Optical device packaging

Abstract

The present invention provides an optical device package, comprising: a carrier having a first surface and a second surface recessed relative to the first surface; and a cover disposed on the second surface of the carrier.

Description

Technical Field

[0001] The present invention relates to an optical device package, and more particularly, to a package structure with low manufacturing cost and confidentiality performance. Background Art

[0002] The optical device package may include some semiconductor devices on a carrier. Some of the semiconductor devices may be integrated or embedded in the carrier to achieve miniaturization. However, it may be unavoidable to increase the cost of integrating or embedding the semiconductor devices in the carrier. Summary of the invention

[0003] In some embodiments, an optical device package includes a carrier and a cover. The carrier includes a first surface and a second surface that is concave relative to the first surface. The cover is disposed on the second surface of the carrier.

[0004] In some embodiments, an optical device package includes a carrier and a cover. The carrier includes a first surface and a second surface. The cover includes a first surface supported by the second surface of the carrier. The first surface of the carrier and the first surface of the cover are not in the same plane.

[0005] In some embodiments, a method of manufacturing an optical device package includes: providing a carrier; removing a portion of the carrier so that the carrier has a first surface and a second surface that is recessed relative to the first surface; and disposing a cover on the second surface of the carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 depicts a cross-sectional view of an optical device package according to some embodiments of the present invention;

[0007] Figure 2 depicts a cross-sectional view of an optical device package according to some embodiments of the present invention;

[0008] Figure 3 depicts a cross-sectional view of an optical device package according to some embodiments of the present invention;

[0009] Figure 4 depicts a cross-sectional view of an optical device package according to some embodiments of the present invention;

[0010] Figure 5 depicts a cross-sectional view of an optical device package according to some embodiments of the present invention;

[0011] Figure 6 depicts a cross-sectional view of an optical device package according to some embodiments of the present invention;

[0012] Figure 7 depicts a cross-sectional view of an optical device package according to some embodiments of the present invention;

[0013] Figure 8 depicts a cross-sectional view of an optical device package according to some embodiments of the present invention;

[0014] Fig. 9 depicts a cross-sectional view of an optical device package according to some embodiments of the present invention;

[0015] Fig.10 depicts a cross-sectional view of an optical device package according to some embodiments of the present invention;

[0016] Fig.11 depicts a cross-sectional view of an optical device package according to some embodiments of the present invention;

[0017] Fig.12 depicts a cross-sectional view of an optical device package according to some embodiments of the present invention;

[0018] Fig.13 depicts a cross-sectional view of an optical device package according to some embodiments of the present invention;

[0019] Fig.14 depicts a cross-sectional view of an optical device package according to some embodiments of the present invention;

[0020] Fig.15 depicts a cross-sectional view of an optical device package according to some embodiments of the present invention;

[0021] Fig.16 depicts a cross-sectional view of an optical device package according to some embodiments of the present invention; and

[0022] Fig.17A , 17B , 17C, 17D, 17E, 17F, 17G, 17H, 17I and 17J illustrate one or more stages in a method of manufacturing an optical device package according to some embodiments of the present invention.

[0023] Fig.18A , 18B , 18C, 18D, 18E, 18F, 18G, 18H, 18I and 18J illustrate one or more stages in a method of manufacturing an optical device package according to some embodiments of the present invention.

[0024] Common reference numerals are used throughout the drawings and detailed description to indicate the same or similar components. The present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. DETAILED DESCRIPTION

[0025] The foregoing description and the following detailed description are exemplary for the purpose of further illustrating the scope of the present invention. Other objects and advantages associated with the present invention will be explained in the subsequent description and the accompanying drawings.

[0026] Unless otherwise specified, spatial descriptions such as "above", "below", "upward", "left", "right", "downward", "top", "bottom", "vertical", "horizontal", "side", "higher", "lower", "upper", "above", "below", etc. are indicated relative to the orientation shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes and that actual implementations of the structures described herein may be spatially arranged in any orientation or manner, with the limitation that the advantages of the embodiments of the present invention are not deviated by such arrangements.

[0027] Figure 1 A cross-sectional view of an optical device package 1 according to some embodiments of the present invention is shown. The optical device package 1 includes a carrier 10 and a cover 17. In some embodiments, the carrier 10 may include a ceramic material or a metal plate. In some embodiments, the carrier 10 may be a substrate, an organic substrate, or a lead frame. In some embodiments, the carrier 10 may include a plurality of traces. Figure 1 The carrier 10 shown in the figure includes a redistribution structure 11 , an electrical connector 12 , a packaging body 13 , a semiconductor device 14 , an optical element 15 and a bottom filling layer 16 .

[0028] The redistribution structure 11 has a surface 111 and a surface 112 opposite to the surface 111. At least one of the electrical connectors 12 is on the surface 112 of the redistribution structure 11. The encapsulation body 13 encapsulates the surface 112 and the side surface 113 of the redistribution structure 11 and the electrical connectors 12. A portion of each electrical connector 12 is exposed by the encapsulation body 13.

[0029] The semiconductor device 14 is mounted on the surface 112 of the redistribution structure 11. The semiconductor device 14 and the redistribution structure 11 are electrically connected by bumps 141. In some embodiments, the space between the bumps 141 is filled by an underfill layer 16. The electrical connector 12 surrounds the periphery of the semiconductor device 14 and is used to fan out the input and output of the semiconductor device 14. The optical element 15 (e.g., an optical emitter or an optical detector) is mounted on the surface 111 of the redistribution structure 11 and is electrically connected to the redistribution structure.

[0030] like Figure 1As shown in FIG. 1 , the encapsulation body 13 encapsulates the surface 112 and the side surface 113 of the redistribution structure 11 and the electrical connector 12. The encapsulation body 13 has a surface 131, a surface 132 that is recessed relative to the surface 131, and a surface 135 that connects the surfaces 131 and 132. The surface 131 of the encapsulation body 13 may be substantially coplanar with the surface 111 of the redistribution structure 11, and thus the surface 132 of the encapsulation body 13 is smaller in height than the surface 131 of the encapsulation body 13 and the surface 111 of the redistribution structure 11. In addition, the surface 132 is adjacent to the side surface 133 of the encapsulation body 13.

[0031] In view of the above, see Figure 1 , the carrier 10 has a concave portion formed by surfaces 132 and 135 on its side.

[0032] In addition, a cover 17 is arranged on the carrier 10. Figure 1 The cover 17 is disposed on the surface 132 of the encapsulation body 13 by means of an adhesive 19. The adhesive 19 may be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. Specifically, Figure 1 , the adhesive 19 is generally arranged on the surface 132 of the encapsulation body 13 and the side surface 135 of the encapsulation body 13, which is connected to the surfaces 131 and 132 of the encapsulation body 13. That is, the adhesive 19 is arranged at the recessed portion of the carrier 10 and is generally between the cover 17 and the carrier 10. In addition, since the adhesive 19 is arranged at the recessed portion of the carrier 10, the adhesive 19 may not migrate on the surface 131 and the surface 111 to cover the wire 151. During the assembly process such as the heating or curing process, the wire 151 is not pulled and dragged by the adhesive 19. The cover 17 has a surface 172 supported by the surface 132 of the encapsulation body 13. Therefore, the surface 172 of the cover 17 is smaller in height than the surface 131 of the encapsulation body 13 and the surface 111 of the redistribution structure 11. In other words, the surface 172 of the cover 17 is disposed at different heights from the surface 131 of the encapsulation body 13 and the surface 111 of the redistribution structure 11. In some embodiments, the surface 173 of the cover 17 and the side surface 133 of the encapsulation body 13 may not be coplanar with each other.

