, if the light spot parameters do not meet the requirements, the host computer can identify the non-compliant controllable microlenses 1101 by their corresponding positions and adjust those controllable microlenses 1101 accordingly.

[0054] In the technical solution of this embodiment, a controllable microlens array 11 is used to shape the laser beam 8, and the shaped laser spot is detected. When the laser spot is detected to be unsatisfactory, some controllable microlenses 1101 in the controllable microlens array 11 can be adjusted so that the shaping result of the corresponding part of the spot by the controllable microlenses 1101 can be adjusted, so that the size of the laser spot and the distribution of laser intensity are uniform, thereby improving the uniformity of the laser annealing process.

[0055] As an optional implementation method, such as Figure 4 As shown, the laser beam is shaped by two or more controllable microlenses 1101 to form two or more laser beams to be superimposed.

[0056] The optical shaping device also includes a Fourier lens 1102, which is disposed in the optical path of the laser beams to be superimposed. The Fourier lens 1102 is used to superimpose two or more laser beams into one laser beam.

[0057] When incident light irradiates two or more controllable microlenses 1101 of the microlens array 11, the incident microlenses can be regarded as a multi-source light source array. Due to the optical effect of the microlens unit, independent propagation light channels are formed. The light energy in each light channel is a uniform beam. After passing through the Fourier lens 1102, the energy in the light channel is superimposed on the same area of ​​the uniform beam plane. The uniformity of the light spot energy distribution formed after superposition is much higher than that of the initial incident light spot.

[0058] As an optional implementation, the detection module includes:

[0059] A spot morphology detector 16 is disposed in the optical path of the laser beam. The laser beam irradiates the spot morphology detector 16 to form a spot, so that the spot morphology detector 16 can detect the spot.

[0060] A motion platform is driven and connected to the spot morphology detector 16 to drive the spot morphology detector 16 to move along a path formed by multiple predetermined positions, so that the spot morphology detector 16 is on the shaped laser beam path.

[0061] The spot morphology detector 16 detects light spots by irradiating them with a laser beam and then detecting the light spots. This detection method eliminates the need for reflection of the light spot, thus enabling more accurate detection of its parameters. Therefore, in this embodiment, the spot morphology detector 16 is mounted on a motion platform, which drives the detector to move synchronously with the laser beam 8, ensuring that the laser beam always irradiates the spot morphology detector 16.

[0062] As an optional implementation, a wafer thickness detection module is also included for detecting the thickness of the wafer to be processed. The motion platform is also used to drive the spot morphology detector 16 to move to a predetermined height based on the height of the workpiece stage 1301 and the thickness of the wafer to be processed. Since the wafer is placed on the workpiece stage 1301 during the wafer annealing process, in this embodiment, in order to more accurately simulate the wafer annealing process, the thickness of the wafer to be processed is measured, and then the thickness of the wafer to be processed is added to the height of the upper surface of the wafer during annealing. When detecting the spot, the spot morphology detector 16 is raised to the plane where the wafer is located during annealing, and then moved along the path of wafer annealing, completely simulating the wafer annealing process, and enabling more accurate adjustment of the controllable microlens array 11. The wafer thickness detection module generally includes a thickness measurement platform 5, a camera 6, and a height gauge 7.

[0063] This invention also provides an optical shaping method, comprising:

[0064] A laser beam is scanned along a predetermined path on a controllable microlens array 11, so that some of the controllable microlenses 1101 in the controllable microlens array 11 shape the laser beam. In some embodiments, the predetermined path refers to the movement path during the annealing process of the wafer. As the laser beam moves along the predetermined path, it scans different controllable microlenses 1101 in the controllable microlens array 11; that is, the laser beam is shaped by different controllable microlenses 1101 at different positions.

[0065] Multiple light spots formed by the shaped laser beam along a predetermined path are sequentially detected to obtain the light spot parameters of the multiple light spots. In some embodiments, the multiple light spots refer to multiple light spots formed after being shaped by different controllable microlenses 1101. When the position of the laser beam changes, the laser beam will cover different controllable microlenses 1101. Since the laser beam moves continuously, the light spots at different times and positions are the light spots formed by different controllable microlenses 1101. By using the parameters of these light spots, the shaping result of the corresponding controllable microlens 1101 on the laser beam can be determined.

