Supporting device for semiconductor devices, handling mechanism and gate cutting apparatus

Abstract

The present disclosure relates to a semiconductor device carrying device, a carrying mechanism and a gate cutting device, and belongs to the technical field of semiconductor packaging. The carrying device comprises a carrier plate having a carrying surface and a back surface opposite to each other, the carrying surface being used for carrying semiconductor devices; a plurality of first sensing devices arranged on the carrier plate and located on the side of the carrying surface close to the back surface; each first sensing device is used for sensing an obstacle through the plane where the carrying surface is located; and a controller is used for outputting an alarm signal when at least one first sensing device is in a target sensing state. The carrying device of the present disclosure can prevent the semiconductor devices from being damaged when cutting the gate.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor packaging technology, and more specifically, to a carrier device, a transport mechanism, and a gate cutting device for semiconductor devices. Background Technology

[0002] Molding technology is a common semiconductor packaging technique. During molding, semiconductor devices such as chips are placed inside a mold cavity and filled with encapsulating material. This encapsulating material covers the semiconductor device, and after curing and demolding, the packaged semiconductor device is obtained. The mold cavity has channels for the encapsulating material to flow through. After the encapsulating material in the channels cures, it forms a gate. However, the gate is not needed for the encapsulation layer, so specialized gate cutting equipment is required to cut it. But during cutting, the semiconductor device is easily damaged.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0004] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a semiconductor device carrier, a transport mechanism, and a gate cutting device to prevent damage to the semiconductor device during gate cutting.

[0005] According to one aspect of this disclosure, a carrier device for a semiconductor device is provided, comprising:

[0006] A carrier plate having a bearing surface and a back surface facing away from each other, the bearing surface being used to support the semiconductor device;

[0007] A plurality of first sensing devices are disposed on the carrier plate and located on the side of the bearing surface near the back side; each first sensing device is used to sense obstacles through the plane of the bearing surface.

[0008] A controller is configured to output a warning signal when at least one of the first sensing devices is in a target sensing state.

[0009] In an exemplary embodiment of this disclosure, the bearing surface is provided with a plurality of mounting holes, and each of the first sensing devices is disposed in a corresponding mounting hole;

[0010] The first sensing device is used to output a first sensing signal when it is blocked by the semiconductor device, and the target sensing state is a state in which the first sensing signal is not output.

[0011] In one exemplary embodiment of this disclosure, the mounting hole penetrates the bearing surface and the back surface; one end of the first sensing device is located between the bearing surface and the back surface, and the other end extends out of the back surface; the bearing device further includes:

[0012] Multiple brackets are connected one-to-one with the end of each of the first sensing devices that extends out of the back, and each bracket is fixedly connected to the carrier plate.

[0013] In one exemplary embodiment of this disclosure, a flexible buffer layer is filled between the first sensing device and the inner wall of the mounting hole.

[0014] In one exemplary embodiment of this disclosure, each of the first sensing devices is distributed along a polygonal trajectory and located at each corner of the polygonal trajectory.

[0015] In one exemplary embodiment of this disclosure, each of the first sensing devices is disposed around the bearing surface and fixed to the outer peripheral surface of the carrier plate;

[0016] The first sensing device is used to output a first sensing signal when it is blocked by the semiconductor device, and the target sensing state is the state of outputting the first sensing signal.

[0017] In one exemplary embodiment of this disclosure, each of the first sensing devices has an indicator light, which is used to light up or turn off when the first sensing device is in the target sensing state.

[0018] In one exemplary embodiment of this disclosure, the carrying device further includes:

[0019] The second sensing device is disposed outside the outer peripheral surface of the carrier plate and located on the side of the bearing surface away from the back surface. It is used to sense obstacles in a direction parallel to the bearing surface and outputs a second sensing signal when it is blocked.

[0020] The controller is used to respond to the second sensing signal and output the warning signal.

[0021] According to one aspect of this disclosure, a semiconductor device handling mechanism is provided, comprising:

[0022] At least one of the above-mentioned carrier devices;

[0023] A conveying device, connected to the carrying device, is used to drive the carrying device to move along a preset trajectory.

[0024] According to one aspect of this disclosure, a gate cutting apparatus for a semiconductor device is provided, comprising:

[0025] The bearing device described in any of the above items;

[0026] A cutting device is used to cut the gate of a semiconductor device on the bearing surface, and can respond to the warning signal and decide whether to perform the cutting action based on the warning signal.