[0033] The cover 17 has an aperture 175 at the top thereof, and the aperture 175 is substantially aligned with the optical element 15. The filter material 18 is arranged in the aperture 175. In addition, since the cover 17 can be formed by injection molding, the roughness of the outer surface of the cover 17 can be substantially uniform. That is, the roughness of the side surface 173 of the cover 17 can be the same as the roughness of the top surface 171 of the cover 17.

[0034] Figure 2 A cross-sectional view of an optical device package 1 according to some embodiments of the present invention is shown. Figure 2The optical device package 1 shown in FIG. 1 is similar in some respects to the Figure 1 The optical device package 1 shown in Figure 2 The substrate 100 is attached to a surface 134 of the encapsulation body 13 and electrically connected to the electrical connector 12, the surface 134 being opposite to the surface 131 of the encapsulation body 13. In addition, the electrical connector 12 may not be exposed. Therefore, in at least some embodiments, the optical device package 1 further includes the substrate 100, and the encapsulation body 13 encapsulates the surface 112 and the side surface 113 of the redistribution structure 11, the surface 101 of the substrate 100, and the electrical connector 12.

[0035] Figure 3 A cross-sectional view of an optical device package 2 according to some embodiments of the present invention is shown. The optical device package 2 includes a carrier 20 and a cover 27. In some embodiments, the carrier 20 may include a ceramic material or a metal plate. In some embodiments, the carrier 20 may be a substrate, an organic substrate, or a lead frame. In some embodiments, the carrier 20 may include a plurality of traces. Figure 3 The carrier 20 shown in the figure includes a redistribution structure 21 , an electrical connection 22 , a packaging body 23 , a semiconductor device 24 , an optical element 25 and a bottom filling layer 26 .

[0036] The redistribution structure 21 has a surface 211 and a surface 212 opposite to the surface 211. At least one of the electrical connectors 22 is on the surface 212 of the redistribution structure 21. The encapsulation body 23 encapsulates the surface 212 and the side surface 213 of the redistribution structure 21 and the electrical connectors 22. A portion of each electrical connector 22 is exposed by the encapsulation body 23.

[0037] The semiconductor device 24 is mounted on the surface 212 of the redistribution structure 21. The semiconductor device 24 and the redistribution structure 21 are electrically connected by bumps 241. In some embodiments, the space between the bumps 241 is filled by a bottom fill layer 26. The electrical connector 22 surrounds the periphery of the semiconductor device 24 and is used to fan out the input and output of the semiconductor device 24. The optical element 25 is mounted on the surface 211 of the redistribution structure 21 and is electrically connected to the redistribution structure. Regarding the two optical elements 25, they can be two optical emitters or two optical detectors, or one is an optical emitter and the other is an optical detector.

[0038] like Figure 3As shown in FIG. 1 , the encapsulation body 23 encapsulates the surface 212 and the side surface 213 of the redistribution structure 21 and the electrical connector 22. The encapsulation body 23 has a surface 231, a surface 232 that is recessed relative to the surface 231, and a surface 235 that connects the surfaces 231 and 232. The surface 231 of the encapsulation body 23 may be substantially coplanar with the surface 211 of the redistribution structure 21, and thus the surface 232 of the encapsulation body 23 is smaller in height than the surface 231 of the encapsulation body 23 and the surface 211 of the redistribution structure 21. In addition, the surface 232 is adjacent to the side surface 233 of the encapsulation body 23.

[0039] In view of the above, see Figure 3 , the carrier 20 has a concave portion formed by surfaces 232 and 235 on its side.

[0040] In addition, a cover 27 is arranged on the carrier 20. Figure 3 The cover 27 is disposed on the surface 211 of the redistribution structure 21 and the surface 232 of the encapsulation body 23 by means of an adhesive 29. The adhesive 29 may be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. Specifically, Figure 3 , the adhesive 29 is generally arranged on the surface 232 of the encapsulation body 23 and the side surface 235 of the encapsulation body 23 and on the first surface 211 of the redistribution structure 21, which is connected to the surfaces 231 and 232 of the encapsulation body 23. That is, the adhesive 29 is arranged at the recessed portion of the carrier 20 and is generally between the cover 27 and the carrier 20. In addition, since the adhesive 29 is arranged at the recessed portion of the carrier 20, the adhesive 29 may not migrate on the surfaces 231 and the surface 211 to cover the wire 251. During the assembly process such as the heating or curing process, the wire 251 is not pulled and dragged by the adhesive 29. The cover 27 has a surface 272 supported by the surface 232 of the encapsulation body 23. Therefore, the surface 272 of the cover 27 is smaller in height than the surface 231 of the encapsulation body 23 and the surface 211 of the redistribution structure 21. In other words, surface 272 of cover 27 is disposed at different heights from surface 231 of encapsulation body 23 and surface 211 of redistribution structure 21. In addition, cover 27 may have inner wall 274 that isolates optical elements 25 from each other. Inner wall 274 of cover 27 has surface 276 supported by surface 211 of redistribution structure 21. Therefore, surface 272 is smaller in height than surface 276. That is, surfaces 272 and 276 of cover 27 are disposed at different heights. In some embodiments, surface 273 of cover 27 and side surface 233 of encapsulation body 23 may not be coplanar with each other.

[0041] The cover 27 has two apertures 275 at the top thereof, and each of the apertures 275 is substantially aligned with the optical element 25. In addition, the filter materials 28 are respectively arranged in the apertures 275. In addition, since the cover 27 can be formed by injection molding, the roughness of the outer surface of the cover 27 can be substantially uniform. That is, the roughness of the side surface 273 of the cover 27 can be the same as the roughness of the top surface 271 of the cover 27.

[0042] Figure 4 A cross-sectional view of an optical device package 2 according to some embodiments of the present invention is shown. Figure 4 The optical device package 2 shown in FIG. 1 is similar in some respects to the Figure 3 The optical device package 2 shown in FIG. Figure 4 The substrate 200 is attached to a surface 234 of the encapsulation body 23 and electrically connected to the electrical connector 22, the surface 234 being opposite to the surface 231 of the encapsulation body 23. In addition, the electrical connector 22 may not be exposed. Therefore, in at least some embodiments, the optical device package 2 further includes the substrate 200, and the encapsulation body 23 encapsulates the surface 212 and the side surface 213 of the redistribution structure 21, the surface 201 of the substrate 200, and the electrical connector 22.

[0043] Figure 5 A cross-sectional view of an optical device package 3 according to some embodiments of the present invention is shown. The optical device package 3 includes a carrier 30 and a cover 37. In some embodiments, the carrier 30 may include a ceramic material or a metal plate. In some embodiments, the carrier 30 may be a substrate, an organic substrate, or a lead frame. In some embodiments, the carrier 30 may include a plurality of traces. Figure 5 The carrier 30 shown in the figure includes a redistribution structure 31 , an electrical connector 32 , a packaging body 33 , a semiconductor device 34 , an optical element 35 and a bottom filling layer 36 .