[0066] Based on predetermined target parameters, it is determined whether multiple spot parameters meet the requirements. In some embodiments, the predetermined target parameters refer to the range of spot parameters capable of uniformly annealing the wafer. After acquiring the spot parameters of multiple spots, the spot parameters are compared with the predetermined target parameters. When the spot parameters are within the range of the target parameters, it can be determined that the current spot parameters meet the requirements; when the spot parameters are outside the range of the target parameters, it can be determined that the current spot parameters do not meet the requirements.

[0067] The controllable microlenses 1101 corresponding to non-compliant spot parameters are adjusted so that the controllable microlenses 1101 shape the laser beam to form a compliant spot on a predetermined path. In some embodiments, since the spot parameters correspond to the controllable microlenses 1101 in the controllable microlens array 11, when the spot parameters are non-compliant, it can be determined that the corresponding controllable microlens 1101 does not meet the requirements for shaping the laser beam. Therefore, in this embodiment, the controllable microlenses 1101 in this part are adjusted. Since only the non-compliant controllable microlenses 1101 are adjusted during the adjustment process, it will not affect the controllable microlenses 1101 in other parts, thereby ensuring that all spots on the entire path meet the requirements.

[0068] In the technical solution of this embodiment, a controllable microlens array 11 is used to shape the laser beam 8, and the shaped laser spot is detected. When the laser spot is detected to be unsatisfactory, some controllable microlenses 1101 in the controllable microlens array 11 can be adjusted so that the shaping result of the corresponding part of the spot by the controllable microlenses 1101 can be adjusted, so that the size of the laser spot and the distribution of laser intensity are uniform, thereby improving the uniformity of the laser annealing process.

[0069] As an optional implementation, sequentially irradiating the controllable microlens array 11 with a laser beam along a predetermined path includes: sequentially irradiating two or more controllable microlenses 1101 with the laser beam along a predetermined path. In some embodiments, when the incident light irradiates two or more microlenses, the incident microlenses can be regarded as a multi-source light source array. Due to the optical effect of the microlens units, independent propagation light channels are formed. The light energy in each light channel is uniform, which can divide a laser beam into multiple uniform laser beams to be superimposed.

[0070] As an optional implementation, sequentially irradiating the controllable microlens array 11 with a laser beam along a predetermined path includes:

[0071] The laser beam is divided into two or more laser beams to be superimposed by using two or more controllable microlenses 1101;

[0072] The laser beams to be superimposed are superimposed into a single laser beam using a Fourier lens 1102.

[0073] In some embodiments, the Fourier lens 1102 superimposes the energy within the optical channel onto the same region of the beam-uniforming plane, resulting in a beam spot with a much higher energy distribution uniformity than the initial incident beam spot. When the uniformity does not meet the requirements, at least some of the controllable microlenses 1101 among two or more controllable microlenses 1101 can be adjusted to regulate the uniformity of the laser beam spot.

[0074] As an optional implementation, sequentially detecting multiple light spots formed by the shaped laser beam along a predetermined path includes:

[0075] The spot morphology detector 16 is set on the plane where the wafer is processed;

[0076] The spot morphology detector 16 is controlled to move along a predetermined path so that the shaped laser beam irradiates the spot morphology detector 16 to form a spot;

[0077] A spot morphology detector 16 is used to detect the spot in real time to obtain the spot parameters.

[0078] In some embodiments, the spot morphology detector 16 detects the spot by irradiating it with a laser beam and then detecting the spot. This detection method eliminates the need for reflection of the spot, thus enabling more accurate detection of its parameters. Therefore, in this embodiment, the spot morphology detector 16 is mounted on a motion platform, which moves the detector synchronously with the laser beam 8, ensuring that the laser beam always irradiates the spot morphology detector 16.

[0079] As an optional implementation, the process of setting the spot morphology inspection instrument 16 on the plane where the wafer is located during processing includes:

[0080] Inspect the thickness of the wafer to be processed;

[0081] The plane on which the wafer is located during processing is determined based on the thickness of the wafer to be processed and the height of the workpiece stage 1301.