[0027] The semiconductor device carrier, conveying mechanism, and gate cutting equipment disclosed herein allow the semiconductor device to be placed on the carrier surface of a substrate during gate cutting. The semiconductor device can be sensed by first sensing devices. If all first sensing devices are not in the target sensing state, the controller does not issue a warning signal, and the cutting operation can proceed normally, indicating that the semiconductor device is in a designated position suitable for cutting. However, if any first sensing device is in the target sensing state, it is considered that the semiconductor device is deviated from the designated position on the carrier surface. In this case, the controller can output a warning signal, allowing the gate cutting equipment to decide whether to cut based on the warning signal. This warning signal can also prompt the operator to handle the situation promptly, thereby preventing cutting in a deviated state and avoiding damage to the semiconductor device.

[0028] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0029] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0030] Figure 1 This is a top view of the first embodiment of the carrier device disclosed herein.

[0031] Figure 2 This is a side view of a first embodiment of the carrier device disclosed herein.

[0032] Figure 3 This is a schematic diagram of the installation method of the first sensing device in the first embodiment of the bearing device disclosed herein.

[0033] Figure 4 This is a schematic diagram showing the semiconductor device located at a designated position in the first embodiment of the carrier device of this disclosure.

[0034] Figure 5 This is a schematic diagram of the semiconductor device being tilted in the first embodiment of the carrier device disclosed herein.

[0035] Figure 6 This is a top view of a second embodiment of the carrier device disclosed herein.

[0036] Figure 7 This is a schematic diagram showing the semiconductor device located at a designated position in a second embodiment of the carrier device disclosed herein.

[0037] Figure 8 This is a schematic diagram of the semiconductor device being tilted in the second embodiment of the carrier device disclosed herein.

[0038] Figure 9 This is a circuit block diagram of one embodiment of the carrier device disclosed herein.

[0039] Explanation of reference numerals in the attached figures:

[0040] 100. Semiconductor device; 200. Gate; 1. Carrier plate; 101. Bearing surface; 102. Back side; 103. Material discharge channel; 104. Cutout; 105. Mounting hole; 2. First sensing device; 3. Controller; 4. Alarm assembly; 5. Bracket; 6. Buffer layer; 7. Positioning block; 8. Second sensing device. Detailed Implementation

[0041] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore detailed descriptions of them will be omitted. Furthermore, the drawings are merely illustrative of this disclosure and are not necessarily drawn to scale.

[0042] Although relative terms such as "up" and "down" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as according to the orientation of the examples shown in the accompanying drawings. It is understood that if the device of the icon is flipped upside down, the component described as "up" will become the component described as "down." When a structure is "up" of another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure through another structure.

[0043] The terms “a,” “one,” “the,” “the,” and “at least one” are used to indicate the presence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first” and “second” are used only as markers and are not a limitation on the number of objects.

[0044] In related technologies, when performing molding operations on semiconductor devices, a mold consisting of an upper mold and a lower mold is required, with each mold having a corresponding cavity. The semiconductor device is placed in the cavity of the lower mold, and after the mold is closed, the cavities align to form a molded cavity, with the semiconductor device located within the cavity. Encapsulation material can be filled into the molded cavity to cover the semiconductor device. After the encapsulation material undergoes a curing process and is demolded, the encapsulated semiconductor device can be obtained.

[0045] To improve production efficiency, molds typically have multiple cavities, each capable of holding a semiconductor device. Multiple semiconductor devices can be encapsulated simultaneously. These cavities are connected by dedicated channels; by injecting encapsulation material into any cavity, the material flows through these channels to all other cavities. However, after the encapsulation material solidifies, the encapsulation material within the channels forms gates connecting the semiconductor devices, requiring cutting.

[0046] However, during the cutting process, the semiconductor device needs to be placed on a special support device, and the gate needs to be cut by the cutting equipment. The semiconductor device also needs to be held in a predetermined position. If it is skewed, the cutting position may be deviated, resulting in damage to the semiconductor device.

[0047] This disclosure provides a carrier device for a semiconductor device, which can be a chip, such as a memory or processor, or a circuit board, etc. No special limitation is made here, as long as it can be molded.