[0044] Redistribution structure 31 has a surface 311 and a surface 312 opposite to surface 311. At least one of electrical connectors 32 is on surface 312 of redistribution structure 31. Encapsulation body 33 encapsulates surface 312 of redistribution structure 31 and electrical connectors 32. A portion of each electrical connector 32 is exposed by encapsulation body 33. In addition, redistribution structure 31 has a side surface 313, and some electroplating lines may be exposed on side surface 313.

[0045] The semiconductor device 34 is mounted on the surface 312 of the redistribution structure 31. The semiconductor device 34 and the redistribution structure 31 are electrically connected by bumps 341. In some embodiments, the space between the bumps 341 is filled by an underfill layer 36. The electrical connector 32 surrounds the periphery of the semiconductor device 34 and is used to fan out the input and output of the semiconductor device 34. The optical element 35 (e.g., an optical emitter or an optical detector) is mounted on the surface 311 of the redistribution structure 31 and is electrically connected to the redistribution structure.

[0046] like Figure 5 As shown in FIG. 1 , the encapsulation body 33 encapsulates the surface 312 of the redistribution structure 31 and the electrical connector 32. Therefore, the encapsulation body 33 has a surface 331 that is recessed relative to the surface 311 of the redistribution structure 31 and is adjacent to the side surface 313 of the redistribution structure 31. That is, the surface 331 of the encapsulation body 33 is smaller in height than the surface 311 of the redistribution structure 31. In addition, the surface 331 of the encapsulation body 33 may be coplanar with the surface 312 of the redistribution structure 31.

[0047] In view of the above, see Figure 5 , the carrier 30 has a concave portion formed by the surfaces 331 and 313 on its side.

[0048] In addition, a cover 37 is arranged on the carrier 30. Figure 5 The cover 37 is disposed on the surface 331 of the encapsulation body 33 by means of an adhesive 39. The adhesive 39 may be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. Specifically, Figure 5 , the adhesive 39 is generally arranged on the surface 331 of the encapsulation body 33 and the side surface 313 of the redistribution structure 31, which connects the surface 311 of the redistribution structure 31 and the surface 331 of the encapsulation body 33. That is, the adhesive 39 is arranged at the recessed portion of the carrier 30 and is generally between the cover 37 and the carrier 30. In addition, since the adhesive 39 is arranged at the recessed portion of the carrier 30, the adhesive 39 may not penetrate on the surface 311 to cover the wire 351. During the assembly process such as the heating or curing process, the wire 351 is not pulled and dragged by the adhesive 39. The cover 37 has a surface 372 supported by the surface 332 of the encapsulation body 33. Therefore, the surface 372 of the cover 37 is smaller in height than the surface 311 of the redistribution structure 31. In other words, the surface 372 of the cover 37 and the surface 311 of the redistribution structure 31 are disposed at different heights. In some embodiments, the surface 373 of the cover 37 and the side surface 333 of the encapsulation body 33 may not be coplanar with each other.

[0049] The cover 37 has an aperture 375 at the top thereof, and the aperture 375 is substantially aligned with the optical element 35. The filter material 38 is arranged in the aperture 375. In addition, since the cover 37 can be formed by injection molding, the roughness of the outer surface of the cover 37 can be substantially uniform. That is, the roughness of the side surface 373 of the cover 37 can be the same as the roughness of the top surface 371 of the cover 37.

[0050] Figure 6 A cross-sectional view of an optical device package 3 according to some embodiments of the present invention is shown. Figure 6 The optical device package 3 shown in FIG. 1 is similar in some respects to the Figure 5 The optical device package 3 shown in FIG. Figure 6 The substrate 300 is attached to a surface 334 of the encapsulation body 33 and electrically connected to the electrical connector 32, the surface 334 being opposite to the surface 331 of the encapsulation body 33. In addition, the electrical connector 32 may not be exposed. Therefore, in at least some embodiments, the optical device package 3 further includes the substrate 300, and the encapsulation body 33 encapsulates the surface 312 of the redistribution structure 31, the surface 301 of the substrate 300, and the electrical connector 32.

[0051] Figure 7 A cross-sectional view of an optical device package 4 according to some embodiments of the present invention is depicted. The optical device package 4 includes a carrier 40 and a cover 47. In some embodiments, the carrier 40 may include a ceramic material or a metal plate. In some embodiments, the carrier 40 may be a substrate, an organic substrate, or a lead frame. In some embodiments, the carrier 40 may include a plurality of traces. Figure 7 The carrier 40 shown in the figure includes a redistribution structure 41 , an electrical connector 42 , a packaging body 43 , a semiconductor device 44 , an optical element 45 and a bottom filling layer 46 .

[0052] Redistribution structure 41 has a surface 411 and a surface 412 opposite to surface 411. At least one of electrical connectors 42 is on surface 412 of redistribution structure 41. Encapsulation body 43 encapsulates surface 412 of redistribution structure 41 and electrical connectors 42. A portion of each electrical connector 42 is exposed by encapsulation body 43. In addition, redistribution structure 41 has a side surface 413, and some electroplating lines may be exposed on side surface 413.

[0053] The semiconductor device 44 is mounted on the surface 412 of the redistribution structure 41. The semiconductor device 44 and the redistribution structure 41 are electrically connected by bumps 441. In some embodiments, the space between the bumps 441 is filled by an underfill layer 46. The electrical connector 42 surrounds the periphery of the semiconductor device 44 and is used to fan out the input and output of the semiconductor device 44. The optical element 45 is mounted on the surface 411 of the redistribution structure 41 and is electrically connected to the redistribution structure. Regarding the two optical elements 45, they can be two optical emitters or two optical detectors, or one is an optical emitter and the other is an optical detector.

[0054] like Figure 7 As shown in FIG. 4 , encapsulation body 43 encapsulates surface 412 of redistribution structure 41 and electrical connector 42. Encapsulation body 43 has surface 431 that is recessed relative to surface 411 of redistribution structure 41 and is adjacent to side surface 413 of redistribution structure 41. Therefore, surface 431 of encapsulation body 43 is smaller in height than surface 411 of redistribution structure 41. In addition, surface 431 of encapsulation body 43 may be coplanar with surface 412 of redistribution structure 41.

[0055] In view of the above, see Figure 7 , the carrier 40 has a concave portion formed by the surfaces 431 and 413 on its side.

[0056] In addition, a cover 47 is arranged on the carrier 40. Figure 7 The cover 47 is disposed on the surface 411 of the redistribution structure 41 and the surface 431 of the encapsulation body 43 by means of an adhesive 49. The adhesive 49 may be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. Specifically, Figure 7, the adhesive 49 is generally arranged on the surface 431 of the encapsulation body 43 and the side surface 413 of the redistribution structure 41, and is arranged on the surface 411 of the redistribution structure 41, which is connected to the surface 411 of the redistribution structure 41 and the surface 431 of the encapsulation body 43. That is, the adhesive 49 is arranged at the recessed portion of the carrier 40 and is generally between the cover 47 and the carrier 40. In addition, since the adhesive 49 is arranged at the recessed portion of the carrier 40, the adhesive 49 may not migrate on the surface 411 to cover the wire 451. During the assembly process such as the heating or curing process, the wire 451 is not pulled and dragged by the adhesive 49. The cover 47 has a surface 472 supported by the surface 431 of the encapsulation body 43. Therefore, the surface 472 of the cover 47 is smaller in height than the surface 411 of the redistribution structure 41. In other words, the surface 472 of the cover 47 and the surface 411 of the redistribution structure 41 are disposed at different heights. In addition, the cover 47 may have an inner wall 474 that isolates the optical elements 45 from each other. The inner wall 474 of the cover 47 has a surface 476 supported by the surface 411 of the redistribution structure 41. Therefore, the surface 472 is smaller in height than the surface 476. That is, the surfaces 472 and 476 of the cover 47 are disposed at different heights. In some embodiments, the surface 473 of the cover 47 and the side surface 433 of the encapsulation body 43 may not be coplanar with each other.