[0082] In some embodiments, since the wafer is placed on the workpiece stage 1301 during the wafer annealing process, in order to more accurately simulate the wafer annealing process, the thickness of the wafer to be processed is measured, and then the thickness of the wafer to be processed is added to the height of the workpiece stage 1301 to obtain the height of the upper surface of the wafer during annealing. When detecting the light spot, the light spot morphology detector 16 is raised to the plane where the wafer is located during annealing, and then moved along the path of wafer annealing, completely simulating the wafer annealing process, and enabling more accurate adjustment of the controllable microlens array 11.

[0083] The optical shaping device in the above embodiments is mainly used in laser annealing equipment, such as... Figure 5As shown, in addition to the aforementioned optical shaping device, the laser annealing equipment also includes a beam detection device and a controllable microlens array 11 cleaning device. In the laser annealing equipment, the laser beam emitted by the laser generator 1 is processed by the pre-shaping lens 2 and the attenuation lens 3 before entering the optical shaping device, as detailed below:

[0084] Beam detection device, such as Figure 6-9 As shown, it includes:

[0085] A spot morphology detector 16 is disposed in the optical path of the laser beam. The laser beam illuminates the spot morphology detector 16 to form a spot, allowing the spot morphology detector 16 to detect the spot. In some embodiments, the detection method of the spot morphology detector 16 involves illuminating the spot morphology detector 16 with the laser beam and then using the spot morphology detector 16 to detect the spot. This detection method does not require reflection of the spot, thus enabling more accurate detection of the spot parameters.

[0086] A three-dimensional motion platform 14 is disposed below the workpiece stage 1301 and is connected to the spot morphology detector 16. The three-dimensional motion platform 14 can drive the spot morphology detector 16 to rise to the first plane where it is located during wafer processing, and drive the spot morphology detector 16 to move synchronously with the laser beam along the annealing processing path within the first plane. In some embodiments, since the spot morphology detector 16 needs to be irradiated by the laser to form a spot when detecting the spot, the three-dimensional motion platform 14 is used to drive the spot morphology detector 16 to move synchronously with the laser beam to ensure that the laser beam can always irradiate the spot morphology detector 16.

[0087] As an optional implementation, the three-dimensional motion platform 14 includes:

[0088] Both vertical tracks 1401 are fixedly connected to the side wall of the processing cavity of the laser annealing equipment; the two vertical tracks 1401 provide a basis for the vertical movement of the spot morphology detector 16.

[0089] The first horizontal track 1403 is slidably connected to the two vertical motion tracks;

[0090] The second horizontal track 1404 is slidably connected to the first horizontal motion track 1403, and the second horizontal track 1404 is set perpendicular to the first horizontal track 1403.

[0091] A support platform, slidably connected to the second horizontal track 1404, is used to mount the spot morphology detector 16. The vertically arranged first and second horizontal tracks 1403 and 1404 give the spot morphology detector 16 two degrees of freedom in the horizontal direction. Through the coordination of these two directions of motion, the spot morphology detector 16 can move along any track within the horizontal plane. In a preferred embodiment, a support beam 1402 can be set between the two vertical tracks 1401, with the first horizontal track 1403 perpendicular to the support beam. Thus, when the second horizontal track 1404 slides along the first horizontal track 1403, the extended portion of the second horizontal track 1404 will not be in the same plane as the two vertical tracks 1401. Therefore, it is not necessary to reserve space between the two vertical tracks 1401 to avoid this extended portion, reducing the space occupied by the three-dimensional motion platform 14.

[0092] Controllable microlens array 11 cleaning device such as Figure 10-11 As shown, it includes:

[0093] An annular fastener 19 is arranged around the controllable microlens array 11; in some embodiments, the annular fastener 19 is a fixing frame for fixing the controllable microlens array 11, and can also be used to fix the gas ejection module 9 and the gas discharge module 10.

[0094] A gas ejection module 9 is connected to the inner sidewall of the annular fixing member 19 and is disposed above the controllable microlens array 11. In some embodiments, the gas ejection module 9 is used to eject gas, which blows across the surface of the controllable microlens array 11 to clean dust from the surface of the controllable microlens array 11. In some embodiments, non-corrosive or non-oxidizing gases such as nitrogen or inert gases can be selected.