[0048] like Figure 1 , Figure 6 and Figure 9 As shown, the carrier device of this embodiment includes a carrier plate 1, a first sensing device 2, and a controller 3, wherein:

[0049] The carrier plate 1 has a bearing surface 101 and a back surface 102 facing away from each other. The bearing surface 101 is used to bear the semiconductor device 100. The carrier plate 1 is provided with a feeding channel 103 that passes through the bearing surface 101 and the back surface 102. A first sensing device 2 is disposed on the carrier plate 1, and there are multiple first sensing devices 2. Each first sensing device 2 is located on the side of the bearing surface 101 near the back surface 102. Each first sensing device 2 is used to sense obstacles through the plane where the bearing surface 101 is located.

[0050] The controller 3 is used to output a warning signal when at least one first sensing device 2 is in a target sensing state.

[0051] The carrier device of this embodiment can place the semiconductor device 100 on the carrier surface 101 of the carrier plate 1 for cutting when cutting the gate 200. During this process, the semiconductor device 100 can be sensed by the first sensing device 2. If all the first sensing devices 2 are not in the target sensing state, the semiconductor device 100 is considered to be in the designated position. At this time, the controller 3 does not need to issue a warning signal, and the cutting work can proceed normally. However, if at least one of the first sensing devices 2 is in the target sensing state, it is considered that the semiconductor device 100 is deviated on the carrier surface 101 and is not in the designated position. At this time, the controller 3 can output a warning signal so that the gate cutting equipment can determine whether to cut based on the warning signal. The warning signal can also be used to prompt the operator to deal with the situation in time, thereby preventing cutting in a deviated state and avoiding damage to the semiconductor device.

[0052] The following is a detailed description of each part of the support device according to the present disclosure:

[0053] like Figure 1 , Figure 2 , Figure 3 and Figure 6 As shown, the carrier plate 1 is a flat plate structure, and its shape can be rectangular, or it can be circular or other shapes. The specific shape can be the same as the shape of the semiconductor device 100, and no special limitation is made here. The carrier plate 1 has a bearing surface 101 and a back surface 102 facing away from each other in the thickness direction. The bearing surface 101 and the back surface 102 can be mutually parallel planes.

[0054] In some embodiments of this disclosure, the gate 200 can be cut by a cutting mechanism of a cutting device. The cutting mechanism has a reciprocating cutting head, which cuts off the gate 200 by moving the cutting head. To ensure that the cutting head can cut off the gate 200 and facilitate material discharge, a discharge channel 103 can be provided on the carrier plate 1. The discharge channel 103 penetrates the bearing surface 101 and the back surface 102, and its shape can be rectangular, circular, etc., as long as it can allow the cutting head to pass through and the gate 200 to fall off. For example, such as Figure 1 and Figure 6 As shown, the feeding channel 103 can be rectangular, and the carrier plate 1 is cut into two parts along the central axis parallel to the bearing surface 101. During cutting, the two parts can be kept relatively fixed by means of other devices. The gate 200 can be directly opposite the feeding channel 103, and the semiconductor devices 100 on both sides of the gate 200 can be supported by the carrier plate 1. Of course, the feeding channel 103 can also be a hole on the top of the carrier plate 1, a circular hole, etc. The specific structure of the pressure cutting mechanism is not described in detail here. Those skilled in the art can select a suitable pressure cutting mechanism according to the actual working conditions.

[0055] Of course, in some embodiments of this disclosure, other cutting tools such as laser cutting machines can also be used to cut the gate 200. In this case, the above-mentioned unloading channel 103 may not be provided, and the cut-off gate 200 can be cleaned with special tools.

[0056] Furthermore, in order to reduce the weight of the carrier plate 1 while supporting the semiconductor device 100, in some embodiments of this disclosure, such as Figure 1 and Figure 6 As shown, the carrier plate 1 may have multiple hollowed-out portions 104. Each hollowed-out portion 104 is a through hole penetrating the bearing surface 101 and the back surface 102. Its shape can be circular, rectangular, etc., and is not specifically limited here. The hollowed-out portions 104 are evenly distributed on the carrier plate 1.

