Packaging structure and method of manufacturing the same

Abstract

The present disclosure relates to a packaging structure and a manufacturing method. The packaging structure includes a wiring structure, a first electronic device, a second electronic device, a protective material, and a reinforcement structure. The first electronic device and the second electronic device are electrically connected to the wiring structure. The protective material is disposed between the first electronic device and the wiring structure and between the second electronic device and the wiring structure. The reinforcement structure is disposed on and contacts the first electronic device and the second electronic device. The reinforcement structure contacts the protective material.

Claims

1. A method for manufacturing a packaging structure, comprising: (a) Providing a wiring structure, wherein the wiring structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer; (b) Electrically connecting the first electronic device and the second electronic device to the wiring structure; (c) A protective material is formed in a first space between the first electronic device and the wiring structure and a second space between the second electronic device and the wiring structure, wherein the protective material further extends into the gap between the first electronic device and the second electronic device; as well as (d) Forming a reinforcing structure on the first electronic device, the second electronic device, and the protective material. In (c), the recessed portion is defined by the side surface of the first electronic device, the upper surface of the protective material, and the side surface of the second electronic device; Following (c), the method further includes: (c1) A temporary structure is formed in the recessed portion; as well as (c2) Form an encapsulating material to cover the first electronic device, the second electronic device, and the temporary structure.

2. The method according to claim 1, wherein after (c2), the method further comprises: (c3) Thinning the encapsulant, the first electronic device, and the second electronic device to expose the temporary structure; as well as (c4) Remove the temporary structure to form a groove; In (d), a portion of the reinforcing structure extends into the groove to contact the upper surface of the protective material.

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