芯片连接器
By designing a matrix-arranged chip connector with separate signal and ground terminals, the signal transmission bottleneck in existing technologies is solved, thereby improving high-frequency electrical performance and reducing crosstalk.
CN112952412BActive Publication Date: 2026-07-17FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO LTD +1
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO LTD
- Filing Date
- 2021-01-26
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Existing chip connectors have become a bottleneck in high-frequency signal transmission, making it difficult to balance mechanical performance and reduce resonance effects.
Method used
A matrix-arranged terminal structure was designed, with signal terminals and ground terminals designed separately. The elastic parts of the signal terminals are closer to each other than the elastic parts of the ground terminals, providing high capacitive electrical performance and reducing crosstalk.
Benefits of technology
It improves high-frequency electrical performance, reduces signal crosstalk, and enhances signal transmission quality.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN112952412B_ABST
Abstract
一种芯片连接器，其包括设有若干端子孔的本体及收容在对应端子孔内且呈矩阵排列的端子。端子孔贯穿本体的上、下表面，端子包括固定在端子孔内的固定部、自固定部向上延伸的第一弹性部及自第一弹性部继续延伸且凸伸出本体上表面的第一接触部。端子包括至少两个相邻的接地端子及至少两个相邻的信号端子。相邻接地端子的第一接触部的虚拟中心线之间的距离与相邻信号端子的第一接触部的虚拟中心线之间的距离相同，相邻接地端子的第一弹性部的虚拟中心线的距离大于相邻信号端子的第一弹性部的虚拟中心线之间的距离。本发明的信号端子20S与接地端子20G结构不同，彼此分开设计，信号端子的弹性部较接地端子的弹性部互相靠近，间距变小，提供高电容性的电气性能，如此可达成电气性能最好，提供最低串扰效果。
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