[0057] The cover 47 has two apertures 475 at the top thereof, and each of the apertures 475 is substantially aligned with the optical element 45. In addition, the filter materials 48 are respectively arranged in the apertures 475. In addition, since the cover 47 can be formed by injection molding, the roughness of the outer surface of the cover 47 can be substantially uniform. That is, the roughness of the side surface 473 of the cover 47 can be the same as the roughness of the top surface 471 of the cover 47.

[0058] Figure 8 A cross-sectional view of an optical device package 4 according to some embodiments of the present invention is shown. Figure 8 The optical device package 4 shown in FIG. 4 is similar in some respects to Figure 7 The optical device package 4 shown in FIG. Figure 8 The substrate 400 is attached to a surface 434 of the encapsulation body 43 and electrically connected to the electrical connector 42, the surface 434 being opposite to the surface 431 of the encapsulation body 43. In addition, the electrical connector 42 may not be exposed. Therefore, in at least some embodiments, the optical device package 4 further includes the substrate 400, and the encapsulation body 43 encapsulates the surface 412 of the redistribution structure 41, the surface 401 of the substrate 400, and the electrical connector 42.

[0059] Fig. 9A cross-sectional view of an optical device package 5 according to some embodiments of the present invention is depicted. The optical device package 5 includes a carrier 50 and a cover 57. In some embodiments, the carrier 50 may include a ceramic material or a metal plate. In some embodiments, the carrier 50 may be a substrate, an organic substrate, or a lead frame. In some embodiments, the carrier 50 may include a plurality of traces. Fig. 9 The carrier 50 shown in the figure includes a redistribution structure 51 , an electrical connector 52 , a packaging body 53 , a semiconductor device 54 , an optical element 55 and a bottom filling layer 56 .

[0060] Redistribution structure 51 has surface 511, surface 512 recessed relative to 511, surface 513 opposite to surfaces 511 and 512, surface 514 connecting surfaces 512 and 513, and surface 515 connecting surfaces 511 and 512. At least one of electrical connectors 52 is on surface 513 of redistribution structure 51. Encapsulation body 53 encapsulates surface 513 and side surface 514 of redistribution structure 51 and electrical connectors 52. A portion of each electrical connector 52 is exposed by encapsulation body 53. In addition, some electroplating lines may be exposed on surface 515 of redistribution structure 51.

[0061] Semiconductor device 54 is mounted on surface 513 of redistribution structure 51. Semiconductor device 54 and redistribution structure 51 are electrically connected by bumps 541. In some embodiments, the space between bumps 541 is filled by bottom fill layer 56. Electrical connector 52 surrounds the periphery of semiconductor device 54 and is used to fan out the input and output of semiconductor device 54. Optical element 55 (e.g., optical emitter or optical detector) is mounted on surface 511 of redistribution structure 51 and electrically connected to the redistribution structure.

[0062] As mentioned above, the redistribution structure 51 has a surface 511, a surface 512 that is recessed relative to 511, and a surface 513 that is opposite to the surfaces 511 and 512, and the encapsulation body 53 encapsulates the surface 513 and the side surface 514 of the redistribution structure 51 and the electrical connector 52. The encapsulation body 53 has a surface 531 that may be adjacent to and coplanar with the surface 512 of the redistribution structure 51. That is, the surface 512 of the redistribution structure 51 and the surface 531 of the encapsulation body 53 are smaller in height than the surface 511 of the redistribution structure 51.

[0063] In view of the above, see Fig. 9 , the carrier 50 has a concave portion formed by surfaces 515, 512 and 531 on its side.

[0064] In addition, a cover 57 is arranged on the carrier 50. Fig. 9The cover 57 is disposed on the surface 512 of the redistribution structure 51 and the surface 531 of the encapsulation body 53 by means of an adhesive 59. The adhesive 59 may be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. Specifically, Fig. 9 , adhesive 59 is generally arranged on surface 531 of encapsulation body 53, surface 512 of redistribution structure 51, and side surface 515 of redistribution structure 51, which is connected to surfaces 511 and 512 of redistribution structure 51. That is, adhesive 59 is arranged at the recessed portion of carrier 50 and is generally between cover 57 and carrier 50. In addition, since adhesive 59 is arranged at the recessed portion of carrier 50, adhesive 59 may not migrate on surface 511 to cover wire 551. During an assembly process such as a heating or curing process, wire 551 is not pulled and dragged by adhesive 59. Cover 57 has surface 572 supported by surface 512 of redistribution structure 51 and surface 531 of encapsulation body 53. Therefore, surface 572 of cover 57 is smaller in height than surface 511 of redistribution structure 51. In other words, surface 572 of cover 57 and surface 511 of redistribution structure 51 are disposed at different heights. In some embodiments, the surface 573 of the cover 57 and the side surface 533 of the encapsulation body 53 may not be coplanar with each other.

[0065] The cover 57 has an aperture 575 at the top thereof, and the aperture 575 is substantially aligned with the optical element 55. The filter material 58 is arranged in the aperture 575. In addition, since the cover 57 can be formed by injection molding, the roughness of the outer surface of the cover 57 can be substantially uniform. That is, the roughness of the side surface 573 of the cover 57 can be the same as the roughness of the top surface 571 of the cover 57.

[0066] Fig.10 A cross-sectional view of an optical device package 5 according to some embodiments of the present invention is shown. Fig.10 The optical device package 5 shown in FIG. 5 is similar in some respects to the Fig. 9 The optical device package 5 shown in FIG. Fig.10 The substrate 500 is attached to a surface 534 of the encapsulation body 53 and electrically connected to the electrical connector 52, the surface 534 being opposite to the surface 531 of the encapsulation body 53. In addition, the electrical connector 52 may not be exposed. Therefore, in at least some embodiments, the optical device package 5 further includes the substrate 500, and the encapsulation body 53 encapsulates the surface 513 and the side surface 514 of the redistribution structure 51, the surface 501 of the substrate 500, and the electrical connector 52.

[0067] Fig.11A cross-sectional view of an optical device package 6 according to some embodiments of the present invention is depicted. The optical device package 6 includes a carrier 60 and a cover 67. In some embodiments, the carrier 60 may include a ceramic material or a metal plate. In some embodiments, the carrier 60 may be a substrate, an organic substrate, or a lead frame. In some embodiments, the carrier 60 may include a plurality of traces. Fig.11 The carrier 60 shown in FIG. 1 includes a redistribution structure 61 , an electrical connector 62 , a packaging body 63 , a semiconductor device 64 , an optical element 65 and a bottom filling layer 66 .