[0057] like Figure 1 , Figure 3 and Figure 6 As shown, multiple first sensing devices 2 are disposed on the carrier plate 1 and located on the side of the bearing surface 101 near the back surface 102, i.e., they do not protrude from the bearing surface 101 to avoid lifting the semiconductor device 100 or colliding with it. Simultaneously, each first sensing device 2 can sense obstacles through the plane of the bearing surface 101 and output a first sensing signal when blocked. The first sensing device 2 can be a photoelectric sensor or other sensing device. The target sensing state of the first sensing device 2 can be one of outputting or not outputting a first sensing signal. Further, the first sensing device 2 may include an indicator light, which can be an LED or other lighting, that can light up or turn off when the first sensing device 2 is in the target sensing state, to indicate the target sensing state. For example:

[0058] like Figure 1 and Figure 3 As shown, in the first embodiment of this disclosure, mounting holes 105 can be formed in the bearing surface 101, and each first sensing device 2 can be correspondingly disposed in each mounting hole 105 without protruding from the bearing surface 101. The first sensing device 2 can sense obstacles through the mounting hole 105 and the plane of the bearing surface 101. When the semiconductor device 100 on the bearing surface 101 blocks the mounting hole 105, that is, when it blocks the first sensing device 2 in the mounting hole 105, the blocked first sensing device 2 can output a first sensing signal. In this embodiment, the target sensing state of the first sensing device 2 is the state of not outputting a first sensing signal. Figure 4 As shown, the semiconductor device 100 is positioned at a designated location, simultaneously blocking each of the first sensing devices 2, and the first sensing devices 2 continuously output a first sensing signal. For example... Figure 5As shown, when the semiconductor device 100 is tilted, at least one first sensing device 2 is not blocked by the semiconductor device 100. At this time, the unblocked first sensing device 2 stops outputting the first sensing signal and is thus in the target sensing state.

[0059] Each of the first sensing devices 2 can be distributed along a polygonal trajectory and located at each corner of the polygonal trajectory. For example, there can be four first sensing devices 2, distributed at the four corners of a rectangular area.

[0060] Furthermore, to facilitate the installation of the first sensing device 2, the mounting hole 105 can be a through hole penetrating the bearing surface 101 and the back surface 102. One end of the first sensing device 2 is located between the bearing surface 101 and the back surface 102, and the other end extends out of the back surface 102. At the same time, multiple brackets 5 are used to connect one-to-one with the end of each first sensing device 2 that extends out of the back surface 102, and each bracket 5 is fixedly connected to the carrier plate 1. The specific structure of the bracket 5 is not specifically limited here. For example, it can be a first rod and a second rod that are connected at right angles. The first rod is arranged parallel to the back surface 102, and one end is connected to the first sensing device 2. The other end extends out of the carrier plate 1 and is connected to the second rod. The second rod can be fixed to the outer peripheral surface of the carrier plate 1 by welding or by using screws.

[0061] Furthermore, in order to limit the first sensing device 2 within the mounting hole 105 and prevent the first sensing device 2 from colliding with the inner wall of the mounting hole 105, a flexible buffer layer 6 can be filled between the first sensing device 2 and the inner wall of the mounting hole 105. The material of the buffer layer 6 may include foam material or other flexible materials, which will not be listed here. Thus, while limiting the first sensing device 2, it also plays a buffering role.

[0062] Furthermore, the carrier device disclosed herein may also include positioning blocks 7, which are disposed on the carrier surface 101, and there are multiple positioning blocks 7. Each positioning block 7 can be distributed along a circular trajectory, and each mounting hole 105 is located within the circular trajectory. When placing the semiconductor device 100, the positioning blocks 7 can be used to position the semiconductor device 100 to avoid excessive offset. At the same time, it can also prevent the semiconductor device 100 from falling off the carrier plate 1. For example, the carrier plate 1 is rectangular, and there are four positioning blocks 7 located at the four corners of the carrier surface 101 of the carrier plate 1. Further, the semiconductor device 100 is also rectangular, and each positioning block 7 forms a recessed area that matches the corner of the semiconductor device 100.

[0063] like Figure 6As shown, in the second embodiment of this disclosure, each first sensing device 2 is disposed around the bearing surface 101 and fixed to the outer peripheral surface of the carrier plate 1. The specific fixing method is not particularly limited here. The first sensing device 2 does not protrude from the bearing surface 101, thus allowing it to sense obstacles through the plane of the bearing surface 101 and output a first sensing signal when triggered. In this embodiment, the target sensing state of the first sensing device 2 is the state of emitting the first sensing signal. For example... Figure 7 As shown, the semiconductor device 100 is in the designated position, and none of the first sensing devices 2 are triggered, nor are they emitting first sensing signals, meaning they are not in the target sensing state; as Figure 8 As shown, when the semiconductor device 100 is deflected, at least one first sensing device 2 is triggered and outputs a first sensing signal, thus entering a target sensing state.