[0095] A gas exhaust module 10 is connected to the inner sidewall of the annular fixing member 19. The gas exhaust module 10 is disposed above the controllable microlens array 11 and opposite to the gas ejection module 9. In some embodiments, the gas exhaust module 10 is used to exhaust gas and simultaneously remove dust blown up by the gas. Because the gas ejected from the gas ejection module 9 is discharged by the gas exhaust module 10, the pressure in the space where the controllable microlens array 11 is located can be maintained within a reasonable range, preventing the controllable microlens array 11 from being subjected to abnormal gas pressure and ensuring the safety of the controllable microlens array 11.

[0096] In the technical solution provided in this embodiment, a gas ejection module 9 blows gas out of the controllable microlens array 11, and a gas discharge module 10 discharges the gas. While the controllable microlens array 11 is being cleaned with gas, the air pressure in the space where the position controllable microlens 1101 is located is balanced, ensuring that the controllable microlens array 11 will not be subjected to abnormal gas pressure and avoiding damage to the controllable microlens 1101.

[0097] As an optional implementation, the top opening of the annular fixing member 19 is provided with a top protective glass 17, and the bottom opening of the annular fixing member 19 is provided with a bottom protective glass 18. In some embodiments, the annular fixing member 19, the top protective glass 17, and the bottom protective glass 18 form a substantially sealed cavity, within which the controllable microlens array 11, the gas ejection module 9, and the gas exhaust module 10 are all disposed. By employing the technical solution of this embodiment, the top protective glass 17 and the bottom protective glass 18 can provide a certain degree of protection for the controllable microlens array 11. On the one hand, this reduces the amount of dust on the surface of the controllable microlens 1101; on the other hand, it prevents large dust particles from settling on the surface of the controllable microlens 1101. Therefore, cleaning a small amount of small dust particles can be achieved using a smaller gas flow rate and a lower gas velocity. Excessive gas flow rate avoids abnormal gas pressure on the controllable microlens array 11, and excessively high gas velocity also prevents the application of excessive stress to the surface of the controllable microlens array 11.

[0098] As an optional implementation, it also includes:

[0099] The first flow monitoring module is mounted on the annular fixing member 19 and is used to detect the first flow rate of the gas ejected by the gas ejection module 9.

[0100] The second flow monitoring module is mounted on the annular fixing member 19 and is used to detect the second flow rate of the gas discharged by the gas discharge module 10.

[0101] In this embodiment, a first flow monitoring module and a second flow monitoring module are used to detect the flow rates of the injected gas and the discharged gas, so as to avoid the difference between the two causing the space where the controllable microlens array 11 is located to have a high positive pressure or a low negative pressure.

[0102] As an optional implementation, it also includes:

[0103] A first regulating module is connected to the gas ejection module 9. The first regulating module is used to regulate the first flow rate of the gas ejection module 9. In some embodiments, the first regulating module can be a valve installed on the gas delivery pipeline that can regulate the gas delivery flow rate.

[0104] The second regulating module is connected to the gas discharge module 10. The second regulating module is used to regulate the second flow rate of the gas discharge module 10. In some embodiments, the second regulating module can be a valve that can regulate the gas discharge flow rate and is installed on the gas discharge pipeline.

[0105] A balancing module, communicatively connected to both the first and second flow monitoring modules, is used to control either the first adjustment module to adjust the first flow or the second adjustment module to adjust the second flow based on the difference between the first and second flow rates. In some embodiments, the balancing module adjusts the first and second adjustment modules based on the difference between the first and second flow rates to maintain the first and second flow rates equal, thereby ensuring that the spatial pressure of the controllable microlens array 11 remains constant.

[0106] As an optional implementation, it also includes:

[0107] A protection module, communicatively connected to the first flow monitoring module and the second flow monitoring module, is used to shut down the gas ejection module 9 and the gas discharge module 10 when the difference between the first flow and the second flow exceeds a predetermined threshold. In some embodiments, to prevent damage to the controllable microlens array 11 caused by adjustment errors in the balancing module, this embodiment includes a protection module that stops the device from operating when the difference between the first flow and the second flow exceeds a predetermined threshold, thereby protecting the device from damage.