[0068] Redistribution structure 61 has surface 611, surface 612 recessed relative to 611, surface 613 opposite to surfaces 611 and 612, surface 614 connecting surfaces 612 and 613, and surface 615 connecting surfaces 611 and 612. At least one of electrical connectors 62 is on surface 613 of redistribution structure 61. Encapsulation body 63 encapsulates surface 613 and side surface 614 of redistribution structure 61 and electrical connectors 62. A portion of each electrical connector 62 is exposed by encapsulation body 63. In addition, some electroplating lines may be exposed on surface 615 of redistribution structure 61.

[0069] The semiconductor device 64 is mounted on the surface 613 of the redistribution structure 61. The semiconductor device 64 and the redistribution structure 61 are electrically connected by bumps 641. In some embodiments, the space between the bumps 641 is filled by an underfill layer 66. The electrical connector 62 surrounds the periphery of the semiconductor device 64 and is used to fan out the input and output of the semiconductor device 64. The optical element 65 is mounted on the surface 611 of the redistribution structure 61 and is electrically connected to the redistribution structure. Regarding the two optical elements 65, they can be two optical emitters or two optical detectors, or one is an optical emitter and the other is an optical detector.

[0070] As mentioned above, the redistribution structure 61 has a surface 611, a surface 612 that is recessed relative to 611, and a surface 613 that is opposite to the surfaces 611 and 612, and the encapsulation body 63 encapsulates the surface 613 and the side surface 614 of the redistribution structure 61 and the electrical connector 62. The encapsulation body 63 has a surface 631 that may be adjacent to and coplanar with the surface 612 of the redistribution structure 61. That is, the surface 612 of the redistribution structure 61 and the surface 631 of the encapsulation body 63 are smaller in height than the surface 611 of the redistribution structure 61.

[0071] In view of the above, see Fig.11 , the carrier 60 has a concave portion formed by surfaces 615, 612 and 631 on its side.

[0072] In addition, a cover 67 is arranged on the carrier 60. Fig.11The cover 67 is disposed on the surface 611 of the redistribution structure 61, the surface 612 of the redistribution structure 61, and the surface 631 of the encapsulation body 63 through the adhesive 69. The adhesive 69 may be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. Specifically, Fig.11 , adhesive 69 is generally arranged on surface 611 of redistribution structure 61, surface 631 of encapsulation body 63, surface 612 of redistribution structure 61, and side surface 615 of redistribution structure 61, which side surface is connected to surfaces 611 and 612 of redistribution structure 61. That is, adhesive 69 is arranged at the recessed portion of carrier 60 and is generally between cover 67 and carrier 60. In addition, since adhesive 69 is arranged at the recessed portion of carrier 60, adhesive 69 may not migrate on surface 611 to cover wire 651. During an assembly process such as a heating or curing process, wire 651 is not pulled and dragged by adhesive 69. Cover 67 has a surface 672 supported by surface 612 of redistribution structure 61 and surface 631 of encapsulation body 63. Therefore, surface 672 of cover 67 is smaller in height than surface 611 of redistribution structure 61. In other words, the surface 672 of the cover 67 and the surface 611 of the redistribution structure 61 are disposed at different heights. In addition, the cover 67 may have an inner wall 674 that isolates the optical elements 65 from each other. The inner wall 674 of the cover 67 has a surface 676 supported by the surface 611 of the redistribution structure 61. Therefore, the surface 672 is smaller in height than the surface 676. That is, the surfaces 672 and 676 of the cover 67 are disposed at different heights. In some embodiments, the surface 673 of the cover 67 and the side surface 633 of the encapsulation body 63 may not be coplanar with each other.

[0073] The cover 67 has two apertures 675 at the top thereof, and each of the apertures 675 is substantially aligned with the optical element 65. In addition, the filter materials 68 are respectively arranged in the apertures 675. In addition, since the cover 67 can be formed by injection molding, the roughness of the outer surface of the cover 67 can be substantially uniform. That is, the roughness of the side surface 673 of the cover 67 can be the same as the roughness of the top surface 671 of the cover 67.

[0074] Fig.12 A cross-sectional view of an optical device package 6 according to some embodiments of the present invention is shown. Fig.12 The optical device package 6 shown in FIG. 6 is similar in some respects to the Fig.11 The optical device package 6 shown in FIG. Fig.12The substrate 600 is attached to a surface 634 of the encapsulation body 63 and electrically connected to the electrical connector 62, the surface 634 being opposite to the surface 631 of the encapsulation body 63. In addition, the electrical connector 62 may not be exposed. Therefore, in at least some embodiments, the optical device package 6 further includes the substrate 600, and the encapsulation body 63 encapsulates the surface 613 and the side surface 614 of the redistribution structure 61, the surface 601 of the substrate 600, and the electrical connector 62.

[0075] Fig.13 A cross-sectional view of an optical device package 7 according to some embodiments of the present invention is shown. The optical device package 7 includes a carrier 70 and a cover 77. In some embodiments, the carrier 70 may include a ceramic material or a metal plate. In some embodiments, the carrier 70 may be a substrate, an organic substrate, or a lead frame. In some embodiments, the carrier 70 may include a plurality of traces. Fig.13 The carrier 70 shown in the figure includes a redistribution structure 71 , an electrical connector 72 , a packaging body 73 , a semiconductor device 74 , an optical element 75 and a bottom filling layer 76 .

[0076] Redistribution structure 71 has a surface 711 and a surface 712 opposite to surface 711. At least one of electrical connectors 72 is on surface 712 of redistribution structure 71. Encapsulation body 73 encapsulates surface 712 of redistribution structure 71 and electrical connectors 72. A portion of each electrical connector 72 is exposed by encapsulation body 73. In addition, redistribution structure 71 has a side surface 713, and some electroplating lines may be exposed on side surface 713.

[0077] The semiconductor device 74 is mounted on the surface 712 of the redistribution structure 71. The semiconductor device 74 and the redistribution structure 71 are electrically connected by bumps 741. In some embodiments, the space between the bumps 741 is filled by an underfill layer 76. The electrical connector 72 surrounds the periphery of the semiconductor device 74 and is used to fan out the input and output of the semiconductor device 74. The optical element 75 (e.g., an optical emitter or an optical detector) is mounted on the surface 711 of the redistribution structure 71 and is electrically connected to the redistribution structure.

[0078] like Fig.13 As shown in FIG. 1 , encapsulation body 73 encapsulates surface 712 of redistribution structure 71 and electrical connector 72. Encapsulation body 73 has surface 731, surface 732 that is recessed relative to surface 731, and side surface 735 connected to surface 731 and surface 732. Surface 731 of encapsulation body 73 is substantially attached to 712 of redistribution structure 71. Side surface 735 of encapsulation body 73 may be adjacent to side surface 713 of redistribution structure 71 and substantially coplanar with side surface 713 of redistribution structure 71. See FIG. Fig.13 , the surface 732 of the encapsulation body 73 is smaller in height than the surface 711 of the redistribution structure 71 .

[0079] In view of the above, see Fig.13 , the carrier 70 has a concave portion formed by surfaces 713, 732 and 735 on its side.