[0064] In the third embodiment of this disclosure, the structure of the bearing device can refer to the first embodiment described above. The difference in the first embodiment is that the target sensing state of the first sensing device 2 is the state of outputting the first sensing signal.

[0065] In the fourth embodiment of this disclosure, if the first sensing device 2 is a photoelectric sensor, it is embedded in the carrier plate 1, and the carrier surface 101 can be made transparent, allowing the sensing of obstacles to be achieved through the carrier surface 101. Of course, other methods can also be used to achieve the sensing of obstacles through the carrier surface 101, which will not be listed here. The target sensing state of this embodiment can be the same as that of the first or third embodiment.

[0066] like Figure 9 As shown, the controller 3 can be connected to each of the first sensing devices 2 via wired or wireless means, and can output an alarm signal when the first sensing device 2 is in target sensing state. For example:

[0067] For the first embodiment described above, a designated position can be preset on the bearing surface 101. This designated position is the area where the semiconductor device 100 can be normally cut. The target sensing state is defined as the state in which the first sensing device 2 does not output a first sensing signal. If the distribution range of each first sensing device 2 is within the designated position, and each first sensing device 2 senses the semiconductor device 100 and outputs a first sensing signal, it is not in the target sensing state, and it can be determined that the semiconductor device 100 is in the designated position and can be cut. If at least one first sensing device 2 does not output a first sensing signal, that is, it is in the target sensing state, it indicates that the semiconductor device 100 has been deflected, and a warning signal can be output at this time.

[0068] In the second embodiment described above, the target sensing state is defined as the state in which the first sensing device 2 outputs a first sensing signal. Each of the first sensing devices 2 is distributed around the bearing surface 101, and naturally also around a designated position. When at least one first sensing device 2 senses the semiconductor device 100, it is in the target sensing state, indicating that the semiconductor device 100 has exceeded the designated position and has deviated. At this time, a warning signal can be output. If none of the first sensing devices 2 sense the semiconductor device 100, it indicates that the semiconductor device 100 has not exceeded the designated position, and cutting can proceed.

[0069] In the third embodiment described above, the target sensing state is defined as the state in which the first sensing device 2 outputs a first sensing signal. The first sensing devices 2 are distributed around a designated position. When at least one first sensing device 2 senses the semiconductor device 100, i.e., receives the first sensing signal, it indicates that the semiconductor device 100 has exceeded the designated position and has deviated, at which point a warning signal can be output. If none of the first sensing devices 2 sense the semiconductor device 100, it indicates that the semiconductor device 100 has not exceeded the designated position, and cutting can proceed.

[0070] like Figure 9 As shown, in some embodiments of this disclosure, the carrier device may further include an alarm component 4, which can receive the aforementioned warning signal and issue an alarm in response to the warning signal to remind the operator to correct the position of the semiconductor device 100 in a timely manner. The alarm component 4 may be a device capable of issuing a prompt, such as a warning light or a buzzer, or a combination of these devices.

[0071] If the semiconductor device 100 is placed on the positioning block 7 mentioned above, or is supported by other obstacles, cutting it would damage the semiconductor device 100. To solve this problem, such as... Figure 1 , Figure 2 and Figure 6 As shown, in some embodiments of this disclosure, the supporting device may further include a second sensing device 8, which may be disposed outside the outer peripheral surface of the carrier plate 1 and located on the side of the supporting surface 101 opposite to the back surface 102, such as... Figure 2 As shown, the second sensing device 8 is located above the bearing surface 101.

[0072] The second sensing device 8 can be a photoelectric sensor, and its specific type can be through-beam or reflective. If it is through-beam, the transmitting end and receiving end of the second sensing device 8 need to be located on opposite sides of the carrier plate 1. If it is reflective, the transmitting end and receiving end are located on the same side of the carrier plate 1. The specific principle will not be described in detail here.

[0073] The second sensing device 8 can sense obstacles in a direction parallel to the bearing surface 101, and outputs a second sensing signal when it is blocked. The controller 3 can also respond to the second sensing signal and output a warning signal. The alarm component 4 can respond to the warning signal and sound an alarm to remind the operator to correct the position of the semiconductor device 100 in time.

[0074] Therefore, it is possible to detect whether the semiconductor device 100 is skewed in two directions, parallel to the bearing surface 101 and perpendicular to the bearing surface 101, to prevent damage to the semiconductor device 100 during cutting.

