热电元件
By designing specific structures and material combinations in thermoelectric elements, including metal substrates, insulating layers, and electrode components, the problems of insufficient heat transfer performance and voltage withstand performance under high pressure conditions are solved, achieving higher thermal conductivity and insulation resistance, and ensuring the stability of the elements.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- LG INNOTEK CO LTD
- Filing Date
- 2020-11-09
- Publication Date
- 2026-07-17
AI Technical Summary
Existing thermoelectric elements have problems with insufficient heat transfer performance and voltage withstand performance under high pressure environment.
The structure includes a first metal substrate, a first insulating layer, a first electrode component, a semiconductor structure, a second electrode component, a second insulating layer, and a second metal substrate. The shortest distance between the extension of the first electrode component and the second outer periphery is within ±10%, the thickness of the insulating layer is within a specific range, and the stability of the structure is improved by connecting components and heat sinks.
It improves the thermal conductivity and voltage withstand performance of thermoelectric elements, enhances insulation resistance, and ensures stable operation under high-voltage environments.
Smart Images
Figure CN112786770B_ABST