[0080] In addition, a cover 77 is arranged on the carrier 70. Fig.13 , the cover 77 is disposed on the surface 732 of the encapsulation body 73 by means of an adhesive 79. The adhesive 79 may be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. Specifically, if Fig.13 As shown in FIG. 7 , adhesive 79 is generally arranged on surface 732 of encapsulation body 73, side surface 735 of encapsulation body 73, and side surface 713 of redistribution structure 71, side surface 735 connects surface 732 of encapsulation body 73, and side surface 713 connects surface 711 of redistribution structure 71. That is, adhesive 79 is arranged at the recessed portion of carrier 70 and is generally between cover 77 and carrier 70. In addition, since adhesive 79 is arranged at the recessed portion of carrier 70, adhesive 79 may not migrate on surface 711 to cover wire 751. During an assembly process such as a heating or curing process, wire 751 is not pulled and dragged by adhesive 79. Cover 77 has surface 772 supported by surface 732 of encapsulation body 73. Therefore, surface 772 of cover 77 is smaller in height than surface 731 of encapsulation body 73 and surface 711 of redistribution structure 71. In other words, the surface 772 of the cover 77 is disposed at different heights from the surface 731 of the encapsulation body 73 and the surface 711 of the redistribution structure 71. In some embodiments, the surface 773 of the cover 77 and the side surface 733 of the encapsulation body 73 may not be coplanar with each other.

[0081] The cover 77 has an aperture 775 at the top thereof, and the aperture 775 is substantially aligned with the optical element 75. The filter material 78 is arranged in the aperture 775. In addition, since the cover 77 can be formed by injection molding, the roughness of the outer surface of the cover 77 can be substantially uniform. That is, the roughness of the side surface 773 of the cover 77 can be the same as the roughness of the top surface 771 of the cover 77.

[0082] Fig.14 A cross-sectional view of an optical device package 7 according to some embodiments of the present invention is shown. Fig.14 The optical device package 7 shown in FIG. 1 is similar in some respects to the Fig.13 The optical device package 7 shown in FIG. Fig.14The substrate 700 is attached to a surface 734 of the encapsulation body 73 and electrically connected to the electrical connector 72, the surface 734 being opposite to the surfaces 731 and 732 of the encapsulation body 73. In addition, the electrical connector 72 may not be exposed. Therefore, in at least some embodiments, the optical device package 7 further includes the substrate 700, and the encapsulation body 73 encapsulates the surface 712 of the redistribution structure 71, the surface 701 of the substrate 700, and the electrical connector 72.

[0083] Fig.15 A cross-sectional view of an optical device package 8 according to some embodiments of the present invention is depicted. The optical device package 8 includes a carrier 80 and a cover 87. In some embodiments, the carrier 80 may include a ceramic material or a metal plate. In some embodiments, the carrier 80 may be a substrate, an organic substrate, or a lead frame. In some embodiments, the carrier 80 may include a plurality of traces. Fig.15 The carrier 80 shown in FIG. 8 includes a redistribution structure 81 , an electrical connector 82 , a packaging body 83 , a semiconductor device 84 , an optical element 85 and a bottom filling layer 86 .

[0084] Redistribution structure 81 has a surface 811 and a surface 812 opposite to surface 811. At least one of electrical connectors 82 is on surface 812 of redistribution structure 81. Encapsulation body 83 encapsulates surface 812 of redistribution structure 81 and electrical connectors 82. A portion of each electrical connector 82 is exposed by encapsulation body 83. In addition, redistribution structure 81 has a side surface 813, and some electroplating lines may be exposed on side surface 813.

[0085] The semiconductor device 84 is mounted on the surface 812 of the redistribution structure 81. The semiconductor device 84 and the redistribution structure 81 are electrically connected by bumps 841. In some embodiments, the space between the bumps 841 is filled by an underfill layer 86. The electrical connector 82 surrounds the periphery of the semiconductor device 84 and is used to fan out the input and output of the semiconductor device 84. The optical element 85 is mounted on the surface 811 of the redistribution structure 81 and is electrically connected to the redistribution structure. Regarding the two optical elements 85, they can be two optical emitters or two optical detectors, or one is an optical emitter and the other is an optical detector.

[0086] like Fig.15 As shown in FIG. 8 , encapsulation body 83 encapsulates surface 812 and electrical connector 82 of redistribution structure 81. Encapsulation body 83 has surface 831, surface 832 that is recessed relative to surface 831, and side surface 833 connected to surface 831 and surface 832. Surface 831 of encapsulation body 83 is substantially attached to 812 of redistribution structure 81. Side surface 833 of encapsulation body 83 may be adjacent to side surface 813 of redistribution structure 81 and substantially coplanar with side surface 813 of redistribution structure 81. See FIG. Fig.15, the surface 832 of the encapsulation body 83 is smaller in height than the surface 811 of the redistribution structure 81 .

[0087] In view of the above, see Fig.15 , the carrier 80 has a concave portion formed by surfaces 813, 832 and 835 on its side.

[0088] In addition, a cover 87 is arranged on the carrier 80. Fig.15 The cover 87 is disposed on the surface 811 of the redistribution structure 81 and the surface 832 of the encapsulation body 83 by means of an adhesive 89. The adhesive 89 may be an optical adhesive, and the optical density (OD) value of the optical adhesive is greater than 3. Specifically, Fig.15 As shown in FIG. 8 , adhesive 89 is generally arranged on surface 811 of redistribution structure 81, surface 832 of encapsulation body 83, side surface 833 of encapsulation body 83, and side surface 813 of redistribution structure 81, side surface 833 connects surface 832 of encapsulation body 83, and side surface 813 connects surface 811 of redistribution structure 81. That is, adhesive 89 is arranged at the recessed portion of carrier 80 and is generally between cover 87 and carrier 80. In addition, since adhesive 89 is arranged at the recessed portion of carrier 80, adhesive 89 may not migrate on surface 811 to cover wire 851. During an assembly process such as a heating or curing process, wire 851 is not pulled and dragged by adhesive 89. Cover 87 has surface 872 supported by surface 832 of encapsulation body 83. Therefore, surface 872 of cover 87 is smaller in height than surface 831 of encapsulation body 83 and surface 811 of redistribution structure 81. In other words, the surface 872 of the cover 87 is disposed at a different height from the surface 831 of the encapsulation body 83 and the surface 811 of the redistribution structure 81. In addition, the cover 87 may have an inner wall 874 that isolates the optical elements 85 from each other. The inner wall 874 of the cover 87 has a surface 876 supported by the surface 811 of the redistribution structure 81. Therefore, the surface 872 is smaller in height than the surface 876. That is, the surfaces 872 and 876 of the cover 87 are disposed at different heights. In some embodiments, the surface 873 of the cover 87 and the side surface 835 of the encapsulation body 83 may not be coplanar with each other.

[0089] The cover 87 has two apertures 875 at the top thereof, and each of the apertures 875 is substantially aligned with the optical element 85. In addition, the filter materials 88 are arranged in the apertures 875, respectively. In addition, since the cover 87 can be formed by injection molding, the roughness of the outer surface of the cover 87 can be substantially uniform. That is, the roughness of the side surface 873 of the cover 87 can be the same as the roughness of the top surface 871 of the cover 87.

[0090] Fig.16 A cross-sectional view of an optical device package 8 according to some embodiments of the present invention is shown. Fig.16The optical device package 8 shown in FIG. 8 is similar in some respects to the Fig.15 The optical device package 8 shown in FIG. Fig.16 The substrate 800 is attached to a surface 834 of the encapsulation body 83 and electrically connected to the electrical connector 82, the surface 834 being opposite to the surfaces 831 and 832 of the encapsulation body 83. In addition, the electrical connector 82 may not be exposed. Therefore, in at least some embodiments, the optical device package 8 further includes the substrate 800, and the encapsulation body 83 encapsulates the surface 812 of the redistribution structure 81, the surface 801 of the substrate 800, and the electrical connector 82.