[0075] This disclosure also provides a semiconductor device handling mechanism, which includes a conveying device and a carrying device according to any of the above embodiments, wherein:

[0076] The structure of the carrier device can be referred to the implementation method of the carrier device described above, and will not be detailed here. The conveying device is connected to the carrier device and can drive the carrier device to move along a preset trajectory in order to realize the transfer of semiconductor devices. The conveying device can be a conveyor belt, overhead crane, or robotic arm, etc., and is not particularly limited here, as long as it can realize the movement of the carrier device.

[0077] This disclosure also provides a gate cutting apparatus for semiconductor devices, the gate cutting apparatus including a cutting device and a carrier device according to any of the above embodiments, wherein:

[0078] The structure of the support device can be referred to the implementation method of the support device described above, and will not be detailed here. The cutting device can cut the gate 200 of the semiconductor device 100 on the support surface 101, and can decide whether to cut in response to the warning signal. Specifically, if the cutting device has been started, the cutting device can stop in response to the warning signal; if the cutting device has not been started, it remains in the off state to avoid damaging the semiconductor device 100; if the cutting device does not receive the warning signal, it can cut normally.

[0079] For example, the cutting device may include a cutting mechanism, which may include a cutting head. The cutting head is positioned facing the bearing surface 101 and directly opposite the discharge channel 103. When the cutting head moves into the discharge channel 103, it can cut off the gate 200, which then falls through the discharge channel 103. The specific structure and working principle of the cutting mechanism are not particularly limited here, as long as it can cut the gate 200. It can respond to a warning signal to control the cutting head to stop moving. If the cutting mechanism is not started, it remains in the inactive state.

[0080] It should be noted that the gate cutting equipment disclosed herein may also include a carrying device based on the aforementioned handling mechanism.

[0081] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A carrier device for a semiconductor device, characterized in that, include: A carrier plate having a bearing surface and a back surface facing away from each other, the bearing surface being used to support the semiconductor device; A plurality of first sensing devices are disposed on the carrier plate and located on the side of the bearing surface near the back side; each first sensing device is used to sense obstacles through the plane of the bearing surface. The controller is configured to output a warning signal when at least one of the first sensing devices is in a target sensing state; The bearing surface is provided with a plurality of mounting holes, and each of the first sensing devices is disposed in a corresponding mounting hole; The first sensing device is used to output a first sensing signal when it is blocked by the semiconductor device, and the target sensing state is a state in which the first sensing signal is not output; The mounting hole penetrates the bearing surface and the back surface; one end of the first sensing device is located between the bearing surface and the back surface, and the other end extends out of the back surface; The supporting device further includes: Multiple brackets are connected one-to-one to the end of each of the first sensing devices that extends out of the back, and each bracket is fixedly connected to the carrier plate; The supporting device further includes: The second sensing device is disposed outside the outer peripheral surface of the carrier plate and located on the side of the bearing surface away from the back surface. It is used to sense obstacles in a direction parallel to the bearing surface and outputs a second sensing signal when it is blocked. The controller is used to respond to the second sensing signal and output the warning signal.

2. The bearing device according to claim 1, characterized in that, A flexible buffer layer is filled between the first sensing device and the inner wall of the mounting hole.

3. The bearing device according to claim 1, characterized in that, Each of the first sensing devices is distributed along a polygonal trajectory and is located at each corner of the polygonal trajectory.

4. The bearing device according to claim 1, characterized in that, Each of the first sensing devices is disposed around the bearing surface and fixed to the outer peripheral surface of the carrier plate; The first sensing device is used to output a first sensing signal when it is blocked by the semiconductor device, and the target sensing state is the state of outputting the first sensing signal.

5. The bearing device according to any one of claims 1-4, characterized in that, Each of the first sensing devices has an indicator light, which is used to light up or turn off when the first sensing device is in the target sensing state.

6. A semiconductor device handling mechanism, comprising: At least one of the carrying devices according to any one of claims 1-5; A conveying device, connected to the carrying device, is used to drive the carrying device to move along a preset trajectory.

7. A gate cutting device for semiconductor devices, characterized in that, include: The bearing device according to any one of claims 1-5; A cutting device is used to cut the gate of a semiconductor device on the bearing surface, and can respond to the warning signal and decide whether to perform the cutting action based on the warning signal.

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