[0108] As an optional implementation, it also includes:

[0109] A linkage module, communicatively connected to the laser generator 1, gas ejection module 9, and gas exhaust module 10, is used to shut down the gas ejection module 9 and the gas exhaust module 10 before the laser generator 1 is turned on, and to turn them on after the laser generator 1 is turned off. In some embodiments, since gas flow may affect the laser processing process, it is necessary to stop the gas flow during laser processing. The linkage module is used to link with the laser generator 1, shutting down the gas ejection module 9 and the gas exhaust module 10 before the laser generator 1 is turned on, and continuously using gas to clean the controllable microlens array 11 after the laser generator 1 is turned off.

[0110] As an optional implementation, it also includes:

[0111] A pneumatic pressure control module, communicatively connected to the laser generator 1, is used to acquire the operating status of the laser generator 1. When the laser generator 1 is in a ready state, the module controls the inlet pressure of the gas ejection module 9 to 1.6 MPa; when the laser generator 1 is in a standby or maintenance state, the module controls the inlet pressure of the gas ejection module 9 to 0.6 MPa. In some embodiments, when the laser generator 1 is in a ready state, it indicates that the device has been stopped for a relatively long time, requiring a higher gas pressure to clean the controllable microlens 1101. Conversely, when the laser generator 1 is in a standby or maintenance state, it indicates that the previous stop time was shorter, thus requiring only a lower inlet pressure for cleaning.

[0112] As an optional implementation, the gas ejection module 9 has a strip-shaped outlet; the gas discharge module 10 has a strip-shaped inlet. The strip-shaped inlet and outlet allow the gas to cover a larger area, improving the cleaning effect on the controllable microlens array 11.

[0113] As an optional implementation, the outlet of the gas ejection module 9 and the inlet of the gas discharge module 10 are arranged parallel to each other at the same height. When they are arranged at the same height, the gas can be discharged from the space as quickly as possible. At the same time, the gas flow direction can form a relatively stable plane, avoiding the gas from causing additional stress on the controllable microlens array 11.

[0114] As an optional implementation, the common plane of the gas outlet of the gas ejection module 9 and the gas inlet of the gas discharge module 10 is parallel to the controllable microlens array 11. In some embodiments, a gas flow plane parallel to the controllable microlens array 11 can minimize the stress exerted by the gas on the controllable microlens array 11, thereby avoiding additional stress on the controllable microlens array 11.

[0115] In the above embodiments, the controllable microlens array 11 of the optical shaping device, the cleaning device, and the beam detection device are all disposed in the processing cavity 12. A window lens 15 is disposed at the bottom of the processing cavity 12. The three-dimensional motion platform 14 of the beam detection device and the spot morphology detector 16 are disposed on the processing platform 13 located inside the processing cavity 12.

[0116] When processing is performed using the aforementioned laser annealing equipment, the process is as follows: Figure 12 As shown, in addition to the optical shaping methods mentioned above, it also includes beam detection methods, specifically including:

[0117] The spot morphology detector 16 is controlled to rise to the plane in which the wafer is located during wafer processing. In some embodiments, the spot morphology detector 16 is raised to the plane in which the wafer is located during wafer processing, so that the plane in which the spot is formed is on the same plane as the wafer processing process, which is beneficial for accurate simulation of the wafer processing process.

[0118] The control galvanometer system 4 drives the laser beam 8 to reflect, so that the laser spot moves along the processing path during annealing. In some embodiments, the galvanometer system 4 drives the laser beam to move along the processing path during annealing, completely simulating the wafer processing process, so that the spot parameters obtained by subsequent measurements can be closer to the parameters in the wafer processing process.

[0119] The laser spot morphology detector 16 is controlled to move synchronously with the laser spot along the processing path during annealing, so that the laser spot irradiates the laser spot morphology detector 16, and the parameters of the laser spot are acquired in real time. In some embodiments, when the laser morphology detector detects the laser spot, it needs to irradiate the laser beam onto the laser spot morphology detector 16 to form a laser spot. To ensure that the laser morphology detector can detect the laser spot, the laser spot morphology detector 16 needs to move synchronously with the moving path of the laser beam.

[0120] In the technical solution provided in this embodiment, a three-dimensional motion platform 14 drives the spot morphology detector 16 to move, thereby causing the laser spot to illuminate the spot morphology detector 16 and directly detect the laser spot without reflection, resulting in extremely high accuracy of the measured laser spot parameters. Furthermore, during the detection process, the movement path of the laser beam and the movement path of the spot morphology detector 16 can be made the same as the path during the wafer annealing process, thus completely simulating the laser annealing process and measuring the spot parameters more accurately.