[0091] Fig.17A , 17B , 17C, 17D, 17E, 17F, 17G, 17H, 17I and 17J illustrate one or more stages of a method of manufacturing an optical device package 2 according to some embodiments of the present invention. Fig.17A A substrate (eg, a redistribution structure) 21 is shown having been processed through the following stages: Baking the substrate strip.

[0092] like Fig. 17B As shown in , the following stage is then performed on the substrate 21: the die 24 is mounted on the surface 212 of the substrate 21 by flip chip (FC) bonding.

[0093] like Fig. 17C As shown in FIG. 2 , the following stages are then performed on the substrate 21 : dispensing an underfill (UF) 26 ; and curing the UF 26 .

[0094] like Fig.17D As shown in , the following stage is then performed on the substrate 21 : The electrical connector 22 is mounted on the surface 212 of the substrate 21 .

[0095] like Fig.17E As shown in , substrate 200 is attached and connected to electrical connections 22 .

[0096] like Fig.17F As shown in FIG. 1 , a film-type molding material (e.g., encapsulation body) 23 is applied on substrate 21, substrate 200, electrical connector 22, and die 24. Thus, encapsulation body 23 encapsulates side surface 213 and surface 212 of substrate 21, surface 201 of substrate 200, and electrical connector 22 and die 24. Encapsulation body 23 has a surface 231, wherein surface 231 may be substantially coplanar with surface 211 of substrate 21, and surface 211 is opposite to surface 212 of substrate 21.

[0097] like Figure 17G As shown in , the following stages are then performed on the substrate 21: cutting the substrate 200 and the encapsulation body 23.

[0098] like Fig.17H, two optical elements 25 are mounted on the surface 211 of the redistribution structure 21. Regarding the two optical elements 25, they can be two optical emitters or two optical detectors, or one is an optical emitter and the other is an optical detector.

[0099] like Fig.17I As shown in FIG. 2 , a portion of the encapsulation body 239 is removed. Therefore, the encapsulation body 23 has a surface 232 adjacent to the side surface 233 of the encapsulation body 23 and concave relative to the surface 231 of the encapsulation body 23.

[0100] like Fig.17J , a cover 27 that can be formed by injection molding is disposed on the surface 211 of the redistribution structure 21 and the surface 232 of the encapsulation body 23 by an adhesive 29. The adhesive 29 may be an optical glue, and the optical density (OD) value of the optical glue is greater than 3. In addition, the pores 275 of the cover 27 are substantially aligned with the optical elements 25. In addition, the cover 27 is formed before the cover 27 is disposed on the surface 211 of the redistribution structure 21 and the surface 232 of the encapsulation body 23, and thus the side surface 273 of the cover 27 may not be coplanar with the side surface 233 of the encapsulation body 23. Fig.17J An optical device package 2 according to some embodiments of the present invention is shown.

[0101] Fig.18A , 18B , 18C, 18D, 18E, 18F, 18G, 18H, 18I, and 18J illustrate one or more stages in a method of manufacturing an optical device package 6' according to some embodiments of the present invention. Fig.18A A substrate (eg, a redistribution structure) 61 is shown having been processed through the following stages: baking the substrate strips. Additionally, the substrate 61 includes plating lines 617.

[0102] like Fig.18B As shown in , the following stage is then performed on the substrate 61: the die 64 is mounted on the surface 613 of the substrate 61 by flip chip (FC) bonding.

[0103] like Fig. 18C As shown in , the following stages are then performed on the substrate 61: dispensing an underfill (UF) 66; and curing the UF 66.

[0104] like Fig.18D As shown in , the following stage is then performed on the substrate 61: electrical connectors 62 are mounted on the surface 613 of the substrate 61.

[0105] like Fig.18E As shown in , substrate 600 is attached and connected to electrical connections 62 .

[0106] like Fig.18FAs shown in FIG. 1 , a film type molding material (e.g., encapsulant) 63 is applied to substrate 61, substrate 600, electrical connector 62, and die 64. Thus, encapsulant 63 encapsulates side surfaces 614 and surface 613 of substrate 61, surface 601 of substrate 600, and electrical connector 62 and die 64.

[0107] like Figure 18G As shown in , the following stages are then performed on the substrate 61: cutting the substrate 600 and the encapsulation body 63.

[0108] like Fig.18H , two optical elements 65 are mounted on the surface 611 of the redistribution structure 61. Regarding the two optical elements 65, they can be two optical emitters or two optical detectors, or one is an optical emitter and the other is an optical detector.

[0109] like Fig.18I As shown in FIG. 6 , a portion of encapsulation body 639 and a portion of substrate (redistribution structure) 619 are removed. Therefore, redistribution structure 61 has surface 612 that is recessed relative to surface 611, surface 615 connecting surfaces 611 and 612, and encapsulation body 63 has surface 631 that is substantially coplanar with surface 612 of redistribution structure 61. In addition, since a portion of substrate (redistribution structure) 619 is removed, plating lines 617 can be exposed on surface 615 of redistribution structure 61.

[0110] like Fig.18J , a cover 67 that can be formed by injection molding is disposed on the surface 612 of the redistribution structure 61 and the surface 631 of the encapsulation body 63 by an adhesive 69. The adhesive 69 can be an optical glue, and the optical density (OD) value of the optical glue is greater than 3. In addition, the aperture 675 of the cover 67 is substantially aligned with the optical element 65. In addition, the cover 67 is formed before the cover 67 is disposed on the surface 612 of the redistribution structure 61 and the surface 631 of the encapsulation body 63, and thus the side surface 673 of the cover 67 may not be coplanar with the side surface 633 of the encapsulation body 63. Fig.18J An optical device package 6' is shown according to some embodiments of the present invention.

[0111] As used herein, relative terms such as "inner," "inner," "outer," "exterior," "top," "bottom," "front," "back," "upper," "upward," "lower," "downward," "vertical," "vertically," "lateral," "laterally," "above," and "below" refer to the orientation of a set of components relative to each other; such orientation is based on the drawings, but is not required during manufacture or use.

[0112] As used herein, the singular terms "a," "an," and "the" may include plural referents unless the context clearly dictates otherwise.

[0113] As used herein, the terms "connect", "connected" and "connection" refer to an operational connection or link. Connected components can be directly or indirectly coupled to each other, for example, via another set of components.

[0114] As used herein, the terms "conductive", "electrically conductive" and "conductivity" refer to the ability to carry an electric current. Conductive materials generally refer to those materials that exhibit little or no resistance to the flow of electric current. One measure of conductivity is Siemens / meter (S / m). Generally, conductive materials are materials having a conductivity greater than about 10 4 S / m (e.g. at least 10 5 S / m or at least 10 6 The conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0115] As used herein, the terms "approximately," "substantially," "substantially," and "about" refer to a considerable degree or range. When used in conjunction with an event or circumstance, the terms may refer to situations where the event or circumstance occurs exactly as well as situations where the event or circumstance occurs approximately, such as when considering typical tolerance levels of the manufacturing methods described herein. For example, when used in conjunction with a numerical value, the terms may refer to a range of variation of less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, two values ​​may be considered “substantially” the same or equal if the difference between them is less than or equal to ±10% of the average of the values, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

[0116] Two surfaces may be considered coplanar or substantially coplanar if the displacement between the two surfaces does not exceed 5 μm, does not exceed 2 μm, does not exceed 1 μm, or does not exceed 0.5 μm.

[0117] A surface may be considered planar or substantially planar if the difference between the highest point and the lowest point on the surface does not exceed 5 μm, does not exceed 2 μm, does not exceed 1 μm, or does not exceed 0.5 μm.

[0118] In addition, sometimes amounts, ratios and other numerical values ​​are presented in range format herein. It should be understood that such range format is used for the sake of convenience and brevity, and should be flexibly interpreted to include the values ​​explicitly specified as range limits, and also include all individual values ​​or sub-ranges contained within the range, as if each value and sub-range were explicitly specified.

[0119] In the description of some embodiments, a component disposed “on” or “over” another component may include a situation where the former component is directly above (e.g., in physical contact with) the latter component, as well as a situation where one or more intervening components are located between the former component and the latter component.

[0120] Although the present invention has been described and illustrated with reference to specific embodiments of the present invention, these descriptions and illustrations do not limit the present invention. It should be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the true spirit and scope of the present invention as defined by the appended claims.

[0121] The construction and arrangement of the structures and methods as shown in the various example embodiments are illustrative only. Therefore, all such modifications are intended to be included within the scope of the present invention. The order or sequence of any process or method steps may be varied or re-sequenced according to alternative embodiments. Other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the example embodiments without departing from the scope of the present invention.

Claims

1. An optical device package, comprising: a carrier having a first surface and a second surface recessed relative to the first surface; a cover disposed on the second surface of the carrier; and an adhesive disposed on the second surface of the carrier and a surface of the carrier, wherein the surface connects the first surface of the carrier and the second surface of the carrier; The carrier comprises: a redistribution structure having a first surface and a second surface opposite to the first surface, an electrical connector on the second surface of the redistribution structure; and an encapsulation body encapsulating the second surface of the redistribution structure and the electrical connector; The encapsulation body has a first surface adjacent to a side surface of the redistribution structure; the first surface of the carrier includes the first surface of the redistribution structure, and the second surface of the carrier includes the first surface of the encapsulation body.

2. An optical device package as claimed in claim 1, wherein the redistribution structure includes a plating line, and the plating line is exposed on the side surface of the redistribution structure.

3. An optical device package, comprising: a carrier having a first surface and a second surface that is recessed relative to the first surface; a cover disposed on the second surface of the carrier; and an adhesive disposed on the second surface of the carrier and a surface of the carrier, wherein the surface connects the first surface of the carrier and the second surface of the carrier; The carrier comprises: a redistribution structure having a first surface, a second surface opposite to the first surface and a third surface recessed relative to the first surface, an electrical connection member on the second surface of the redistribution structure; and an encapsulation body, which encapsulates the second surface of the redistribution structure and the electrical connector; The first surface of the carrier includes the first surface of the redistribution structure, and the second surface of the carrier includes the third surface of the redistribution structure.

4. An optical device package as claimed in claim 3, wherein the encapsulation body includes a first surface coplanar with the third surface of the redistribution structure, and wherein the second surface of the carrier includes the third surface of the redistribution structure and the first surface of the encapsulation body.

5. An optical device package, comprising: a carrier having a first surface and a second surface that is recessed relative to the first surface; a cover disposed on the second surface of the carrier; and an adhesive disposed on the second surface of the carrier and a surface of the carrier, wherein the surface connects the first surface of the carrier and the second surface of the carrier; The carrier comprises: a redistribution structure having a first surface and a second surface opposite to the first surface, an electrical connector on the second surface of the redistribution structure; and an encapsulation body encapsulating the second surface of the redistribution structure and the electrical connector; The encapsulation body has a side surface that is substantially coplanar with a side surface of the redistribution structure and a first surface connected to the side surface of the encapsulation body; the first surface of the carrier includes the first surface of the redistribution structure, and the second surface of the carrier includes the first surface of the encapsulation body.

6. The optical device package of any one of claims 1, 3 and 5, further comprising a substrate electrically connected to the carrier.

7. The optical device package of any one of claims 1, 3 and 5, wherein the cover has a top surface and a side surface, and wherein a roughness of the top surface of the cover is the same as a roughness of the side surface of the cover.

8. The optical device package of claim 5, wherein the encapsulation body has a second surface close to the second surface of the redistribution structure, and wherein the first surface of the encapsulation body is recessed relative to the second surface of the encapsulation body.

9. The optical device package of any one of claims 1, 3 and 5, wherein a side surface of the cover and a side surface of the carrier are not coplanar.

10. The optical device package of any one of claims 1, 3 and 5, wherein the cover has an aperture.

11. The optical device package of any one of claims 1, 3 and 5, further comprising an optical element disposed on the first surface of the carrier, and wherein the optical element is an optical emitter or an optical detector.

12. The optical device package of any one of claims 1, 3 and 5, wherein the second surface is adjacent to a side surface of the carrier.

13. An optical device package, comprising: a carrier having a first surface and a second surface; and a cover having a first surface supported by the second surface of the carrier; wherein the first surface of the carrier and the first surface of the cover are not in the same plane; The carrier comprises: a redistribution structure having a first surface and a second surface opposite to the first surface, an electrical connector on the second surface of the redistribution structure; and an encapsulation body encapsulating the second surface of the redistribution structure and the electrical connector; The encapsulation body has a side surface that is substantially coplanar with a side surface of the redistribution structure and a first surface that supports the first surface of the cover; the first surface of the carrier includes the first surface of the redistribution structure, and the second surface of the carrier includes the first surface of the encapsulation body.

14. The optical device package of claim 13, wherein: When viewed from the side, the cover partially overlaps the encapsulation body laterally.

15. An optical device package, comprising: a carrier having a first surface and a second surface; and a cover having a first surface supported by the second surface of the carrier; wherein the first surface of the carrier and the first surface of the cover are not in the same plane; The carrier comprises: a redistribution structure having a first surface, a second surface and a third surface opposite to the first surface and the second surface, an electrical connector on the third surface of the redistribution structure; and an encapsulation body encapsulating the third surface of the redistribution structure and the electrical connector and comprising a first surface coplanar with the second surface of the redistribution structure; wherein the second surface of the redistribution structure and the first surface of the encapsulation body support the first surface of the cover; The first surface of the carrier includes the first surface of the redistribution structure, and the second surface of the carrier includes the second surface of the redistribution structure and the first surface of the encapsulation body.

16. The optical device package of claim 13 or 15, further comprising an optical element disposed on the first surface of the carrier, and wherein the optical element is an optical emitter or an optical detector.

17. The optical device package of claim 13 or 15, wherein: When viewed from the side, the cover partially overlaps the carrier laterally.

18. An optical device package, comprising: a carrier having a first surface and a second surface; and a cover having a first surface supported by the second surface of the carrier; wherein the first surface of the carrier and the first surface of the cover are not in the same plane; The vector includes: A redistribution structure having a first surface, a second surface recessed relative to the first surface, and a third surface opposite to the first surface, and an electrical connector on the third surface of the redistribution structure; and an encapsulation body, which encapsulates the third surface of the redistribution structure and the electrical connection member; The second surface of the redistribution structure supports the first surface of the cover; the first surface of the carrier includes the first surface of the redistribution structure, and the second surface of the carrier includes the second surface of the redistribution structure.

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