[0121] In a preferred embodiment, the parameters of the light spot include: the position parameters of the light spot, and the light spot size and light spot quality corresponding to the position parameters of the light spot.

[0122] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An optical shaping device, characterized in that, Used to simulate the laser annealing process for laser shaping, including: A laser generator is used to produce a laser beam; A controllable microlens array includes multiple controllable microlenses arranged in an array manner; the laser beam is shaped by two or more controllable microlenses to form two or more laser beams to be superimposed. A driving mechanism is used to drive the laser beam to sequentially irradiate at least a portion of the controllable microlenses along a predetermined path, so that the controllable microlenses shape the laser beam; wherein, as the laser beam moves along the predetermined path, the laser spot formed by the laser beam on the controllable microlens array will sequentially cover a portion of the controllable microlenses along the predetermined path. The detection module is used to detect the light spot formed by the shaped laser beam at a predetermined position in three-dimensional space in order to obtain the light spot parameters; The host computer is communicatively connected to the detection module and the controllable microlens array. The host computer adjusts the controllable microlens at the corresponding positions based on the light spot parameters and the position information corresponding to the light spot parameters. A Fourier lens is disposed in the optical path of the laser beams to be superimposed, and the Fourier lens is used to superimpose two or more laser beams into one laser beam.

2. The optical shaping device according to claim 1, characterized in that, The detection module includes: A spot morphology detector is disposed in the optical path of the laser beam. The laser beam illuminates the spot morphology detector to form a spot, so that the spot morphology detector can detect the spot. A motion platform, connected to the light spot morphology detector, is used to drive the light spot morphology detector to move along a path formed by multiple predetermined positions, so that the light spot morphology detector is on the shaped laser beam path.

3. The optical shaping device according to claim 2, characterized in that, It also includes a wafer thickness detection module for detecting the thickness of the wafer to be processed; The motion platform is also used to drive the spot morphology detector to a predetermined height based on the workpiece stage height and the thickness of the wafer to be processed.

4. The optical shaping device according to claim 1, characterized in that, The controllable microlens can be circular or square.

5. An optical shaping method, characterized in that, Used to simulate the laser annealing process for laser shaping, including: A laser beam is scanned along a predetermined path on a controllable microlens array so that some of the controllable microlenses in the array shape the laser beam; wherein, as the laser beam moves along the predetermined path, the laser spot formed by the laser beam on the controllable microlens array will sequentially cover some of the controllable microlenses along the predetermined path. Multiple light spots formed by a shaped laser beam along a predetermined path are detected sequentially in three-dimensional space to obtain the light spot parameters of the multiple light spots; Based on the predetermined target parameters, determine whether the parameters of the multiple light spots meet the requirements; Adjust the controllable microlens corresponding to the non-compliant spot parameters so that the controllable microlens can shape the laser beam to form a compliant spot on a predetermined path; The process of sequentially irradiating a controllable microlens array with a laser beam along a predetermined path includes: The laser beam is divided into two or more laser beams to be superimposed using two or more controllable microlenses; The laser beams to be superimposed are superimposed into a single laser beam using a Fourier lens.

6. The optical shaping method according to claim 5, characterized in that, Sequentially irradiating a controllable microlens array with a laser beam along a predetermined path includes: sequentially irradiating two or more controllable microlenses with a laser beam along a predetermined path.

7. The optical shaping method according to claim 5, characterized in that, The process of sequentially detecting multiple light spots formed by the shaped laser beam along a predetermined path includes: The spot morphology detector is set on the plane where the wafer is processed; The spot morphology detector is controlled to move along a predetermined path so that the shaped laser beam irradiates the spot morphology detector to form a spot; A spot morphology detector is used to detect the spot in real time to obtain the spot parameters.

8. The optical shaping method according to claim 7, characterized in that, Before setting the spot morphology inspection instrument on the plane where the wafer is processed, the following steps are included: Inspect the thickness of the wafer to be processed; The plane on which the wafer is located during processing is determined based on the thickness of the wafer to be processed and the height of the workpiece stage.

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